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Tom Brady Takes Jab at Buffalo Bills, Old Highmark Stadium
Tom Brady takes shot at Buffalo Bills, Old Highmark Stadium during TV broadcast. The post Tom Brady Takes Jab at Buffalo Bills, Old Highmark Stadium appeared first on HEAVY.
ArtPrize is once a year, but new business Endcap Market and Studios aims to foster art year round
C.J. Stroud throws for 167 yards in Week 3
Texans QB C.J. Stroud has decent outing despite Nico Collins unavailable
MLB playoffs 2026 tracker: Astros win AL West, Phillies hang on for wild card — final playoff bracket, seeding and postseason schedule after MLB finish
Braves learn Wild Card series opponent
The Atlanta Braves now know who they will face in the Wild Card series.
Malik Willis throws for 210 yards
Miami Dolphins quarterback Malik Willis completed 20 of 36 passes for 210 yards, no touchdowns and one interception in Week 3
Hand injury for Qwan'tez Stiggers
Jets CB Qwan'tez Stiggers suffers hand injury and is questionable to return
A final day at the Academy of Natural Sciences bring tears, nostalgia and disbelief
Inside the museum, a steady stream of visitors took photos, touched the skin of of a scaly anteater being circulated by educators, and guided toddlers in dinosaur costumes through exhibits.
‘All INdiana Politics’: Property tax reform and childcare costs dominate debate in key State Senate race
INDIANAPOLIS — The race for Indiana’s 29th State Senate district has emerged as a focal point for the upcoming elections as candidates compete for an open seat in a key swing district. The vacancy follows State Senator J.D. Ford’s decision to challenge U.S. Representative Victoria Spartz for her seat in Congress. The 29th District stretches […]
NFL Week 3 TV coverage maps
There are 15 games remaining on the NFL schedule in Week 3. Where and when will they air?
Pourover: Falling flat in the 4th
Both sides of the ball faltered when the team needed them most.
2 megastars being targeted for Super Bowl halftime show: Here’s what we know
Will country music fans finally get their halftime show?
Labour is nostalgic for two-party politics. That cosy, simple time is over
Our fragmented political model will endure for the foreseeable future – and Reform will benefit from it until Burnham learns that cooperation is key, says Guardian columnist John Harris
Sports on TV/radio listings: Sept. 27
Where to watch and/or listen to today's sporting events that will be televised or broadcast on the radio.
Democratic attorneys general work to Trump-proof election
Stepping in for a complacent Congress, Democratic attorneys general are ready to fight efforts to undermine or overturn the Nov. 3 election. "We need to stay vigilant," says Colorado's Phil Weiser.
Sports betting vs. investing: Americans turn to betting for long-term wealth
Some Americans are treating sports betting as a strategy for building long-term wealth rather than simply gambling.
Which games are Fox, CBS broadcasting? NFL Week 3 coverage maps
Which NFL games will be broadcast in your region in Week 3? Here are the coverage maps for Sunday's action.
Arsenal 24yo explains international absence
Piero Hincapié has explained why he was left out of Ecuador’s latest squad, with the Arsenal defender confirming the reason during a live broadcast in his home country.Photo by Kevin C. Cox/Getty I...
Arizona at Washington State: Players of the Game
Saturday night saw the Arizona Wildcats travel to Pullman, Washington to take on the Cougars of Washington State. After a pretty up and down first half, the ‘Cats settled down and found their rhythm in the second half, winning a hard-fought contest 34-24. Even with the inconsistencies, there were plenty of clutch plays and career […]
Alabama football TE Josh Ford addresses punch from Dylan Stewart
Alabama football TE Josh Ford took a punch from South Carolina star LB Dylan Stewart in UA's win Saturday. Here's what he said about it.
Seahawks: JSN paces Sports Illustrated’s latest fantasy WR rankings
Seahawks star Jaxon Smith-Njigba sets the standard at the wide receiver position in fantasy football heading into the Week 3 slate of games.
FINAL: Cincinnati 31, K-State 26
It’s a familiar refrain from the past: a disastrous third quarter doomed the Kansas State Wildcats to defeat.
Four-Run Second Inning Helps Keep Rangers Playoff Hopes Alive
The Texas Rangers kept postseason pressure on the Houston Astros by capitalizing on a massive early inning against the Minnesota Twins.
High school flag football: Friday and Saturday scores
CIF City Section and Southern Section high school girls' flag football scores for games played on Friday and Saturday.
Two senior FBI agents ousted over investigation into alleged harassing calls to wife of Trump adviser Stephen Miller
Two veteran FBI agents overseeing counterterrorism operations in the nation’s capital have been removed from their jobs and reassigned over the handling of an investigation involving Katie Miller, the conservative podcaster and wife of senior White House adviser Stephen Miller, according to two people familiar with the move.
Takeaways from Michigan’s embarrassing loss to Iowa
Michigan’s loss to Iowa is unacceptable. Here are takeaways from the game.
A loss, but not a total one
A celebration of small victories, because it’s exhausting to complain all the time.
Raiders’ defensive makeover has an unexpected star leading the charge
Nakobe Dean is wasting no time proving his value in Las Vegas, as the Raiders’ $36 million linebacker has quickly emerged as the “glue” of their revamped defense.
Missouri State Football’s Growing Connection to the Lone Star State
Missouri State head coach Casey Woods and several players with Texas roots prepare to lead the Bears into a matchup against SMU in Dallas, marking the team's third consecutive trip to the state.
76ers Star Jaylen Brown's Work Ethic Complemented by LeBron James
Jaylen Brown may have been why James joined, but it's really the work he puts in on the court that stands out.
Microsoft CEO says Xbox's "streamlining" is "great to see" despite cuts and layoffs
Speaking on the Sources podcast, Satya Nadella called Xbox's ongoing restructuring under Asha Sharma "great to see", despite fresh layoffs this week.
Anthony Santander's Season Ends in Frustration For Blue Jays
The slugging outfielder will make another run at in 2027.
Joliet gets $1 million federal grant for community mental health program
The funds are part of more than $3.17 million in federal grants for Will County programs related to childcare, nursing education, substance abuse treatment, and university research, according to Rep. Lauren Underwood's office.
Preseason Gamethread: Penguins @ Sabres
Talk about the last preseason game with Pens fans here! The game will be broadcast locally on Sportsnet Pittsburgh+ and MSG-B in the respective local areas for Pittsburgh and Buffalo. Nationally, it will be carried on NHL Network. It will be available via audio on the internet/radio from 105.9 The X.
College football’s top Cowboys draft targets in Week 4
What CFB game are you most looking forward to?
Germany coach Klopp support nation's plans to host Olympics
Germany coach Jürgen Klopp showed his support for the nation's plans to host Olympic Games with an emotional anecdote. "All my memories of sports actually begin with the Olympic Games," Klopp told broadcasters ARD.
Intel Panther Lake Teardown, 18A, BSPD, GAAFET, SemiAnalysis STEEL
Panther Lake debuts the first commercial implementation of backside power delivery (BSPDN), introduces Intel’s first iteration of gate-all-around (GAA) transistors, and showcases their advanced packaging capabilities with its Foveros-S assembly. With Panther Lake, Intel’s manufacturing arc has shifted from nebulous roadmaps to shipped silicon, a significant milestone on their long road back to competitive semiconductor manufacturing. To evaluate the extent of Intel’s comeback, we tore down Panther Lake. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Our teardown traces 18A from its four-sheet RibbonFETs (Intel’s marketing name for GAAFETs) and gate stacks through contacts, frontside and backside wiring, and the bonded carrier. We explain how these material and integration choices improve gate control and reduce resistance, while adding capacitance, thermal resistance, and process complexity. Our measurements put Panther Lake’s 18A compute logic and TSMC N3E GPU logic at similar logic density. However, 18A does not lead TSMC N3P, N2 or Samsung SF2 in peak density. Panther Lake’s CPU cores are incremental updates, and the high-end GPU still uses TSMC N3E. Panther Lake assembles one compute tile, one GPU tile, and one I/O tile atop a passive base tile using Intel’s Foveros-S advanced packaging. Both compute tile variants use Intel 18A. The Xe3 GPU options are a 4-core GT1 tile on Intel 3 and a larger 12-core GT2 tile on TSMC N3E. Both I/O tile variants use TSMC N6. [1], [2] Our analysis centers on the PTL-U compute tile, both the 4-core and 12-core GPU tiles, as well as the 12-lane I/O tile. In conventional chips, power and signal are routed through the same frontside metal stack towards the device frontend. Power rails consume scarce routing resources near the transistors, while tall via stacks carry VDD and VSS from the coarse upper wires to local rails. Backside power delivery (BSPD) moves the main power network behind the transistor layer, to the backside, separating it from frontside signal routing. We covered BSPD and its impacts in 2024. [3], [4], [5] Intel’s BSPD implementation, branded as “PowerVia”, routes power through dedicated backside metals to nano-TSVs, which connect those rails to local source/drain (S/D) contacts. Implementing that separation requires Intel to build the interconnect stacks from both sides of the wafer. The frontside comprises the M0-M14 signal stack, while the backside comprises the BM0-BM5 power stack. M0 and BM0 are closest to the transistors. The nano-TSVs connect the two sides, but Intel patterns and etches each via from the front after forming the contacts. A narrow via runs from the side of the contact deep into the silicon substrate. Intel then completes the frontside signal metal stack, bonds the wafer to a carrier, flips it and removes the original substrate until the buried via tips are exposed. The backside metal stack is then deposited directly on the revealed vias. The nano-TSV and backside-via profiles taper in opposite directions because Intel forms them from opposite sides of the wafer. The transistor structures form the FEOL. Local contacts and nano-TSVs connect them to the wiring. M0 begins the frontside interconnect stack. The silicon carrier remains attached above the frontside interconnects. It supports the device wafer during substrate removal and backside processing and remains part of the finished chip’s thermal path. PowerVia removes the main power distribution from the congested frontside metals, routing supply through shorter and wider backside wires. Its lateral landing still occupies area in the standard cell, so it recovers less cell area than a direct backside contact. [3] Nano-TSVs beside the logic devices carry VDD or VSS from the backside power network, while signal connections continue upward through the frontside metals. Backside Interconnects Samsung SF2 data is included for comparison to Panther Lake’s within this article. SF2 is the incumbent GAA foundry node but lacks BSPD, serving as a useful reference to evaluate 18A. A full teardown of Samsung’s S26 products, processed on SF2, will be shared soon.Nanosheet-cut EDS comparison. The PowerVia supply path runs from the backside Cu rails through Mo-lined W nano-TSVs to the local transistor contacts. In this cross section, the tapered connection spans roughly 150 nm from the contact level to BM0. The Ta liner confines Cu and promotes adhesion to the surrounding stack; the AlOₓ etch stop controls the next dielectric etch above the rail. Dielectric beneath the ribbons electrically separates the devices from the backside wiring and removes the conducting silicon body below the channel. [6] AlOₓ serves as an etchstop (ES), enabling endpointing and protecting the underlying layers. Low-volatility aluminum fluoride reaction products resist the fluorinated plasma, allowing a thin AlOₓ film to protect the metal while the surrounding low-k dielectric is removed. [6], [7]. While the BM0 and layers above the M1 lines show double AlOx layers, Our SMIC N+3 teardown showed single AlOₓ layers. SMIC uses a simpler local AlOₓ substack, while the remaining cap and etch sequence provide the required landing protection. So why double layers? The closely spaced AlOₓ doublets provide two protected endpoints in the etch sequence. Intel documents an AlOₓ/SiN/AlOₓ stack that explains the benefit. The main dielectric plasma etch stops on the first AlOₓ film; a selective wet clear opens that film; a second plasma etch removes the intermediate SiN and stops on the second AlOₓ film. The final wet clear exposes the metal landing surface. SiN is the intermediate dielectric in Intel’s published example. [8] The second stop protects the metal through a cap breakthrough. Wide openings can etch faster than narrow ones, and etch depth varies across the wafer. Metal under an early-clearing opening would otherwise be exposed while other openings still need more etching. Staged protection widens the process window and reduces metal erosion, corrosion and void formation. [8] TSMC documents AlN/AlOₓ/SiOC/AlOₓ above Cu, with AlN blocking Cu diffusion, and a simpler AlN/SiOC/AlOₓ variant that omits one AlOx film. [9] Levels with different opening sizes, aspect ratios, pattern densities and cap materials need different etch margins. A double AlOx stop is useful where another protected endpoint justifies the added processing. The extra film adds formation, selective opening and cleaning steps, plus another set of interfaces to control adhesion, moisture, and stress. These blanket films are opened through the existing via pattern, so each film does not require another lithography mask. AlOₓ adds parasitic capacitance when it replaces lower-k dielectric; two thin AlOₓ films can nevertheless contain less AlOₓ than one thick film. Total thickness, placement, and theintermediate dielectric determine the electrical cost. Deposition chemistry also changes AlOx permittivity and residual hydroxyl content, which can oxidize the underlying metal. [7], [8], [10], [11] The backside stack separates into relatively fine BM0-BM2 wiring near the devices and coarser BM3-BM5 power distribution. The largest pitch increase occurs between BM2 and BM3. BM0’s pitch closely matches the logic-row height, fitting local power delivery to the cell rows. Higher levels aggregate current through larger conductors: routing density becomes less important than low resistance and current capacity as the network approaches the package. This hierarchy provides wide power wiring for the power delivery network without consuming scarce frontside signal-routing resources. [3] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Frontside Interconnects Intel 18A combines Mo-lined W contacts and nano-TSVs with a separate backside Cu power network. Samsung SF2 keeps power on the frontside, using Ti-based contact interfaces and Ta-based barriers and Co liners around Cu wiring. In 18A standard-cell rows, backside power rails supply the devices through nano-TSVs within the cells, freeing frontside routing resources. Samsung’s M0 accommodates both power and signal connections. From the device toward M0, the connection runs through a Ti-based S/D interface, W contact fill, a Mo-lined W via, and the Cu M0 wire. Mo supplies a conductive nucleation and adhesion layer for W, replacing the resistive TiN liner used in conventional W integration. This increases the effective conduction volume within the feature while retaining W fill and its established polishing, cleaning and etching processes. Intel’s Mo/W patent describes this integration tradeoff. The nano-TSV uses the same Mo-lined W construction in the backside supply path. [12] The move from TiN to Mo is an incremental change. While a full Co or Mo fill can also reduce the volume lost to liners in very small features, it requires new integration schemes that increase complexity and risk. Cu remains attractive for wider wires due to its low resistance. As wires and vias shrink, the diffusion barrier consumes an increasing fraction of their cross-section. [12], [12], [14] Intel uses Co/Ru liners at M0-M1, Co at M2-M4, and Nb at M5-M9. The lower-level liners help Cu adhere and reduce void formation during trench fills. Applied Materials’ Endura has new thermal control that facilitate wetting process, so the thin film continuity is good enough that good capillary pressure will drive Cu atoms to the via bottom without voiding. Intel’s choice to use Nb is particularly interesting. Intel’s Nb patent describes a conductive diffusion barrier intended to reduce the barrier’s contribution to resistance relative to conventional Ta-based barriers, particularly at via bottoms where all current crosses the barrier. The patent pairs Nb in coarser levels with the option of lower-cost PVD processing. [15], [16] The upper metal layers support thicker barriers formed through physical vapor deposition (PVD) despite its worse coverage and uniformity. Meanwhile, the lower metal layers require thinner barriers deposited through conformal atomic layer deposition (ALD). Co/Ru adds another material interface and requires controlled deposition and Cu fill. Changing liners and barriers by metal layer allows Intel to optimize interconnect resistance, process complexity, and reliability. [15, 16] RibbonFET, Intel’s name for its gate-all-around FETs (GAAFETs), replaces the FinFET’s vertical fins with four stacked horizontal silicon nanosheets, allowing the gate to surround the channel on every side. The path to GAAFET begins with the planar transistor. A planar MOSFET places the gate above the channel between its source and drain. Pairing an NMOS with a PMOS transistor creates a CMOS inverter, in which the NMOS pulls the output low for a high input, and the PMOS pulls it high for a low input. The gate must retain electrostatic control of the channel to ensure clean switching. As gate lengths shrank, the drain began to compete with the gate for that control, increasing off-state leakage. Electrostatic control was restored through an architectural evolution that raised the channel into a vertical fin and wrapping the gate around three sides. Called “FinFET”, this new architecture packed more effective channel width into a smaller footprint. Further scaling made it harder to maintain both drive current and leakage within smaller cells, and reintroduced the same problems planar MOSFETs faced. Nanosheet GAAFETs close the fourth side by replacing the vertical fin with a stack of horizontal nanosheets, each surrounded by the gate. The tighter electrostatic control suppresses leakage at shorter gate lengths while stacking adds effective channel width within the cell footprint. In a FinFET process, channel width changes in discrete steps as designers must add or remove whole fins. Nanosheet width can instead be adjusted continuously within the process’s design rules. Wider sheets increase drive current, while narrower sheets reduce capacitance at the cost of drive current. Intel 18A uses stacks of four nanosheets each and varies their widths across logic and SRAM. At the process level, adding more sheets to each stack increases effective channel width and drive current, but complicates fabrication. RibbonFET vs MBCFET Samsung began GAAFET production in 2022 with SF3E, following with SF3 and now SF2. Its ‘MBCFET’ provides a useful structural comparison with Intel’s first RibbonFET implementation. [17] STEEL is digging deeper into SF2, used in the Exynos 2600, and TSMC’s GAAFET N2, used in Apple’s A20 Pro, in upcoming newsletter articles. We’re throwing some teasers on X. Let’s compare Samsung SF2’s MBCFET with Intel 18A’s RibbonFET. Subscribe Even to the untrained eye, Intel’s extra nanosheet is obvious. Intel stacks four ribbons to Samsung’s three. Samsung’s sheets are much wider in these fields, so both sheet count and width matter to the available channel perimeter. Sheet width also changes which silicon surfaces carry current. On conventional (001) silicon, wide nanosheets emphasize the broad top and bottom surfaces, favoring electron transport; the larger sidewall contribution in a narrow sheet favors hole transport. Thinner sheets improve gate control but increase confinement and scattering. This makes width and thickness part of the NMOS/PMOS balance, alongside strain and threshold voltage. [18], [19] GAAFET designs like 18A use different work-function-metal (WFM) stacks for NMOS and PMOS. Around each ribbon, a thin SiOx interfacial layer separates the silicon channel from the HfOx high-k dielectric, with La providing dipole tuning and the WFM wrapping the dielectric. NMOS uses a TiAl-based stack, while PMOS uses TiN WFM. W fills the remaining gate trench, providing a lower-resistivity path where the work-function layers are no longer needed. In this field, the PMOS stacks leave room for W between ribbons, while the NMOS stacks occupy more of those gaps. A silicon-based dielectric marks the P/N boundary, allowing the PMOS and NMOS gates, sharing the same gate trench, to be processed sequentially. Fast logic paths, retention circuits, and SRAM need a family of threshold options. Changing threshold without substantially changing device dimensions, capacitance or fabrication complexity is valuable. FinFET processes typically use different work-function-metal stacks. In a four-ribbon GAA stack, the narrow sheet-to-sheet gap limits how much WFM can fit around each channel. La in the gate dielectric creates interfacial dipoles at the SiOx/HfOx boundary, shifting effective work function and tuning threshold voltage. This gives Intel another control alongside its NMOS and PMOS WFM stacks. Low-threshold devices improve critical-path drive; higher thresholds reduce leakage elsewhere. Dipole tuning is especially useful in GAA because it changes threshold without consuming the narrow intersheet gap with thicker WFM. Precise control of La incorporation, diffusion and interface quality has long been a challenge, limiting viability in high volume production but is now seen from every leading-edge foundry. Intel’s patent describes depositing a dipole-forming oxide above HfOx and annealing it toward the interfacial oxide before completing the work-function and fill metals. This separates threshold tuning from the space available for metal. Newer research addresses the thermal cost: imec’s 2026 dipole-middle research inserts the shifter between two HfOx depositions, shortening the diffusion path while protecting SiOx during patterning. [20], [21]Matched-cut EDS, Intel 18A (left) vs. Samsung SF2 (right). Intel retains raised source/drain epi beneath its contacts, while Samsung recesses W deep into the epi to form a V-shaped Ti-lined interface. The deeper contact increases metal-to-semiconductor area and shortens the current path from the lower sheets, reducing contact and spreading resistance. It also removes epi volume and brings the contact etch closer to the channel ends. Retaining more epi preserves the material available for strain transfer, especially from SiGe into PMOS. These geometries balance contact access against stress engineering and etch margin. [22], [23] Samsung stacks three sheets to Intel’s four ribbons, and both processes use sheet width to tune drive strength. In our Samsung cross-sections, widths range roughly from 19 to 30 nm in the NPU rows and 37 to 50 nm in the CU cell. The Samsung nanosheets taper, with the widest sheet at the bottom and the narrowest at the top. Both processes use HfOx gate dielectric and Ti-based work-function stacks, with Al in the NMOS stack. In the Samsung devices shown here, the dielectric and WFM occupy the intersheet gaps, leaving W above the top sheet. Intel’s PMOS stack leaves more room between ribbons, and W fills those gaps while the thicker NMOS stack leaves W mainly in the upper trench. Gate-stack EDS maps. The W between Intel’s PMOS ribbons provides a conductive path close to the lower gates. Where WFM fills the entire gap, the gate still surrounds the channel, but voltage reaches it through the more resistive work-function films. Thinner WFM and dipole tuning preserve room for low-resistivity fill; Mo and Ru are alternative fill metals being developed for further scaling. [24] A masked, sequential WFM flow explains the different gate heights and inter-nanosheet fill. The proposed sequence below shows how separate NMOS and PMOS work-function steps produce that geometry. Enabled by the BSPDN process, Intel replaces the dense-logic silicon subfin with dielectric, removing the parasitic conduction path below the ribbons and reducing substrate-related capacitance. A retained silicon body as in classical, non-SOI, planar and FinFET designs needs junction and punchthrough-stop engineering to suppress leakage. Dielectric isolation makes that leakage less sensitive to the subfin doping profile but adds removal and fill steps. It also weakens the direct thermal path through silicon, making the contacts, metal stacks and package more important for heat extraction. [24], [26] Fluorine is concentrated around selected Intel device structures in the maps. WF6 is a standard precursor for W nucleation and fill, while barrier films protect adjacent dielectrics from fluorine attack. Low-fluorine W processes reduce the residual-F burden. Chloride-based precursors avoid introducing F during W deposition, but require control of chlorine attack, nucleation and fill quality. The integration target is a continuous, low-resistance W path with a thin protective liner and minimal chemical damage to the surrounding stack. [20], [27], [28] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. We measured cell height, gate pitch, metal geometry, and ribbon dimensions at the XTEM sites shown below. The tables group these dimensions by site and device polarity. Our “sheet cuts” cross the silicon channel and show the ribbons end-on. “gate cuts” run along the channel through successive gates. The 18A logic cell dimensions point to a five-track logic library while the N3E and Intel 3 cell dimensions evidence a seven-track logic library. The DDR-PHY uses wider M0 wires and much larger spacing than core logic. That trades routing density for lower wire resistance and weaker coupling between neighboring nets. The geometry suits the current delivery and coupling requirements of analog, clock, and I/O circuitry. PowerVia lets 18A combine a compact cell height with wider M0 geometry by moving the main power rails off the signal-routing tracks. That relaxes local wire scaling while preserving a small cell footprint. Cell height and gate pitch set the geometric density; pin access and routability determine how much of it a real block can use. [29] The biggest takeaway from our gate-pitch measurements is that Intel 18A compute logic and TSMC N3E GPU logic have similar density in the Bohr representative-cell model. The 18A example is 18.6% denser than the Intel 3 GPU example. Gate pitches are nearly identical across the three sites, so cell height drives most of the difference. The Bohr model combines a four-transistor NAND2 spanning three gate pitches and a 32-transistor scan flip-flop (SFF) spanning nineteen pitches, weighting their densities 60:40. The sensitivity column shows how independently changing cell height and gate pitch by ±1 nm changes the result. This compares representative cell geometries; whole-die density also depends on cell mix and placement. The 18A P-core gives M0 substantially more metal cross section than the N3E vector engine. Treating each profile as a trapezoid gives 2.63 times the area per line and 1.84 times the area after normalization by routing pitch. The larger section reduces the geometric contribution to line resistance and lowers current density for a given current. Taller and wider wires also add capacitance, so circuit delay depends on the balance of resistance and capacitance. The DDR-PHY has less metal area per routing width than the 18A core fields, while remaining above N3E. [30] Area = height × (top CD + bottom CD) / 2, including liners. Area/pitch normalizes by routing width. Taper is the symmetric sidewall angle from vertical, with the largest angle belonging to the DDR-PHY. Compute tile The measurements show how ribbon dimensions and gate-stack geometry vary across the compute tile and between NMOS and PMOS to balance channel drive, gate load and the space needed for the dielectric/WFM stack across logic, SRAM and the DDR-PHY. Width mainly changes available channel perimeter; thickness also changes electrostatic control and carrier confinement. Gate-stack thickness then determines the space left for low-resistivity fill P-core and LP E-core logic Both the P-core and LP E-core use multiple nanosheet widths. Widths are measured on high-magnification XTEMs while wider-field images demonstrate additional width choices within the LP E-core. Multiple widths are expected even within an LP E-core. Timing-critical paths, buffers and cells with different fanout need different drive strengths. The lower-magnification fields show this width diversity beyond the sites quantified in the table. L2 and L3 SRAM GAA gives SRAM designers another way to balance the pull-up (PU), pass-gate (PG), and pull-down (PD) transistors. FinFET bitcells set device strength through fin count while GAA adds nanosheet width as a sizing knob. In a 6T SRAM cell, a strong pull-down relative to the pass-gate limits read disturbance, while a strong pass-gate relative to the pull-up improves writability. During a write, the pass-gate and write driver pull the node storing “1” below the inverter trip point. During a read, the pull-down holds the node storing “0” low. Bias, threshold voltage, mismatch and assist circuitry set the remaining margin. FinFET high-current cells commonly use a PU:PG:PD fin-count pattern of 1:2:2, a device-sizing ratio rather than a current ratio. Ribbon width lets Intel balance SRAM strengths without adding whole fins. The L2 cell uses its narrowest ribbons for PU and widest for PD, improving writability and read stability respectively. Intel’s disclosed HCC operates without assist; its denser HDC uses negative-bitline write assist. Pulling the selected bitline briefly below ground increases pass-gate overdrive so it can overpower the pull-up at lower supply voltage. That buys density and low voltage writability at the cost of boosting circuitry, switching energy, and additional voltage stress that must be controlled. [31], [32] Four rectangular ribbons give the perimeter = 8 × (width + thickness), before corner rounding. PG/PU is 1.49 and PD/PG is 1.16. The L3 structures closely resemble L2 in layout and cell height. Fewer L3 nanosheet widths are tabulated because fewer high-magnification images were available. DDR PHY The DDR-PHY trades density for controlled analog behavior and reliable off-chip signaling. It contains drivers, receivers, delay circuits, and calibration logic that set drive strength, sampling time, and voltage margin. Repeated four-sheet devices with similar widths fit the use of regular transistor units for matching and programmable drive. Its wider local wiring provides room for current delivery and separation of sensitive signals, while consuming more area than a dense core-logic grid. The layout serves the memory channel’s electrical requirements as well as digital logic density. [33] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Intel 3 GPU devices Vector engine logic Intel 3’s XVE logic uses two-fin PMOS and NMOS devices with power rails in M0. Its cell height and M0 pitch give a seven-track geometry, two tracks more than the 18A logic. One-fin groups also appear among the two-fin devices. Intel 3 L2 SRAM The Intel 3 L2 SRAM uses the familiar HCC sizing pattern: one PU fin, two PG fins, and two PD fins. N3E GPU devices Vector engine logic The N3E XVE field contains repeated two-fin devices with seven-track cell geometry. N3E remains a FinFET process, giving Panther Lake a direct FinFET-to-RibbonFET comparison. N3E L2 SRAM The N3E L2 SRAM uses the same PU:PG:PD fin-count pattern of 1:2:2. Panther Lake-U follows Lunar Lake’s floorplan quite closely. Both pair 4 P-cores with 4 LP E-cores and NPU, media and display engines in similar locations. Lunar Lake also uses Xe2, the direct predecessor to Panther Lake’s Xe3 GPU. This makes Lunar Lake the most direct basis for our comparisons. Arrow Lake differs in core count and uses the older Xe-LPG GPU architecture, so we only use it where it offers a more direct component-level comparison. Compute tile Panther Lake compute-tile floorplans remain sparse even months after launch. Intel 18A’s backside metal and dielectric stack must be removed without damaging the underlying structures before a clean transistor-level floorplan can be imaged. Most published die shots hide or heavily process the background, but we are quite proud of the die shot we achieved and are excited to show the work we have done. We measured the areas of the key components on the compute tile and compared them with their Lunar Lake predecessors on TSMC N3B. These help us to capture changes in block area and compare the two chips across process nodes and designs. Our total tile areas exclude the scribe-line area. The compute-plus-GPU subtotal below uses the PTL-U compute tile and GT1 GPU; it excludes the I/O tile and passive base. Individual block areas use the boundaries marked on the floorplans The compute-plus-GPU row is recomputed from the displayed PTL-U and GT1 areas. Component rows use their stated per-region counts and are not an additive partition of the whole tile. The P-core area remains almost unchanged between Lunar Lake and Panther Lake, despite L2 capacity increasing from 2.5 MiB to 3 MiB. Arrow Lake uses the same Lion Cove core as Lunar Lake but also has a 3 MiB L2. Cougar Cove fits 20% more L2 into the same P-core area. The larger private cache keeps more of each core’s working set close to its execution units, reducing access to shared L3 and DRAM. Extra capacity adds storage leakage and lookup energy, so designers balance it against avoided lower-level accesses. The shared P-core L3 cache also shrank by 14.8%. [2] Cougar Cove combines a similar footprint with Intel’s reported power-efficiency improvements. RibbonFET’s tighter channel control reduces leakage, while PowerVia reduces supply droop and allows tighter voltage guardbands. [1] Darkmont’s four-core LP E-core cluster is 5.0% smaller than Skymont’s on Lunar Lake, with most of the reduction in its L2 regions. The 1 MiB region shrank by 8.4% and the 1.5 MiB region by 14.9%. The tag arrays also use one fewer visible row. Tags identify which memory addresses the data array holds, so rearranging them changes the cache’s layout and wiring without requiring less data capacity. [2] The LP E-cores share one L2. This pools capacity and avoids duplicating all the cache machinery, but the four cores contend for its banks and bandwidth. Their separate cluster also keeps light work away from the performance cluster and its L3, allowing that larger domain to sleep. [1], [2] Cache area includes more than the storage cells. Tags identify each line, decoders select rows, sense amplifiers read the small bitline signal, and wires connect to the banks. Splitting an array into smaller sections shortens wordlines and bitlines, improving access speed, but duplicates peripheral circuits. Panther Lake’s smaller cache regions therefore reflect the complete memory implementation, including how much of each region is devoted to storage. [34] Unlike Meteor Lake and Arrow Lake, Panther Lake has no separate SoC tile. The NPU, LP E-cores, memory controllers, PHYs, media and display engines now share the compute tile. This removes an active die and keeps CPU memory traffic on one die. The cost is moving PHY and I/O-related circuitry onto 18A: drivers, receivers and analog circuits must still meet external voltage, loading and signal-integrity requirements, so their area does not shrink like dense digital logic. [1], [2] The biggest shrink comes from the NPU, which occupies 36.9% less area. NPU 5 consolidates the same total INT8 MAC count into half as many neural compute engines. Each of the three NCEs has a larger MAC array to make the complete NCE envelope 22.6% larger than an NPU 4 engine. Consolidation also halves the number of scratchpads and SHAVE DSPs, from 12 to 6. The MAC array handles matrix multiplication and convolution, while SHAVE executes vector and custom operations that fit the array poorly. [1], [2], [35] The paired floorplans identify each NCE envelope and its scratchpad, MAC, and SHAVE regions. Each measured MAC polygon is counted once per NCE in the area accounting below. The scratchpads store weights, activations, and intermediate results near the MAC arrays, allowing repeated use without fetching them again from DRAM. Halving their number delivers the largest measured area saving but leaves less local storage for the same total MAC count. Layers that no longer fit locally require smaller working tiles or more transfers of intermediate data. The benefit depends on keeping the enlarged arrays busy while managing that tighter storage budget. [36] NPU 5 also adds native FP8. Using half the operand width of FP16 reduces storage and transfer demand, helping workloads fit the smaller local memory budget. Lower precision and format-dependent range make scaling and model validation part of deployment. Hardware activation functions further reduce work that would otherwise occupy the programmable DSPs. [1], [2] Microsoft requires an NPU to deliver at least 40 TOPS for Copilot+ PCs. Both Lunar Lake and Panther Lake meet this threshold, but Panther Lake uses significantly less silicon. GPU tiles Panther Lake is Intel’s first product with Xe3, its latest GPU architecture. It offers two different GPU tiles: a smaller GT1 tile with 4 Xe3 cores on Intel 3 and a larger GT2 tile with 12 Xe3 cores on TSMC N3E. Panther Lake allows us to compare the same GPU architecture across both Intel 3 and TSMC N3E. Wildcat Lake adds a third Xe3 implementation on Intel 18A. A future newsletter will detail Xe3 and its implementation differences across all three process nodes. GT2 scales Xe3 to a different physical layout, with render slices arranged vertically instead of GT1’s horizontal arrangement. Slice placement sets the distances to shared cache banks and the D2D interface. Those wires consume area and add delay, so scaling the number of Xe cores also requires a new balance of cache placement, routing and timing. [1] What’s immediately obvious is that the GT2 tile on TSMC N3E has much smaller Xe cores than GT1. These block areas include logic, caches, and routing. An Xe core on the GT1 tile is ~69% larger than one on Lunar Lake, and ~55% larger than one on GT2. Intel 3 therefore uses substantially more area per Xe core. The block-area gap exceeds the measured logic and SRAM density gaps, bringing routing, timing targets, cell mix, and floorplan allocation into the comparison. The measured vector/matrix engine region is almost unchanged between Lunar Lake and Panther Lake’s GT2 tile. Xe3 retains eight 512-bit vector engines and eight 2048-bit XMX engines per core. Its gains also come from feeding those engines more effectively: more resident threads hide stalls, and variable register allocation lets shaders trade registers per thread against the number of threads kept active. [1] The shared L1/SLM capacity increased by 33% from 192 KiB to 256 KiB, while its area increased only 5%, raising effective density by 27%. L1 retains reused cache lines, while software-managed SLM lets a thread group share data locally. Both reduce traffic to more distant memory. Allocating more SLM per group can also limit how many groups reside on a core at once. [1], [37] The GT1 tile carries 4 MiB of L2 against 16 MiB on the GT2 tile. GT1 divides its L2 cache into four 1 MiB banks, while GT2 uses eight 2 MiB banks. Each bank contains 128 macros, but each N3E macro stores 16 KiB, twice the Intel 3 macro’s 8 KiB capacity. The N3E macro is only 54% larger while holding twice as many bits, giving it 30% higher density: ~23.7 Mbit/mm² versus 18.3 Mbit/mm². Including bank-level circuitry, the gap widens to ~16.9 Mbit/mm² on GT2 versus ~10.4 Mbit/mm² on GT1. GT2 gains density with its macros storing more bits per unit area, and those macros occupy more of each cache bank. Larger macros spread decoder and sense-amplifier overhead across more storage, while a more compact bank layout reduces the share spent on control and routing. The compromise is longer wordlines and bitlines that carry more capacitance. [34] I/O tile Panther Lake uses two I/O tile variants, both fabricated on TSMC N6. The smaller one provides 4 PCIe 5.0 and 8 PCIe 4.0 lanes and serves lower-tier systems as well as those without a discrete GPU, while the larger one adds 8 PCIe 5.0 lanes, bringing the total to 20 lanes, for discrete-GPU connectivity. Panther Lake SKUs with the larger 10- or 12-Xe GPUs use the smaller I/O tile. [38] The smaller I/O tile adds a PCIe 4.0 block and a Thunderbolt block to Lunar Lake’s I/O layout, providing four additional PCIe 4.0 lanes and another Thunderbolt 4 port. Its repeated N6 blocks retain nearly identical areas and layouts. Reusing these proven PHYs and controllers avoids porting and requalifying external interfaces on 18A, where faster digital logic offers less benefit to circuits constrained by the off-chip link. [38] SemiAnalysis’s teardown lab (STEEL) dives deep into the world’s advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. We’re hiring technical experts from system to transistor and everywhere in between. Check out our Careers page. Panther Lake offers scalability and modularity through its disaggregated packaging that partition compute, GPU, and I/O silicon into separate tiles allowing for a suite of tile configurations. This partitioning makes the package part of Intel’s node economics as it determines how much leading-edge wafer area each product consumes, which functions can remain on other processes, and how much configuration freedom Intel can offer from a shared set of tiles. Furthermore, fabricating the compute and GPU tiles separately confines the new 18A process to the compute tile and allows graphics and I/O to use other, more established, and more cost-effective processes. For Panther Lake, the GPU and I/O tiles are assembled alongside the compute tile on a passive silicon base using Foveros-S. Intel’s current technology brief lists a nominal 36 µm pitch for Foveros-S. Through-silicon vias (TSVs) in the base connect the fine wiring above to the larger package connections below. The functional tiles sit side by side on that passive base in a 2.5D configuration. [39] Our cross-section through the compute and GPU tiles shows the package’s wiring hierarchy. Microbumps connect each active tile to the passive silicon base; its fine redistribution layer (RDL) carries the short, dense tile-to-tile links. TSVs carry connections through the base to the package substrate, which fans them out to the much coarser motherboard solder joints. The base supplies interconnect, while computation remains in the active tiles above it. [39] At the compute-tile edge, the higher-magnification inset shows a local microbump spacing of approximately 25.24 µm and a feature width of 12.33 µm. These local spacings are finer than Intel’s nominal Foveros-S value. The X-ray fields further confirm tighter neighboring bumps, consistent across every die-to-die area found on each tile. Additional X-ray analysis is offered after the paywall. Putting the memory controller beside the CPU removes the D2D transfer that CPU memory requests required in Meteor Lake and Arrow Lake. This avoids the extra transmitter, receiver, and link traversal, saving interface energy and latency. Panther Lake’s separate GPU still crosses a D2D link to reach DRAM, so its larger local caches also help contain package traffic. [1], [40] Smaller dies are less likely to contain a random fatal defect, and screening them before assembly prevents one bad tile from consuming a complete package of good silicon. Reuse also spreads design and qualification work across more products. Against those gains, Intel pays for the passive base, D2D circuits, extra bonding and test steps, and losses during assembly. Cost per working product across the portfolio captures the combined effect of wafer yield, reuse, test, and assembly. [29] Wildcat Lake packaging Intel launched Core Series 3, formerly Wildcat Lake, on 16 April 2026 for value mobile and edge systems. Wildcat Lake keeps 18A but removes the passive base and combines more functions on one die to simplify the package. The two products therefore reveal two distinct ways to commercialize the same leading-edge process. [41] Wildcat Lake’s 18A die combines up to two Cougar Cove P-cores, four Darkmont LP E-cores, two Xe3 cores and a smaller NPU. A separate platform-controller die supplies I/O, connected through UCIe, Intel’s first processor implementation of the standard. Consolidating graphics remove a tile boundary and the passive base, reducing assembly complexity for a modest-bandwidth value product. It also ties CPU and graphics scaling to the same die, giving up Panther Lake’s ability to swap in a much larger GPU. [42], [43] In July 2021, Intel CEO Pat Gelsinger set out an ambitious process roadmap aimed at regaining performance leadership by 2025, later described as five nodes in four years. Five years and one CEO later, Intel’s comeback story is not as unambiguously positive as Pat may have hoped. [44], [45] Intel once set the pace for process technology, bringing high-k metal gate technology and FinFETs into volume production years ahead of the rest of the industry. Its 22 nm FinFET process reached consumers with Ivy Bridge in 2012. [46] Intel’s integrated device manufacturing (IDM) model allowed its architects and process engineers to co-optimize products and processes. Starting with Sandy Bridge, Intel dominated x86, while AMD struggled with Bulldozer. That lead faltered at 14 nm and broke at 10 nm. Intel targeted a massive 2.7× density increase, but the node arrived years late and required several revisions before it could support Intel’s full lineup. This delay forced Intel to stretch 14 nm across six generations, while TSMC moved ahead in process technology and AMD recovered in x86. By 2019, Intel was still shipping 14 nm across most of its product stack, with its 10 nm client ramp focused on Ice Lake mobile processors. Meanwhile, TSMC was shipping N7 and N7+, and AMD’s Zen 2 compute chiplets used N7 to raise core counts and improve efficiency. Intel’s process failures were central to its decline, but unsound business decisions furthered their downward slide. Product delays compounded product mistakes, pushing client, server, and FPGA roadmaps off schedule. Several attempts to enter AI (Nervana and Gaudi) and networking (Tofino) also failed to establish lasting businesses. Intel’s recovery has focused on consumer CPUs and advanced packaging. Tiger Lake, Alder Lake, Lunar Lake and now Panther Lake have restored Intel’s consumer roadmap. On the process side, Intel 4 shipped with Meteor Lake, Intel 3 with Granite Rapids and Sierra Forest, and Intel 18A with Panther Lake. Intel has also made advanced packaging part of its foundry offering. However, Intel is still playing catch-up in servers. Several Xeon generations arrived years late and trailed contemporary AMD and Arm server CPUs in performance, efficiency, and core count. The process roadmap is back, but Intel does not hold the same process-technology leadership position it held prior to 10 nm. The introduction of gate-all-around nanosheets and backside power delivery are two of the biggest changes to transistor integration in a decade. Intel took on both changes at once: 18A paired its first RibbonFET with PowerVia in Panther Lake. Panther Lake is a substantial manufacturing milestone. Our cross-sections show how RibbonFET and PowerVia reshape local contacts and wiring, while the floorplans show where architectural consolidation and process choices save area. A sustained competitive lead depends on product performance, cost, yield, and the next implementation. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page.. 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A Juneau nonprofit received grant funding to create a childcare center for Bartlett Regional Hospital employees.
Is an Iowa-based dog business really going to take over the Bar K location in OKC?
Rumors circulated on social media on Friday morning about an Iowa-based business possibly taking over the Bar K location in downtown Oklahoma City.
St. Louis Cardinals vs Milwaukee Brewers Game Discussion Friday Night
The St. Louis Cardinals begin the final series of their season Friday night in Milwaukee as Michael McGreevy is the scheduled starter. The Brewers will send Robert Gasser to the mound. First pitch is scheduled for 6:40pm at American Family Field and the game broadcast will be handled by Cardinals.tv.
Jonathan Taylor ready to play in Week 3
Colts RB Jonathan Taylor not on injury report after a rest day earlier in the week
William Penn Foundation offers funding to keep Academy of Natural Sciences museum open
A Drexel spokesperson did not say whether the school had declined the offer, but said, “No proposal has been presented that would provide a permanent, sustainable path forward" for the museum.
NYC Health + Hospitals and DCAS Celebrate Completion of Major Energy Efficiency Projects at NYC Health + Hospitals/Queens And NYC Health + Hospitals/Coler
Today, NYC Health + Hospitals, the Department of Citywide Administrative Services (DCAS), and the New York Power Authority (NYPA) announced the completion
Massachusetts State Police Celebrate National Forensic Science Week
September 25, 2026MARLBOROUGH – Today, at the conclusion of National Forensic Science Week, the Massachusetts State Police celebrated the “topping off” of its new four-story Crime Lab. The event included state officials from the Division of Capital Asset Management and Maintenance (DCAMM), and the Executive Office of Public Safety and Security (EOPSS), as well as members of the project team from Greatland Realty Partners, Consigli Construction Co., Inc. and Ci Design, Inc. With the final structu
What to watch for when Arizona football visits Washington State
Though Arizona has already played a conference game, Saturday’s trip to Washington State feels like the end of the warmup portion of the 2026 season. Starting next week the rest of the opponents are in Big 12 play. The Wildcats (2-1) are seeking their fourth consecutive 3-1 start, which last happened during Rich Rodriguez’s first […]
Local Family Business Celebrates a Major Milestone - WHIZ - Fox 5 / Marquee Broadcasting
ZANESVILLE, Ohio – Four generations ago, the Rittberger family, began a retail butcher shop in the Zanesville City Market. 116-years-ago, they expanded that business into a wholesale operation based from their farm on Lutz Lane. “Carl Rittberger Sr. came from Germany in 1897, as a 16-year-old kid, with his family. And was trained in Germany in the meat trade. Came...
Pittsburgh Football Show, Episode 3, Sept. 25, 2026
Welcome to the show, Pittsburgh. I’m incredibly pleased to unveil The Pittsburgh Football Show, our new three-hour weekly broadcast that […]
Will ABC show Trump during Tennessee vs. Texas game amid media ban
ABC will broadcast Tennessee's game against Texas at noon ET on Sept. 26, a game President Donald Trump plans to attend. The matchup comes amid Trump's ongoing feud with several major media outlets.
MLB legend backs Vladimir Guerrero Jr. after podcast comments
An MLB legend is defending Toronto Blue Jays first baseman Vladimir Guerrero Jr. for his comments.
🚨 Turkey-France: Zidane’s first line-up is out!
Zizou’s first!This Friday evening at 8:45 p.m., the France team travels to Kocaeli to take on Turkey as part of Matchday 1 of the 2027 Nations League.A match naturally marked by Zinédine Zidane’s...
Former Sonics broadcaster Kevin Calabro to join Timberwolves
After decades in the Pacific Northwest, former SuperSonics and Trailblazers broadcaster Kevin Calabro has a new home.
Business leaders, policymakers to gather for Capitol Connections Breakfast
The Lansing Regional Chamber of Commerce held its Capitol Connections Breakfast Friday morning, bringing together business leaders to discuss politics, policy and the upcoming midterm elections.
Author Sarah Longwell says political character counts in ‘How to Eat an Elephant’
Is the idea of political virtue outdated? What do voters say when asked if character counts? That’s just one of the complicated topics Sarah Longwell, publisher of The Bulwark and host of The Focus Group Podcast, tackles in her new book, “How to Eat an Elephant: One Voter at a Time.”
Fox Sports Radio launches ‘College Football with Stugotz & The Bear’ podcast
Jon “Stugotz” Weiner has moved on from his “hurtful” split from The Dan Le Batard Show, formerly The Dan Le Batard Show with Stugotz, and he’s making good on his promise to “build a f*cking empire.” On Thursday, Fox Sports Radio announced College Football with Stugotz & The Bear, distributed by iHeartPodcasts and debuting Friday, Sept. 25.…
The Art of Releasing a Hit Streaming Series: 'Strictly Business'
It's a delicate art of timing the release of a hit streaming series, as examined by Luminate analysts on Variety's 'Strictly Business' podcast.
US core capital goods orders surge in August
New orders for key U.S.-manufactured capital goods increased more than expected in August and data for the prior month was revised sharply higher, pointing to another quarter of robust growth in business spending on equipment amid an artificial intelligence infrastructure buildout.
Can the Left Make America Fun Again?
Hi friends, I’ve got a piece in The New York Times today about how collective joy — participatory, youthful, anti-corporate — can defeat Trumpism and transform our lives. The basic argument is that politics used to be embedded in communal life: dances, sports leagues, union halls. As that infrastructure disappeared — and more of everyday life was atomized and privatized — politics became something broadcast at people rather than something they did together. NYC-DSA and Zohran provide another model, where socials and face-to-face organizing are tied to a fight vs the corporations that fenced off so much of the good life. Rebuilding that kind of collective fun, I argue, could help bring young people back into politics and, by redistributing America’s wealth, make everyday life more joyful. I would super appreciate it if you’d read the piece, share it, or post comments on it. Thank you! p.s. FYI, Opinion writers don’t get any say over their headlines! More Take action to support the fight of licensed deck officers at Alaska Tanker Company and Overseas Shipholding Group to win a first union contract. This is one of the most important, and underreported, unionization campaigns in America: these workers have a huge amount of power over domestic energy distribution and maritime supply chains, and they’re still without a contract two years after having voted overwhelmingly to unionize. Please sign the public petition here, and if you’re an academic you can sign this support letter.
Sports on TV/radio listings: Sept. 25
Where to watch and/or listen to today's sporting events that will be televised or broadcast on the radio.
Atalanta’s Charles De Ketelaere reveals PSG talks
Atalanta forward Charles De Ketelaere (25) has revealed that he held talks with Paris Saint-Germain this summer, before the reigning European champions ultimately set their sights on Spain’s Ferran ...
'I would encourage patience with Wirtz'
"Liverpool fans were naturally expecting the finished product to arrive and Florian Wirtz probably isn't that just yet," says Liverpool podcaster Josh Williams, who also admits the 23-year-old isn't living up to his £116m price tag. Wirtz has made 55 appearances for the Reds, scoring seven goals and contributing 11 assists, since penning a five-year deal to move to Anfield from Bayern Leverkusen in June 2025.
High school flag football: Wednesday and Thursday scores
CIF City Section and Southern Section high school girls' flag football scores for Wednesday and Thursday.
Brazil XI vs Australia – Predicted lineup and team news
Brazil is heading across the globe to face Australia on Friday at Queensland Country Bank Stadium, marking their first game since the World Cup.Brazil arrives in this new chapter keen to move on from ...
ACSH in the media: British Medical Journal, RealClearScience (and Health), plus more podcasts
From a weedkiller paper that cannot carry the weight of its headline to a PFAS rule that treats cookware like a biohazard, we've been busy. Here’s a look at some of our recent media appearances, including in the British Medical Journal (BMJ), RealClearHealth, RealClearScience, SacTown Talks and the Health Policy Podcast.
Darrell Waltrip’s Former Colleague Sends Well Wishes After Sad Health Update
Larry McReynolds, who once stood alongside Darrell Waltrip in the NASCAR on FOX broadcast booth for nearly two decades, is sending his former colleague well wishes after an unfortunate health update.On Wednesday, it was revealed that Waltrip has been diagnosed with Frontotemporal Degeneration (FTD) complicated by possible Chronic Traumatic Encephalopathy (CTE). Waltrip’s family believes it […] The post Darrell Waltrip’s Former Colleague Sends Well Wishes After Sad Health Update appeared first on
Preseason Gamethread: Penguins @ Blue Jackets
Talk about the preseason game with Pens fans here! It doesn’t look like this game will be broadcast for TV/streaming at all. It will be available via audio on the internet/radio from 105.9 The X.
Interactive sports exhibit set to open at Buffalo Museum of Science
The new $3 million exhibit at the Buffalo Museum of Science includes a new sports simulator, an anchor desk that allows visitors to record their own highlight reel as a broadcaster, a sports medicine lab, and a mascot design studio.
Lucas Bergvall Addresses Tottenham Exit Speculation After Signing New Contract
Lucas Bergvall has explained his decision to renew with Tottenham, addressing summer transfer speculation and his talks with the club over his future.
Josh McDaniels preaches patience with Patriots offense
New England has scored just two offensive touchdowns in its first two games.
ROCKET FUEL FOR STORMS: THE SCIENCE BEHIND EL NINO
Hurricane Polo weakened to a strong Category 4 off Mexico’s Pacific coast after undergoing extreme rapid intensification and hitting rare Category 5 status on Tuesday. Its rapid growth was due
3 things to watch for as Indiana football hosts Northwestern
Indiana starts Big Ten play on Friday night with a home game against the 2-0 Northwestern Wildcats.
Business Loop 70 in Columbia set to close under I-70 Thursday night
Business Loop 70 will close under Interstate 70 in Columbia overnight on Thursday for crews to remove signs on the bridge.
Ravens Offensive Line is Producing Troubling Stats Early On
Baltimore Ravens quarterback Lamar Jackson is one of the quarterbacks who have faced the highest pressure from defenses.
VIDEO: How the Packers came back on the Jets
The Jets fell to 1-1 in Week 2 as the Green Bay Packers rallied from 10 points down in the fourth quarter to force overtime. The Packers were able to outplay the Jets in all three phases of the game in the final 10 minutes of regulation and overtime. Blame for the loss does not […]
I hope to one day have a partnership. I definitely …
I hope to one day have a partnership. I definitely …
AI is impacting local kids’ mental health: How can we keep them safe?
Editor’s note: This story contains mentions of suicide and self-harm. If you or someone you know needs help, call, text, or chat the 988 Lifeline.
NAB Show New York 2026 Brings Media’s Biggest Business and Technology Shifts to the Stage Oct. 21-22
More than 150 speakers to explore the business and technology shaping broadcast, creators, sports, streaming and the future of media.
Lamar Jackson Stat a Warning for Giants, Jameis Winston
A worrying stat from head coach John Harbaugh's history with Lamar Jackson should worry the New York Giants about backup QB Jameis Winston. The post Lamar Jackson Stat a Warning for Giants, Jameis Winston appeared first on HEAVY.
Farquhar hints 2027 could be his final chapter in sport
Ryan Farquhar hints that 2027 could be the final chapter for him in the sport - as the road racing legend reflects on crashes and family sacrifices on the BBC Bikes Podcast.
Falcons Roundtable: Can Michael Penix Save Atlanta's Offense Against Packers?
The Atlanta Falcons face the Green Bay Packers on Thursday Night Football as Michael Penix Jr. returns from his ACL injury. Our Falcons Roundtable breaks down Atlanta's 0-2 start, Penix's expectations, Green Bay's weaknesses, bold predictions and Week 3 score picks.
“Sopranos” writer and “Age of Disclosure ”director to adapt bombshell memoir from ‘real-life Agent Mulder’
Emmy winner Terence Winter tells EW the series answers “whether we are the only intelligent life in the universe.”
Denver Broncos look to continue success vs. NFC opponents
In the last nine games against NFC teams, the Broncos are 9-0. All streaks end. When will this one?
East Tennessee sports announcer dies in head-on crash
Longtime East Tennessee sports broadcaster and youth coach Aaron Harvey has died following a two-vehicle head-on crash on Ruritan Road in Roane County.
Tucker Carlson has a new enemy: the politics he helped build
Tucker Carlson is talking about what happened behind closed doors in his very public break with President Trump over the war with Iran.He recounts an Oval Office meeting, before the conflict began, when Carlson says he warned Trump that he was allowing the U.S. to be led to war by Israel. “Yes, you’re right,” Carlson claims Trump admitted. “But in the end we all die anyway, so it doesn’t matter.” "And I was shocked by that, because it's nihilism,” he says. “That's the last thing any leader should display.”In response to a request for comment from NPR, the White House did not address that point specifically, instead sending along a social media post by the president that describes Carlson and others as “stupid people” who want Iran to have a nuclear weapon.In this episode of NPR’s Newsmakers, Carlson and host Steve Inskeep unpack the conservative commentator’s split with Trump and the MAGA movement. They also get into faith, money, political power, and why Carlson believes both major parties have failed Americans.Newsmakers is where you'll find NPR's biggest interviews. We post new episodes as soon as they're available -- any day of the week. Follow or subscribe on Spotify, YouTube, or wherever you watch or listen to podcasts to get new episodes as soon as possible. You can also find Newsmakers on the NPR app. Newsmakers relies on supporters who value independent journalism and a free press. Join NPR+ today to support our work and get perks from the podcasts you trust. Go to plus.npr.org.