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'Many national leagues have become boring', Germany's Bierhoff says
Domestic football leagues have lost their appeal because they are dominated by the same teams like Bayern Munich or Paris Saint-Germain, former German Football Federation (DFB) director Oliver Bierhoff has said. "The Champions League is an outstanding competition, but many national leagues have become boring, to put it simply," Bierhoff told the German edition of Sports Illustrated magazine.
The Houston Rockets Defeat the Dallas Mavericks in Opening Game
The Houston Rockets dominated in their season opener, defeating the Dallas Mavericks 128 to 110.
Michigan awards 12 drone projects state funding
The state of Michigan handed out another $1.7 million to drone startups statewide — and Detroit-based companies dominated the list.
Duke Dominates First Half against #8 Tennessee
Duke at half is currently up 54-30 against #8 Tennessee. They dominated the first half from start to finish, including a 15-0 run after it was tied 2-2. The Blue Devils have looked like the much better team. Tennessee attempted a run late in the half but couldn’t get closer than 20 points. If the […] The post Duke Dominates First Half against #8 Tennessee appeared first on HEAVY.
Sanae Takaichi took on Japan’s male-dominated politics and won – can she survive a second year in power?
The straight-talking PM’s ability to manage Trump and stand up to China have endeared her to the public, but she may need friends closer to home to survive
So What Is Socialism, Anyway?
In a world dominated by neoliberal market fundamentalism, “socialism” is what will make a more moderate, regulated form of capitalism work for most people.
Trump dominated rural America. Iowa is testing whether Democrats can win them back
Dave Roethler is a former Donald Trump supporter in Iowa who feels disillusioned about the economy and believes middle-class families are suffering while the president benefits.
Trump dominated rural America. Iowa is testing whether Democrats can win them back
Dave Roethler is a former Donald Trump supporter in Iowa who feels disillusioned about the economy and believes middle-class families are suffering while the president benefits.
Trump dominated rural America. Iowa is testing whether Democrats can win them back
Dave Roethler is a former Donald Trump supporter in Iowa who feels disillusioned about the economy and believes middle-class families are suffering while the president benefits.
Trump dominated rural America. Iowa is testing whether Democrats can win them back
Dave Roethler is a former Donald Trump supporter in Iowa who feels disillusioned about the economy and believes middle-class families are suffering while the president benefits.
Penguins dominated by Golden Knights for sixth loss in seven games
LAS VEGAS — Pittsburgh Penguins fans who didn’t stay up for Saturday’s late-night matchup with the Vegas Golden Knights did themselves a favor. The pitiful performance was hardly worth losing
Steve Hilton bets California is ready for something different in the governor's office
Steve Hilton is taking his campaign for governor across California, arguing for change in a state long dominated by Democrats.
AI data centers are coming for federal land and roiling Nevada governor's race
The data center issue has dominated the competitive governor’s race in Nevada, where 80% of the land is owned by the federal government.
Who Will Break Nets’ 40-Year 1,000 Rebound Season Drought?
Not since Buck Williams dominated the glass has a Brooklyn Net reached four digits. Now, Day’Ron Sharpe faces the uphill battle of ending a four-decade rebounding drought.
Beyond November: Business faces a more interventionist Washington post-midterms
In a Trump-dominated Washington, Congress ceded much of its power and relevance.
Politics Unplugged (Full Episode) Oct. 11, 2026
On "Politics Unplugged," political editor Dennis Welch sits down with Republican gubernatorial candidate Andy Biggs for a wide-ranging interview weeks before election day. The conversation is dominated by Governor Katie Hobbs' multi-million-dollar ad campaign accusing Biggs of protecting Warren Jeffs' FLDS cult while he was Arizona Senate President. Biggs forcefully denies the allegations, defending his legislative record and accusing the interviewer of carrying Hobbs' water. He escalates further, claiming Hobbs' rhetoric has led to death threats and that she would be "thrilled" if he were physically harmed. The interview also covers his vote against honoring Capitol Police on January 6th, his call to Rusty Bowers about decertifying the 2020 election, and whether he'd certify results as governor in 2028. Hobbs' office responds with a statement denying the claims. The show closes with a teaser for a Hobbs interview the following week.
Warm-Up Science Mapped: Nearly 1,000 Studies Reveal Where the Evidence Ends
A scoping review of 964 studies finds warm-up research dominated by short-term jump and sprint proxies, while injury endpoints, competition outcomes and real-world implementation remain strikingly underexplored.
BYU Beats Iowa State, Sets up Notre Dame Matchup
BYU dominated the stat sheet, but some miscues kept BYU from really controlling the game in a 24-10 home win over Iowa State Friday night in Provo. In a night where BYU needed their QB to carry them, Bear Bachmeier dominated with 329 passing yards, 2 passing TDs, and 109 rushing yards on 9 carries. […]
Dodgers tap NLCS rotation order to replicate dominance over Brewers
Dodgers pitching dominated the Brewers in last year's NLCS. They are hoping Tarik Skubal and Yoshinobu Yamamoto can set a similar tone in this year's rematch
Four Tigers Rookies Break Into MLB’s Top 50
Led by Kevin McGonigle’s top-ranked campaign, Detroit’s rising stars dominated the 2026 rankings, signaling a powerful youth movement and a bright future for the rebuilding franchise’s core.
Inside Broward County’s battle for health care real estate
Broward County’s health care giants are racing to snap up real estate, competing for space amid rapid population growth and development. The county’s health care map, long dominated by a neatly defined duopoly between taxpayer funded hospital districts Broward Health and Memorial Healthcare System, is changing as an outpatient construction boom floods the market with new facilities and health care systems look beyond traditional medical real estate to expand their portfolios. But with prime development sites growing scarce, the county has emerged as a medical development battleground, with systems jockeying for land, market share and the opportunity to redraw the […]
5 Key Moments From Hostile Michigan Senate Debate Between El-Sayed and Rogers
Slashing personal attacks dominated the first televised face-off between Dr. Abdul El-Sayed, the Democratic nominee for Senate, and former Representative Mike Rogers, his Republican rival.
Thunder Rookie Aday Mara Passed His First Real Test
The 7-foot-3 Spaniard dominated the paint against Pelicans starters, flashing elite versatility and rim protection that suggests the Thunder have unearthed another high-impact piece for their frontcourt.
Luke Fickell's 'vision' starting to show, Joe Thomas says
After the Wisconsin Badgers dominated Michigan State on Saturday, Hall of Famer Joe Thomas broke down the team's progress.
Kalen DeBoer Has Bold Comments After Alabama Dominates Mississippi State
Alabama head coach Kalen DeBoer had some strong comments after his team dominated Mississippi State.
Notre Dame dominated the trenches to take down UNC
The Heels hung around with one of the best teams in the country, but ultimately the Irish came away with the W.
HIGHLIGHTS: Somerset Academy (NV) vs. Midland Lee
MIDLAND, Texas (KMID/KPEJ) – Midland Lee dominated Somerset Academy from Nevada 61-6 as the Rebels improved to 4-2. Next week the Rebels kick off district play at home against Permian. Watch the video above for the highlights.
Texas A&M Looks To Extend Arkansas Dominance At Kyle Field
Texas A&M returns home trying to stop a two-game skid and beat Arkansas for a fifth straight time in a rivalry the Aggies have dominated since 2012.
Israeli Politicians Trade Barbs Over FlyDubai Attack
Prime Minister Benjamin Netanyahu’s campaign for a coming election was already dominated by discussion of the policy, military and intelligence failures leading up to the Hamas-led attacks on Oct. 7, 2023.
Maine Democrat who rejects special interests previously ran PAC that courted them
Troy Jackson is challenging Republican Sen. Susan Collins in a pivotal contest that has been dominated by campaign finance issues.
ChatGPT ads are dominated by business software companies so far
ChatGPT ads skew heavily toward business software, and there are bright points for the business, according to a new report from the agency Graphite.
No. 1 Texas outlasts No. 14 Tennessee 20-17 in Knoxville with Trump watching
Texas dominated defensively with 10 sacks, led by Colin Simmons.
Corn Nation Overreaction: Huskers Dominate Spartans, Remain Undefeated
Nebraska moved to 4-0 with a convincing 31-13 road victory over Michigan State, and Greg and Jake broke down an “ugly win” that still showed how far the Huskers have come. Nebraska didn’t play its best football, particularly in the running game, but the defense dominated with six sacks, multiple takeaways, excellent tackling, and impressive […]
Misiorowski Guides Brewers to 103rd Win in Regular Season Finale
Cy Young favorite Jacob Misiorowski dominated St. Louis, securing Milwaukee’s 103rd victory and a first-round postseason bye as Brice Turang eclipsed the 100-RBI milestone in the finale.
Film Review: Miami Hurricanes 52
The Miami Hurricanes dominated the CMU Chips 52-3 at Hard Rock as a tune-up before Clemson in Death Valley.
Seminoles WR Boggs Has Breakout Game vs. Central Arkansas
Sophomore Jayvan Boggs dominated Central Arkansas, racking up 122 yards and a long touchdown to solidify his role as a premier playmaker in the Seminoles' crowded offense.
Intel Panther Lake Teardown, 18A, BSPD, GAAFET, SemiAnalysis STEEL
Panther Lake debuts the first commercial implementation of backside power delivery (BSPDN), introduces Intel’s first iteration of gate-all-around (GAA) transistors, and showcases their advanced packaging capabilities with its Foveros-S assembly. With Panther Lake, Intel’s manufacturing arc has shifted from nebulous roadmaps to shipped silicon, a significant milestone on their long road back to competitive semiconductor manufacturing. To evaluate the extent of Intel’s comeback, we tore down Panther Lake. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Our teardown traces 18A from its four-sheet RibbonFETs (Intel’s marketing name for GAAFETs) and gate stacks through contacts, frontside and backside wiring, and the bonded carrier. We explain how these material and integration choices improve gate control and reduce resistance, while adding capacitance, thermal resistance, and process complexity. Our measurements put Panther Lake’s 18A compute logic and TSMC N3E GPU logic at similar logic density. However, 18A does not lead TSMC N3P, N2 or Samsung SF2 in peak density. Panther Lake’s CPU cores are incremental updates, and the high-end GPU still uses TSMC N3E. Panther Lake assembles one compute tile, one GPU tile, and one I/O tile atop a passive base tile using Intel’s Foveros-S advanced packaging. Both compute tile variants use Intel 18A. The Xe3 GPU options are a 4-core GT1 tile on Intel 3 and a larger 12-core GT2 tile on TSMC N3E. Both I/O tile variants use TSMC N6. [1], [2] Our analysis centers on the PTL-U compute tile, both the 4-core and 12-core GPU tiles, as well as the 12-lane I/O tile. In conventional chips, power and signal are routed through the same frontside metal stack towards the device frontend. Power rails consume scarce routing resources near the transistors, while tall via stacks carry VDD and VSS from the coarse upper wires to local rails. Backside power delivery (BSPD) moves the main power network behind the transistor layer, to the backside, separating it from frontside signal routing. We covered BSPD and its impacts in 2024. [3], [4], [5] Intel’s BSPD implementation, branded as “PowerVia”, routes power through dedicated backside metals to nano-TSVs, which connect those rails to local source/drain (S/D) contacts. Implementing that separation requires Intel to build the interconnect stacks from both sides of the wafer. The frontside comprises the M0-M14 signal stack, while the backside comprises the BM0-BM5 power stack. M0 and BM0 are closest to the transistors. The nano-TSVs connect the two sides, but Intel patterns and etches each via from the front after forming the contacts. A narrow via runs from the side of the contact deep into the silicon substrate. Intel then completes the frontside signal metal stack, bonds the wafer to a carrier, flips it and removes the original substrate until the buried via tips are exposed. The backside metal stack is then deposited directly on the revealed vias. The nano-TSV and backside-via profiles taper in opposite directions because Intel forms them from opposite sides of the wafer. The transistor structures form the FEOL. Local contacts and nano-TSVs connect them to the wiring. M0 begins the frontside interconnect stack. The silicon carrier remains attached above the frontside interconnects. It supports the device wafer during substrate removal and backside processing and remains part of the finished chip’s thermal path. PowerVia removes the main power distribution from the congested frontside metals, routing supply through shorter and wider backside wires. Its lateral landing still occupies area in the standard cell, so it recovers less cell area than a direct backside contact. [3] Nano-TSVs beside the logic devices carry VDD or VSS from the backside power network, while signal connections continue upward through the frontside metals. Backside Interconnects Samsung SF2 data is included for comparison to Panther Lake’s within this article. SF2 is the incumbent GAA foundry node but lacks BSPD, serving as a useful reference to evaluate 18A. A full teardown of Samsung’s S26 products, processed on SF2, will be shared soon.Nanosheet-cut EDS comparison. The PowerVia supply path runs from the backside Cu rails through Mo-lined W nano-TSVs to the local transistor contacts. In this cross section, the tapered connection spans roughly 150 nm from the contact level to BM0. The Ta liner confines Cu and promotes adhesion to the surrounding stack; the AlOₓ etch stop controls the next dielectric etch above the rail. Dielectric beneath the ribbons electrically separates the devices from the backside wiring and removes the conducting silicon body below the channel. [6] AlOₓ serves as an etchstop (ES), enabling endpointing and protecting the underlying layers. Low-volatility aluminum fluoride reaction products resist the fluorinated plasma, allowing a thin AlOₓ film to protect the metal while the surrounding low-k dielectric is removed. [6], [7]. While the BM0 and layers above the M1 lines show double AlOx layers, Our SMIC N+3 teardown showed single AlOₓ layers. SMIC uses a simpler local AlOₓ substack, while the remaining cap and etch sequence provide the required landing protection. So why double layers? The closely spaced AlOₓ doublets provide two protected endpoints in the etch sequence. Intel documents an AlOₓ/SiN/AlOₓ stack that explains the benefit. The main dielectric plasma etch stops on the first AlOₓ film; a selective wet clear opens that film; a second plasma etch removes the intermediate SiN and stops on the second AlOₓ film. The final wet clear exposes the metal landing surface. SiN is the intermediate dielectric in Intel’s published example. [8] The second stop protects the metal through a cap breakthrough. Wide openings can etch faster than narrow ones, and etch depth varies across the wafer. Metal under an early-clearing opening would otherwise be exposed while other openings still need more etching. Staged protection widens the process window and reduces metal erosion, corrosion and void formation. [8] TSMC documents AlN/AlOₓ/SiOC/AlOₓ above Cu, with AlN blocking Cu diffusion, and a simpler AlN/SiOC/AlOₓ variant that omits one AlOx film. [9] Levels with different opening sizes, aspect ratios, pattern densities and cap materials need different etch margins. A double AlOx stop is useful where another protected endpoint justifies the added processing. The extra film adds formation, selective opening and cleaning steps, plus another set of interfaces to control adhesion, moisture, and stress. These blanket films are opened through the existing via pattern, so each film does not require another lithography mask. AlOₓ adds parasitic capacitance when it replaces lower-k dielectric; two thin AlOₓ films can nevertheless contain less AlOₓ than one thick film. Total thickness, placement, and theintermediate dielectric determine the electrical cost. Deposition chemistry also changes AlOx permittivity and residual hydroxyl content, which can oxidize the underlying metal. [7], [8], [10], [11] The backside stack separates into relatively fine BM0-BM2 wiring near the devices and coarser BM3-BM5 power distribution. The largest pitch increase occurs between BM2 and BM3. BM0’s pitch closely matches the logic-row height, fitting local power delivery to the cell rows. Higher levels aggregate current through larger conductors: routing density becomes less important than low resistance and current capacity as the network approaches the package. This hierarchy provides wide power wiring for the power delivery network without consuming scarce frontside signal-routing resources. [3] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Frontside Interconnects Intel 18A combines Mo-lined W contacts and nano-TSVs with a separate backside Cu power network. Samsung SF2 keeps power on the frontside, using Ti-based contact interfaces and Ta-based barriers and Co liners around Cu wiring. In 18A standard-cell rows, backside power rails supply the devices through nano-TSVs within the cells, freeing frontside routing resources. Samsung’s M0 accommodates both power and signal connections. From the device toward M0, the connection runs through a Ti-based S/D interface, W contact fill, a Mo-lined W via, and the Cu M0 wire. Mo supplies a conductive nucleation and adhesion layer for W, replacing the resistive TiN liner used in conventional W integration. This increases the effective conduction volume within the feature while retaining W fill and its established polishing, cleaning and etching processes. Intel’s Mo/W patent describes this integration tradeoff. The nano-TSV uses the same Mo-lined W construction in the backside supply path. [12] The move from TiN to Mo is an incremental change. While a full Co or Mo fill can also reduce the volume lost to liners in very small features, it requires new integration schemes that increase complexity and risk. Cu remains attractive for wider wires due to its low resistance. As wires and vias shrink, the diffusion barrier consumes an increasing fraction of their cross-section. [12], [12], [14] Intel uses Co/Ru liners at M0-M1, Co at M2-M4, and Nb at M5-M9. The lower-level liners help Cu adhere and reduce void formation during trench fills. Applied Materials’ Endura has new thermal control that facilitate wetting process, so the thin film continuity is good enough that good capillary pressure will drive Cu atoms to the via bottom without voiding. Intel’s choice to use Nb is particularly interesting. Intel’s Nb patent describes a conductive diffusion barrier intended to reduce the barrier’s contribution to resistance relative to conventional Ta-based barriers, particularly at via bottoms where all current crosses the barrier. The patent pairs Nb in coarser levels with the option of lower-cost PVD processing. [15], [16] The upper metal layers support thicker barriers formed through physical vapor deposition (PVD) despite its worse coverage and uniformity. Meanwhile, the lower metal layers require thinner barriers deposited through conformal atomic layer deposition (ALD). Co/Ru adds another material interface and requires controlled deposition and Cu fill. Changing liners and barriers by metal layer allows Intel to optimize interconnect resistance, process complexity, and reliability. [15, 16] RibbonFET, Intel’s name for its gate-all-around FETs (GAAFETs), replaces the FinFET’s vertical fins with four stacked horizontal silicon nanosheets, allowing the gate to surround the channel on every side. The path to GAAFET begins with the planar transistor. A planar MOSFET places the gate above the channel between its source and drain. Pairing an NMOS with a PMOS transistor creates a CMOS inverter, in which the NMOS pulls the output low for a high input, and the PMOS pulls it high for a low input. The gate must retain electrostatic control of the channel to ensure clean switching. As gate lengths shrank, the drain began to compete with the gate for that control, increasing off-state leakage. Electrostatic control was restored through an architectural evolution that raised the channel into a vertical fin and wrapping the gate around three sides. Called “FinFET”, this new architecture packed more effective channel width into a smaller footprint. Further scaling made it harder to maintain both drive current and leakage within smaller cells, and reintroduced the same problems planar MOSFETs faced. Nanosheet GAAFETs close the fourth side by replacing the vertical fin with a stack of horizontal nanosheets, each surrounded by the gate. The tighter electrostatic control suppresses leakage at shorter gate lengths while stacking adds effective channel width within the cell footprint. In a FinFET process, channel width changes in discrete steps as designers must add or remove whole fins. Nanosheet width can instead be adjusted continuously within the process’s design rules. Wider sheets increase drive current, while narrower sheets reduce capacitance at the cost of drive current. Intel 18A uses stacks of four nanosheets each and varies their widths across logic and SRAM. At the process level, adding more sheets to each stack increases effective channel width and drive current, but complicates fabrication. RibbonFET vs MBCFET Samsung began GAAFET production in 2022 with SF3E, following with SF3 and now SF2. Its ‘MBCFET’ provides a useful structural comparison with Intel’s first RibbonFET implementation. [17] STEEL is digging deeper into SF2, used in the Exynos 2600, and TSMC’s GAAFET N2, used in Apple’s A20 Pro, in upcoming newsletter articles. We’re throwing some teasers on X. Let’s compare Samsung SF2’s MBCFET with Intel 18A’s RibbonFET. Subscribe Even to the untrained eye, Intel’s extra nanosheet is obvious. Intel stacks four ribbons to Samsung’s three. Samsung’s sheets are much wider in these fields, so both sheet count and width matter to the available channel perimeter. Sheet width also changes which silicon surfaces carry current. On conventional (001) silicon, wide nanosheets emphasize the broad top and bottom surfaces, favoring electron transport; the larger sidewall contribution in a narrow sheet favors hole transport. Thinner sheets improve gate control but increase confinement and scattering. This makes width and thickness part of the NMOS/PMOS balance, alongside strain and threshold voltage. [18], [19] GAAFET designs like 18A use different work-function-metal (WFM) stacks for NMOS and PMOS. Around each ribbon, a thin SiOx interfacial layer separates the silicon channel from the HfOx high-k dielectric, with La providing dipole tuning and the WFM wrapping the dielectric. NMOS uses a TiAl-based stack, while PMOS uses TiN WFM. W fills the remaining gate trench, providing a lower-resistivity path where the work-function layers are no longer needed. In this field, the PMOS stacks leave room for W between ribbons, while the NMOS stacks occupy more of those gaps. A silicon-based dielectric marks the P/N boundary, allowing the PMOS and NMOS gates, sharing the same gate trench, to be processed sequentially. Fast logic paths, retention circuits, and SRAM need a family of threshold options. Changing threshold without substantially changing device dimensions, capacitance or fabrication complexity is valuable. FinFET processes typically use different work-function-metal stacks. In a four-ribbon GAA stack, the narrow sheet-to-sheet gap limits how much WFM can fit around each channel. La in the gate dielectric creates interfacial dipoles at the SiOx/HfOx boundary, shifting effective work function and tuning threshold voltage. This gives Intel another control alongside its NMOS and PMOS WFM stacks. Low-threshold devices improve critical-path drive; higher thresholds reduce leakage elsewhere. Dipole tuning is especially useful in GAA because it changes threshold without consuming the narrow intersheet gap with thicker WFM. Precise control of La incorporation, diffusion and interface quality has long been a challenge, limiting viability in high volume production but is now seen from every leading-edge foundry. Intel’s patent describes depositing a dipole-forming oxide above HfOx and annealing it toward the interfacial oxide before completing the work-function and fill metals. This separates threshold tuning from the space available for metal. Newer research addresses the thermal cost: imec’s 2026 dipole-middle research inserts the shifter between two HfOx depositions, shortening the diffusion path while protecting SiOx during patterning. [20], [21]Matched-cut EDS, Intel 18A (left) vs. Samsung SF2 (right). Intel retains raised source/drain epi beneath its contacts, while Samsung recesses W deep into the epi to form a V-shaped Ti-lined interface. The deeper contact increases metal-to-semiconductor area and shortens the current path from the lower sheets, reducing contact and spreading resistance. It also removes epi volume and brings the contact etch closer to the channel ends. Retaining more epi preserves the material available for strain transfer, especially from SiGe into PMOS. These geometries balance contact access against stress engineering and etch margin. [22], [23] Samsung stacks three sheets to Intel’s four ribbons, and both processes use sheet width to tune drive strength. In our Samsung cross-sections, widths range roughly from 19 to 30 nm in the NPU rows and 37 to 50 nm in the CU cell. The Samsung nanosheets taper, with the widest sheet at the bottom and the narrowest at the top. Both processes use HfOx gate dielectric and Ti-based work-function stacks, with Al in the NMOS stack. In the Samsung devices shown here, the dielectric and WFM occupy the intersheet gaps, leaving W above the top sheet. Intel’s PMOS stack leaves more room between ribbons, and W fills those gaps while the thicker NMOS stack leaves W mainly in the upper trench. Gate-stack EDS maps. The W between Intel’s PMOS ribbons provides a conductive path close to the lower gates. Where WFM fills the entire gap, the gate still surrounds the channel, but voltage reaches it through the more resistive work-function films. Thinner WFM and dipole tuning preserve room for low-resistivity fill; Mo and Ru are alternative fill metals being developed for further scaling. [24] A masked, sequential WFM flow explains the different gate heights and inter-nanosheet fill. The proposed sequence below shows how separate NMOS and PMOS work-function steps produce that geometry. Enabled by the BSPDN process, Intel replaces the dense-logic silicon subfin with dielectric, removing the parasitic conduction path below the ribbons and reducing substrate-related capacitance. A retained silicon body as in classical, non-SOI, planar and FinFET designs needs junction and punchthrough-stop engineering to suppress leakage. Dielectric isolation makes that leakage less sensitive to the subfin doping profile but adds removal and fill steps. It also weakens the direct thermal path through silicon, making the contacts, metal stacks and package more important for heat extraction. [24], [26] Fluorine is concentrated around selected Intel device structures in the maps. WF6 is a standard precursor for W nucleation and fill, while barrier films protect adjacent dielectrics from fluorine attack. Low-fluorine W processes reduce the residual-F burden. Chloride-based precursors avoid introducing F during W deposition, but require control of chlorine attack, nucleation and fill quality. The integration target is a continuous, low-resistance W path with a thin protective liner and minimal chemical damage to the surrounding stack. [20], [27], [28] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. We measured cell height, gate pitch, metal geometry, and ribbon dimensions at the XTEM sites shown below. The tables group these dimensions by site and device polarity. Our “sheet cuts” cross the silicon channel and show the ribbons end-on. “gate cuts” run along the channel through successive gates. The 18A logic cell dimensions point to a five-track logic library while the N3E and Intel 3 cell dimensions evidence a seven-track logic library. The DDR-PHY uses wider M0 wires and much larger spacing than core logic. That trades routing density for lower wire resistance and weaker coupling between neighboring nets. The geometry suits the current delivery and coupling requirements of analog, clock, and I/O circuitry. PowerVia lets 18A combine a compact cell height with wider M0 geometry by moving the main power rails off the signal-routing tracks. That relaxes local wire scaling while preserving a small cell footprint. Cell height and gate pitch set the geometric density; pin access and routability determine how much of it a real block can use. [29] The biggest takeaway from our gate-pitch measurements is that Intel 18A compute logic and TSMC N3E GPU logic have similar density in the Bohr representative-cell model. The 18A example is 18.6% denser than the Intel 3 GPU example. Gate pitches are nearly identical across the three sites, so cell height drives most of the difference. The Bohr model combines a four-transistor NAND2 spanning three gate pitches and a 32-transistor scan flip-flop (SFF) spanning nineteen pitches, weighting their densities 60:40. The sensitivity column shows how independently changing cell height and gate pitch by ±1 nm changes the result. This compares representative cell geometries; whole-die density also depends on cell mix and placement. The 18A P-core gives M0 substantially more metal cross section than the N3E vector engine. Treating each profile as a trapezoid gives 2.63 times the area per line and 1.84 times the area after normalization by routing pitch. The larger section reduces the geometric contribution to line resistance and lowers current density for a given current. Taller and wider wires also add capacitance, so circuit delay depends on the balance of resistance and capacitance. The DDR-PHY has less metal area per routing width than the 18A core fields, while remaining above N3E. [30] Area = height × (top CD + bottom CD) / 2, including liners. Area/pitch normalizes by routing width. Taper is the symmetric sidewall angle from vertical, with the largest angle belonging to the DDR-PHY. Compute tile The measurements show how ribbon dimensions and gate-stack geometry vary across the compute tile and between NMOS and PMOS to balance channel drive, gate load and the space needed for the dielectric/WFM stack across logic, SRAM and the DDR-PHY. Width mainly changes available channel perimeter; thickness also changes electrostatic control and carrier confinement. Gate-stack thickness then determines the space left for low-resistivity fill P-core and LP E-core logic Both the P-core and LP E-core use multiple nanosheet widths. Widths are measured on high-magnification XTEMs while wider-field images demonstrate additional width choices within the LP E-core. Multiple widths are expected even within an LP E-core. Timing-critical paths, buffers and cells with different fanout need different drive strengths. The lower-magnification fields show this width diversity beyond the sites quantified in the table. L2 and L3 SRAM GAA gives SRAM designers another way to balance the pull-up (PU), pass-gate (PG), and pull-down (PD) transistors. FinFET bitcells set device strength through fin count while GAA adds nanosheet width as a sizing knob. In a 6T SRAM cell, a strong pull-down relative to the pass-gate limits read disturbance, while a strong pass-gate relative to the pull-up improves writability. During a write, the pass-gate and write driver pull the node storing “1” below the inverter trip point. During a read, the pull-down holds the node storing “0” low. Bias, threshold voltage, mismatch and assist circuitry set the remaining margin. FinFET high-current cells commonly use a PU:PG:PD fin-count pattern of 1:2:2, a device-sizing ratio rather than a current ratio. Ribbon width lets Intel balance SRAM strengths without adding whole fins. The L2 cell uses its narrowest ribbons for PU and widest for PD, improving writability and read stability respectively. Intel’s disclosed HCC operates without assist; its denser HDC uses negative-bitline write assist. Pulling the selected bitline briefly below ground increases pass-gate overdrive so it can overpower the pull-up at lower supply voltage. That buys density and low voltage writability at the cost of boosting circuitry, switching energy, and additional voltage stress that must be controlled. [31], [32] Four rectangular ribbons give the perimeter = 8 × (width + thickness), before corner rounding. PG/PU is 1.49 and PD/PG is 1.16. The L3 structures closely resemble L2 in layout and cell height. Fewer L3 nanosheet widths are tabulated because fewer high-magnification images were available. DDR PHY The DDR-PHY trades density for controlled analog behavior and reliable off-chip signaling. It contains drivers, receivers, delay circuits, and calibration logic that set drive strength, sampling time, and voltage margin. Repeated four-sheet devices with similar widths fit the use of regular transistor units for matching and programmable drive. Its wider local wiring provides room for current delivery and separation of sensitive signals, while consuming more area than a dense core-logic grid. The layout serves the memory channel’s electrical requirements as well as digital logic density. [33] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Intel 3 GPU devices Vector engine logic Intel 3’s XVE logic uses two-fin PMOS and NMOS devices with power rails in M0. Its cell height and M0 pitch give a seven-track geometry, two tracks more than the 18A logic. One-fin groups also appear among the two-fin devices. Intel 3 L2 SRAM The Intel 3 L2 SRAM uses the familiar HCC sizing pattern: one PU fin, two PG fins, and two PD fins. N3E GPU devices Vector engine logic The N3E XVE field contains repeated two-fin devices with seven-track cell geometry. N3E remains a FinFET process, giving Panther Lake a direct FinFET-to-RibbonFET comparison. N3E L2 SRAM The N3E L2 SRAM uses the same PU:PG:PD fin-count pattern of 1:2:2. Panther Lake-U follows Lunar Lake’s floorplan quite closely. Both pair 4 P-cores with 4 LP E-cores and NPU, media and display engines in similar locations. Lunar Lake also uses Xe2, the direct predecessor to Panther Lake’s Xe3 GPU. This makes Lunar Lake the most direct basis for our comparisons. Arrow Lake differs in core count and uses the older Xe-LPG GPU architecture, so we only use it where it offers a more direct component-level comparison. Compute tile Panther Lake compute-tile floorplans remain sparse even months after launch. Intel 18A’s backside metal and dielectric stack must be removed without damaging the underlying structures before a clean transistor-level floorplan can be imaged. Most published die shots hide or heavily process the background, but we are quite proud of the die shot we achieved and are excited to show the work we have done. We measured the areas of the key components on the compute tile and compared them with their Lunar Lake predecessors on TSMC N3B. These help us to capture changes in block area and compare the two chips across process nodes and designs. Our total tile areas exclude the scribe-line area. The compute-plus-GPU subtotal below uses the PTL-U compute tile and GT1 GPU; it excludes the I/O tile and passive base. Individual block areas use the boundaries marked on the floorplans The compute-plus-GPU row is recomputed from the displayed PTL-U and GT1 areas. Component rows use their stated per-region counts and are not an additive partition of the whole tile. The P-core area remains almost unchanged between Lunar Lake and Panther Lake, despite L2 capacity increasing from 2.5 MiB to 3 MiB. Arrow Lake uses the same Lion Cove core as Lunar Lake but also has a 3 MiB L2. Cougar Cove fits 20% more L2 into the same P-core area. The larger private cache keeps more of each core’s working set close to its execution units, reducing access to shared L3 and DRAM. Extra capacity adds storage leakage and lookup energy, so designers balance it against avoided lower-level accesses. The shared P-core L3 cache also shrank by 14.8%. [2] Cougar Cove combines a similar footprint with Intel’s reported power-efficiency improvements. RibbonFET’s tighter channel control reduces leakage, while PowerVia reduces supply droop and allows tighter voltage guardbands. [1] Darkmont’s four-core LP E-core cluster is 5.0% smaller than Skymont’s on Lunar Lake, with most of the reduction in its L2 regions. The 1 MiB region shrank by 8.4% and the 1.5 MiB region by 14.9%. The tag arrays also use one fewer visible row. Tags identify which memory addresses the data array holds, so rearranging them changes the cache’s layout and wiring without requiring less data capacity. [2] The LP E-cores share one L2. This pools capacity and avoids duplicating all the cache machinery, but the four cores contend for its banks and bandwidth. Their separate cluster also keeps light work away from the performance cluster and its L3, allowing that larger domain to sleep. [1], [2] Cache area includes more than the storage cells. Tags identify each line, decoders select rows, sense amplifiers read the small bitline signal, and wires connect to the banks. Splitting an array into smaller sections shortens wordlines and bitlines, improving access speed, but duplicates peripheral circuits. Panther Lake’s smaller cache regions therefore reflect the complete memory implementation, including how much of each region is devoted to storage. [34] Unlike Meteor Lake and Arrow Lake, Panther Lake has no separate SoC tile. The NPU, LP E-cores, memory controllers, PHYs, media and display engines now share the compute tile. This removes an active die and keeps CPU memory traffic on one die. The cost is moving PHY and I/O-related circuitry onto 18A: drivers, receivers and analog circuits must still meet external voltage, loading and signal-integrity requirements, so their area does not shrink like dense digital logic. [1], [2] The biggest shrink comes from the NPU, which occupies 36.9% less area. NPU 5 consolidates the same total INT8 MAC count into half as many neural compute engines. Each of the three NCEs has a larger MAC array to make the complete NCE envelope 22.6% larger than an NPU 4 engine. Consolidation also halves the number of scratchpads and SHAVE DSPs, from 12 to 6. The MAC array handles matrix multiplication and convolution, while SHAVE executes vector and custom operations that fit the array poorly. [1], [2], [35] The paired floorplans identify each NCE envelope and its scratchpad, MAC, and SHAVE regions. Each measured MAC polygon is counted once per NCE in the area accounting below. The scratchpads store weights, activations, and intermediate results near the MAC arrays, allowing repeated use without fetching them again from DRAM. Halving their number delivers the largest measured area saving but leaves less local storage for the same total MAC count. Layers that no longer fit locally require smaller working tiles or more transfers of intermediate data. The benefit depends on keeping the enlarged arrays busy while managing that tighter storage budget. [36] NPU 5 also adds native FP8. Using half the operand width of FP16 reduces storage and transfer demand, helping workloads fit the smaller local memory budget. Lower precision and format-dependent range make scaling and model validation part of deployment. Hardware activation functions further reduce work that would otherwise occupy the programmable DSPs. [1], [2] Microsoft requires an NPU to deliver at least 40 TOPS for Copilot+ PCs. Both Lunar Lake and Panther Lake meet this threshold, but Panther Lake uses significantly less silicon. GPU tiles Panther Lake is Intel’s first product with Xe3, its latest GPU architecture. It offers two different GPU tiles: a smaller GT1 tile with 4 Xe3 cores on Intel 3 and a larger GT2 tile with 12 Xe3 cores on TSMC N3E. Panther Lake allows us to compare the same GPU architecture across both Intel 3 and TSMC N3E. Wildcat Lake adds a third Xe3 implementation on Intel 18A. A future newsletter will detail Xe3 and its implementation differences across all three process nodes. GT2 scales Xe3 to a different physical layout, with render slices arranged vertically instead of GT1’s horizontal arrangement. Slice placement sets the distances to shared cache banks and the D2D interface. Those wires consume area and add delay, so scaling the number of Xe cores also requires a new balance of cache placement, routing and timing. [1] What’s immediately obvious is that the GT2 tile on TSMC N3E has much smaller Xe cores than GT1. These block areas include logic, caches, and routing. An Xe core on the GT1 tile is ~69% larger than one on Lunar Lake, and ~55% larger than one on GT2. Intel 3 therefore uses substantially more area per Xe core. The block-area gap exceeds the measured logic and SRAM density gaps, bringing routing, timing targets, cell mix, and floorplan allocation into the comparison. The measured vector/matrix engine region is almost unchanged between Lunar Lake and Panther Lake’s GT2 tile. Xe3 retains eight 512-bit vector engines and eight 2048-bit XMX engines per core. Its gains also come from feeding those engines more effectively: more resident threads hide stalls, and variable register allocation lets shaders trade registers per thread against the number of threads kept active. [1] The shared L1/SLM capacity increased by 33% from 192 KiB to 256 KiB, while its area increased only 5%, raising effective density by 27%. L1 retains reused cache lines, while software-managed SLM lets a thread group share data locally. Both reduce traffic to more distant memory. Allocating more SLM per group can also limit how many groups reside on a core at once. [1], [37] The GT1 tile carries 4 MiB of L2 against 16 MiB on the GT2 tile. GT1 divides its L2 cache into four 1 MiB banks, while GT2 uses eight 2 MiB banks. Each bank contains 128 macros, but each N3E macro stores 16 KiB, twice the Intel 3 macro’s 8 KiB capacity. The N3E macro is only 54% larger while holding twice as many bits, giving it 30% higher density: ~23.7 Mbit/mm² versus 18.3 Mbit/mm². Including bank-level circuitry, the gap widens to ~16.9 Mbit/mm² on GT2 versus ~10.4 Mbit/mm² on GT1. GT2 gains density with its macros storing more bits per unit area, and those macros occupy more of each cache bank. Larger macros spread decoder and sense-amplifier overhead across more storage, while a more compact bank layout reduces the share spent on control and routing. The compromise is longer wordlines and bitlines that carry more capacitance. [34] I/O tile Panther Lake uses two I/O tile variants, both fabricated on TSMC N6. The smaller one provides 4 PCIe 5.0 and 8 PCIe 4.0 lanes and serves lower-tier systems as well as those without a discrete GPU, while the larger one adds 8 PCIe 5.0 lanes, bringing the total to 20 lanes, for discrete-GPU connectivity. Panther Lake SKUs with the larger 10- or 12-Xe GPUs use the smaller I/O tile. [38] The smaller I/O tile adds a PCIe 4.0 block and a Thunderbolt block to Lunar Lake’s I/O layout, providing four additional PCIe 4.0 lanes and another Thunderbolt 4 port. Its repeated N6 blocks retain nearly identical areas and layouts. Reusing these proven PHYs and controllers avoids porting and requalifying external interfaces on 18A, where faster digital logic offers less benefit to circuits constrained by the off-chip link. [38] SemiAnalysis’s teardown lab (STEEL) dives deep into the world’s advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. We’re hiring technical experts from system to transistor and everywhere in between. Check out our Careers page. Panther Lake offers scalability and modularity through its disaggregated packaging that partition compute, GPU, and I/O silicon into separate tiles allowing for a suite of tile configurations. This partitioning makes the package part of Intel’s node economics as it determines how much leading-edge wafer area each product consumes, which functions can remain on other processes, and how much configuration freedom Intel can offer from a shared set of tiles. Furthermore, fabricating the compute and GPU tiles separately confines the new 18A process to the compute tile and allows graphics and I/O to use other, more established, and more cost-effective processes. For Panther Lake, the GPU and I/O tiles are assembled alongside the compute tile on a passive silicon base using Foveros-S. Intel’s current technology brief lists a nominal 36 µm pitch for Foveros-S. Through-silicon vias (TSVs) in the base connect the fine wiring above to the larger package connections below. The functional tiles sit side by side on that passive base in a 2.5D configuration. [39] Our cross-section through the compute and GPU tiles shows the package’s wiring hierarchy. Microbumps connect each active tile to the passive silicon base; its fine redistribution layer (RDL) carries the short, dense tile-to-tile links. TSVs carry connections through the base to the package substrate, which fans them out to the much coarser motherboard solder joints. The base supplies interconnect, while computation remains in the active tiles above it. [39] At the compute-tile edge, the higher-magnification inset shows a local microbump spacing of approximately 25.24 µm and a feature width of 12.33 µm. These local spacings are finer than Intel’s nominal Foveros-S value. The X-ray fields further confirm tighter neighboring bumps, consistent across every die-to-die area found on each tile. Additional X-ray analysis is offered after the paywall. Putting the memory controller beside the CPU removes the D2D transfer that CPU memory requests required in Meteor Lake and Arrow Lake. This avoids the extra transmitter, receiver, and link traversal, saving interface energy and latency. Panther Lake’s separate GPU still crosses a D2D link to reach DRAM, so its larger local caches also help contain package traffic. [1], [40] Smaller dies are less likely to contain a random fatal defect, and screening them before assembly prevents one bad tile from consuming a complete package of good silicon. Reuse also spreads design and qualification work across more products. Against those gains, Intel pays for the passive base, D2D circuits, extra bonding and test steps, and losses during assembly. Cost per working product across the portfolio captures the combined effect of wafer yield, reuse, test, and assembly. [29] Wildcat Lake packaging Intel launched Core Series 3, formerly Wildcat Lake, on 16 April 2026 for value mobile and edge systems. Wildcat Lake keeps 18A but removes the passive base and combines more functions on one die to simplify the package. The two products therefore reveal two distinct ways to commercialize the same leading-edge process. [41] Wildcat Lake’s 18A die combines up to two Cougar Cove P-cores, four Darkmont LP E-cores, two Xe3 cores and a smaller NPU. A separate platform-controller die supplies I/O, connected through UCIe, Intel’s first processor implementation of the standard. Consolidating graphics remove a tile boundary and the passive base, reducing assembly complexity for a modest-bandwidth value product. It also ties CPU and graphics scaling to the same die, giving up Panther Lake’s ability to swap in a much larger GPU. [42], [43] In July 2021, Intel CEO Pat Gelsinger set out an ambitious process roadmap aimed at regaining performance leadership by 2025, later described as five nodes in four years. Five years and one CEO later, Intel’s comeback story is not as unambiguously positive as Pat may have hoped. [44], [45] Intel once set the pace for process technology, bringing high-k metal gate technology and FinFETs into volume production years ahead of the rest of the industry. Its 22 nm FinFET process reached consumers with Ivy Bridge in 2012. [46] Intel’s integrated device manufacturing (IDM) model allowed its architects and process engineers to co-optimize products and processes. Starting with Sandy Bridge, Intel dominated x86, while AMD struggled with Bulldozer. That lead faltered at 14 nm and broke at 10 nm. Intel targeted a massive 2.7× density increase, but the node arrived years late and required several revisions before it could support Intel’s full lineup. This delay forced Intel to stretch 14 nm across six generations, while TSMC moved ahead in process technology and AMD recovered in x86. By 2019, Intel was still shipping 14 nm across most of its product stack, with its 10 nm client ramp focused on Ice Lake mobile processors. Meanwhile, TSMC was shipping N7 and N7+, and AMD’s Zen 2 compute chiplets used N7 to raise core counts and improve efficiency. Intel’s process failures were central to its decline, but unsound business decisions furthered their downward slide. Product delays compounded product mistakes, pushing client, server, and FPGA roadmaps off schedule. Several attempts to enter AI (Nervana and Gaudi) and networking (Tofino) also failed to establish lasting businesses. Intel’s recovery has focused on consumer CPUs and advanced packaging. Tiger Lake, Alder Lake, Lunar Lake and now Panther Lake have restored Intel’s consumer roadmap. On the process side, Intel 4 shipped with Meteor Lake, Intel 3 with Granite Rapids and Sierra Forest, and Intel 18A with Panther Lake. Intel has also made advanced packaging part of its foundry offering. However, Intel is still playing catch-up in servers. Several Xeon generations arrived years late and trailed contemporary AMD and Arm server CPUs in performance, efficiency, and core count. The process roadmap is back, but Intel does not hold the same process-technology leadership position it held prior to 10 nm. The introduction of gate-all-around nanosheets and backside power delivery are two of the biggest changes to transistor integration in a decade. Intel took on both changes at once: 18A paired its first RibbonFET with PowerVia in Panther Lake. Panther Lake is a substantial manufacturing milestone. Our cross-sections show how RibbonFET and PowerVia reshape local contacts and wiring, while the floorplans show where architectural consolidation and process choices save area. A sustained competitive lead depends on product performance, cost, yield, and the next implementation. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page.. [1] Intel, “Intel Tech Tour 2025 Panther Lake recap,” Doc. 866361, 2025. Accessed: Sep. 14, 2026. [Online]. Available: https://cdrdv2-public.intel.com/866361/ITT_2025_Panther_Lake_Recap1.pdf [2] Intel, “Core Ultra processors Series 3 datasheet, volume 1,” Doc. 872188-001, Jan. 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://cdrdv2-public.intel.com/872188/872188-001.pdf [3] N. Horiguchi and E. Beyne, “Backside power delivery: How to power chips from the backside,” imec Reading Room, Nov. 25, 2022. Accessed: Sep. 14, 2026. [Online]. Available: https://www.imec-int.com/en/articles/how-power-chips-backside [4] W. Hafez et al., “Intel PowerVia technology: Backside power delivery for high density and high-performance computing,” in Proc. IEEE Symp. VLSI Technol. Circuits, Kyoto, Japan, Jun. 2023, pp. 1–2, doi: 10.23919/vlsitechnologyandcir57934.2023.10185208. [5] K. Fischer et al., “Intel 18A platform technology featuring RibbonFET (GAA) and PowerVia for advanced high-performance computing,” in Proc. Symp. VLSI Technol. Circuits, Kyoto, Japan, Jun. 2025, pp. 1–3, doi: 10.23919/vlsitechnologyandcir65189.2025.11075006. [6] K.-F. Cheng, C.-L. Teng, H.-Y. Huang, and H.-C. Chen, “Metal oxide composite as etch stop layer,” U.S. Patent 12 176 247 B2, Dec. 24, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US12176247B2/en [7] S. W. King, “Dielectric barrier, etch stop, and metal capping materials for state of the art and beyond metal interconnects,” ECS J. Solid State Sci. Technol., vol. 4, no. 1, pp. N3029–N3047, 2015, doi: 10.1149/2.0051501jss. [8] A. V. Mule’, D. J. Towner, D. Seghete, C. R. Ryder, and A. A. Gonzalez, “Multi-layer etch stop layers for advanced integrated circuit structure fabrication,” U.S. Patent Appl. 20220102343 A1, Mar. 31, 2022. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US20220102343A1/en [9] C.-C. Wang and J. H. Wang, “Interconnect structure with dielectric cap layer and etch stop layer stack,” U.S. Patent Appl. 20230253247 A1, Aug. 10, 2023. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US20230253247A1/en [10] Y. J. Wu, K.-F. Cheng, C.-C. Lee, H.-K. Chang, and H.-Y. Huang, “Etch stop layer for interconnect structures,” U.S. Patent Appl. 20240332070 A1, Oct. 3, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US20240332070A1/en [11] M. G. Rainville, N. Shankar, K. S. Reddy, and D. M. Hausmann, “Deposition of aluminum oxide etch stop layers,” U.S. Patent Appl. 20180197770 A1, Jul. 12, 2018. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.justia.com/patent/20180197770 [12] J. S. Leib et al., “Conductive lines having molybdenum liner and tungsten fill for advanced integrated circuit structure fabrication,” U.S. Patent Appl. 20240429126 A1, Dec. 26, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.justia.com/patent/20240429126 [13] M. Naik, “Cobalt enables power and performance scaling at single-digit logic nodes,” Applied Materials, Dec. 17, 2018. Accessed: Sep. 14, 2026. [Online]. Available: https://www.appliedmaterials.com/us/en/blog/blog-posts/cobalt-enables-power-and-performance-scaling-at-single-digit-logic-nodes.html [14] Lam Research, “Breaking through AI’s invisible barrier with molybdenum,” Lam Research Newsroom, May 6, 2025. Accessed: Sep. 14, 2026. [Online]. Available: https://newsroom.lamresearch.com/molybdenum-metallization-ai-revolution [15] P. Yashar, G. Malyavanatham, and H. Vijwani, “Integrated circuit interconnect structures with niobium barrier materials,” U.S. Patent Appl. 20240112951 A1, Apr. 4, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US20240112951A1/en [16] Applied Materials, “Applied Materials unveils chip wiring innovations for more energy-efficient computing,” Applied Materials Investor Relations, Jul. 8, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://ir.appliedmaterials.com/news-releases/news-release-details/applied-materials-unveils-chip-wiring-innovations-more-energy [17] Samsung, “Samsung showcases AI-era vision and latest foundry technologies at SFF 2024,” Samsung Semiconductor, Jun. 13, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://semiconductor.samsung.com/news-events/news/samsung-showcases-ai-era-vision-and-latest-foundry-technologies-at-sff-2024/ [18] C. W. Yeung et al., “Channel geometry impact and narrow sheet effect of stacked nanosheet,” in Proc. IEEE Int. Electron Devices Meeting (IEDM), Dec. 2018, pp. 28.6.1–28.6.4, doi: 10.1109/iedm.2018.8614608. [19] S. Mochizuki et al., “Evaluation of (110) versus (001) channel orientation for improved nFET/pFET device performance trade-off in gate-all-around nanosheet technology,” in Proc. Int. Electron Devices Meeting (IEDM), Dec. 2023, pp. 1–4, doi: 10.1109/iedm45741.2023.10413854. [20] D. G. Ouellette et al., “Fabrication of gate-all-around integrated circuit structures having molybdenum nitride metal gates and gate dielectrics with a dipole layer,” U.S. Patent 12 051 698 B2, Jul. 30, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US12051698B2/en [21] imec, “Advancing the CFET-based device roadmap with novel integration modules and standard-cell architectures,” imec, 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://www.imec-int.com/en/articles/advancing-cfet-based-device-roadmap-novel-integration-modules-and-standard-cell [22] A. Reznicek, X. Miao, C. Lee, and J. Zhang, “Wrap around contact for nanosheet source drain epitaxy,” U.S. Patent 11 302 813 B2, Apr. 12, 2022. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US11302813B2/en [23] J. A. Kittl, J. G. Hong, D. R. Palle, and M. S. Rodder, “Methods for varied strain on nano-scale field effect transistor devices,” U.S. Patent 9 978 833 B2, May 22, 2018. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US9978833B2/en [24] S. Gandikota et al., “Method of reducing metal gate resistance for next generation NMOS device application,” Int. Patent Appl. WO 2024/137272 A1, Jun. 27, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/WO2024137272A1/en [25] J. Zhang et al., “Full bottom dielectric isolation to enable stacked nanosheet transistor for low power and high performance applications,” in Proc. IEEE Int. Electron Devices Meeting (IEDM), Dec. 2019, pp. 11.6.1–11.6.4, doi: 10.1109/iedm19573.2019.8993490. [26] C. Yoo, J. Chang, Y. Seon, H. Kim, and J. Jeon, “Analysis of self-heating effects in multi-nanosheet FET considering bottom isolation and package options,” IEEE Trans. Electron Devices, vol. 69, no. 3, pp. 1524–1531, Mar. 2022, doi: 10.1109/ted.2022.3141327. [27] S. S. Pradhan, D. B. Bergstrom, J.-S. Chun, and J. Chiu, “Tungsten gates for non-planar transistors,” European Patent Appl. EP 3 506 367 A1, Jul. 3, 2019. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/EP3506367A1/en [28] L. Schloss and X. Ba, “Tungsten films having low fluorine content,” U.S. Patent 9 754 824 B2, Sep. 5, 2017. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US9754824B2/en [29] Intel Foundry, “Accelerating AI and HPC with advanced process and packaging technologies,” Doc. 367370-001US, Jun. 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intel.com/content/dam/www/central-libraries/us/en/documents/2025-11/intel-foundry-hpc-ai-brief.pdf [30] M. Lofrano, X. Chang, H. Oprins, and Z. Tokei, “Mitigating the thermal bottleneck in advanced interconnects,” imec, Sep. 28, 2023. Accessed: Sep. 14, 2026. [Online]. Available: https://www.imec-int.com/en/articles/mitigating-thermal-bottleneck-advanced-interconnects [31] S. Bair, “Intel at ISSCC 2025: Navid Shahriari invited talk, eight papers, forums, panelist & product details,” Intel Community, Feb. 19, 2025. Accessed: Sep. 14, 2026. [Online]. Available: https://community.intel.com/t5/Blogs/Tech-Innovation/Edge-5G/Intel-at-ISSCC-2025-Navid-Shahriari-Invited-Talk-Eight-Papers/post/1667592 [32] D. Chandra, E. Potladhurthi, D. R. S. Reddy, and K. S. Rengarajan, “Tunable negative bitline write assist and boost attenuation circuit,” U.S. Patent Appl. 20160203857 A1, Jul. 14, 2016. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US20160203857A1/en [33] Synopsys, “Advantages of firmware-based training in high-speed DDR IP,” Synopsys IP Technical Bulletin. Accessed: Sep. 14, 2026. [Online]. Available: https://www.synopsys.com/articles/firmware-based-training-ddr-ip.html [34] N. Muralimanohar, R. Balasubramonian, and N. P. Jouppi, “CACTI 6.0: A tool to understand large caches,” Hewlett-Packard Laboratories, 2009. Accessed: Sep. 14, 2026. [Online]. Available: https://users.cs.utah.edu/~rajeev/cacti6/cacti6-tr.pdf [35] Intel, “Intel Tech Tour 2024 Lunar Lake AI hardware accelerators,” Doc. 824436, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://cdrdv2-public.intel.com/824436/2024_Intel_Tech%20Tour%20TW_Lunar%20Lake%20AI%20Hardware%20Accelerators.pdf [36] Y.-H. Chen, J. Emer, and V. Sze, “Eyeriss: A spatial architecture for energy-efficient dataflow for convolutional neural networks,” in Proc. 43rd ACM/IEEE Annu. Int. Symp. Comput. Archit. (ISCA), Jun. 2016, pp. 367–379, doi: 10.1109/isca.2016.40. [37] Intel, “Introduction to the Xe-HPG architecture,” Doc. 758306, Nov. 4, 2022. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intel.com/content/www/us/en/developer/articles/technical/introduction-to-the-xe-hpg-architecture.html [38] Intel, “Core Ultra processors Series 3 for the edge,” Doc. 855291. Accessed: Sep. 14, 2026. [Online]. Available: https://cdrdv2-public.intel.com/855291/Intel%C2%AE%20Core%E2%84%A2%20Ultra%20Processors%20Series%203%20for%20Edge%20Overview_2.pdf [39] Intel Foundry, “Foveros technology brief,” Doc. 366411-001US, Feb. 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intel.com/content/dam/www/central-libraries/us/en/documents/2025-07/foveros-25d-product-brief.pdf [40] D. Das Sharma, “UCIe: Building an open chiplet ecosystem,” UCIe Consortium, 2022. Accessed: Sep. 14, 2026. [Online]. Available: https://www.uciexpress.org/_files/ugd/0c1418_c5970a68ab214ffc97fab16d11581449.pdf [41] Intel, “Intel launches Intel Core Series 3 processors,” Intel Newsroom, Apr. 16, 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intel.com/content/www/us/en/newsroom/news/client-computing/intel-launches-intel-core-series-3-processors-changing-the-game-for-everyday-computing.html [42] Intel, “Core Series 3 launch press deck,” Apr. 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://download.intel.com/newsroom/2026/Intel-Core-Series-3/Intel-Core-Series-3-Launch-Press-Deck.pdf [43] Intel, “Intel outlines architectures for agentic AI at Hot Chips 2026,” Intel Newsroom, Aug. 24, 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intel.com/content/www/us/en/newsroom/news/client-computing/intel-outlines-architectures-for-agentic-ai-at-hot-chips-2026.html [44] Intel, “Intel accelerates process and packaging innovations,” Intel Investor Relations, Jul. 26, 2021. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intc.com/filings-reports/all-sec-filings/content/0001193125-21-224438/d199788dex991.htm [45] Intel, “Intel reports third-quarter 2021 financial results,” Intel Investor Relations, Oct. 21, 2021. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intc.com/news-events/press-releases/detail/1505/intel-reports-third-quarter-2021-financial-results [46] Intel, “3rd generation Intel Core processors bring exciting new experiences and fun to the PC,” Intel Investor Relations, Apr. 23, 2012. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intc.com/news-events/press-releases/detail/577/3rd-generation-intel-core-processors-bring-exciting
Falcons soar over the Packers in dominant 35-14 win in Green Bay
The Falcons dominated the Packers on the national stage during Thursday Night Football. Quarterback Michael Penix Jr. returned to the lineup and led the team to a convincing 35-14 win in Green Bay
Falcons’ Bijan Robinson Gets Candid About Packers Defenders
Bijan Robinson dominated the Packers on Thursday night. Afterward, the Falcons star revealed what he noticed from Green Bay defenders. The post Falcons’ Bijan Robinson Gets Candid About Packers Defenders appeared first on HEAVY.
Arch Manning visits stadium where Uncle Peyton dominated
Texas coach Steve Sarkisian doesn't want his quarterback trying to live up to anyone else on Saturday.
🗞️ Diomandé, Raphinha, Javier Aguirre... Variety on Thursday's front pages
Football headlines are being dominated by the debate over Real Madrid’s lineup, Valencia’s signing of Javier Aguirre, the mileage burden on Raphinha, and the feat of the women’s under-20 team. ...
30 years of Republican dominance of Ohio politics: The results
The Republican party of Ohio has dominated state government for the past thirty years. Let's look at the job they have done in managing the state. The results may shock you.
Texas Senate race focuses on high prices — but what can candidates actually do about it?
Affordability has dominated the U.S. Senate race in Texas. Both James Talarico and Ken Paxton have promised to help voters' pocketbooks.
The Giants’ season is already in danger, plus an early NHL preview
The Pulse Newsletter 📣 | This is The Athletic’s daily sports newsletter. Sign up here to receive The Pulse directly in your inbox. Good morning! Talk to your friends about EPA today. Coming up: 🔀 Vibe shift in L.A. 🤓 The WNBA’s spectacle 📕 We’re all football nerds Football season can be so fickle. Vibes can turn on a dime. Last week, we marveled at how the new-look Giants dominated the Cowboys in primetime. We wondered if New York’s ceiling could be higher than previously thought under coaching legend John Harbaugh. And we wondered if the Rams’ dream season...
Three Takeaways From Dodgers Sweep vs. Giants
The San Francisco Giants' late-season collapse deepened as the Los Angeles Dodgers dominated the division rivalry.
Brock Purdy Looks Unstoppable as 49ers Start 2-0
The San Francisco 49ers are off to a 2-0 start, and Brock Purdy looks like a quarterback ready to take his game to another level. San Francisco dominated the Miami Dolphins 35-13 on Sunday, following up its Week 1 victory over the Los Angeles Rams with another convincing performance. The 49ers have now opened the…
Packers' Lukas Van Ness Delivers Best Career Performance vs. Jets
Green Bay Packers' Lukas Van Ness dominated the New York Jets with nine pressures and a clutch overtime sack.
Steelers offense gets dominated in 20-3 loss to Patriots
Steelers get stomped by Patriots, fall to 1-1.
Lewis Hall Shine’s In Newcastle’s Win Against Hull City
Fresh from an England recall, the full-back dominated the left flank with a clinical strike and resilient defending to anchor a vital victory for the Magpies.
Real MN Gophers Winners and Losers vs Akron
The Minnesota Gophers dominated the Akron Zips on Saturday, but not everyone on the winning team was a winner.
Lopez strike seals Wolves win in Black Country Derby
Wolves claimed local bragging rights on Sunday as Fer Lopez’s second-half goal secured a 1-0 victory over West Bromwich in the Black Country derby.Wolves dominated the opening stages and could easil...
1969 Elvis Presley Gem Was the Flip Side of a No. 3 Billboard Smash
While 'In the Ghetto' dominated the radio, its soulful B-side proved to be a masterpiece of its own.
1969 Elvis Presley Gem Was the Flip Side of a No. 3 Billboard Smash
While 'In the Ghetto' dominated the radio, its soulful B-side proved to be a masterpiece of its own.
Prediction For Buccaneers Week 2 Game Against Cleveland Browns
Tampa Bay is looking to bounce back in Week 2 against a Cleveland team that was dominated a week ago.
Brighton 3-0 Arsenal Player Ratings And Fan Opinions
The Seagulls dominated the Emirates in a historic shutout. Discover which standout debutants and tactical masters earned near-perfect scores as Brighton dismantled the Gunners’ title ambitions.
Georgia Tech Cracked The Code At Southern Showcase
Georgia Tech's cross country squads dominated the Southern Showcase with a historic men's finish and multiple personal bests. See the full breakdown.
Georgia Rolls Past Arkansas in Dominant SEC Opener
No. 2 Georgia wasted no time showing that it is ready for another run through the SEC. The Bulldogs traveled to Fayetteville on Saturday and dominated Arkansas from the opening whistle, cruising to a 45-17 victory in their first conference game of the season. Georgia improved to 3-0 overall and 1-0 in SEC play with…
Hamburg beat Köln for first league win
The game started off slowly with both teams having possession but little chances in the first 10 minutes. Köln dominated the ball in the first fifteen minutes but were unable to do anything with the ...
Latest impressive defensive performance helps undefeated Cedar Ridge stuff Rouse
After allowing nearly 40 points per game last year, Cedar Ridge's defense has dominated so far this season. The Raiders are 4-0 for the first time since 2017.
China-led team discovers fragments of lost continent Gondwana
Research suggests that the land mass that once dominated Earth was larger than previously thought.
Kerim Alajbegovic delighted to score in the Europa League
Kerim Alajbegovic was among the goalscorers as Juventus dominated NEC in a fine evening at the Allianz Stadium, securing an impressive 5-0 victory in the Europa League.The youngster had been a standou...
Menopause and estrogen patches dominated DC conversations. Now what?
Menopause took center stage in Washington, DC, with meetings about testosterone, estrogen patches, and how to improve women's health care.
Credit unions bulk up a business that banks long dominated
Citadel Credit Union recently closed a $50 million loan on a Philadelphia office tower. It's part of a trend, as credit unions build their commercial real estate lending businesses.
Cincinnati vs Miami University Prediction: Are the Bearcats Good?
Cincinnati dominated mediocre teams, but Miami University should show up in the rivalry battle. Here's the CFN preview and prediction.
Larkin ‘Ready to be Bottom of the Totem Pole Again’
After an offseason dominated by headlines with his name in them, former Red Wings captain Dylan Larkin seemingly would rather […]
Chiefs rumors: Don't count out Tyreek Hill signing
The Kansas City Chiefs recently started out their 2026 season with a bang with a home win over the Denver Broncos on Monday Night Football. Patrick Mahomes didn’t look fully healthy in his first game back from an ACL injury, but it didn’t matter, as Kansas City’s defense and running game dominated throughout the evening. Mahomes will certainly want […] The post Chiefs rumors: Don't count out Tyreek Hill signing appeared first on ClutchPoints.
Gray knows the consequences if slump continues
The lack of consistency from Hibs is alarming, but not a surprise. Tuesday night's home defeat by Kilmarnock - Hibs' third successive league loss and sixth in a row at home in the Premiership - came after one of the poorest performances at Easter Road I can remember in recent years. The statistics show Hibs dominated possession and had more shots on goal than Kilmarnock, but they rarely troubled Max Stryjek in the visitors' goal.
Not Starship. Not Starlink. This Is the Part of SpaceX's Business That Could Lift It Into the $3 Trillion Club.
SpaceX's artificial intelligence (AI) business is proving its worth in an arena dominated by hyperscalers.
Rivals dominate OneFootball's BR26 round 27 XI, watch 📹
With another Brasileirão round wrapped up, it’s now time for the OneFootball Team of the Week!League leaders Flamengo are included, but it wasn’t the Rubro-Negro who dominated our selection, whic...
Vikes Views: Nincompoop of the Week
The taste of victory is sweet, especially against the Packers. The Minnesota Vikings dominated the 2nd half after a questionable decision to pull points off the board by Matt LeFleur. The Packers continued their choking ways from last season and the Vikings cruised to victory. Matt LaFleur Why is LaFleur a Nincompoop? Going for it […]
Kyle Whittingham Speaks on The Power of Doing More
Driven by player initiative and a relentless new mantra, the Wolverines dominated the trenches to secure a 2-0 start through physical intensity and heightened preparation standards.
Ohio State Pulled Off an All-Time Choke Job
I still can’t believe Ohio State lost this game . The No. 1 team in the country walked into Austin, dominated Texas for three quarters and entered the fourth with a 23-3 lead . Twenty points. One quarter to play. Game over, right? Apparently not. Ohio State proceeded to completely collapse, allowing 21 unanswered points…
🗞️ Barça full house, Mestalla heats up... Monday's front pages
The sports front pages this Monday, September 14 are dominated by FC Barcelona’s unstoppable run at the top of LaLiga, Atlético de Madrid’s emphatic thrashing to keep pace, and the institutional ...
Bears news: D'Andre Swift's take on 59-point explosion should strike fear for opponents
D’Andre Swift and the Chicago Bears made incredible history after beating down the Carolina Panthers in a 59-37 win on Sunday afternoon. Swift has been playing in the NFL since 2020, starting his third year with the Bears. He shines as their leading rusher, having found comfort there with his production as a versatile running back. Swift dominated […] The post Bears news: D'Andre Swift's take on 59-point explosion should strike fear for opponents appeared first on ClutchPoints.
Takeaways from Memphis’ 18-point loss to Boise State
Memphis lost for the first time in the Charles Huff era Saturday night against Boise State. The Tigers led by 14 points in the first half, but the Broncos dominated the second half to record an 18-point victory.
Ravens Dominate Colts in Statement 41-23 Season-Opening Win
The Baltimore Ravens couldn’t have asked for a better start to the 2026 season. Baltimore traveled to Indianapolis and dominated the Colts 41-23 , giving new head coach Jesse Minter a statement victory in his first regular-season game. The Ravens overwhelmed Indianapolis on both sides of the ball, piling up 506 total yards while controlling…
This Is Why Ohio State Should’ve Let Texas Score
The Ohio State Buckeyes had no business losing to the Texas Longhorns on Saturday night, not after the way OSU had dominated much of the game. But down the stretch, Arch Manning and the Longhorns started scoring, and the Texas defense began getting stops. All of a sudden, Texas was on the doorstep with less […] The post This Is Why Ohio State Should’ve Let Texas Score appeared first on HEAVY.
Jefferson, Roosevelt 2026 Presidents Bowl winners
SIOUX FALLS, S.D. (KELO) — The 34th Presidents Bowl took place at Howard Wood Field on Saturday afternoon featuring all four Sioux Falls public high schools, in the main events of the day Roosevelt edged Washington 27-7 while #2 Jefferson dominated #4 Lincoln 42-14. #2 Jefferson 42, #4 Lincoln 14 In the second and final […]
Big Second Half Propels BYU in Win Over Arizona
BYU went into half down 17-14, but shut out the Wildcats in the second half in a 28-17 win over Arizona Saturday afternoon in Provo. After allowing 240 yards to Arizona in the second half, BYU’s defense dominated in the second . Arizona in the second half mustered only 87 total yards, including -2 rushing […]
Liverpool take first step towards deal for new Ryan Gravenberch
Liverpool have their eyes on a new Ryan Gravenberch. They've registered their interest - and things could move quickly from here.2027 will largely be dominated by Liverpool trying to find a new midfie...
Highlights: Louisville 59, Villanova 13
Dominated like they were supposed to. Got starters some rest. Got the young guys some action. Didn’t suffer any major injuries (as long as KeyJuan is ok). Pretty much all the major boxes checked in this one. Massive, massive opportunity for this team in eight days. Think the fans will recognize the gravity of the […]
Union Hill dominates Jonesboro, 3rd blowout of the season
UNION HILL, Texas (KETK) — The Union Hill Bulldogs dominated the Jonesboro Eagles on Friday night to go 3-0 on the season. FINAL: Union Hill 70 – Jonesboro 14 Union Hill will play the East Texas Homeschool Sports Chargers next Friday in Longview. Jonesboro will face Calvert on the road next Friday. You can now […]
Elon threatens to sue over new 'Musk' doc. But festival crowd loves it
Elon Musk and Elizabeth Holmes are unwitting film fest stars as documentaries about problematic tech titans have dominated news coming out of prestigious film festivals.
Scientists May Have Cracked the Mystery of the Moon’s Unequal Hemispheres
Chang’e-6 samples suggest the Moon’s two very different sides may have formed when uneven heating drove magma from one hemisphere to the other. The Moon presents two dramatically different faces. Its Earth-facing hemisphere is rich in dark volcanic plains, while the farside is dominated by older highlands and a much thicker crust. New analyses of
Arsenal edge Napoli as Odegaard continues fine start to season
Martin Odegaard maintained his superb start to the campaign as Arsenal opened their Champions League journey with a hard-fought 1-0 victory over Napoli.The Gunners dominated much of the contest but we...
River Ryan Impresses in Tigers Organizational Debut
The former Dodgers phenom dominated in his Toledo debut, showcasing the aggressive strike-zone command that could fast-track the 28-year-old righty to Detroit’s rotation before season's end.
Fantasy Football Week 1 2026 Start ‘Em Sit ‘Em: Quarterback
Week 1 is finally here, and with it comes the annual gut-check every fantasy manager dreads: trusting your gut on a quarterback you drafted or trusting the matchup staring you in the face right now. The names that dominated August mock drafts don’t always match up with the defenses they’re about to face, and a handful of under-the-radar arms are […] The post Fantasy Football Week 1 2026 Start ‘Em Sit ‘Em: Quarterback appeared first on ClutchPoints.
Seahawks vs. Patriots: Super Bowl Rematch Game Preview
Seahawks vs. Patriots: Super Bowl Rematch Game Preview The NFL season is finally here, and it is opening with one of the most anticipated matchups possible: a rematch of Super Bowl LX. The Seattle Seahawks will welcome the New England Patriots to Lumen Field on Wednesday night, just seven months after Seattle dominated New England…
Celtic summer target returns to action after turbulent summer
Farès Ghedjemis has returned to Serie A action with Frosinone following a summer dominated by uncertainty over his future. Celtic courted the attacker but never managed to get a deal over the line. T...
Arsenal extends their superb head-to-head record over Chelsea
Arsenal have dominated their matches against Chelsea since Mikel Arteta became manager at the club, and the Gunners extended their dominance in the fixture in their latest meeting with the Blues.Mikel...
Marcel Reed sparks No. 8 Texas A&M in a 50-0 rout of Missouri State
The Aggies thoroughly dominated the game, despite not playing their best.
Arizona soccer thwarted by defensive-minded Dartmouth
Arizona dominated in every stat except the one that matters most
Hernando Teachers Protest 23% Health Insurance Premium Hike at Packed School Board Meeting
A packed Aug. 25 Hernando County School Board meeting was dominated by one topic — a potential 23% jump in employees’ health insurance premiums. Florida Blue informed the district during […]
Angels Dominated By Skenes In 1-0 Loss To Pirates
The Los Angeles Angels lost to the Pittsburgh Pirates as they were shut down by Paul Skenes and a quartet of relievers.
Analysis: Depleted Toffees show their fight
The build-up to this match was dominated by conversations about who Everton failed to sign in the transfer window. Since their last league match - a 1-1 draw with Bournemouth eight days ago - they had sold attackers Iliman N'Diaye and Beto, while Nathan Patterson joined Torino. When on-loan Jack Grealish - once the most expensive British player of all time - took to the touchline on his return to the club, he appeared to be Everton's most likely route back into the game.
Lane Kiffin Shades Clemson After Dominant LSU Debut Win
The Lane Kiffin era at Louisiana State is off to an emphatic start.The #11 Tigers dominated all three facets of the game against Clemson in a 51-10 route in Baton Rouge on Saturday night.The 51-year-old has been a longtime villain in the college football world, and is continuing to embrace it at this moment.Kiffin Shades […] The post Lane Kiffin Shades Clemson After Dominant LSU Debut Win appeared first on HEAVY.
Jonathan Aranda's Extra-Inning Blast Lifts Rays Past Rangers
The Tampa Bay Rays beat the Texas Rangers 6-3 in extra innings to improve to 85-57 and maintain a four-game AL East lead. Jonathan Aranda hit a three-run homer in the 10th, Junior Caminero launched his AL-leading 38th home run and Drew Rasmussen dominated.
Swiatek into US Open fourth round in tight two-setter
Six-time Grand Slam champion Iga Swiatek reached the US Open fourth round on Saturday with a tight two-set victory over Czech Maria Bouzkova.Poland's Swiatek, seeded eighth as she seeks to cap an erratic season with a second US Open crown, dominated both tiebreakers in a 7-6 (7/3), 7-6 (7/3) victory over 25th-seeded Bouzkova, who broke Swiatek early in each set but couldn't make the lead stand up.