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Results for " Ken " 8,930 found 🔀 AI-powered Shuffle

Manchin says ‘if character means anything, you can’t vote for Ken Paxton’

“I don’t know that young man and things he’s said I’m discouraged about, but I can tell you, if character means anything, you can’t vote for Ken Paxton, if character means a…

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Sep 27 • 4:46 PM EDT • Politics • newsnationnow.com
Kenneth Walker III totals two touchdowns

Kansas City Chiefs running back Kenneth Walker III rushed 18 times for 70 yards and a touchdown in the Week 3

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Sep 27 • 4:20 PM EDT • Sports • sports.yahoo.com
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8,000-Mile 2001 Porsche 911 GT2 Clubsport For Sale And You're Too Chicken To Actually Drive It

With low miles on the clock and in excellent condition, this rare Porsche 911 GT2 Clubsport is going to be an expensive buy for the final bidder.

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Sep 27 • 4:05 PM EDT • Technology • jalopnik.com
Republican senator criticizes White House for taxpayer-funded Trump ads

John Kennedy pushes back against such spending as pro-Trump ‘public service announcements’ air before midterms

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Sep 27 • 3:54 PM EDT • Politics • theguardian.com
Experimental Emulator Brings Nintendo Switch Games to Jailbroken PS5 Consoles

An unofficial port of the Eden Nintendo Switch emulator is now running natively on jailbroken PlayStation 5 consoles. Developer BlackBearReloaded released ProsperoEden, which adapts Eden, itself a fork of the now-defunct Yuzu project, to run directly on Sony's hardware as homebrew rather than...

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Sep 27 • 3:03 PM EDT • Technology • techpowerup.com
Sen. Kennedy urges Trump to focus on affordability, address nation on Iran ahead of midterm elections
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Sep 27 • 2:35 PM EDT • Politics • cbsnews.com
High-Signal Publisher
Jalen Brunson hosts 'SNL' Season 52 premiere as Weekend Update spoofs Anthropic's Dario Amodei

Knicks star Jalen Brunson hosted the "SNL" Season 52 premiere with help from his teammates, Katseye made its debut and Jane Wickline spoofed Anthropic CEO Dario Amodei.

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Sep 27 • 2:02 PM EDT • Entertainment • yahoo.com
College football rankings shuffled with Florida surging in US LBM Coaches Poll Top 25

The results of Week 4 in college football have shaken up the US LBM Coaches Poll Top 25. See who is moving up and who is moving down.

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Sep 27 • 12:47 PM EDT • Sports • sports.yahoo.com
Kennedy suggests ‘rule’ that no politician should have a building named after them while alive

GOP Sen. John Kennedy (La.) said Sunday that public officials should not have buildings named after them while they are alive, as President Trump fights to rename the Kennedy Center after himself.&…

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Sep 27 • 12:39 PM EDT • Politics • thehill.com
Ghosts of Drumcree wakened as questions loom over Stormont's future

We are again reminded of the unfinished business of that peace and of roads yet to travel, writes Brian Rowan.

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Sep 27 • 12:23 PM EDT • Politics • yahoo.com
Anna Kendrick Is “Over the Moon” About Directing ‘The Seven Husbands of Evelyn Hugo’

The 'Babies' actress covered George Clooney, 'Twilight' ("what the f*** am I doing here?") and 'Pitch Perfect's "revisionist history" in a career-spanning conversation at the Zurich Film Festival.

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Sep 27 • 11:39 AM EDT • Entertainment • yahoo.com
Ure's 'different' route can inspire Scots

Callum Davidson believes other Scottish players can emulate the route Robbie Ure has taken to reach international level. Ure, 22, made his Scotland debut in Saturday's 0-0 Nations League opener with Slovenia in Ljubljana. "A lot of young Scottish players can look at the route he's gone down to get there," former Scotland left-back Davidson told BBC Radio Scotland's Sportsound.

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Sep 27 • 11:11 AM EDT • Sports • sports.yahoo.com
Sun Belt Week 4 Takeaways

This was the last weekend of non-conference games for the majority of the Sun Belt. Now these teams have enough of a sample size to get a feel for what they can be against their main competition. The stakes will only rise from here, but they've played one conference game and several other high-profile matchups …

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Sep 27 • 11:00 AM EDT • Sports • sports.yahoo.com
Harry Kane sends message of congratulations to Real Madrid star

Bayern Munich and England star Harry Kane has this weekend sent a message of congratulations the way of fellow countryman Jude Bellingham.This comes after the latter beat his illustrious teammate to t...

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Sep 27 • 11:00 AM EDT • Sports • sports.yahoo.com
Shockingly blue turtle discovered in Kentucky backyard

PSA: Do not paint turtles.

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Sep 27 • 10:36 AM EDT • Science • popsci.com
Comedian Rips Into Ed Sheeran: 'Red-Headed Puppet With A Hand Up His Ass'

The “Chicken Shop Date” host didn’t hold back during her “SNL UK” monologue.

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Sep 27 • 10:27 AM EDT • Entertainment • huffpost.com
Uber CEO says ‘really demanding’ work culture includes expecting employees to answer emails over the weekend: ‘Don’t come here if you want to coast’

Uber boss Dara Khosrowshahi said the most important skill in life is working hard: “I’m not going to let anyone outwork me.”

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Sep 27 • 9:09 AM EDT • Technology • fortune.com
Rangers vs. Twins Preview: Season on the Line

Texas Rangers' MacKenzie Gore takes the mound in a high-stakes finale, needing a victory and help from the Houston Astros to secure a postseason berth.

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Sep 27 • 9:00 AM EDT • Sports • sports.yahoo.com
'Dual Threat Dru' DeShields raising Kent State football's expectations

Kent State University QB Dru DeShields knows how to use his legs and arm on the football field. He showed off all his tools in a win over Ball State.

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Sep 27 • 8:53 AM EDT • Sports • sports.yahoo.com
Sunday Puzzle: So-so

NPR's Ayesha Rascoe and WYPR listener Katherine Jakuta of Baltimore, Maryland play the puzzle with Weekend Edition puzzle master Will Shortz.

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Sep 27 • 8:46 AM EDT • Entertainment • kgou.org
Nintendo Switch emulator now runs natively on jailbroken PS5, Cuphead reaches 60 FPS

ProsperoEden is an experimental native PS5 port of the Eden Nintendo Switch emulator, with several games already reaching gameplay on jailbroken consoles.

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Sep 27 • 8:33 AM EDT • Technology • videocardz.com
Major Louisville events bring visitors and sales to NuLu businesses

Major Louisville events are sending visitors into NuLu, where restaurants, shops and small businesses say foot traffic is boosting sales this weekend.wei

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Sep 27 • 8:23 AM EDT • Business • spectrumnews1.com
Rogers Tries to Make El-Sayed’s Health Care Plan Scary

_Taylor, Michigan_HERE’S HOW YOU CAN TELL Mike Rogers is anxious to make up ground in the Michigan Senate race: He held a press conference on health care last weekend. Health care is usually a rough issue for Republicans, because voters associate the GOP with attacking cherished programs like Medicare and Medicaid that Democrats have historically supported. It’s a particularly difficult issue in this campaign, because a few months ago Donald Trump and the Republicans refused to extend temporary financial assistance in the Affordable Care Act. As a result of that decision, more than 20 million Americans faced higher insurance prices this year. That’s not a policy choice you want to be defending at a time when voters frequently cite the cost of health care as a top concern. Throw in the fact that Democratic nominee Abdul El-Sayed can draw on his credibility as a doctor and former public health director in Detroit, and it might seem like Rogers’s best bet would be to avoid health care altogether. But Rogers had his reasons to spotlight health care last Saturday. And they became apparent a few minutes before he spoke, when members of his campaign staff There’s a lot happening. Too much, some days. We can’t promise to have all the answers. But we can promise to keep asking the questions, following the facts, and figuring things out alongside people who care about where this country is headed. Read with us. Learn with us. And when it matters, stand with us. Join the side you’re already on. Join Bulwark+

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Sep 27 • 8:01 AM EDT • Health • thebulwark.com
2026 VMAs: How to watch live tonight, who's performing, full nominations list and more

You don't need MTV to watch! Here's how to tune in live to this weekend's star-studded show.

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Sep 27 • 7:03 AM EDT • Entertainment • yahoo.com
Maha split shows all is not well with Kennedy’s US health revolution

Republicans worry Make America Healthy Again is an electoral liability while activists claim it has abandoned its values

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Sep 27 • 6:00 AM EDT • Health • ft.com
Burnham: 'Broken social care will in the end break the NHS'

Andy Burnham said the proposed care service would be laid out in detail and put on the ballot at the next general election.

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Sep 27 • 5:52 AM EDT • Politics • bbc.com
Takuma Inoue vs. Tenshin Nasukawa 2 live results update

Welcome to the live results update for the Takuma Inoue (22-2, 5 KOs) vs. Tenshin Nasukawa (8-1, 3 KOs) rematch! Their bout headlines a Teiken Promotions card at the Toyota Arena in Tokyo, Japan. Fight fans in Japan will be able to catch the action live on Prime Video. The rest of the world will […]

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Sep 27 • 5:17 AM EDT • Sports • sports.yahoo.com
It's Your Business | Couple brings gym to Fisher with Jacked Rabbit Fitness

Travis Enghausen and Ashley Warlow hope to have a grand opening on the weekend of Nov. 14 for their business, which they’ve decided to call Jacked Rabbit Fitness — perfectly

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Sep 27 • 5:15 AM EDT • Business • news-gazette.com
DeMarco Murray addresses managing Kenneth Walker III's workload

During his press conference, Kansas City Chiefs running backs coach DeMarco Murray addressed managing Kenneth Walker III's workload | @EdEastonJr

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Sep 27 • 5:03 AM EDT • Sports • sports.yahoo.com
A ‘Big Problem’: Trump’s War With Iran Drags Down Republicans in Midterms

As their November picture darkens, and gas and diesel prices soar, some Republicans who backed the war for months are now changing their tune.

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Sep 27 • 5:01 AM EDT • Politics • nytimes.com
I read MacKenzie Scott's post-divorce, dystopian novel. It's baffling.

MacKenzie Scott self-published her novel 'Last Days in Two Nations' on Substack. It's her first novel since divorcing Jeff Bezos, and it's baffling.

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Sep 27 • 4:14 AM EDT • Business • businessinsider.com
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'Gaming pays me double what I earned as a teacher'

Jarvs Tasker says it would have taken her 20 years as a teacher to make what she earns now.

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Sep 27 • 1:38 AM EDT • Technology • bbc.com
Wales XI vs Denmark – Predicted lineup and team news

Wales are set to face Denmark away from home on Sunday in their next UEFA Nations League fixture at the Parken Stadium.The visitors arrive in Copenhagen amid a difficult run of form, having failed to ...

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Sep 27 • 1:05 AM EDT • Sports • sports.yahoo.com
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CDC vaccine policy recommendations grind to a halt under Health Secretary Kennedy - WSVN 7News | Miami News, Weather, Sports

NEW YORK (AP) — The Food and Drug Administration recently approved a new flu vaccine that tested well in older adults. But the federal agencyRead More

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Sep 26 • 11:52 PM EDT • Health • wsvn.com
Stampede Blue Reacts Survey Results

The Horseshoe faithful have spoken! (And who could rightfully blame them right now)

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Sep 26 • 11:50 PM EDT • Sports • sports.yahoo.com
Colts represented at Notre Dame v. Purdue game

The Indianapolis Colts are known to have representatives at a college football game on the weekend of Sept. 26.

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Sep 26 • 9:41 PM EDT • Sports • sports.yahoo.com
AP Entertainment SummaryBrief at 8:30 p.m. EDT

Kennedy Center put off planned repairs despite known structural issues, former employees allege

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Sep 26 • 8:30 PM EDT • Entertainment • dailyrecordnews.com
Laken Tomlinson joining Green Bay

The Green Bay Packers are adding OG Laken Tomlinson off the Dallas practice squad

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Sep 26 • 8:20 PM EDT • Sports • sports.yahoo.com
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Boston 25 News

On a beautiful Friday afternoon in Stow, business is brisk at Shelburne Farm. There is a big storm coming, and people are getting their weekend apples now.

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Sep 26 • 7:45 PM EDT • Business • facebook.com
Four Chord Music Fest brings nearly 30 acts to Pittsburgh for 12th year

For 12 years, Four Chord Music Festival has called Pittsburgh home, and this weekend, thousands of fans packed F.N.B. Stadium for another year of music, merchandise and memories.

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Sep 26 • 6:37 PM EDT • Entertainment • fresnobee.com
San Diego County issues health warning over recalled cheese

Officials issued a warning this weekend urging residents not to eat Northern California-based Sierra Nevada Graziers raw milk cheese.

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Sep 26 • 5:29 PM EDT • Health • nbcsandiego.com
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Kennedy Center put off planned repairs despite known structural issues, former employees allege

The center’s executive director and chief operating officer, Matt Floca, did not treat the roofing issues as priorities and in April halted a funded plan to address them, according to the letter Thursday signed by David Seide, a lawyer representing the anonymous whistleblowers.

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Sep 26 • 4:43 PM EDT • Politics • pbs.org
Chelsea attacker, on loan at Celtic, makes England U20s debut

Shumaira Mheuka has taken another significant step in his development after making his England Under-20 debut during a 3-1 victory over Italy. The attacker joined Celtic on a season long loan from Xab...

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Sep 26 • 4:30 PM EDT • Sports • sports.yahoo.com
No, Xbox didn't pay $400 million for Hideo Kojima's 'PHYSINT'

A new rumor going around this weekend has put Xbox's investment in Kojima Productions way above the real figure. But it remains to be seen just how spendy the projects will end up being.

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Sep 26 • 3:11 PM EDT • Technology • windowscentral.com
Packers sign guard Laken Tomlinson from Cowboys’ practice squad

The Packers get some long-awaited offensive line help.

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Sep 26 • 2:40 PM EDT • Sports • sports.yahoo.com
Kennedy Center put off planned repairs despite known structural issues, former employees allege

Some former Kennedy Center employees are accusing officials at the performing arts venue of long knowing about structural issues they recently cited as new problems | WBBM Newsradio 780 AM & 105.9 FM

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Sep 26 • 1:34 PM EDT • Entertainment • audacy.com
Kennedy Center put off planned repairs despite known structural issues, former employees allege

Some former Kennedy Center employees are accusing officials at the performing arts venue of long knowing about structural issues they recently cited as new problems | WBEN

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Sep 26 • 1:34 PM EDT • Entertainment • audacy.com
Kennedy Center put off planned repairs despite known structural issues, former employees allege

Some former Kennedy Center employees are accusing officials at the performing arts venue of long knowing about structural issues they recently cited as new problems. The anonymous whistleblowers...

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Sep 26 • 1:34 PM EDT • Entertainment • stamfordadvocate.com
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🔥 Martial offered, Juventus-Anguissa and Dybala update: today’s news

First weekend break for all international football, with the Nations League taking over from Serie A.Watch the entire Serie BKT live with LaB Channel on OneFootball: subscribe for just €9.99 per mon...

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Sep 26 • 12:54 PM EDT • Sports • sports.yahoo.com
Star Wars: The Force Awakens — Science Lessons vs. Story Rules

Special effects are not worthless but they are second-tier when it comes to storytelling.

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Sep 26 • 12:18 PM EDT • Science • mindmatters.ai
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Youth sports are broken. Reality TV and Kim Kardashian are cashing in.

The conversation about youth sports has made it to reality TV.

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Sep 26 • 11:30 AM EDT • Entertainment • thenewstribune.com
ACC Football: A look around the conference’s matchups this weekend

Orange are off so let’s look around the ACC

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Sep 26 • 11:30 AM EDT • Sports • sports.yahoo.com
☹️ Negative (-8%)
The Weekend Mauling: 9/26/26

Kansas Jayhawks News Tre White use headed back to Kansas. What does it mean for Self and the Jayhawks? Through the Phog writes that one former Kansas player from recent years would make this year’s team unstoppable if you could add him to the roster (though I don’t think even the current eligibility situation would […]

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Sep 26 • 10:53 AM EDT • Sports • sports.yahoo.com
Kansas City Royals news: The last weekend of Royals baseball

And Congrats to Denny!

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Sep 26 • 10:32 AM EDT • Sports • sports.yahoo.com
Intel Panther Lake Teardown, 18A, BSPD, GAAFET, SemiAnalysis STEEL

Panther Lake debuts the first commercial implementation of backside power delivery (BSPDN), introduces Intel’s first iteration of gate-all-around (GAA) transistors, and showcases their advanced packaging capabilities with its Foveros-S assembly. With Panther Lake, Intel’s manufacturing arc has shifted from nebulous roadmaps to shipped silicon, a significant milestone on their long road back to competitive semiconductor manufacturing. To evaluate the extent of Intel’s comeback, we tore down Panther Lake. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Our teardown traces 18A from its four-sheet RibbonFETs (Intel’s marketing name for GAAFETs) and gate stacks through contacts, frontside and backside wiring, and the bonded carrier. We explain how these material and integration choices improve gate control and reduce resistance, while adding capacitance, thermal resistance, and process complexity. Our measurements put Panther Lake’s 18A compute logic and TSMC N3E GPU logic at similar logic density. However, 18A does not lead TSMC N3P, N2 or Samsung SF2 in peak density. Panther Lake’s CPU cores are incremental updates, and the high-end GPU still uses TSMC N3E. Panther Lake assembles one compute tile, one GPU tile, and one I/O tile atop a passive base tile using Intel’s Foveros-S advanced packaging. Both compute tile variants use Intel 18A. The Xe3 GPU options are a 4-core GT1 tile on Intel 3 and a larger 12-core GT2 tile on TSMC N3E. Both I/O tile variants use TSMC N6. [1], [2] Our analysis centers on the PTL-U compute tile, both the 4-core and 12-core GPU tiles, as well as the 12-lane I/O tile. In conventional chips, power and signal are routed through the same frontside metal stack towards the device frontend. Power rails consume scarce routing resources near the transistors, while tall via stacks carry VDD and VSS from the coarse upper wires to local rails. Backside power delivery (BSPD) moves the main power network behind the transistor layer, to the backside, separating it from frontside signal routing. We covered BSPD and its impacts in 2024. [3], [4], [5] Intel’s BSPD implementation, branded as “PowerVia”, routes power through dedicated backside metals to nano-TSVs, which connect those rails to local source/drain (S/D) contacts. Implementing that separation requires Intel to build the interconnect stacks from both sides of the wafer. The frontside comprises the M0-M14 signal stack, while the backside comprises the BM0-BM5 power stack. M0 and BM0 are closest to the transistors. The nano-TSVs connect the two sides, but Intel patterns and etches each via from the front after forming the contacts. A narrow via runs from the side of the contact deep into the silicon substrate. Intel then completes the frontside signal metal stack, bonds the wafer to a carrier, flips it and removes the original substrate until the buried via tips are exposed. The backside metal stack is then deposited directly on the revealed vias. The nano-TSV and backside-via profiles taper in opposite directions because Intel forms them from opposite sides of the wafer. The transistor structures form the FEOL. Local contacts and nano-TSVs connect them to the wiring. M0 begins the frontside interconnect stack. The silicon carrier remains attached above the frontside interconnects. It supports the device wafer during substrate removal and backside processing and remains part of the finished chip’s thermal path. PowerVia removes the main power distribution from the congested frontside metals, routing supply through shorter and wider backside wires. Its lateral landing still occupies area in the standard cell, so it recovers less cell area than a direct backside contact. [3] Nano-TSVs beside the logic devices carry VDD or VSS from the backside power network, while signal connections continue upward through the frontside metals. Backside Interconnects Samsung SF2 data is included for comparison to Panther Lake’s within this article. SF2 is the incumbent GAA foundry node but lacks BSPD, serving as a useful reference to evaluate 18A. A full teardown of Samsung’s S26 products, processed on SF2, will be shared soon.Nanosheet-cut EDS comparison. The PowerVia supply path runs from the backside Cu rails through Mo-lined W nano-TSVs to the local transistor contacts. In this cross section, the tapered connection spans roughly 150 nm from the contact level to BM0. The Ta liner confines Cu and promotes adhesion to the surrounding stack; the AlOₓ etch stop controls the next dielectric etch above the rail. Dielectric beneath the ribbons electrically separates the devices from the backside wiring and removes the conducting silicon body below the channel. [6] AlOₓ serves as an etchstop (ES), enabling endpointing and protecting the underlying layers. Low-volatility aluminum fluoride reaction products resist the fluorinated plasma, allowing a thin AlOₓ film to protect the metal while the surrounding low-k dielectric is removed. [6], [7]. While the BM0 and layers above the M1 lines show double AlOx layers, Our SMIC N+3 teardown showed single AlOₓ layers. SMIC uses a simpler local AlOₓ substack, while the remaining cap and etch sequence provide the required landing protection. So why double layers? The closely spaced AlOₓ doublets provide two protected endpoints in the etch sequence. Intel documents an AlOₓ/SiN/AlOₓ stack that explains the benefit. The main dielectric plasma etch stops on the first AlOₓ film; a selective wet clear opens that film; a second plasma etch removes the intermediate SiN and stops on the second AlOₓ film. The final wet clear exposes the metal landing surface. SiN is the intermediate dielectric in Intel’s published example. [8] The second stop protects the metal through a cap breakthrough. Wide openings can etch faster than narrow ones, and etch depth varies across the wafer. Metal under an early-clearing opening would otherwise be exposed while other openings still need more etching. Staged protection widens the process window and reduces metal erosion, corrosion and void formation. [8] TSMC documents AlN/AlOₓ/SiOC/AlOₓ above Cu, with AlN blocking Cu diffusion, and a simpler AlN/SiOC/AlOₓ variant that omits one AlOx film. [9] Levels with different opening sizes, aspect ratios, pattern densities and cap materials need different etch margins. A double AlOx stop is useful where another protected endpoint justifies the added processing. The extra film adds formation, selective opening and cleaning steps, plus another set of interfaces to control adhesion, moisture, and stress. These blanket films are opened through the existing via pattern, so each film does not require another lithography mask. AlOₓ adds parasitic capacitance when it replaces lower-k dielectric; two thin AlOₓ films can nevertheless contain less AlOₓ than one thick film. Total thickness, placement, and theintermediate dielectric determine the electrical cost. Deposition chemistry also changes AlOx permittivity and residual hydroxyl content, which can oxidize the underlying metal. [7], [8], [10], [11] The backside stack separates into relatively fine BM0-BM2 wiring near the devices and coarser BM3-BM5 power distribution. The largest pitch increase occurs between BM2 and BM3. BM0’s pitch closely matches the logic-row height, fitting local power delivery to the cell rows. Higher levels aggregate current through larger conductors: routing density becomes less important than low resistance and current capacity as the network approaches the package. This hierarchy provides wide power wiring for the power delivery network without consuming scarce frontside signal-routing resources. [3] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Frontside Interconnects Intel 18A combines Mo-lined W contacts and nano-TSVs with a separate backside Cu power network. Samsung SF2 keeps power on the frontside, using Ti-based contact interfaces and Ta-based barriers and Co liners around Cu wiring. In 18A standard-cell rows, backside power rails supply the devices through nano-TSVs within the cells, freeing frontside routing resources. Samsung’s M0 accommodates both power and signal connections. From the device toward M0, the connection runs through a Ti-based S/D interface, W contact fill, a Mo-lined W via, and the Cu M0 wire. Mo supplies a conductive nucleation and adhesion layer for W, replacing the resistive TiN liner used in conventional W integration. This increases the effective conduction volume within the feature while retaining W fill and its established polishing, cleaning and etching processes. Intel’s Mo/W patent describes this integration tradeoff. The nano-TSV uses the same Mo-lined W construction in the backside supply path. [12] The move from TiN to Mo is an incremental change. While a full Co or Mo fill can also reduce the volume lost to liners in very small features, it requires new integration schemes that increase complexity and risk. Cu remains attractive for wider wires due to its low resistance. As wires and vias shrink, the diffusion barrier consumes an increasing fraction of their cross-section. [12], [12], [14] Intel uses Co/Ru liners at M0-M1, Co at M2-M4, and Nb at M5-M9. The lower-level liners help Cu adhere and reduce void formation during trench fills. Applied Materials’ Endura has new thermal control that facilitate wetting process, so the thin film continuity is good enough that good capillary pressure will drive Cu atoms to the via bottom without voiding. Intel’s choice to use Nb is particularly interesting. Intel’s Nb patent describes a conductive diffusion barrier intended to reduce the barrier’s contribution to resistance relative to conventional Ta-based barriers, particularly at via bottoms where all current crosses the barrier. The patent pairs Nb in coarser levels with the option of lower-cost PVD processing. [15], [16] The upper metal layers support thicker barriers formed through physical vapor deposition (PVD) despite its worse coverage and uniformity. Meanwhile, the lower metal layers require thinner barriers deposited through conformal atomic layer deposition (ALD). Co/Ru adds another material interface and requires controlled deposition and Cu fill. Changing liners and barriers by metal layer allows Intel to optimize interconnect resistance, process complexity, and reliability. [15, 16] RibbonFET, Intel’s name for its gate-all-around FETs (GAAFETs), replaces the FinFET’s vertical fins with four stacked horizontal silicon nanosheets, allowing the gate to surround the channel on every side. The path to GAAFET begins with the planar transistor. A planar MOSFET places the gate above the channel between its source and drain. Pairing an NMOS with a PMOS transistor creates a CMOS inverter, in which the NMOS pulls the output low for a high input, and the PMOS pulls it high for a low input. The gate must retain electrostatic control of the channel to ensure clean switching. As gate lengths shrank, the drain began to compete with the gate for that control, increasing off-state leakage. Electrostatic control was restored through an architectural evolution that raised the channel into a vertical fin and wrapping the gate around three sides. Called “FinFET”, this new architecture packed more effective channel width into a smaller footprint. Further scaling made it harder to maintain both drive current and leakage within smaller cells, and reintroduced the same problems planar MOSFETs faced. Nanosheet GAAFETs close the fourth side by replacing the vertical fin with a stack of horizontal nanosheets, each surrounded by the gate. The tighter electrostatic control suppresses leakage at shorter gate lengths while stacking adds effective channel width within the cell footprint. In a FinFET process, channel width changes in discrete steps as designers must add or remove whole fins. Nanosheet width can instead be adjusted continuously within the process’s design rules. Wider sheets increase drive current, while narrower sheets reduce capacitance at the cost of drive current. Intel 18A uses stacks of four nanosheets each and varies their widths across logic and SRAM. At the process level, adding more sheets to each stack increases effective channel width and drive current, but complicates fabrication. RibbonFET vs MBCFET Samsung began GAAFET production in 2022 with SF3E, following with SF3 and now SF2. Its ‘MBCFET’ provides a useful structural comparison with Intel’s first RibbonFET implementation. [17] STEEL is digging deeper into SF2, used in the Exynos 2600, and TSMC’s GAAFET N2, used in Apple’s A20 Pro, in upcoming newsletter articles. We’re throwing some teasers on X. Let’s compare Samsung SF2’s MBCFET with Intel 18A’s RibbonFET. Subscribe Even to the untrained eye, Intel’s extra nanosheet is obvious. Intel stacks four ribbons to Samsung’s three. Samsung’s sheets are much wider in these fields, so both sheet count and width matter to the available channel perimeter. Sheet width also changes which silicon surfaces carry current. On conventional (001) silicon, wide nanosheets emphasize the broad top and bottom surfaces, favoring electron transport; the larger sidewall contribution in a narrow sheet favors hole transport. Thinner sheets improve gate control but increase confinement and scattering. This makes width and thickness part of the NMOS/PMOS balance, alongside strain and threshold voltage. [18], [19] GAAFET designs like 18A use different work-function-metal (WFM) stacks for NMOS and PMOS. Around each ribbon, a thin SiOx interfacial layer separates the silicon channel from the HfOx high-k dielectric, with La providing dipole tuning and the WFM wrapping the dielectric. NMOS uses a TiAl-based stack, while PMOS uses TiN WFM. W fills the remaining gate trench, providing a lower-resistivity path where the work-function layers are no longer needed. In this field, the PMOS stacks leave room for W between ribbons, while the NMOS stacks occupy more of those gaps. A silicon-based dielectric marks the P/N boundary, allowing the PMOS and NMOS gates, sharing the same gate trench, to be processed sequentially. Fast logic paths, retention circuits, and SRAM need a family of threshold options. Changing threshold without substantially changing device dimensions, capacitance or fabrication complexity is valuable. FinFET processes typically use different work-function-metal stacks. In a four-ribbon GAA stack, the narrow sheet-to-sheet gap limits how much WFM can fit around each channel. La in the gate dielectric creates interfacial dipoles at the SiOx/HfOx boundary, shifting effective work function and tuning threshold voltage. This gives Intel another control alongside its NMOS and PMOS WFM stacks. Low-threshold devices improve critical-path drive; higher thresholds reduce leakage elsewhere. Dipole tuning is especially useful in GAA because it changes threshold without consuming the narrow intersheet gap with thicker WFM. Precise control of La incorporation, diffusion and interface quality has long been a challenge, limiting viability in high volume production but is now seen from every leading-edge foundry. Intel’s patent describes depositing a dipole-forming oxide above HfOx and annealing it toward the interfacial oxide before completing the work-function and fill metals. This separates threshold tuning from the space available for metal. Newer research addresses the thermal cost: imec’s 2026 dipole-middle research inserts the shifter between two HfOx depositions, shortening the diffusion path while protecting SiOx during patterning. [20], [21]Matched-cut EDS, Intel 18A (left) vs. Samsung SF2 (right). Intel retains raised source/drain epi beneath its contacts, while Samsung recesses W deep into the epi to form a V-shaped Ti-lined interface. The deeper contact increases metal-to-semiconductor area and shortens the current path from the lower sheets, reducing contact and spreading resistance. It also removes epi volume and brings the contact etch closer to the channel ends. Retaining more epi preserves the material available for strain transfer, especially from SiGe into PMOS. These geometries balance contact access against stress engineering and etch margin. [22], [23] Samsung stacks three sheets to Intel’s four ribbons, and both processes use sheet width to tune drive strength. In our Samsung cross-sections, widths range roughly from 19 to 30 nm in the NPU rows and 37 to 50 nm in the CU cell. The Samsung nanosheets taper, with the widest sheet at the bottom and the narrowest at the top. Both processes use HfOx gate dielectric and Ti-based work-function stacks, with Al in the NMOS stack. In the Samsung devices shown here, the dielectric and WFM occupy the intersheet gaps, leaving W above the top sheet. Intel’s PMOS stack leaves more room between ribbons, and W fills those gaps while the thicker NMOS stack leaves W mainly in the upper trench. Gate-stack EDS maps. The W between Intel’s PMOS ribbons provides a conductive path close to the lower gates. Where WFM fills the entire gap, the gate still surrounds the channel, but voltage reaches it through the more resistive work-function films. Thinner WFM and dipole tuning preserve room for low-resistivity fill; Mo and Ru are alternative fill metals being developed for further scaling. [24] A masked, sequential WFM flow explains the different gate heights and inter-nanosheet fill. The proposed sequence below shows how separate NMOS and PMOS work-function steps produce that geometry. Enabled by the BSPDN process, Intel replaces the dense-logic silicon subfin with dielectric, removing the parasitic conduction path below the ribbons and reducing substrate-related capacitance. A retained silicon body as in classical, non-SOI, planar and FinFET designs needs junction and punchthrough-stop engineering to suppress leakage. Dielectric isolation makes that leakage less sensitive to the subfin doping profile but adds removal and fill steps. It also weakens the direct thermal path through silicon, making the contacts, metal stacks and package more important for heat extraction. [24], [26] Fluorine is concentrated around selected Intel device structures in the maps. WF6 is a standard precursor for W nucleation and fill, while barrier films protect adjacent dielectrics from fluorine attack. Low-fluorine W processes reduce the residual-F burden. Chloride-based precursors avoid introducing F during W deposition, but require control of chlorine attack, nucleation and fill quality. The integration target is a continuous, low-resistance W path with a thin protective liner and minimal chemical damage to the surrounding stack. [20], [27], [28] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. We measured cell height, gate pitch, metal geometry, and ribbon dimensions at the XTEM sites shown below. The tables group these dimensions by site and device polarity. Our “sheet cuts” cross the silicon channel and show the ribbons end-on. “gate cuts” run along the channel through successive gates. The 18A logic cell dimensions point to a five-track logic library while the N3E and Intel 3 cell dimensions evidence a seven-track logic library. The DDR-PHY uses wider M0 wires and much larger spacing than core logic. That trades routing density for lower wire resistance and weaker coupling between neighboring nets. The geometry suits the current delivery and coupling requirements of analog, clock, and I/O circuitry. PowerVia lets 18A combine a compact cell height with wider M0 geometry by moving the main power rails off the signal-routing tracks. That relaxes local wire scaling while preserving a small cell footprint. Cell height and gate pitch set the geometric density; pin access and routability determine how much of it a real block can use. [29] The biggest takeaway from our gate-pitch measurements is that Intel 18A compute logic and TSMC N3E GPU logic have similar density in the Bohr representative-cell model. The 18A example is 18.6% denser than the Intel 3 GPU example. Gate pitches are nearly identical across the three sites, so cell height drives most of the difference. The Bohr model combines a four-transistor NAND2 spanning three gate pitches and a 32-transistor scan flip-flop (SFF) spanning nineteen pitches, weighting their densities 60:40. The sensitivity column shows how independently changing cell height and gate pitch by ±1 nm changes the result. This compares representative cell geometries; whole-die density also depends on cell mix and placement. The 18A P-core gives M0 substantially more metal cross section than the N3E vector engine. Treating each profile as a trapezoid gives 2.63 times the area per line and 1.84 times the area after normalization by routing pitch. The larger section reduces the geometric contribution to line resistance and lowers current density for a given current. Taller and wider wires also add capacitance, so circuit delay depends on the balance of resistance and capacitance. The DDR-PHY has less metal area per routing width than the 18A core fields, while remaining above N3E. [30] Area = height × (top CD + bottom CD) / 2, including liners. Area/pitch normalizes by routing width. Taper is the symmetric sidewall angle from vertical, with the largest angle belonging to the DDR-PHY. Compute tile The measurements show how ribbon dimensions and gate-stack geometry vary across the compute tile and between NMOS and PMOS to balance channel drive, gate load and the space needed for the dielectric/WFM stack across logic, SRAM and the DDR-PHY. Width mainly changes available channel perimeter; thickness also changes electrostatic control and carrier confinement. Gate-stack thickness then determines the space left for low-resistivity fill P-core and LP E-core logic Both the P-core and LP E-core use multiple nanosheet widths. Widths are measured on high-magnification XTEMs while wider-field images demonstrate additional width choices within the LP E-core. Multiple widths are expected even within an LP E-core. Timing-critical paths, buffers and cells with different fanout need different drive strengths. The lower-magnification fields show this width diversity beyond the sites quantified in the table. L2 and L3 SRAM GAA gives SRAM designers another way to balance the pull-up (PU), pass-gate (PG), and pull-down (PD) transistors. FinFET bitcells set device strength through fin count while GAA adds nanosheet width as a sizing knob. In a 6T SRAM cell, a strong pull-down relative to the pass-gate limits read disturbance, while a strong pass-gate relative to the pull-up improves writability. During a write, the pass-gate and write driver pull the node storing “1” below the inverter trip point. During a read, the pull-down holds the node storing “0” low. Bias, threshold voltage, mismatch and assist circuitry set the remaining margin. FinFET high-current cells commonly use a PU:PG:PD fin-count pattern of 1:2:2, a device-sizing ratio rather than a current ratio. Ribbon width lets Intel balance SRAM strengths without adding whole fins. The L2 cell uses its narrowest ribbons for PU and widest for PD, improving writability and read stability respectively. Intel’s disclosed HCC operates without assist; its denser HDC uses negative-bitline write assist. Pulling the selected bitline briefly below ground increases pass-gate overdrive so it can overpower the pull-up at lower supply voltage. That buys density and low voltage writability at the cost of boosting circuitry, switching energy, and additional voltage stress that must be controlled. [31], [32] Four rectangular ribbons give the perimeter = 8 × (width + thickness), before corner rounding. PG/PU is 1.49 and PD/PG is 1.16. The L3 structures closely resemble L2 in layout and cell height. Fewer L3 nanosheet widths are tabulated because fewer high-magnification images were available. DDR PHY The DDR-PHY trades density for controlled analog behavior and reliable off-chip signaling. It contains drivers, receivers, delay circuits, and calibration logic that set drive strength, sampling time, and voltage margin. Repeated four-sheet devices with similar widths fit the use of regular transistor units for matching and programmable drive. Its wider local wiring provides room for current delivery and separation of sensitive signals, while consuming more area than a dense core-logic grid. The layout serves the memory channel’s electrical requirements as well as digital logic density. [33] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Intel 3 GPU devices Vector engine logic Intel 3’s XVE logic uses two-fin PMOS and NMOS devices with power rails in M0. Its cell height and M0 pitch give a seven-track geometry, two tracks more than the 18A logic. One-fin groups also appear among the two-fin devices. Intel 3 L2 SRAM The Intel 3 L2 SRAM uses the familiar HCC sizing pattern: one PU fin, two PG fins, and two PD fins. N3E GPU devices Vector engine logic The N3E XVE field contains repeated two-fin devices with seven-track cell geometry. N3E remains a FinFET process, giving Panther Lake a direct FinFET-to-RibbonFET comparison. N3E L2 SRAM The N3E L2 SRAM uses the same PU:PG:PD fin-count pattern of 1:2:2. Panther Lake-U follows Lunar Lake’s floorplan quite closely. Both pair 4 P-cores with 4 LP E-cores and NPU, media and display engines in similar locations. Lunar Lake also uses Xe2, the direct predecessor to Panther Lake’s Xe3 GPU. This makes Lunar Lake the most direct basis for our comparisons. Arrow Lake differs in core count and uses the older Xe-LPG GPU architecture, so we only use it where it offers a more direct component-level comparison. Compute tile Panther Lake compute-tile floorplans remain sparse even months after launch. Intel 18A’s backside metal and dielectric stack must be removed without damaging the underlying structures before a clean transistor-level floorplan can be imaged. Most published die shots hide or heavily process the background, but we are quite proud of the die shot we achieved and are excited to show the work we have done. We measured the areas of the key components on the compute tile and compared them with their Lunar Lake predecessors on TSMC N3B. These help us to capture changes in block area and compare the two chips across process nodes and designs. Our total tile areas exclude the scribe-line area. The compute-plus-GPU subtotal below uses the PTL-U compute tile and GT1 GPU; it excludes the I/O tile and passive base. Individual block areas use the boundaries marked on the floorplans The compute-plus-GPU row is recomputed from the displayed PTL-U and GT1 areas. Component rows use their stated per-region counts and are not an additive partition of the whole tile. The P-core area remains almost unchanged between Lunar Lake and Panther Lake, despite L2 capacity increasing from 2.5 MiB to 3 MiB. Arrow Lake uses the same Lion Cove core as Lunar Lake but also has a 3 MiB L2. Cougar Cove fits 20% more L2 into the same P-core area. The larger private cache keeps more of each core’s working set close to its execution units, reducing access to shared L3 and DRAM. Extra capacity adds storage leakage and lookup energy, so designers balance it against avoided lower-level accesses. The shared P-core L3 cache also shrank by 14.8%. [2] Cougar Cove combines a similar footprint with Intel’s reported power-efficiency improvements. RibbonFET’s tighter channel control reduces leakage, while PowerVia reduces supply droop and allows tighter voltage guardbands. [1] Darkmont’s four-core LP E-core cluster is 5.0% smaller than Skymont’s on Lunar Lake, with most of the reduction in its L2 regions. The 1 MiB region shrank by 8.4% and the 1.5 MiB region by 14.9%. The tag arrays also use one fewer visible row. Tags identify which memory addresses the data array holds, so rearranging them changes the cache’s layout and wiring without requiring less data capacity. [2] The LP E-cores share one L2. This pools capacity and avoids duplicating all the cache machinery, but the four cores contend for its banks and bandwidth. Their separate cluster also keeps light work away from the performance cluster and its L3, allowing that larger domain to sleep. [1], [2] Cache area includes more than the storage cells. Tags identify each line, decoders select rows, sense amplifiers read the small bitline signal, and wires connect to the banks. Splitting an array into smaller sections shortens wordlines and bitlines, improving access speed, but duplicates peripheral circuits. Panther Lake’s smaller cache regions therefore reflect the complete memory implementation, including how much of each region is devoted to storage. [34] Unlike Meteor Lake and Arrow Lake, Panther Lake has no separate SoC tile. The NPU, LP E-cores, memory controllers, PHYs, media and display engines now share the compute tile. This removes an active die and keeps CPU memory traffic on one die. The cost is moving PHY and I/O-related circuitry onto 18A: drivers, receivers and analog circuits must still meet external voltage, loading and signal-integrity requirements, so their area does not shrink like dense digital logic. [1], [2] The biggest shrink comes from the NPU, which occupies 36.9% less area. NPU 5 consolidates the same total INT8 MAC count into half as many neural compute engines. Each of the three NCEs has a larger MAC array to make the complete NCE envelope 22.6% larger than an NPU 4 engine. Consolidation also halves the number of scratchpads and SHAVE DSPs, from 12 to 6. The MAC array handles matrix multiplication and convolution, while SHAVE executes vector and custom operations that fit the array poorly. [1], [2], [35] The paired floorplans identify each NCE envelope and its scratchpad, MAC, and SHAVE regions. Each measured MAC polygon is counted once per NCE in the area accounting below. The scratchpads store weights, activations, and intermediate results near the MAC arrays, allowing repeated use without fetching them again from DRAM. Halving their number delivers the largest measured area saving but leaves less local storage for the same total MAC count. Layers that no longer fit locally require smaller working tiles or more transfers of intermediate data. The benefit depends on keeping the enlarged arrays busy while managing that tighter storage budget. [36] NPU 5 also adds native FP8. Using half the operand width of FP16 reduces storage and transfer demand, helping workloads fit the smaller local memory budget. Lower precision and format-dependent range make scaling and model validation part of deployment. Hardware activation functions further reduce work that would otherwise occupy the programmable DSPs. [1], [2] Microsoft requires an NPU to deliver at least 40 TOPS for Copilot+ PCs. Both Lunar Lake and Panther Lake meet this threshold, but Panther Lake uses significantly less silicon. GPU tiles Panther Lake is Intel’s first product with Xe3, its latest GPU architecture. It offers two different GPU tiles: a smaller GT1 tile with 4 Xe3 cores on Intel 3 and a larger GT2 tile with 12 Xe3 cores on TSMC N3E. Panther Lake allows us to compare the same GPU architecture across both Intel 3 and TSMC N3E. Wildcat Lake adds a third Xe3 implementation on Intel 18A. A future newsletter will detail Xe3 and its implementation differences across all three process nodes. GT2 scales Xe3 to a different physical layout, with render slices arranged vertically instead of GT1’s horizontal arrangement. Slice placement sets the distances to shared cache banks and the D2D interface. Those wires consume area and add delay, so scaling the number of Xe cores also requires a new balance of cache placement, routing and timing. [1] What’s immediately obvious is that the GT2 tile on TSMC N3E has much smaller Xe cores than GT1. These block areas include logic, caches, and routing. An Xe core on the GT1 tile is ~69% larger than one on Lunar Lake, and ~55% larger than one on GT2. Intel 3 therefore uses substantially more area per Xe core. The block-area gap exceeds the measured logic and SRAM density gaps, bringing routing, timing targets, cell mix, and floorplan allocation into the comparison. The measured vector/matrix engine region is almost unchanged between Lunar Lake and Panther Lake’s GT2 tile. Xe3 retains eight 512-bit vector engines and eight 2048-bit XMX engines per core. Its gains also come from feeding those engines more effectively: more resident threads hide stalls, and variable register allocation lets shaders trade registers per thread against the number of threads kept active. [1] The shared L1/SLM capacity increased by 33% from 192 KiB to 256 KiB, while its area increased only 5%, raising effective density by 27%. L1 retains reused cache lines, while software-managed SLM lets a thread group share data locally. Both reduce traffic to more distant memory. Allocating more SLM per group can also limit how many groups reside on a core at once. [1], [37] The GT1 tile carries 4 MiB of L2 against 16 MiB on the GT2 tile. GT1 divides its L2 cache into four 1 MiB banks, while GT2 uses eight 2 MiB banks. Each bank contains 128 macros, but each N3E macro stores 16 KiB, twice the Intel 3 macro’s 8 KiB capacity. The N3E macro is only 54% larger while holding twice as many bits, giving it 30% higher density: ~23.7 Mbit/mm² versus 18.3 Mbit/mm². Including bank-level circuitry, the gap widens to ~16.9 Mbit/mm² on GT2 versus ~10.4 Mbit/mm² on GT1. GT2 gains density with its macros storing more bits per unit area, and those macros occupy more of each cache bank. Larger macros spread decoder and sense-amplifier overhead across more storage, while a more compact bank layout reduces the share spent on control and routing. The compromise is longer wordlines and bitlines that carry more capacitance. [34] I/O tile Panther Lake uses two I/O tile variants, both fabricated on TSMC N6. The smaller one provides 4 PCIe 5.0 and 8 PCIe 4.0 lanes and serves lower-tier systems as well as those without a discrete GPU, while the larger one adds 8 PCIe 5.0 lanes, bringing the total to 20 lanes, for discrete-GPU connectivity. Panther Lake SKUs with the larger 10- or 12-Xe GPUs use the smaller I/O tile. [38] The smaller I/O tile adds a PCIe 4.0 block and a Thunderbolt block to Lunar Lake’s I/O layout, providing four additional PCIe 4.0 lanes and another Thunderbolt 4 port. Its repeated N6 blocks retain nearly identical areas and layouts. Reusing these proven PHYs and controllers avoids porting and requalifying external interfaces on 18A, where faster digital logic offers less benefit to circuits constrained by the off-chip link. [38] SemiAnalysis’s teardown lab (STEEL) dives deep into the world’s advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. We’re hiring technical experts from system to transistor and everywhere in between. Check out our Careers page. Panther Lake offers scalability and modularity through its disaggregated packaging that partition compute, GPU, and I/O silicon into separate tiles allowing for a suite of tile configurations. This partitioning makes the package part of Intel’s node economics as it determines how much leading-edge wafer area each product consumes, which functions can remain on other processes, and how much configuration freedom Intel can offer from a shared set of tiles. Furthermore, fabricating the compute and GPU tiles separately confines the new 18A process to the compute tile and allows graphics and I/O to use other, more established, and more cost-effective processes. For Panther Lake, the GPU and I/O tiles are assembled alongside the compute tile on a passive silicon base using Foveros-S. Intel’s current technology brief lists a nominal 36 µm pitch for Foveros-S. Through-silicon vias (TSVs) in the base connect the fine wiring above to the larger package connections below. The functional tiles sit side by side on that passive base in a 2.5D configuration. [39] Our cross-section through the compute and GPU tiles shows the package’s wiring hierarchy. Microbumps connect each active tile to the passive silicon base; its fine redistribution layer (RDL) carries the short, dense tile-to-tile links. TSVs carry connections through the base to the package substrate, which fans them out to the much coarser motherboard solder joints. The base supplies interconnect, while computation remains in the active tiles above it. [39] At the compute-tile edge, the higher-magnification inset shows a local microbump spacing of approximately 25.24 µm and a feature width of 12.33 µm. These local spacings are finer than Intel’s nominal Foveros-S value. The X-ray fields further confirm tighter neighboring bumps, consistent across every die-to-die area found on each tile. Additional X-ray analysis is offered after the paywall. Putting the memory controller beside the CPU removes the D2D transfer that CPU memory requests required in Meteor Lake and Arrow Lake. This avoids the extra transmitter, receiver, and link traversal, saving interface energy and latency. Panther Lake’s separate GPU still crosses a D2D link to reach DRAM, so its larger local caches also help contain package traffic. [1], [40] Smaller dies are less likely to contain a random fatal defect, and screening them before assembly prevents one bad tile from consuming a complete package of good silicon. Reuse also spreads design and qualification work across more products. Against those gains, Intel pays for the passive base, D2D circuits, extra bonding and test steps, and losses during assembly. Cost per working product across the portfolio captures the combined effect of wafer yield, reuse, test, and assembly. [29] Wildcat Lake packaging Intel launched Core Series 3, formerly Wildcat Lake, on 16 April 2026 for value mobile and edge systems. Wildcat Lake keeps 18A but removes the passive base and combines more functions on one die to simplify the package. The two products therefore reveal two distinct ways to commercialize the same leading-edge process. [41] Wildcat Lake’s 18A die combines up to two Cougar Cove P-cores, four Darkmont LP E-cores, two Xe3 cores and a smaller NPU. A separate platform-controller die supplies I/O, connected through UCIe, Intel’s first processor implementation of the standard. Consolidating graphics remove a tile boundary and the passive base, reducing assembly complexity for a modest-bandwidth value product. It also ties CPU and graphics scaling to the same die, giving up Panther Lake’s ability to swap in a much larger GPU. [42], [43] In July 2021, Intel CEO Pat Gelsinger set out an ambitious process roadmap aimed at regaining performance leadership by 2025, later described as five nodes in four years. Five years and one CEO later, Intel’s comeback story is not as unambiguously positive as Pat may have hoped. [44], [45] Intel once set the pace for process technology, bringing high-k metal gate technology and FinFETs into volume production years ahead of the rest of the industry. Its 22 nm FinFET process reached consumers with Ivy Bridge in 2012. [46] Intel’s integrated device manufacturing (IDM) model allowed its architects and process engineers to co-optimize products and processes. Starting with Sandy Bridge, Intel dominated x86, while AMD struggled with Bulldozer. That lead faltered at 14 nm and broke at 10 nm. Intel targeted a massive 2.7× density increase, but the node arrived years late and required several revisions before it could support Intel’s full lineup. This delay forced Intel to stretch 14 nm across six generations, while TSMC moved ahead in process technology and AMD recovered in x86. By 2019, Intel was still shipping 14 nm across most of its product stack, with its 10 nm client ramp focused on Ice Lake mobile processors. Meanwhile, TSMC was shipping N7 and N7+, and AMD’s Zen 2 compute chiplets used N7 to raise core counts and improve efficiency. Intel’s process failures were central to its decline, but unsound business decisions furthered their downward slide. Product delays compounded product mistakes, pushing client, server, and FPGA roadmaps off schedule. Several attempts to enter AI (Nervana and Gaudi) and networking (Tofino) also failed to establish lasting businesses. Intel’s recovery has focused on consumer CPUs and advanced packaging. Tiger Lake, Alder Lake, Lunar Lake and now Panther Lake have restored Intel’s consumer roadmap. On the process side, Intel 4 shipped with Meteor Lake, Intel 3 with Granite Rapids and Sierra Forest, and Intel 18A with Panther Lake. Intel has also made advanced packaging part of its foundry offering. However, Intel is still playing catch-up in servers. Several Xeon generations arrived years late and trailed contemporary AMD and Arm server CPUs in performance, efficiency, and core count. The process roadmap is back, but Intel does not hold the same process-technology leadership position it held prior to 10 nm. The introduction of gate-all-around nanosheets and backside power delivery are two of the biggest changes to transistor integration in a decade. Intel took on both changes at once: 18A paired its first RibbonFET with PowerVia in Panther Lake. Panther Lake is a substantial manufacturing milestone. Our cross-sections show how RibbonFET and PowerVia reshape local contacts and wiring, while the floorplans show where architectural consolidation and process choices save area. A sustained competitive lead depends on product performance, cost, yield, and the next implementation. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page.. 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Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US20240112951A1/en [16] Applied Materials, “Applied Materials unveils chip wiring innovations for more energy-efficient computing,” Applied Materials Investor Relations, Jul. 8, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://ir.appliedmaterials.com/news-releases/news-release-details/applied-materials-unveils-chip-wiring-innovations-more-energy [17] Samsung, “Samsung showcases AI-era vision and latest foundry technologies at SFF 2024,” Samsung Semiconductor, Jun. 13, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://semiconductor.samsung.com/news-events/news/samsung-showcases-ai-era-vision-and-latest-foundry-technologies-at-sff-2024/ [18] C. W. Yeung et al., “Channel geometry impact and narrow sheet effect of stacked nanosheet,” in Proc. IEEE Int. Electron Devices Meeting (IEDM), Dec. 2018, pp. 28.6.1–28.6.4, doi: 10.1109/iedm.2018.8614608. [19] S. Mochizuki et al., “Evaluation of (110) versus (001) channel orientation for improved nFET/pFET device performance trade-off in gate-all-around nanosheet technology,” in Proc. Int. Electron Devices Meeting (IEDM), Dec. 2023, pp. 1–4, doi: 10.1109/iedm45741.2023.10413854. [20] D. G. Ouellette et al., “Fabrication of gate-all-around integrated circuit structures having molybdenum nitride metal gates and gate dielectrics with a dipole layer,” U.S. Patent 12 051 698 B2, Jul. 30, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US12051698B2/en [21] imec, “Advancing the CFET-based device roadmap with novel integration modules and standard-cell architectures,” imec, 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://www.imec-int.com/en/articles/advancing-cfet-based-device-roadmap-novel-integration-modules-and-standard-cell [22] A. Reznicek, X. Miao, C. Lee, and J. Zhang, “Wrap around contact for nanosheet source drain epitaxy,” U.S. Patent 11 302 813 B2, Apr. 12, 2022. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US11302813B2/en [23] J. A. Kittl, J. G. Hong, D. R. Palle, and M. S. Rodder, “Methods for varied strain on nano-scale field effect transistor devices,” U.S. Patent 9 978 833 B2, May 22, 2018. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US9978833B2/en [24] S. Gandikota et al., “Method of reducing metal gate resistance for next generation NMOS device application,” Int. Patent Appl. WO 2024/137272 A1, Jun. 27, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/WO2024137272A1/en [25] J. Zhang et al., “Full bottom dielectric isolation to enable stacked nanosheet transistor for low power and high performance applications,” in Proc. IEEE Int. Electron Devices Meeting (IEDM), Dec. 2019, pp. 11.6.1–11.6.4, doi: 10.1109/iedm19573.2019.8993490. [26] C. Yoo, J. Chang, Y. Seon, H. Kim, and J. Jeon, “Analysis of self-heating effects in multi-nanosheet FET considering bottom isolation and package options,” IEEE Trans. Electron Devices, vol. 69, no. 3, pp. 1524–1531, Mar. 2022, doi: 10.1109/ted.2022.3141327. [27] S. S. Pradhan, D. B. Bergstrom, J.-S. Chun, and J. Chiu, “Tungsten gates for non-planar transistors,” European Patent Appl. EP 3 506 367 A1, Jul. 3, 2019. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/EP3506367A1/en [28] L. Schloss and X. Ba, “Tungsten films having low fluorine content,” U.S. Patent 9 754 824 B2, Sep. 5, 2017. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US9754824B2/en [29] Intel Foundry, “Accelerating AI and HPC with advanced process and packaging technologies,” Doc. 367370-001US, Jun. 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intel.com/content/dam/www/central-libraries/us/en/documents/2025-11/intel-foundry-hpc-ai-brief.pdf [30] M. Lofrano, X. Chang, H. Oprins, and Z. Tokei, “Mitigating the thermal bottleneck in advanced interconnects,” imec, Sep. 28, 2023. Accessed: Sep. 14, 2026. [Online]. Available: https://www.imec-int.com/en/articles/mitigating-thermal-bottleneck-advanced-interconnects [31] S. Bair, “Intel at ISSCC 2025: Navid Shahriari invited talk, eight papers, forums, panelist & product details,” Intel Community, Feb. 19, 2025. Accessed: Sep. 14, 2026. [Online]. Available: https://community.intel.com/t5/Blogs/Tech-Innovation/Edge-5G/Intel-at-ISSCC-2025-Navid-Shahriari-Invited-Talk-Eight-Papers/post/1667592 [32] D. Chandra, E. Potladhurthi, D. R. S. Reddy, and K. S. Rengarajan, “Tunable negative bitline write assist and boost attenuation circuit,” U.S. Patent Appl. 20160203857 A1, Jul. 14, 2016. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US20160203857A1/en [33] Synopsys, “Advantages of firmware-based training in high-speed DDR IP,” Synopsys IP Technical Bulletin. Accessed: Sep. 14, 2026. [Online]. Available: https://www.synopsys.com/articles/firmware-based-training-ddr-ip.html [34] N. Muralimanohar, R. Balasubramonian, and N. P. Jouppi, “CACTI 6.0: A tool to understand large caches,” Hewlett-Packard Laboratories, 2009. Accessed: Sep. 14, 2026. [Online]. Available: https://users.cs.utah.edu/~rajeev/cacti6/cacti6-tr.pdf [35] Intel, “Intel Tech Tour 2024 Lunar Lake AI hardware accelerators,” Doc. 824436, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://cdrdv2-public.intel.com/824436/2024_Intel_Tech%20Tour%20TW_Lunar%20Lake%20AI%20Hardware%20Accelerators.pdf [36] Y.-H. Chen, J. Emer, and V. Sze, “Eyeriss: A spatial architecture for energy-efficient dataflow for convolutional neural networks,” in Proc. 43rd ACM/IEEE Annu. Int. Symp. Comput. Archit. (ISCA), Jun. 2016, pp. 367–379, doi: 10.1109/isca.2016.40. [37] Intel, “Introduction to the Xe-HPG architecture,” Doc. 758306, Nov. 4, 2022. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intel.com/content/www/us/en/developer/articles/technical/introduction-to-the-xe-hpg-architecture.html [38] Intel, “Core Ultra processors Series 3 for the edge,” Doc. 855291. Accessed: Sep. 14, 2026. [Online]. Available: https://cdrdv2-public.intel.com/855291/Intel%C2%AE%20Core%E2%84%A2%20Ultra%20Processors%20Series%203%20for%20Edge%20Overview_2.pdf [39] Intel Foundry, “Foveros technology brief,” Doc. 366411-001US, Feb. 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intel.com/content/dam/www/central-libraries/us/en/documents/2025-07/foveros-25d-product-brief.pdf [40] D. Das Sharma, “UCIe: Building an open chiplet ecosystem,” UCIe Consortium, 2022. Accessed: Sep. 14, 2026. [Online]. Available: https://www.uciexpress.org/_files/ugd/0c1418_c5970a68ab214ffc97fab16d11581449.pdf [41] Intel, “Intel launches Intel Core Series 3 processors,” Intel Newsroom, Apr. 16, 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intel.com/content/www/us/en/newsroom/news/client-computing/intel-launches-intel-core-series-3-processors-changing-the-game-for-everyday-computing.html [42] Intel, “Core Series 3 launch press deck,” Apr. 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://download.intel.com/newsroom/2026/Intel-Core-Series-3/Intel-Core-Series-3-Launch-Press-Deck.pdf [43] Intel, “Intel outlines architectures for agentic AI at Hot Chips 2026,” Intel Newsroom, Aug. 24, 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intel.com/content/www/us/en/newsroom/news/client-computing/intel-outlines-architectures-for-agentic-ai-at-hot-chips-2026.html [44] Intel, “Intel accelerates process and packaging innovations,” Intel Investor Relations, Jul. 26, 2021. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intc.com/filings-reports/all-sec-filings/content/0001193125-21-224438/d199788dex991.htm [45] Intel, “Intel reports third-quarter 2021 financial results,” Intel Investor Relations, Oct. 21, 2021. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intc.com/news-events/press-releases/detail/1505/intel-reports-third-quarter-2021-financial-results [46] Intel, “3rd generation Intel Core processors bring exciting new experiences and fun to the PC,” Intel Investor Relations, Apr. 23, 2012. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intc.com/news-events/press-releases/detail/577/3rd-generation-intel-core-processors-bring-exciting

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Sep 26 • 9:36 AM EDT • Technology • newsletter.semianalysis.com
Presidents Cup Saturday scores, live updates: International Team enters weekend leading at Medinah after sweep
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Sep 26 • 9:35 AM EDT • Sports • sports.yahoo.com
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Find local prep and college sports scores online this weekend

Rogue Valley Times Sports Editor Kris Henry is on vacation. Find local prep and college scores online at www.osaa.org/activities/fall and www.souraiders.com. Sports coverage will resume online this coming week and […]

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Sep 26 • 9:30 AM EDT • Sports • rv-times.com
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All-SEC Oklahoma star out for Georgia football game

The Oklahoma Sooners will be without an All-SEC OL against Georgia. QB John Mateer is 1-4 when he has taken three sacks since joining OU

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Sep 26 • 9:01 AM EDT • Sports • sports.yahoo.com
Mahershala Ali says ‘Blade’ taught him to focus on movies ‘that don’t feel like reissues of things’

‘Your Mother Your Mother Your Mother’ star Mahershala Ali wants to focus on movies that ‘don’t feel like reissues’ after his ‘Blade’ movie failed to materialize at Marvel. His new film, out this weekend, is a step in that direction.

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Sep 26 • 9:00 AM EDT • Entertainment • ew.com
Second-line season kicks into high gear this weekend in New Orleans. Here’s the schedule.

With the exception of Sundays during Christmas, Carnival and the New Orleans Jazz & Heritage Festival, some 40 second-lines roll each week until around mid-June.

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Sep 26 • 9:00 AM EDT • Entertainment • nola.com
Ken Paxton to bring campaign tour to El Paso. Here’s when and where

Paxton’s “Protecting the Texas Promise” tour is scheduled to stop in El Paso next week. The event is free, though spots can be reserved.

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Sep 26 • 8:23 AM EDT • Politics • elpasotimes.com
Press pool dispute escalates as White House cuts CNN from Air Force One travel

The White House has barred CNN from traveling on Air Force One this weekend. It's another chapter in President Trump's fight with the press, and it appears there will be no TV pool coverage today.

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Sep 26 • 7:38 AM EDT • Politics • npr.org
High-Signal Publisher
Amazon Canada has a Shark vacuum for 43% off, wrinkle-fighting skincare for under $15 & 25 more early October Prime Day deals to shop this weekend

Ready, set, save!

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Sep 26 • 7:00 AM EDT • Technology • ca.style.yahoo.com
The full 'Harvest Moon' rises with Saturn this weekend — here's how to get the best views

The famous Harvest Moon will be the first full moon of autumn when it rises on Saturday, Sept. 26. Here's how to get the best view of it, and where to look for bright Saturn nearby.

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Sep 26 • 6:30 AM EDT • Science • livescience.com
Lord’s Acre Festival serves up food, entertainment, mingling - The Daily Reporter

Volunteers help fill containers with chicken and noodles Sept. 19 during the Lord’s Acre Festival at McCordsville United Methodist Church in McCordsville. The perennially popular dish is sold for festival dining or carry-out until it sells out. The 74th annual festival took place Sept. 18-19.

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Sep 26 • 6:00 AM EDT • Entertainment • greenfieldreporter.com
‘Zombified’ C.D.C., Hobbled by Cuts, Struggles to Fulfill Scientific Mission

The agency has lost its independence and nearly a third of its staff, as Health Secretary Robert F. Kennedy Jr. and associates have tightened control.

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Sep 26 • 5:01 AM EDT • Health • nytimes.com
GOP governor candidate Stacy Garrity touts experience in business, military, state government

Editor’s note: This is the first of three profiles on this year’s candidates for Pennsylvania governor. A profile of Democratic incumbent Gov. Josh Shapiro is scheduled to be published on Tuesday, Sept. 29, and one on Libertarian Ken Krawchuk is scheduled for publication on Thursday, Oct. 1. HARRISBURG — It’s

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Sep 26 • 4:00 AM EDT • Business • triblive.com
Ken San Jose set for Broadway debut in ‘Evita’ revival

Ken San Jose will star in the upcoming Broadway revival of "Evita" via Instagram/@ kensanjose Filipino American performer Ken San Jose will make his Broadway debut in the 2027 revival of Evita, joining the ensemble of director Jamie Lloyd’s production starring Rachel Zegler as Eva Perón. Previews begin Feb. 27 at the Winter Garden Theatre in New York,…

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Sep 26 • 2:43 AM EDT • Entertainment • asianjournal.com
Kenny Moore II Breaks Silence on Joining the Philadelphia Eagles

Veteran cornerback Kenny Moore II has broken his silence on signing with the Philadelphia Eagles‘ practice squad.Moore signed with the Eagles earlier this week after spending the first nine seasons of his career with the Indianapolis Colts, and he discussed the transition with the Eagles’ official website.Kenny Moore II Ready to Write a New Chapter […] The post Kenny Moore II Breaks Silence on Joining the Philadelphia Eagles appeared first on HEAVY.

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Sep 26 • 2:20 AM EDT • Sports • sports.yahoo.com
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I tried Microsoft’s new haptic Surface Mouse — standard mice now feel completely broken to me

This is a game-changer

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Sep 26 • 1:15 AM EDT • Technology • tomsguide.com
Whistleblowers accuse Kennedy Center officials of halting planned repairs later used to justify closure

Whistleblowers are alleging that Kennedy Center officials halted plans earlier this year to repair leaks in the building, which the Trump administration has highlighted as its reason to close the storied arts institution.

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Sep 26 • 12:10 AM EDT • Politics • cnn.com
How I would change my preseason predictions

Memphis has an off week this weekend before it starts conference play on October 3rd against Charlotte. With the Tigers off, it’s a good time to revisit my preseason predictions.

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Sep 25 • 11:28 PM EDT • Sports • sports.yahoo.com
Lakers Insider Reveals Biggest Problem Entering This Season

The Los Angeles Lakers are hoping that the risky offseason of controversial moves will work out behind Luka Doncic as the top star. Losing talents like LeBron James, Rui Hachimura, and Luke Kennard is not a good thing for any NBA team. However, the Lakers decided to invest in younger talents that they believe fit […] The post Lakers Insider Reveals Biggest Problem Entering This Season appeared first on HEAVY.

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Sep 25 • 10:15 PM EDT • Sports • sports.yahoo.com
Yankees change roster for doubleheader; Red Sox showdown finally official

The Yankees are wrapping up the regular-season this weekend against the Orioles with a Friday doubleheader and a single game Sunday.

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Sep 25 • 8:05 PM EDT • Sports • sports.yahoo.com
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Boston 25 News

On a beautiful Friday afternoon in Stow, business is brisk at Shelburne Farm. There is a big storm coming, and people are getting their weekend apples now.

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Sep 25 • 7:32 PM EDT • Business • facebook.com
Historian Price to present program at Owensboro Museum of Science and History

Author and historian Eddie Price will present the historical program "Homemaking on the Kentucky Frontier" at 6 p.m. Monday, Sept. 28, at the Owensboro Museum of Science and History.

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Sep 25 • 7:30 PM EDT • Science • messenger-inquirer.com
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Hardwood Hardship: Kentucky's lumber industry looks for relief

Shrinking exports, man-made wood alternatives and soaring diesel fuel costs are taking a toll on the hardwood lumber industry.

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Sep 25 • 7:22 PM EDT • Politics • spectrumnews1.com
2026 Maker Faire in Vallejo intersects art, science and all things inquisitive

Now in its 20th year, Maker Faire returned Friday to Mare Island’s historic Naval Shipyard, bringing together artists, engineers, scientists, students and curious minds from across the region for a weekend of experimentation and creativity.

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Sep 25 • 7:11 PM EDT • Science • timesheraldonline.com
White House has not acted on RFK Jr.’s push for proof ultra-processed foods are safe

A draft letter obtained by The Post shows Kennedy’s favorable response to a petition that food experts said could lead to significant changes for the industry.

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Sep 25 • 6:53 PM EDT • Health • washingtonpost.com
How to watch East Kentwood vs Jenison high school football

You can watch East Kentwood football all season long with NFHS Network, including this week’s game against Jenison.

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Sep 25 • 5:20 PM EDT • Sports • sports.yahoo.com
Liverpool could sign Everton's best player next summer

Liverpool haven’t signed a player directly from Everton since Abel Xavier crossed Stanley Park in 2002, but that record could soon be broken. There are always rumours linking the Reds with whoever i...

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Sep 25 • 5:10 PM EDT • Sports • sports.yahoo.com
Pokémon card collector used GPS device to track delivery woman

After 30 years, Pokémon remains among the most desirable collectible franchises in fandom and auctions regularly prove the cards' growing value. But one collector went too far in his efforts…

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Sep 25 • 5:09 PM EDT • Technology • boingboing.net
Partisan Politics Should Stay out of America’s Cultural Institutions

During his second presidential term, President Donald Trump and his administration have initiated countless attacks on free speech. Virtually every entity involved in the public dissemination of information has been impacted by the Trump administration’s censorship campaign. Responses to these attacks have been wide-ranging: while many organizations and institutions have fought back against the administration,...

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Sep 25 • 4:50 PM EDT • Politics • oberlinreview.org
Mystic businesses, tourists brace for storm ahead of weekend events

Businesses and tourists in Mystic are preparing for a storm expected to move into the area, with wind already picking up near Mystic Harbor.

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Sep 25 • 4:13 PM EDT • Business • wfsb.com
Mütter Museum will display bonus collection items for after-hours ‘Frankenstein’ finale

The Nov. 12 Meet & Geek will explore the science and medicine behind Mary Shelley’s novel as the museum closes out its seasonal pop-up.

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Sep 25 • 3:13 PM EDT • Science • phillyvoice.com
Omar Blanco Takes the Spotlight at Greater Kendall Business Association!

Getting your Trinity Audio player ready... The Greater Kendall Business Association welcomed Omar Blanco as a special guest, bringing local business and community connections into the spotlight. Watch our video recap for highlights from his visit and a look inside the gathering. #OmarBlanco #GreaterKendall #GKBA #KendallBusiness #MiamiCommunityNews Connect To Your Customers & Grow Your Business […]

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Sep 25 • 3:03 PM EDT • Business • communitynewspapers.com
LSU and Texas A&M: Three Keys to Win

LSU and Texas A&M will surely feel the urgency on Saturday in a game that’s practically a must-win for both teams in terms of realistic expectations to make the playoffs. The Aggies’ standing in the college football world took more of a blow recently after a resounding loss at home to Kentucky. LSU’s loss wasn’t …

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Sep 25 • 3:00 PM EDT • Sports • sports.yahoo.com
“Survivor 51”, “Line of Fire”, and Robert Pattinson as Chris Hansen top this week’s Must List

Jae Stephens’ “Audacity” and “Exhibit G” round out our picks for the weekend of Sept. 25.

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Sep 25 • 3:00 PM EDT • Entertainment • yahoo.com
Peachtree Entertainment Named Co-Owner, Operator of Lexington’s The Rail

Peachtree Entertainment has been named co-owner and exclusive operator of The Rail, a 2,200-capacity live music venue under development in Lexington, Kentucky. The venue is expected to open in early...

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Sep 25 • 2:46 PM EDT • Entertainment • ticketnews.com
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Cash registers, safe taken during at least 4 business burglaries on Chicago's South Side

Multiple businesses were broken into on Friday morning, and burglars left cash registers and a safe.

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Sep 25 • 2:13 PM EDT • Business • cbsnews.com
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Report: Cubs, Red Sox Could Finish Series In Tampa

As a looming nor’easter forces scheduling shifts and doubleheaders, the regular-season finale faces a potential relocation to Tropicana Field to bypass Boston’s worsening weekend weather forecast.

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Sep 25 • 1:11 PM EDT • Sports • sports.yahoo.com
Celebrating National Lobster Day with coastal flavors and weekend entertainment at Confab Kitchen and Bar

Confab Kitchen & Bar owner Doug Gross and Chef Jason Hall visit WANF’s ATL Live Show to demonstrate how to assemble a fresh lobster roll for National Lobster Day and share details on Friday live patio music and fall game-day viewing.

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Sep 25 • 1:09 PM EDT • Entertainment • atlantanewsfirst.com
Rochester Red Wings take International League title

This is the first time the Wings have taken the title since 1997.

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Sep 25 • 1:04 PM EDT • Sports • spectrumlocalnews.com
Apple Stock Gains as Macs Attack the Token Meter

Local inference replaces recurring cloud charges with hardware whose utilization determines the savings.

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Sep 25 • 12:59 PM EDT • Technology • finance.yahoo.com
Ed Sheeran cancels New England concerts as Nor'easter looms

Ed Sheeran can’t be in love with the shape of this forecast. A weekend nor’easter bound for New England has prompted the cancellation of the English pop singer’s concerts Friday

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Sep 25 • 12:44 PM EDT • Entertainment • yakimaherald.com
What is the Diamondbacks’ path to the 2026 MLB postseason?

PHOENIX – With just three games left in the 2026 MLB season, the Arizona Diamondbacks have created one final opportunity to make October. The D-backs enter the final weekend two games behind the Philadelphia Phillies for the National League’s final Wild Card spot.

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Sep 25 • 12:34 PM EDT • Sports • sports.yahoo.com
Renown breaks ground on new Sparks health facility

Renown has broken ground on a new health facility in Sparks.

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Sep 25 • 12:17 PM EDT • Health • kolotv.com
Man City and the 115 charges

It has taken more than two years, but a judgement finally appears to have been made on the 115 charges levelled against Manchester City. Here's what is means.

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Sep 25 • 12:17 PM EDT • Sports • sports.yahoo.com
Anthony Gordon addresses Premier League demands amid England squad withdrawals

Barcelona winger Anthony Gordon has spoken about the physical demands of the Premier League on England players after five players withdrew from the ongoing international window

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Sep 25 • 12:12 PM EDT • Sports • sports.yahoo.com
Mid-Michigan entertainment for the weekend of Sept. 25-27 and beyond

Check out what’s happening in and around the region.

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Sep 25 • 12:12 PM EDT • Entertainment • themorningsun.com