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How good (or bad) can it get? The best- and worst-case scenarios for every NFL team in 2026
Can the Cowboys finally break through? Will Patrick Mahomes regain his MVP form? Here are the dream and nightmare outcomes for your favorite team this fall
Lenhart: A meaningful life is more important than politics
I am not generally prone to hero worship. I have seen too many supposedly great men humbled or shamed to fall prey to that impulse.
French Quarter businesses face storm and flood project disruptions
Businesses on Decatur Street in the French Quarter are preparing for heavy rainfall from Invest 90L while dealing with challenges from a flood control project.
Mood darkens among German auto suppliers as investment, hiring fall, survey shows
German automotive suppliers expecting business conditions to worsen over the next year now outnumber the industry's optimists, a survey showed on Wednesday, as domestic hiring sinks to a new low and investment in the sector moves overseas.
Abby Phillip on suggestions Vance being an Iran fall guy: ‘where you at Marco Rubio?’
Golden Knights’ Mitch Marner opens up about mental health: ‘Some really dark moments’
After the best playoff performance of his career and falling just short of a title, Marner used his platform to discuss mental health.
NBC's 2026 fall TV schedule includes 4 new shows, 9 cancellations
NBC is shaking things up for its fall 2026 lineup.
Merchants of Doubt and the attacks on Extreme Event Attribution science
Last week, I attended a meeting at Columbia University on attribution science and climate law, hosted by the Sabin Center. It was a fantastic event, bringing together scientists and legal experts working at the intersection of extreme event attribution and climate law. Subscribe For those unfamiliar with it, extreme event attribution attempts to quantify the contribution of climate change to an extreme event. For example, several groups analyzed the impact of climate change on Hurricane Harvey’s enormous rainfall totals over Houston, Texas and they found that climate change increased rainfall by 15 to 38%. One thing that came up again and again was how terrified fossil-fuel interests are of extreme event attribution science. They are acutely aware that this research could land them in court. And losing those cases would leave them legally liable for billions of dollars in climate damages. Because the legal stakes are so high, the blowback has turned ugly. I spoke with several scientists at the meeting who are facing ongoing harassment over their work. This blowback is a coordinated campaign to make the entire field look suspect. The goal is to create the impression that attribution science is too uncertain, too political, or too conflicted to be useful in court or in public policy. The strategy is not based on actual science or evidence of misconduct, but on the generation of doubt. The new Merchants of Doubt We’ve seen this before. In fact, not that long ago: We only have to go back a year to the Department of Energy (DOE) Climate Working Group (CWG) report to see an example of using doubt as the tool to push back against well-established science. This strategy is laid out in an email from a member of the CWG, Dr. Roy Spencer, that was released during litigation over the Climate Working Group process. The key quote is: About all I can hope is that what we write will provide sufficient “reasonable scientific doubt” regarding the science claims in the 2009 TSD [technical support document], based upon almost 2 decades of new science, to call into question the original reasoning for the EPA Administrator’s decision that CO2 presents a threat to human health and welfare. This statement is strong evidence that at least some members of the committee were working to support a particular policy outcome: revoking the Endangerment Finding. The email also explains how they planned to do it: by attempting to generate “reasonable doubt”. This is going to be hard, Spencer implies. Despite falsely claiming that “2 decades of new science” weakens the case, Spencer explicitly acknowledges that the actual peer-reviewed science of climate change overwhelmingly rejects his position: But if the science argument is decided upon by a vote, or by the number of published citations, we lose the science argument. We can go back even further: This CWG email shares unmistakable DNA with the infamous 1969 tobacco memo that declared: “Doubt is our product, since it is the best means of competing with the ‘body of fact’ that exists in the mind of the general public. It is also the means of establishing a controversy.” The tobacco memo also acknowledges the limit of this strategy: Like the CWG, they knew the science was not on their side. Share The new new Merchants of Doubt The people attacking the IPCC chapter on extreme event attribution are the newest iteration of the Merchants of Doubt. Their goal, like all Merchants before them, is to introduce doubt into the process. Because the report is not even out yet, they cannot attack its conclusions. So they are attacking the authors instead. Here is a press release from the House Science, Space, and Technology Committee: In the letter, the Chairmen express concerns about potential conflicts of interest involving members of the Attribution Committee, stating that “publicly available information suggests a troubling pattern” in which committee members are affiliated with nonprofits that support climate accountability lawsuits, “raising the appearance of impropriety and member bias.” To be clear, this is just innuendo. There is no actual evidence of bias. And given the robust process that these reports go through, including multiple lines of peer review, it seems very unlikely that significant bias can survive into the report. When the report comes out, critics will have the opportunity to make legitimate criticisms of the report — if any exist. If none do, however, they’ll still make criticisms, but they’ll be bogus, simply designed to generate doubt. We’ll see. A note to the press: Fix your frame To any journalists reading this: The public debate over extreme event attribution science is not going away. The science is simply too dangerous to fossil-fuel interests for them to stop fighting it. You very well might be assigned to write an article about this area of research in the future. When you do, do not automatically adopt the framing that climate misinformers want you to use. They want you to frame the story around questions like: Are climate scientists trying to put their thumb on the scale to achieve a predetermined, politically motivated result? Are climate scientists improperly letting their politics invade the science of the IPCC? That frame is a trap. Instead, you need to view this through the historical lens of the Merchants of Doubt. How does the ecosystem of doubt operate? Who funds it? What methods do they use to misrepresent science and slime researchers? What scientific results are they trying to keep people from understanding are legitimate? Ultimately, you instead need to focus your article on the generation of doubt as a way to maintain the fossil fuel industry’s social and legal license to keep burning oil, gas, and coal. If you treat the misinformers’ frame as a legitimate, good-faith scientific critique, you are helping them produce doubt. Don’t do it. Don’t be a Merchant of Doubt. Thanks for reading The Climate Brink! Subscribe for free to receive new posts and support our work. Subscribe other stuff The Staying Curious Substack has an interesting post about the different flavors of climate sensitivity. This is crucial information if you want to understand how scientists think about how much warming the Earth will experience. I’d be grateful if you could hit the like button ❤️ below! It helps more people discover these ideas and lets me know what’s connecting with readers.
Microsoft's cloud infrastructure talks with Oracle collapse, Business Insider reports
June 16 (Reuters) - Microsoft's discussions with Oracle regarding a cloud infrastructure leasing deal, potentially valued at more than $3 billion, have fallen apart due to security and compliance
Microsoft's cloud infrastructure talks with Oracle collapse, Business Insider reports
Microsoft's discussions with Oracle regarding a cloud infrastructure leasing deal, potentially valued at more than $3 billion, have fallen apart due to security and compliance concerns, Business Insider reported on Tuesday.
In Michigan visit, RFK Jr. hammers processed foods
Kennedy spoke at an event with U.S. Rep. Tom Barrett, a Charlotte Republican who faces a reelection campaign expected to be competitive this fall.
2027 NFL Draft Summer Scouting Report: Braelin Moore, C, LSU
Braelin Moore is a reliable center and piece on the LSU offensive line heading into the Fall.
Siri AI hints at new iPhone 18 Pro design change
Siri AI is available in the iOS 27 beta, featuring a not-so-subtle hint about a design change that’s rumored for this fall’s iPhone 18 Pro.
The Google / Xreal Aura XR glasses are now available to preorder
You can reserve them for $99, with a full launch expected this fall.
Qualcomm Announces Snapdragon Reality Elite, Its New Flagship XR Chipset
Qualcomm just announced Snapdragon Reality Elite, its new flagship XR chipset, and it will debut in the compute puck of Xreal's Aura Android XR device this fall.
Snap’s first consumer AR glasses are coming this fall for $2,195
Snap is finally launching augmented glasses for the public
Snap Opens Preorders For Specs, True AR Glasses Shipping This Fall For $2195
Snap just officially revealed and opened preorders for Specs, fully standalone true AR glasses shipping this fall in the US, UK, and France for $2195.
Rhode Island health leaders recommend avoiding contact with Watchaug Pond in Charlestown
NBC 10 WJAR is the news, sports and weather leader for Providence, Rhode Island and surrounding communities, including Cranston, Pawtucket, Woonsocket, Warwick, Newport, Bristol and Narragansett, Rhode Island and Attleboro, North Attleborough, Swansea, Fall River, Taunton and New Bedford, Massachusetts.
Business seeks help finding 2 accused of stealing inflatable from Providence yard
NBC 10 WJAR is the news, sports and weather leader for Providence, Rhode Island and surrounding communities, including Cranston, Pawtucket, Woonsocket, Warwick, Newport, Bristol and Narragansett, Rhode Island and Attleboro, North Attleborough, Swansea, Fall River, Taunton and New Bedford, Massachusetts.
Q&A: Term-limited Sioux Falls mayor reflects on Republican fractures, conflict with legislators
TenHaken became emotional Monday while reflecting on positive relationships with city leaders and his staff’s accomplishments.
Steelers great Ben Roethlisberger says Ravens are 'falling apart' and Super Bowl window 'has closed'
The former Steelers QB is clearly not a fan of Baltimore's offseason moves
Berkley and Royal Oak Students Studying Science Earn DAR Scholarships
Two high school seniors will go to the University of Michigan in the fall with scientific publishing credits already on their resumes.
Summit League expands partnerships with CBS Sports and Midco Sports
SIOUX FALLS, S.D. – The Summit League announced expansions of its media rights agreements with CBS Sports and Midco Sports Tuesday that will keep both partners at the center of distributing the conference’s national linear and digital network content.
Siri AI in iOS 27: Features, Requirements, and How It Works
The biggest change in iOS 27 is Apple's total overhaul of Siri, with Siri turning into Siri AI. Apple delivered on the features originally promised at WWDC 2024 and added new capabilities that turn Siri into a viable competitor to chatbots like Claude and ChatGPT. Siri AI is available in the iOS 27 beta, but everyone will get access this fall. Below, we walk through everything new you can expect from Siri.
Bronzeville Businesses Still Cleaning Up After Violent Storms, Water Main Break
BRONZEVILLE— Multiple Bronzeville businesses are still cleaning up from a series of severe storms last week, with fallout including a busted water main
Dave & Buster's Entertainment Inc. (PLAY) Stock Falls on Q1 2026 Earnings
Dave & Buster's Entertainment Inc. (PLAY) reported first-quarter 2026 results with total revenue of $559.2 million, a 1.5% decline year-over-year, and gross profit of $479.4 million, down 1.3% versus the prior year.Total revenue: $559.2 million (-1.5% YoY)Gross profit: $479.4 million (-1.3% YoY)Operating profit: $46.9 million (-25.8% YoY)Net income attributable to common shareholders: $5.7 million (-73.7% YoY)Diluted earnings per share: $0.16 (-7
Dial in for a day to support business founders, celebrate big Startup Sioux Falls win
Sioux Falls won a big startup competition -- and now it's time to celebrate, with a day for founders and fun coming up this month.
Black Watch to bring watch shop, speakeasy-style bar downtown
The newest addition to Phillips Avenue opens this week -- bringing a concept unlike any seen downtown before.
Atacama Desert’s center dried out 20 million years earlier than previously thought
Chile's Atacama Desert, which gets less than 5 millimeters (0.2 inches) of rainfall each year, started to form more than 40 million years ago — 20 million years before the Andes.
Left-wing distraction of Trump's UFC event falls flat as bitter celebrities mocked online
Celebrities including Bette Midler and Robert De Niro faced widespread online mockery for their anti-Trump concert meant to counter-program his UFC event.
No iPhone 18 This Year, Apple Supplier Comments Seemingly Confirm
Apple's standard iPhone 18 model will launch in early 2027, based on comments from a partner in the company's supply chain that appear to corroborate rumors of a delayed spring release for the base model. Apple typically works on an annual smartphone launch cycle where it releases the entirety of its latest flagship iPhone series in the fall, usually around mid-September. That appears set to change this year, however.
Microsoft weighs an Xbox spinoff. Would it revive the business or put it at risk?
With hardware sales falling and costs rising, a comeback would be anything but guaranteed.
Gas prices fall below $4 national average for first time since April
Gas prices have fallen 9.3 cents over the past week, according to GasBuddy.com
Fantasy Baseball Rest-of-Season Rankings: Scott Pianowski's updated risers and fallers as of June 15
Wichita Falls board to tackle business prospects behind closed doors
The Wichita Falls Economic Development Corporation meets Thursday to discuss property deals and business incentives in private.
Jim Acosta ruthlessly mocked for comparing removal of Trump’s name from Kennedy Center to fall of Berlin Wall
Jim Acosta live-streamed for nearly 11 hours awaiting the removal of Trump's name from the Kennedy Center, then compared it to the Berlin Wall falling.
If You're Itching for a Gothic Action RPG, Mistfall Hunter's Free Open Beta Is Now Live on PS5
Mistfell for it
This strange material can become strong or fall apart in seconds
Scientists have found that staple-shaped particles can tangle together to create a material that is both strong and flexible. Unlike conventional materials, these particles can be locked into a sturdy structure or rapidly unraveled using vibrations. The unusual behavior could open the door to recyclable buildings, reconfigurable structures, and even futuristic robotic technologies.
Millions take calcium and vitamin D for stronger bones. A major review finds little benefit
For years, calcium and vitamin D supplements have been promoted as a simple way for older adults to protect their bones and prevent falls. But a massive review of nearly 154,000 people found that calcium, vitamin D, or a combination of both provided little to no meaningful protection against fractures or falls for most older adults.
Report: Microsoft weighing up spinning off Xbox
Company management has reportedly approved a plan by new CEO Asha Sharma to increase spending on Halo, Fallout and The Elder Scrolls to speed up development, to
What your heart rate variability really says about you
Here’s what HRV is, how it works and what can cause it to rise or fall.
Dodgers' Emmet Sheehan: Falls apart late vs. ChiSox
Dodgers' Emmet Sheehan: Falls apart late vs. ChiSox
Oil price falls to three-month low and markets rally after US-Iran peace deal
Rolling coverage of the latest economic and financial news
West Virginia Falls Short Against North Carolina
The Mountaineers battled but come up short againt the Tarheels
Oil prices fall on US-Iran agreement
Oil prices dropped on Sunday after President Donald Trump said an agreement with Iran had been reached and the United States would end its naval blockade on the country.
Is SMIC N+3’s Metal Pitch Smaller than Intel 18A’s?
Almost four years ago, we published that SMIC had started shipping 7 nm (N+1) chips. Now, SMIC is shipping its third-generation 7 nm (N+3) process in Huawei’s Kirin 9030, with a minimum metal pitch of 32.5 nm, about 10% tighter than the 36 nm minimum metal pitch shipping in Intel’s latest Panther Lake CPUs on 18A. The headline is true, but incomplete cherry picked metric. N+3 reaches the density of TSMC N6 through aggressive DUV multi-patterning and design-technology co-optimization (DTCO), but it pays for that in complexity, efficiency and process control. We found this and more in our reverse engineering and teardown where we cover SMIC’s N3 process technology, Huawei’s packaging, memory, architecture, and more. SemiAnalysis has been building a state-of-the-art teardown lab in Oregon capable of analyzing the world’s most advanced and important chips over the last year and half. We have already generated revenue on advanced datacenter chip teardowns including our recent reverse engineering of a major TSMC customer’s COUPE CPO optical engine + EIC 3D stack. This is the first public report from the SemiAnalysis Teardown Engineering & Evaluation Lab, or STEEL for short. The lab is aggressively scaling up and out and we’re excited to announce it publicly. This is a bit of inconvenient timing for TechInsights as they are private equity owned and currently being sold while having enjoyed virtually no credible competition for decades. This has led to TechInsights underinvesting in CAPEX. SemiAnalysis exceeds TechInsights in revenue despite no venture or private equity ownership and being founded only 6 years ago. Because we have no external investors and are founder led, we move faster, build faster, and we can release client chip teardowns for free regularly, while focusing on datacenter for our major clients. Here’s the first public image from our lab, the HiSilicon Kirin 9030 Pro SoC: This report will detail our teardown of the Kirin 9030 and our findings on SMIC’s N+3 process, the most advanced in China. For comparison, we’ll show our teardown of the MediaTek Helio G99, made on TSMC N6. Through this comparison, we can look at the effect of export controls – SMIC N+3 and TSMC N6 are comparable nodes, but one is heavily export-controlled, the other free to use the West’s most advanced equipment. Here we see both China’s progress and constraints. SMIC N+3 reaches TSMC N6-class logic density, but it requires far more aggressive DUV multi-patterning, so it does not match N6 on process maturity or cost. The Kirin 9030 Pro performs similarly to three-year-old Android flagships, and trails far behind the current flagship SoCs from Apple, Qualcomm, MediaTek, and Samsung. The efficiency gap is even wider. Export controls have not stopped Huawei and SMIC from shipping advanced silicon, but they have forced a different path. Without EUV, SMIC is leaning harder on DUV multi-patterning, DTCO, and increasingly complex integration. The roadmap continues forward through tighter design rules and backside power, but each step adds cost and process risk. Huawei’s τ scaling and LogicFolding show another path: stacking active logic and recovering density through advanced packaging and system-technology co-optimization (STCO). To understand the Kirin 9030, we must first understand Huawei’s SoC history. HiSilicon is Huawei’s chip design arm, responsible for the Kirin smartphone SoCs, Kunpeng server CPUs, Ascend AI accelerators, and switch/router networking silicon. Before export controls, Huawei was TSMC’s largest customer – the only customer on TSMC’s first EUV node, N7+, and among the first on N5, alongside Apple. That ended in late 2020. Huawei switched to Qualcomm SoCs in its flagship smartphones, though export controls limited them to 4G-only variants. In late 2023, Huawei returned to in-house silicon with the Kirin 9000s, a successor to the Kirin 9000, fabricated on SMIC N+2 instead of TSMC N5. In the following years, they released the Kirin 9010 and 9020 on the same N+2 process. These chips used Huawei’s in-house TaiShan CPU cores and Maleoon GPU. We have not torn down a Kirin 9020 ourselves, so the predecessor die shot is from Kurnal. The die shots show how Huawei spent its silicon budget: which functional blocks are where, and how their areas compare to the predecessor. First, a quick guide to the major blocks on the die. The total die area is nearly identical, but the 9030 uses that area more aggressively. A denser process lets Huawei fit an extra middle CPU core, more GPU and NPU cores, and larger caches into the same footprint. In contrast, the Helio G99 is a much smaller, low-cost SoC, built for budget smartphones rather than a flagship device. While the Kirin 9030 is ~140 mm², the G99 is only ~29 mm², roughly one-fifth the area. The underlying TSMC process technology, however, is directly comparable as a baseline for analyzing SMIC’s. The Kirin 9030 is an evolutionary refresh, not a clean-sheet design. Its CPU, GPU and NPU cores carry over the 9020’s families, and the gains come from three levers: the SMIC N+2-to-N+3 process step, DTCO and floorplan work, and incremental microarchitecture. Area is where the first two show up, and the 9030 scales well here. Performance and efficiency are the harder test. Huawei’s design holds up better than its node would suggest, but the chip still trails, both because N+3 sits behind the leading-edge nodes and because its cores, while competent, remain a few generations behind the newest designs. The new prime core is an incremental update. The main changes are a 10% frequency increase from 2.5 GHz to 2.75 GHz and a doubling in the L2 cache from 1 MiB to 2 MiB. Despite the increased cache, the core size decreased by 7.6%. Excluding the private L2 cache, the core size decreased by 21%. This is a large reduction for an incremental node. Compared with the TaiShan New V120 core in the Kirin 9020, the Kirin 9030’s middle core is almost unchanged architecturally, yet each core shrinks by ~22%. Most of that comes from the move from N+2 to N+3, with layout likely accounting for the rest. Visually, the most noticeable change is the increase from 3 middle cores to 4. There is also a 20% increase in the shared L3 cache of the big cluster. This helps to improve multi-core performance without sacrificing much in terms of area. Even with each core shrinking, the big CPU cluster’s total area is essentially unchanged. The per-core savings went back into an additional middle core and larger caches. The tiny cores shrank less than the prime core (excluding its L2 cache) and less than the middle cores. This is likely because fixed overhead is a larger share on a small core. We cannot resolve any architectural changes from the die shot alone, but the per-clock and efficiency gains shown below point to more than pure process and layout scaling. The area reduction was offset by a doubling of the shared L2 cache from 2 MiB to 4 MiB, leaving the total tiny CPU cluster area slightly larger. Area is the easiest improvement to see from a die shot, but it is only one part of PPA (power, performance, area). For modern logic, power and performance matter just as much, and often more. Since Dennard scaling broke down in the mid-2000s, voltage and frequency have not scaled in step with transistor dimensions, so each node has had to fight harder for gains in performance and efficiency. The starkest comparison is not Kirin 9020 versus Kirin 9030 Pro. Apple’s efficiency cores run circles around Huawei’s prime core. Apple’s low-power core delivers 20% higher integer performance while drawing only 1 W, compared with 4.5 W for Huawei’s prime core. N+3 matches TSMC N6, but N6 is several generations old. Apple and Qualcomm build on N4 and N3P, which are denser and sit on a better voltage-frequency curve, giving them a larger transistor budget and more performance per watt. The 9030’s own cores did improve. The middle and tiny cores gained 17% and 14% in per-clock integer performance over the 9020, with floating-point flat on the middle core and up 11% on the tiny. The tiny core improves cleanly, with performance rising while power falls and efficiency increases by 45% in integer and 24% in floating point. The middle core is mixed: integer performance rises but power rises faster, cutting integer efficiency by 7%, while lower power lifts floating-point efficiency 16%. Per-clock gains at the same or lower frequency are microarchitectural, so the cores are tuned, not just shrunk. Both also failed to hold their rated maximum frequencies, pointing to thermal, power, or stability limits. Per clock, the middle core sits around Arm Cortex-A720 and the tiny core near the Cortex-A520; absolute performance trails because Huawei clocks them much lower. The prime core is roughly Cortex-X2 class per clock, a 2021 design. Apple’s 2020 M1 Firestorm core is still 35% higher per clock and 57% faster in absolute integer performance at a similar 4.5 W. The current leading edge is further ahead again: the Apple M5 P-core is 60% higher per clock and 2.7× faster, the Arm C1 Ultra 45% higher and 2× faster. Matching older high-end cores per clock is a genuine design achievement. What Huawei cannot match is the voltage-frequency curve and transistor budget of leading-edge nodes, which let Apple, Qualcomm and others spend more transistors in the same area on wider cores, larger caches and deeper buffers while running at lower voltage. Huawei’s LogicFolding roadmap is one answer, stacking active logic to recover density and shorten signal paths. We return to it later. The GPU compute units (CUs) changed more visibly than the CPU cores, moving to a more rectangular layout for both the arithmetic logic unit (ALU) clusters and the CU overall. Even with ray-tracing support added, a CU shrank ~28%. However, that shrink is offset by the increase from 4 to 6 CUs and the area outside the CUs grew 33%. Overall, the GPU cluster is larger by ~10%. The GPU is where Huawei makes its biggest gains. The Maleoon 935 is not competitive with current flagships, but it is a large step up from the 920 and reaches older-flagship territory. In 3DMark it is 70% faster in Wild Life Extreme (WLE) and 79% faster in Steel Nomad Light (SNL) than the 920; with 11% higher clocks and 50% more CUs, the ~67% theoretical uplift roughly matches WLE and is beaten by SNL. It edges ahead of the Snapdragon 8+ Gen 1 in WLE and SNL, and the Dimensity 9200 and Apple A16 in WLE, but stays far behind newer parts: the Snapdragon 8 Elite Gen 5 and Dimensity 9500 are ~2.4–2.6× faster in WLE and ~3.2× faster in SNL. The Maleoon 935 is Huawei’s first GPU with hardware-accelerated ray tracing; there it lands slightly ahead of the Exynos 2200, and on par with the Apple A16, with current flagships up to 3.7× faster. The Neural Processing Unit (NPU) saw the largest structural changes of any block, moving from a Lite and a Tiny core in the Kirin 9020 to a Lite and two Tiny cores in the Kirin 9030. Both core types also show significant layout changes. This is a reversal in Huawei’s NPU design. The Kirin 9000 5G, its last flagship chip on TSMC N5, used two Lite and one Tiny core. The series of SoCs on SMIC N+2 moved to one Lite and one Tiny core, likely for area savings. With the Kirin 9030, Huawei has shifted back toward a larger multi-core NPU cluster, but with the additional area going to a Tiny core rather than a Lite core. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Before diving into the process stack, the package and memory are worth separating from the SoC itself. The Pro variant of the Kirin 9030 carries 12 GB of Samsung DRAM, with two stacks of four dies each. The dies were identified as the K4L2E165YD, a 12 Gb LPDDR5X-9600 device fabricated on Samsung’s 1a node, the fourth generation of its 10 nm-class DRAM after 1x, 1y and 1z. 1a has shipped in volume since 2022, so this is current memory rather than older-node inventory. The 16 GB Pro Max variants we obtained were found with both CXMT and Samsung packages. The CXMT package is marked CXDD7JEDM, with two stacks of four dies, packaged in week 45 of 2025. The inferred die dimensions from X-ray computed tomography (CT) are consistent with a known density of ~0.3 Gib/mm² for the CXMT G4 process, roughly equivalent to other manufacturers’ 1z processes. The Kirin 9030 uses a typical integrated package-on-package (iPoP) stack: multiple DRAM dies in a memory package sit above an organic redistribution layer (RDL) interposer, which sits above the SoC and package substrate. The full package is then mounted to the printed circuit board (PCB) through ball-grid array (BGA) solder bumps. The memory package substrate is a thin bismaleimide-triazine (BT) laminate carrying the LPDDR5X stack. The organic RDL interposer over the SoC routes the PoP signals around the die and carries possible dummy thermal copper pillars. The package substrate, a thicker Ajinomoto Build-up Film (ABF) build-up over a BT core, fans the flip-chip bumps out to BGA pitch and embeds the power planes. The whole stack is organic. The only silicon is the SoC and the LPDDR5X dies; there is no silicon interposer. Keeping it all-organic brings the package’s coefficient of thermal expansion (CTE) close to the PCB’s, reducing board-level warpage, and avoids the cost of a silicon interposer the SoC’s bandwidth does not need. In an iPoP stack, the memory package connects to the organic RDL interposer through an array of solder bumps. Underfill fills the gap around those bumps, adding stiffness and protecting the joints from mechanical stress. The Pro and Pro Max variants differ here, which we cover behind the paywall. The die shot and architecture tell us how Huawei allocated its silicon budget. The process tells us what SMIC can manufacture. We use the Helio G99 as the process reference for TSMC N6. Both SMIC N+3 and TSMC N6 are evolutions of previous 7 nm-class nodes. We used targeted TEM cross-sections through logic and memory regions, imaged in both fin-cut and gate-cut directions. Each cross-section caption gives its horizontal field width (HFW), the real width of the imaged area. We start at the transistor fins, then move up through standard cells, local interconnect, and SRAM. SMIC has not overtaken Intel or TSMC. It uses aggressive DUV scaling and DTCO to reach N6-class density, but that density doesn’t translate into comparable performance and efficiency, for two reasons: the node gap to leading-edge nodes, and Huawei’s core designs. Fin Profile One of the most important knobs in a FinFET process is the fin profile: the shape of an individual fin and the channel where current passes from source to drain. The ideal fin is tall, narrow, and nearly vertical. A taller fin increases effective channel width, while a narrower fin improves electrostatic control by thinning the body the gate must control. Push either too far, and the process pays for it: weaker drive current, fragile fins, taper, footing and line-edge variation that hit yield and device variability. The Intel 22 nm, 14 nm, and 10 nm fin cross-sections show how FinFET nodes have improved over time. 22 nm fins were a first-generation structure, relatively short, wide and strongly tapered. The shape limits current density and reduces gate control uniformity across the height of the fin. At 14 nm and 10 nm, Intel pushed the fins taller and narrower while also making the sidewalls more vertical. Rather than shrinking the device, these changes increase the effective channel width per fin and improve electrostatic control. The trade-off is that taller fins at tighter pitches are much more difficult to manufacture. Now, let’s compare the Helio G99 on TSMC N6 with the Kirin 9030 on SMIC N+3. Both processes are in the same class, with fin pitch of 30-32 nm on N+3 and 34 nm in our N6 cross-section. The pitch for N6 is especially interesting as N7’s HD library is generally listed with a 33 nm fin pitch, and N6 did not shrink pitches directly. Its density gains came from DTCO instead of tighter pitches. The 34 nm pitch was stable across our sampled region and serves more as a comparison against the SMIC N+3 we have not investigated further. Pinning down N+3’s fin patterning scheme takes more than one core unit. The CPU cores show a dense ~32 nm pitch, with the pitch between N-P fin pairs alternating between 78 and 88 nm. Logic alone may be consistent with dual-pitch mandrels of 120 and 110 nm, but this is a complex and unusual approach. Combining the pitch from the the 8T SRAM, which has more complex repeat unit, with the CPU core sequence allows us to reverse engineer the patterning steps with more confidence. As both the logic and SRAM should share the same base grid, a single CD mandrel lithography pattern with 128 nm pitch undergoing SAQP produces a die-wide ~32 nm grid (128 nm/4), which supports the pitch sequencing seen in both logic and SRAM cells. In the sampled cross-sections, N+3 shows a taller, narrower, higher-aspect-ratio fin than N6. The measured fin aspect ratio is ~9.5:1 on N+3 versus 7.8:1 on N6. N+3 also shows less top rounding, with an estimated radius of ~2 nm, compared with 2.8 nm on N6. Even though the fin widths differ, the ratio of top rounding to fin width tells the same story, with N+3 at 0.37 and N6 at 0.44. In a geometric sense, lower is better; a perfectly rectangular fin would have no top-rounding penalty. These are single-digit-nanometer features measured from a handful of cuts, so treat the absolute numbers as approximate. The important result is the relative gap: N+3’s fins are consistently taller, narrower and less rounded than N6’s. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Standard Cell A standard cell is the basic building block of chip layout: a fixed-height row pairing one NMOS and one PMOS transistor that share a gate, tiled in a grid to build logic blocks. The key dimensions are contacted gate pitch (CGP), cell height (CH), fin count, and the lower-metal routing grid. To measure density, we use the Bohr metric: a weighted average of NAND2 gate area (60%) and scan flip-flop area (40%). This represents a realistic mix of combinational and sequential logic. This metric has its limitations, especially for complex cell layouts like TSMC’s FinFLEX, which alternates cells with different fin counts. Even so, it is the best metric for a pure process-level comparison. Another important measurement is the fin pitch; it refers to the distance between two fins of the same transistor. In a FinFET process, multiple fins are used in each transistor to increase the drive current and thus performance. TSMC N6 ships both a high-density (HD) library with 2 PMOS and 2 NMOS fins per cell, and a high-performance (HP) library with 3 of each. More fins under the shared gate mean more effective channel width. HP cells switch harder at the cost of area. Designers mix the two on a die, primarily spending HP cells on timing-critical paths, and matching their PPA targets. In the Cortex-A55 core of the Helio G99, we found a cell height of 240 nm for the HD cell. MediaTek has used HD cells in the G99 to minimize die size and thus cost. As an SoC for budget smartphones at ~$100, this is essential. By contrast, we found only one library in the Kirin 9030, with 2 NMOS and 2 PMOS fins. This suggests a narrower library strategy than TSMC N6, where both HD and HP libraries are widely used. This likely reflects the smaller customer base and the more constrained domestic design and electronic design automation (EDA) ecosystem. In all three CPU cores of the Kirin 9030, we found cell heights of 228 nm, 5% smaller than on N6. This is also a reduction of 9.5% over SMIC N+2’s cell height of 252 nm. SMIC N+3 and TSMC N6’s HD library both feature a CGP of 57 nm. For SMIC, this is a 9.5% shrink over N+2. In the past, CGP and cell height alone may have been enough to compare transistor density. Now, however, we must consider scaling boosters and DTCO as well. SMIC’s density gain does not come from EUV. It comes from using every available DTCO booster aggressively. First is fin depopulation: reducing the number of NMOS and PMOS fins in each cell. The first FinFET nodes started with 3 or 4 fins for each transistor. SMIC N+3 and TSMC N6 HD both use only 2 fins per transistor, trading drive strength for density. Next is contact over active gate (COAG). By landing the gate contact directly over the active gate, instead of out over the isolation region, the cell height drops. N+3 integrates COAG while N6 does not. Our N+3 gate-cut cross-sections indicate COAG, with the gate contact sitting over the active region, while N6 shows an off-gate contact. Last is single diffusion break (SDB). Diffusion breaks are inserted between cells in the same row to provide electrical isolation, but they also introduce local layout effects (LLE), layout-dependent shifts in electrical characteristics. In the past, a double diffusion break was used, consuming the space of two CGPs. SMIC N+3 and TSMC N6 instead use SDB, saving area but increasing LLE sensitivity. This must be controlled at the process level and accurately modeled in the process design kit (PDK) so that EDA tools can account for it. Overall, SMIC N+3 has a transistor density of 113.4 MTr/mm², slightly above TSMC N6 at 107.7 MTr/mm². Even without EUV, SMIC has achieved density beyond TSMC’s mature N6 node which utilizes EUV. Metal Stack The smallest critical dimension in the teardown is M0; SMIC N+3 uses a 32.5 nm local metal pitch. That is smaller than the 36 nm M0 pitch on Intel 18A in Panther Lake. However, this does not mean that SMIC has a better process than Intel 18A or TSMC N3P. M0 is a local intra-cell routing layer. Its usefulness depends on the full interconnect stack: M1 and M2 pitch, track count, via and line resistance, design rules, mask count, overlay control, and routing flexibility. The 32.5 nm M0 is consistent with self-aligned quadruple patterning (SAQP), whose four-population line-width loading we read coarsely as alternating widths of 21.5 to 24 nm; M1 and M2, at 38 and 40 nm, are consistent with self-aligned double patterning (SADP), a single A/B split. On TSMC N6, M0, M2, and M3 sit at a relaxed ~40 nm and are consistent with SADP-class double patterning, with no need for quadruple patterning. That said, we measure M2 for example at ~43 nm, likely inflated by sparse routing. We do not assign any specific layer to EUV from our cross-sections; the distinction we can draw is double versus quadruple patterning, not lithography wavelength. Transistor-level density in the front-end-of-line (FEOL) sets an upper bound, but the design is ultimately limited by what the interconnect stack can route. The lowest metals are the most important for standard-cell density, but the semi-global and global layers determine how usable that density is at the block and chip level. Two axes are commonly used for chip cross-sections: the fin-cut and the gate-cut. The micrograph above is a fin-cut and shows metals 0 through 3. This axis lets us see the even-numbered metals, with M0 right above the fins. There are two kinds of M0 lines. The first are the power rails; these are wide wires for the VDD and VSS running horizontally at the top and bottom edges of each standard cell. The wide wires measure 55 nm across, more than double the other M0 lines. Their width minimizes resistance and reduces IR drop. The second kind are intra-cell wires, short segments within the cell that connect terminals to M1. These have alternating widths between 21.5 and 24 nm. The M0 pitch is 32.5 nm, a 19% reduction versus N+2 and N6. At this pitch, DUV patterning requires more aggressive multi-patterning, increasing mask count, overlay sensitivity, process complexity and cost. M0 is below what a single DUV-defined spacer (SADP) can resolve, so SMIC cascades a second spacer step (SAQP). The cross-section reflects the cost: the M0 trenches are visibly more re-entrant (narrower at the bottom than the top) than M1 or M2 on the same chip and carry a bright barrier-rich foot where the trench meets the etch-stop layer. That shape is partly the intended damascene profile, as a slightly narrow bottom helps void-free copper fill, but its magnitude at M0 is driven by the tight pitch and the higher trench aspect ratio. Intel 18A supports an M0 pitch of 32 nm, although Panther Lake has only shipped with a looser 36 nm pitch. This is due to Intel’s heavy usage of HP libraries. Among leading-edge nodes, 18A has the loosest M0 pitches due to PowerVia. With power routing moving to the backside, congestion is reduced, and the entire front-side metal stack can be used for signal routing. M2 is the first true inter-cell routing layer. It runs horizontally like M0 but spans across multiple cells to carry block-level signals. The M2 pitch sets the cell’s track height – the number of M2 tracks that fit between the VDD and VSS rails, defining what the library calls a 6-track or 7.5-track cell. This layer is the most important, limiting the routing of entire blocks. SMIC N+3 features a 5.7-track cell. The M2 pitch is 40 nm, a 5% decrease over N+2 and the same as N6. This shrink keeps the pitch at the edge of what is possible with double patterning. Future nodes will need to increase the number of masks for M2 as reducing the number of tracks is much harder due to the limitations in routing. The micrograph above is in the perpendicular direction, the gate-cut, and shows metals 0 through 4. This allows us to see and measure the odd-numbered vertical metal layers. The M1 pitch is 38 nm, 9.5% less than N+2 and 33% less than N6. The M1-to-gate ratio matters because it sets local routing flexibility. N+2 and N+3 use a 3:2 ratio, while N6 uses a 1:1 ratio, explaining the huge differences in M1 pitch. The more M1 lines there are compared with the gates, the more flexibility there is for power and signal crossing within the cell. Routing flexibility enables more complex and better cells. Clean fractional ratios are also preferred as a grid is periodic and improves layouts. The 3:2 ratio gives SMIC more local routing flexibility than a strict 1:1 grid, but it also complicates layout and patterning. This is a DTCO choice, with SMIC increasing process complexity to recover density and routability without EUV. This 3:2 ratio is not very popular in the leading-edge nodes. TSMC has only used it on N7+, the N5 family, and the short-lived N3(B). They have switched back to a 1:1 ratio for N3E. Intel has only used it on the 10 nm/Intel 7 family, with Intel 4, 3 and 18A all using a 1:1 ratio. Samsung is the only one still using a 3:2 ratio at the leading edge, using it in the SF4 and SF3 families. It remains to be seen if SMIC will remain at a 3:2 ratio or move to a 1:1 ratio with its future nodes. The industry is still actively exploring these local-routing ratios. At VLSI 2026, imec will be presenting work on even higher ratios, including a 2:1 scheme that can reduce area by up to 14%. We will be covering the conference in a future newsletter article. Subscribe We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. The final local interconnect layer for N+3 is M3, with a pitch of 44 nm. The M3 pitch is the same as on N+2 and 10% larger than on N6. The semi-global layers carry the majority of block-level signal routing. They have a coarser pitch than the lower local layers. On leading-edge nodes, they are designed to sit at the limit of DUV single patterning. M4 through M11 pitches were found divided between 80–82 nm (M4–M6), 128 nm (M7–M10), and 148 nm (M11). Given limited sampling, it is possible these are divided further in dense routing areas. At the top are two giant metal layers, M12 and M13. These have kept the same pitches as N+2 at 1920 nm and 4600 nm respectively. While the lower layers’ pitches are generally fixed by the process and library, the upper layers vary much more in pitch and count, depending on the design. Even two smartphone SoCs on the same process can have wildly different metal stacks. The Helio G99 carries fewer routing layers, reaching coarse metal pitches of 850 nm by M9, while the larger and higher-performance Kirin 9030 keeps fine pitches until M11. SRAM At the leading edge, SRAM is much more difficult to scale than logic. TSMC’s latest nodes have seen little to no bitcell scaling, while logic still has more DTCO levers to pull. While looking for other logic libraries in the GPU compute units, we stumbled upon the SRAM. The most common type of SRAM has 6 transistors (6T), but this cell had 8 transistors (8T) instead. 8T SRAM adds two transistors to form a dedicated read port. Unlike a 6T cell, where reading disturbs the storage, the decoupled read port removes read-disturb, improving read stability and letting the cell be pushed harder for performance. At first glance, the cut looked like an unusual logic library, with each cell row having 3 fins of one polarity and 5 fins of another. The rows also alternated in orientation. Energy-dispersive X-ray spectroscopy (EDS) resolved our confusion. The cut had not landed on the GPU logic, but on the SRAM macro beside it. The unusual fin pattern was due to the SRAM library. We return to EDS in the process flow analysis behind the paywall. SRAM libraries are not like traditional logic libraries. Due to the unequal number of PMOS and NMOS transistors, they require specialized rules and layout libraries. They do not need the flexibility of logic libraries, so they are hyper-optimized for one purpose: dense, reliable memory. The SRAM cell we found is a 1:2:2-2:2 cell. This means there is 1 fin per pull-up (PU) PMOS transistor, and 2 fins per pull-down (PD) and pass-gate (PG) NMOS transistor. These 2 PU, 2 PD and 2 PG transistors would usually form a single 6T high-current cell (HCC). An 8T HCC adds a read-pull-down (RPD) and a read-pass-gate (RPG) NMOS transistor, each with two fins. We measured a cell height of 406 nm, which brings the bitcell size to 0.0463 µm². That is a theoretical peak density of 21.6 Mib/mm². We estimate that a 6T HCC would have a cell height of 292 nm and a size of 0.0337 µm². This is ~12% larger than a 6T HCC on Intel 3 and 4. We also estimate the 6T high-density cell (HDC) to have a cell height of 228 nm and a size of 0.0260 µm². This is coincidentally the same as the logic standard-cell height measured earlier. The estimate puts the cell near Samsung 7LPP/5LPP and slightly below TSMC N7/N6. That is a theoretical peak density of 38.5 Mib/mm². 6T HDC is arguably the most important cell as it is used for the largest caches in a chip, the L3 caches and system-level cache (SLC). Both the Kirin 9020 and 9030 have split the SLC into 4 banks to raise total SLC bandwidth. In the Kirin 9030, the SLC increased from 2 MiB to 3 MiB per bank. Correspondingly, the number of arrays within the bank also increased by 50%, from 16 to 24. Each array can store 128 KiB and forms an orderly pattern on the die shot. From the Kirin 9020 to the Kirin 9030, the area of a 128 KiB SLC array decreased from 0.0477 mm² to 0.0392 mm², an 18% shrink. The achieved density is 25.5 Mib/mm², 66% of the theoretical maximum. While the SLC was quite similar across both chips, the L3 has seen some major changes, particularly in terms of its layout. The total capacity also went up from 10 MiB to 12 MiB. Much like the SLC, the L3 is also split into 4 banks. In the Kirin 9020, an L3 bank consisted of 16× 128 KiB arrays and 16× 32 KiB arrays. However, an L3 bank in the Kirin 9030 instead consists of 48× 64 KiB arrays. In the Kirin 9020 L3, a 128 KiB array was 0.0513 mm² and a 32 KiB array was 0.0154 mm². The size of the 128 KiB array is different on the L3 and SLC as the assist circuitry for the two arrays differs depending on their purpose. In the Kirin 9030 L3, a 64 KiB array is 0.0210 mm². Although not a like-for-like comparison, normalized for capacity, it is 18% smaller than the 9020’s 128 KiB L3 array and 31% smaller than its 32 KiB L3 array. The achieved density is slightly lower than the SLC, at 23.8 Mib/mm², 62% of the theoretical maximum. Unlike the L3 and SLC, the prime cores’ private L2 cache uses a 2-bank design. As the prime cores’ L2 is latency-critical, it likely uses 6T HCC instead of 6T HDC. The 9020 has 16 arrays in each bank while the 9030 has 32. Each array has a capacity of 32 KiB. A 32 KiB array in the L2 shrank from 0.0171 mm² to 0.0142 mm², ~17% smaller. The density is 17.6 Mib/mm², ~59% of the theoretical maximum for 6T HCC. SRAM scaled well from N+2 to N+3, shrinking by ~19%, close to the theoretical logic shrink. The caveat is that N+2’s bitcells were unusually large, bigger than comparable 7 nm-class nodes, so part of the gain is catch-up rather than true scaling. With the insights from STEEL’s teardowns, we will be doing a deep dive into SRAM in a future newsletter article. Subscribe Everything above came out of a single STEEL teardown: die annotation, block-level area analysis and TEM cross-sections through logic and SRAM. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Future Roadmap The same cross-sections that pin down N+3 also show where SMIC can go next. Although N+3 is already close to the practical limits of DUV multi-patterning in several layers, SMIC still has a few scaling levers left. A theoretical N+4 would likely start with cell height. N+3 uses 5 M0 tracks between its power rails. Moving to 4 M0 tracks, as on SMIC N+2 and TSMC N6, could reduce cell height by roughly 15%. The routing grid is only one side of the shrink; the front end also must fit into the smaller cell. One possible FEOL lever is reducing the p-to-n isolation spacing from two diffusion grid units to one. Intel used this scaling booster on Intel 4, and TSMC did so on its N3 family. This path trades layout flexibility for density. Fewer M0 tracks reduce local routing resources, while tighter p-to-n spacing raises integration and design-rule difficulty. M2 is also constrained by the cell height shrink. For SMIC to maintain a ~5.7-track cell, M2 would need to move toward ~35 nm. That would move another layer into SAQP territory. SMIC could also reduce the CGP from 57 nm to 54 nm. Intel reached a similar CGP on Intel 10 nm/Intel 7 without EUV. The local interconnect is also tougher. If SMIC keeps the 3:2 M1-to-gate ratio, M1 would need to shrink to 36 nm and would likely require SAQP as well. If SMIC moves to a 1:1 ratio, M1 could relax to 54 nm, but it would give up routing flexibility. Under this theoretical path, we estimate that SMIC N+4 could reach a cell height of 198 nm and a CGP of 54 nm, implying a Bohr density of 137.8 MTr/mm², on par with TSMC N5 or Samsung SF4. However, the difficulty is cumulative. Each step is individually plausible, but together they make N+4 harder than the transition from N+2 to N+3. It will likely take longer, cost more, and carry less process margin. A theoretical N+5 would require a larger integration shift. One possible path is backside contacts (BSCon), moving power routing and source/drain contacts to the backside, which would reduce front-side routing pressure and enable another reduction in cell height. The front-side metal pitches could relax to reduce the process complexity. M0 would likely relax slightly to ~34 nm, and M2 and M4 pitches could relax further. CGP is unlikely to shrink much further. Even with EUV, 48 nm has been the practical limit for yield and process control. This approach would allow N+5’s cell height to fall to 170 nm and its CGP to 53 nm. This implies a Bohr density of 163.6 MTr/mm², on par with Intel 18A’s HP library. However, this would not make N+5 cost-competitive with the leading edge. It would reach a similar density through a much more expensive route. The integration difficulty rises sharply, with new process flows for backside alignment, wafer thinning, contact reveal, and backside metallization. Past this point, standard density and interconnect scaling become increasingly unattractive. That is where Huawei’s roadmap stops looking like a normal foundry roadmap and starts looking like a packaging roadmap. At ISCAS 2026, Huawei unveiled its tau (τ) scaling law, reframing process scaling in the time domain. τ is the time cost of data movement and processing: switching delays in transistors, RC signal propagation delays in circuits, compute, memory, and networking latency. Outside Huawei’s terminology, this is called system-technology co-optimization. This is Huawei’s answer to its lack of EUV lithography. Without EUV, planar density cannot keep pace with TSMC, Intel, or Samsung. If transistor density cannot shrink further, Huawei’s alternative is to shorten wires, reduce buffering, and stack logic vertically. “LogicFolding”, Huawei’s implementation of this new scaling idea, is, in practice, an aggressive 3D stacking approach. AMD V-Cache places SRAM above or below a CPU die. AMD’s MI350X places active interposer dies (AIDs) underneath accelerator and compute dies (XCDs), with the AIDs handling cache, IO interfaces, the network-on-chip (NoC) and embedded metal-insulator-metal (MIM) capacitors. With LogicFolding, parts of the same logic block are split across multiple active dies bonded face-to-face at ultra-fine pitch. This allows Huawei to shorten some critical paths and reduce buffer overhead, not merely add cache capacity or offload the IO and interconnect. Shortening wires is where the higher clocks come from. A large share of a modern core’s delay and energy budget goes into driving long interconnects and the repeater buffers along them. LogicFolding distributes a block’s critical-path gates across multiple stacked tiers bonded at a very fine pitch, so the bond interface behaves like an additional metal layer and the longest paths get shorter. That is how Huawei expects to recover frequency and efficiency it cannot get from the process alone. Huawei’s roadmap shows its intent. Prime core frequency is targeted to rise from 2.75 GHz in the Kirin 9030 to roughly 5 GHz by 2031, far beyond what planar scaling alone could deliver. Prime cores with 3.1 and 3.39 GHz clocks are being tested in its labs, although their power consumption is unknown. Beyond that, chips are in the design, simulation or pathfinding phase, meaning the frequencies are targets. However, the direction matters more: LogicFolding also helps with performance, not just density. The catch is that Huawei’s density claim is not directly comparable to foundry densities. A stacked design can report more transistors per package footprint by adding active layers, even if each patterned die remains well behind TSMC or Intel in front-end density. This is how Huawei can claim to reach foundry 14A-equivalent density by 2031. This is not a like-for-like foundry comparison, with Huawei using stacked logic and measuring density per package footprint. On a normalized Bohr-density basis, SMIC N+3 is ~114 MTr/mm², 38% less than Intel 18A’s HD library. Huawei’s 3D roadmap closes the gap by stacking active logic, reaching 215 MTr/mm² by 2030. In 2031, the roadmap density jumps to 295 MTr/mm², implying either a third active layer, partial EUV insertion or aggressive planar DUV scaling. Huawei’s methodology makes other foundries look much denser as well. Applying it to AMD’s MI450X with an N2 top die on an N3P base die yields a theoretical density of 460.2 MTr/mm² in 2026, compared with Huawei’s 295 MTr/mm² in 2031. This Kirin 9030 does not use LogicFolding, remaining in a conventional mobile SoC package. Instead, it forms the baseline for how far Huawei and SMIC can push planar scaling. Future teardowns of Kirin and Ascend chips will show both planar logic density and Huawei’s hybrid bonding solutions. Export controls changed China’s optimization problem rather than ending it. EUV restrictions raised the cost and complexity of leading-edge manufacturing without freezing it. SMIC reaches N6-class logic density through DUV immersion, SAQP and DTCO, while Huawei shifts more of the burden onto architecture, packaging and system-level integration. Future nodes will be tougher. N+3 still had room to tighten local metals and reduce cell height and CGP. Further scaling without EUV leaves fewer levers. More aggressive multi-patterning adds masks and overlay error. SMIC can keep pushing DUV, but each step will get more expensive and less forgiving. The design side is just as critical. Huawei had domestic EDA tools and flows before the Kirin 9030, with the Kirin 9000s, 9010 and 9020 making that clear. Huawei was able to ship multiple consumer SoCs on SMIC N+2 and N+3 while cut off from the Western EDA stack. US export controls restricted EDA tools for advanced chips in 2022 but did not target tools for more mature chips. In 2025, the US government briefly placed much broader restrictions on EDA software from Synopsys, Cadence, and others, before lifting them less than two months later as part of a trade deal tied to rare earths. Huawei has been unable to access those tools because it remains on a US trade blacklist. That forced Huawei, SMIC and Chinese academic institutions to build their own tools and flows. Researchers at Peking University recently announced a prototype EDA tool for Huawei’s LogicFolding architecture, which requires a new flow to handle the multilayer layout and floorplan. This is not the same as replacing the full Synopsys or Cadence stack, but it shows where domestic EDA is headed: toward tighter co-optimization between architecture, process and packaging. These advances are also diffusing into the Chinese ecosystem. SMIC is licensing its N+2 and N+3 processes to HLMC/Hua Hong at the government’s direction rather than by choice. If the same process learning feeds into Ascend accelerators for AI training and inference, the choke point shifts from one named fab to an ecosystem. Alibaba’s T-Head silicon arm and Cambricon, a Chinese AI chip designer that is expected to supply ByteDance, could also be major beneficiaries. Sanctions aimed at SMIC alone become less effective once the manufacturing knowledge has spread to other fabs and design houses. China is not closing the gap with Intel, Samsung and TSMC. The teardown shows the opposite in several places: no EUV, no backside power, higher process complexity, and visible trade-offs. 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(Welcome to the Entertainment Strategy Guy, a newsletter on the entertainment industry and business strategy. I write a weekly Streaming Ratings Report and a bi-weekly strategy column, along with occasional deep dives into other topics, like today’s article. Please subscribe.) Okay, time for the tenth and final article in my ten-part series recapping 2025. As I wrote two articles ago, my barometer for whether these articles are worth writing/publishing is whether they yield strategic insights, and once again, every subsection in this article has a strategic takeaway (or two). Honestly, these are the most important takeaways, since I step back and look holistically at the streaming wars in 2025. After I declare which streamers won and lost the year and which genres won and lost the year, I have six bonus thoughts. If you’d like to review the whole series... You can find the film flops here and here. You can find the TV shows flops here and here. You can find the top films here. You can find the top TV shows here, here and here. Then I declared my winners and losers in various categories here. You can find my 2024 recaps here. You can find the 2023 recaps here and here. And my 2022, 2021 and 2020 are all stored here. Yeah, it’s halfway through the year, and I’m just finishing this series up now. This year, I tried to space things out to not clog up my writing calendar, plus I had to wait for Fallout to (finally) drop off the charts. Well, that ended up pushing this series wayyyyy too far back on the calendar. Oh well. Next year, the goal will be to finish this series in March, but frankly, I just need more staff to make that happen. So please subscribe. Or, if you’re an advertiser (movie studio, FYC firm, or other), please reach out. Subscribe Streamer of the Year: Netflix Honorable Mention: Paramount (and CBS) So, just last week, I wrote about how Netflix has lost seven of its top twelve scripted shows in the last year. And I shared two very dour looks at Netflix’s potential slowdown this year and last. Guess what? They’re still the number one streamer in America. In 2025, they dominated new streaming shows (even if most of those new hit shows aren’t coming back for future seasons), they had the two biggest films, and they had the top returning TV show by a mile. The world is complicated, nuanced and messy. There may be warning signs of a future Netflix slowdown, but in 2025, Netflix was still the number one streamer. Note what I didn’t say? That Netflix has “won” the streaming wars, because obviously the streaming wars are still ongoing and, more importantly, YouTube is still growing—so now YouTube has “won” the streaming wars?—while Netflix’s share of TV consumption has stalled out. Avoid simplistic talking points, especially if they’re constantly repeated and could fit on a bumper sticker. I had trouble picking the second-place streamer this year, because all of the candidates for second place—Prime Video, HBO Max, and Paramount+—had some hits, but no one stood out. Then I saw this update from Nielsen on the top shows on TV in the 2025-206 season. Sure enough, Netflix had five of the top ten shows! And they had ten of the top 31 shows and fifteen of the top fifty. But CBS/Paramount+ actually had more shows in the top thirty and the top fifty. Paramount+/CBS had twelve of the top thirty shows and nineteen of the top fifty. Let me emphasize that: CBS/Paramount+ had more top shows in the 2025-2026 season than Netflix. And this look was just for TV shows, not live sports, an arena Netflix barely plays in. Meanwhile, Paramount-Skydance’s market cap is a fraction of Netflix’s. That’s weird, right? Streaming Loser of the Year, TV… We’re just getting started with this issue, but the rest is for paid subscribers of the Entertainment Strategy Guy, so if you’d like to find out… ...what streamer lost the year in TV... …whether Netflix could win the title for “film” streamer too… …who won the Disney vs Warner Bros. battle for theaters… ...what TV genres won and lost the year... ...what film genres won and lost the year... ...what film genre people think is thriving on streaming but isn’t… …why F-BOSSS TV shows don’t hold the same sway in the 2020s… …what it means to “flop” as a film on streaming… …UK shows underperforming on streaming… And a lot more... ...please subscribe! We can only keep doing this great work with your support. If you’d like to read more about why you should subscribe, please read this article about the Streaming Ratings Report, why it matters, why you need it, and why we cover streaming ratings best.
ACA Enrollment Could Fall By 5 Million As Enhanced Health Insurance Subsidies Expire
Millions of Americans face higher health insurance costs as enhanced ACA subsidies expire. New projections show marketplace enrollment could fall by 5 million people.
Beyond red and blue: Pew says Americans fall into one of nine political groups
The Pew Research Center’s new “political typology” was published this past week and was based on surveys from last fall. Most Americans fall within a “politically messy center,” while smaller groups of partisan and politically active voters…
Can Trump get a good Iran deal? Here are the major pitfalls that lie ahead
There is newfound optimism about the Trump administration reaching an agreement with Iran. But getting here was likely the easier part; what comes next will be even harder.
Fallout 76 | Fallout 76: Inside the Vault – Pspsps-TS (World Pets Testing Server)
Get an early look at a new feature arriving this later this year that allows you to take your C.A.M.P. Pets out into Appalachian wasteland!
Study finds 5 daily servings may fall short of key heart-health compounds
Researchers report that many people in the U.S. and U.K. are not consuming levels of flavanol-rich fruits and vegetables associated with better cardiovascular outcomes.
Consumer sentiment rises for the first time in three months
Consumer sentiment may finally be recovering after falling to historic lows due to wartime price spikes.
Scientists Created Nuclear Fireballs in a Lab—on Purpose
When a nuclear accident happens, it’s vital that scientists have accurate fallout models.
War-wary Hill Republicans question Trump’s Iran strategy with control of Congress at stake
A growing number of Hill Republicans say they are frustrated with President Donald Trump’s ever-changing strategy in Iran — dangling a ground invasion one day, touting progress in peace talks the next — in a conflict many fear will cost them their majority this fall.
Beyond red and blue: Pew Research Center says Americans fall into 1 of 9 political groups
A new report from the Pew Research Center groups Americans into nine, not just two, political categories.
A Nebraska immigration raid shut businesses down a year ago. The fallout is ongoing, officials say.
Local businesses have taken a hit as families and workers grapple with the effects of the raid last June on the Glenn Valley Foods meatpacking plant, community members said.
California Democrat endorsed by Pelosi falls behind younger challenger
The intraparty race is expected to shape up as a competitive one.
Apple hinted at three new products this week with fall launches rumored
Apple’s WWDC announcements for iOS 27 were packed with hints about new hardware, including three new products expected to launch this fall.
Nintendo’s Palworld Lawsuit Is Falling Apart
Nintendo's patent lawsuit against Palworld gets a preliminary end date, as well as some changes suggesting it's falling apart.
‘Bad policy and even worse politics’: DeSantis spurns potential White House AI preemption
The Trump administration’s longstanding opposition to state AI laws ultimately killed legislation in Florida, and now Gov. Ron DeSantis fears policies in other states could fall by the wayside.
He Spent 15 Years Amassing SpaceX Shares. Now Comes the Windfall.
Justin Fishner-Wolfson, long a minor figure in Elon Musk’s orbit, is at the helm of a multibillion-dollar payout
I left Canada and moved to California for love; gave up everything
After falling in love on vacation, I gave up everything and sold my dream condo so I could leave Canada and move to the US to be with my partner.
One of fall's coolest games has been delayed to October to avoid a September crush
Last Sunday, a trailer that aired during an online Xbox event showed Valor Mortis, an upcoming action game that re-imagines the age of Napoleonic wars as a conflict with the plague-ridden undead. It’s a first-person game that mixes Dark Souls-style combat with parkour—it’s from the developers of the acclaimed, fast-paced cyberpunk wall-running Ghostrunner games—and a setting like nothing else that’s out there. Valor Mortis’ trailer concluded with a release date: September 24. But by the time it aired, the teams behind the game knew that was no longer Valor Mortis’ release date. Days ago, they’d learned the hard way that September 24 would be untenable and that they’d have to change it. Today, they’ve announced a new one, October 13, after speaking to Game File about getting out of the bind they recently found themselves in. “When we picked September 24th, it looked like a very, very clear date,” Blake Rochkind, head of publisher Lyrical Games, told me during an impromptu interview on Monday in Los Angeles. “Very quickly it became not such a clear date.” Lyrical and development studio One More Level had a feeling the deate might need to change, Rochkind recalled. But they had to lock in September 24 “many, many weeks” ago. Really, though, who could know if that was the right call when they made it? “There were so many unknowns,” Rochkind said. “This was before Sony State of Play, before Xbox Showcase, before Nintendo Direct, before Summer Games Fest.” Then on Tuesday, June 2, during a PlayStation showcase held just five days before their planned release date reveal, things changed. “As soon as Control announced September 24th, we knew we were moving the date.” It wasn’t just the PlayStation showcase reveal of the release date for Remedy’s upcoming third-person thriller. There were others. And changing their own trailer this close to its airing, Rochkind would later tell me, wasn’t possible.
Xbox layoffs planned as CEO Asha Sharma orders business reset
The Microsoft gaming unit's accountability margin has fallen to 3%, and revenue declined nearly half a billion dollars over five years
Kustom Entertainment, Inc. and Gilley’s Gambling Hall Park City Conclude Press Conference Announcing New Live Event Plans
Kustom plans 20+ show dates at Gilley’s, with the first event planned for Fall 2026 Park City, Kan., June 11, 2026 (GLOBE NEWSWIRE) -- Kustom Entertainment, Inc. (Nasdaq: KUST), (Stan Ross, CEO) and Gilley’s Gambling Hall Park City, KS (Phil Ruffin, Owner) have concluded a press conference at Gilley’s, where leaders shared new details on plans to bring more live music, festivals, and large-scale entertainment events to Park City and the Wichita, Kansas area. Kustom Entertainment, Inc. (the “Comp
Social Security is Facing a Political Crisis
On Tuesday the Social Security Trustees released their latest report on the system’s finances. The numbers didn’t change much: Unless something is done, the Old Age Survivors and Disability Insurance (OASDI) program, Social Security’s official name, will be unable to pay full benefits starting in either 2032 or 2034, depending on some technical issues. That’s not far away: If the Trustees are right, the prospect of a Social Security crisis will loom over the next presidential administration. It’s important to understand, however, the nature of the looming crisis. It won’t be an economic crisis. It won’t even be a serious fiscal crisis. Whatever you may have heard, Social Security isn’t in danger of going bankrupt. What we’re facing, instead, is potential political crisis. Congress and the White House could easily take action to sustain America’s retirement system. But given the current state of our politics, there’s no guarantee that they will. There is a widespread misunderstanding of how Social Security works. While Social Security was designed to look like a pension fund, it isn’t. A pension fund pays benefits out of a stock of assets it has accumulated over time. In contrast, Social Security operates as a government transfer program, like food stamps or Medicaid. Now, unlike food stamps — but like the highway trust fund — Social Security is on paper supported by a dedicated tax, the payroll tax, that is assigned to that program. But I say “on paper” because from an economic point of view assigning the payroll tax to Social Security is just an accounting convention. What matters for the U.S. economy is the overall balance between government spending and government revenue, not the difference between one type of spending and one source of revenue. So there’s no inherent economic significance to the fact that by 2034 payroll tax receipts will be insufficient to cover promised benefits. There is, however, a legislative issue. As long as the Social Security Administration can pay benefits out of payroll taxes and its cash reserve, there’s no need for Congress to vote each year to authorize benefits — they just keep going out until further notice. However, once those resources become insufficient, benefits will fall —by 17 percent according to the Trustees — unless Congress passes new legislation that “tops up” Social Security’s finances. Yet the current administration and Republican party are such extremists that there is a real risk that Social Security will be held hostage on behalf of their goals. If this should come to pass, the hostage-takers will claim that shoring up Social Security is unaffordable. Right on cue, Mike Johnson, the Trump-sycophant Speaker of the House, declared on Monday that “entitlement programs” like Social Security “have to be adjusted and fixed,” and that Republicans will introduce a plan to that effect next year. But this is a ploy, because while the cost of maintaining Social Security benefits at their promised level isn’t trivial, it is in fact affordable. According to the Trustees’ report, the actuarial balance of OASDI up through 2050 — the amount of additional funds it would need to keep paying full benefits for the next 25 years — is 1.06 percent of GDP. To put that number in perspective, the Trump administration proposes increasing military spending next year by $420 billion, equivalent to about 1.4 percent of GDP – without any discussion of whether that’s affordable Yet how did we get to the point where Social Security will need to be topped up? The main answer is that we have an aging population, with a growing ratio of retirees collecting benefits to workers paying into the system: Trump’s anti-immigration policies are making this problem worse. According to the Trustees’ report, lower immigration will deepen Social Security’s financial hole because many immigrants are working-age adults who will pay into the system for decades before they collect benefits. In fact, this problem may be much bigger than the report acknowledges: The report’s baseline assumption is that we’ll have net immigration of almost 1.2 million people a year, and even the pessimistic case assumes 750,000 a year. Meanwhile actual net immigration has already been cut far below that — and may now be negative. Moreover, Social Security is being financially damaged by growing income inequality in America. Payroll taxes are levied only on wages up to $184,500, and they don’t touch capital income. With the distribution of income increasingly shifting from labor to capital, as well as becoming more unequal among wage-earners, revenue from the Social Security payroll tax has been falling as a share of national income. From 1990 to 2024, it fell from 5.02 percent of gross domestic income to 4.46 percent. Which brings me to the question that, these days, we ask about everything: How might Social Security be affected by the advent of AI? A short answer: If, as many of us fear, AI accelerates rising income inequality, it will further reduce the payroll tax receipts that currently pay for Social Security and further endanger its finances. On the other hand, if AI, as its advocates promise, leads to faster economic growth, it will increase the potential tax base that could and should be used to support Social Security and other social insurance programs. But to take advantage of that larger base, we’ll have to get serious about taxing wealth and capital income. Is Social Security in trouble? Yes, but only because of the way its financing is currently structured — a structure that no longer works well because our society and economy have become so unequal. Moreover, Trump’s immigration policies are further endangering its already deteriorating financial condition. So don’t believe Republicans’ gaslighting that it will be necessary to cut Social Security benefits. All that is necessary to preserve Social Security is political will to raise taxes on the wealthy and a sensible immigration policy. MUSICAL CODA Actually 67 under current law.
South African business confidence edges up in May after April slump
South African business confidence edged up in May after a sharp fall in April, as companies adjusted to the oil price shock triggered by the Iran war and vehicle sales remained buoyant, data showed on Thursday.
Why India’s deadly dengue crisis is now no longer confined to the monsoons
Experts warn that rising temperatures, erratic rainfall and rapid urbanisation have transformed the seasonal disease.
Eagles offense, Jalen Hurts falling behind at minicamp
The Philadelphia Eagles offense and quarterback Jalen Hurts are falling behind the defense before training camp starts in July.
Temple University Japan Further Expands Academic Offerings with Launch of Cybersecurity Major and Data Science Certificate in Fall 2026
Temple University, Japan Campus (TUJ) will launch a Bachelor of Science in Cybersecurity through the university’s College of Science and Technology beginning in the fall 2026 semester.
Statement - Europe lost 200 000 people to heat in 4 years yet nearly all of them were preventable
Good morning. The impacts of climate change are a clear and present danger, and its most immediate and lethal manifestation is extreme heat. Heatwaves are no longer freak weather anomalies. They are now a recurring crisis inflicting suffering, claiming lives and fracturing our health systems and infrastructure.
Knicks owner James Dolan says President Trump actually didn't fall asleep during Game 3 of NBA Finals
New business expected to move into Franklin Foods plant after closure
The current plant manager, with the help of the state and community partners, plans to launch Franklin County Cheese at the Enosburg Falls facility
Small business optimism falls to lowest level since October 2024
Market Domination host Josh Lipton welcomes NFIB Research Center Executive Director Holly Wade to discuss the latest NFIB Small Business Optimism Index, which fell to its lowest level since October 2024 as inflation concerns continue to weigh on business owners. The decline effectively erases much of the optimism gained following President Trump's return to office.
Downtown hard corner opportunity offers high-profile business location
A prominent downtown corner space is available in a historic building that has been extensively restored.
US measles cases pass 2,000 as outbreak nears worst in decades
Outbreak driven by falling vaccination and misinformation as federal public health cuts hamper state response
Amazon’s Echo speakers can now help kids wind down and fall asleep
Amazon wants to make bedtime less of a struggle.
HomePod gets better in two new ways with iOS 27
Apple’s HomePod and HomePod mini get better in two ways with iOS 27—and bigger changes are rumored to be unveiled this fall.
Family business grows from one man, one machine to major name in packaging industry
They moved from Minnesota to South Dakota, saw a manufacturing market opportunity -- and evolved into a national leader in their industry.
Amazon Expands Its LTL Shipping Business. Old Dominion Freight Tumbles.
Old Dominion Freight Line and FedEx Freight stocks are falling Wednesday after Amazon expands its less-than-truckload shipping service.
