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RBC AND CANUCKS SPORTS & ENTERTAINMENT (CSE) ANNOUNCE MULTI-YEAR PARTNERSHIP; RBC LOGO TO BE FEATURED ON VANCOUVER CANUCKS HOME JERSEYS
RBC expands commitment to sports, entertainment and community by connecting CSE fans to enhanced experiences, including exclusive benefits for RBC clients
T. Rowe Price Unveils New Institutional Business Model
T. Rowe Price revamps institutional business to deepen consultant, client relationships reflecting the evolving needs of the marketplace
Starmer says he'll resign as UK prime minister, roiling British politics yet again
British Prime Minister Keir Starmer said Monday he will resign, forced out by his own party after missteps and mistakes soured voters’ goodwill following a landslide election victory two years ago on a promise of steady leadership and economic growth.
Charles Cella was racing purist and business realist, shaping his long stint as Oaklawn’s president
A thoroughbred racing purist, Charles Cella shunned excessive racing, exotic wagering and permissive medication.
Decisions loom for Arkansas football’s official visitors
Arkansas hosted the last round of official visits this weekend, and three prospects look like they’ll be announcing their college decisions soon.
MASTER CLASS: Tap in to the power within to make healthy choices
Intention is a very powerful psychological attribute contributing toward any behavior change. Without an intent to change, there's almost zero chance it will occur – especially with respect to health behaviors. This week, I'll present some tips for maximizing intention in an effort to make good behaviors "stick." Plus, I'll introduce an exercise that fits perfectly into physical activity program.
U.S. Small Business Administration ‘actively working’ to create veterans resource center in Idaho
At the request of U.S. Sen. Jim Risch, the federal Small Business Administration is looking at establishing a new, Idaho-based office dedicated to supporting veterans, military members and their spouses.
Lincoln Day Dinner: GOP gubernatorial candidates talk growth, business, preserving Tennessee culture
Two candidates in Tennessee's gubernatorial race discussed growth, business recruitment and preserving Volunteer State values at Saturday's Lincoln Day Dinner, the Hamilton County Republican Party's largest annual fundraiser.
ENTERTAINMENT: Fayetteville art exhibit seeks entries; book festival names ‘headliner’
Aug. 10 is the deadline for Northwest Arkansas visual artists to submit works to Fayetteville’s Walton Arts Center for the sixth annual “Our Art, Our Region, Our Time” group art exhibition.
AI Slipped Into Your Business Tools. Three Questions Take It Back
AI just landed inside QuickBooks, HubSpot and the tools you already pay for. Here are three questions to ask before it acts on your money and your clients.
OPINION: Politics, AI, and human dignity
Whether we are building technology, running campaigns, serving in government, or participating in our local political party, the measure of success is not simply whether we win. It is whether we remember that every person has dignity and value independent of their usefulness to our cause.
Russian big Ilia Frolov has committed to Arkansas basketball
Russian big man Ilia Frolov, who wrapped up his official visit to Arkansas early Thursday morning, has committed to the Razorbacks.
Goldman Sachs: Buy these 16 tech stocks as AI-capex juices earnings
"A capex supercycle is taking hold," Peter Oppenheimer, the bank's chief global equity strategist, said in a client note on Tuesday.
Is SEO Dead? Here's What I'm Telling Every Client Who Asks Me in 2026
The version of SEO your competitors are selling is dying. The version that actually drives revenue isn't.
ENTERTAINMENT: UCA show turns Conway into Sherwood Forest
The University of Central Arkansas Summer Theatre stages “Ken Ludwig’s Sherwood: The Adventures of Robin Hood,” Ludwig’s “theatrical reimagining” of the tale of the legendary outlaw and his Merry Men.
ENTERTAINMENT: UCA show turns Conway into Sherwood Forest
The University of Central Arkansas Summer Theatre stages “Ken Ludwig’s Sherwood: The Adventures of Robin Hood,” Ludwig’s “theatrical reimagining” of the tale of the legendary outlaw and his Merry Men.
Abarca Health and LucyRx Announce Strategic Combination to Create the Only Modern PBM Built for Commercial and Government Scale
Abarca Health and LucyRx today announced a strategic combination to create the only modern, independent pharmacy benefit manager with the scale, technology, and track record to credibly serve commercial and government clients of any size. Combined, Abarca and LucyRx will provide prescription services to more than 9 million members across the United States.
AJ Evasco, Luke Neiswonger latest transfers to Arkansas baseball
The Razorbacks added two more commitments from transfers Tuesday, including one of the top names in this year’s portal.
OpenAI Just Started Selling What Your Consulting Business Sells
OpenAI and Anthropic just launched their own AI consulting firms. Here is what independent advisors and small firms should do to keep their clients.
Count Porkula to close its doors after business Sunday
Sunday will be the last day of business for Count Porkula, 10840 Maumelle Blvd., just east of where North Little Rock meets Maumelle.
Arkansas women's basketball learns 2026-27 SEC opponents, locations
Arkansas was paired with Mississippi State as its home-and-away opponent in 2026-27.
Healthcare AI vendor suffers data breach, exposing patient records to hackers
Tennessee-based Xsolis said the incident occurred in January, and the sensitive data was from its clients. The company provides AI-powered case management software to hospitals and health insurers.
Times Opinion: Trump’s war on science is being waged in the fine print
A fresh attack on the U.S. scientific infrastructure could be the most damaging yet.
Athletic director: Eagles sports program drawing students, money to Northwest Arkansas Community College
BENTONVILLE -- Northwest Arkansas Community College is pursuing lofty enrollment growth goals, and athletics are playing a key part in recruiting students, according to the college's athletic director.
Arkansas football makes recruiting strides during weekend visits
Arkansas had six prospects on campus this weekend and the Hogs appears to have gained momentum with them
Is SMIC N+3’s Metal Pitch Smaller than Intel 18A’s?
Almost four years ago, we published that SMIC had started shipping 7 nm (N+1) chips. Now, SMIC is shipping its third-generation 7 nm (N+3) process in Huawei’s Kirin 9030, with a minimum metal pitch of 32.5 nm, about 10% tighter than the 36 nm minimum metal pitch shipping in Intel’s latest Panther Lake CPUs on 18A. The headline is true, but incomplete cherry picked metric. N+3 reaches the density of TSMC N6 through aggressive DUV multi-patterning and design-technology co-optimization (DTCO), but it pays for that in complexity, efficiency and process control. We found this and more in our reverse engineering and teardown where we cover SMIC’s N3 process technology, Huawei’s packaging, memory, architecture, and more. SemiAnalysis has been building a state-of-the-art teardown lab in Oregon capable of analyzing the world’s most advanced and important chips over the last year and half. We have already generated revenue on advanced datacenter chip teardowns including our recent reverse engineering of a major TSMC customer’s COUPE CPO optical engine + EIC 3D stack. This is the first public report from the SemiAnalysis Teardown Engineering & Evaluation Lab, or STEEL for short. The lab is aggressively scaling up and out and we’re excited to announce it publicly. This is a bit of inconvenient timing for TechInsights as they are private equity owned and currently being sold while having enjoyed virtually no credible competition for decades. This has led to TechInsights underinvesting in CAPEX. SemiAnalysis exceeds TechInsights in revenue despite no venture or private equity ownership and being founded only 6 years ago. Because we have no external investors and are founder led, we move faster, build faster, and we can release client chip teardowns for free regularly, while focusing on datacenter for our major clients. Here’s the first public image from our lab, the HiSilicon Kirin 9030 Pro SoC: This report will detail our teardown of the Kirin 9030 and our findings on SMIC’s N+3 process, the most advanced in China. For comparison, we’ll show our teardown of the MediaTek Helio G99, made on TSMC N6. Through this comparison, we can look at the effect of export controls – SMIC N+3 and TSMC N6 are comparable nodes, but one is heavily export-controlled, the other free to use the West’s most advanced equipment. Here we see both China’s progress and constraints. SMIC N+3 reaches TSMC N6-class logic density, but it requires far more aggressive DUV multi-patterning, so it does not match N6 on process maturity or cost. The Kirin 9030 Pro performs similarly to three-year-old Android flagships, and trails far behind the current flagship SoCs from Apple, Qualcomm, MediaTek, and Samsung. The efficiency gap is even wider. Export controls have not stopped Huawei and SMIC from shipping advanced silicon, but they have forced a different path. Without EUV, SMIC is leaning harder on DUV multi-patterning, DTCO, and increasingly complex integration. The roadmap continues forward through tighter design rules and backside power, but each step adds cost and process risk. Huawei’s τ scaling and LogicFolding show another path: stacking active logic and recovering density through advanced packaging and system-technology co-optimization (STCO). To understand the Kirin 9030, we must first understand Huawei’s SoC history. HiSilicon is Huawei’s chip design arm, responsible for the Kirin smartphone SoCs, Kunpeng server CPUs, Ascend AI accelerators, and switch/router networking silicon. Before export controls, Huawei was TSMC’s largest customer – the only customer on TSMC’s first EUV node, N7+, and among the first on N5, alongside Apple. That ended in late 2020. Huawei switched to Qualcomm SoCs in its flagship smartphones, though export controls limited them to 4G-only variants. In late 2023, Huawei returned to in-house silicon with the Kirin 9000s, a successor to the Kirin 9000, fabricated on SMIC N+2 instead of TSMC N5. In the following years, they released the Kirin 9010 and 9020 on the same N+2 process. These chips used Huawei’s in-house TaiShan CPU cores and Maleoon GPU. We have not torn down a Kirin 9020 ourselves, so the predecessor die shot is from Kurnal. The die shots show how Huawei spent its silicon budget: which functional blocks are where, and how their areas compare to the predecessor. First, a quick guide to the major blocks on the die. The total die area is nearly identical, but the 9030 uses that area more aggressively. A denser process lets Huawei fit an extra middle CPU core, more GPU and NPU cores, and larger caches into the same footprint. In contrast, the Helio G99 is a much smaller, low-cost SoC, built for budget smartphones rather than a flagship device. While the Kirin 9030 is ~140 mm², the G99 is only ~29 mm², roughly one-fifth the area. The underlying TSMC process technology, however, is directly comparable as a baseline for analyzing SMIC’s. The Kirin 9030 is an evolutionary refresh, not a clean-sheet design. Its CPU, GPU and NPU cores carry over the 9020’s families, and the gains come from three levers: the SMIC N+2-to-N+3 process step, DTCO and floorplan work, and incremental microarchitecture. Area is where the first two show up, and the 9030 scales well here. Performance and efficiency are the harder test. Huawei’s design holds up better than its node would suggest, but the chip still trails, both because N+3 sits behind the leading-edge nodes and because its cores, while competent, remain a few generations behind the newest designs. The new prime core is an incremental update. The main changes are a 10% frequency increase from 2.5 GHz to 2.75 GHz and a doubling in the L2 cache from 1 MiB to 2 MiB. Despite the increased cache, the core size decreased by 7.6%. Excluding the private L2 cache, the core size decreased by 21%. This is a large reduction for an incremental node. Compared with the TaiShan New V120 core in the Kirin 9020, the Kirin 9030’s middle core is almost unchanged architecturally, yet each core shrinks by ~22%. Most of that comes from the move from N+2 to N+3, with layout likely accounting for the rest. Visually, the most noticeable change is the increase from 3 middle cores to 4. There is also a 20% increase in the shared L3 cache of the big cluster. This helps to improve multi-core performance without sacrificing much in terms of area. Even with each core shrinking, the big CPU cluster’s total area is essentially unchanged. The per-core savings went back into an additional middle core and larger caches. The tiny cores shrank less than the prime core (excluding its L2 cache) and less than the middle cores. This is likely because fixed overhead is a larger share on a small core. We cannot resolve any architectural changes from the die shot alone, but the per-clock and efficiency gains shown below point to more than pure process and layout scaling. The area reduction was offset by a doubling of the shared L2 cache from 2 MiB to 4 MiB, leaving the total tiny CPU cluster area slightly larger. Area is the easiest improvement to see from a die shot, but it is only one part of PPA (power, performance, area). For modern logic, power and performance matter just as much, and often more. Since Dennard scaling broke down in the mid-2000s, voltage and frequency have not scaled in step with transistor dimensions, so each node has had to fight harder for gains in performance and efficiency. The starkest comparison is not Kirin 9020 versus Kirin 9030 Pro. Apple’s efficiency cores run circles around Huawei’s prime core. Apple’s low-power core delivers 20% higher integer performance while drawing only 1 W, compared with 4.5 W for Huawei’s prime core. N+3 matches TSMC N6, but N6 is several generations old. Apple and Qualcomm build on N4 and N3P, which are denser and sit on a better voltage-frequency curve, giving them a larger transistor budget and more performance per watt. The 9030’s own cores did improve. The middle and tiny cores gained 17% and 14% in per-clock integer performance over the 9020, with floating-point flat on the middle core and up 11% on the tiny. The tiny core improves cleanly, with performance rising while power falls and efficiency increases by 45% in integer and 24% in floating point. The middle core is mixed: integer performance rises but power rises faster, cutting integer efficiency by 7%, while lower power lifts floating-point efficiency 16%. Per-clock gains at the same or lower frequency are microarchitectural, so the cores are tuned, not just shrunk. Both also failed to hold their rated maximum frequencies, pointing to thermal, power, or stability limits. Per clock, the middle core sits around Arm Cortex-A720 and the tiny core near the Cortex-A520; absolute performance trails because Huawei clocks them much lower. The prime core is roughly Cortex-X2 class per clock, a 2021 design. Apple’s 2020 M1 Firestorm core is still 35% higher per clock and 57% faster in absolute integer performance at a similar 4.5 W. The current leading edge is further ahead again: the Apple M5 P-core is 60% higher per clock and 2.7× faster, the Arm C1 Ultra 45% higher and 2× faster. Matching older high-end cores per clock is a genuine design achievement. What Huawei cannot match is the voltage-frequency curve and transistor budget of leading-edge nodes, which let Apple, Qualcomm and others spend more transistors in the same area on wider cores, larger caches and deeper buffers while running at lower voltage. Huawei’s LogicFolding roadmap is one answer, stacking active logic to recover density and shorten signal paths. We return to it later. The GPU compute units (CUs) changed more visibly than the CPU cores, moving to a more rectangular layout for both the arithmetic logic unit (ALU) clusters and the CU overall. Even with ray-tracing support added, a CU shrank ~28%. However, that shrink is offset by the increase from 4 to 6 CUs and the area outside the CUs grew 33%. Overall, the GPU cluster is larger by ~10%. The GPU is where Huawei makes its biggest gains. The Maleoon 935 is not competitive with current flagships, but it is a large step up from the 920 and reaches older-flagship territory. In 3DMark it is 70% faster in Wild Life Extreme (WLE) and 79% faster in Steel Nomad Light (SNL) than the 920; with 11% higher clocks and 50% more CUs, the ~67% theoretical uplift roughly matches WLE and is beaten by SNL. It edges ahead of the Snapdragon 8+ Gen 1 in WLE and SNL, and the Dimensity 9200 and Apple A16 in WLE, but stays far behind newer parts: the Snapdragon 8 Elite Gen 5 and Dimensity 9500 are ~2.4–2.6× faster in WLE and ~3.2× faster in SNL. The Maleoon 935 is Huawei’s first GPU with hardware-accelerated ray tracing; there it lands slightly ahead of the Exynos 2200, and on par with the Apple A16, with current flagships up to 3.7× faster. The Neural Processing Unit (NPU) saw the largest structural changes of any block, moving from a Lite and a Tiny core in the Kirin 9020 to a Lite and two Tiny cores in the Kirin 9030. Both core types also show significant layout changes. This is a reversal in Huawei’s NPU design. The Kirin 9000 5G, its last flagship chip on TSMC N5, used two Lite and one Tiny core. The series of SoCs on SMIC N+2 moved to one Lite and one Tiny core, likely for area savings. With the Kirin 9030, Huawei has shifted back toward a larger multi-core NPU cluster, but with the additional area going to a Tiny core rather than a Lite core. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Before diving into the process stack, the package and memory are worth separating from the SoC itself. The Pro variant of the Kirin 9030 carries 12 GB of Samsung DRAM, with two stacks of four dies each. The dies were identified as the K4L2E165YD, a 12 Gb LPDDR5X-9600 device fabricated on Samsung’s 1a node, the fourth generation of its 10 nm-class DRAM after 1x, 1y and 1z. 1a has shipped in volume since 2022, so this is current memory rather than older-node inventory. The 16 GB Pro Max variants we obtained were found with both CXMT and Samsung packages. The CXMT package is marked CXDD7JEDM, with two stacks of four dies, packaged in week 45 of 2025. The inferred die dimensions from X-ray computed tomography (CT) are consistent with a known density of ~0.3 Gib/mm² for the CXMT G4 process, roughly equivalent to other manufacturers’ 1z processes. The Kirin 9030 uses a typical integrated package-on-package (iPoP) stack: multiple DRAM dies in a memory package sit above an organic redistribution layer (RDL) interposer, which sits above the SoC and package substrate. The full package is then mounted to the printed circuit board (PCB) through ball-grid array (BGA) solder bumps. The memory package substrate is a thin bismaleimide-triazine (BT) laminate carrying the LPDDR5X stack. The organic RDL interposer over the SoC routes the PoP signals around the die and carries possible dummy thermal copper pillars. The package substrate, a thicker Ajinomoto Build-up Film (ABF) build-up over a BT core, fans the flip-chip bumps out to BGA pitch and embeds the power planes. The whole stack is organic. The only silicon is the SoC and the LPDDR5X dies; there is no silicon interposer. Keeping it all-organic brings the package’s coefficient of thermal expansion (CTE) close to the PCB’s, reducing board-level warpage, and avoids the cost of a silicon interposer the SoC’s bandwidth does not need. In an iPoP stack, the memory package connects to the organic RDL interposer through an array of solder bumps. Underfill fills the gap around those bumps, adding stiffness and protecting the joints from mechanical stress. The Pro and Pro Max variants differ here, which we cover behind the paywall. The die shot and architecture tell us how Huawei allocated its silicon budget. The process tells us what SMIC can manufacture. We use the Helio G99 as the process reference for TSMC N6. Both SMIC N+3 and TSMC N6 are evolutions of previous 7 nm-class nodes. We used targeted TEM cross-sections through logic and memory regions, imaged in both fin-cut and gate-cut directions. Each cross-section caption gives its horizontal field width (HFW), the real width of the imaged area. We start at the transistor fins, then move up through standard cells, local interconnect, and SRAM. SMIC has not overtaken Intel or TSMC. It uses aggressive DUV scaling and DTCO to reach N6-class density, but that density doesn’t translate into comparable performance and efficiency, for two reasons: the node gap to leading-edge nodes, and Huawei’s core designs. Fin Profile One of the most important knobs in a FinFET process is the fin profile: the shape of an individual fin and the channel where current passes from source to drain. The ideal fin is tall, narrow, and nearly vertical. A taller fin increases effective channel width, while a narrower fin improves electrostatic control by thinning the body the gate must control. Push either too far, and the process pays for it: weaker drive current, fragile fins, taper, footing and line-edge variation that hit yield and device variability. The Intel 22 nm, 14 nm, and 10 nm fin cross-sections show how FinFET nodes have improved over time. 22 nm fins were a first-generation structure, relatively short, wide and strongly tapered. The shape limits current density and reduces gate control uniformity across the height of the fin. At 14 nm and 10 nm, Intel pushed the fins taller and narrower while also making the sidewalls more vertical. Rather than shrinking the device, these changes increase the effective channel width per fin and improve electrostatic control. The trade-off is that taller fins at tighter pitches are much more difficult to manufacture. Now, let’s compare the Helio G99 on TSMC N6 with the Kirin 9030 on SMIC N+3. Both processes are in the same class, with fin pitch of 30-32 nm on N+3 and 34 nm in our N6 cross-section. The pitch for N6 is especially interesting as N7’s HD library is generally listed with a 33 nm fin pitch, and N6 did not shrink pitches directly. Its density gains came from DTCO instead of tighter pitches. The 34 nm pitch was stable across our sampled region and serves more as a comparison against the SMIC N+3 we have not investigated further. Pinning down N+3’s fin patterning scheme takes more than one core unit. The CPU cores show a dense ~32 nm pitch, with the pitch between N-P fin pairs alternating between 78 and 88 nm. Logic alone may be consistent with dual-pitch mandrels of 120 and 110 nm, but this is a complex and unusual approach. Combining the pitch from the the 8T SRAM, which has more complex repeat unit, with the CPU core sequence allows us to reverse engineer the patterning steps with more confidence. As both the logic and SRAM should share the same base grid, a single CD mandrel lithography pattern with 128 nm pitch undergoing SAQP produces a die-wide ~32 nm grid (128 nm/4), which supports the pitch sequencing seen in both logic and SRAM cells. In the sampled cross-sections, N+3 shows a taller, narrower, higher-aspect-ratio fin than N6. The measured fin aspect ratio is ~9.5:1 on N+3 versus 7.8:1 on N6. N+3 also shows less top rounding, with an estimated radius of ~2 nm, compared with 2.8 nm on N6. Even though the fin widths differ, the ratio of top rounding to fin width tells the same story, with N+3 at 0.37 and N6 at 0.44. In a geometric sense, lower is better; a perfectly rectangular fin would have no top-rounding penalty. These are single-digit-nanometer features measured from a handful of cuts, so treat the absolute numbers as approximate. The important result is the relative gap: N+3’s fins are consistently taller, narrower and less rounded than N6’s. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Standard Cell A standard cell is the basic building block of chip layout: a fixed-height row pairing one NMOS and one PMOS transistor that share a gate, tiled in a grid to build logic blocks. The key dimensions are contacted gate pitch (CGP), cell height (CH), fin count, and the lower-metal routing grid. To measure density, we use the Bohr metric: a weighted average of NAND2 gate area (60%) and scan flip-flop area (40%). This represents a realistic mix of combinational and sequential logic. This metric has its limitations, especially for complex cell layouts like TSMC’s FinFLEX, which alternates cells with different fin counts. Even so, it is the best metric for a pure process-level comparison. Another important measurement is the fin pitch; it refers to the distance between two fins of the same transistor. In a FinFET process, multiple fins are used in each transistor to increase the drive current and thus performance. TSMC N6 ships both a high-density (HD) library with 2 PMOS and 2 NMOS fins per cell, and a high-performance (HP) library with 3 of each. More fins under the shared gate mean more effective channel width. HP cells switch harder at the cost of area. Designers mix the two on a die, primarily spending HP cells on timing-critical paths, and matching their PPA targets. In the Cortex-A55 core of the Helio G99, we found a cell height of 240 nm for the HD cell. MediaTek has used HD cells in the G99 to minimize die size and thus cost. As an SoC for budget smartphones at ~$100, this is essential. By contrast, we found only one library in the Kirin 9030, with 2 NMOS and 2 PMOS fins. This suggests a narrower library strategy than TSMC N6, where both HD and HP libraries are widely used. This likely reflects the smaller customer base and the more constrained domestic design and electronic design automation (EDA) ecosystem. In all three CPU cores of the Kirin 9030, we found cell heights of 228 nm, 5% smaller than on N6. This is also a reduction of 9.5% over SMIC N+2’s cell height of 252 nm. SMIC N+3 and TSMC N6’s HD library both feature a CGP of 57 nm. For SMIC, this is a 9.5% shrink over N+2. In the past, CGP and cell height alone may have been enough to compare transistor density. Now, however, we must consider scaling boosters and DTCO as well. SMIC’s density gain does not come from EUV. It comes from using every available DTCO booster aggressively. First is fin depopulation: reducing the number of NMOS and PMOS fins in each cell. The first FinFET nodes started with 3 or 4 fins for each transistor. SMIC N+3 and TSMC N6 HD both use only 2 fins per transistor, trading drive strength for density. Next is contact over active gate (COAG). By landing the gate contact directly over the active gate, instead of out over the isolation region, the cell height drops. N+3 integrates COAG while N6 does not. Our N+3 gate-cut cross-sections indicate COAG, with the gate contact sitting over the active region, while N6 shows an off-gate contact. Last is single diffusion break (SDB). Diffusion breaks are inserted between cells in the same row to provide electrical isolation, but they also introduce local layout effects (LLE), layout-dependent shifts in electrical characteristics. In the past, a double diffusion break was used, consuming the space of two CGPs. SMIC N+3 and TSMC N6 instead use SDB, saving area but increasing LLE sensitivity. This must be controlled at the process level and accurately modeled in the process design kit (PDK) so that EDA tools can account for it. Overall, SMIC N+3 has a transistor density of 113.4 MTr/mm², slightly above TSMC N6 at 107.7 MTr/mm². Even without EUV, SMIC has achieved density beyond TSMC’s mature N6 node which utilizes EUV. Metal Stack The smallest critical dimension in the teardown is M0; SMIC N+3 uses a 32.5 nm local metal pitch. That is smaller than the 36 nm M0 pitch on Intel 18A in Panther Lake. However, this does not mean that SMIC has a better process than Intel 18A or TSMC N3P. M0 is a local intra-cell routing layer. Its usefulness depends on the full interconnect stack: M1 and M2 pitch, track count, via and line resistance, design rules, mask count, overlay control, and routing flexibility. The 32.5 nm M0 is consistent with self-aligned quadruple patterning (SAQP), whose four-population line-width loading we read coarsely as alternating widths of 21.5 to 24 nm; M1 and M2, at 38 and 40 nm, are consistent with self-aligned double patterning (SADP), a single A/B split. On TSMC N6, M0, M2, and M3 sit at a relaxed ~40 nm and are consistent with SADP-class double patterning, with no need for quadruple patterning. That said, we measure M2 for example at ~43 nm, likely inflated by sparse routing. We do not assign any specific layer to EUV from our cross-sections; the distinction we can draw is double versus quadruple patterning, not lithography wavelength. Transistor-level density in the front-end-of-line (FEOL) sets an upper bound, but the design is ultimately limited by what the interconnect stack can route. The lowest metals are the most important for standard-cell density, but the semi-global and global layers determine how usable that density is at the block and chip level. Two axes are commonly used for chip cross-sections: the fin-cut and the gate-cut. The micrograph above is a fin-cut and shows metals 0 through 3. This axis lets us see the even-numbered metals, with M0 right above the fins. There are two kinds of M0 lines. The first are the power rails; these are wide wires for the VDD and VSS running horizontally at the top and bottom edges of each standard cell. The wide wires measure 55 nm across, more than double the other M0 lines. Their width minimizes resistance and reduces IR drop. The second kind are intra-cell wires, short segments within the cell that connect terminals to M1. These have alternating widths between 21.5 and 24 nm. The M0 pitch is 32.5 nm, a 19% reduction versus N+2 and N6. At this pitch, DUV patterning requires more aggressive multi-patterning, increasing mask count, overlay sensitivity, process complexity and cost. M0 is below what a single DUV-defined spacer (SADP) can resolve, so SMIC cascades a second spacer step (SAQP). The cross-section reflects the cost: the M0 trenches are visibly more re-entrant (narrower at the bottom than the top) than M1 or M2 on the same chip and carry a bright barrier-rich foot where the trench meets the etch-stop layer. That shape is partly the intended damascene profile, as a slightly narrow bottom helps void-free copper fill, but its magnitude at M0 is driven by the tight pitch and the higher trench aspect ratio. Intel 18A supports an M0 pitch of 32 nm, although Panther Lake has only shipped with a looser 36 nm pitch. This is due to Intel’s heavy usage of HP libraries. Among leading-edge nodes, 18A has the loosest M0 pitches due to PowerVia. With power routing moving to the backside, congestion is reduced, and the entire front-side metal stack can be used for signal routing. M2 is the first true inter-cell routing layer. It runs horizontally like M0 but spans across multiple cells to carry block-level signals. The M2 pitch sets the cell’s track height – the number of M2 tracks that fit between the VDD and VSS rails, defining what the library calls a 6-track or 7.5-track cell. This layer is the most important, limiting the routing of entire blocks. SMIC N+3 features a 5.7-track cell. The M2 pitch is 40 nm, a 5% decrease over N+2 and the same as N6. This shrink keeps the pitch at the edge of what is possible with double patterning. Future nodes will need to increase the number of masks for M2 as reducing the number of tracks is much harder due to the limitations in routing. The micrograph above is in the perpendicular direction, the gate-cut, and shows metals 0 through 4. This allows us to see and measure the odd-numbered vertical metal layers. The M1 pitch is 38 nm, 9.5% less than N+2 and 33% less than N6. The M1-to-gate ratio matters because it sets local routing flexibility. N+2 and N+3 use a 3:2 ratio, while N6 uses a 1:1 ratio, explaining the huge differences in M1 pitch. The more M1 lines there are compared with the gates, the more flexibility there is for power and signal crossing within the cell. Routing flexibility enables more complex and better cells. Clean fractional ratios are also preferred as a grid is periodic and improves layouts. The 3:2 ratio gives SMIC more local routing flexibility than a strict 1:1 grid, but it also complicates layout and patterning. This is a DTCO choice, with SMIC increasing process complexity to recover density and routability without EUV. This 3:2 ratio is not very popular in the leading-edge nodes. TSMC has only used it on N7+, the N5 family, and the short-lived N3(B). They have switched back to a 1:1 ratio for N3E. Intel has only used it on the 10 nm/Intel 7 family, with Intel 4, 3 and 18A all using a 1:1 ratio. Samsung is the only one still using a 3:2 ratio at the leading edge, using it in the SF4 and SF3 families. It remains to be seen if SMIC will remain at a 3:2 ratio or move to a 1:1 ratio with its future nodes. The industry is still actively exploring these local-routing ratios. At VLSI 2026, imec will be presenting work on even higher ratios, including a 2:1 scheme that can reduce area by up to 14%. We will be covering the conference in a future newsletter article. Subscribe We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. The final local interconnect layer for N+3 is M3, with a pitch of 44 nm. The M3 pitch is the same as on N+2 and 10% larger than on N6. The semi-global layers carry the majority of block-level signal routing. They have a coarser pitch than the lower local layers. On leading-edge nodes, they are designed to sit at the limit of DUV single patterning. M4 through M11 pitches were found divided between 80–82 nm (M4–M6), 128 nm (M7–M10), and 148 nm (M11). Given limited sampling, it is possible these are divided further in dense routing areas. At the top are two giant metal layers, M12 and M13. These have kept the same pitches as N+2 at 1920 nm and 4600 nm respectively. While the lower layers’ pitches are generally fixed by the process and library, the upper layers vary much more in pitch and count, depending on the design. Even two smartphone SoCs on the same process can have wildly different metal stacks. The Helio G99 carries fewer routing layers, reaching coarse metal pitches of 850 nm by M9, while the larger and higher-performance Kirin 9030 keeps fine pitches until M11. SRAM At the leading edge, SRAM is much more difficult to scale than logic. TSMC’s latest nodes have seen little to no bitcell scaling, while logic still has more DTCO levers to pull. While looking for other logic libraries in the GPU compute units, we stumbled upon the SRAM. The most common type of SRAM has 6 transistors (6T), but this cell had 8 transistors (8T) instead. 8T SRAM adds two transistors to form a dedicated read port. Unlike a 6T cell, where reading disturbs the storage, the decoupled read port removes read-disturb, improving read stability and letting the cell be pushed harder for performance. At first glance, the cut looked like an unusual logic library, with each cell row having 3 fins of one polarity and 5 fins of another. The rows also alternated in orientation. Energy-dispersive X-ray spectroscopy (EDS) resolved our confusion. The cut had not landed on the GPU logic, but on the SRAM macro beside it. The unusual fin pattern was due to the SRAM library. We return to EDS in the process flow analysis behind the paywall. SRAM libraries are not like traditional logic libraries. Due to the unequal number of PMOS and NMOS transistors, they require specialized rules and layout libraries. They do not need the flexibility of logic libraries, so they are hyper-optimized for one purpose: dense, reliable memory. The SRAM cell we found is a 1:2:2-2:2 cell. This means there is 1 fin per pull-up (PU) PMOS transistor, and 2 fins per pull-down (PD) and pass-gate (PG) NMOS transistor. These 2 PU, 2 PD and 2 PG transistors would usually form a single 6T high-current cell (HCC). An 8T HCC adds a read-pull-down (RPD) and a read-pass-gate (RPG) NMOS transistor, each with two fins. We measured a cell height of 406 nm, which brings the bitcell size to 0.0463 µm². That is a theoretical peak density of 21.6 Mib/mm². We estimate that a 6T HCC would have a cell height of 292 nm and a size of 0.0337 µm². This is ~12% larger than a 6T HCC on Intel 3 and 4. We also estimate the 6T high-density cell (HDC) to have a cell height of 228 nm and a size of 0.0260 µm². This is coincidentally the same as the logic standard-cell height measured earlier. The estimate puts the cell near Samsung 7LPP/5LPP and slightly below TSMC N7/N6. That is a theoretical peak density of 38.5 Mib/mm². 6T HDC is arguably the most important cell as it is used for the largest caches in a chip, the L3 caches and system-level cache (SLC). Both the Kirin 9020 and 9030 have split the SLC into 4 banks to raise total SLC bandwidth. In the Kirin 9030, the SLC increased from 2 MiB to 3 MiB per bank. Correspondingly, the number of arrays within the bank also increased by 50%, from 16 to 24. Each array can store 128 KiB and forms an orderly pattern on the die shot. From the Kirin 9020 to the Kirin 9030, the area of a 128 KiB SLC array decreased from 0.0477 mm² to 0.0392 mm², an 18% shrink. The achieved density is 25.5 Mib/mm², 66% of the theoretical maximum. While the SLC was quite similar across both chips, the L3 has seen some major changes, particularly in terms of its layout. The total capacity also went up from 10 MiB to 12 MiB. Much like the SLC, the L3 is also split into 4 banks. In the Kirin 9020, an L3 bank consisted of 16× 128 KiB arrays and 16× 32 KiB arrays. However, an L3 bank in the Kirin 9030 instead consists of 48× 64 KiB arrays. In the Kirin 9020 L3, a 128 KiB array was 0.0513 mm² and a 32 KiB array was 0.0154 mm². The size of the 128 KiB array is different on the L3 and SLC as the assist circuitry for the two arrays differs depending on their purpose. In the Kirin 9030 L3, a 64 KiB array is 0.0210 mm². Although not a like-for-like comparison, normalized for capacity, it is 18% smaller than the 9020’s 128 KiB L3 array and 31% smaller than its 32 KiB L3 array. The achieved density is slightly lower than the SLC, at 23.8 Mib/mm², 62% of the theoretical maximum. Unlike the L3 and SLC, the prime cores’ private L2 cache uses a 2-bank design. As the prime cores’ L2 is latency-critical, it likely uses 6T HCC instead of 6T HDC. The 9020 has 16 arrays in each bank while the 9030 has 32. Each array has a capacity of 32 KiB. A 32 KiB array in the L2 shrank from 0.0171 mm² to 0.0142 mm², ~17% smaller. The density is 17.6 Mib/mm², ~59% of the theoretical maximum for 6T HCC. SRAM scaled well from N+2 to N+3, shrinking by ~19%, close to the theoretical logic shrink. The caveat is that N+2’s bitcells were unusually large, bigger than comparable 7 nm-class nodes, so part of the gain is catch-up rather than true scaling. With the insights from STEEL’s teardowns, we will be doing a deep dive into SRAM in a future newsletter article. Subscribe Everything above came out of a single STEEL teardown: die annotation, block-level area analysis and TEM cross-sections through logic and SRAM. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Future Roadmap The same cross-sections that pin down N+3 also show where SMIC can go next. Although N+3 is already close to the practical limits of DUV multi-patterning in several layers, SMIC still has a few scaling levers left. A theoretical N+4 would likely start with cell height. N+3 uses 5 M0 tracks between its power rails. Moving to 4 M0 tracks, as on SMIC N+2 and TSMC N6, could reduce cell height by roughly 15%. The routing grid is only one side of the shrink; the front end also must fit into the smaller cell. One possible FEOL lever is reducing the p-to-n isolation spacing from two diffusion grid units to one. Intel used this scaling booster on Intel 4, and TSMC did so on its N3 family. This path trades layout flexibility for density. Fewer M0 tracks reduce local routing resources, while tighter p-to-n spacing raises integration and design-rule difficulty. M2 is also constrained by the cell height shrink. For SMIC to maintain a ~5.7-track cell, M2 would need to move toward ~35 nm. That would move another layer into SAQP territory. SMIC could also reduce the CGP from 57 nm to 54 nm. Intel reached a similar CGP on Intel 10 nm/Intel 7 without EUV. The local interconnect is also tougher. If SMIC keeps the 3:2 M1-to-gate ratio, M1 would need to shrink to 36 nm and would likely require SAQP as well. If SMIC moves to a 1:1 ratio, M1 could relax to 54 nm, but it would give up routing flexibility. Under this theoretical path, we estimate that SMIC N+4 could reach a cell height of 198 nm and a CGP of 54 nm, implying a Bohr density of 137.8 MTr/mm², on par with TSMC N5 or Samsung SF4. However, the difficulty is cumulative. Each step is individually plausible, but together they make N+4 harder than the transition from N+2 to N+3. It will likely take longer, cost more, and carry less process margin. A theoretical N+5 would require a larger integration shift. One possible path is backside contacts (BSCon), moving power routing and source/drain contacts to the backside, which would reduce front-side routing pressure and enable another reduction in cell height. The front-side metal pitches could relax to reduce the process complexity. M0 would likely relax slightly to ~34 nm, and M2 and M4 pitches could relax further. CGP is unlikely to shrink much further. Even with EUV, 48 nm has been the practical limit for yield and process control. This approach would allow N+5’s cell height to fall to 170 nm and its CGP to 53 nm. This implies a Bohr density of 163.6 MTr/mm², on par with Intel 18A’s HP library. However, this would not make N+5 cost-competitive with the leading edge. It would reach a similar density through a much more expensive route. The integration difficulty rises sharply, with new process flows for backside alignment, wafer thinning, contact reveal, and backside metallization. Past this point, standard density and interconnect scaling become increasingly unattractive. That is where Huawei’s roadmap stops looking like a normal foundry roadmap and starts looking like a packaging roadmap. At ISCAS 2026, Huawei unveiled its tau (τ) scaling law, reframing process scaling in the time domain. τ is the time cost of data movement and processing: switching delays in transistors, RC signal propagation delays in circuits, compute, memory, and networking latency. Outside Huawei’s terminology, this is called system-technology co-optimization. This is Huawei’s answer to its lack of EUV lithography. Without EUV, planar density cannot keep pace with TSMC, Intel, or Samsung. If transistor density cannot shrink further, Huawei’s alternative is to shorten wires, reduce buffering, and stack logic vertically. “LogicFolding”, Huawei’s implementation of this new scaling idea, is, in practice, an aggressive 3D stacking approach. AMD V-Cache places SRAM above or below a CPU die. AMD’s MI350X places active interposer dies (AIDs) underneath accelerator and compute dies (XCDs), with the AIDs handling cache, IO interfaces, the network-on-chip (NoC) and embedded metal-insulator-metal (MIM) capacitors. With LogicFolding, parts of the same logic block are split across multiple active dies bonded face-to-face at ultra-fine pitch. This allows Huawei to shorten some critical paths and reduce buffer overhead, not merely add cache capacity or offload the IO and interconnect. Shortening wires is where the higher clocks come from. A large share of a modern core’s delay and energy budget goes into driving long interconnects and the repeater buffers along them. LogicFolding distributes a block’s critical-path gates across multiple stacked tiers bonded at a very fine pitch, so the bond interface behaves like an additional metal layer and the longest paths get shorter. That is how Huawei expects to recover frequency and efficiency it cannot get from the process alone. Huawei’s roadmap shows its intent. Prime core frequency is targeted to rise from 2.75 GHz in the Kirin 9030 to roughly 5 GHz by 2031, far beyond what planar scaling alone could deliver. Prime cores with 3.1 and 3.39 GHz clocks are being tested in its labs, although their power consumption is unknown. Beyond that, chips are in the design, simulation or pathfinding phase, meaning the frequencies are targets. However, the direction matters more: LogicFolding also helps with performance, not just density. The catch is that Huawei’s density claim is not directly comparable to foundry densities. A stacked design can report more transistors per package footprint by adding active layers, even if each patterned die remains well behind TSMC or Intel in front-end density. This is how Huawei can claim to reach foundry 14A-equivalent density by 2031. This is not a like-for-like foundry comparison, with Huawei using stacked logic and measuring density per package footprint. On a normalized Bohr-density basis, SMIC N+3 is ~114 MTr/mm², 38% less than Intel 18A’s HD library. Huawei’s 3D roadmap closes the gap by stacking active logic, reaching 215 MTr/mm² by 2030. In 2031, the roadmap density jumps to 295 MTr/mm², implying either a third active layer, partial EUV insertion or aggressive planar DUV scaling. Huawei’s methodology makes other foundries look much denser as well. Applying it to AMD’s MI450X with an N2 top die on an N3P base die yields a theoretical density of 460.2 MTr/mm² in 2026, compared with Huawei’s 295 MTr/mm² in 2031. This Kirin 9030 does not use LogicFolding, remaining in a conventional mobile SoC package. Instead, it forms the baseline for how far Huawei and SMIC can push planar scaling. Future teardowns of Kirin and Ascend chips will show both planar logic density and Huawei’s hybrid bonding solutions. Export controls changed China’s optimization problem rather than ending it. EUV restrictions raised the cost and complexity of leading-edge manufacturing without freezing it. SMIC reaches N6-class logic density through DUV immersion, SAQP and DTCO, while Huawei shifts more of the burden onto architecture, packaging and system-level integration. Future nodes will be tougher. N+3 still had room to tighten local metals and reduce cell height and CGP. Further scaling without EUV leaves fewer levers. More aggressive multi-patterning adds masks and overlay error. SMIC can keep pushing DUV, but each step will get more expensive and less forgiving. The design side is just as critical. Huawei had domestic EDA tools and flows before the Kirin 9030, with the Kirin 9000s, 9010 and 9020 making that clear. Huawei was able to ship multiple consumer SoCs on SMIC N+2 and N+3 while cut off from the Western EDA stack. US export controls restricted EDA tools for advanced chips in 2022 but did not target tools for more mature chips. In 2025, the US government briefly placed much broader restrictions on EDA software from Synopsys, Cadence, and others, before lifting them less than two months later as part of a trade deal tied to rare earths. Huawei has been unable to access those tools because it remains on a US trade blacklist. That forced Huawei, SMIC and Chinese academic institutions to build their own tools and flows. Researchers at Peking University recently announced a prototype EDA tool for Huawei’s LogicFolding architecture, which requires a new flow to handle the multilayer layout and floorplan. This is not the same as replacing the full Synopsys or Cadence stack, but it shows where domestic EDA is headed: toward tighter co-optimization between architecture, process and packaging. These advances are also diffusing into the Chinese ecosystem. SMIC is licensing its N+2 and N+3 processes to HLMC/Hua Hong at the government’s direction rather than by choice. If the same process learning feeds into Ascend accelerators for AI training and inference, the choke point shifts from one named fab to an ecosystem. Alibaba’s T-Head silicon arm and Cambricon, a Chinese AI chip designer that is expected to supply ByteDance, could also be major beneficiaries. Sanctions aimed at SMIC alone become less effective once the manufacturing knowledge has spread to other fabs and design houses. China is not closing the gap with Intel, Samsung and TSMC. The teardown shows the opposite in several places: no EUV, no backside power, higher process complexity, and visible trade-offs. But China is still advancing. If domestic chips become good enough for phones, inference, networking and security-sensitive workloads, they can matter strategically without matching TSMC at the leading edge. Behind the paywall, we show what else STEEL can do, with material and process flow analysis of SMIC N+3, and analysis of the Kirin 9030 package. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline, access the full Kirin 9030 and SMIC N+3 analysis or to commission a custom teardown, contact sales@semianalysis.com.
When religion and politics mix, it’s just a big ol’ mess
The Southern Baptists met in convention last week and reaffirmed their rule that women can't preach in church. They cited scriptures, such as I Corinthians 14:34-35, which says straight out, "Women should remain silent in church ... as the law also says."
3-star DB John Catlin commits to Arkansas football
Arkansas football has received the commitment of defensive back John Catlin during his official visit to Fayetteville.
Arkansas' newest pledge Davion Thompson has elite ability
Arkansas basketball point guard commitment Davion Thompson has elite scoring ability that should serve him well as a Razorback.
ENTERTAINMENT: Film tracks four emerging opera stars; MacArthur Museum screens ‘The Forgotten War’
The MacArthur Museum of Arkansas Military History screens the documentary “The Forgotten War,” examining the three years of heavy combat in the Korean War from the perspective of soldiers that fought it.
Better Business Bureau: Major sporting events bring economic opportunities and increased scam risks
As excitement builds around World Cup matches – especially with Spain's team training in Chattanooga and tournaments being held as close as Atlanta – your Better Business Bureau is encouraging local fans and businesses to prepare for increased activity, heightened demand and the rise in scams that too often accompany major global sporting events.
Local History: Kefauver calls out corruption in Tennessee politics
Chattanooga's Estes Kefauver was elected to the U.S. House of Representatives in 1939, after campaigning as a progressive supporting President Franklin D. Roosevelt's New Deal.
South Africa banks chase underserved mid-sized businesses to drive growth
(Corrects paragraph 7 to say in excess of 30% not about 30%, paragraph 9 to make clear that clients will grow by 7,000 not to 7,000) By Nqobile Dludla JOHANNESBURG, June 11 (Reuters) - In the glass-walled boardrooms of South Africa's biggest banks, executives are ramping up efforts to win clients from a once overlooked corporate segment: medium-sized companies that are now too lucrative to
Arkansas football hosting several prospects for official visits
Arkansas football will host at least seven 2027 prospects for official visits this weekend starting on Friday.
Businesses feeling the pain from AI spending, so OpenAI reportedly weighs price cuts
An artificial intelligence price war between OpenAI and Anthropic might be brewing, with The Wall Street Journal reporting that OpenAI, the maker of ChatGPT, is considering "drastic" price cuts for business clients.
Get to know: '27 kicker commitment Rocco DePrima
Arkansas kicker commitment Rocco DePrima is not hurting for leg strength and has a 67-yard field goal during a workout in January to prove it.
Top 25 prospect Davion Thompson commits to Arkansas basketball
Top 25 class of 2027 prospect Davion Thompson has announced his commitment to Arkansas coach John Calipari and staff over other finalists Michigan, Baylor and Vanderbilt.
ENTERTAINMENT: Flag Day concert, ‘Anastasia’ musical on weekend ‘set list’
The Little Rock Winds’ 29th annual Flag Day concert, 7 p.m. Sunday on the old parade ground behind the MacArthur Museum of Arkansas Military History in MacArthur Park continues the band’s America250 celebration with a program of marches, patriotic songs, and pop tunes.
ENTERTAINMENT: Flag Day concert, ‘Anastasia’ musical on weekend ‘set list’
The Little Rock Winds’ 29th annual Flag Day concert, 7 p.m. Sunday on the old parade ground behind the MacArthur Museum of Arkansas Military History in MacArthur Park continues the band’s America250 celebration with a program of marches, patriotic songs, and pop tunes.
Dillard family’s ‘long game’ approach pays off in retail business
Little Rock-based Dillard's Inc., the operator of 272 department stores in 30 states, began in 1938 when founder William Thomas Dillard borrowed $8,000 from his father to open a small store in Nashville in Howard County.
Steven Chiu, Prominent California Healthcare Regulatory Attorney, Joins Crowell & Moring in California
Los Angeles – June 10, 2026: Steven Chiu, an experienced and versatile health care regulatory attorney with more than 16 years of experience advising leading health care clients, has joined Crowell &…
Diane LaFollette retires as CEO of Mid-America Science Museum
HOT SPRINGS -- After 13 years at the helm of Mid-America Science Museum, Diane LaFollette has announced her retirement.
Report: Arkansas softball shortstop Atalyia Rijo enters transfer portal
As a senior this year, Rijo recorded offensive career highs with a .342 batting average, 13 doubles, 7 home runs and 42 RBI
How Banks Are Using the SpaceX IPO to Woo the Super Rich
Wall Street is giving its richest clients velvet rope access to this week’s public listing of SpaceX, reflecting the growing importance of the wealth management business.
PodcastVideos.com Names Andrea Roten Business Development Executive
Rogers-based studio adds 20-year sales and partnership veteran to expand client roster
Low pay plagues Congo health workers
MONGBWALU, Congo -- The front line is wearing thin in Congo's battle with the world's latest Ebola virus outbreak, as low pay adds to the fatigue plaguing the nation's healthcare workers, says one medical authority.
3-star defensive end pledges to Arkansas
Defensive end Keith Richmond was won over by Arkansas after his official visit and pledged to the Razorbacks.
Arkansas football checks boxes for weekend visitors
Arkansas football continued to impress prospects on the second weekend of official visitors.
Times Opinion: US lead in science is shrinking fast as China, India and even Iran catch up
A country with one of the fastest-rising scientific profiles operates under sweeping international sanctions, has limited access to Western research infrastructure and is rarely mentioned in American conversations about global innovation. That country is Iran.
Ultrawealthy clients pay me $150,000 a year to manage their lifestyle
Roman & Erica charge their clients $150,000 to plan all aspects of their leisure and social lives and be available for requests 24/7.
Minor sports at University of Arkansas, other major colleges struggle to survive
FAYETTEVILLE -- The future of tennis and other minor sports at major universities depends on the kindness of people with deep pockets or the helping hand of the federal government.
'Probably the most visibility the city will receive through sports globally, maybe ever’: Notable quotes from a week of Chattanooga area news
People who had a way with words in the news last week:
ENTERTAINMENT: ‘Heights’ onstage in SoMa; ‘Onegin’ moves to Ozarks
TheatreSquared is putting “Eugene Onegin: A Bluegrass Musical,” a new adaptation of Alexander Pushkin’s drama by Obie Award-winner Sarah Gancher, onstage in its West Theatre, 7:30 p.m. Tuesday-Friday, 2 and 7:30 p.m. Saturday and 2 p.m. Sunday through June 28.
Get Moving: Family Health & Fitness Day Offers Outdoor Fun Across Sacramento County
Looking for a fun way to get active, spend time outdoors and make memories with your family? Sacramento County residents will have plenty of opportunities to do just that during Family Health & Fitness Day on Saturday, June 13.
ENTERTAINMENT: ‘Music’ at Wildwood; ‘Aftermaths’ exhibit opens at AMFA Saturday
"Aftermaths: Mat Collishaw," featuring the latest film from British painter, photographer, sculptor and filmmaker Mat Collishaw, opens Saturday in the Fine Arts Club New Media Gallery at the Arkansas Museum of Fine Arts.
Brennan seeks to 'correct matters' over 12-week ban
The solicitor of Dublin senior football manager Ger Brennan says his client has concerns "a consistent and equitable approach is unfortunately not being applied to every team, player and manager" following his well-documented ban and wishes to "correct certain matters now brought into the public domain".
May's top PlayStation games by copies sold
Yesterday’s State of Play gave us an idea of where PlayStation’s heading next. But we’ve had our May estimates for a couple of days now (we always update our data daily for clients), so it’s time to look at what performed best on PlayStation last month. We’ve got a new IP at the top, two evergreens doing their evergreen thing, FC26 smashing it ahead of the World Cup Plus pivot, and a quiet but promising result for Lego Batman. Let’s have a look at the state of Play…Station’s top games for May. 007 takes #001 007 First Light sold 1M copies on PS5 in May, easily making it the month’s top PS5 game by copies sold. Over 80% of those May copies were digital, which is broadly in line with where PlayStation’s digital share has settled for new releases this year. To date, 007 First Light has sold through 2.2M copies across platforms (so no unsold retail copies in that figure). The platform split is 55.1% PS5, 33.1% Steam, and 11.8% Xbox (console, Windows, and cloud combined). In gross revenue terms, 007 First Light has generated $150M. Owing to regional pricing and audience composition differences, the consoles make up a higher share of revenue than they do copies. Of the $150M, 60.5% came via PlayStation, 27.6% via Steam, and 12.9% via Xbox. Part of this is because over two-thirds of 007 First Light‘s PlayStation audience is in North America (43.4%) or Western Europe (23.2%), where local currency means the game generates more revenue per player. On Steam, under half of First Light‘s audience is from those same regions (31.8% North America, 15.1% Western Europe). As we covered in last week’s 007 Steam piece, the Steam version is pulling in higher-than-expected numbers in China, which now accounts for 17.3% of First Light‘s Steam audience. 007 is the equivalent of $44 USD in China, which is roughly 37% cheaper than the US price and about 44% cheaper than Western Europe. Subscribe for free to get the most accurate games estimates in your inbox twice a week 🫶 Subscribe The crossover data backs up what we’ve seen all year about launch-window cohorts. 11% of PS5 players who played 007 First Light in May also played Lego Batman: Legacy of the Dark Knight, which launched just a few days before. Last month was a great month for Denmark! IO Interactive is Copenhagen-based, and Lego Group is headquartered in Billund (TT Games is UK-based but produces work under Lego Group licence and direction). Speaking of which… A very blocky #2 and #3 Minecraft sold another 788K copies on PlayStation consoles last month. Business as usual, since Minecraft hasn’t sold fewer than 760K copies in a single month all year. With over 350M copies sold across all platforms, Minecraft is the best-selling game in history and one of the strongest brands in the world. Every month, a new cohort of children reaches Minecraft age, which guarantees a constant volume of new sales regardless of what the broader market is up to. The demographic refresh rate is truly impressive, with the audience renewing itself faster than it’s churning. Lego Batman: Legacy of the Dark Knight shifted 757K copies on PS5 last month, bringing its lifetime total on the platform to over 800K. Across all platforms, Legacy of the Dark Knight has now passed 1.5M sold through, so PlayStation accounts for over half of the game’s players. The May crossover data for Legacy of the Dark Knight on PS5 is also useful. 27% of those players also played Fortnite, 16% Roblox, 16% FC 26, and 14% NBA 2K. That’s the household-and-family cohort showing up, plus the launch-window cohort of core gamers who buy practically everything. FC 26 gets players through the door ahead of the World Cup FC 26 sold 411K copies on PlayStation last month (90% via PS5), the fewest copies FC 26 has sold all year and down heavily from April’s 700K. Part of this dropoff is because FC 26 has been available as a PlayStation Plus monthly game since 6 May, cannibalising premium sales. Subscribe for free to get the most accurate games estimates in your inbox twice a week 🫶 Subscribe The strategic logic is straightforward for EA, which is sacrificing premium unit sales in May to build up the player base ahead of the FIFA World Cup, which kicks off on 11 June. Obviously, a bigger player pool going into the tournament means a bigger pool of potential Ultimate Team spenders during the period when football attention is at its peak. The early returns are around what you’d expect, with 4.4M new players accessing FC 26 via PS Plus last month – a substantial new spender pool. Anecdotally, a few of my mates who were ‘’skipping FIFA and Ultimate Team this year’’, were drawn back in via PS Plus. Lo and behold, one of them is buying packs like it’s going out of fashion. Whether this is all a smart trade for EA depends entirely on the Ultimate Team conversion rate over the next six weeks. Either way, the short-term engagement impact on the game as a whole is evident. FC 26‘s MAUs hit a record 24M on PlayStation in May, up 30% from the previous record set in April. GTA V does what GTA V always does Rounding out the top five is another evergreen title. Grand Theft Auto V shifted another 387K copies on PlayStation last month. No matter what else is happening in the industry, GTA V keeps pulling players in. It’s sold another 1.8M copies on PS5 in the first half of this year alone, helping the franchise pass the 230M-sold milestone across all platforms. Subscribe for free to get the most accurate games estimates in your inbox twice a week 🫶 Subscribe I have a theory that Minecraft and GTA V are doing the same thing at different demographic levels. Both are functioning as generational gateway games that the audience ages into faster than it ages out of. Minecraft captures kids around age 6-10, GTA V captures much of the same audience around age 12-15 (unofficially, of course). The crossover data suggests this: 40% of GTA V‘s monthly PlayStation players typically play Fortnite in any given month, while 30% play Roblox. Household accounts aside, that’s not the original GTA V audience from 2013. Of course, the under-12 audience would love to get their hands on GTA, too. It’s always been the way of things, and some parents are happy to oblige. Mine did too back in the day, and I turned out just fine. Right? Right!? Want to get your hands on our data for yourself – for free? We’re offering a free trial of our platform for games companies. Send us a message here, or reply to this email, and we’ll set you up. The last word Reply to this email – or reach out here – if you have any feedback for the newsletter – or want to request a game for us to cover. [Alinea Analytics boasts the most accurate PC and console estimates in the business. Game makers use our platform to understand their audience, keep an eye on the competition, monitor sales trends, and spot new opportunities. We equip game studios and financial institutions with accurate data and the confidence to make smarter, data-driven decisions. Want to talk about all things games market data? We’d love to chat!]
B2B marketer makes comedy skits for LinkedIn to acquire clients
Henry Hayes is gaining traction and new client leads by posting comedy skits on LinkedIn, like a recent "Grand Theft Auto" spoof.
COMMENTARY: Politics and failure
Politics is the only profession of which I am aware in which competence doesn't seem to matter. One can fail miserably; one can be corrupt and one can get away with crimes that if committed by someone outside of elective office, arrest, prosecution and a stint in jail would be the result. Yet politicians, Democrats and Republicans, continue to get re-elected.
OPINION: Civility where art thou in today’s politics?
I've been asked of late if we as United States citizens, and even here at home in Arkansas, have seen a vast and downward decline in civility.
Deloitte's CMO shares tips for creating successful sports sponsorships
Deloitte's Scott Mager shared his thoughts on evolving CMO roles, AI, sports sponsorships, and tech to enhance branding and client engagement.
Ballard Partners taps California AI czar to head new emerging tech practice
'Amy ... will offer unique insights that will be instrumental in delivering the exceptional results our clients expect in this rapidly evolving landscape.'
Senior Spotlight: Glacier High School student looks to use science to help others
Knowing she wanted to help others, there was a time when Anitha Ravipati considered pursuing a career as a medical doctor. But applying her science acumen during an internship last summer opened the possibility of assisting through research.
Center stage: Chattanooga entertainment options are major economic driver
From large events to small, elegant to offbeat, entertainment in Chattanooga is a major economic driver.
Playbook 2026: How Chattanooga’s business leaders are preparing for what comes next
Chattanooga is changing -- much of it happening right in front of us, while other parts are harder to see.
Arkansas makes headway with numerous football visitors
Arkansas looks to be in good shape with several prospects who officially visited Fayetteville this weekend.
Business People
Dr. Jacquelyn Paykel has been named assistant dean of whole health education at the Alice L. Walton School of Medicine.
Arkansas baseball pitcher Hunter Dietz due up vs. Kansas
Dietz will pitch in a game for the first time since he took a 105 mph line drive off his right shin during a start against Texas.
Microsoft and NVIDIA Jointly Tease Possible N1X Debut as a "New Era of PC"
Microsoft and NVIDIA, through their X handles, each teased "A new era of PC," along with the map coordinates "25.0528, 121.5990," which correspond to the Nangang Exhibition Centre, the seat of Computex 2026. If it wasn't obvious already, NVIDIA is announcing its much awaited N1X client PC processor,...
Fireweed pitch: Unwinnable Democrats should back GOP, independents
If Democrats cannot win the 1st U.S. Congressional District race in Montana, the party is better positioned backing select moderate Republicans or independent candidates who can advance at least some of the agenda. That’s what Fireweed Campaigns, a self-described politically independent Helena-based firm with only Republican clients pitched to a room of approximately a dozen ‘Democrat-adjacent’ strategists mixed with representatives during a quiet strategy meeting in Anaconda in the summer of 2025.
Camp Mystic chief health officer barred from direct patient care by Texas nursing board
The restrictions on Mary Liz Eastland's license forbid her from working directly with patients, including "teaching, counseling, assessing the client's needs and strengths, and providing skilled nursing care," according to the order.
Trump’s latest immigration move clouds the path to green cards
When President Donald Trump's administration announced last week that it would require green card seekers to apply from their home countries instead of in the U.S., immigration attorney Flavia Santos Lloyd’s phone began ringing off the hook with clients worried about the implications for them.
Arkansas basketball notebook: John Calipari supportive of measures in new Protect College Sports Act
Speaking to reporters at the SEC's spring meetings in Miramar Beach, Florida, Arkansas men’s basketball coach John Calipari touched on a variety of topics.
Arkansas football loses '27 commitment
Tight end George VanSandt, who committed to Arkansas in April, has reopened his recruitment.
La Union uses Business Community Ownership Fund to build community with their commercial space
As interior designers, Sonia-Lynn Abenojar and Sergio Max Legon-Talmoni know what it takes to turn an idea into a reality. “Our role as designers is taking the big idea from the client, any inspiration they have from aesthetics to function, and putting them into drawing form so the City can review and approve it. Then […]
Capgemini says AI widens client spending pool
Capgemini on Thursday said artificial intelligence was opening access to client spending beyond traditional information technology budgets, as the French technology services group sought to ease investor concerns that the technology could disrupt its business model.
Continental Strategy adds Florida government pro Brandi Gunder as newest partner
'She will offer clients unique insights because she wasn't just an observer of government, she was a part of getting things done.'
Former Razorback star receiver Anthony Lucas to speak at Hawgs Illustrated Sports Club luncheon
Former Arkansas star wide receiver and new Fayetteville Bulldogs head coach Anthony Lucas will be the guest speaker at the June 3 Hawgs Illustrated Sports Club luncheon.
Entertainment group builds India tech hub team with Aeries Technology
PE-backed entertainment client taps Aeries to support ERP, BI and analytics from India, as Aeries reports momentum and visibility into fiscal 2027.
Sporticast: What’s Up With the French Open Fashion Friction?
On the 555th Sporticast episode, hosts Scott Soshnick and Eben Novy-Williams discuss some of the biggest sports business stories of the week, including some simmering tension between tennis’ biggest tournaments and fashion brands like Gucci and Louis Vuitton. Tennis players have long been attractive endorsers for luxury brands—the sport’s clientele, locations and vibes all align—and …
Wealth Adviser Shuffle Hits Los Angeles - Los Angeles Business Journal
In Los Angeles and across the country, wealth advisers are packing up their millions or billions of client assets and heading for the door. Adviser
Selection surprise: Arkansas baseball not hosting NCAA regional
The Razorbacks will be sent on the road for the NCAA regional round after Fayetteville was not one of the 16 host sites announced Sunday.
Arkansas softball honors past while celebrating first WCWS berth
The Razorbacks have a daily reminder inside their lockers to let them know they stand on the shoulders of those who came first.
Home 'sick' home? Here’s how to keep your house healthy
Michael Reed entered first, turning on the lights to make it feel like home before the clients arrived. He flipped switches as he walked through the formal...
Flathead Business Watercooler
Happenings related to business in the Flathead Valley
Commentary: Take a bow, Courtney Deifel
Deifel is the first to deflect praise for the Arkansas softball program’s ascent, but everyone around the program knows who built this.
ENTERTAINMENT: Touring show flips script on love story; inaugural Juneteenth summit at Robinson Center
The musical flips the script on Shakespeare’s most famous love story, asking what would happen if Juliet doesn’t end it all over Romeo.
ENTERTAINMENT: Touring show flips script on love story; inaugural Juneteenth summit at Robinson Center
The musical flips the script on Shakespeare’s most famous love story, asking what would happen if Juliet doesn’t end it all over Romeo.
Better Business Bureau: Protect yourself from deepfake scams
Artificial intelligence is changing the way businesses and consumers interact every day.
Commentary: Arkansas women's spring sports are in a golden era
Golf's Shauna Taylor and softball's Courtney Deifel are putting together stellar, perhaps statue-worthy careers.
SBIR and STTR Contracts: Not for Just Any Small Business
On April 13, 2026, President Trump signed into law the Small Business Innovation and Economic Security Act, reauthorizing the Small Business Innovation Research (SBIR) and Small Business Technology…
Chase Travel plays a starring role when entertainment clients seek VIP treatment
Chase Travel Entertainment Solutions specializes in high-stakes, customized and discreet travel arrangements for A-list celebrities and entertainment clients, leveraging its scale and focus for growth in the entertainment sector.
How America’s Leading Retail Banks Work to Understand their Small Business Clients and Build Frameworks to Support them Best
The Consumer Bankers Association (CBA) is excited to celebrate Small Business Month 2026 with a new series of blogs highlighting the many ways in which America’s leading retail banks are working to support small businesses on Main Streets across the country. This blog showcases how three CBA members – TD…
Trump orders banks to take closer look at clients' citizenship
The order instructs bank regulators and government departments to identify signs of people without legal status opening accounts or obtaining loans
Trump orders banks to take closer look at clients' citizenship
The order instructs bank regulators and government departments to identify signs of people without legal status opening accounts or obtaining loans
Excel Sports and WIN Artists Team Up on Sports Entertainment Deals
Excel Sports Management is teaming with the ex-WME mogul's WIN Artists to give clients more opportunities in media — even as both firms are also circling Casey Wasserman's The Team.
Excel Sports and WIN Artists Team Up on Sports Entertainment Deals
Excel Sports Management is teaming with the ex-WME mogul's WIN Artists to give clients more opportunities in media — even as both firms are also circling Casey Wasserman's The Team.
Genius Sports Revenue Surged 31% Last Quarter. So Why Did This Investor Bail?
Genius Sports delivers real-time data and digital solutions to sports leagues, sportsbooks, and media clients worldwide.
Goldman Sachs, Moelis Say Business as Usual Amid Iran Conflict
Goldman Sachs Group Inc.’s international co-heads say the turbulent start to the year has done little to deter clients, underscoring Wall Street’s bullish outlook despite events like the Iran war.
Greenberg Traurig's Entertainment & Media Practice Congratulates Clients Recognized with Academy of Country Music Awards
/PRNewswire/ -- Greenberg Traurig, LLP's Entertainment & Media Practice congratulates its clients for their achievements at the 61st Academy of Country Music...