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ABA Business Law Section Fall Meeting 2026
Learn more about the latest updates in legal, with expert commentary and insights from trusted attorneys from Foley Hoag LLP. Foley Hoag is a professional community of highly qualified attorneys from all over the US.
Pocket Entertainment: Interview With Co-Founder And CEO Rohan Nayak About AI-Powered Storytelling And The Single-Person Studio
Pocket Entertainment is building an entertainment ecosystem that connects storytelling, creation, production, distribution, localization, and audience engagement. The company operates Pocket FM, its flagship serialized audio drama platform, and has expanded into short-form visual entertainment through Pocket Saga while developing AI tools such as Sherpa that helps creators develop ideas and build characters, worlds, story arcs and episodes. Pulse 2.0 interviewed Pocket Entertainment Co-Founder and CEO Rohan Nayak to learn more about the company’s origins, its evolution beyond audio entertainment, and how AI could enable individual creators to build global entertainment franchises.
Champions to advance public health - Center Times Plus, UT Southwestern
The Peter O’Donnell Jr. School of Public Health recognized outstanding individuals whose work is making a meaningful difference. Honored for their achievements in service, scholarship, innovation, and leadership, these changemakers represent the next generation. Learn more about their goals, passions, and visions for the future of public health.
AI small business workshop
Businesses are still wanting to learn more about the technology in order to stay efficient.
Foley Hoag Advises Vesica Health in Sale to Photocure ASA
Learn more about the latest updates in legal, with expert commentary and insights from trusted attorneys from Foley Hoag LLP. Foley Hoag is a professional community of highly qualified attorneys from all over the US.
From Classroom to Racetrack: How Charlie Baur is Building a Motorsports Career in a Business Discipline
Charlie Baur can trace his racing story back to a Christmas morning in Michigan — the kind that starts with snow on the ground and ends with a throttle in a kid’s hands. “I remember being 3 years old and then for Christmas that year, my parents had gotten me a 120 cc snowmobile,” Baur said. Long before sprint cars, he was a Michigan kid on snowmobiles, dirt bikes, four-wheelers and jet skis — and a regular at car shows and races with his family. Photo courtesy of Charlie Baur That early exposure became a calling. At 12, he sat in a sprint car for the first time and knew he’d found the next chapter. He started in quarter midgets, moved to go-karts, and the day before he turned 16 — one day shy of the minimum age required by track insurance — he made his first sprint car start after convincing officials to let him race. Five years later, Baur is still pushing forward, now racing sprint cars on both pavement and dirt while pursuing an automotive business education at Northwood University — with a clear-eyed understanding that motorsports encompasses more than what happens under the lights on Saturday night. “It’s a business,” said Charlie, a 20-year-old who calls Fenton, Michigan, home when he’s not at a racetrack or at Northwood’s residential campus in Midland, Michigan. Photo courtesy of Charlie Baur Racing is the product — but preparation is the job To the average fan, race day begins around dinner time. For a team, race day can be a 12-hour shift — plus the work that came before it. And Baur’s racing operation is a family affair. “The team is my parents and myself,” he said, explaining they own the cars, maintain equipment and manage the business side — from sponsor relations to budgeting. On race weekends, the core group includes Baur and his parents (Eric and Stefanie), plus a couple of additional hands (Alex Photiou and Robert Flannigan) who help with the intensity and pace of trackside work. That structure has shaped how he thinks about efficiency and professionalism. “We’ve always kind of had the mentality of we’re never working on the car for maintenance at the track,” he said. “Our goal is to do as little work as possible to the car because it should be ready when that car rolls out of the trailer to go racing.” That mindset shows up in routines: bolt checks, tire procedures, safety equipment and a repeatable process designed to limit errors. “Once I fire the car up and put my helmet on, that’s when it’s go time,” he said. “You can plan as much as possible for how the race is going to play out, but until you take the green flag … you don’t know how it’s going to go.” Photo courtesy of Charlie Baur First-generation driver, student of the game In racing, “first-generation” matters — and Baur wears that label with pride. “A lot of the drivers are third or fourth generation,” he said. “My family has never been in motorsports. So for me, we’ve always looked at it as we’re new to it and we want to be as different as possible. From a marketing standpoint, it helps us stand out.” It also pushes him to seek out mentors — especially veteran drivers who have seen every scenario, solved every problem and won in multiple eras. Baur credits accomplished driver Jason Blonde, a 10-time champion, for becoming his driver coach and helping him develop as a competitor. “To me, learning from Jason helps me because he has had lots of success and knows what to do,” Baur said. “You have to humble yourself and say, ‘I don’t know what to do; can you help me out?’” That willingness to learn extends off the track, too. Baur says one of his biggest challenges is not a mechanical limitation, but credibility. “It’s my age,” he said. “Some people won’t take me seriously because I’m so young. Even though … I do know what we’re talking about and have a general idea.” His answer has been to out-prepare, out-communicate and treat the operation like a real enterprise — because it is. Photo courtesy of Charlie Baur Northwood’s role: Turning passion into a plan Baur is majoring in automotive aftermarket management and pursuing an accelerated path that pairs undergraduate study with graduate work. He’s also exploring how to align his studies with motorsports-focused coursework as Northwood advances related programs and pathways. He sees the value clearly: motorsports needs business-literate professionals who understand budgets, sponsorship, marketing, operations and long-term strategy — and who can translate between the language of the shop and the language of the boardroom. That’s why his Northwood experience isn’t limited to the classroom. He has been involved with the Northwood University International Auto Show and serves as motorsports chair — a leadership role that demands outreach, contracts, coordination and a steady professional demeanor. “There’s so much outside work that makes the auto show successful that people don’t realize,” he said. “And it is truly student led.” He’s also participated in industry experiences through Northwood at major events such as AAPEX, SEMA and PRI, along with other automotive networking events — opportunities he describes as a fast track to understanding how business really gets done. “You learn a lot in the classroom,” he said. “But if you learn it and you can’t apply it to the real world, it loses its value. Or if you learn it and can apply it, but you don’t know anyone, it is still of no value.” In his words, Northwood helps him win because it “gives me the tools to succeed” — including flexibility and faculty support as he balances travel and racing commitments with academics. Photo courtesy of Charlie Baur Racing as an ecosystem — and a talent gap waiting to be filled Baur is blunt about what he sees across the motorsports world: a deep bench of experienced professionals, and not enough young talent entering the pipeline. “I go to car shows, I go to these different events, and typically … the average age is between 45 to 55,” he said. “There’s not a lot of young people going into the motorsports world.” That reality reinforces Northwood’s communications focus: positioning motorsports not as a narrow lane, but as a wide ecosystem of business careers — sponsorship, logistics, data, media, leadership, hospitality and innovation — with real demand for prepared graduates. It also shapes how Baur talks to younger students who love racing but aren’t sure what their future looks like. “If you have a passion for motorsports, there’s gonna be a spot for you somewhere,” he said, emphasizing that driving is only one of many career paths — and that local tracks and hands-on experience are often the best first step. But if someone is interested in driving as a career path, it will take a team to make that happen. Baur’s team includes Stahl’s Motors and Music Experience, Rhino Racing, Randy Wise Buick GMC Chevrolet, Western Michigan Fleet Parts, Mother’s Polish, Schaeffer’s Oil, Hepfner Racing Products, Ameriguard Storage Centers, Justice Brothers, Race 1 Wraps, TBM Brakes, Behind Your Design, CharlieBaur.com and Northwood University. “There are so many people who invest not only in myself but in my race team and who believe in us to succeed,” he added. Pictured: Charlie Bauer’s sprint race car. Looking ahead: A headline worth chasing Ask Baur to imagine 2035, and he’ll give you two answers — one dream, one blueprint. “In a perfect world,” he said, “winning the Indy 500.” Realistically, he wants to build a life where business ownership and racing reinforce each other and where he can pay forward the help he has received by mentoring younger drivers, especially those trying to break into motorsports without a family legacy. “When I retire from full-time racing, I want to be able to provide the same opportunities that were presented to myself to the next generation of drivers,” Baur said. “I know how difficult it is to get your foot in the door.” For now, the focus is simple: keep building the operation, keep learning the business, and keep showing up prepared — because in sprint car racing, as in life, process matters. And once the helmet goes on? “It’s go time,” Baur said. Photo courtesy of Charlie Baur Learn more Students interested in motorsports careers — whether in competition, team operations, marketing, finance, sponsorship, data, or management — can explore opportunities through Northwood University’s Center for Automotive and Mobility Studies. For Charlie Baur’s latest motorsports adventures, follow Charlie_Baur and Charlie Baur Racing on social media. To learn more about Northwood’s Bachelor of Business Administration in Automotive and Mobility Studies and motorsports management concentration, visit www.northwood.edu/programs/automotive-mobility-studies/. Photo courtesy of Charlie Baur Pictured: Charlie Baur at Butler Motor Speedway on May 31, 2026. Share this page
Health department temporarily closes restaurant, fire destroys 12 apartments and more Flint-area news
Learn more about these stories and other Flint-area news with these local headlines from the past week.
Discover The Connection Between Science And The Science Fiction Of Project Hail Mary July 21 At Nature Center
PEEC News: Pajarito Environmental Education Center (PEEC) invites the community to dive deeper into Project Hail Mary with, “The Science of Project Hail Mary,” 7-8 p.m. Tuesday, July 21, in the Planetarium at the Los Alamos Nature Center. This light hearted presentation is sure to amuse scientists and science fiction fans alike. Learn more about […]
Luminis Health Cyberattack Reported; Investigation Ongoing
Suspect your information could have been exposed in the Luminis Health cyberattack? Learn more about the incident.
Abbott gathering real-world data on FDA-approved TriClip system
Abbott's TriClip system for tricuspid regurgitation is approved by the FDA and covered by Medicare. To learn more about its real-world performance, researchers will now track 1,000 patients for a total of five years.
The Satire, Autograph Collection | The Hotel Collection
Discover The Satire, Autograph Collection an American Express Travel Luxury Property. Learn More About The Offerings & Features of The Satire, Autograph Collection in Alexandria, Virginia US.
The Cost of Cutting American Science: How Federal Cuts Diminish Public Health Capacity
Among the federal government’s many responsibilities is the work it does to protect public health. Federal agencies monitor our food supply to ensure safety, conduct research to better understand emerging health threats, provide funding for public health programs in communities and work to detect and respond to disease outbreaks. Americans rely on these efforts every day—in a 2024 online survey, 74% of respondents said that “if the federal government issued safety guidance about food you eat regularly,” they would follow it. Changes to Federal Public Health Capacity The Trump administration’s efforts to reshape the federal government have resulted in significant impacts on our nation’s public health capacity over the past 20 months, affecting the response to health concerns such as measles, Ebola and cyclosporiasis. Agencies with core public health, food safety and disease prevention responsibilities experienced large workforce decreases during the first year of the administration. At the Centers for Disease Control and Prevention, for instance, the workforce in February 2026 was 26.7% smaller than in September 2024 before the start of the Trump administration. The Food and Drug Administration saw a similarly steep decline of 21.6%. Agencies such as the National Institutes of Health, Substance Abuse and Mental Health Services Administration and Food Safety and Inspection Service also experienced large workforce decreases. (function(){function e(){window.addEventListener(`message`,function(e){if(e.data[`datawrapper-height`]!==void 0){var t=document.querySelectorAll(`iframe`);for(var n in e.data[`datawrapper-height`])for(var r=0,i;i=t[r];r++)if(i.contentWindow===e.source){var a=e.data[`datawrapper-height`][n]+`px`;i.style.height=a}}})}e()})(); Changes can also be seen in crucial public health occupations. The number of federal food inspectors, for example, decreased by more than half between September 2024 and February 2026, going from 1,035 to 473. This is the lowest number of food inspectors employed by the federal government since at least 2005. By February 2026, there were also 33.3% fewer federal public health program specialists, whose work includes advising federal funding recipients on public health activities and analyzing the effectiveness of public health programs. Government’s capacity is diminished as employees with specialized knowledge and experience in protecting the public and responding to health risks depart, leaving agencies less prepared to carry out their public health missions. There also have been vacancies in critical high-level leadership positions at public health agencies, most notably at the CDC, which had a permanent Senate-confirmed director for less than a month between January 2025 and early August 2026. Although the CDC has previously been led by acting directors at the start of an administration, the nearly yearlong gap since the departure of the administration’s first permanent director in August 2025 is without precedent. As of August 2026, the FDA is also currently without a Senate-confirmed commissioner following the previous commissioner’s resignation in May 2026. Additionally, public health agencies are experiencing increased politicization of their leadership ranks. In agencies such as the CDC and Food Safety and Inspection Service, the number of individuals in the Senior Executive Service—the most senior career leaders in government—has declined significantly, while at the same time the number of political appointees has reached record levels. (function(){function e(){window.addEventListener(`message`,function(e){if(e.data[`datawrapper-height`]!==void 0){var t=document.querySelectorAll(`iframe`);for(var n in e.data[`datawrapper-height`])for(var r=0,i;i=t[r];r++)if(i.contentWindow===e.source){var a=e.data[`datawrapper-height`][n]+`px`;i.style.height=a}}})}e()})(); (function(){function e(){window.addEventListener(`message`,function(e){if(e.data[`datawrapper-height`]!==void 0){var t=document.querySelectorAll(`iframe`);for(var n in e.data[`datawrapper-height`])for(var r=0,i;i=t[r];r++)if(i.contentWindow===e.source){var a=e.data[`datawrapper-height`][n]+`px`;i.style.height=a}}})}e()})(); At the CDC, for example, the number of career SES decreased 42.9% between December 2024 and February 2026, while the number of non-Senate confirmed political appointees at the agency was six times larger than the agency’s historical average from 2009 and 2024. Knowledgeable career leaders are integral to the ability of public health agencies to carry out their work with scientific integrity and professional judgment, and rapid leadership turnover and increased politicization threaten agencies’ ability to make evidence-based decisions to protect our health. The upheaval and politicization in public health agencies have also negatively affected employee engagement. Strong employee engagement is crucial to the ability of agencies to carry out their mission and successfully provide essential services to the public. In the 2025 Public Service Viewpoint Survey conducted by the Partnership for Public Service, the Department of Health and Human Services—which encompasses major public health agencies such as the CDC and FDA—had an employee engagement and satisfaction score of 20.4 out of 100, one of the lowest among large agencies. Only 2.8% of HHS employees indicated trust in their political leaders and only 8.7% reported confidence that they could report a suspected violation of law or regulation without retaliation. Employees at HHS also reported that the agency’s ability to provide services to the public had suffered. Nearly half of employees at HHS, 47.5%, said their work unit was worse at delivering quality services compared to its performance in 2024. In addition, 57.8% said their work unit was performing worse at fulfilling stakeholder needs. In addition to the work done within federal agencies, the federal government also distributes significant funding for public health and disease prevention work to state and local governments, nonprofits and small businesses—funding which has been significantly disrupted. At the CDC, for example, there was a 71.9% decrease in the amount of project grant funding issued in fiscal year 2025 compared to fiscal year 2024. The FDA also issued far less funding in fiscal year 2025—a 21.3% decrease from its fiscal year 2024 funding. Changes in federal funding include the ending of grants to community organizations that worked on HIV prevention and the cancellation of funding for research into improvements to patient safety and healthcare quality. These changes go beyond federal agencies to impact the broader public health ecosystem, including the state and local health departments responsible for much of the on-the-ground public health work in their communities. About 80% of the CDC’s domestic funding is directed towards state and local partners—meaning that cuts to CDC funding can ultimately result in cuts to state and local public health capacity. Federal agencies also provide expertise and assistance to state and local health agencies as they deal with particular health challenges, but workforce cuts have resulted in fewer federal employees available to help. The Impact of Changes to Public Health Capacity These changes to federal public health capacity are not abstract concerns. Disrupted programs, reduced funding and lost expertise at public health agencies across all levels of government threaten the public’s physical well-being and safety. In some cases, this has already led to harm. The most immediate impacts of federal cuts were seen in interruptions to ongoing public health programs and crisis responses. In one instance, when CDC grants were canceled during the 2025 Texas measles outbreak—the most severe measles outbreak in 25 years—public health officials in Lubbock, Texas were forced to pause parts of their measles response work supported by the frozen funding. Lubbock’s director of public health further said that a lack of available CDC experts to reach out to for advice “definitely” impacted the department’s response to the measles crisis. Cuts to federal funding also forced Dallas County Health and Human Services to cut staff and cancel 50 community vaccination clinics during the outbreak. Public health work outside of major outbreak responses was also disrupted. For example, in April 2025, the Milwaukee Public Health Department was unexpectedly unable to reach experts on lead poisoning due to firings at the CDC when responding to concerns about lead contamination in Milwaukee public schools. Due to federal workforce cuts, several programs at the CDC, including Alzheimer’s and epilepsy programs, have also become trapped in limbo—existing on paper, but without the staff necessary to operate. More recent crises reveal how federal cuts have weakened the public health infrastructure needed to prevent and respond to dangerous new outbreaks. Internationally, cuts at the U.S. Agency for International Development eliminated funding for disease testing and contact tracing abroad, which delayed detection of and responses to the 2026 Ebola outbreak in the Democratic Republic of Congo. While international outbreaks may seem far removed, the unchecked spread of disease in any country can quickly pose a danger to economic well-being, security and health around the world. Within the United States, public health cuts inhibited responses to the summer 2026 outbreak of the food-borne parasite cyclospora. At the federal level, cuts to funding for lab equipment and for CDC staff with expertise in parasitic infections—including 9 out of 11 staff members at the lab responsible for identifying parasitic outbreaks in 2025— contributed to the largest reporting delay in outbreak cases at the CDC in 15 years. Conflicting communications from the FDA about the source of the outbreak, which followed cuts to the agency’s communications department, additionally led to confusion among the public about how to best avoid infection. At the same time, cuts to HHS funding and support for local and state public health slowed some health departments’ responses to the crisis. The exact costs of these delays, constraints and confusion in public health responses are difficult to estimate. However, their message is clear: federal cuts have already made containing threats to public health even more of a challenge. Conclusion Protecting public health—from food safety to disease prevention—is one of the federal government’s most important missions. Dramatic and haphazard cuts to federal agencies and funding have already disrupted the public health system, impacting the response to challenges such as measles, lead poisoning and cyclosporiasis. The U.S. public health system needed improvement before these disruptions. Since 2022, federal leadership and coordination in response to public health outbreaks has been on the Government Accountability Office’s High-Risk List of areas in need of attention to improve government effectiveness and efficiency. Recent cuts only compound these concerns. The chaotic dismantling of government and resulting disruptions to crucial functions like public health and disease prevention highlight the need for meaningful reform and concrete policy proposals to reimagine how government can better serve the public and be more effective, responsive and accountable. To learn more about the impact of federal cuts to public health and science more broadly, visit The Cost of Cutting American Science. Learn more For more information on the Partnership for Public Service’s government reform initiative, visit Government for a New Era. View here In line with The Cost of Cutting American Science, federal workforce data in this brief is as of February 2026
Column: Learn more about Iowa’s environmental health risks
Iowa has the second-highest cancer incidence rate in the nation. No single factor can be blamed. But scientists increasingly recognize that environmental exposures, including contaminants in our water, deserve serious scrutiny.
Minecraft Dungeons II Gameplay Trailer
Discover the Sift, a mysterious new dimension in Minecraft Dungeons II. Watch the latest gameplay trailer, explore strange new landscapes, face powerful threats, and learn more about the biggest Minecraft Dungeons adventure yet. Pre-order now before launch on September 29.
Kitchen workshops stress dairy’s role in health
Learn more about Kitchen workshops stress dairy’s role in health, News and College of Health Sciences. Texas Woman's University (TWU) is the nation's largest un
Navigating the American Dream: How Integrated Financial Tools, Credit and Rewards Can Help Small Businesses Succeed
(Feature Impact) Owning a small business has been a cornerstone of the “American Dream” for generations. It represents the chance to transform a passion into a livelihood and legacy. However, turning dreams into reality is rarely a smooth or easy process and requires more than ambition alone. Today’s business owners need support and access to tools that enable them to overcome challenges and keep growing.#placement_678081_0_i{width:100%;margin:0 auto;}var rnd = window.rnd || Math.floor(Math.random()*10e6);var pid678081 = window.pid678081 || rnd;var plc678081 = window.plc678081 || 0;var abkw = window.abkw || '';var absrc = 'https://ads.empowerlocal.co/adserve/;ID=181918;size=0x0;setID=678081;type=js;sw='+screen.width+';sh='+screen.height+';spr='+window.devicePixelRatio+';kw='+abkw+';pid='+pid678081+';place='+(plc678081++)+';rnd='+rnd+';click=CLICK_MACRO_PLACEHOLDER';var _absrc = absrc.split("type=js"); absrc = _absrc[0] + 'type=js;referrer=' + encodeURIComponent(document.location.href) + _absrc[1];document.write('');Recent research conducted by the Capital One Insights Center shows 75% of more than 1,000 surveyed small business owners with more than one employee and annual revenues of up to $20 million are confident about the future, and 69% believe their business is actively primed for growth.While this optimism is promising, 47% of business owners still said their operations either stayed the same or became less efficient over the past year, citing issues like back-office friction and fragmented financial systems that make it difficult to get a clear picture of the health of their businesses.If you’re a small business owner eager to grow but not sure how to get there, start with this advice from real small business owners and experts at Capital One.Identify Sources of FrictionBefore you can pour effort into growth, you must understand what barriers are holding you back. Take time to look under the hood of your business to identify where time and energy is being lost.For example, you may be among the 78% of small business owners who feel stressed and uncertain about expense management – think hours spent hunting for receipts, manually entering numbers into software and reconciling accounts. Operational challenges aren’t just a hassle; they also pull attention away from important priorities like serving your customers and planning for growth. “We were focused on making as many candles as possible, especially during the busy season,” said Katie Roering, co-owner of Fontana Candle Co. “A lot of the back-office tasks like procurement, raw material purchasing, forecasting – all the really important things – were done at 3 a.m., 8 p.m. or on Saturday and Sunday, and there really just was not enough time in the day to get everything done that we needed to. We just knew as we continued to grow, we needed to streamline our processes, build out our team and keep moving forward.”Use Integrated Tools to Manage FinancesInstead of balancing 10 different tracking and analysis tools, you can turn to one-stop solutions to improve efficiency. Time gets lost when you’re forced to manually gather and interpret relevant data before you’re able to act. You need a platform that handles the busywork for you.Integrated, or “all-in-one,” financial tools – like accounting and bookkeeping platforms with automation capabilities or business credit cards featuring built-in analytical tools – allow you to easily stay on top of cash flow and day-to-day operations. For small businesses where every hour and dollar makes a difference, consolidating and automating systems can have an immediate impact. In fact, 51% of survey respondents said integrated tools have already fueled their growth.Leverage Credit Access and Rewards WiselyGrowth requires capital, so access to credit is a game-changer for many business owners, with 77% describing it as a key factor in achieving business resilience. Having funds accessible when you need them makes your business more capable of weathering storms such as equipment failures and seasonal slowdowns. It also puts the power in your hands to act when an exciting opportunity presents itself, like an inventory flash sale or the chance to advertise in a new market.Access to credit comes with another advantage: rewards. By using credit cards for your daily business expenses, you can earn cash back, points or travel rewards. Whether you redeem these to cover everyday expenses, book business trips or reinvest in the business, they can act as a bonus source of income. Learn to maximize rewards like the 84% of small business cardholders surveyed so you aren’t leaving money on the table.To learn more about how small business owners can identify obstacles, employ integrated financial tools and use credit as a tool for growth, read the full report at capitalone.com/about/insights-center.Photos courtesy of Shutterstock
Tyrella beach: How beachgoers are turning snaps into science
Scientists hope to learn more about the impact of climate change on coasts through people's photos.
Minot business leaders see economic opportunity with proposed pig iron plant
KMOT’s Joe Skurzewski met with business leaders in rural Minnesota to learn more about a proposed pig iron plant for Minot and its role in a renewed push for domestic steel production.
California Politics 360 full episode | Attorney General Rob Bonta reacts to Paramount settlement
After several states, including California, agreed to settle an antitrust case with Paramount, a federal judge wants to learn more about the settlement.
Your Back-to-School Health Checklist: Physicals, Vaccines and More | Hartford Hospital
Learn more about News Detail at hartfordhospital.org
Health: The Fight For The Health Of 9/11 First Responders
A quarter century after 9/11, the health of those who responded to the attacks continues to be affected.Some 3,000 people died across three locations that day. An estimated 400,000 people were exposed to toxic contaminants and risked physical injury in the hours and days that followed. That’s according to data from the Centers for Disease Control and Prevention.Since the dust and debris have settled, more than 96,000 have been diagnosed with physical and mental health conditions related to 9/11.In 2010, President Barack Obama signed the James Zadroga 9/11 Health and Compensation Act, establishing the World Trade Center Health Program and reopening the 9/11 Victims Compensation Fund. Today, more than 150,000 people are enrolled in the program.But that program wouldn’t exist without the advocacy of survivors and first responders who put their bodies and lives on the line following the attacks. How did that fight for care unfold?For more information about the Rutgers WTC Health Program, click here. And to learn more about applying, click here.Find more of our programs online. Listen to 1A sponsor-free by signing up for 1A+ at plus.npr.org/the1a.
6 Sleep Products That Actually Work, According to an Expert | Hartford HealthCare
Learn more about News Detail at hartfordhealthcare.org
SepticSmart Week features free webinar promoting septic maintenance, public health, water conservation and more
For SepticSmart Week, learn more about Michigan’s Septic Replacement Loan Program and a free webinar for homeowners.
Biomedical Sciences Graduate Health Professions Exploration Fair, Oct. 6
Meet with admission representatives from over 30 graduate health programs to learn more about career opportunities, education requirements, the admission process and more.
Do You Need 8 Glasses of Water a Day? 6 Health Myths Explained | Hartford HealthCare
Learn more about News Detail at hartfordhealthcare.org
Air district to detail Chevron Richmond Refinery health risk assessment
Residents in Richmond hope to learn more about the state of their air quality during a public meeting focused on the Chevron Richmond Refinery.
Biotech is Back: A Wave of Life Science Deals is Pumping Cash into the Sector
Learn more about the latest updates in legal, with expert commentary and insights from trusted attorneys from Foley Hoag LLP. Foley Hoag is a professional community of highly qualified attorneys from all over the US.
Science Kids Has Seats Available for Classes in August
During a recent interview with Sheridan Media, Science Kids Executive Director Jule Rieder said that there are available seats remaining for a couple of classes in August for 12 to 14 year-old learners. Click here to learn more about Science Kids, including registration information for the available seats in the August classes.
6 Heart Healthy Dinners You’ll Actually Want to Eat | Hartford HealthCare
Learn more about News Detail at hartfordhealthcare.org
Community-Centric Approaches to the Development of Data Centers
Learn more about the latest updates in legal, with expert commentary and insights from trusted attorneys from Foley Hoag LLP. Foley Hoag is a professional community of highly qualified attorneys from all over the US.
Caesars Entertainment, Inc. (CZR) Investigation: Bronstein, Gewirtz & Grossman, LLC Encourages Shareholders to Contact the Firm to Learn More About the Investigation
NEW YORK CITY, NY / ACCESS Newswire / August 30, 2026 / Bronstein, Gewirtz & Grossman, LLC is investigating claims on behalf of investors in Caesars Entertainment, Inc. ("Caesars" or "the Company") (NASDAQ:CZR) for potential breaches of fiduciary duty on the part of its directors and management.
8 Daily Habits to Support Your Heart, Kidney and Metabolic Health
(Feature Impact) When it comes to protecting your heart, supporting your kidney function and improving your metabolic health, you’ll find the advice for each one looks similar. That’s because your body’s systems are deeply interconnected: what affects one will have ripple effects across the others.Cardiovascular-kidney-metabolic health, or CKM health, is a perfect example. When any one of these systems is compromised, it can lead to problems with the others. Therefore, it’s not uncommon for health problems like heart disease, stroke, diabetes and kidney disease to develop or worsen simultaneously – a condition collectively known as CKM syndrome.The reverse is also true, so habits that are healthy for your heart will have a positive effect on your kidneys and metabolic system and vice versa. Consider these simple strategies that align with the American Heart Association’s Life’s Essential 8, a list of healthy steps that can improve overall health. Learn more about how these habits and health measures affect your CKM health at Heart.org.Choose Healthy Foods – Food is your body’s fuel, so fill your tank wisely. Certain types of foods can help your blood pressure, cholesterol, blood glucose and triglycerides stay within healthy ranges, while poor nutrition can push those numbers into more dangerous territory. Focus on vegetables, fruits, whole grains, plant-based proteins (e.g. beans, legumes and nuts) and lean animal proteins (e.g. seafood, skinless poultry and low-fat dairy). Drink plenty of water throughout the day and limit added sugar and salty or fatty foods.Stay Physically Active – Exercise doesn’t have to feel like a chore – in fact, some of your favorite hobbies may already count. The American Heart Association recommends aiming for 150 minutes per week of moderate physical activity like dancing, gardening or walking, moving quickly enough to elevate your heart rate and break a light sweat. Alternatively, choose 75 weekly minutes of vigorous exercise that gets you breathing hard and fast; think running, swimming, playing tennis or riding your bike on hilly terrain.Avoid Nicotine – Tobacco and other nicotine products can raise your blood pressure, damage blood vessels and increase your risk of heart attack and stroke, which are all bad news for your CKM health. If you’re currently trying to quit, you aren’t alone, so don’t be afraid to seek out support groups and resources to help.#placement_976606_0_i{width:100%;max-width:550px;margin:0 auto;}var rnd = window.rnd || Math.floor(Math.random()*10e6);var pid976606 = window.pid976606 || rnd;var plc976606 = window.plc976606 || 0;var abkw = window.abkw || '';var absrc = 'https://ads.empowerlocal.co/adserve/;ID=181918;size=0x0;setID=976606;type=js;sw='+screen.width+';sh='+screen.height+';spr='+window.devicePixelRatio+';kw='+abkw+';pid='+pid976606+';place='+(plc976606++)+';rnd='+rnd+';click=CLICK_MACRO_PLACEHOLDER';var _absrc = absrc.split("type=js"); absrc = _absrc[0] + 'type=js;referrer=' + encodeURIComponent(document.location.href) + _absrc[1];document.write('');Prioritize Healthy Sleep – Sleep gives your body a chance to rest and recover from the day, but it’s often one of the first things people sacrifice when life gets busy. Poor sleep can increase your risk for heart disease, weight gain and other issues. Aim for a solid 7-9 hours a night. Keep your bedroom cool, dark and comfortable, and do your best to limit distractions like late-night smartphone scrolling.Watch Your Blood Pressure – When your blood pressure is high, it forces your heart to work harder to pump blood through the body, which can weaken it over time. It can also damage the delicate arteries in and around the kidneys, putting CKM health further at risk. Information is power, so check your blood pressure frequently to know whether further action is needed to keep it under control.Manage Your Blood Sugar – High blood sugar can damage the kidneys, eyes, blood vessels and more, thereby increasing your chance of developing harmful CKM conditions. Controlling blood sugar is particularly important for people with diabetes. If you don’t have diabetes and still experience frequent blood sugar spikes and crashes, talk to your doctor.Control Your Cholesterol – Cholesterol comes in both “bad” (LDL) and “good” (HDL) forms, requiring a balancing act to keep your levels within a healthy range. If LDL is high and HDL is low, your risk of clogged blood vessels, heart attack and stroke are higher. Healthy levels keep blood flowing to your heart and kidneys, supporting your metabolic health in the process. See your doctor for regular bloodwork so you can monitor cholesterol changes.Maintain a Healthy Weight – Since excess body weight puts pressure on the heart, kidneys and other organs, a healthy body weight helps lower your risk of CKM syndrome. Whether you’re hoping to maintain or reduce your weight, regular exercise, healthy eating and quality sleep are all great ways to achieve your goals.
Weekend Gardener: 2026 Texas A&M Department of Horticultural Sciences Field Day
Community members are invited to learn more about the research being done in the Texas A&M Department of Horticultural Sciences Department.
Community is her lab; citizens are her scientists
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Hannah Daniels Lovely's physician assistant journey started at MSU
As a recent graduate of the University of Kentucky's Physician Assistant (UKPA) program, earning high marks along the way, Daniels Lovely said she owes much of her success in that program to the preparation and support she received at Morehead State University. To learn more about programs in MSU's College of Science & Engineering, email dsci@moreheadstate.edu or call 606-783-2626.
Comedy Shows and More at Hershey Entertainment Venues Sept. 2026
Summer concert season at Hersheypark Stadium presented by Penn State Health wraps up with one final show this month! Popular comedians also take the stage at Hershey Theatre in downtown Hershey, Pa., while hockey action returns to GIANT Center. Learn more about the events coming to our sweet destination in September down below!
MSU Vet Tech program awarded $150k NIFA-USDA grant
Morehead State University's nationally ranked veterinary technology program was recently awarded significant financial support to help it maintain its place as the #1 program of its kind in Kentucky. The National Institute of Food and Agriculture (NIFA), part of the United States Department of Agriculture (USDA), awarded MSU's vet tech program a $150,000 NIFA-USDA grant for equipment to support small and large veterinary technology education and workforce competency at MSU. Learn more about veterinary technology programs at MSU by emailing Staton at a.staton@moreheadstate.edu or calling 606-783-2328. Find out more about MSU's veterinary technology program by calling 606-783-2662.
Ag Progress Days showcases college research, AI tool and animal health updates
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When Should I Consider Medication for Anxiety? | Hartford HealthCare
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New Locations for Office of Student Support and Success, Military Science Program
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Monkeys hunt small animals when fruit is scarce
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Why Marketing Feels Harder as Your Business Grows by Nathan Tayloe
At some point, most growing businesses hit the same moment. What used to feel straightforward starts to feel more complicated. Marketing takes more effort. Results feel less predictable. What once worked consistently begins delivering mixed outcomes. It is easy to assume something is broken. In many cases, nothing is. The business has simply reached a different stage. What Worked Before Starts to Lose Its Edge Early on, growth is often driven by a few things working well at the same time: Referrals are strong The value of the offering is clear The team is aligned Decisions are made quickly Marketing, in that stage, tends to feel easier because the business itself is easier to understand. As the company grows, that simplicity fades. The audience expands. Services evolve. New people join the team. More channels are added. More decisions are made across more touchpoints. Marketing is no longer communicating one clear story. It is trying to represent a more complex business. Complexity Creates Friction That added complexity does not always show up immediately. It builds over time. Messaging starts to drift. Different parts of the business describe what they do in slightly different ways. The website no longer reflects how the company actually operates. Sales conversations evolve faster than the brand. At the same time, more activity is introduced to try to keep growth moving: New campaigns More content Additional platforms More tools and reporting The volume increases. The clarity does not always keep pace. That is when marketing starts to feel harder. It’s Not a Lack of Effort Most teams respond to this stage by doing more. More output More meetings More adjustments More experimentation That effort is not misplaced. It is often pointed in the wrong direction. When the underlying issue is a lack of alignment, more activity tends to create more noise. Results become harder to interpret. Decisions take longer. Progress feels inconsistent. From the outside, everything looks active. From the inside, it feels less certain. The Real Shift As businesses grow, marketing becomes less about execution and more about alignment. The companies that navigate this transition well tend to refocus on a few fundamentals: A clearly defined audience A strong, consistent position in the market Messaging that reflects how the business actually operates Alignment between leadership, marketing, and sales When those elements are in place, execution becomes more effective again. Marketing does not necessarily become easier, but it becomes more consistent. A Different Kind of Discipline Growth introduces more opportunity, but it also demands more discipline. What worked when the business was smaller often cannot be scaled without adjustment. The systems, messaging, and decision-making that once felt intuitive need to become more intentional. That is not a sign of failure. It is a normal part of growth. Marketing feels harder because the business has become more complex. The solution is not to outwork that complexity. It is to bring clarity to it. The companies that do that well tend to regain momentum quickly. Those who do not often stay busy without seeing the same level of progress. — Learn more about how we help organizations align strategy, brand, and execution. Visit tayloegray.com, or reach out directly at nathan@tayloegray.com.
Lactose Intolerant? These 6 Foods May Be Easier to Digest | Hartford HealthCare
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These 7 Cookout Mistakes Can Lead to Food Poisoning | Hartford HealthCare
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Sonoma Co.: County Launches Free Virtual Workshops For Student Mental Health
The Sonoma County Office of Education is hosting a series of free, virtual workshops for families and caregivers to learn more about various mental health topics that may impact students.
As Small Business Owners Retire, Worker Cooperatives Could Help Close Wealth Gap » NCRC
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Foley Hoag Ranked in India Business Law Journal List of Top Foreign Law Firms for India-Related Work
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CA Alumnus, NASA Engineer Returns for Science Night
Columbia Academy alumnus Dr. Phillip Allen is returning to campus on Tuesday, Oct. 13 as guest speaker for CA’s Science Night – and the community is invited to attend. NASA and space travel enthusiasts can attend to learn more about the recent Artemis II launch and trip around the moon. Dr. Allen served as the
Perry: Minnesota waters are full of ancient fish ― and the science behind them is pretty cool
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Inside the Art of Campaign Evolved
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Pa. election 2026: Your complete guide to the candidates for governor
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Wilmington Small Business Coalition: Building Momentum in 2026 by Heather McWhorter
This article was contributed by Lydia Thomas, UNCW CIE Program Manager. North Carolina continues to be one of the best states to start a business and in 2025, Wilmington, North Carolina earned a spot on the GoDaddy list of the top 10 most entrepreneurial cities in the U.S. While many know Wilmington as small beach town with exceptional food, lots of coffee shops, and fun, vibrant summer activities, a closer look reveals a thriving innovation economy. You’ll find startups emerging across industries including software, healthtech, bluetech, and fintech. At the core of this entrepreneurial ecosystem is the Wilmington Small Business Coalition, with small business advocates and entrepreneur support organizations (ESOs) dedicated to helping founders grow, thrive, and succeed. “No Wrong Door” Established in 2016, the Coalition was designed to make it easier for individuals and small businesses to access resources most suited to their particular needs. The Coalition is designed to have a “no wrong door” entryway into the regional startup ecosystem. Whether you are exploring a new idea sketched on the back of a napkin or leading a more established, growth-stage company, Coalition members can help connect you with the programs, funding opportunities, mentors, and resources best suited to your needs. No matter where you are in your entrepreneurial journey, any Coalition organization can help point you in the right direction. Coalition Members and Leadership Coalition members include the UNCW Center for Innovation and Entrepreneurship (UNCW CIE), AARP, Brunswick Community College Small Business Center, Cape Fear Community College Small Business Center, Cape Fear Region SCORE, Genesis Block Foundation, Network for Entrepreneurs in Wilmington (NEW), Small Business & Technology Development Center (SBTDC), Greater Wilmington Chamber of Commerce, YWCA Living the Dream Center for Entrepreneurship, Carolina Community Impact Fund (CCI Fund), Partner Community Capital, 717mkt Office Collaborative, NC Biotech, and Institute NC. In May 2026, the Coalition held its leadership elections, resulting in the selection of a new executive team. The following officers were elected to serve two-year terms: Chair: Lydia Thomas, UNCW CIE Vice Chair: Diane Lantz, CCI Fund Secretary: Aariene Hansley, Genesis Block Foundation Treasurer: Gloria Monroe, SBTDC Vision for the Wilmington Small Business Coalition In 2026, the Wilmington Small Business Coalition continues its work as a collaborative network of organizations. By connecting programs, expertise, and services across partner organizations, entrepreneurs can more easily find the right support at the right time. Rather than operating in silos, the Coalition aims to function as a unified, cohesive system of support for small businesses and entrepreneurs, ensuring that resources and expertise across partner organizations are visible and accessible. Through stronger collaboration and shared pathways, entrepreneurs can move more seamlessly from idea to startup to growth. Looking to dive into the Wilmington entrepreneurial ecosystem? Connect with any of the Coalition partners to get started! Connect with CIE To learn more about CIE and our services, programs, and events, join the CIE newsletter. You can also follow us on social media: Instagram, Facebook, LinkedIn, TikTok, or YouTube. CIE’s website is uncw.edu/cie. Heather McWhorter is the director of the UNCW Center for Innovation and Entrepreneurship (CIE). CIE supports innovation-forward start-ups and helps to build a vibrant innovation economy for all in southeast NC.
Learn More About Soil Health with SDSU Extension Webinar Series
BROOKINGS, S.D. – South Dakota State University Extension will host a series of webinars for farmers and ranchers interested in learning more about soil health....
Two URI physics professors receive NSF awards to further study science behind black holes
KINGSTON, R.I. – Oct. 6, 2026 – Black holes and their complexity continue to fascinate astrophysics researchers around the world, including those at the University of Rhode Island. Researchers are drawn to how these massive, dense concentrations of energy affect their surroundings and want to learn more about how the universe as a whole was […]
Business, builders come together for expo
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Loyal Liberals
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The business of Otis elevators
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Start your business with Chicago's free entrepreneur certificate program | ChicagoLIVE
Want to learn more about getting your business off the ground? Ivan Capifali, commissioner of the Chicago Department of Business Affairs and Consumer Protection, joins ChicagoLIVE to discuss the city's free Entrepreneur Certificate Program and how you can get involved.
Biomedical Sciences Graduate Health Professions Exploration Fair, Oct. 6
Meet with admission representatives from over 30 graduate health programs to learn more about career opportunities, education requirements, the admission process and more.
7 Foods That Sound Healthy but Really Aren’t | Hartford HealthCare
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Intel Panther Lake Teardown, 18A, BSPD, GAAFET, SemiAnalysis STEEL
Panther Lake debuts the first commercial implementation of backside power delivery (BSPDN), introduces Intel’s first iteration of gate-all-around (GAA) transistors, and showcases their advanced packaging capabilities with its Foveros-S assembly. With Panther Lake, Intel’s manufacturing arc has shifted from nebulous roadmaps to shipped silicon, a significant milestone on their long road back to competitive semiconductor manufacturing. To evaluate the extent of Intel’s comeback, we tore down Panther Lake. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Our teardown traces 18A from its four-sheet RibbonFETs (Intel’s marketing name for GAAFETs) and gate stacks through contacts, frontside and backside wiring, and the bonded carrier. We explain how these material and integration choices improve gate control and reduce resistance, while adding capacitance, thermal resistance, and process complexity. Our measurements put Panther Lake’s 18A compute logic and TSMC N3E GPU logic at similar logic density. However, 18A does not lead TSMC N3P, N2 or Samsung SF2 in peak density. Panther Lake’s CPU cores are incremental updates, and the high-end GPU still uses TSMC N3E. Panther Lake assembles one compute tile, one GPU tile, and one I/O tile atop a passive base tile using Intel’s Foveros-S advanced packaging. Both compute tile variants use Intel 18A. The Xe3 GPU options are a 4-core GT1 tile on Intel 3 and a larger 12-core GT2 tile on TSMC N3E. Both I/O tile variants use TSMC N6. [1], [2] Our analysis centers on the PTL-U compute tile, both the 4-core and 12-core GPU tiles, as well as the 12-lane I/O tile. In conventional chips, power and signal are routed through the same frontside metal stack towards the device frontend. Power rails consume scarce routing resources near the transistors, while tall via stacks carry VDD and VSS from the coarse upper wires to local rails. Backside power delivery (BSPD) moves the main power network behind the transistor layer, to the backside, separating it from frontside signal routing. We covered BSPD and its impacts in 2024. [3], [4], [5] Intel’s BSPD implementation, branded as “PowerVia”, routes power through dedicated backside metals to nano-TSVs, which connect those rails to local source/drain (S/D) contacts. Implementing that separation requires Intel to build the interconnect stacks from both sides of the wafer. The frontside comprises the M0-M14 signal stack, while the backside comprises the BM0-BM5 power stack. M0 and BM0 are closest to the transistors. The nano-TSVs connect the two sides, but Intel patterns and etches each via from the front after forming the contacts. A narrow via runs from the side of the contact deep into the silicon substrate. Intel then completes the frontside signal metal stack, bonds the wafer to a carrier, flips it and removes the original substrate until the buried via tips are exposed. The backside metal stack is then deposited directly on the revealed vias. The nano-TSV and backside-via profiles taper in opposite directions because Intel forms them from opposite sides of the wafer. The transistor structures form the FEOL. Local contacts and nano-TSVs connect them to the wiring. M0 begins the frontside interconnect stack. The silicon carrier remains attached above the frontside interconnects. It supports the device wafer during substrate removal and backside processing and remains part of the finished chip’s thermal path. PowerVia removes the main power distribution from the congested frontside metals, routing supply through shorter and wider backside wires. Its lateral landing still occupies area in the standard cell, so it recovers less cell area than a direct backside contact. [3] Nano-TSVs beside the logic devices carry VDD or VSS from the backside power network, while signal connections continue upward through the frontside metals. Backside Interconnects Samsung SF2 data is included for comparison to Panther Lake’s within this article. SF2 is the incumbent GAA foundry node but lacks BSPD, serving as a useful reference to evaluate 18A. A full teardown of Samsung’s S26 products, processed on SF2, will be shared soon.Nanosheet-cut EDS comparison. The PowerVia supply path runs from the backside Cu rails through Mo-lined W nano-TSVs to the local transistor contacts. In this cross section, the tapered connection spans roughly 150 nm from the contact level to BM0. The Ta liner confines Cu and promotes adhesion to the surrounding stack; the AlOₓ etch stop controls the next dielectric etch above the rail. Dielectric beneath the ribbons electrically separates the devices from the backside wiring and removes the conducting silicon body below the channel. [6] AlOₓ serves as an etchstop (ES), enabling endpointing and protecting the underlying layers. Low-volatility aluminum fluoride reaction products resist the fluorinated plasma, allowing a thin AlOₓ film to protect the metal while the surrounding low-k dielectric is removed. [6], [7]. While the BM0 and layers above the M1 lines show double AlOx layers, Our SMIC N+3 teardown showed single AlOₓ layers. SMIC uses a simpler local AlOₓ substack, while the remaining cap and etch sequence provide the required landing protection. So why double layers? The closely spaced AlOₓ doublets provide two protected endpoints in the etch sequence. Intel documents an AlOₓ/SiN/AlOₓ stack that explains the benefit. The main dielectric plasma etch stops on the first AlOₓ film; a selective wet clear opens that film; a second plasma etch removes the intermediate SiN and stops on the second AlOₓ film. The final wet clear exposes the metal landing surface. SiN is the intermediate dielectric in Intel’s published example. [8] The second stop protects the metal through a cap breakthrough. Wide openings can etch faster than narrow ones, and etch depth varies across the wafer. Metal under an early-clearing opening would otherwise be exposed while other openings still need more etching. Staged protection widens the process window and reduces metal erosion, corrosion and void formation. [8] TSMC documents AlN/AlOₓ/SiOC/AlOₓ above Cu, with AlN blocking Cu diffusion, and a simpler AlN/SiOC/AlOₓ variant that omits one AlOx film. [9] Levels with different opening sizes, aspect ratios, pattern densities and cap materials need different etch margins. A double AlOx stop is useful where another protected endpoint justifies the added processing. The extra film adds formation, selective opening and cleaning steps, plus another set of interfaces to control adhesion, moisture, and stress. These blanket films are opened through the existing via pattern, so each film does not require another lithography mask. AlOₓ adds parasitic capacitance when it replaces lower-k dielectric; two thin AlOₓ films can nevertheless contain less AlOₓ than one thick film. Total thickness, placement, and theintermediate dielectric determine the electrical cost. Deposition chemistry also changes AlOx permittivity and residual hydroxyl content, which can oxidize the underlying metal. [7], [8], [10], [11] The backside stack separates into relatively fine BM0-BM2 wiring near the devices and coarser BM3-BM5 power distribution. The largest pitch increase occurs between BM2 and BM3. BM0’s pitch closely matches the logic-row height, fitting local power delivery to the cell rows. Higher levels aggregate current through larger conductors: routing density becomes less important than low resistance and current capacity as the network approaches the package. This hierarchy provides wide power wiring for the power delivery network without consuming scarce frontside signal-routing resources. [3] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Frontside Interconnects Intel 18A combines Mo-lined W contacts and nano-TSVs with a separate backside Cu power network. Samsung SF2 keeps power on the frontside, using Ti-based contact interfaces and Ta-based barriers and Co liners around Cu wiring. In 18A standard-cell rows, backside power rails supply the devices through nano-TSVs within the cells, freeing frontside routing resources. Samsung’s M0 accommodates both power and signal connections. From the device toward M0, the connection runs through a Ti-based S/D interface, W contact fill, a Mo-lined W via, and the Cu M0 wire. Mo supplies a conductive nucleation and adhesion layer for W, replacing the resistive TiN liner used in conventional W integration. This increases the effective conduction volume within the feature while retaining W fill and its established polishing, cleaning and etching processes. Intel’s Mo/W patent describes this integration tradeoff. The nano-TSV uses the same Mo-lined W construction in the backside supply path. [12] The move from TiN to Mo is an incremental change. While a full Co or Mo fill can also reduce the volume lost to liners in very small features, it requires new integration schemes that increase complexity and risk. Cu remains attractive for wider wires due to its low resistance. As wires and vias shrink, the diffusion barrier consumes an increasing fraction of their cross-section. [12], [12], [14] Intel uses Co/Ru liners at M0-M1, Co at M2-M4, and Nb at M5-M9. The lower-level liners help Cu adhere and reduce void formation during trench fills. Applied Materials’ Endura has new thermal control that facilitate wetting process, so the thin film continuity is good enough that good capillary pressure will drive Cu atoms to the via bottom without voiding. Intel’s choice to use Nb is particularly interesting. Intel’s Nb patent describes a conductive diffusion barrier intended to reduce the barrier’s contribution to resistance relative to conventional Ta-based barriers, particularly at via bottoms where all current crosses the barrier. The patent pairs Nb in coarser levels with the option of lower-cost PVD processing. [15], [16] The upper metal layers support thicker barriers formed through physical vapor deposition (PVD) despite its worse coverage and uniformity. Meanwhile, the lower metal layers require thinner barriers deposited through conformal atomic layer deposition (ALD). Co/Ru adds another material interface and requires controlled deposition and Cu fill. Changing liners and barriers by metal layer allows Intel to optimize interconnect resistance, process complexity, and reliability. [15, 16] RibbonFET, Intel’s name for its gate-all-around FETs (GAAFETs), replaces the FinFET’s vertical fins with four stacked horizontal silicon nanosheets, allowing the gate to surround the channel on every side. The path to GAAFET begins with the planar transistor. A planar MOSFET places the gate above the channel between its source and drain. Pairing an NMOS with a PMOS transistor creates a CMOS inverter, in which the NMOS pulls the output low for a high input, and the PMOS pulls it high for a low input. The gate must retain electrostatic control of the channel to ensure clean switching. As gate lengths shrank, the drain began to compete with the gate for that control, increasing off-state leakage. Electrostatic control was restored through an architectural evolution that raised the channel into a vertical fin and wrapping the gate around three sides. Called “FinFET”, this new architecture packed more effective channel width into a smaller footprint. Further scaling made it harder to maintain both drive current and leakage within smaller cells, and reintroduced the same problems planar MOSFETs faced. Nanosheet GAAFETs close the fourth side by replacing the vertical fin with a stack of horizontal nanosheets, each surrounded by the gate. The tighter electrostatic control suppresses leakage at shorter gate lengths while stacking adds effective channel width within the cell footprint. In a FinFET process, channel width changes in discrete steps as designers must add or remove whole fins. Nanosheet width can instead be adjusted continuously within the process’s design rules. Wider sheets increase drive current, while narrower sheets reduce capacitance at the cost of drive current. Intel 18A uses stacks of four nanosheets each and varies their widths across logic and SRAM. At the process level, adding more sheets to each stack increases effective channel width and drive current, but complicates fabrication. RibbonFET vs MBCFET Samsung began GAAFET production in 2022 with SF3E, following with SF3 and now SF2. Its ‘MBCFET’ provides a useful structural comparison with Intel’s first RibbonFET implementation. [17] STEEL is digging deeper into SF2, used in the Exynos 2600, and TSMC’s GAAFET N2, used in Apple’s A20 Pro, in upcoming newsletter articles. We’re throwing some teasers on X. Let’s compare Samsung SF2’s MBCFET with Intel 18A’s RibbonFET. Subscribe Even to the untrained eye, Intel’s extra nanosheet is obvious. Intel stacks four ribbons to Samsung’s three. Samsung’s sheets are much wider in these fields, so both sheet count and width matter to the available channel perimeter. Sheet width also changes which silicon surfaces carry current. On conventional (001) silicon, wide nanosheets emphasize the broad top and bottom surfaces, favoring electron transport; the larger sidewall contribution in a narrow sheet favors hole transport. Thinner sheets improve gate control but increase confinement and scattering. This makes width and thickness part of the NMOS/PMOS balance, alongside strain and threshold voltage. [18], [19] GAAFET designs like 18A use different work-function-metal (WFM) stacks for NMOS and PMOS. Around each ribbon, a thin SiOx interfacial layer separates the silicon channel from the HfOx high-k dielectric, with La providing dipole tuning and the WFM wrapping the dielectric. NMOS uses a TiAl-based stack, while PMOS uses TiN WFM. W fills the remaining gate trench, providing a lower-resistivity path where the work-function layers are no longer needed. In this field, the PMOS stacks leave room for W between ribbons, while the NMOS stacks occupy more of those gaps. A silicon-based dielectric marks the P/N boundary, allowing the PMOS and NMOS gates, sharing the same gate trench, to be processed sequentially. Fast logic paths, retention circuits, and SRAM need a family of threshold options. Changing threshold without substantially changing device dimensions, capacitance or fabrication complexity is valuable. FinFET processes typically use different work-function-metal stacks. In a four-ribbon GAA stack, the narrow sheet-to-sheet gap limits how much WFM can fit around each channel. La in the gate dielectric creates interfacial dipoles at the SiOx/HfOx boundary, shifting effective work function and tuning threshold voltage. This gives Intel another control alongside its NMOS and PMOS WFM stacks. Low-threshold devices improve critical-path drive; higher thresholds reduce leakage elsewhere. Dipole tuning is especially useful in GAA because it changes threshold without consuming the narrow intersheet gap with thicker WFM. Precise control of La incorporation, diffusion and interface quality has long been a challenge, limiting viability in high volume production but is now seen from every leading-edge foundry. Intel’s patent describes depositing a dipole-forming oxide above HfOx and annealing it toward the interfacial oxide before completing the work-function and fill metals. This separates threshold tuning from the space available for metal. Newer research addresses the thermal cost: imec’s 2026 dipole-middle research inserts the shifter between two HfOx depositions, shortening the diffusion path while protecting SiOx during patterning. [20], [21]Matched-cut EDS, Intel 18A (left) vs. Samsung SF2 (right). Intel retains raised source/drain epi beneath its contacts, while Samsung recesses W deep into the epi to form a V-shaped Ti-lined interface. The deeper contact increases metal-to-semiconductor area and shortens the current path from the lower sheets, reducing contact and spreading resistance. It also removes epi volume and brings the contact etch closer to the channel ends. Retaining more epi preserves the material available for strain transfer, especially from SiGe into PMOS. These geometries balance contact access against stress engineering and etch margin. [22], [23] Samsung stacks three sheets to Intel’s four ribbons, and both processes use sheet width to tune drive strength. In our Samsung cross-sections, widths range roughly from 19 to 30 nm in the NPU rows and 37 to 50 nm in the CU cell. The Samsung nanosheets taper, with the widest sheet at the bottom and the narrowest at the top. Both processes use HfOx gate dielectric and Ti-based work-function stacks, with Al in the NMOS stack. In the Samsung devices shown here, the dielectric and WFM occupy the intersheet gaps, leaving W above the top sheet. Intel’s PMOS stack leaves more room between ribbons, and W fills those gaps while the thicker NMOS stack leaves W mainly in the upper trench. Gate-stack EDS maps. The W between Intel’s PMOS ribbons provides a conductive path close to the lower gates. Where WFM fills the entire gap, the gate still surrounds the channel, but voltage reaches it through the more resistive work-function films. Thinner WFM and dipole tuning preserve room for low-resistivity fill; Mo and Ru are alternative fill metals being developed for further scaling. [24] A masked, sequential WFM flow explains the different gate heights and inter-nanosheet fill. The proposed sequence below shows how separate NMOS and PMOS work-function steps produce that geometry. Enabled by the BSPDN process, Intel replaces the dense-logic silicon subfin with dielectric, removing the parasitic conduction path below the ribbons and reducing substrate-related capacitance. A retained silicon body as in classical, non-SOI, planar and FinFET designs needs junction and punchthrough-stop engineering to suppress leakage. Dielectric isolation makes that leakage less sensitive to the subfin doping profile but adds removal and fill steps. It also weakens the direct thermal path through silicon, making the contacts, metal stacks and package more important for heat extraction. [24], [26] Fluorine is concentrated around selected Intel device structures in the maps. WF6 is a standard precursor for W nucleation and fill, while barrier films protect adjacent dielectrics from fluorine attack. Low-fluorine W processes reduce the residual-F burden. Chloride-based precursors avoid introducing F during W deposition, but require control of chlorine attack, nucleation and fill quality. The integration target is a continuous, low-resistance W path with a thin protective liner and minimal chemical damage to the surrounding stack. [20], [27], [28] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. We measured cell height, gate pitch, metal geometry, and ribbon dimensions at the XTEM sites shown below. The tables group these dimensions by site and device polarity. Our “sheet cuts” cross the silicon channel and show the ribbons end-on. “gate cuts” run along the channel through successive gates. The 18A logic cell dimensions point to a five-track logic library while the N3E and Intel 3 cell dimensions evidence a seven-track logic library. The DDR-PHY uses wider M0 wires and much larger spacing than core logic. That trades routing density for lower wire resistance and weaker coupling between neighboring nets. The geometry suits the current delivery and coupling requirements of analog, clock, and I/O circuitry. PowerVia lets 18A combine a compact cell height with wider M0 geometry by moving the main power rails off the signal-routing tracks. That relaxes local wire scaling while preserving a small cell footprint. Cell height and gate pitch set the geometric density; pin access and routability determine how much of it a real block can use. [29] The biggest takeaway from our gate-pitch measurements is that Intel 18A compute logic and TSMC N3E GPU logic have similar density in the Bohr representative-cell model. The 18A example is 18.6% denser than the Intel 3 GPU example. Gate pitches are nearly identical across the three sites, so cell height drives most of the difference. The Bohr model combines a four-transistor NAND2 spanning three gate pitches and a 32-transistor scan flip-flop (SFF) spanning nineteen pitches, weighting their densities 60:40. The sensitivity column shows how independently changing cell height and gate pitch by ±1 nm changes the result. This compares representative cell geometries; whole-die density also depends on cell mix and placement. The 18A P-core gives M0 substantially more metal cross section than the N3E vector engine. Treating each profile as a trapezoid gives 2.63 times the area per line and 1.84 times the area after normalization by routing pitch. The larger section reduces the geometric contribution to line resistance and lowers current density for a given current. Taller and wider wires also add capacitance, so circuit delay depends on the balance of resistance and capacitance. The DDR-PHY has less metal area per routing width than the 18A core fields, while remaining above N3E. [30] Area = height × (top CD + bottom CD) / 2, including liners. Area/pitch normalizes by routing width. Taper is the symmetric sidewall angle from vertical, with the largest angle belonging to the DDR-PHY. Compute tile The measurements show how ribbon dimensions and gate-stack geometry vary across the compute tile and between NMOS and PMOS to balance channel drive, gate load and the space needed for the dielectric/WFM stack across logic, SRAM and the DDR-PHY. Width mainly changes available channel perimeter; thickness also changes electrostatic control and carrier confinement. Gate-stack thickness then determines the space left for low-resistivity fill P-core and LP E-core logic Both the P-core and LP E-core use multiple nanosheet widths. Widths are measured on high-magnification XTEMs while wider-field images demonstrate additional width choices within the LP E-core. Multiple widths are expected even within an LP E-core. Timing-critical paths, buffers and cells with different fanout need different drive strengths. The lower-magnification fields show this width diversity beyond the sites quantified in the table. L2 and L3 SRAM GAA gives SRAM designers another way to balance the pull-up (PU), pass-gate (PG), and pull-down (PD) transistors. FinFET bitcells set device strength through fin count while GAA adds nanosheet width as a sizing knob. In a 6T SRAM cell, a strong pull-down relative to the pass-gate limits read disturbance, while a strong pass-gate relative to the pull-up improves writability. During a write, the pass-gate and write driver pull the node storing “1” below the inverter trip point. During a read, the pull-down holds the node storing “0” low. Bias, threshold voltage, mismatch and assist circuitry set the remaining margin. FinFET high-current cells commonly use a PU:PG:PD fin-count pattern of 1:2:2, a device-sizing ratio rather than a current ratio. Ribbon width lets Intel balance SRAM strengths without adding whole fins. The L2 cell uses its narrowest ribbons for PU and widest for PD, improving writability and read stability respectively. Intel’s disclosed HCC operates without assist; its denser HDC uses negative-bitline write assist. Pulling the selected bitline briefly below ground increases pass-gate overdrive so it can overpower the pull-up at lower supply voltage. That buys density and low voltage writability at the cost of boosting circuitry, switching energy, and additional voltage stress that must be controlled. [31], [32] Four rectangular ribbons give the perimeter = 8 × (width + thickness), before corner rounding. PG/PU is 1.49 and PD/PG is 1.16. The L3 structures closely resemble L2 in layout and cell height. Fewer L3 nanosheet widths are tabulated because fewer high-magnification images were available. DDR PHY The DDR-PHY trades density for controlled analog behavior and reliable off-chip signaling. It contains drivers, receivers, delay circuits, and calibration logic that set drive strength, sampling time, and voltage margin. Repeated four-sheet devices with similar widths fit the use of regular transistor units for matching and programmable drive. Its wider local wiring provides room for current delivery and separation of sensitive signals, while consuming more area than a dense core-logic grid. The layout serves the memory channel’s electrical requirements as well as digital logic density. [33] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Intel 3 GPU devices Vector engine logic Intel 3’s XVE logic uses two-fin PMOS and NMOS devices with power rails in M0. Its cell height and M0 pitch give a seven-track geometry, two tracks more than the 18A logic. One-fin groups also appear among the two-fin devices. Intel 3 L2 SRAM The Intel 3 L2 SRAM uses the familiar HCC sizing pattern: one PU fin, two PG fins, and two PD fins. N3E GPU devices Vector engine logic The N3E XVE field contains repeated two-fin devices with seven-track cell geometry. N3E remains a FinFET process, giving Panther Lake a direct FinFET-to-RibbonFET comparison. N3E L2 SRAM The N3E L2 SRAM uses the same PU:PG:PD fin-count pattern of 1:2:2. Panther Lake-U follows Lunar Lake’s floorplan quite closely. Both pair 4 P-cores with 4 LP E-cores and NPU, media and display engines in similar locations. Lunar Lake also uses Xe2, the direct predecessor to Panther Lake’s Xe3 GPU. This makes Lunar Lake the most direct basis for our comparisons. Arrow Lake differs in core count and uses the older Xe-LPG GPU architecture, so we only use it where it offers a more direct component-level comparison. Compute tile Panther Lake compute-tile floorplans remain sparse even months after launch. Intel 18A’s backside metal and dielectric stack must be removed without damaging the underlying structures before a clean transistor-level floorplan can be imaged. Most published die shots hide or heavily process the background, but we are quite proud of the die shot we achieved and are excited to show the work we have done. We measured the areas of the key components on the compute tile and compared them with their Lunar Lake predecessors on TSMC N3B. These help us to capture changes in block area and compare the two chips across process nodes and designs. Our total tile areas exclude the scribe-line area. The compute-plus-GPU subtotal below uses the PTL-U compute tile and GT1 GPU; it excludes the I/O tile and passive base. Individual block areas use the boundaries marked on the floorplans The compute-plus-GPU row is recomputed from the displayed PTL-U and GT1 areas. Component rows use their stated per-region counts and are not an additive partition of the whole tile. The P-core area remains almost unchanged between Lunar Lake and Panther Lake, despite L2 capacity increasing from 2.5 MiB to 3 MiB. Arrow Lake uses the same Lion Cove core as Lunar Lake but also has a 3 MiB L2. Cougar Cove fits 20% more L2 into the same P-core area. The larger private cache keeps more of each core’s working set close to its execution units, reducing access to shared L3 and DRAM. Extra capacity adds storage leakage and lookup energy, so designers balance it against avoided lower-level accesses. The shared P-core L3 cache also shrank by 14.8%. [2] Cougar Cove combines a similar footprint with Intel’s reported power-efficiency improvements. RibbonFET’s tighter channel control reduces leakage, while PowerVia reduces supply droop and allows tighter voltage guardbands. [1] Darkmont’s four-core LP E-core cluster is 5.0% smaller than Skymont’s on Lunar Lake, with most of the reduction in its L2 regions. The 1 MiB region shrank by 8.4% and the 1.5 MiB region by 14.9%. The tag arrays also use one fewer visible row. Tags identify which memory addresses the data array holds, so rearranging them changes the cache’s layout and wiring without requiring less data capacity. [2] The LP E-cores share one L2. This pools capacity and avoids duplicating all the cache machinery, but the four cores contend for its banks and bandwidth. Their separate cluster also keeps light work away from the performance cluster and its L3, allowing that larger domain to sleep. [1], [2] Cache area includes more than the storage cells. Tags identify each line, decoders select rows, sense amplifiers read the small bitline signal, and wires connect to the banks. Splitting an array into smaller sections shortens wordlines and bitlines, improving access speed, but duplicates peripheral circuits. Panther Lake’s smaller cache regions therefore reflect the complete memory implementation, including how much of each region is devoted to storage. [34] Unlike Meteor Lake and Arrow Lake, Panther Lake has no separate SoC tile. The NPU, LP E-cores, memory controllers, PHYs, media and display engines now share the compute tile. This removes an active die and keeps CPU memory traffic on one die. The cost is moving PHY and I/O-related circuitry onto 18A: drivers, receivers and analog circuits must still meet external voltage, loading and signal-integrity requirements, so their area does not shrink like dense digital logic. [1], [2] The biggest shrink comes from the NPU, which occupies 36.9% less area. NPU 5 consolidates the same total INT8 MAC count into half as many neural compute engines. Each of the three NCEs has a larger MAC array to make the complete NCE envelope 22.6% larger than an NPU 4 engine. Consolidation also halves the number of scratchpads and SHAVE DSPs, from 12 to 6. The MAC array handles matrix multiplication and convolution, while SHAVE executes vector and custom operations that fit the array poorly. [1], [2], [35] The paired floorplans identify each NCE envelope and its scratchpad, MAC, and SHAVE regions. Each measured MAC polygon is counted once per NCE in the area accounting below. The scratchpads store weights, activations, and intermediate results near the MAC arrays, allowing repeated use without fetching them again from DRAM. Halving their number delivers the largest measured area saving but leaves less local storage for the same total MAC count. Layers that no longer fit locally require smaller working tiles or more transfers of intermediate data. The benefit depends on keeping the enlarged arrays busy while managing that tighter storage budget. [36] NPU 5 also adds native FP8. Using half the operand width of FP16 reduces storage and transfer demand, helping workloads fit the smaller local memory budget. Lower precision and format-dependent range make scaling and model validation part of deployment. Hardware activation functions further reduce work that would otherwise occupy the programmable DSPs. [1], [2] Microsoft requires an NPU to deliver at least 40 TOPS for Copilot+ PCs. Both Lunar Lake and Panther Lake meet this threshold, but Panther Lake uses significantly less silicon. GPU tiles Panther Lake is Intel’s first product with Xe3, its latest GPU architecture. It offers two different GPU tiles: a smaller GT1 tile with 4 Xe3 cores on Intel 3 and a larger GT2 tile with 12 Xe3 cores on TSMC N3E. Panther Lake allows us to compare the same GPU architecture across both Intel 3 and TSMC N3E. Wildcat Lake adds a third Xe3 implementation on Intel 18A. A future newsletter will detail Xe3 and its implementation differences across all three process nodes. GT2 scales Xe3 to a different physical layout, with render slices arranged vertically instead of GT1’s horizontal arrangement. Slice placement sets the distances to shared cache banks and the D2D interface. Those wires consume area and add delay, so scaling the number of Xe cores also requires a new balance of cache placement, routing and timing. [1] What’s immediately obvious is that the GT2 tile on TSMC N3E has much smaller Xe cores than GT1. These block areas include logic, caches, and routing. An Xe core on the GT1 tile is ~69% larger than one on Lunar Lake, and ~55% larger than one on GT2. Intel 3 therefore uses substantially more area per Xe core. The block-area gap exceeds the measured logic and SRAM density gaps, bringing routing, timing targets, cell mix, and floorplan allocation into the comparison. The measured vector/matrix engine region is almost unchanged between Lunar Lake and Panther Lake’s GT2 tile. Xe3 retains eight 512-bit vector engines and eight 2048-bit XMX engines per core. Its gains also come from feeding those engines more effectively: more resident threads hide stalls, and variable register allocation lets shaders trade registers per thread against the number of threads kept active. [1] The shared L1/SLM capacity increased by 33% from 192 KiB to 256 KiB, while its area increased only 5%, raising effective density by 27%. L1 retains reused cache lines, while software-managed SLM lets a thread group share data locally. Both reduce traffic to more distant memory. Allocating more SLM per group can also limit how many groups reside on a core at once. [1], [37] The GT1 tile carries 4 MiB of L2 against 16 MiB on the GT2 tile. GT1 divides its L2 cache into four 1 MiB banks, while GT2 uses eight 2 MiB banks. Each bank contains 128 macros, but each N3E macro stores 16 KiB, twice the Intel 3 macro’s 8 KiB capacity. The N3E macro is only 54% larger while holding twice as many bits, giving it 30% higher density: ~23.7 Mbit/mm² versus 18.3 Mbit/mm². Including bank-level circuitry, the gap widens to ~16.9 Mbit/mm² on GT2 versus ~10.4 Mbit/mm² on GT1. GT2 gains density with its macros storing more bits per unit area, and those macros occupy more of each cache bank. Larger macros spread decoder and sense-amplifier overhead across more storage, while a more compact bank layout reduces the share spent on control and routing. The compromise is longer wordlines and bitlines that carry more capacitance. [34] I/O tile Panther Lake uses two I/O tile variants, both fabricated on TSMC N6. The smaller one provides 4 PCIe 5.0 and 8 PCIe 4.0 lanes and serves lower-tier systems as well as those without a discrete GPU, while the larger one adds 8 PCIe 5.0 lanes, bringing the total to 20 lanes, for discrete-GPU connectivity. Panther Lake SKUs with the larger 10- or 12-Xe GPUs use the smaller I/O tile. [38] The smaller I/O tile adds a PCIe 4.0 block and a Thunderbolt block to Lunar Lake’s I/O layout, providing four additional PCIe 4.0 lanes and another Thunderbolt 4 port. Its repeated N6 blocks retain nearly identical areas and layouts. Reusing these proven PHYs and controllers avoids porting and requalifying external interfaces on 18A, where faster digital logic offers less benefit to circuits constrained by the off-chip link. [38] SemiAnalysis’s teardown lab (STEEL) dives deep into the world’s advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. We’re hiring technical experts from system to transistor and everywhere in between. Check out our Careers page. Panther Lake offers scalability and modularity through its disaggregated packaging that partition compute, GPU, and I/O silicon into separate tiles allowing for a suite of tile configurations. This partitioning makes the package part of Intel’s node economics as it determines how much leading-edge wafer area each product consumes, which functions can remain on other processes, and how much configuration freedom Intel can offer from a shared set of tiles. Furthermore, fabricating the compute and GPU tiles separately confines the new 18A process to the compute tile and allows graphics and I/O to use other, more established, and more cost-effective processes. For Panther Lake, the GPU and I/O tiles are assembled alongside the compute tile on a passive silicon base using Foveros-S. Intel’s current technology brief lists a nominal 36 µm pitch for Foveros-S. Through-silicon vias (TSVs) in the base connect the fine wiring above to the larger package connections below. The functional tiles sit side by side on that passive base in a 2.5D configuration. [39] Our cross-section through the compute and GPU tiles shows the package’s wiring hierarchy. Microbumps connect each active tile to the passive silicon base; its fine redistribution layer (RDL) carries the short, dense tile-to-tile links. TSVs carry connections through the base to the package substrate, which fans them out to the much coarser motherboard solder joints. The base supplies interconnect, while computation remains in the active tiles above it. [39] At the compute-tile edge, the higher-magnification inset shows a local microbump spacing of approximately 25.24 µm and a feature width of 12.33 µm. These local spacings are finer than Intel’s nominal Foveros-S value. The X-ray fields further confirm tighter neighboring bumps, consistent across every die-to-die area found on each tile. Additional X-ray analysis is offered after the paywall. Putting the memory controller beside the CPU removes the D2D transfer that CPU memory requests required in Meteor Lake and Arrow Lake. This avoids the extra transmitter, receiver, and link traversal, saving interface energy and latency. Panther Lake’s separate GPU still crosses a D2D link to reach DRAM, so its larger local caches also help contain package traffic. [1], [40] Smaller dies are less likely to contain a random fatal defect, and screening them before assembly prevents one bad tile from consuming a complete package of good silicon. Reuse also spreads design and qualification work across more products. Against those gains, Intel pays for the passive base, D2D circuits, extra bonding and test steps, and losses during assembly. Cost per working product across the portfolio captures the combined effect of wafer yield, reuse, test, and assembly. [29] Wildcat Lake packaging Intel launched Core Series 3, formerly Wildcat Lake, on 16 April 2026 for value mobile and edge systems. Wildcat Lake keeps 18A but removes the passive base and combines more functions on one die to simplify the package. The two products therefore reveal two distinct ways to commercialize the same leading-edge process. [41] Wildcat Lake’s 18A die combines up to two Cougar Cove P-cores, four Darkmont LP E-cores, two Xe3 cores and a smaller NPU. A separate platform-controller die supplies I/O, connected through UCIe, Intel’s first processor implementation of the standard. Consolidating graphics remove a tile boundary and the passive base, reducing assembly complexity for a modest-bandwidth value product. It also ties CPU and graphics scaling to the same die, giving up Panther Lake’s ability to swap in a much larger GPU. [42], [43] In July 2021, Intel CEO Pat Gelsinger set out an ambitious process roadmap aimed at regaining performance leadership by 2025, later described as five nodes in four years. Five years and one CEO later, Intel’s comeback story is not as unambiguously positive as Pat may have hoped. [44], [45] Intel once set the pace for process technology, bringing high-k metal gate technology and FinFETs into volume production years ahead of the rest of the industry. Its 22 nm FinFET process reached consumers with Ivy Bridge in 2012. [46] Intel’s integrated device manufacturing (IDM) model allowed its architects and process engineers to co-optimize products and processes. Starting with Sandy Bridge, Intel dominated x86, while AMD struggled with Bulldozer. That lead faltered at 14 nm and broke at 10 nm. Intel targeted a massive 2.7× density increase, but the node arrived years late and required several revisions before it could support Intel’s full lineup. This delay forced Intel to stretch 14 nm across six generations, while TSMC moved ahead in process technology and AMD recovered in x86. By 2019, Intel was still shipping 14 nm across most of its product stack, with its 10 nm client ramp focused on Ice Lake mobile processors. Meanwhile, TSMC was shipping N7 and N7+, and AMD’s Zen 2 compute chiplets used N7 to raise core counts and improve efficiency. Intel’s process failures were central to its decline, but unsound business decisions furthered their downward slide. Product delays compounded product mistakes, pushing client, server, and FPGA roadmaps off schedule. Several attempts to enter AI (Nervana and Gaudi) and networking (Tofino) also failed to establish lasting businesses. Intel’s recovery has focused on consumer CPUs and advanced packaging. Tiger Lake, Alder Lake, Lunar Lake and now Panther Lake have restored Intel’s consumer roadmap. On the process side, Intel 4 shipped with Meteor Lake, Intel 3 with Granite Rapids and Sierra Forest, and Intel 18A with Panther Lake. Intel has also made advanced packaging part of its foundry offering. However, Intel is still playing catch-up in servers. Several Xeon generations arrived years late and trailed contemporary AMD and Arm server CPUs in performance, efficiency, and core count. The process roadmap is back, but Intel does not hold the same process-technology leadership position it held prior to 10 nm. The introduction of gate-all-around nanosheets and backside power delivery are two of the biggest changes to transistor integration in a decade. Intel took on both changes at once: 18A paired its first RibbonFET with PowerVia in Panther Lake. Panther Lake is a substantial manufacturing milestone. Our cross-sections show how RibbonFET and PowerVia reshape local contacts and wiring, while the floorplans show where architectural consolidation and process choices save area. A sustained competitive lead depends on product performance, cost, yield, and the next implementation. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page.. 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Mochizuki et al., “Evaluation of (110) versus (001) channel orientation for improved nFET/pFET device performance trade-off in gate-all-around nanosheet technology,” in Proc. Int. Electron Devices Meeting (IEDM), Dec. 2023, pp. 1–4, doi: 10.1109/iedm45741.2023.10413854. [20] D. G. Ouellette et al., “Fabrication of gate-all-around integrated circuit structures having molybdenum nitride metal gates and gate dielectrics with a dipole layer,” U.S. Patent 12 051 698 B2, Jul. 30, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US12051698B2/en [21] imec, “Advancing the CFET-based device roadmap with novel integration modules and standard-cell architectures,” imec, 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://www.imec-int.com/en/articles/advancing-cfet-based-device-roadmap-novel-integration-modules-and-standard-cell [22] A. Reznicek, X. Miao, C. Lee, and J. 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Here’s what iPhone Duo’s new two-page PDF experience looks like
We continue to learn more about iPhone Duo’s feature set, with the latest reveal a preview of the two-page PDF viewing experience on the Duo.
8 Daily Habits to Support Your Heart, Kidney and Metabolic Health
(Feature Impact) When it comes to protecting your heart, supporting your kidney function and improving your metabolic health, you’ll find the advice for each one looks similar. That’s because your body’s systems are deeply interconnected: what affects one will have ripple effects across the others.#placement_1126610_0_i{width:100%;max-width:550px;margin:0 auto;}var rnd = window.rnd || Math.floor(Math.random()*10e6);var pid1126610 = window.pid1126610 || rnd;var plc1126610 = window.plc1126610 || 0;var abkw = window.abkw || '';var absrc = 'https://ads.empowerlocal.co/adserve/;ID=181918;size=0x0;setID=1126610;type=js;sw='+screen.width+';sh='+screen.height+';spr='+window.devicePixelRatio+';kw='+abkw+';pid='+pid1126610+';place='+(plc1126610++)+';rnd='+rnd+';click=CLICK_MACRO_PLACEHOLDER';var _absrc = absrc.split("type=js"); absrc = _absrc[0] + 'type=js;referrer=' + encodeURIComponent(document.location.href) + _absrc[1];document.write('');Cardiovascular-kidney-metabolic health, or CKM health, is a perfect example. When any one of these systems is compromised, it can lead to problems with the others. Therefore, it’s not uncommon for health problems like heart disease, stroke, diabetes and kidney disease to develop or worsen simultaneously – a condition collectively known as CKM syndrome.The reverse is also true, so habits that are healthy for your heart will have a positive effect on your kidneys and metabolic system and vice versa. Consider these simple strategies that align with the American Heart Association’s Life’s Essential 8, a list of healthy steps that can improve overall health. Learn more about how these habits and health measures affect your CKM health at Heart.org.Choose Healthy Foods – Food is your body’s fuel, so fill your tank wisely. Certain types of foods can help your blood pressure, cholesterol, blood glucose and triglycerides stay within healthy ranges, while poor nutrition can push those numbers into more dangerous territory. Focus on vegetables, fruits, whole grains, plant-based proteins (e.g. beans, legumes and nuts) and lean animal proteins (e.g. seafood, skinless poultry and low-fat dairy). Drink plenty of water throughout the day and limit added sugar and salty or fatty foods.Stay Physically Active – Exercise doesn’t have to feel like a chore – in fact, some of your favorite hobbies may already count. The American Heart Association recommends aiming for 150 minutes per week of moderate physical activity like dancing, gardening or walking, moving quickly enough to elevate your heart rate and break a light sweat. Alternatively, choose 75 weekly minutes of vigorous exercise that gets you breathing hard and fast; think running, swimming, playing tennis or riding your bike on hilly terrain.Avoid Nicotine – Tobacco and other nicotine products can raise your blood pressure, damage blood vessels and increase your risk of heart attack and stroke, which are all bad news for your CKM health. If you’re currently trying to quit, you aren’t alone, so don’t be afraid to seek out support groups and resources to help.Prioritize Healthy Sleep – Sleep gives your body a chance to rest and recover from the day, but it’s often one of the first things people sacrifice when life gets busy. Poor sleep can increase your risk for heart disease, weight gain and other issues. Aim for a solid 7-9 hours a night. Keep your bedroom cool, dark and comfortable, and do your best to limit distractions like late-night smartphone scrolling.Watch Your Blood Pressure – When your blood pressure is high, it forces your heart to work harder to pump blood through the body, which can weaken it over time. It can also damage the delicate arteries in and around the kidneys, putting CKM health further at risk. Information is power, so check your blood pressure frequently to know whether further action is needed to keep it under control.Manage Your Blood Sugar – High blood sugar can damage the kidneys, eyes, blood vessels and more, thereby increasing your chance of developing harmful CKM conditions. Controlling blood sugar is particularly important for people with diabetes. If you don’t have diabetes and still experience frequent blood sugar spikes and crashes, talk to your doctor.Control Your Cholesterol – Cholesterol comes in both “bad” (LDL) and “good” (HDL) forms, requiring a balancing act to keep your levels within a healthy range. If LDL is high and HDL is low, your risk of clogged blood vessels, heart attack and stroke are higher. Healthy levels keep blood flowing to your heart and kidneys, supporting your metabolic health in the process. See your doctor for regular bloodwork so you can monitor cholesterol changes.Maintain a Healthy Weight – Since excess body weight puts pressure on the heart, kidneys and other organs, a healthy body weight helps lower your risk of CKM syndrome. Whether you’re hoping to maintain or reduce your weight, regular exercise, healthy eating and quality sleep are all great ways to achieve your goals.
Bar Harbor Parents Again Raise Concerns About How Some Science Education In Sixth Grade.
The Bar Harbor Story is generously sponsored by Restaurant Barn. BAR HARBOR—Parents again raised concerns this week about how Bar Harbor students receive science instruction after fifth grade, months after the same issue came before the Bar Harbor School Board. The concern centers on a past scheduling change at Conners Emerson School that gives fifth graders a full year of science rather than switching between science and social studies at midyear. Principal Dr. Heather Weir Webster told the board that the school has been monitoring test scores, teacher feedback, and the experience of students as it considers whether the current approach is working. If it is not, the approach may be changed, but that would not likely occur this school year. In fifth and sixth grade, the school used to have one semester of social studies and one of science in each year. That schedule shifted because switching at midyear often broke up the learning units. So, approximately two-three years ago, they decided to shift that a bit. Science became a dedicated focus in fifth grade. Social studies was the dedicated focus in sixth grade. The school staff members are hoping to dive deeply into the data and see if the students are having a more quality experience throughout their time in those grades when it comes to science and social studies. If not, things could shift again. This year, Dr. Webster said at the September meeting, potential changes to curricula have been a bit complicated by moving into the school’s new building in late October and early November. “There have been no changes this year because it’s hard enough to handle the move. That allows them to have consistency,” Dr. Webster said. Dr. Webster said that after the Covid pandemic which prevented students from attending school in person, many fifth graders were struggling. “We tried several different configurations,” she said, including a co-teaching model to help with that struggle, but to also see how to best schedule and support those students. “We found that a January switch” where classes switched from social studies to science was really difficult. Part of the decision making stemmed from science being more hands-on and accessible to fifth graders. Social studies was a bit more abstract content, which was why the school tried the current configuration. In a letter submitted as public comment, parent Beth Dumont wrote, “In May 2026, I wrote to express my concern that our middle school students are not receiving consistent instruction in science and social studies. I appreciate that the Board took this concern seriously and requested a presentation from Principal Webster. I am also grateful for the opportunity to meet with Principal Webster and Julie Keblinsky in July to learn more about the current curriculum and scheduling. “During that meeting, I learned that the current model is intended to integrate science and social studies into other subjects during the years or semesters when they are not offered as standalone courses. “While I appreciate the intent behind this model, I remain concerned about its premise. Science and social studies are core academic disciplines that provide students with essential knowledge, skills, and ways of thinking. Yet under the current schedule, students are not guaranteed consistent instructional time in these subjects. Instead, exposure to content in these disciplines may depend on whether opportunities for integration arise within other classes. “To be clear, I strongly support interdisciplinary learning. Integrating science and social studies across the curriculum can enrich students’ educational experiences and help them make meaningful connections across subject areas. My concern is not with integration itself, but with relying on integration as a substitute for dedicated instruction in core disciplines.” Dr. Webster said that they’ve been monitoring test scores, talking to teachers, seeing how the pilot program works. It’s in its third year now of this schedule. One science teacher, she said, told her he’d seen positive outcomes with full year science and that there was a stronger classroom community. Another science teacher had concerns over the readiness last year, but she isn’t feeling that way about this year’s current class. A third teacher for social studies said he loves the full year. A fourth teacher of social studies hasn’t said that anything has changed. For the three fathers who spoke at the school committee meeting, the fractured science curriculum caused concerns. One father said that when he spoke to others, “all were surprised and confused as to why there was no dedicated, continuous science education,” at the school. Though students are testing well in science and math, he worried that without continuity in education, learning is lost. “We shouldn’t have to choose between key learning disciplines,” he said. Matthew Bergin, another father, agreed, adding, “I’m just a little concerned.” In her letter, Dumont wrote, “As the parent of a recent sixth grader who completed an entire year without a dedicated science course, I saw very little evidence that this integration was occurring in a consistent, systematic, or readily identifiable way. This is not a criticism of our middle school teachers, who have been uniformly excellent. Rather, it is a structural criticism of the current schedule.” Dr. Webster gave an update about all aspects of the schedule and how it’s created and she also spoke to social and emotional learning (SEL) in middle school. It’s explicitly taught but also embedded. Science is embedded as well and explicitly taught at all but that one grade. The school schedule is built from lunch out, then electives like art and physical education are placed, before going into the instruction time, teacher planning time, multi-tier support systems (MTSS), and then social and emotional learning. Teachers have to have 250 minutes a week of planning time per their contracts. That’s the minimum and occurs when their students are at specials. “The schedule is really not the purview of the board,” School Board Chair Marie Yarborough reminded the other board members and the public and thanked Dr. Webster for the presentation. The parents were also thanked for coming. LINK TO LEARN MORE [ ](https://barharborstory.substack.com/p/despite-strong-rankings-some-bar) [ Despite Strong Rankings, Some Bar Harbor Parents Raise Concerns About School's Science Education ](https://barharborstory.substack.com/p/despite-strong-rankings-some-bar) Carrie Jones · Jun 4 [ Read full story ](https://barharborstory.substack.com/p/despite-strong-rankings-some-bar) HELP SUPPORT THE BAR HARBOR STORY When we started The Bar Harbor Story, we didn’t know if anyone would read it. But you showed up. You shared. You sent tips. Now—over 400,000 views every month later—it’s clear: people here care about their community and each other. We’ve kept everything free because news should never be out of reach, but every one of our stories takes time to write, and your support keeps The Bar Harbor Story going. If you value our work, please consider a paid subscription, a founding membership, or a sponsorship. It truly helps us cover one more meeting, tell one more story, shine one more light. Even $5 a month makes a difference. Click here to become a one-time supporter now. Thank you so much for being here. Founding member information can be found here. Have questions about sponsorships? Just send Shaun an email at sfarrar86@gmail.com, he’d love to hear from you. Subscribe Share Bar Harbor Story Share Leave a comment
Women’s Health Innovation Summit
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Air district report links Richmond Chevron refinery emissions to elevated health risks
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Can One Drink a Day Raise Your Cancer Risk? | Hartford HealthCare
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How Americans’ Financial Health Is Faring In The “K-Shaped” Economy
Hey all, Jason here. Money20/20 is still two weeks away, but I’ve already started packing (not procrastinating for once!). My calendar is already filling up with various sessions I want to catch, meetings, and of course happy hours, dinners, and other side events. If you’ll be in Vegas and want to catch up, let me know by replying to this email, and we can try to find a time amidst the chaos of the Venetian. A big if not totally unexpected piece of news dropped on Friday: the Independent Community Bankers of America, a trade group that represents smaller U.S. banks, filed a lawsuit against the OCC and Comptroller Jonathan Gould, arguing that the regulator’s move to grant trust bank charters to firms seeking to use them to conduct substantial non-fiduciary activities exceeds the authorities granted to the OCC by Congress. I haven’t had time to fully digest the legal filing or speak to folks in my network about it, but you can expect to see coverage and analysis on it in next week’s newsletter. Subscribe or Support by Upgrading The NerdCon agenda just dropped. It’s stacked. Partner content: Nubank built an AI-first bank. Chime built its own banking core. Figure and Valon are rebuilding the mortgage stack. At NerdCon, you’ll hear from the people behind those bets: what they chose, what they learned, and what they’re still figuring out. The agenda is live, with leaders from Nubank, Chime, OpenAI, Remitly, Mercury, Figure, Valon and more. Follow the mainstage conversations, bring the problem your team is wrestling with to a hands-on workshop, or pull up a chair at a roundtable. Pick your quests. Meet us in San Diego, November 18–20. Fintech Business Weekly readers save 20% with code FBW20. Explore the Agenda Things To Know & Other Good Reads Federal Reserve Board finalizes changes to enhance the transparency and public accountability of its stress test and reduce volatility in its stress test-related capital requirements (Federal Reserve Board of Governors) FDIC Announces Conclusion of Independent Monitorship (FDIC) Modernizing Financial Regulation: Initial Observations from eSLR (Fed Vice Chair for Supervision Michelle Bowman) The Data Version of Godzilla versus Kong: FRED Takes on AI (Fed Governor Christopher Waller) Financing the AI buildout (Brookings) Q3’26: Rules for Banks but Not for Crypto (Fintech Takes Banking) The Inevitability of Local Stablecoins (Lombard Notes) Delusions of AI Governance: The Human-in-the-Loop Comfort Blanket (Fintech Snark Tank) Stripe agrees to acquire Parafin to expand revenue opportunities for platforms and help small businesses grow (Stripe) Listen: Fighting Fraud in the Age of AI, with SEON’s Tamas Kadar (Fintech Business Weekly) How Americans’ Financial Health Is Faring In The “K-Shaped” Economy If there is one overarching theme across the economy and politics in the U.S. at the moment, it’s “affordability.” The term is vague enough to encompass a panoply of factors shaping Americans’ day-to-day lives: rising costs for the hallmarks of being “middle class,” including healthcare, housing, childcare, and education, inflation and rising interest rates, and a job market with the specter of AI hovering over it. At the same time, policy shifts under the Trump administration have resulted in reduced subsidies to those who get health insurance under the Affordable Care Act and new restrictions on qualifying for Medicaid and SNAP, the impacts of which have yet to be fully felt. These factors are contributing to declining consumer confidence and general dissatisfaction with the economy, despite continuing GDP growth and stock market records. This divergence is encapsulated in the idea of the “K-shaped” economy, in which a small proportion of Americans have seen their wealth balloon, while the majority of American households struggle to preserve the lifestyle they have. Perhaps the greatest determinant of which branch of the “K” a household is on is whether their wealth and income are primarily derived from employment vs. from assets. Nearly two decades of low interest rates and, more recently, elevated rates of inflation have benefited asset owners, while those whose income is primarily or solely derived from labor have largely seen real purchasing power stagnate or decline. This is reflected in recent Bureau of Labor Statistics data showing that labor share of U.S. GDP — the fraction of economic output that accrues to workers as compensation in exchange for their labor — dropped to just 52.8% in Q2 2026, the lowest since the BLS began keeping records. In 1947, approximately 2/3rds of economic output accrued to workers; even as recently as 2001, labor’s share of GDP was 64.1%. Against this backdrop, we’ve seen the rise of more credit and credit-like products: cash advance apps, “no-fee” overdraft, earned wage access, and buy now pay later, which are often used as small-dollar short-term borrowing mechanisms to meet immediate consumption needs or pay other bills (eg utilities, cell phone, other debt payments). With the markers of a middle class existence and, increasingly, basic financial stability seemingly out of reach for many, it should be no surprise there’s been an increase in “financial nihilism,” something industry peers like Alex Johnson and Frank Rotman have discussed and analyzed the roots of. The explosion of gambling and gambling-adjacent products and services — often marketed under the guise of being an “investment” — is inextricably intertwined with the rise of financial nihilism. Crypto, sports betting, and, more recently, prediction markets offer an escape or even hope of sorts, like a contemporary, digital version of a scratch-off lottery ticket, while leaving the overwhelming number of people who use such products worse off. Share of Households That Are Financially “Vulnerable” Ticks Up The Financial Health Network’s 2026 Financial Health Pulse® report adds context on how American households are faring. (I linked to this report in last week’s newsletter, but wanted to take time to further unpack the data in the report this week.) The Financial Health Network publishes the report annually, providing insight into how Americans’ financial circumstances are changing over time. The 2026 report is derived from a survey fielded in April and May 2026. The report leverages survey responses to assess indicators of financial health across spending, saving, borrowing, and planning/protecting and to determine a zero to 100 “FinHealth” score. Those with scores between 0 and 39 are considered “Financially Vulnerable,” consumers with scores ranging between 40 and 79 are defined as “Financially Coping,” and those with scores of 80 to 100 are “Financially Healthy.” The report found that moderate improvements in 2025 were reversed, with the share of respondents considered financially “vulnerable” rebounding to 17%. The longitudinal data reflect the impact of pandemic-era programs, like expanded unemployment, cash stimulus payments, and pauses of federal student loan payments. The positive impacts of those programs, as reflected in the Financial Health Pulse reports, had largely disappeared by 2023. While pandemic-era inflation — to be fair, in part caused by the various support and stimulus measures — had come down from as high as 9% in 2022, it has rebounded since the start of Trump’s second term, with tariffs and energy market disruptions owing to the war in Iran pushing prices back up. Specific indicators in the survey that deteriorated from 2025 to 2026 include the share of respondents spending less than their income over the past 12 months, the share paying all bills on time over the past 12 months, the share that have a manageable amount or no debt, the share that are “moderately” or “very” confident their insurance is adequate to cover them in an emergency, and the share that “somewhat” or “strongly” agree that their household plans ahead financially. Unsurprisingly, lower- and moderate-income households are more likely to struggle to pay their bills on time and have any funds leftover to save. The share of low-income households whose income exceeded their spending dropped from 35% in 2025 to 31% in 2026, while the share of upper-income households whose income exceeded expenses remained unchanged at 63%. Households with student loans or revolving credit card debt reported having “a bit more” or “far more” debt than was manageable at rates far higher than those not carrying these types of debts. The share of those with student loan debt indicating their debt load was too high to manage increased from 50% in 2025 to 55% in 2026, while the share of those with revolving credit card debt saying the same ticked up from 51% in 2025 to 54% in 2026. Households that had student loans were markedly more likely to be financially “coping” or “vulnerable” vs. those without student loans. In 2026, 27% of households with student loans were considered financially vulnerable, a jump of 6% points vs. 2025. Households without student loans saw just a 1% point increase (not statistically significant) in those considered financially vulnerable. Households’ perception of the affordability of categories of goods and services paints a stark picture, with less than one-fourth considering higher education affordable, about a third deeming childcare affordable, and less than half viewing healthcare as affordable. Fintech Business Weekly is made possible by the generous support of paying subscribers — bringing you independent analysis of banking, fintech, and crypto without fear or favor. You can support my work by becoming a paying subscriber if you aren’t already. Paying subscribers enjoy: access to the entire archive of nearly six years of newsletters extended versions of the weekly newsletter, with additional content and analysis and (for founding member tier) quarterly personal 1:1 fintech Q&A / strategy calls with me, tapping into my unparalleled knowledge of the intersection of banking and fintech and experience working in the sector, including helping to launch Goldman Sachs’ retail bank Marcus Support Fintech Business Weekly You can also support Fintech Business Weekly by sponsoring a newsletter or podcast, putting you in front of 93,000+ of the most influential decision makers in banking, fintech, and crypto. Learn more about sponsor opportunities or request a media kit by dropping me an email. Democratic Senate Report Highlights How Iran Uses Tether to Evade U.S. Sanctions Iran uses stablecoins, specifically Tether, to evade sanctions, fund regional proxies, and to purchase military drones, a report released last week by the Senate Permanent Subcommittee on Investigations says. The report was authored by committee ranking member Senator Richard Blumenthal (D-CT) and the minority staff. Crypto and stablecoin proponents will often push back on criticism that criminals make use of these assets by arguing that, on an absolute dollar basis, far more illicit funds flow through traditional banking systems and payment rails than via crypto and stablecoins. And while that is likely true, it elides the reality presented in news story after news story: whether state actors — Russia, Iran, North Korea — or criminal groups, those looking to engage in illicit transactions increasingly favor stablecoins and, specifically, Tether (USDT). The report from the Senate Permanent Subcommittee on Investigations released last week adds context to how Iran uses Tether has a lynchpin in its shadow banking system. The report analyzed 846 wallets that have been sanctioned or targeted for seizure, finding that 84% of them transacted exclusively or primarily in Tether. The ability to create near limitless, anonymous wallets and to move funds effectively instantaneously and irreversibly have made crypto a favored financial mechanism for bad actors. Stablecoins solved key drawbacks of bitcoin, namely, the original cryptocurrency’s highly volatile value in dollars. And while Tether (the company) has the technical ability to “freeze” or destroy funds, the company is often limited and reactive in its approach to doing so, the Senate report argues. Tether, which is nominally based in crypto-friendly El Salvador, “has stated that its compliance with OFAC sanctions is ‘voluntary’ and that it follows ‘OFAC guidelines,’” the Senate report says. Owing to these favorable attributes, Tether “became a primary cryptocurrency for Iran, Hamas, Hizballah, and the Houthis beginning in 2023 and has expanded in scale since,” according to the report. Tether’s role in Iran’s shadow banking system, the report says, is enhanced by crypto exchanges like Bybit, Kyrrex, OKX, Gate, and Binance, and through “over the counter” exchanges and hawala networks. The consequences of these financial flows aren’t hypothetical. The Senate report links Tether as a funds transfer mechanism to Iranian proxies in the region, including Hizballah, the Houthis, and Hamas. Tether has also been used to make payments to secure components necessary to manufacture drones, the report says. The report concludes by arguing that “[s]tablecoin issuers with a significant nexus to the United States, particularly those that offer dollar-denominated stablecoins, should be subject to American sanctions law rather than being allowed to hide behind foreign jurisdictions.” Stablecoin issuers like Tether must be held accountable for repeated failures to prevent illicit finance and sanctions violations by law enforcement, the Department of Justice, the Securities and Exchange Commission, and OFAC, the report argues. [Paying Subscriber Exclusive] OUSD Goes Live, Make Your Own Neobank, U.S. Sanctions Russia’s A7 Network As “Transnational Criminal Organization” OpenUSD, the stablecoin issued by the Open Standard consortium that includes Stripe, Visa, Mastercard, core providers, crypto firms, and numerous banks, went live last week. Social commerce platform Whop raised eyebrows in fintech by offering creators on its platform the ability to launch their own neobanks, which the company describes as “great businesses that are easy to run,” in just 15 minutes. And OFAC and FinCEN target Russia’s “shadow banking” A7 Network — more on these stories after the paywall.
Is SMIC N+3’s Metal Pitch Smaller than Intel 18A’s?
Almost four years ago, we published that SMIC had started shipping 7 nm (N+1) chips. Now, SMIC is shipping its third-generation 7 nm (N+3) process in Huawei’s Kirin 9030, with a minimum metal pitch of 32.5 nm, about 10% tighter than the 36 nm minimum metal pitch shipping in Intel’s latest Panther Lake CPUs on 18A. The headline is true, but incomplete cherry picked metric. N+3 reaches the density of TSMC N6 through aggressive DUV multi-patterning and design-technology co-optimization (DTCO), but it pays for that in complexity, efficiency and process control. We found this and more in our reverse engineering and teardown where we cover SMIC’s N3 process technology, Huawei’s packaging, memory, architecture, and more. SemiAnalysis has been building a state-of-the-art teardown lab in Oregon capable of analyzing the world’s most advanced and important chips over the last year and half. We have already generated revenue on advanced datacenter chip teardowns including our recent reverse engineering of a major TSMC customer’s COUPE CPO optical engine + EIC 3D stack. This is the first public report from the SemiAnalysis Teardown Engineering & Evaluation Lab, or STEEL for short. The lab is aggressively scaling up and out and we’re excited to announce it publicly. This is a bit of inconvenient timing for TechInsights as they are private equity owned and currently being sold while having enjoyed virtually no credible competition for decades. This has led to TechInsights underinvesting in CAPEX. SemiAnalysis exceeds TechInsights in revenue despite no venture or private equity ownership and being founded only 6 years ago. Because we have no external investors and are founder led, we move faster, build faster, and we can release client chip teardowns for free regularly, while focusing on datacenter for our major clients. Here’s the first public image from our lab, the HiSilicon Kirin 9030 Pro SoC: This report will detail our teardown of the Kirin 9030 and our findings on SMIC’s N+3 process, the most advanced in China. For comparison, we’ll show our teardown of the MediaTek Helio G99, made on TSMC N6. Through this comparison, we can look at the effect of export controls – SMIC N+3 and TSMC N6 are comparable nodes, but one is heavily export-controlled, the other free to use the West’s most advanced equipment. Here we see both China’s progress and constraints. SMIC N+3 reaches TSMC N6-class logic density, but it requires far more aggressive DUV multi-patterning, so it does not match N6 on process maturity or cost. The Kirin 9030 Pro performs similarly to three-year-old Android flagships, and trails far behind the current flagship SoCs from Apple, Qualcomm, MediaTek, and Samsung. The efficiency gap is even wider. Export controls have not stopped Huawei and SMIC from shipping advanced silicon, but they have forced a different path. Without EUV, SMIC is leaning harder on DUV multi-patterning, DTCO, and increasingly complex integration. The roadmap continues forward through tighter design rules and backside power, but each step adds cost and process risk. Huawei’s τ scaling and LogicFolding show another path: stacking active logic and recovering density through advanced packaging and system-technology co-optimization (STCO). To understand the Kirin 9030, we must first understand Huawei’s SoC history. HiSilicon is Huawei’s chip design arm, responsible for the Kirin smartphone SoCs, Kunpeng server CPUs, Ascend AI accelerators, and switch/router networking silicon. Before export controls, Huawei was TSMC’s largest customer – the only customer on TSMC’s first EUV node, N7+, and among the first on N5, alongside Apple. That ended in late 2020. Huawei switched to Qualcomm SoCs in its flagship smartphones, though export controls limited them to 4G-only variants. In late 2023, Huawei returned to in-house silicon with the Kirin 9000s, a successor to the Kirin 9000, fabricated on SMIC N+2 instead of TSMC N5. In the following years, they released the Kirin 9010 and 9020 on the same N+2 process. These chips used Huawei’s in-house TaiShan CPU cores and Maleoon GPU. We have not torn down a Kirin 9020 ourselves, so the predecessor die shot is from Kurnal. The die shots show how Huawei spent its silicon budget: which functional blocks are where, and how their areas compare to the predecessor. First, a quick guide to the major blocks on the die. The total die area is nearly identical, but the 9030 uses that area more aggressively. A denser process lets Huawei fit an extra middle CPU core, more GPU and NPU cores, and larger caches into the same footprint. In contrast, the Helio G99 is a much smaller, low-cost SoC, built for budget smartphones rather than a flagship device. While the Kirin 9030 is ~140 mm², the G99 is only ~29 mm², roughly one-fifth the area. The underlying TSMC process technology, however, is directly comparable as a baseline for analyzing SMIC’s. The Kirin 9030 is an evolutionary refresh, not a clean-sheet design. Its CPU, GPU and NPU cores carry over the 9020’s families, and the gains come from three levers: the SMIC N+2-to-N+3 process step, DTCO and floorplan work, and incremental microarchitecture. Area is where the first two show up, and the 9030 scales well here. Performance and efficiency are the harder test. Huawei’s design holds up better than its node would suggest, but the chip still trails, both because N+3 sits behind the leading-edge nodes and because its cores, while competent, remain a few generations behind the newest designs. The new prime core is an incremental update. The main changes are a 10% frequency increase from 2.5 GHz to 2.75 GHz and a doubling in the L2 cache from 1 MiB to 2 MiB. Despite the increased cache, the core size decreased by 7.6%. Excluding the private L2 cache, the core size decreased by 21%. This is a large reduction for an incremental node. Compared with the TaiShan New V120 core in the Kirin 9020, the Kirin 9030’s middle core is almost unchanged architecturally, yet each core shrinks by ~22%. Most of that comes from the move from N+2 to N+3, with layout likely accounting for the rest. Visually, the most noticeable change is the increase from 3 middle cores to 4. There is also a 20% increase in the shared L3 cache of the big cluster. This helps to improve multi-core performance without sacrificing much in terms of area. Even with each core shrinking, the big CPU cluster’s total area is essentially unchanged. The per-core savings went back into an additional middle core and larger caches. The tiny cores shrank less than the prime core (excluding its L2 cache) and less than the middle cores. This is likely because fixed overhead is a larger share on a small core. We cannot resolve any architectural changes from the die shot alone, but the per-clock and efficiency gains shown below point to more than pure process and layout scaling. The area reduction was offset by a doubling of the shared L2 cache from 2 MiB to 4 MiB, leaving the total tiny CPU cluster area slightly larger. Area is the easiest improvement to see from a die shot, but it is only one part of PPA (power, performance, area). For modern logic, power and performance matter just as much, and often more. Since Dennard scaling broke down in the mid-2000s, voltage and frequency have not scaled in step with transistor dimensions, so each node has had to fight harder for gains in performance and efficiency. The starkest comparison is not Kirin 9020 versus Kirin 9030 Pro. Apple’s efficiency cores run circles around Huawei’s prime core. Apple’s low-power core delivers 20% higher integer performance while drawing only 1 W, compared with 4.5 W for Huawei’s prime core. N+3 matches TSMC N6, but N6 is several generations old. Apple and Qualcomm build on N4 and N3P, which are denser and sit on a better voltage-frequency curve, giving them a larger transistor budget and more performance per watt. The 9030’s own cores did improve. The middle and tiny cores gained 17% and 14% in per-clock integer performance over the 9020, with floating-point flat on the middle core and up 11% on the tiny. The tiny core improves cleanly, with performance rising while power falls and efficiency increases by 45% in integer and 24% in floating point. The middle core is mixed: integer performance rises but power rises faster, cutting integer efficiency by 7%, while lower power lifts floating-point efficiency 16%. Per-clock gains at the same or lower frequency are microarchitectural, so the cores are tuned, not just shrunk. Both also failed to hold their rated maximum frequencies, pointing to thermal, power, or stability limits. Per clock, the middle core sits around Arm Cortex-A720 and the tiny core near the Cortex-A520; absolute performance trails because Huawei clocks them much lower. The prime core is roughly Cortex-X2 class per clock, a 2021 design. Apple’s 2020 M1 Firestorm core is still 35% higher per clock and 57% faster in absolute integer performance at a similar 4.5 W. The current leading edge is further ahead again: the Apple M5 P-core is 60% higher per clock and 2.7× faster, the Arm C1 Ultra 45% higher and 2× faster. Matching older high-end cores per clock is a genuine design achievement. What Huawei cannot match is the voltage-frequency curve and transistor budget of leading-edge nodes, which let Apple, Qualcomm and others spend more transistors in the same area on wider cores, larger caches and deeper buffers while running at lower voltage. Huawei’s LogicFolding roadmap is one answer, stacking active logic to recover density and shorten signal paths. We return to it later. The GPU compute units (CUs) changed more visibly than the CPU cores, moving to a more rectangular layout for both the arithmetic logic unit (ALU) clusters and the CU overall. Even with ray-tracing support added, a CU shrank ~28%. However, that shrink is offset by the increase from 4 to 6 CUs and the area outside the CUs grew 33%. Overall, the GPU cluster is larger by ~10%. The GPU is where Huawei makes its biggest gains. The Maleoon 935 is not competitive with current flagships, but it is a large step up from the 920 and reaches older-flagship territory. In 3DMark it is 70% faster in Wild Life Extreme (WLE) and 79% faster in Steel Nomad Light (SNL) than the 920; with 11% higher clocks and 50% more CUs, the ~67% theoretical uplift roughly matches WLE and is beaten by SNL. It edges ahead of the Snapdragon 8+ Gen 1 in WLE and SNL, and the Dimensity 9200 and Apple A16 in WLE, but stays far behind newer parts: the Snapdragon 8 Elite Gen 5 and Dimensity 9500 are ~2.4–2.6× faster in WLE and ~3.2× faster in SNL. The Maleoon 935 is Huawei’s first GPU with hardware-accelerated ray tracing; there it lands slightly ahead of the Exynos 2200, and on par with the Apple A16, with current flagships up to 3.7× faster. The Neural Processing Unit (NPU) saw the largest structural changes of any block, moving from a Lite and a Tiny core in the Kirin 9020 to a Lite and two Tiny cores in the Kirin 9030. Both core types also show significant layout changes. This is a reversal in Huawei’s NPU design. The Kirin 9000 5G, its last flagship chip on TSMC N5, used two Lite and one Tiny core. The series of SoCs on SMIC N+2 moved to one Lite and one Tiny core, likely for area savings. With the Kirin 9030, Huawei has shifted back toward a larger multi-core NPU cluster, but with the additional area going to a Tiny core rather than a Lite core. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Before diving into the process stack, the package and memory are worth separating from the SoC itself. The Pro variant of the Kirin 9030 carries 12 GB of Samsung DRAM, with two stacks of four dies each. The dies were identified as the K4L2E165YD, a 12 Gb LPDDR5X-9600 device fabricated on Samsung’s 1a node, the fourth generation of its 10 nm-class DRAM after 1x, 1y and 1z. 1a has shipped in volume since 2022, so this is current memory rather than older-node inventory. The 16 GB Pro Max variants we obtained were found with both CXMT and Samsung packages. The CXMT package is marked CXDD7JEDM, with two stacks of four dies, packaged in week 45 of 2025. The inferred die dimensions from X-ray computed tomography (CT) are consistent with a known density of ~0.3 Gib/mm² for the CXMT G4 process, roughly equivalent to other manufacturers’ 1z processes. The Kirin 9030 uses a typical integrated package-on-package (iPoP) stack: multiple DRAM dies in a memory package sit above an organic redistribution layer (RDL) interposer, which sits above the SoC and package substrate. The full package is then mounted to the printed circuit board (PCB) through ball-grid array (BGA) solder bumps. The memory package substrate is a thin bismaleimide-triazine (BT) laminate carrying the LPDDR5X stack. The organic RDL interposer over the SoC routes the PoP signals around the die and carries possible dummy thermal copper pillars. The package substrate, a thicker Ajinomoto Build-up Film (ABF) build-up over a BT core, fans the flip-chip bumps out to BGA pitch and embeds the power planes. The whole stack is organic. The only silicon is the SoC and the LPDDR5X dies; there is no silicon interposer. Keeping it all-organic brings the package’s coefficient of thermal expansion (CTE) close to the PCB’s, reducing board-level warpage, and avoids the cost of a silicon interposer the SoC’s bandwidth does not need. In an iPoP stack, the memory package connects to the organic RDL interposer through an array of solder bumps. Underfill fills the gap around those bumps, adding stiffness and protecting the joints from mechanical stress. The Pro and Pro Max variants differ here, which we cover behind the paywall. The die shot and architecture tell us how Huawei allocated its silicon budget. The process tells us what SMIC can manufacture. We use the Helio G99 as the process reference for TSMC N6. Both SMIC N+3 and TSMC N6 are evolutions of previous 7 nm-class nodes. We used targeted TEM cross-sections through logic and memory regions, imaged in both fin-cut and gate-cut directions. Each cross-section caption gives its horizontal field width (HFW), the real width of the imaged area. We start at the transistor fins, then move up through standard cells, local interconnect, and SRAM. SMIC has not overtaken Intel or TSMC. It uses aggressive DUV scaling and DTCO to reach N6-class density, but that density doesn’t translate into comparable performance and efficiency, for two reasons: the node gap to leading-edge nodes, and Huawei’s core designs. Fin Profile One of the most important knobs in a FinFET process is the fin profile: the shape of an individual fin and the channel where current passes from source to drain. The ideal fin is tall, narrow, and nearly vertical. A taller fin increases effective channel width, while a narrower fin improves electrostatic control by thinning the body the gate must control. Push either too far, and the process pays for it: weaker drive current, fragile fins, taper, footing and line-edge variation that hit yield and device variability. The Intel 22 nm, 14 nm, and 10 nm fin cross-sections show how FinFET nodes have improved over time. 22 nm fins were a first-generation structure, relatively short, wide and strongly tapered. The shape limits current density and reduces gate control uniformity across the height of the fin. At 14 nm and 10 nm, Intel pushed the fins taller and narrower while also making the sidewalls more vertical. Rather than shrinking the device, these changes increase the effective channel width per fin and improve electrostatic control. The trade-off is that taller fins at tighter pitches are much more difficult to manufacture. Now, let’s compare the Helio G99 on TSMC N6 with the Kirin 9030 on SMIC N+3. Both processes are in the same class, with fin pitch of 30-32 nm on N+3 and 34 nm in our N6 cross-section. The pitch for N6 is especially interesting as N7’s HD library is generally listed with a 33 nm fin pitch, and N6 did not shrink pitches directly. Its density gains came from DTCO instead of tighter pitches. The 34 nm pitch was stable across our sampled region and serves more as a comparison against the SMIC N+3 we have not investigated further. Pinning down N+3’s fin patterning scheme takes more than one core unit. The CPU cores show a dense ~32 nm pitch, with the pitch between N-P fin pairs alternating between 78 and 88 nm. Logic alone may be consistent with dual-pitch mandrels of 120 and 110 nm, but this is a complex and unusual approach. Combining the pitch from the the 8T SRAM, which has more complex repeat unit, with the CPU core sequence allows us to reverse engineer the patterning steps with more confidence. As both the logic and SRAM should share the same base grid, a single CD mandrel lithography pattern with 128 nm pitch undergoing SAQP produces a die-wide ~32 nm grid (128 nm/4), which supports the pitch sequencing seen in both logic and SRAM cells. In the sampled cross-sections, N+3 shows a taller, narrower, higher-aspect-ratio fin than N6. The measured fin aspect ratio is ~9.5:1 on N+3 versus 7.8:1 on N6. N+3 also shows less top rounding, with an estimated radius of ~2 nm, compared with 2.8 nm on N6. Even though the fin widths differ, the ratio of top rounding to fin width tells the same story, with N+3 at 0.37 and N6 at 0.44. In a geometric sense, lower is better; a perfectly rectangular fin would have no top-rounding penalty. These are single-digit-nanometer features measured from a handful of cuts, so treat the absolute numbers as approximate. The important result is the relative gap: N+3’s fins are consistently taller, narrower and less rounded than N6’s. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Standard Cell A standard cell is the basic building block of chip layout: a fixed-height row pairing one NMOS and one PMOS transistor that share a gate, tiled in a grid to build logic blocks. The key dimensions are contacted gate pitch (CGP), cell height (CH), fin count, and the lower-metal routing grid. To measure density, we use the Bohr metric: a weighted average of NAND2 gate area (60%) and scan flip-flop area (40%). This represents a realistic mix of combinational and sequential logic. This metric has its limitations, especially for complex cell layouts like TSMC’s FinFLEX, which alternates cells with different fin counts. Even so, it is the best metric for a pure process-level comparison. Another important measurement is the fin pitch; it refers to the distance between two fins of the same transistor. In a FinFET process, multiple fins are used in each transistor to increase the drive current and thus performance. TSMC N6 ships both a high-density (HD) library with 2 PMOS and 2 NMOS fins per cell, and a high-performance (HP) library with 3 of each. More fins under the shared gate mean more effective channel width. HP cells switch harder at the cost of area. Designers mix the two on a die, primarily spending HP cells on timing-critical paths, and matching their PPA targets. In the Cortex-A55 core of the Helio G99, we found a cell height of 240 nm for the HD cell. MediaTek has used HD cells in the G99 to minimize die size and thus cost. As an SoC for budget smartphones at ~$100, this is essential. By contrast, we found only one library in the Kirin 9030, with 2 NMOS and 2 PMOS fins. This suggests a narrower library strategy than TSMC N6, where both HD and HP libraries are widely used. This likely reflects the smaller customer base and the more constrained domestic design and electronic design automation (EDA) ecosystem. In all three CPU cores of the Kirin 9030, we found cell heights of 228 nm, 5% smaller than on N6. This is also a reduction of 9.5% over SMIC N+2’s cell height of 252 nm. SMIC N+3 and TSMC N6’s HD library both feature a CGP of 57 nm. For SMIC, this is a 9.5% shrink over N+2. In the past, CGP and cell height alone may have been enough to compare transistor density. Now, however, we must consider scaling boosters and DTCO as well. SMIC’s density gain does not come from EUV. It comes from using every available DTCO booster aggressively. First is fin depopulation: reducing the number of NMOS and PMOS fins in each cell. The first FinFET nodes started with 3 or 4 fins for each transistor. SMIC N+3 and TSMC N6 HD both use only 2 fins per transistor, trading drive strength for density. Next is contact over active gate (COAG). By landing the gate contact directly over the active gate, instead of out over the isolation region, the cell height drops. N+3 integrates COAG while N6 does not. Our N+3 gate-cut cross-sections indicate COAG, with the gate contact sitting over the active region, while N6 shows an off-gate contact. Last is single diffusion break (SDB). Diffusion breaks are inserted between cells in the same row to provide electrical isolation, but they also introduce local layout effects (LLE), layout-dependent shifts in electrical characteristics. In the past, a double diffusion break was used, consuming the space of two CGPs. SMIC N+3 and TSMC N6 instead use SDB, saving area but increasing LLE sensitivity. This must be controlled at the process level and accurately modeled in the process design kit (PDK) so that EDA tools can account for it. Overall, SMIC N+3 has a transistor density of 113.4 MTr/mm², slightly above TSMC N6 at 107.7 MTr/mm². Even without EUV, SMIC has achieved density beyond TSMC’s mature N6 node which utilizes EUV. Metal Stack The smallest critical dimension in the teardown is M0; SMIC N+3 uses a 32.5 nm local metal pitch. That is smaller than the 36 nm M0 pitch on Intel 18A in Panther Lake. However, this does not mean that SMIC has a better process than Intel 18A or TSMC N3P. M0 is a local intra-cell routing layer. Its usefulness depends on the full interconnect stack: M1 and M2 pitch, track count, via and line resistance, design rules, mask count, overlay control, and routing flexibility. The 32.5 nm M0 is consistent with self-aligned quadruple patterning (SAQP), whose four-population line-width loading we read coarsely as alternating widths of 21.5 to 24 nm; M1 and M2, at 38 and 40 nm, are consistent with self-aligned double patterning (SADP), a single A/B split. On TSMC N6, M0, M2, and M3 sit at a relaxed ~40 nm and are consistent with SADP-class double patterning, with no need for quadruple patterning. That said, we measure M2 for example at ~43 nm, likely inflated by sparse routing. We do not assign any specific layer to EUV from our cross-sections; the distinction we can draw is double versus quadruple patterning, not lithography wavelength. Transistor-level density in the front-end-of-line (FEOL) sets an upper bound, but the design is ultimately limited by what the interconnect stack can route. The lowest metals are the most important for standard-cell density, but the semi-global and global layers determine how usable that density is at the block and chip level. Two axes are commonly used for chip cross-sections: the fin-cut and the gate-cut. The micrograph above is a fin-cut and shows metals 0 through 3. This axis lets us see the even-numbered metals, with M0 right above the fins. There are two kinds of M0 lines. The first are the power rails; these are wide wires for the VDD and VSS running horizontally at the top and bottom edges of each standard cell. The wide wires measure 55 nm across, more than double the other M0 lines. Their width minimizes resistance and reduces IR drop. The second kind are intra-cell wires, short segments within the cell that connect terminals to M1. These have alternating widths between 21.5 and 24 nm. The M0 pitch is 32.5 nm, a 19% reduction versus N+2 and N6. At this pitch, DUV patterning requires more aggressive multi-patterning, increasing mask count, overlay sensitivity, process complexity and cost. M0 is below what a single DUV-defined spacer (SADP) can resolve, so SMIC cascades a second spacer step (SAQP). The cross-section reflects the cost: the M0 trenches are visibly more re-entrant (narrower at the bottom than the top) than M1 or M2 on the same chip and carry a bright barrier-rich foot where the trench meets the etch-stop layer. That shape is partly the intended damascene profile, as a slightly narrow bottom helps void-free copper fill, but its magnitude at M0 is driven by the tight pitch and the higher trench aspect ratio. Intel 18A supports an M0 pitch of 32 nm, although Panther Lake has only shipped with a looser 36 nm pitch. This is due to Intel’s heavy usage of HP libraries. Among leading-edge nodes, 18A has the loosest M0 pitches due to PowerVia. With power routing moving to the backside, congestion is reduced, and the entire front-side metal stack can be used for signal routing. M2 is the first true inter-cell routing layer. It runs horizontally like M0 but spans across multiple cells to carry block-level signals. The M2 pitch sets the cell’s track height – the number of M2 tracks that fit between the VDD and VSS rails, defining what the library calls a 6-track or 7.5-track cell. This layer is the most important, limiting the routing of entire blocks. SMIC N+3 features a 5.7-track cell. The M2 pitch is 40 nm, a 5% decrease over N+2 and the same as N6. This shrink keeps the pitch at the edge of what is possible with double patterning. Future nodes will need to increase the number of masks for M2 as reducing the number of tracks is much harder due to the limitations in routing. The micrograph above is in the perpendicular direction, the gate-cut, and shows metals 0 through 4. This allows us to see and measure the odd-numbered vertical metal layers. The M1 pitch is 38 nm, 9.5% less than N+2 and 33% less than N6. The M1-to-gate ratio matters because it sets local routing flexibility. N+2 and N+3 use a 3:2 ratio, while N6 uses a 1:1 ratio, explaining the huge differences in M1 pitch. The more M1 lines there are compared with the gates, the more flexibility there is for power and signal crossing within the cell. Routing flexibility enables more complex and better cells. Clean fractional ratios are also preferred as a grid is periodic and improves layouts. The 3:2 ratio gives SMIC more local routing flexibility than a strict 1:1 grid, but it also complicates layout and patterning. This is a DTCO choice, with SMIC increasing process complexity to recover density and routability without EUV. This 3:2 ratio is not very popular in the leading-edge nodes. TSMC has only used it on N7+, the N5 family, and the short-lived N3(B). They have switched back to a 1:1 ratio for N3E. Intel has only used it on the 10 nm/Intel 7 family, with Intel 4, 3 and 18A all using a 1:1 ratio. Samsung is the only one still using a 3:2 ratio at the leading edge, using it in the SF4 and SF3 families. It remains to be seen if SMIC will remain at a 3:2 ratio or move to a 1:1 ratio with its future nodes. The industry is still actively exploring these local-routing ratios. At VLSI 2026, imec will be presenting work on even higher ratios, including a 2:1 scheme that can reduce area by up to 14%. We will be covering the conference in a future newsletter article. Subscribe We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. The final local interconnect layer for N+3 is M3, with a pitch of 44 nm. The M3 pitch is the same as on N+2 and 10% larger than on N6. The semi-global layers carry the majority of block-level signal routing. They have a coarser pitch than the lower local layers. On leading-edge nodes, they are designed to sit at the limit of DUV single patterning. M4 through M11 pitches were found divided between 80–82 nm (M4–M6), 128 nm (M7–M10), and 148 nm (M11). Given limited sampling, it is possible these are divided further in dense routing areas. At the top are two giant metal layers, M12 and M13. These have kept the same pitches as N+2 at 1920 nm and 4600 nm respectively. While the lower layers’ pitches are generally fixed by the process and library, the upper layers vary much more in pitch and count, depending on the design. Even two smartphone SoCs on the same process can have wildly different metal stacks. The Helio G99 carries fewer routing layers, reaching coarse metal pitches of 850 nm by M9, while the larger and higher-performance Kirin 9030 keeps fine pitches until M11. SRAM At the leading edge, SRAM is much more difficult to scale than logic. TSMC’s latest nodes have seen little to no bitcell scaling, while logic still has more DTCO levers to pull. While looking for other logic libraries in the GPU compute units, we stumbled upon the SRAM. The most common type of SRAM has 6 transistors (6T), but this cell had 8 transistors (8T) instead. 8T SRAM adds two transistors to form a dedicated read port. Unlike a 6T cell, where reading disturbs the storage, the decoupled read port removes read-disturb, improving read stability and letting the cell be pushed harder for performance. At first glance, the cut looked like an unusual logic library, with each cell row having 3 fins of one polarity and 5 fins of another. The rows also alternated in orientation. Energy-dispersive X-ray spectroscopy (EDS) resolved our confusion. The cut had not landed on the GPU logic, but on the SRAM macro beside it. The unusual fin pattern was due to the SRAM library. We return to EDS in the process flow analysis behind the paywall. SRAM libraries are not like traditional logic libraries. Due to the unequal number of PMOS and NMOS transistors, they require specialized rules and layout libraries. They do not need the flexibility of logic libraries, so they are hyper-optimized for one purpose: dense, reliable memory. The SRAM cell we found is a 1:2:2-2:2 cell. This means there is 1 fin per pull-up (PU) PMOS transistor, and 2 fins per pull-down (PD) and pass-gate (PG) NMOS transistor. These 2 PU, 2 PD and 2 PG transistors would usually form a single 6T high-current cell (HCC). An 8T HCC adds a read-pull-down (RPD) and a read-pass-gate (RPG) NMOS transistor, each with two fins. We measured a cell height of 406 nm, which brings the bitcell size to 0.0463 µm². That is a theoretical peak density of 21.6 Mib/mm². We estimate that a 6T HCC would have a cell height of 292 nm and a size of 0.0337 µm². This is ~12% larger than a 6T HCC on Intel 3 and 4. We also estimate the 6T high-density cell (HDC) to have a cell height of 228 nm and a size of 0.0260 µm². This is coincidentally the same as the logic standard-cell height measured earlier. The estimate puts the cell near Samsung 7LPP/5LPP and slightly below TSMC N7/N6. That is a theoretical peak density of 38.5 Mib/mm². 6T HDC is arguably the most important cell as it is used for the largest caches in a chip, the L3 caches and system-level cache (SLC). Both the Kirin 9020 and 9030 have split the SLC into 4 banks to raise total SLC bandwidth. In the Kirin 9030, the SLC increased from 2 MiB to 3 MiB per bank. Correspondingly, the number of arrays within the bank also increased by 50%, from 16 to 24. Each array can store 128 KiB and forms an orderly pattern on the die shot. From the Kirin 9020 to the Kirin 9030, the area of a 128 KiB SLC array decreased from 0.0477 mm² to 0.0392 mm², an 18% shrink. The achieved density is 25.5 Mib/mm², 66% of the theoretical maximum. While the SLC was quite similar across both chips, the L3 has seen some major changes, particularly in terms of its layout. The total capacity also went up from 10 MiB to 12 MiB. Much like the SLC, the L3 is also split into 4 banks. In the Kirin 9020, an L3 bank consisted of 16× 128 KiB arrays and 16× 32 KiB arrays. However, an L3 bank in the Kirin 9030 instead consists of 48× 64 KiB arrays. In the Kirin 9020 L3, a 128 KiB array was 0.0513 mm² and a 32 KiB array was 0.0154 mm². The size of the 128 KiB array is different on the L3 and SLC as the assist circuitry for the two arrays differs depending on their purpose. In the Kirin 9030 L3, a 64 KiB array is 0.0210 mm². Although not a like-for-like comparison, normalized for capacity, it is 18% smaller than the 9020’s 128 KiB L3 array and 31% smaller than its 32 KiB L3 array. The achieved density is slightly lower than the SLC, at 23.8 Mib/mm², 62% of the theoretical maximum. Unlike the L3 and SLC, the prime cores’ private L2 cache uses a 2-bank design. As the prime cores’ L2 is latency-critical, it likely uses 6T HCC instead of 6T HDC. The 9020 has 16 arrays in each bank while the 9030 has 32. Each array has a capacity of 32 KiB. A 32 KiB array in the L2 shrank from 0.0171 mm² to 0.0142 mm², ~17% smaller. The density is 17.6 Mib/mm², ~59% of the theoretical maximum for 6T HCC. SRAM scaled well from N+2 to N+3, shrinking by ~19%, close to the theoretical logic shrink. The caveat is that N+2’s bitcells were unusually large, bigger than comparable 7 nm-class nodes, so part of the gain is catch-up rather than true scaling. With the insights from STEEL’s teardowns, we will be doing a deep dive into SRAM in a future newsletter article. Subscribe Everything above came out of a single STEEL teardown: die annotation, block-level area analysis and TEM cross-sections through logic and SRAM. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Future Roadmap The same cross-sections that pin down N+3 also show where SMIC can go next. Although N+3 is already close to the practical limits of DUV multi-patterning in several layers, SMIC still has a few scaling levers left. A theoretical N+4 would likely start with cell height. N+3 uses 5 M0 tracks between its power rails. Moving to 4 M0 tracks, as on SMIC N+2 and TSMC N6, could reduce cell height by roughly 15%. The routing grid is only one side of the shrink; the front end also must fit into the smaller cell. One possible FEOL lever is reducing the p-to-n isolation spacing from two diffusion grid units to one. Intel used this scaling booster on Intel 4, and TSMC did so on its N3 family. This path trades layout flexibility for density. Fewer M0 tracks reduce local routing resources, while tighter p-to-n spacing raises integration and design-rule difficulty. M2 is also constrained by the cell height shrink. For SMIC to maintain a ~5.7-track cell, M2 would need to move toward ~35 nm. That would move another layer into SAQP territory. SMIC could also reduce the CGP from 57 nm to 54 nm. Intel reached a similar CGP on Intel 10 nm/Intel 7 without EUV. The local interconnect is also tougher. If SMIC keeps the 3:2 M1-to-gate ratio, M1 would need to shrink to 36 nm and would likely require SAQP as well. If SMIC moves to a 1:1 ratio, M1 could relax to 54 nm, but it would give up routing flexibility. Under this theoretical path, we estimate that SMIC N+4 could reach a cell height of 198 nm and a CGP of 54 nm, implying a Bohr density of 137.8 MTr/mm², on par with TSMC N5 or Samsung SF4. However, the difficulty is cumulative. Each step is individually plausible, but together they make N+4 harder than the transition from N+2 to N+3. It will likely take longer, cost more, and carry less process margin. A theoretical N+5 would require a larger integration shift. One possible path is backside contacts (BSCon), moving power routing and source/drain contacts to the backside, which would reduce front-side routing pressure and enable another reduction in cell height. The front-side metal pitches could relax to reduce the process complexity. M0 would likely relax slightly to ~34 nm, and M2 and M4 pitches could relax further. CGP is unlikely to shrink much further. Even with EUV, 48 nm has been the practical limit for yield and process control. This approach would allow N+5’s cell height to fall to 170 nm and its CGP to 53 nm. This implies a Bohr density of 163.6 MTr/mm², on par with Intel 18A’s HP library. However, this would not make N+5 cost-competitive with the leading edge. It would reach a similar density through a much more expensive route. The integration difficulty rises sharply, with new process flows for backside alignment, wafer thinning, contact reveal, and backside metallization. Past this point, standard density and interconnect scaling become increasingly unattractive. That is where Huawei’s roadmap stops looking like a normal foundry roadmap and starts looking like a packaging roadmap. At ISCAS 2026, Huawei unveiled its tau (τ) scaling law, reframing process scaling in the time domain. τ is the time cost of data movement and processing: switching delays in transistors, RC signal propagation delays in circuits, compute, memory, and networking latency. Outside Huawei’s terminology, this is called system-technology co-optimization. This is Huawei’s answer to its lack of EUV lithography. Without EUV, planar density cannot keep pace with TSMC, Intel, or Samsung. If transistor density cannot shrink further, Huawei’s alternative is to shorten wires, reduce buffering, and stack logic vertically. “LogicFolding”, Huawei’s implementation of this new scaling idea, is, in practice, an aggressive 3D stacking approach. AMD V-Cache places SRAM above or below a CPU die. AMD’s MI350X places active interposer dies (AIDs) underneath accelerator and compute dies (XCDs), with the AIDs handling cache, IO interfaces, the network-on-chip (NoC) and embedded metal-insulator-metal (MIM) capacitors. With LogicFolding, parts of the same logic block are split across multiple active dies bonded face-to-face at ultra-fine pitch. This allows Huawei to shorten some critical paths and reduce buffer overhead, not merely add cache capacity or offload the IO and interconnect. Shortening wires is where the higher clocks come from. A large share of a modern core’s delay and energy budget goes into driving long interconnects and the repeater buffers along them. LogicFolding distributes a block’s critical-path gates across multiple stacked tiers bonded at a very fine pitch, so the bond interface behaves like an additional metal layer and the longest paths get shorter. That is how Huawei expects to recover frequency and efficiency it cannot get from the process alone. Huawei’s roadmap shows its intent. Prime core frequency is targeted to rise from 2.75 GHz in the Kirin 9030 to roughly 5 GHz by 2031, far beyond what planar scaling alone could deliver. Prime cores with 3.1 and 3.39 GHz clocks are being tested in its labs, although their power consumption is unknown. Beyond that, chips are in the design, simulation or pathfinding phase, meaning the frequencies are targets. However, the direction matters more: LogicFolding also helps with performance, not just density. The catch is that Huawei’s density claim is not directly comparable to foundry densities. A stacked design can report more transistors per package footprint by adding active layers, even if each patterned die remains well behind TSMC or Intel in front-end density. This is how Huawei can claim to reach foundry 14A-equivalent density by 2031. This is not a like-for-like foundry comparison, with Huawei using stacked logic and measuring density per package footprint. On a normalized Bohr-density basis, SMIC N+3 is ~114 MTr/mm², 38% less than Intel 18A’s HD library. Huawei’s 3D roadmap closes the gap by stacking active logic, reaching 215 MTr/mm² by 2030. In 2031, the roadmap density jumps to 295 MTr/mm², implying either a third active layer, partial EUV insertion or aggressive planar DUV scaling. Huawei’s methodology makes other foundries look much denser as well. Applying it to AMD’s MI450X with an N2 top die on an N3P base die yields a theoretical density of 460.2 MTr/mm² in 2026, compared with Huawei’s 295 MTr/mm² in 2031. This Kirin 9030 does not use LogicFolding, remaining in a conventional mobile SoC package. Instead, it forms the baseline for how far Huawei and SMIC can push planar scaling. Future teardowns of Kirin and Ascend chips will show both planar logic density and Huawei’s hybrid bonding solutions. Export controls changed China’s optimization problem rather than ending it. EUV restrictions raised the cost and complexity of leading-edge manufacturing without freezing it. SMIC reaches N6-class logic density through DUV immersion, SAQP and DTCO, while Huawei shifts more of the burden onto architecture, packaging and system-level integration. Future nodes will be tougher. N+3 still had room to tighten local metals and reduce cell height and CGP. Further scaling without EUV leaves fewer levers. More aggressive multi-patterning adds masks and overlay error. SMIC can keep pushing DUV, but each step will get more expensive and less forgiving. The design side is just as critical. Huawei had domestic EDA tools and flows before the Kirin 9030, with the Kirin 9000s, 9010 and 9020 making that clear. Huawei was able to ship multiple consumer SoCs on SMIC N+2 and N+3 while cut off from the Western EDA stack. US export controls restricted EDA tools for advanced chips in 2022 but did not target tools for more mature chips. In 2025, the US government briefly placed much broader restrictions on EDA software from Synopsys, Cadence, and others, before lifting them less than two months later as part of a trade deal tied to rare earths. Huawei has been unable to access those tools because it remains on a US trade blacklist. That forced Huawei, SMIC and Chinese academic institutions to build their own tools and flows. Researchers at Peking University recently announced a prototype EDA tool for Huawei’s LogicFolding architecture, which requires a new flow to handle the multilayer layout and floorplan. This is not the same as replacing the full Synopsys or Cadence stack, but it shows where domestic EDA is headed: toward tighter co-optimization between architecture, process and packaging. These advances are also diffusing into the Chinese ecosystem. SMIC is licensing its N+2 and N+3 processes to HLMC/Hua Hong at the government’s direction rather than by choice. If the same process learning feeds into Ascend accelerators for AI training and inference, the choke point shifts from one named fab to an ecosystem. Alibaba’s T-Head silicon arm and Cambricon, a Chinese AI chip designer that is expected to supply ByteDance, could also be major beneficiaries. Sanctions aimed at SMIC alone become less effective once the manufacturing knowledge has spread to other fabs and design houses. China is not closing the gap with Intel, Samsung and TSMC. The teardown shows the opposite in several places: no EUV, no backside power, higher process complexity, and visible trade-offs. But China is still advancing. If domestic chips become good enough for phones, inference, networking and security-sensitive workloads, they can matter strategically without matching TSMC at the leading edge. Behind the paywall, we show what else STEEL can do, with material and process flow analysis of SMIC N+3, and analysis of the Kirin 9030 package. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline, access the full Kirin 9030 and SMIC N+3 analysis or to commission a custom teardown, contact sales@semianalysis.com.
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MSU announces naming of Greene College of Science & Engineering, cementing eastern Kentucky family legacy
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AHF • ‘We the People’ Coalition Merges Faith & Politics to Engage Black Voters -- L.A. Gospel Concert & Panel, Sat., Aug. 8th
AIDS Healthcare Foundation (AHF), the world's largest HIV/AIDS healthcare organization, currently provides medical care and services to more than 1.75 million clients in 45 countries. With more than 7,000 employees worldwide, AHF now has treatment clinics and other operations in the US, Africa, Latin America/Caribbean, the Asia/Pacific Region, and Europe. To learn more about AHF, please visit our website: www.aidshealth.org, find us on Facebook: www.facebook.com/aidshealth, and follow us on Twitter: @aidshealthcare and Instagram: @aidshealthcare.
Science, Public Health, and the Politics of Truth
Presented as part of the McCloskey Speaker Series.Peter Hotez, M.D., Ph.D., professor and dean of the National School of Tropical Medicine at Baylor College of Medicine, joins the Aspen Institute for a keynote lecture on the intersection of science, medicine, and public trust. A leading authority on vaccines and neglected tropical diseases, Hotez reflects on the challenges facing public health today, the growing politicization of science, and what it will take to rebuild trust in scientific institutions in the years ahead.Paepcke Auditorium, doors at 5:00 pmRegistrationThis event is free and open to the public, but registration is required, and capacity is established on a first-come, first-served basis. Once an event is at capacity, we will have an in-person waitlist at the door.Public registration is now open for summer 2026. Please click here to register.ParkingParking is very limited. Please carpool, walk, bike, or ride RFTA.Book signing will immediately follow the event. To learn more about his book or to order a copy, please click here.
The Annual Entrepreneurship Conference at Harvard Business School
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The Cost of Cutting American Science: How Federal Cuts Diminish Public Health Capacity
Among the federal government’s many responsibilities is the work it does to protect public health. Federal agencies monitor our food supply to ensure safety, conduct research to better understand emerging health threats, provide funding for public health programs in communities and work to detect and respond to disease outbreaks. Americans rely on these efforts every day—in a 2024 online survey, 74% of respondents said that “if the federal government issued safety guidance about food you eat regularly,” they would follow it. Changes to Federal Public Health Capacity The Trump administration’s efforts to reshape the federal government have resulted in significant impacts on our nation’s public health capacity over the past 20 months, affecting the response to health concerns such as measles, Ebola and cyclosporiasis. Agencies with core public health, food safety and disease prevention responsibilities experienced large workforce decreases during the first year of the administration. At the Centers for Disease Control and Prevention, for instance, the workforce in February 2026 was 26.7% smaller than in September 2024 before the start of the Trump administration. The Food and Drug Administration saw a similarly steep decline of 21.6%. Agencies such as the National Institutes of Health, Substance Abuse and Mental Health Services Administration and Food Safety and Inspection Service also experienced large workforce decreases. (function(){function e(){window.addEventListener(`message`,function(e){if(e.data[`datawrapper-height`]!==void 0){var t=document.querySelectorAll(`iframe`);for(var n in e.data[`datawrapper-height`])for(var r=0,i;i=t[r];r++)if(i.contentWindow===e.source){var a=e.data[`datawrapper-height`][n]+`px`;i.style.height=a}}})}e()})(); Changes can also be seen in crucial public health occupations. The number of federal food inspectors, for example, decreased by more than half between September 2024 and February 2026, going from 1,035 to 473. This is the lowest number of food inspectors employed by the federal government since at least 2005. By February 2026, there were also 33.3% fewer federal public health program specialists, whose work includes advising federal funding recipients on public health activities and analyzing the effectiveness of public health programs. Government’s capacity is diminished as employees with specialized knowledge and experience in protecting the public and responding to health risks depart, leaving agencies less prepared to carry out their public health missions. There also have been vacancies in critical high-level leadership positions at public health agencies, most notably at the CDC, which had a permanent Senate-confirmed director for less than a month between January 2025 and early August 2026. Although the CDC has previously been led by acting directors at the start of an administration, the nearly yearlong gap since the departure of the administration’s first permanent director in August 2025 is without precedent. As of August 2026, the FDA is also currently without a Senate-confirmed commissioner following the previous commissioner’s resignation in May 2026. Additionally, public health agencies are experiencing increased politicization of their leadership ranks. In agencies such as the CDC and Food Safety and Inspection Service, the number of individuals in the Senior Executive Service—the most senior career leaders in government—has declined significantly, while at the same time the number of political appointees has reached record levels. (function(){function e(){window.addEventListener(`message`,function(e){if(e.data[`datawrapper-height`]!==void 0){var t=document.querySelectorAll(`iframe`);for(var n in e.data[`datawrapper-height`])for(var r=0,i;i=t[r];r++)if(i.contentWindow===e.source){var a=e.data[`datawrapper-height`][n]+`px`;i.style.height=a}}})}e()})(); (function(){function e(){window.addEventListener(`message`,function(e){if(e.data[`datawrapper-height`]!==void 0){var t=document.querySelectorAll(`iframe`);for(var n in e.data[`datawrapper-height`])for(var r=0,i;i=t[r];r++)if(i.contentWindow===e.source){var a=e.data[`datawrapper-height`][n]+`px`;i.style.height=a}}})}e()})(); At the CDC, for example, the number of career SES decreased 42.9% between December 2024 and February 2026, while the number of non-Senate confirmed political appointees at the agency was six times larger than the agency’s historical average from 2009 and 2024. Knowledgeable career leaders are integral to the ability of public health agencies to carry out their work with scientific integrity and professional judgment, and rapid leadership turnover and increased politicization threaten agencies’ ability to make evidence-based decisions to protect our health. The upheaval and politicization in public health agencies have also negatively affected employee engagement. Strong employee engagement is crucial to the ability of agencies to carry out their mission and successfully provide essential services to the public. In the 2025 Public Service Viewpoint Survey conducted by the Partnership for Public Service, the Department of Health and Human Services—which encompasses major public health agencies such as the CDC and FDA—had an employee engagement and satisfaction score of 20.4 out of 100, one of the lowest among large agencies. Only 2.8% of HHS employees indicated trust in their political leaders and only 8.7% reported confidence that they could report a suspected violation of law or regulation without retaliation. Employees at HHS also reported that the agency’s ability to provide services to the public had suffered. Nearly half of employees at HHS, 47.5%, said their work unit was worse at delivering quality services compared to its performance in 2024. In addition, 57.8% said their work unit was performing worse at fulfilling stakeholder needs. In addition to the work done within federal agencies, the federal government also distributes significant funding for public health and disease prevention work to state and local governments, nonprofits and small businesses—funding which has been significantly disrupted. At the CDC, for example, there was a 71.9% decrease in the amount of project grant funding issued in fiscal year 2025 compared to fiscal year 2024. The FDA also issued far less funding in fiscal year 2025—a 21.3% decrease from its fiscal year 2024 funding. Changes in federal funding include the ending of grants to community organizations that worked on HIV prevention and the cancellation of funding for research into improvements to patient safety and healthcare quality. These changes go beyond federal agencies to impact the broader public health ecosystem, including the state and local health departments responsible for much of the on-the-ground public health work in their communities. About 80% of the CDC’s domestic funding is directed towards state and local partners—meaning that cuts to CDC funding can ultimately result in cuts to state and local public health capacity. Federal agencies also provide expertise and assistance to state and local health agencies as they deal with particular health challenges, but workforce cuts have resulted in fewer federal employees available to help. The Impact of Changes to Public Health Capacity These changes to federal public health capacity are not abstract concerns. Disrupted programs, reduced funding and lost expertise at public health agencies across all levels of government threaten the public’s physical well-being and safety. In some cases, this has already led to harm. The most immediate impacts of federal cuts were seen in interruptions to ongoing public health programs and crisis responses. In one instance, when CDC grants were canceled during the 2025 Texas measles outbreak—the most severe measles outbreak in 25 years—public health officials in Lubbock, Texas were forced to pause parts of their measles response work supported by the frozen funding. Lubbock’s director of public health further said that a lack of available CDC experts to reach out to for advice “definitely” impacted the department’s response to the measles crisis. Cuts to federal funding also forced Dallas County Health and Human Services to cut staff and cancel 50 community vaccination clinics during the outbreak. Public health work outside of major outbreak responses was also disrupted. For example, in April 2025, the Milwaukee Public Health Department was unexpectedly unable to reach experts on lead poisoning due to firings at the CDC when responding to concerns about lead contamination in Milwaukee public schools. Due to federal workforce cuts, several programs at the CDC, including Alzheimer’s and epilepsy programs, have also become trapped in limbo—existing on paper, but without the staff necessary to operate. More recent crises reveal how federal cuts have weakened the public health infrastructure needed to prevent and respond to dangerous new outbreaks. Internationally, cuts at the U.S. Agency for International Development eliminated funding for disease testing and contact tracing abroad, which delayed detection of and responses to the 2026 Ebola outbreak in the Democratic Republic of Congo. While international outbreaks may seem far removed, the unchecked spread of disease in any country can quickly pose a danger to economic well-being, security and health around the world. Within the United States, public health cuts inhibited responses to the summer 2026 outbreak of the food-borne parasite cyclospora. At the federal level, cuts to funding for lab equipment and for CDC staff with expertise in parasitic infections—including 9 out of 11 staff members at the lab responsible for identifying parasitic outbreaks in 2025— contributed to the largest reporting delay in outbreak cases at the CDC in 15 years. Conflicting communications from the FDA about the source of the outbreak, which followed cuts to the agency’s communications department, additionally led to confusion among the public about how to best avoid infection. At the same time, cuts to HHS funding and support for local and state public health slowed some health departments’ responses to the crisis. The exact costs of these delays, constraints and confusion in public health responses are difficult to estimate. However, their message is clear: federal cuts have already made containing threats to public health even more of a challenge. Conclusion Protecting public health—from food safety to disease prevention—is one of the federal government’s most important missions. Dramatic and haphazard cuts to federal agencies and funding have already disrupted the public health system, impacting the response to challenges such as measles, lead poisoning and cyclosporiasis. The U.S. public health system needed improvement before these disruptions. Since 2022, federal leadership and coordination in response to public health outbreaks has been on the Government Accountability Office’s High-Risk List of areas in need of attention to improve government effectiveness and efficiency. Recent cuts only compound these concerns. The chaotic dismantling of government and resulting disruptions to crucial functions like public health and disease prevention highlight the need for meaningful reform and concrete policy proposals to reimagine how government can better serve the public and be more effective, responsive and accountable. To learn more about the impact of federal cuts to public health and science more broadly, visit The Cost of Cutting American Science. Learn more For more information on the Partnership for Public Service’s government reform initiative, visit Government for a New Era. View here In line with The Cost of Cutting American Science, federal workforce data in this brief is as of February 2026
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Learn more about News Detail at hartfordhealthcare.org
This Week: Phone Bank for Transit, SF Politics, Transit Tales
Here is a list of events this week. Monday/today! Phone bank with SFBike to Save Transit. The San Francisco Bicycle Coalition is phone banking and connecting with voters, explaining how vital it is to pass the Regional Transit Measure this November. Join them to help make sure our regional transit survives and thrives. Monday/today, September 21, 5-7 p.m. San Francisco Bicycle Coalition Office, 1720 Market Street, S.F. Tuesday Historic Photo Exhibit Tour. Moving San Francisco is a collaboration between the SFMTA and San Francisco Arts Commission and is on view at City Hall through November 25. During this informal tour, they will take an in-depth look at selected photos from San Francisco transit history and learn more about the stories and people behind them. Tuesday, September 22, 5-7:45 p.m. North Light Court inside City Hall, One Dr. Carlton B. Goodlett Place, S.F. Tuesday San Francisco Bicycle Coalition Board Meeting. SF Bicycle Coalition members are invited to attend all board meetings. Tuesday, September 22, 6-8 p.m. Register for Zoom link. Tuesday SF Politics 101 with Joel Engardio. SF Politics 101 is a look at how local politics work and the history that shaped San Francisco—brought to life with visuals and narrative storytelling. Tuesday, September 22, 6-7:15 p.m. SPUR Urban Center, 654 Mission Street, S.F. Register to attend. Wednesday Transit Tales: A Storytelling Night. Join SPUR and Muni Diaries at Local Economy for an evening of true stories inspired by riding transit. From unexpected encounters and meet-cutes to funny mishaps and heartfelt moments, Transit Tales celebrates the experiences that make public transportation unforgettable. Wednesday, 5:30-7 p.m. Local Economy, 6028 College Ave, Oakland. Saturday Group Ride: Richmond BART to Point Pinole. Join Bike East Bay for a family-friendly, no-drop group ride to Point Pinole Regional Shoreline. Saturday, September 26, 10:30 a.m.-3 p.m. Starts at Richmond BART Plaza, 1600 Nevin Plaza, Richmond. Saturday Shipwreck Cove Opening. Come see Sunset Dunes’s newest playground. Saturday, September 26, 3 p.m., Sunset Dunes and Kirkham, S.F. Saturday 55 Wine Line Progressive. Ride between Horsies Market & Saloon, Bar Part Time and Ruby Wine on the 55 Dogpatch bus. Saturday, September 26. Three locations in Dogpatch. See SFMTA site for more details on locations and times. Got an event we should know about? Drop us a line.
Small Gym September: Meet Thunder Elite
Learn more about Thunder Elite from Bryan, TX! Thunder Elite is proud to have brought home its first-ever D2 Summit win this past season!
Sandhills Community College Small Business Center expands to Moore and Hoke Counties
Small Business Center Director, Laura Kinsman. Photo provided by: SCCSandhills Community College (SCC) is launching a redesigned Small Business Center model that expands no-cost entrepreneurial support across Moore and Hoke Counties. Rooted in the College’s commitment to strengthening small businesses and entrepreneurship as drivers of economic growth, the enhanced model is led by recently appointed Small Business Center Director, Laura Kinsman. The model also includes two new Senior Business Advisors who will provide trusted expertise, stronger community connections, and individualized guidance to entrepreneurs and business owners throughout the region.Kinsman brings a unique perspective to the director’s role as both a local business owner, operating in downtown Southern Pines, and a former Moore County educator. “Her combination of education, business ownership, leadership, and community involvement make her a great fit for the Small Business Center and the work we are continuing to build across Moore and Hoke counties,” said Taylor L. McCaskill, senior director of Workforce Development & Corporate Partnerships in a press release.Kinsman is an active member of the Southern Pines Business Association and has been connected to the Sandhills Small Business Center since the beginning of her entrepreneurial journey. She looks forward to building on that experience by strengthening the Center’s partnerships and expanding its connections throughout the community.She will lead the Center's efforts to support entrepreneurs and business owners throughout Moore and Hoke County and be the connector to the North Carolina Community College System Small Business Center Network operations. The Center offers no-cost, confidential one-on-one counseling, practical workshops, and connections to the resources and partners that help local businesses start, grow, and create jobs.A key part of this new approach, only offered at SCC, is a network of Senior Business Advisors, experienced professionals who will provide individualized guidance in areas such as business planning, finance, marketing, operations, growth strategy, and problem-solving. These advisors will serve as trusted partners to entrepreneurs and business owners, helping them turn ideas into action, overcome barriers, strengthen existing businesses, and pursue new opportunities. This one-on-one counseling is available at no cost, ensuring that high-quality business support is accessible to entrepreneurs at every stage.Senior Business Advisor for Hoke County, Kenna Parks. Photo provided by: SCCKenna Parks has been named the senior business advisor for Hoke County. She is a business professional, entrepreneur, and educator who brings a unique combination of academic training and real-world business experience. She earned her Master of Business Administration (MBA) in 2017 and has built her career around entrepreneurship, marketing, business development, and helping others turn ideas into sustainable opportunities.Senior Business Advisor for Moore County, Katrin Henderson. Photo provided by: SCCAs a military spouse, she has successfully launched and operated businesses across five states, giving her firsthand experience in adapting to diverse markets, building new customer bases and understanding the importance of global reach in today’s business environment. Over the last decade, her areas of focus include business planning, marketing strategy, branding, customer development, financial preparedness, operational planning and connecting entrepreneurs with educational programs and community resources.Parks brings an especially valuable perspective to business advising because she is an entrepreneur herself. She is the owner of Glamo Society Bridal & Formal Wear in Raeford, N.C., giving her firsthand experience with the realities of launching, operating, marketing and growing a small business. She understands that entrepreneurship extends far beyond developing a great idea; it requires strategy, financial awareness, adaptability, strong customer relationships, and consistent execution.Katrin Henderson will serve as the senior business advisor for Moore County. Thriving in hospitality and retail, Henderson has enjoyed positions in Food & Beverage Management and Retail Management in various fine dining and retail establishments in the area, before opening her own children's shop in 2015, in the Village of Pinehurst. She is a native of Moore County.Quickly immersing herself in this new world of small business ownership, Henderson joined various boards and committees, including President Elect of Pinehurst Business Partners and Event Chair for the Holly Arts & Crafts Festival. She also partnered with local organizations such as Moore County Economic Development and Moore County Chamber of Commerce and Sandhills Community College Small Business Center in events and educational opportunities. In 2026, Henderson sold her shop and now offers full-time support to both new and seasoned entrepreneurs through freelance consulting mentorship and the SCC Small Business Center program.The Small Business Center team is passionate about making business resources more accessible, and ensuring entrepreneurs know they do not have to navigate business ownership alone. Through their work with SCC, they are committed to building meaningful relationships with local businesses, community organizations, and industry partners while helping entrepreneurs move from idea to strategy, strategy to action, and action to sustainable growth.“Sandhills Community College believes deeply in the power of small business and entrepreneurship because strong local businesses create jobs, spark innovation, generate investment, and strengthen the communities we serve,” said McCaskill in press release. “Through this new Small Business Center model, Sandhills is building a stronger ecosystem where entrepreneurs can connect, grow, and thrive, while helping drive long-term economic vitality throughout our region.”To learn more about the Center's services or to schedule a consultation, please contact Kinsman directly at kinsmanl@sandhills.edu or 910-695-3938.
Sports Science: Stick Mastery
Ever wonder how hockey players stickhandle without looking down? Learn more about stick mastery in Episode 1 of Sports Science presented by Northwell Health.
Eagles vs. Bengals preseason watching guide
Learn more about the Philadelphia-Cincinnati matchup on Friday night.
Science, Public Health, and the Politics of Truth
Presented as part of the McCloskey Speaker Series.Peter Hotez, M.D., Ph.D., professor and dean of the National School of Tropical Medicine at Baylor College of Medicine, joins the Aspen Institute for a keynote lecture on the intersection of science, medicine, and public trust. A leading authority on vaccines and neglected tropical diseases, Hotez reflects on the challenges facing public health today, the growing politicization of science, and what it will take to rebuild trust in scientific institutions in the years ahead.Paepcke Auditorium, doors at 5:00 pmRegistrationThis event is free and open to the public, but registration is required, and capacity is established on a first-come, first-served basis. Once an event is at capacity, we will have an in-person waitlist at the door.Public registration is now open for summer 2026. Please click here to register.ParkingParking is very limited. Please carpool, walk, bike, or ride RFTA.Book signing will immediately follow the event. To learn more about his book or to order a copy, please click here.
8 Daily Habits to Support Your Heart, Kidney and Metabolic Health
(Feature Impact) When it comes to protecting your heart, supporting your kidney function and improving your metabolic health, you’ll find the advice for each one looks similar. That’s because your body’s systems are deeply interconnected: what affects one will have ripple effects across the others.#placement_1126603_0_i{width:100%;max-width:550px;margin:0 auto;}var rnd = window.rnd || Math.floor(Math.random()*10e6);var pid1126603 = window.pid1126603 || rnd;var plc1126603 = window.plc1126603 || 0;var abkw = window.abkw || '';var absrc = 'https://ads.empowerlocal.co/adserve/;ID=181918;size=0x0;setID=1126603;type=js;sw='+screen.width+';sh='+screen.height+';spr='+window.devicePixelRatio+';kw='+abkw+';pid='+pid1126603+';place='+(plc1126603++)+';rnd='+rnd+';click=CLICK_MACRO_PLACEHOLDER';var _absrc = absrc.split("type=js"); absrc = _absrc[0] + 'type=js;referrer=' + encodeURIComponent(document.location.href) + _absrc[1];document.write('');Cardiovascular-kidney-metabolic health, or CKM health, is a perfect example. When any one of these systems is compromised, it can lead to problems with the others. Therefore, it’s not uncommon for health problems like heart disease, stroke, diabetes and kidney disease to develop or worsen simultaneously – a condition collectively known as CKM syndrome.The reverse is also true, so habits that are healthy for your heart will have a positive effect on your kidneys and metabolic system and vice versa. Consider these simple strategies that align with the American Heart Association’s Life’s Essential 8, a list of healthy steps that can improve overall health. Learn more about how these habits and health measures affect your CKM health at Heart.org.Choose Healthy Foods – Food is your body’s fuel, so fill your tank wisely. Certain types of foods can help your blood pressure, cholesterol, blood glucose and triglycerides stay within healthy ranges, while poor nutrition can push those numbers into more dangerous territory. Focus on vegetables, fruits, whole grains, plant-based proteins (e.g. beans, legumes and nuts) and lean animal proteins (e.g. seafood, skinless poultry and low-fat dairy). Drink plenty of water throughout the day and limit added sugar and salty or fatty foods.Stay Physically Active – Exercise doesn’t have to feel like a chore – in fact, some of your favorite hobbies may already count. The American Heart Association recommends aiming for 150 minutes per week of moderate physical activity like dancing, gardening or walking, moving quickly enough to elevate your heart rate and break a light sweat. Alternatively, choose 75 weekly minutes of vigorous exercise that gets you breathing hard and fast; think running, swimming, playing tennis or riding your bike on hilly terrain.Avoid Nicotine – Tobacco and other nicotine products can raise your blood pressure, damage blood vessels and increase your risk of heart attack and stroke, which are all bad news for your CKM health. If you’re currently trying to quit, you aren’t alone, so don’t be afraid to seek out support groups and resources to help. Prioritize Healthy Sleep – Sleep gives your body a chance to rest and recover from the day, but it’s often one of the first things people sacrifice when life gets busy. Poor sleep can increase your risk for heart disease, weight gain and other issues. Aim for a solid 7-9 hours a night. Keep your bedroom cool, dark and comfortable, and do your best to limit distractions like late-night smartphone scrolling.Watch Your Blood Pressure – When your blood pressure is high, it forces your heart to work harder to pump blood through the body, which can weaken it over time. It can also damage the delicate arteries in and around the kidneys, putting CKM health further at risk. Information is power, so check your blood pressure frequently to know whether further action is needed to keep it under control.Manage Your Blood Sugar – High blood sugar can damage the kidneys, eyes, blood vessels and more, thereby increasing your chance of developing harmful CKM conditions. Controlling blood sugar is particularly important for people with diabetes. If you don’t have diabetes and still experience frequent blood sugar spikes and crashes, talk to your doctor.Control Your Cholesterol – Cholesterol comes in both “bad” (LDL) and “good” (HDL) forms, requiring a balancing act to keep your levels within a healthy range. If LDL is high and HDL is low, your risk of clogged blood vessels, heart attack and stroke are higher. Healthy levels keep blood flowing to your heart and kidneys, supporting your metabolic health in the process. See your doctor for regular bloodwork so you can monitor cholesterol changes.Maintain a Healthy Weight – Since excess body weight puts pressure on the heart, kidneys and other organs, a healthy body weight helps lower your risk of CKM syndrome. Whether you’re hoping to maintain or reduce your weight, regular exercise, healthy eating and quality sleep are all great ways to achieve your goals.
PENN Entertainment: Not Much To Get Excited About
PENN Entertainment remains a Hold with an $18 price target due to mixed earnings and limited valuation upside versus peers. Learn more about PENN stock here.
'My aim will always be to battle hard'
New forward Daizen Maeda promises he "will always run and give everything that I have" for Ipswich after arriving on a three-year contract from Celtic. The 28-year-old Japan international said his aim "will always be to battle hard, score goals, and provide assists for my team" and shared his excitement to "learn more about the club and meet the supporters". Maeda scored 79 goals in 212 appearances for Celtic, where he won five league titles, three Scottish Cups and two Scottish League Cups.
Colorado Sues EarnIn For “Immoral, Unethical, Oppressive and Unscrupulous” Business Practices
Hey all, Jason here. When this hits your inbox, I should be en route to the airport — not to go anywhere myself, just to pick up my better half. I must admit, it’s been strange to be home alone (well, with two dogs) for two weeks! Really lets me “optimize” to spending more time on reading/writing/working, whether that’s healthy or not! Looking forward to getting back into a (somewhat) more balance routine. Subscribe or Support by Upgrading Compare Notes With the People Who Built Modern Fintech Partner content: Remitly CEO Sebastian Gunningham. Increase founder Darragh Buckley. Linda Du, Co-founder & President at Valon. They’ll unpack the decisions behind building and scaling major financial products: what they got right, what broke, what they would do differently, and how AI and new infrastructure are changing the operator playbook. Most events tell you where fintech is going. NerdCon puts the people who built the present in the room and asks them what comes next. Expect an operator-led conversation grounded in real products, real trade-offs and lessons earned the hard way. Fintech Business Weekly readers save 20% on Regular tickets with code FBW20 before standard pricing ends September 11. Meet the Builders Things To Know & Other Good Reads Advent and Stripe Abandon $50 Billion Pursuit of PayPal (Bloomberg) Trump Family’s New Crypto Bank Is Backed by Abu Dhabi Sheikh (Wall Street Journal) The multiplying risks of financing data centres (FT) Let the Bond Market Speak (Wall Street Journal) Did we waste a crisis? Modest proposals to reform deposit insurance. (Fintech Takes Banking) Untangling Guggenheim: How Private Credit Built Its Own Universe (Net Interest) The Hater’s Guide To Circular Financing — Part One (Ed Zitron) Fiat Ventures Rebrands to FGV Capital, Announces $35M Oversubscribed Fund II (BusinessWire) Socure Announces Strategic Growth Investment at $5.2B Valuation and Acquires Agentic Operations Platform Fravity (Socure) Listen: When Consumer Protection Disclosures Work Too Well (Consumer Finance Monitor Podcast) Colorado Sues EarnIn For “Immoral, Unethical, Oppressive and Unscrupulous” Business Practices When Andreessen Horowitz led EarnIn’s $39 million Series B in 2017, Alex Rampell, a partner at the storied venture capital firm, described EarnIn’s small-dollar advance product as “free,” relying on “entirely on voluntary contributions instead of fees.” Rampell favorably compared EarnIn’s approach to typical payday loans, writing, “Payday loans historically have had the potential to be a slippery slope for consumers into financial distress: opaque systems and steep fees that are hard to repay and set individuals back further than where they started. For many Americans living paycheck to paycheck, that kind of slide into debt can be extremely difficult to recover from.” But EarnIn’s product — which, the company says, isn’t a “loan,” legally speaking — ends up being anything but free for most users. While it is technically possible to take a no-fee advance from the company, most users incur “Lightning Speed” (instant funding) fees and/or ostensibly optional tips that combined can equate to annualized percent rates that can reach over 1,000%. With an average term of 9.77 days, even fees and tips that are small on an absolute dollar basis are equivalent to high APRs on an annualized basis. A lawsuit filed last week by Colorado Attorney General Phil Weiser against EarnIn describes the company and its product and business practices quite differently than Andreessen’s Rampell; “EarnIn’s business practices are unfair because they are immoral, unethical, oppressive and unscrupulous,” the complaint, filed in District Court in Denver, Colorado, says. EarnIn’s marquee product, Cash Out, isn’t a loan, the company says, as Cash Out is not “[f]orward [l]ooking” because “[t]he money is transferred based on earnings to date,” does not carry a mandatory fee to access funds, and is “non-recourse,” meaning EarnIn cannot pursue recovery from users who don’t repay advanced funds. EarnIn is sometimes referred to as an “Earned Wage Advance” service. Though, unlike some others in the broader category, EarnIn does not integrate with employers’ payroll or time and attendance systems. Rather, EarnIn attempts to verify a user’s income and employment, by examining direct deposit transaction data in their linked external bank account, by using GPS location and Bluetooth data to estimate a user’s time spent at work, if they work in a fixed location, and/or by having a user provided a work email address. While repayment is theoretically optional, as EarnIn would have no recourse, such as reporting non-payment to the credit bureaus or a collections agency, this is anything but clear to users of the EarnIn app, Colorado’s complaint argues. During the process of taking a Cash Out, users must agree to a preauthorized debit of the amount advanced, plus any expedited funding fee and/or tips. Though users technically can revoke this ACH authorization, the fact that they have this right isn’t presented to users during the Cash Out process, but rather is included in linked terms and conditions few users are likely to actually read. And users who do wish to revoke their ACH authorization must do so three or more days before the scheduled transaction date by emailing EarnIn’s customer support. Similarly, EarnIn’s marketing claims that it carries “no interest” and “no mandatory fees” is technically true, but is not the reality for many of the app’s users, the Colorado complaint argues. Further, EarnIn has extensively marketed to users the ability to “access your pay today,” to get “instant” funds, and to get funds “the same day you work” — when, in reality, this speed of access was only possible by paying the additional, undisclosed Lightning Speed fee. The Colorado complaint highlights this contradiction specifically, noting: EarnIn tells consumers that they can ‘Make any day payday with EarnIn’ and that there no ‘hidden’ or ‘mandatory fees.’ For a consumer to access their pay on the same day requested, they would have to pay the Lightning Speed fee. In the fine print of the advertisement EarnIn discloses that ‘[f]ees apply to use Lightning Speed,’ a direct contradiction to the larger text of the advertisement, and a fact that would not be immediately understood by a consumer as ‘Lightning Speed’ is not defined nor explained. Like other small-dollar lending services, rather than explicitly charge interest, EarnIn collects a markup on the optional Lighting Speed fee, which, given the nature of the transactions, many users opt for, as well as offering users the option to leave “tips.” EarnIn leverages either Real-Time Payments (RTP) rails or push-to-card via debit rails if a user opts for the optional Lightning Speed. But while these capabilities cost EarnIn, on average, $0.075 or $0.20 per transaction, respectively, EarnIn charges users significantly more. Initially, EarnIn charged as little as $1.99 for Cash Outs up to $24. But EarnIn has hiked these fees multiple times, and now charges $4.99 for Cash Outs up to $75 and $6.99 for those over $75. According to the Colorado complaint, EarnIn leverages “dark patterns” to manipulate users and to make it more difficult to avoid tipping. Examples of these “road blocks” highlighted in the complaint include: As of 2023, in the EarnIn app, a consumer attempting to get a loan under the default settings had to make at least eighteen separate taps to complete the transaction and reduce the tip to $0. There is an alternative method to leave a $0 tip, via the “Custom tip” feature, but EarnIn made this option difficult to access by visually deemphasizing it and positioning it near devices’ “home” button. Using language and imagery such as “Tip to pay it forward,” “Your generosity supports the service + helps,” “Your tips make a difference,” and “[t]he APR for this cash out is 0%. Your tips help support us.” While Lightning Speed and tipping are, in theory, both optional, in practice, users nearly always ended up paying something. According to the Colorado suit, users were charged either a tip or an expedite fee for more than 92% of transactions, with an average APR of nearly 388%. And, although the advances are “non-recourse,” EarnIn successfully collects on nearly all transactions — 99.18%, according to the complaint, which, Colorado argues, “demonstrat[es] that EarnIn’s advances function as high cost loans, not voluntary payments.” The share of EarnIn users incurring fees — despite the product being marketed as 0% APR — is hard to reconcile with Andreessen investor Rampell’s favorable description of EarnIn vs. “opaque systems and steep fees” associated with payday loans, which, Rampell says, can be “extremely difficult” for borrowers to extricate themselves from. According to Colorado’s suit, EarnIn’s Cash Out product “trapped many consumers in extreme cycles of high-cost reborrowing.” The suit gives an example of one consumer in the state, who took out a whopping 1,151 loans, paying a total of $4,038.50 in Lightning Speed expedited funding fees on loans that averaged the equivalent of 1,421% APR. Another Colorado user, the suit says, took out 1,033 loans, paying $8,561.22 in tips and fees at an average APR of 1,539% . These types of usage patterns demonstrate “the severe and repeated financial harm caused by EarnIn’s illegal lending model,” the Colorado complaint argues. In aggregate, from January 2023 through July 2025, EarnIn extended 3.1 million loans to 56,778 users in Colorado — an average of nearly 55 transactions per person during the time period. EarnIn lent more than $300 million and collected more than $16 million from Colorado users in Lightning Speed fees and in tips. Ultimately, the Colorado complaint argues that “EarnIn’s Cash Outs are loans under Colorado law, and EarnIn’s contention that its product is not a loan based on its disclaimer of any legal repayment obligation lacks any real-world significance given how the Cash Out transactions actually operate in practice.” Colorado further argues that “EarnIn was not working with companies here in providing consumers with funds but acted as a third-party lender and charged illegally high rates, used deceptive design strategies to extract some charges, and trapped consumers in repeat borrowing. Colorado will continue to stand up for consumers and hold companies accountable when they violate our credit laws or attempt to evade them through misleading practices.” Colorado’s suit alleges EarnIn assesses finance charge in excess of that permitted by Colorado law, that EarnIn failed to make legally required disclosures to Colorado borrowers, that EarnIn made supervised loans to consumers without obtaining the requisite license, that EarnIn violated the state’s Deferred Deposit Loan Act, that EarnIn engage in unfair and deceptive trade practices, and that EarnIn made false or misleading statements concerning price. The suit seeks a court order enjoining EarnIn from violating relevant Colorado laws, for EarnIn to refund amounts charged in excess of state law, fees, costs, and penalties, and other relief the court deems to be just. Fintech Business Weekly is made possible by the generous support of paying subscribers — bringing you independent analysis of banking, fintech, and crypto without fear or favor. You can support my work by becoming a paying subscriber if you aren’t already. Paying subscribers enjoy: access to the entire archive of nearly six years of newsletters extended versions of the weekly newsletter, with additional content and analysis and (for founding member tier) quarterly personal 1:1 fintech Q&A / strategy calls with me, tapping into my unparalleled knowledge of the intersection of banking and fintech and experience working in the sector, including helping to launch Goldman Sachs’ retail bank Marcus Support Fintech Business Weekly You can also support Fintech Business Weekly by sponsoring a newsletter or podcast, putting you in front of 93,000+ of the most influential decision makers in banking, fintech, and crypto. Learn more about sponsor opportunities or request a media kit by dropping me an email. Q2 Quarterly Banking Profile: Five Quick Takeaways The FDIC released its quarterly banking profile, which is always worth a read, for the second quarter. The profile provides an aggregate snapshot about the overall health of the 4,238 institutions whose deposits are insured by the FDIC, who, collectively, hold more than $26 trillion in assets and saw a total net income of more than $90 billion in the second quarter. Net income was up 12% vs. Q1 2026, with lower provisions and realized gains on securities helping to drive the improvement, somewhat offset by increases in non-interest expense and applicable income taxes. Overall net interest margin was basically flat quarter over quarter (up 1 basis point vs. Q1 2026), though community banks saw NIM grow by 10 basis points, to 3.81%. Unsurprisingly, given that interest rates haven’t changed, unrealized losses on securities changed little, edging up slightly to $326.7 billion vs. $325.1 billion in Q1 2026. Aggregate credit quality has remained benign, with asset quality actually improving slightly in Q2. Overall, institutions reported a 9 basis point decline in their past-due and non-accrual rate, to 1.44%. Net charge off rate also declined by 2 basis points, to 0.57%. And finally, the FDIC’s deposit insurance fund stands at $161.1 billion, making the DIF reserve ratio 1.48% — above the statutory minimum of 1.35%, but still below the designated target reserve ratio of 2%. [Paid Subscriber Exclusive] Nissan Withdraws ILC App, State Associations Plan BankChain Alliance, FDIC Defines “Unsafe or Unsound Practice” For First Time Automaker Nissan withdrew its application to charter a Utah industrial loan company and its corresponding application to the FDIC for deposit insurance last week, on August 19th. Nissan’s application had been outstanding for more than a year, as it originally applied in June 2025. Recent applications to the OCC to form national banks have been decisioned, one way or the other, substantially more quickly than has historically been the case.