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How Trump Accounts Platform reshape small business finance
I understand the immense effort required to run a business—long hours, complex supply chains, and personal sacrifices for employees and children. That’s why the U.S. Small Business Administration (SBA) is partnering with you to ensure your hard work leads to lasting stability, supporting our region’s families by providing immediate financial relief and long-term wealth building […]
Opening the future of science
The U.S. NSF LCCF Overview and Characteristic Science Applications virtual panel featured remarks from NSF and TACC leaders, followed by a moderated panel of researchers using TACC's Frontera and Vista supercomputers to tackle some of science's most complex challenges.
Scientists enable DNA synthesis using only temperature instead of chemical reagents
"Complex chemical processes are essential for making DNA." This long-held assumption in the field of biotechnology has been overturned by a Korean research team. A KAIST research team has developed the ...
Thousands of acres, billions in investment: What's next for RiverPlex MegaPark?
The RiverPlex MegaPark is still years away from reaching its full potential, but the foundation is being laid for what could become one of the Gulf Coast’s largest industrial hubs, according to Ascension Economic Development Corporation President and CEO Kate MacArthur. With roughly $10 billion in announced investment already committed and thousands of acres still […]
The Most Influential California Political Dynasty You’ve Never Heard Of
They’re Nerdy. They’re Local. They Love a Complex Problem. And They Summer in Santa Cruz. Meet the Lemperts
The science of solving crimes
Every criminal case comes with a story. For years, Florida Gulf Coast University’s (FGCU) Human Identity and Trauma Analysis team has helped law enforcement uncover these stories, bringing science to some of Florida’s most complex investigations. The Michael Haim Trial in 2019, the “Baby Moses” cold case in 2016, and the Tulsa Race Massacre Excavation
T.I. Reveals He Never Wanted His Kids to Get Into Entertainment: ‘We Got a Thousand Rappers’
T.I. spoke out on Arian Simone's podcast about the betrayal he's seen in entertainment and why he wanted different paths f...
'Accidental American' Balogun at crossroads of US, soccer politics at World Cup
Folarin Balogun plays the biggest game of his life on Monday caught in a complex intersection of soccer, identity and U.S. politics, with an intervention from President Donald Trump helping propel him to the centre of one of the World Cup’s biggest controversies.
'Accidental American' Balogun at Crossroads of US, Soccer Politics at World Cup
By Amy Tennery and Kristina Cooke NEW YORK, July 6 (Reuters) - Folarin Balogun plays the biggest game of his life on Monday caught in a complex intersection of soccer, identity and U.S. politics, with an intervention from President Donald Trump helping propel him to the centre of one of the World ...
Listen to whales to improve connection, care & ocean health (commentary)
Seventy years ago, Le Monde du Silence, a film by Jacques Cousteau and Louis Malle, depicted the ocean as silent. Today, we know that the ocean is filled with the melodies of millions of vocalizing sea creatures, from the crisp snapping of shrimps to the complex singing and speaking of whales. In fact, the first […]
You can sort-of play Mario Kart on YouTube as an "interactive video" that could lead to more complex experiments
A rising YouTube channel is making "playable games" for YouTube, and its Mario Kart interactive video is a conceptually fascinating take on the racer.
Digital Science unveils AI-powered research strategy platform
Platform "designed to help research institutions answer complex strategic questions using verifiable evidence"
Lori Harvey Expands Business Empire With Gran Coramino Role
From modeling to chief creative advisor, Lori Harvey is helping shape Gran Coramino's female-focused next chapter after the tequila brand surpassed $200 million in retail sales.
Two new food benefits available to Oregon Health Plan members with complex health needs
The Oregon Health Authority has launched new nutrition benefits for Oregon Health Plan members with chronic conditions to help improve food security.
Audit spots some errors, but gives Wyoming Business Council passing grade
Though there were some instances of incomplete, misclassified reporting and mathematical errors, an audit of the Wyoming Business Council shows the agency generally operates within a complex set of state
Caitlin Clark Targeted In WNBA, Sophie Cunningham Says
Cunningham calls out the WNBA and refs, claiming Clark takes nonstop cheap shots with little protection despite a growing list of flagrant fouls.
Chinese team’s brain-mimicking chip ‘up to 478 times faster than Nvidia GPU’
New chip performs data storage and computation in a single memory array, enabling real-time modelling of complex brain structures, team says.
America held a big birthday party — and a soccer extravaganza broke out
The game the rest of the world knows as football is teaching America something about itself on its 250th birthday and reminding foreigners that the nation is far more welcoming and complex than its bitter political caricature.
Audit spots some errors, but gives Wyoming Business Council passing grade
Though there were some instances of incomplete, misclassified reporting and mathematical errors, an audit of the Wyoming Business Council shows the agency generally operates within a complex set of state
Why Perplexity's founder doesn't think the American dream is over
Aravind Srinivas, the CEO of Perplexity, praised America's startup culture on "The Joe Rogan Experience."
Federal court complex in D.C. once home to NASA HQ to open to public Friday
Federal court complex in D.C. once home to NASA HQ to open to public Friday
New owners of One Canal Place declare bankruptcy just over 2 months after $28M acquisition
The New York brothers behind a network of for-profit summer camps and a complex web of corporations and are now under investigation by Israeli authorities.
Scientists Sound the Alarm: Antarctic Discovery Is More Disturbing Than Anyone Feared - Futura-Sciences
The Frozen Continent Is Changing Faster Than We Thought Antarctica has always been a tough nut to crack for scientists. Its complex and sometimes baffling phenomena have long made it mysterious, and recent findings suggest its influence on our planet’s climate could be much greater than we thought. In September...
$250 used to get you a Lifetime Plex Pass. Now you get a five-year subscription
Plex is pushing customers to newer features and more frequent payments.
WHO, Member States discuss expanding South-East Asia Emergency Health Fund SEARHEF
With climate-related disasters, disease outbreaks and other health emergencies becoming more frequent and complex across South-East Asia, WHO and Member States today discussed measures to strengthen and expand the South-East Asia Regional Health Emergency Fund (SEARHEF) to ensure countries have rapid access to life-saving support when crises strike. "Health emergencies are becoming more frequent, more complex and more costly. Countries need rapid, flexible financing that can be mobilized immediately when lives are at risk. SEARHEF represents regional solidarity in action, enabling Member States to support one another when emergencies strike," said Dr Catharina Boehme, Officer-in-Charge WHO South-East Asia Region. She was addressing the Fifteenth Meeting of the Working Group on the Governance of SEARHEF.
Illinois State undertaking major upgrades to science research and teaching capacity through new project
Illinois State is undertaking a major upgrade of its science research and teaching capacity through the construction of three new facilities.
Justin Bieber Releases 'SWAG Live From Coachella' Album
Beliebers rejoice! A 22-track live recording of the pop star's weekend one headline performance is now available to stream.
ASU scientists unveil new methods to extract reliable truth from imperfect data
Scientists at Arizona State University are advancing how they interpret complex, imperfect data — challenging long-standing assumptions in fields ranging from imaging to cellular biology. In two papers published in Nature Communications and Proceedings of the National Academy of Sciences, the team introduces fundamentally new approaches to solving “inverse problems,” where researchers work backward from noisy observations to uncover the underlying reality.
How Bridge Entertainment Labs' Steven Olikara Is Building Community Across America's Deepest Divides
Steven Olikara identifies a "division industrial complex" where media and politics profit from societal polarization, fostering hatred based on false narratives. To counter this, Olikara, drawing from...
How Bridge Entertainment Labs' Steven Olikara Is Building Community Across America's Deepest Divides
Steven Olikara identifies a "division industrial complex" where media and politics profit from societal polarization, fostering hatred based on false narratives. To counter this, Olikara, drawing from his experiences in music and politics, founded Bridge Entertainment Labs.
Professor, Mentor, Researcher, and Data Pioneer: Celebrating Lynn Blewett’s Retirement
I first met Lynn Blewett as a graduate student at the University of Minnesota School of Public Health, where her courses on the U.S. health care system fundamentally shaped how I understand policy and evidence. What struck me most was her ability to translate complex health systems into their human dimensions and to remind us […]
The Case for Performance-First Management
What began as a crisis-driven response to the Covid pandemic laid the foundation for today’s dominant management paradigm: people-first management. But today’s business demands a different approach, as performance and productivity have replaced engagement and retention atop the CEO agenda. Performance-first management represents a gentle shift toward an approach where managers empower their teams to deliver high-impact results within a complex and evolving reality. It keeps people at the center, but reorients the manager’s role around enabling performance, not just supporting satisfaction. Gartner research shows that managers who shift toward a performance-first approach are up to 21% more likely to deliver the business results that are expected of them. And employees who say that their managers are performance-first report higher overall satisfaction with their employee experience.
How Would LeBron James Fit on the Philadelphia 76ers?
Imagine King James joining Joel Embiid and Tyrese Maxey. While his elite playmaking could spark a title run, complex salary cap hurdles and roster age remains significant risks.
Anthropic unveils 'Claude Science' AI platform for scientific research
Anthropic on Tuesday launched Claude Science, an AI platform designed to help scientists streamline research, analyze data and manage complex computing workflows.
This microbe turns into a cannibalistic ‘Hulk’
Euplotes gigatrox’s shape-shifting may reveal how early life learned to act in surprisingly complex ways.
HILCO GLOBAL ANNOUNCES SALE OF TURNKEY MOVIE & ENTERTAINMENT COMPLEX IN WHEELING TOWN CENTER
/PRNewswire/ -- The Hilco Global Real Estate Practice is pleased to announce the offering of a turnkey 36,880± SF movie and entertainment complex located at...
Studio Gang and Henning Larsen Complete One Milestone Life Science Campus in Boston
Studio Gang and Henning Larsen's One Milestone brings life science labs, flexible workspaces, and public amenities to Boston's Allston neighborhood.
Developer addresses community concerns around Franklin youth sports complex project
The project, proposed by developer BLVD Capital, would transform Brownland Farm, a 233-acre property on Hillsboro Road just outside downtown Franklin, into “The Banks at Brownland.”
Plutonium compound unlocks rare topological quantum behavior with potential nuclear science applications
Plutonium is one of the most complex elements in the periodic table. First synthesized and isolated in 1940 by scientists at the University of California, Berkeley, plutonium has been studied closely ...
An out-of-state private equity firm just paid $8.6M for a local apartment complex
North Carolina-based private equity firm Emerald City Associates has purchased the 246-unit Magnolia Trace apartment complex on North Harrell's Ferry Road near Sherwood Forest Boulevard and Interstate… Already an INSIDER? Sign in. Already an INSIDER? Sign in
Eskin named general manager of NEXUS sports and entertainment complex
Middlesex County, in partnership with The Sports Facilities Companies, announced Edison native Katie Eskin as General Manager of NEXUS.
Downtown Clearwater site cleared for $50M EVO entertainment complex
Developers cleared the site for a $50M EVO entertainment complex in downtown Clearwater, advancing the project toward construction.
A Salt Lake City school’s new sports complex features a huge turf field. Neighbors say it’s a heat island
One couple said they’re no longer able to enjoy their yard because it now reeks of hot rubber.
Efzimfotase alfa demonstrated improvements in bone health in treatment-naïve pediatric patients with hypophosphatasia achieving median difference of 1.67 vs placebo in RGI-C Score at week 25 in MULBERRY Phase III trial
Positive results from the MULBERRY Phase III trial showed that efzimfotase alfa (ALXN1850), an investigational enzyme replacement therapy, demonstrated a statistically significant and clinically meaningful improvement in bone health in children (2 to
Design and Early Implementation Outcomes of a Mobile Health-Enabled Social Support Intervention for Adults Living With HIV and Type 2 Diabetes in Uganda
Background: Adults living with HIV and type 2 diabetes experience complex treatment demands that affect medication-taking, clinic attendance, privacy, social support, and engagement with care. M...
Community baby shower in Landover aims to address disparities, promote healthier lifestyles
This weekend in Prince George’s County, people came together for a community baby shower aimed at promoting healthier lifestyles among Black and Brown families across the DMV. With a lot of energy and laughter in the room, hundreds of people gathered at Prince George’s Sports and Learning Complex in Landover. The free event offered support for expecting mothers and parents…
Scientists finally explain why these wild boars stay more radioactive than Chernobyl's wolves - Futura-Sciences
What explains this surprising finding? The answer appears to be a complex mix of history, ecology, and diet. Bavaria’s wild boars mainly feed on underground fungi that absorbed radioactive fallout from both the notorious Chernobyl disaster and Cold War-era nuclear testing. Unlike wolves, which sit higher on the food chain...
'Super puffy': Scientists ponder extreme low density of two planets
International researchers are engaged in a complex study of two planets in deep space that appear to have an average density lower than that of candy floss. The planets orbiting star TOI-791, located ...
Community helps rebuild Future Champions Sports Complex
Now, one year after the disaster, Jamison said he reflects on the support he was shown.
How complex surgeries helped a Texas man avoid foot amputation
A Texas man nearly lost his foot in a lawn mower accident, but Houston doctors saved it through a series of complex surgeries.
Perplexity, Kalshi, Replit insiders share how to get a startup job
We asked startup founders, recruiters, and hiring managers what to do — and not to do — to boost your chances of getting an offer.
J. William Fulbright, proponent of cultural exchange, left complex legacy across politics, education
As the Vietnam War heated up, U.S. Sen. J. William Fulbright became uncomfortable with American involvement in the conflict.
J. William Fulbright, proponent of cultural exchange, left complex legacy across politics, education
As the Vietnam War heated up, U.S. Sen. J. William Fulbright became uncomfortable with American involvement in the conflict.
Tourism tax dollars to drive $25M makeover of John R. Jones Sports Complex in Pensacola
PENSACOLA, Fla. -- The John R. Jones Sports Complex will soon undergo a makeover. When it's complete, it is expected to be one of the premiere athletic fields i
New feed trailer expands feed delivery opportunities
Delivery of bulk feed produced at the Iowa State University Kent Feed Mill and Grain Science Complex to Iowa State’s animal science farms is now possible, thanks to a new high-tech feed trailer.
233-acre Franklin farm could become major youth sports complex
A Nashville Predators-operated ice rink and athletic facility could transform historic Franklin property.
Shockwave Medical announces new studies evaluating carotid IVL platform
Carotid artery disease causes up to 30% of all strokes, but severely calcified lesions can make treatment quite complex. The hope is that IVL can be as successful in this area as it has been in the treatment of coronary and peripheral artery disease.
Microsoft Discovery Aims To Advance The Era Of Agentic Science
The cloud-based agentic AI platform aims to help human researchers overcome resource constraints and complex data challenges to accelerate science at scale.
New additions, bike trails, dog park open at McDevitt Youth Sports Complex
Visitors to the Charles F. McDevitt Youth Sports Complex in West Boise will find several new amenities now open, including a nature-themed playground, new cycli
NASA rover finds record-breaking trove of complex organic molecules on Mars
Data from NASA’s Perseverance rover confirms the presence of macromolecular carbon on Mars – another potential piece of the puzzle in the search for life.
“Cats go wild for this mysterious sound”—why experts say it works every time - Futura-Sciences
The Secret Behind the Slow Blink Cats are famous for their independent streak, but behind that mysterious gaze is a much more complex reality. Our feline friends are constantly seeking ways to communicate with us, but we humans aren’t always the best at picking up their signals. Scientific research has...
Perseverance Finds Complex Organic Compounds in Strange Mars Rocks
Another potential ancient life sign on the red planet?
Burial site of all female extinct human relatives baffles scientists
‘Homo naledi’ may have had complex death rituals and funky gene
Philadelphia bars see spike in business during 2026 Men's World Cup: "We've definitely seen a huge increase"
The 2026 Men's World Cup may be centered around the stadiums, but some Philadelphia business owners say the tournament's impact is being felt well beyond the sports complex.
Local business raises more than $1K for residents displaced by Brockport apartment fire
SWEDEN, N.Y. (WROC) – After hearing the details of a devastating apartment complex fire in Brockport which displaced more than thirty people, the owners of a business in Sweden decided to step up and ...
Advances in materials science are helping unlock secrets of nanomaterials
New instruments on the horizon promise the most precise tools yet to study and experiment on the smallest and most complex materials ever manufactured. In a paper published in the journal Nature Materials, ...
The future of a new sports entertainment development in Chula Vista
The Pangea Sports Entertainment District complex is the latest in developments coming to Chula Vista’s bayfront. NBC 7’s Joe Little explains why its future depends on a big decision being made Tuesday.
Lakewood Ranch ice sports complex expansion approved
Manatee County Commission moves forward with $80 million facility featuring four ice rinks
Mobile health tops early RHTP funding trends
State rural health transformation programs aim to overcome high startup costs and allow rural providers to deliver complex care locally with remote ultrasound, RPM and other mobile health technologies, says one industry expert.
Hillsborough County to move forward with indoor sports facility at MOSI
MOSI staff said construction will take about 18 months to complete with the goal of opening in 2028.
Think human anatomy is finished? Scientists say think again
Despite centuries of study, scientists are still finding new details and even overlooked structures within the human body. As researchers explore anatomical differences between individuals, it’s becoming clear that the body is far more complex—and less fully understood—than textbooks suggest.
Success via SNF mental health assistants: How one provider slashed antipsychotics use, bad behavior and hospitalizations
One of the nation’s largest nursing homes is expanding its behavioral health initiatives, offering important insights for caregiving as providers nationwide admit more patients than ever with serious mental illness or other complex diagnoses.
World Cup Health And Security Risks Will Grow In The Knockout Phase
This is the largest and most complex World Cup ever, with three host countries and 48 teams. It will place unprecedented challenges on medical and security staff
Oakes Farms withdraws plans for new Bonita Springs entertainment complex
Oakes Farms has withdrawn its proposal to transform the old greyhound track in Bonita Springs into an entertainment complex.
WCC publishes “HIV and Mental Health: What Can the Church Do?”
The World Council of Churches (WCC) has published “HIV and Mental Health: What Can the Church Do?” by Dr Sue Parry, a practical and theologically grounded resource for congregations ready to respond to one of the most complex pastoral challenges of our time.
DNA time stamps reveal the strawberry’s surprising origins
Researchers have created a new way to reconstruct the evolutionary history of complex plant genomes by analyzing genetic traces left by transposable elements. The technique revealed that modern strawberries were assembled through multiple ancient genome-merging events, shedding new light on how major crop species evolved.
NASA’s Lucy Reveals Wobbling, Peanut-Shaped Asteroid
Even small asteroids lead complex lives. During its flyby of the asteroid Donaldjohanson last year, NASA’s Lucy spacecraft revealed the asteroid to be a
Inside High 5: Renderings of Estero’s upcoming entertainment complex
See new renderings of High 5 Entertainment in Estero, including bowling, arcade attractions, pickleball courts, miniature golf, dining areas and outdoor gathering spaces ahead of its planned 2027 opening.
An Anaheim vision: The Anaheim Angels in a new stadium, next to a youth sports complex
A new owner could move the Angels, but Anaheim offers a 150-acre site with what every owner in pro sports covets: land around the venue to turn the property into a year-round money-making operation.
Tennessee's new quantum computer could reshape science: Meet Pathfinder
Oak Ridge National Laboratory just launched Pathfinder, a quantum computer built to tackle complex global challenges.
‘It’s a sanctuary’: DFW’s first state behavioral health hospital opens to patients, community
State officials and UT Southwestern Medical Center on Tuesday unveiled Texas' newest state hospital, the first in the Dallas-Fort Worth Metroplex. The Texas Behavioral Health Center joins ten other facilities — nine state hospitals and one youth residential treatment center — to provide care for hundreds of Texans with serious mental health issues.
Small Business Owners Face Confusion Over Signage
A new law permitting some use of sandwich boards may help businesses — but other signage complexities remain
Plans announced for sports complex, mixed-use development near Huntsville-Decatur interchange
Synergy Sports, Limestone County, the City of Decatur, and Crossroads LLC, announced a cooperative effort to bring a mixed-use development, anchored by a southeast regional sports complex, to the Tennessee Valley.
Suspect arrested following suspicious death at Sonora Behavioral Health
He was booked into the Pima County Adult Detention Complex based on an active arrest warrant for manslaughter.
Toward a uniform business tax system: Examining proposals to tax large pass-through entities as corporations
In a new paper for the Hamilton Project, we examine an approach that many policymakers have offered to reform pass-through taxation: requiring large or complex pass-through entities to pay federal income tax at the entity level, as corporations do.
Apptio Unveils Conversational Insights and New Suite of AI-Powered Capabilities to Translate Complex Technology Spend into Measurable Business Outcomes
Apptio announced significant updates to its solution suite designed to turn technology investment into measurable business outcomes and establish best practices for the financial governance for AI in a time of record infrastructure investments.
Scientists found a way to explain bird flocks that “defy” Newton’s third law
Physicists have solved a long-standing problem involving systems that appear to violate Newton’s third law, such as bird flocks and bacterial swarms. By adding carefully designed “imaginary partners” to their models, they can now simulate these complex systems with unprecedented accuracy.
New sports complex adds to Suncoast’s growing athletics scene
Development near State Road 64 expected to offer pickleball, volleyball, baseball and softball facilities
Pastor Jamal Bryant On Asian Business Boycott, Black Spending Power
How one clip from an Asian creator pushed the Atlanta pastor to challenge Black spending habits and demand a test of economic dependence.
Janelia’s Two Big Bets: Decoding the Brain and Reinventing How Science is Done
HHMI’s Janelia Research Campus is launching a decade-long scientific effort to pursue two coequal goals: understanding how the brain generates complex behavior, and developing a new mode of scientific discovery in which biologists and AI work together as partners in discovery.
New sports complex to open in Madison
The center is located at 4845 Tradewinds Parkway in Madison. The complex has two international-size futsal courts, two volleyball courts, eight pickleball courts, a fitness space, a cafe, and a pub.
Team careers in science: formation, composition and success of persistent collaborations
npj Complexity - Team careers in science: formation, composition and success of persistent collaborations
Global multipolarity through the lens of network science and game theory
npj Complexity - The “Theory of Competing Networks”, which integrates network science and game theory, reveals that cooperation is more stable than hierarchy, offering insights into...
Why Marketing Feels Harder as Your Business Grows by Nathan Tayloe
At some point, most growing businesses hit the same moment. What used to feel straightforward starts to feel more complicated. Marketing takes more effort. Results feel less predictable. What once worked consistently begins delivering mixed outcomes. It is easy to assume something is broken. In many cases, nothing is. The business has simply reached a different stage. What Worked Before Starts to Lose Its Edge Early on, growth is often driven by a few things working well at the same time: Referrals are strong The value of the offering is clear The team is aligned Decisions are made quickly Marketing, in that stage, tends to feel easier because the business itself is easier to understand. As the company grows, that simplicity fades. The audience expands. Services evolve. New people join the team. More channels are added. More decisions are made across more touchpoints. Marketing is no longer communicating one clear story. It is trying to represent a more complex business. Complexity Creates Friction That added complexity does not always show up immediately. It builds over time. Messaging starts to drift. Different parts of the business describe what they do in slightly different ways. The website no longer reflects how the company actually operates. Sales conversations evolve faster than the brand. At the same time, more activity is introduced to try to keep growth moving: New campaigns More content Additional platforms More tools and reporting The volume increases. The clarity does not always keep pace. That is when marketing starts to feel harder. It’s Not a Lack of Effort Most teams respond to this stage by doing more. More output More meetings More adjustments More experimentation That effort is not misplaced. It is often pointed in the wrong direction. When the underlying issue is a lack of alignment, more activity tends to create more noise. Results become harder to interpret. Decisions take longer. Progress feels inconsistent. From the outside, everything looks active. From the inside, it feels less certain. The Real Shift As businesses grow, marketing becomes less about execution and more about alignment. The companies that navigate this transition well tend to refocus on a few fundamentals: A clearly defined audience A strong, consistent position in the market Messaging that reflects how the business actually operates Alignment between leadership, marketing, and sales When those elements are in place, execution becomes more effective again. Marketing does not necessarily become easier, but it becomes more consistent. A Different Kind of Discipline Growth introduces more opportunity, but it also demands more discipline. What worked when the business was smaller often cannot be scaled without adjustment. The systems, messaging, and decision-making that once felt intuitive need to become more intentional. That is not a sign of failure. It is a normal part of growth. Marketing feels harder because the business has become more complex. The solution is not to outwork that complexity. It is to bring clarity to it. The companies that do that well tend to regain momentum quickly. Those who do not often stay busy without seeing the same level of progress. — Learn more about how we help organizations align strategy, brand, and execution. Visit tayloegray.com, or reach out directly at nathan@tayloegray.com.
Is SMIC N+3’s Metal Pitch Smaller than Intel 18A’s?
Almost four years ago, we published that SMIC had started shipping 7 nm (N+1) chips. Now, SMIC is shipping its third-generation 7 nm (N+3) process in Huawei’s Kirin 9030, with a minimum metal pitch of 32.5 nm, about 10% tighter than the 36 nm minimum metal pitch shipping in Intel’s latest Panther Lake CPUs on 18A. The headline is true, but incomplete cherry picked metric. N+3 reaches the density of TSMC N6 through aggressive DUV multi-patterning and design-technology co-optimization (DTCO), but it pays for that in complexity, efficiency and process control. We found this and more in our reverse engineering and teardown where we cover SMIC’s N3 process technology, Huawei’s packaging, memory, architecture, and more. SemiAnalysis has been building a state-of-the-art teardown lab in Oregon capable of analyzing the world’s most advanced and important chips over the last year and half. We have already generated revenue on advanced datacenter chip teardowns including our recent reverse engineering of a major TSMC customer’s COUPE CPO optical engine + EIC 3D stack. This is the first public report from the SemiAnalysis Teardown Engineering & Evaluation Lab, or STEEL for short. The lab is aggressively scaling up and out and we’re excited to announce it publicly. This is a bit of inconvenient timing for TechInsights as they are private equity owned and currently being sold while having enjoyed virtually no credible competition for decades. This has led to TechInsights underinvesting in CAPEX. SemiAnalysis exceeds TechInsights in revenue despite no venture or private equity ownership and being founded only 6 years ago. Because we have no external investors and are founder led, we move faster, build faster, and we can release client chip teardowns for free regularly, while focusing on datacenter for our major clients. Here’s the first public image from our lab, the HiSilicon Kirin 9030 Pro SoC: This report will detail our teardown of the Kirin 9030 and our findings on SMIC’s N+3 process, the most advanced in China. For comparison, we’ll show our teardown of the MediaTek Helio G99, made on TSMC N6. Through this comparison, we can look at the effect of export controls – SMIC N+3 and TSMC N6 are comparable nodes, but one is heavily export-controlled, the other free to use the West’s most advanced equipment. Here we see both China’s progress and constraints. SMIC N+3 reaches TSMC N6-class logic density, but it requires far more aggressive DUV multi-patterning, so it does not match N6 on process maturity or cost. The Kirin 9030 Pro performs similarly to three-year-old Android flagships, and trails far behind the current flagship SoCs from Apple, Qualcomm, MediaTek, and Samsung. The efficiency gap is even wider. Export controls have not stopped Huawei and SMIC from shipping advanced silicon, but they have forced a different path. Without EUV, SMIC is leaning harder on DUV multi-patterning, DTCO, and increasingly complex integration. The roadmap continues forward through tighter design rules and backside power, but each step adds cost and process risk. Huawei’s τ scaling and LogicFolding show another path: stacking active logic and recovering density through advanced packaging and system-technology co-optimization (STCO). To understand the Kirin 9030, we must first understand Huawei’s SoC history. HiSilicon is Huawei’s chip design arm, responsible for the Kirin smartphone SoCs, Kunpeng server CPUs, Ascend AI accelerators, and switch/router networking silicon. Before export controls, Huawei was TSMC’s largest customer – the only customer on TSMC’s first EUV node, N7+, and among the first on N5, alongside Apple. That ended in late 2020. Huawei switched to Qualcomm SoCs in its flagship smartphones, though export controls limited them to 4G-only variants. In late 2023, Huawei returned to in-house silicon with the Kirin 9000s, a successor to the Kirin 9000, fabricated on SMIC N+2 instead of TSMC N5. In the following years, they released the Kirin 9010 and 9020 on the same N+2 process. These chips used Huawei’s in-house TaiShan CPU cores and Maleoon GPU. We have not torn down a Kirin 9020 ourselves, so the predecessor die shot is from Kurnal. The die shots show how Huawei spent its silicon budget: which functional blocks are where, and how their areas compare to the predecessor. First, a quick guide to the major blocks on the die. The total die area is nearly identical, but the 9030 uses that area more aggressively. A denser process lets Huawei fit an extra middle CPU core, more GPU and NPU cores, and larger caches into the same footprint. In contrast, the Helio G99 is a much smaller, low-cost SoC, built for budget smartphones rather than a flagship device. While the Kirin 9030 is ~140 mm², the G99 is only ~29 mm², roughly one-fifth the area. The underlying TSMC process technology, however, is directly comparable as a baseline for analyzing SMIC’s. The Kirin 9030 is an evolutionary refresh, not a clean-sheet design. Its CPU, GPU and NPU cores carry over the 9020’s families, and the gains come from three levers: the SMIC N+2-to-N+3 process step, DTCO and floorplan work, and incremental microarchitecture. Area is where the first two show up, and the 9030 scales well here. Performance and efficiency are the harder test. Huawei’s design holds up better than its node would suggest, but the chip still trails, both because N+3 sits behind the leading-edge nodes and because its cores, while competent, remain a few generations behind the newest designs. The new prime core is an incremental update. The main changes are a 10% frequency increase from 2.5 GHz to 2.75 GHz and a doubling in the L2 cache from 1 MiB to 2 MiB. Despite the increased cache, the core size decreased by 7.6%. Excluding the private L2 cache, the core size decreased by 21%. This is a large reduction for an incremental node. Compared with the TaiShan New V120 core in the Kirin 9020, the Kirin 9030’s middle core is almost unchanged architecturally, yet each core shrinks by ~22%. Most of that comes from the move from N+2 to N+3, with layout likely accounting for the rest. Visually, the most noticeable change is the increase from 3 middle cores to 4. There is also a 20% increase in the shared L3 cache of the big cluster. This helps to improve multi-core performance without sacrificing much in terms of area. Even with each core shrinking, the big CPU cluster’s total area is essentially unchanged. The per-core savings went back into an additional middle core and larger caches. The tiny cores shrank less than the prime core (excluding its L2 cache) and less than the middle cores. This is likely because fixed overhead is a larger share on a small core. We cannot resolve any architectural changes from the die shot alone, but the per-clock and efficiency gains shown below point to more than pure process and layout scaling. The area reduction was offset by a doubling of the shared L2 cache from 2 MiB to 4 MiB, leaving the total tiny CPU cluster area slightly larger. Area is the easiest improvement to see from a die shot, but it is only one part of PPA (power, performance, area). For modern logic, power and performance matter just as much, and often more. Since Dennard scaling broke down in the mid-2000s, voltage and frequency have not scaled in step with transistor dimensions, so each node has had to fight harder for gains in performance and efficiency. The starkest comparison is not Kirin 9020 versus Kirin 9030 Pro. Apple’s efficiency cores run circles around Huawei’s prime core. Apple’s low-power core delivers 20% higher integer performance while drawing only 1 W, compared with 4.5 W for Huawei’s prime core. N+3 matches TSMC N6, but N6 is several generations old. Apple and Qualcomm build on N4 and N3P, which are denser and sit on a better voltage-frequency curve, giving them a larger transistor budget and more performance per watt. The 9030’s own cores did improve. The middle and tiny cores gained 17% and 14% in per-clock integer performance over the 9020, with floating-point flat on the middle core and up 11% on the tiny. The tiny core improves cleanly, with performance rising while power falls and efficiency increases by 45% in integer and 24% in floating point. The middle core is mixed: integer performance rises but power rises faster, cutting integer efficiency by 7%, while lower power lifts floating-point efficiency 16%. Per-clock gains at the same or lower frequency are microarchitectural, so the cores are tuned, not just shrunk. Both also failed to hold their rated maximum frequencies, pointing to thermal, power, or stability limits. Per clock, the middle core sits around Arm Cortex-A720 and the tiny core near the Cortex-A520; absolute performance trails because Huawei clocks them much lower. The prime core is roughly Cortex-X2 class per clock, a 2021 design. Apple’s 2020 M1 Firestorm core is still 35% higher per clock and 57% faster in absolute integer performance at a similar 4.5 W. The current leading edge is further ahead again: the Apple M5 P-core is 60% higher per clock and 2.7× faster, the Arm C1 Ultra 45% higher and 2× faster. Matching older high-end cores per clock is a genuine design achievement. What Huawei cannot match is the voltage-frequency curve and transistor budget of leading-edge nodes, which let Apple, Qualcomm and others spend more transistors in the same area on wider cores, larger caches and deeper buffers while running at lower voltage. Huawei’s LogicFolding roadmap is one answer, stacking active logic to recover density and shorten signal paths. We return to it later. The GPU compute units (CUs) changed more visibly than the CPU cores, moving to a more rectangular layout for both the arithmetic logic unit (ALU) clusters and the CU overall. Even with ray-tracing support added, a CU shrank ~28%. However, that shrink is offset by the increase from 4 to 6 CUs and the area outside the CUs grew 33%. Overall, the GPU cluster is larger by ~10%. The GPU is where Huawei makes its biggest gains. The Maleoon 935 is not competitive with current flagships, but it is a large step up from the 920 and reaches older-flagship territory. In 3DMark it is 70% faster in Wild Life Extreme (WLE) and 79% faster in Steel Nomad Light (SNL) than the 920; with 11% higher clocks and 50% more CUs, the ~67% theoretical uplift roughly matches WLE and is beaten by SNL. It edges ahead of the Snapdragon 8+ Gen 1 in WLE and SNL, and the Dimensity 9200 and Apple A16 in WLE, but stays far behind newer parts: the Snapdragon 8 Elite Gen 5 and Dimensity 9500 are ~2.4–2.6× faster in WLE and ~3.2× faster in SNL. The Maleoon 935 is Huawei’s first GPU with hardware-accelerated ray tracing; there it lands slightly ahead of the Exynos 2200, and on par with the Apple A16, with current flagships up to 3.7× faster. The Neural Processing Unit (NPU) saw the largest structural changes of any block, moving from a Lite and a Tiny core in the Kirin 9020 to a Lite and two Tiny cores in the Kirin 9030. Both core types also show significant layout changes. This is a reversal in Huawei’s NPU design. The Kirin 9000 5G, its last flagship chip on TSMC N5, used two Lite and one Tiny core. The series of SoCs on SMIC N+2 moved to one Lite and one Tiny core, likely for area savings. With the Kirin 9030, Huawei has shifted back toward a larger multi-core NPU cluster, but with the additional area going to a Tiny core rather than a Lite core. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Before diving into the process stack, the package and memory are worth separating from the SoC itself. The Pro variant of the Kirin 9030 carries 12 GB of Samsung DRAM, with two stacks of four dies each. The dies were identified as the K4L2E165YD, a 12 Gb LPDDR5X-9600 device fabricated on Samsung’s 1a node, the fourth generation of its 10 nm-class DRAM after 1x, 1y and 1z. 1a has shipped in volume since 2022, so this is current memory rather than older-node inventory. The 16 GB Pro Max variants we obtained were found with both CXMT and Samsung packages. The CXMT package is marked CXDD7JEDM, with two stacks of four dies, packaged in week 45 of 2025. The inferred die dimensions from X-ray computed tomography (CT) are consistent with a known density of ~0.3 Gib/mm² for the CXMT G4 process, roughly equivalent to other manufacturers’ 1z processes. The Kirin 9030 uses a typical integrated package-on-package (iPoP) stack: multiple DRAM dies in a memory package sit above an organic redistribution layer (RDL) interposer, which sits above the SoC and package substrate. The full package is then mounted to the printed circuit board (PCB) through ball-grid array (BGA) solder bumps. The memory package substrate is a thin bismaleimide-triazine (BT) laminate carrying the LPDDR5X stack. The organic RDL interposer over the SoC routes the PoP signals around the die and carries possible dummy thermal copper pillars. The package substrate, a thicker Ajinomoto Build-up Film (ABF) build-up over a BT core, fans the flip-chip bumps out to BGA pitch and embeds the power planes. The whole stack is organic. The only silicon is the SoC and the LPDDR5X dies; there is no silicon interposer. Keeping it all-organic brings the package’s coefficient of thermal expansion (CTE) close to the PCB’s, reducing board-level warpage, and avoids the cost of a silicon interposer the SoC’s bandwidth does not need. In an iPoP stack, the memory package connects to the organic RDL interposer through an array of solder bumps. Underfill fills the gap around those bumps, adding stiffness and protecting the joints from mechanical stress. The Pro and Pro Max variants differ here, which we cover behind the paywall. The die shot and architecture tell us how Huawei allocated its silicon budget. The process tells us what SMIC can manufacture. We use the Helio G99 as the process reference for TSMC N6. Both SMIC N+3 and TSMC N6 are evolutions of previous 7 nm-class nodes. We used targeted TEM cross-sections through logic and memory regions, imaged in both fin-cut and gate-cut directions. Each cross-section caption gives its horizontal field width (HFW), the real width of the imaged area. We start at the transistor fins, then move up through standard cells, local interconnect, and SRAM. SMIC has not overtaken Intel or TSMC. It uses aggressive DUV scaling and DTCO to reach N6-class density, but that density doesn’t translate into comparable performance and efficiency, for two reasons: the node gap to leading-edge nodes, and Huawei’s core designs. Fin Profile One of the most important knobs in a FinFET process is the fin profile: the shape of an individual fin and the channel where current passes from source to drain. The ideal fin is tall, narrow, and nearly vertical. A taller fin increases effective channel width, while a narrower fin improves electrostatic control by thinning the body the gate must control. Push either too far, and the process pays for it: weaker drive current, fragile fins, taper, footing and line-edge variation that hit yield and device variability. The Intel 22 nm, 14 nm, and 10 nm fin cross-sections show how FinFET nodes have improved over time. 22 nm fins were a first-generation structure, relatively short, wide and strongly tapered. The shape limits current density and reduces gate control uniformity across the height of the fin. At 14 nm and 10 nm, Intel pushed the fins taller and narrower while also making the sidewalls more vertical. Rather than shrinking the device, these changes increase the effective channel width per fin and improve electrostatic control. The trade-off is that taller fins at tighter pitches are much more difficult to manufacture. Now, let’s compare the Helio G99 on TSMC N6 with the Kirin 9030 on SMIC N+3. Both processes are in the same class, with fin pitch of 30-32 nm on N+3 and 34 nm in our N6 cross-section. The pitch for N6 is especially interesting as N7’s HD library is generally listed with a 33 nm fin pitch, and N6 did not shrink pitches directly. Its density gains came from DTCO instead of tighter pitches. The 34 nm pitch was stable across our sampled region and serves more as a comparison against the SMIC N+3 we have not investigated further. Pinning down N+3’s fin patterning scheme takes more than one core unit. The CPU cores show a dense ~32 nm pitch, with the pitch between N-P fin pairs alternating between 78 and 88 nm. Logic alone may be consistent with dual-pitch mandrels of 120 and 110 nm, but this is a complex and unusual approach. Combining the pitch from the the 8T SRAM, which has more complex repeat unit, with the CPU core sequence allows us to reverse engineer the patterning steps with more confidence. As both the logic and SRAM should share the same base grid, a single CD mandrel lithography pattern with 128 nm pitch undergoing SAQP produces a die-wide ~32 nm grid (128 nm/4), which supports the pitch sequencing seen in both logic and SRAM cells. In the sampled cross-sections, N+3 shows a taller, narrower, higher-aspect-ratio fin than N6. The measured fin aspect ratio is ~9.5:1 on N+3 versus 7.8:1 on N6. N+3 also shows less top rounding, with an estimated radius of ~2 nm, compared with 2.8 nm on N6. Even though the fin widths differ, the ratio of top rounding to fin width tells the same story, with N+3 at 0.37 and N6 at 0.44. In a geometric sense, lower is better; a perfectly rectangular fin would have no top-rounding penalty. These are single-digit-nanometer features measured from a handful of cuts, so treat the absolute numbers as approximate. The important result is the relative gap: N+3’s fins are consistently taller, narrower and less rounded than N6’s. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Standard Cell A standard cell is the basic building block of chip layout: a fixed-height row pairing one NMOS and one PMOS transistor that share a gate, tiled in a grid to build logic blocks. The key dimensions are contacted gate pitch (CGP), cell height (CH), fin count, and the lower-metal routing grid. To measure density, we use the Bohr metric: a weighted average of NAND2 gate area (60%) and scan flip-flop area (40%). This represents a realistic mix of combinational and sequential logic. This metric has its limitations, especially for complex cell layouts like TSMC’s FinFLEX, which alternates cells with different fin counts. Even so, it is the best metric for a pure process-level comparison. Another important measurement is the fin pitch; it refers to the distance between two fins of the same transistor. In a FinFET process, multiple fins are used in each transistor to increase the drive current and thus performance. TSMC N6 ships both a high-density (HD) library with 2 PMOS and 2 NMOS fins per cell, and a high-performance (HP) library with 3 of each. More fins under the shared gate mean more effective channel width. HP cells switch harder at the cost of area. Designers mix the two on a die, primarily spending HP cells on timing-critical paths, and matching their PPA targets. In the Cortex-A55 core of the Helio G99, we found a cell height of 240 nm for the HD cell. MediaTek has used HD cells in the G99 to minimize die size and thus cost. As an SoC for budget smartphones at ~$100, this is essential. By contrast, we found only one library in the Kirin 9030, with 2 NMOS and 2 PMOS fins. This suggests a narrower library strategy than TSMC N6, where both HD and HP libraries are widely used. This likely reflects the smaller customer base and the more constrained domestic design and electronic design automation (EDA) ecosystem. In all three CPU cores of the Kirin 9030, we found cell heights of 228 nm, 5% smaller than on N6. This is also a reduction of 9.5% over SMIC N+2’s cell height of 252 nm. SMIC N+3 and TSMC N6’s HD library both feature a CGP of 57 nm. For SMIC, this is a 9.5% shrink over N+2. In the past, CGP and cell height alone may have been enough to compare transistor density. Now, however, we must consider scaling boosters and DTCO as well. SMIC’s density gain does not come from EUV. It comes from using every available DTCO booster aggressively. First is fin depopulation: reducing the number of NMOS and PMOS fins in each cell. The first FinFET nodes started with 3 or 4 fins for each transistor. SMIC N+3 and TSMC N6 HD both use only 2 fins per transistor, trading drive strength for density. Next is contact over active gate (COAG). By landing the gate contact directly over the active gate, instead of out over the isolation region, the cell height drops. N+3 integrates COAG while N6 does not. Our N+3 gate-cut cross-sections indicate COAG, with the gate contact sitting over the active region, while N6 shows an off-gate contact. Last is single diffusion break (SDB). Diffusion breaks are inserted between cells in the same row to provide electrical isolation, but they also introduce local layout effects (LLE), layout-dependent shifts in electrical characteristics. In the past, a double diffusion break was used, consuming the space of two CGPs. SMIC N+3 and TSMC N6 instead use SDB, saving area but increasing LLE sensitivity. This must be controlled at the process level and accurately modeled in the process design kit (PDK) so that EDA tools can account for it. Overall, SMIC N+3 has a transistor density of 113.4 MTr/mm², slightly above TSMC N6 at 107.7 MTr/mm². Even without EUV, SMIC has achieved density beyond TSMC’s mature N6 node which utilizes EUV. Metal Stack The smallest critical dimension in the teardown is M0; SMIC N+3 uses a 32.5 nm local metal pitch. That is smaller than the 36 nm M0 pitch on Intel 18A in Panther Lake. However, this does not mean that SMIC has a better process than Intel 18A or TSMC N3P. M0 is a local intra-cell routing layer. Its usefulness depends on the full interconnect stack: M1 and M2 pitch, track count, via and line resistance, design rules, mask count, overlay control, and routing flexibility. The 32.5 nm M0 is consistent with self-aligned quadruple patterning (SAQP), whose four-population line-width loading we read coarsely as alternating widths of 21.5 to 24 nm; M1 and M2, at 38 and 40 nm, are consistent with self-aligned double patterning (SADP), a single A/B split. On TSMC N6, M0, M2, and M3 sit at a relaxed ~40 nm and are consistent with SADP-class double patterning, with no need for quadruple patterning. That said, we measure M2 for example at ~43 nm, likely inflated by sparse routing. We do not assign any specific layer to EUV from our cross-sections; the distinction we can draw is double versus quadruple patterning, not lithography wavelength. Transistor-level density in the front-end-of-line (FEOL) sets an upper bound, but the design is ultimately limited by what the interconnect stack can route. The lowest metals are the most important for standard-cell density, but the semi-global and global layers determine how usable that density is at the block and chip level. Two axes are commonly used for chip cross-sections: the fin-cut and the gate-cut. The micrograph above is a fin-cut and shows metals 0 through 3. This axis lets us see the even-numbered metals, with M0 right above the fins. There are two kinds of M0 lines. The first are the power rails; these are wide wires for the VDD and VSS running horizontally at the top and bottom edges of each standard cell. The wide wires measure 55 nm across, more than double the other M0 lines. Their width minimizes resistance and reduces IR drop. The second kind are intra-cell wires, short segments within the cell that connect terminals to M1. These have alternating widths between 21.5 and 24 nm. The M0 pitch is 32.5 nm, a 19% reduction versus N+2 and N6. At this pitch, DUV patterning requires more aggressive multi-patterning, increasing mask count, overlay sensitivity, process complexity and cost. M0 is below what a single DUV-defined spacer (SADP) can resolve, so SMIC cascades a second spacer step (SAQP). The cross-section reflects the cost: the M0 trenches are visibly more re-entrant (narrower at the bottom than the top) than M1 or M2 on the same chip and carry a bright barrier-rich foot where the trench meets the etch-stop layer. That shape is partly the intended damascene profile, as a slightly narrow bottom helps void-free copper fill, but its magnitude at M0 is driven by the tight pitch and the higher trench aspect ratio. Intel 18A supports an M0 pitch of 32 nm, although Panther Lake has only shipped with a looser 36 nm pitch. This is due to Intel’s heavy usage of HP libraries. Among leading-edge nodes, 18A has the loosest M0 pitches due to PowerVia. With power routing moving to the backside, congestion is reduced, and the entire front-side metal stack can be used for signal routing. M2 is the first true inter-cell routing layer. It runs horizontally like M0 but spans across multiple cells to carry block-level signals. The M2 pitch sets the cell’s track height – the number of M2 tracks that fit between the VDD and VSS rails, defining what the library calls a 6-track or 7.5-track cell. This layer is the most important, limiting the routing of entire blocks. SMIC N+3 features a 5.7-track cell. The M2 pitch is 40 nm, a 5% decrease over N+2 and the same as N6. This shrink keeps the pitch at the edge of what is possible with double patterning. Future nodes will need to increase the number of masks for M2 as reducing the number of tracks is much harder due to the limitations in routing. The micrograph above is in the perpendicular direction, the gate-cut, and shows metals 0 through 4. This allows us to see and measure the odd-numbered vertical metal layers. The M1 pitch is 38 nm, 9.5% less than N+2 and 33% less than N6. The M1-to-gate ratio matters because it sets local routing flexibility. N+2 and N+3 use a 3:2 ratio, while N6 uses a 1:1 ratio, explaining the huge differences in M1 pitch. The more M1 lines there are compared with the gates, the more flexibility there is for power and signal crossing within the cell. Routing flexibility enables more complex and better cells. Clean fractional ratios are also preferred as a grid is periodic and improves layouts. The 3:2 ratio gives SMIC more local routing flexibility than a strict 1:1 grid, but it also complicates layout and patterning. This is a DTCO choice, with SMIC increasing process complexity to recover density and routability without EUV. This 3:2 ratio is not very popular in the leading-edge nodes. TSMC has only used it on N7+, the N5 family, and the short-lived N3(B). They have switched back to a 1:1 ratio for N3E. Intel has only used it on the 10 nm/Intel 7 family, with Intel 4, 3 and 18A all using a 1:1 ratio. Samsung is the only one still using a 3:2 ratio at the leading edge, using it in the SF4 and SF3 families. It remains to be seen if SMIC will remain at a 3:2 ratio or move to a 1:1 ratio with its future nodes. The industry is still actively exploring these local-routing ratios. At VLSI 2026, imec will be presenting work on even higher ratios, including a 2:1 scheme that can reduce area by up to 14%. We will be covering the conference in a future newsletter article. Subscribe We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. The final local interconnect layer for N+3 is M3, with a pitch of 44 nm. The M3 pitch is the same as on N+2 and 10% larger than on N6. The semi-global layers carry the majority of block-level signal routing. They have a coarser pitch than the lower local layers. On leading-edge nodes, they are designed to sit at the limit of DUV single patterning. M4 through M11 pitches were found divided between 80–82 nm (M4–M6), 128 nm (M7–M10), and 148 nm (M11). Given limited sampling, it is possible these are divided further in dense routing areas. At the top are two giant metal layers, M12 and M13. These have kept the same pitches as N+2 at 1920 nm and 4600 nm respectively. While the lower layers’ pitches are generally fixed by the process and library, the upper layers vary much more in pitch and count, depending on the design. Even two smartphone SoCs on the same process can have wildly different metal stacks. The Helio G99 carries fewer routing layers, reaching coarse metal pitches of 850 nm by M9, while the larger and higher-performance Kirin 9030 keeps fine pitches until M11. SRAM At the leading edge, SRAM is much more difficult to scale than logic. TSMC’s latest nodes have seen little to no bitcell scaling, while logic still has more DTCO levers to pull. While looking for other logic libraries in the GPU compute units, we stumbled upon the SRAM. The most common type of SRAM has 6 transistors (6T), but this cell had 8 transistors (8T) instead. 8T SRAM adds two transistors to form a dedicated read port. Unlike a 6T cell, where reading disturbs the storage, the decoupled read port removes read-disturb, improving read stability and letting the cell be pushed harder for performance. At first glance, the cut looked like an unusual logic library, with each cell row having 3 fins of one polarity and 5 fins of another. The rows also alternated in orientation. Energy-dispersive X-ray spectroscopy (EDS) resolved our confusion. The cut had not landed on the GPU logic, but on the SRAM macro beside it. The unusual fin pattern was due to the SRAM library. We return to EDS in the process flow analysis behind the paywall. SRAM libraries are not like traditional logic libraries. Due to the unequal number of PMOS and NMOS transistors, they require specialized rules and layout libraries. They do not need the flexibility of logic libraries, so they are hyper-optimized for one purpose: dense, reliable memory. The SRAM cell we found is a 1:2:2-2:2 cell. This means there is 1 fin per pull-up (PU) PMOS transistor, and 2 fins per pull-down (PD) and pass-gate (PG) NMOS transistor. These 2 PU, 2 PD and 2 PG transistors would usually form a single 6T high-current cell (HCC). An 8T HCC adds a read-pull-down (RPD) and a read-pass-gate (RPG) NMOS transistor, each with two fins. We measured a cell height of 406 nm, which brings the bitcell size to 0.0463 µm². That is a theoretical peak density of 21.6 Mib/mm². We estimate that a 6T HCC would have a cell height of 292 nm and a size of 0.0337 µm². This is ~12% larger than a 6T HCC on Intel 3 and 4. We also estimate the 6T high-density cell (HDC) to have a cell height of 228 nm and a size of 0.0260 µm². This is coincidentally the same as the logic standard-cell height measured earlier. The estimate puts the cell near Samsung 7LPP/5LPP and slightly below TSMC N7/N6. That is a theoretical peak density of 38.5 Mib/mm². 6T HDC is arguably the most important cell as it is used for the largest caches in a chip, the L3 caches and system-level cache (SLC). Both the Kirin 9020 and 9030 have split the SLC into 4 banks to raise total SLC bandwidth. In the Kirin 9030, the SLC increased from 2 MiB to 3 MiB per bank. Correspondingly, the number of arrays within the bank also increased by 50%, from 16 to 24. Each array can store 128 KiB and forms an orderly pattern on the die shot. From the Kirin 9020 to the Kirin 9030, the area of a 128 KiB SLC array decreased from 0.0477 mm² to 0.0392 mm², an 18% shrink. The achieved density is 25.5 Mib/mm², 66% of the theoretical maximum. While the SLC was quite similar across both chips, the L3 has seen some major changes, particularly in terms of its layout. The total capacity also went up from 10 MiB to 12 MiB. Much like the SLC, the L3 is also split into 4 banks. In the Kirin 9020, an L3 bank consisted of 16× 128 KiB arrays and 16× 32 KiB arrays. However, an L3 bank in the Kirin 9030 instead consists of 48× 64 KiB arrays. In the Kirin 9020 L3, a 128 KiB array was 0.0513 mm² and a 32 KiB array was 0.0154 mm². The size of the 128 KiB array is different on the L3 and SLC as the assist circuitry for the two arrays differs depending on their purpose. In the Kirin 9030 L3, a 64 KiB array is 0.0210 mm². Although not a like-for-like comparison, normalized for capacity, it is 18% smaller than the 9020’s 128 KiB L3 array and 31% smaller than its 32 KiB L3 array. The achieved density is slightly lower than the SLC, at 23.8 Mib/mm², 62% of the theoretical maximum. Unlike the L3 and SLC, the prime cores’ private L2 cache uses a 2-bank design. As the prime cores’ L2 is latency-critical, it likely uses 6T HCC instead of 6T HDC. The 9020 has 16 arrays in each bank while the 9030 has 32. Each array has a capacity of 32 KiB. A 32 KiB array in the L2 shrank from 0.0171 mm² to 0.0142 mm², ~17% smaller. The density is 17.6 Mib/mm², ~59% of the theoretical maximum for 6T HCC. SRAM scaled well from N+2 to N+3, shrinking by ~19%, close to the theoretical logic shrink. The caveat is that N+2’s bitcells were unusually large, bigger than comparable 7 nm-class nodes, so part of the gain is catch-up rather than true scaling. With the insights from STEEL’s teardowns, we will be doing a deep dive into SRAM in a future newsletter article. Subscribe Everything above came out of a single STEEL teardown: die annotation, block-level area analysis and TEM cross-sections through logic and SRAM. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Future Roadmap The same cross-sections that pin down N+3 also show where SMIC can go next. Although N+3 is already close to the practical limits of DUV multi-patterning in several layers, SMIC still has a few scaling levers left. A theoretical N+4 would likely start with cell height. N+3 uses 5 M0 tracks between its power rails. Moving to 4 M0 tracks, as on SMIC N+2 and TSMC N6, could reduce cell height by roughly 15%. The routing grid is only one side of the shrink; the front end also must fit into the smaller cell. One possible FEOL lever is reducing the p-to-n isolation spacing from two diffusion grid units to one. Intel used this scaling booster on Intel 4, and TSMC did so on its N3 family. This path trades layout flexibility for density. Fewer M0 tracks reduce local routing resources, while tighter p-to-n spacing raises integration and design-rule difficulty. M2 is also constrained by the cell height shrink. For SMIC to maintain a ~5.7-track cell, M2 would need to move toward ~35 nm. That would move another layer into SAQP territory. SMIC could also reduce the CGP from 57 nm to 54 nm. Intel reached a similar CGP on Intel 10 nm/Intel 7 without EUV. The local interconnect is also tougher. If SMIC keeps the 3:2 M1-to-gate ratio, M1 would need to shrink to 36 nm and would likely require SAQP as well. If SMIC moves to a 1:1 ratio, M1 could relax to 54 nm, but it would give up routing flexibility. Under this theoretical path, we estimate that SMIC N+4 could reach a cell height of 198 nm and a CGP of 54 nm, implying a Bohr density of 137.8 MTr/mm², on par with TSMC N5 or Samsung SF4. However, the difficulty is cumulative. Each step is individually plausible, but together they make N+4 harder than the transition from N+2 to N+3. It will likely take longer, cost more, and carry less process margin. A theoretical N+5 would require a larger integration shift. One possible path is backside contacts (BSCon), moving power routing and source/drain contacts to the backside, which would reduce front-side routing pressure and enable another reduction in cell height. The front-side metal pitches could relax to reduce the process complexity. M0 would likely relax slightly to ~34 nm, and M2 and M4 pitches could relax further. CGP is unlikely to shrink much further. Even with EUV, 48 nm has been the practical limit for yield and process control. This approach would allow N+5’s cell height to fall to 170 nm and its CGP to 53 nm. This implies a Bohr density of 163.6 MTr/mm², on par with Intel 18A’s HP library. However, this would not make N+5 cost-competitive with the leading edge. It would reach a similar density through a much more expensive route. The integration difficulty rises sharply, with new process flows for backside alignment, wafer thinning, contact reveal, and backside metallization. Past this point, standard density and interconnect scaling become increasingly unattractive. That is where Huawei’s roadmap stops looking like a normal foundry roadmap and starts looking like a packaging roadmap. At ISCAS 2026, Huawei unveiled its tau (τ) scaling law, reframing process scaling in the time domain. τ is the time cost of data movement and processing: switching delays in transistors, RC signal propagation delays in circuits, compute, memory, and networking latency. Outside Huawei’s terminology, this is called system-technology co-optimization. This is Huawei’s answer to its lack of EUV lithography. Without EUV, planar density cannot keep pace with TSMC, Intel, or Samsung. If transistor density cannot shrink further, Huawei’s alternative is to shorten wires, reduce buffering, and stack logic vertically. “LogicFolding”, Huawei’s implementation of this new scaling idea, is, in practice, an aggressive 3D stacking approach. AMD V-Cache places SRAM above or below a CPU die. AMD’s MI350X places active interposer dies (AIDs) underneath accelerator and compute dies (XCDs), with the AIDs handling cache, IO interfaces, the network-on-chip (NoC) and embedded metal-insulator-metal (MIM) capacitors. With LogicFolding, parts of the same logic block are split across multiple active dies bonded face-to-face at ultra-fine pitch. This allows Huawei to shorten some critical paths and reduce buffer overhead, not merely add cache capacity or offload the IO and interconnect. Shortening wires is where the higher clocks come from. A large share of a modern core’s delay and energy budget goes into driving long interconnects and the repeater buffers along them. LogicFolding distributes a block’s critical-path gates across multiple stacked tiers bonded at a very fine pitch, so the bond interface behaves like an additional metal layer and the longest paths get shorter. That is how Huawei expects to recover frequency and efficiency it cannot get from the process alone. Huawei’s roadmap shows its intent. Prime core frequency is targeted to rise from 2.75 GHz in the Kirin 9030 to roughly 5 GHz by 2031, far beyond what planar scaling alone could deliver. Prime cores with 3.1 and 3.39 GHz clocks are being tested in its labs, although their power consumption is unknown. Beyond that, chips are in the design, simulation or pathfinding phase, meaning the frequencies are targets. However, the direction matters more: LogicFolding also helps with performance, not just density. The catch is that Huawei’s density claim is not directly comparable to foundry densities. A stacked design can report more transistors per package footprint by adding active layers, even if each patterned die remains well behind TSMC or Intel in front-end density. This is how Huawei can claim to reach foundry 14A-equivalent density by 2031. This is not a like-for-like foundry comparison, with Huawei using stacked logic and measuring density per package footprint. On a normalized Bohr-density basis, SMIC N+3 is ~114 MTr/mm², 38% less than Intel 18A’s HD library. Huawei’s 3D roadmap closes the gap by stacking active logic, reaching 215 MTr/mm² by 2030. In 2031, the roadmap density jumps to 295 MTr/mm², implying either a third active layer, partial EUV insertion or aggressive planar DUV scaling. Huawei’s methodology makes other foundries look much denser as well. Applying it to AMD’s MI450X with an N2 top die on an N3P base die yields a theoretical density of 460.2 MTr/mm² in 2026, compared with Huawei’s 295 MTr/mm² in 2031. This Kirin 9030 does not use LogicFolding, remaining in a conventional mobile SoC package. Instead, it forms the baseline for how far Huawei and SMIC can push planar scaling. Future teardowns of Kirin and Ascend chips will show both planar logic density and Huawei’s hybrid bonding solutions. Export controls changed China’s optimization problem rather than ending it. EUV restrictions raised the cost and complexity of leading-edge manufacturing without freezing it. SMIC reaches N6-class logic density through DUV immersion, SAQP and DTCO, while Huawei shifts more of the burden onto architecture, packaging and system-level integration. Future nodes will be tougher. N+3 still had room to tighten local metals and reduce cell height and CGP. Further scaling without EUV leaves fewer levers. More aggressive multi-patterning adds masks and overlay error. SMIC can keep pushing DUV, but each step will get more expensive and less forgiving. The design side is just as critical. Huawei had domestic EDA tools and flows before the Kirin 9030, with the Kirin 9000s, 9010 and 9020 making that clear. Huawei was able to ship multiple consumer SoCs on SMIC N+2 and N+3 while cut off from the Western EDA stack. US export controls restricted EDA tools for advanced chips in 2022 but did not target tools for more mature chips. In 2025, the US government briefly placed much broader restrictions on EDA software from Synopsys, Cadence, and others, before lifting them less than two months later as part of a trade deal tied to rare earths. Huawei has been unable to access those tools because it remains on a US trade blacklist. That forced Huawei, SMIC and Chinese academic institutions to build their own tools and flows. Researchers at Peking University recently announced a prototype EDA tool for Huawei’s LogicFolding architecture, which requires a new flow to handle the multilayer layout and floorplan. This is not the same as replacing the full Synopsys or Cadence stack, but it shows where domestic EDA is headed: toward tighter co-optimization between architecture, process and packaging. These advances are also diffusing into the Chinese ecosystem. SMIC is licensing its N+2 and N+3 processes to HLMC/Hua Hong at the government’s direction rather than by choice. If the same process learning feeds into Ascend accelerators for AI training and inference, the choke point shifts from one named fab to an ecosystem. Alibaba’s T-Head silicon arm and Cambricon, a Chinese AI chip designer that is expected to supply ByteDance, could also be major beneficiaries. Sanctions aimed at SMIC alone become less effective once the manufacturing knowledge has spread to other fabs and design houses. China is not closing the gap with Intel, Samsung and TSMC. The teardown shows the opposite in several places: no EUV, no backside power, higher process complexity, and visible trade-offs. But China is still advancing. If domestic chips become good enough for phones, inference, networking and security-sensitive workloads, they can matter strategically without matching TSMC at the leading edge. Behind the paywall, we show what else STEEL can do, with material and process flow analysis of SMIC N+3, and analysis of the Kirin 9030 package. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline, access the full Kirin 9030 and SMIC N+3 analysis or to commission a custom teardown, contact sales@semianalysis.com.
Sports complex makes big impact on community four years later
Spooky Nook sports complex in Hamilton is the largest in North America.
Sports complex makes big impact on community four years later
Spooky Nook sports complex in Hamilton is the largest in North America.
Sports complex makes big impact on community four years later
Spooky Nook sports complex in Hamilton is the largest in North America.
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