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Jay Shetty Says His 'Body Couldn't Keep Up with His Vision' Before Prioritizing This One Aspect in His Wellness Routine (Exclusive)
The global bestselling author and podcast host, 38, talks to PEOPLE about his health journey and latest partnership with BIOptimizers.
Mamdani boosts his congressional picks with early voting underway
One endorsement has put him in conflict with Rep. Nydia Velázquez.
Yankees Rivalry Roundup: Rays keep pace, M’s get shelled
Tampa wins another one while Washington trounced Seattle
NWA Women in Business: Melissa Curry
Residence: Fort Smith Education: Certified dementia practitioner, certified dementia practitioner trainer, certified dementia care manager, University of Arkansas at Fort Smith (Westark College) Professional background: Curry has been the CEO...
Berkeley Wellness Center to close as California shifts mental health funding
The arts-focused community space for people with mental health challenges is one of seven wellness centers in Alameda County that will close.
Tarleton State named 2025-26 WAC Commissioner’s Cup champions, conference award for overall performance across all sports
STEPHENVILLE, Texas – After eight conference championships in 2025-26, Tarleton State Athletics claimed the ultimate prize for overall performance across all sports – the Western Athletic Conference Commissioner's Cup. The WAC announced on Monday that Tarleton State is the 2025-26 WAC Commissioner's Cup champion, the Texans' first time winning it all in their sixth year in the conference.
Edward Jones Expands Workplace Retirement Solutions for Business Owners and Their Employees
With new products, investments and product partners, Edward Jones is helping business owners support employees while preparing for their own financial futures....
Edward Jones Expands Workplace Retirement Solutions for Business Owners and Their Employees
Edward Jones today announced a significant expansion of its workplace retirement plan capabilities, adding new product partners and solutions designed to help business owners and their employees improve long-term financial fulfillment.
Stephanie Ruhle on Money, Power, Politics and New MS NOW Morning Show
"We're living in unprecedented times," Ruhle tells The Hollywood Reporter.
MS NOW’s Stephanie Ruhle Moves From ‘The 11th Hour’ To Mornings With ‘Money, Power, Politics’
Ruhle signed off MS NOW's 'The 11th Hour' on Friday, and she debuts in her new role this morning after 'Morning Joe,' with a focus on how the economy and Washington impact real people.
Family Entertainment Group, LLC appoints industry veteran Nick DiMatteo, ICAE as senior vice president, equipment operations & strategy
ITASCA, Ill. — Family Entertainment Group, LLC FEG, one of the nation’s premier operators of family entertainment centers, today announced the appointment of Nick DiMatteo, ICAE as Senior V…
Amid Marathon slump and Destiny 2 player resurgence, former Bungie employee claims studio was "very close" to shutting down before Sony's acquisition
The fight to keep Destiny 2 going has been a long one, according to a former member of staff.
Should You Buy Seaport Entertainment Group (SEG)?
Seaport Entertainment Group Inc. (NYSE:SEG) is one of the 6 Cheap Stocks to Buy According to Bill Ackman. Seaport Entertainment Group Inc. (NYSE:SEG) is a real estate firm focused on the entertainment sector. The shares are up by 18.8% over the past year and by 23% year-to-date. The firm has been busy in 2026 consolidating […]
First Plain Language Summary of Publication in veterinary science
Taylor & Francis has announced the publication of the first Plain Language Summary of Publication (PLSP) in veterinary research, a milestone in making discoveries in animal health more accessible, engaging ...
Electronic Arts Introduces EA Advertising, Launching Brands Directly Into Gameplay and Live Experiences
Connecting brands to highly engaged audiences through an exclusive EA SPORTS Partner Program, in-game integrations, creative partnerships, and scalable advertising capabilities across EA’s global portfolio Electronic Arts Inc. (NASDAQ: EA), the global leader in interactive entertainment, today announced the launch of EA Advertising , a new platform transforming how brands connect with audiences through digital and real-world experiences across its global portfolio of games. EA sits at the intersection of entertainment, sports, technology, music, and culture. Across console, mobile, and PC, our games and services reached more than 120 million players 1 each month during fiscal year 2026. Together, this scale and frequency of engagement create meaningful opportunities for brands to connect with audiences through authentic, interactive experiences. EA SPORTS is one of the largest interactive sports platforms in the world, connecting hundreds of millions of players across console, PC, and
Cone Health Plans Hospital in Forsyth County
The health system is applying for 56 acute care beds allocated to Forsyth County.
Millions take calcium and vitamin D for stronger bones. A major review finds little benefit
For years, calcium and vitamin D supplements have been promoted as a simple way for older adults to protect their bones and prevent falls. But a massive review of nearly 154,000 people found that calcium, vitamin D, or a combination of both provided little to no meaningful protection against fractures or falls for most older adults.
NY Essential Plan: What To Do If You Lose Health Care on July 1
Hundreds of thousands of New Yorkers enrolled in the state's Essential Plan will lose their health coverage soon. Here's what you need to know.
What Will It Take to Get a Bundibugyo Vaccine? | Johns Hopkins Bloomberg School of Public Health
Decades of research and billions of dollars went into licensing a vaccine for Zaire ebolavirus. What will it take to get one for Bundibugyo?
The unique World Cup position for Seattle sports fans and why it matters
What these six FIFA World Cup matches in Seattle signify is something far greater.
State names first round of projects funded by federal rural health program
The state this week announced its first round of federal rural health grant funding, which allocated $36 million to projects to help communities with one-time infrastructure improvements and improve technological gaps. The Nevada Health Authority on Monday named the 25 projects that were awarded funding as part of the $180 million part of the Rural […]
The stability of the first iOS 27 developer beta tells its own story
If there’s one thing which is usually a very bad idea even for the most enthusiastic of Apple fans, it’s...
Diomande shows Iraola what the fuss is about
The task of filling the huge vacancy left by Mohamed Salah will be right at the top of Andoni Iraola's tasks when he settles behind his desk at Liverpool. RB Leipzig's 19-year-old Yan Diomande has been the name on the lips of many as the target to take the place of the 'Egyptian king'. Hs is one of Europe's hottest properties and showed exactly why Liverpool are being heavily touted - along with back-t0-back Champions League winners Paris St-Germain - as his next destination with a man-of-the-match performance rich in promise in Ivory Coast's 1-0 victory over Ecuador.
Ultimate Marvel vs. Capcom 3 just received its first significant patch in nearly a decade on Steam, but it appears to have broken more than it fixed
A surprise update to Ultimate Marvel vs. Capcom 3 on Steam has broken one of its most powerful characters.
Why I'm Telling People to Stop Hunting for Dumb TVs
Finding a new TV that doesn't beg you to connect to the internet is a challenge. But even if you find one, there are good reasons to stick with a smart TV and go with a workaround instead. Here's why.
Tottenham join race for Moroccan wonderkid after World Cup debut
Saturday afternoon saw the 2026 FIFA World Cup usher in one of the names for the future into the global game, Morocco's Ayyoub Buaddi, with the wonderkid playing a large part of his national team's draw against perennial powerhouse Brazil. It was just more than just a debut, as it showed that Bouaddi can perform on the global stage against some of the best players in the world, emboldening the interest that teams had in him following his stellar campaign with Lille in Ligue 1, winning out on 49 tackles and recording 33 interceptions last season for the French outfit. All in all, the Moroccan wonderkid has been looked at and is being closely followed by the likes of Arsenal, Liverpool, and Paris-Saint Germain, amongst others, but according to a recent report, yet another English club is pursuing the 18-year-old.
Honor’s Magic V6 sets three foldable firsts
But the bigger battery is the only one that matters.
HMNC Brain Health announces $50 million first closing of Series B financing and a strategic partnership with MEDICE
Financing will accelerate the development of HMNC’s neurosciences portfolio, including Phase 3-readiness activities for Ketabon (KET01) and Nelivabon (BH-200)Agreement grants MEDICE exclusive European commercialization rights for KET01, with tiered double-digit royalties and significant milestone payments MUNICH, Germany, June 15, 2026 – HMNC Brain Health ("HMNC" or the "Company"), a clinical-stage neuroscience company, today announced the successful $50 million first closing of its Series B fin
How Should Sport Identify Its Future Leaders?
Today’s guest column is from professors John Cairney and Rick Burton. Let’s admit it, the sports industry loves a familiar script. A Hall of Fame player retires and becomes an owner. A championship-winning coach moves into the front office. A celebrated team executive becomes league commissioner. A former elite athlete transitions into a leadership role managing or running …
Google leaked its next Pixel Drop with Screen Reactions and paid features
Google's next Pixel Drop looks set to add Screen Reactions, Gemini Omni video tools, and AI music creation.
Being open and honest about men's mental health with News4's Tony Perkins
Men gathered at the Macy’s Metro Center to have an open discussion with WHUR’s Joe Clair and News4’s Tony Perkins about mental health on Saturday.
'We believe in Pedro'
Pedro Porro has signed a new long-term contract with Tottenham, having made 152 appearances since arriving in January 2023 from Sporting CP. "During the past three-and-half years, he has made huge progress to become one of the best full-backs in the game, and the fact he is about to play in the World Cup for Spain is testament to that."
How Apple Is Making Your Older iPhone Run Faster and Stay Alive Longer
Even the aging iPhone 11 will feel a little more responsive soon, thanks to improvements in an unsung iOS feature.
Can Iraola release the real Wirtz?
Florian Wirtz arrived at Liverpool from Bayer Leverkusen last summer amid great fanfare in a then-British record £116m deal - but remained an enigma as he fell far short of expectations. Liverpool still have huge hopes for a gifted attacking player who has only just turned 23, which means one of Andoni Iraola's main tasks is to find a settled position for the German to release the talent he demonstrated before moving to Anfield. This is why Iraola will have been intrigued by what he saw from Wirtz in Germany's 7-1 win against Curacao in their opening World Cup game.
BioSTL Builds Gateway for U.K.'s National Health Service Innovators with St. Louis as Launch Point into U.S. Market
BioSTL Global, the international arm of BioSTL, the backbone of the region's bio-innovation ecosystem, has reached an agreement with the innovation network commissioned by the U.K.'s National Health Service (NHS) that promises to attract new companies to St. Louis' nationally recognized healthcare industry.
Weird Science: Historian uses carbon dating to show N.C.'s most enduring mystery isn't so mysterious
For nearly a century, American school children have been taught the same haunting mystery. In 1587, a group of English colonists landed on Roanoke Island. Then, they vanished, leaving behind only one cryptic clue carved into a wooden gatepost: the word "Croatoan."In this edition of Weird Science, Public Radio East's Annette Weston spoke with a Buxton native who is using science to dispel what he said is the myth behind the truth.
Weird Science: Historian uses carbon dating to show N.C.'s most enduring mystery isn't so mysterious
For nearly a century, American school children have been taught the same haunting mystery. In 1587, a group of English colonists landed on Roanoke Island. Then, they vanished, leaving behind only one cryptic clue carved into a wooden gatepost: the word "Croatoan."In this edition of Weird Science, Public Radio East's Annette Weston spoke with a Buxton native who is using science to dispel what he said is the myth behind the truth.
Themed Entertainment Giant Teases $55 Billion Investment
One of the world’s leading themed entertainment developers has teased a $54.4 billion project which is expected to be one of the biggest investments in its history.
How one millennial hit financial independence in three years
"The biggest factor by far, bar none, is the gap between your income and your expenses," says Cody Berman, who hit financial independence at age 25.
Health under the Global Gateway: achievements and future prospects
The EU has increasingly positioned global health as a strategic component of its external action through the EU Global Health Strategy and the Global Gateway in
Analyst recommendations: Accenture, Caesars Entertainment, Roku, Adobe, Salesforce…
Every morning, find a selection of analysts' recommendations covering North America. The list only includes companies that have been the subject of a change of opinion or price target, or of a new...
Reasons for Commanders to hope and mope in 2026
One NFL analyst shares a reason for the Commanders to hope and mope in 2026.
Are Glutathione Supplements a Scam?
The so-called “mother of all antioxidants” is sold as dissolving strips, capsules, liquids, gels and powders. We asked experts if they actually work.
They're uninsured after Obamacare became too costly. And they're far from alone.
They’re Uninsured After Obamacare Became Too Costly. And They’re Far From Alone.
After congressional Republicans let expanded subsidies for Affordable Care Act plans expire at the end of last year, some families have decided the price is too great of a financial burden and canceled their coverage.
Who Will Lead the Democrats in 2028? Watch the Two Georgia Senators
The timing is right for one of Georgia’s two Democratic senators.
Most parents track their 18-25-year-old kids on their smartphones. Is that healthy?
A new survey from the University of Michigan asks parents about their use of technology to track their adult children, ages 18-25, including using "always on" location tracking on their smartphones.
Yankees news: Paul Goldschmidt has been worth every dime
An insurance policy worth weight in gold; how Jasson managed a chaotic return; Boone amped about Knicks
👀 Spain wait on Lamine, can he play this afternoon?
The Spanish national team begins its World Cup campaign this afternoon (18:00 CET) against Cape Verde. The big question surrounding the starting eleven is the physical condition of La Roja’s young s...
One California politician’s unexpected crusade against ultra-processed food
Jesse Gabriel "has passed more food policy in three years than most legislators enact in their entire careers," says one supporter.
Cucurella, Rashford... 5️⃣ stories beyond the World Cup
The summer transfer market exploded completely this Monday, stealing the spotlight from the World Cup itself for a few hours. Clubs from Europe’s top leagues don’t want to waste any time, and the ...
Jim Cramer Shows Enthusiasm Around Honeywell’s Aerospace Business Spin-Off
Honeywell International Inc. (NASDAQ:HON) was one of the stocks on Jim Cramer’s radar as he cautioned that SpaceX could blow past its opening price. Cramer highlighted the stock’s rally, as he remarked: You know, I’ve been pretty darn enthusiastic about Honeywell’s plan to spin off its aerospace business later this month, and today the market […]
L.A. Sites Included in Major Deal
Editor's note: A version of this story was originally published in the Orange County Business Journal. In one of the largest light industrial deals of the
Shimano Reinvents Deore Group With New Brakes and Cable-Actuated Drivetrain
Three new derailleurs, all cable-actuated, one with a clutch.
Hernandez, Snell Seen Working Out on Field Amid IL Stints
Los Angeles Dodgers stars Blake Snell and Teoscar Hernandez both worked out on the field at Dodger Stadium on Sunday. Snell has only made one start for the Dodgers this season, missing the beginning of the year with fatigue and…
FIFA World Cup boosts sales at business in Manchester
With the World Cup in full swing across North America, one New Hampshire business is seeing a boost in sales.
Taboos are on the table at Bury St Edmunds women's health event
Three nurses behind the event say they want women to feel they can have open and honest conversations.
Review | Spielberg’s return to science fiction, “Disclosure Day” is a bold, messy blockbuster
Steven Spielberg is one of the most prolific directors of all time, so obviously, when he has a new movie coming out, I get incredibly excited. Spielberg’s return to science fiction with “Disclosure Day” is in many ways just what I expected from him, but also was head-scratching in some areas that I thought it...
After a lifetime in politics, a former Maine congressman finds his biggest fight at home
Mike Michaud avoided scandal for nearly 50 years in state and federal politics. So how did he wind up in one in a small northern Maine town?
After a lifetime in politics, a former Maine congressman finds his biggest fight at home
Mike Michaud avoided scandal for nearly 50 years in state and federal politics. So how did he wind up in one in a small northern Maine town?
Why I designed Charlotte Tilbury Beauty as a technology company
The beauty mogul explains why technology has been central to her business strategy from day one.
Forty Fort business hits the mark: The Hatchet Factory earns $10,000 award
Denise Ogurkis’ ax-throwing gathering spot earns recognition from Citizens as one of the bank’s 20 recipients, from nine states, of its 2026 Small Business Community Champion Award.
Forty Fort business hits the mark: The Hatchet Factory earns $10,000 award
Denise Ogurkis’ ax-throwing gathering spot earns recognition from Citizens as one of the bank’s 20 recipients, from nine states, of its 2026 Small Business Community Champion Award.
Microsoft CEO warns that AI winners could hollow 'entire industries'
AI models are hoovering up corporate knowledge, and that's leaving one big loser, says Satya Nadella.
💪 Dream World Cup debut! Gyökeres is making history tonight
The Swedish forward is destroying any trace of nerves in his World Cup debut. In less than sixty minutes, he delivered his first assist and scored his first goal in football’s biggest competition. ...
How Long Do Owners Say iPhones Usually Last?
Buying a new iPhone every year might be a thing of the past. Before you decide to upgrade to a new phone, find out how long owners say their IPhones last.
Cubs' Struggles Should Lead to Ideal Phillies Trade
The Philadelphia Phillies moving on from one of their big prospects wouldn't come as much of a surprise at this trade deadline, though there are some others in the system who could be traded, even if they aren't as highly regarded as some of the other top players.
Shark expert says Tony Abbott ‘doesn’t understand the science’ after former PM calls for cull
Another expert says drone technology may have prevented a shark attack at Coogee beach on Saturday
New poll reveals how politics reshaped trust in U.S. public health
A Harvard Chan/de Beaumont national poll of 2,205 U.S. adults found CDC trust dropped to 50% one year into new federal public health leadership, while state and local health agencies remained more trusted.
New poll reveals how politics reshaped trust in U.S. public health
A Harvard Chan/de Beaumont national poll of 2,205 U.S. adults found CDC trust dropped to 50% one year into new federal public health leadership, while state and local health agencies remained more trusted.
Is David Flippo's primary win the death blow for Old Nevada politics?
He rallied Washington's Trumpiest voices, poured in his own money and went straight for the jugular. That approach trounced James Settelmeyer's legacy campaign.
Apple’s iPhone Ultra Now Tipped To Launch In 2027 With A Base Price Of $2,000, While The High-End Variant To Cost $2,200
Apple is apparently pushing back the debut of its iPhone Ultra amid an onslaught of engineering and supply chain-related challenges.
$12 million free agent signing named Eagles' best breakout candidate
The Philadelphia Eagles made a nice bargain signing this offseason and it could end up being one of their best moves.
Campaign Early Access Now Included in Modern Warfare 4 PS5 Pre-Orders
Play one week early from 16th October
Jose Mourinho pushing Real Madrid to sign €140m midfielder
Real Madrid have been very busy in the last few weeks, with now four signings having been wrapped up before the transfer window even opens. Ibrahima Konate and Denzel Dumfries were done prior to Flore...
The cafe that stopped charging and made a profit
Minneapolis venue made more money even though nearly half of its customers paid nothing
No country should have to build its digital health future alone – now none of them will
WHO/Europe and Healthcare Denmark have signed a memorandum of understanding (MoU) to accelerate cooperation on digital health, health data, artificial intelligence (AI) and health system innovation in the 53 countries of the WHO European Region.
Why Marketing Feels Harder as Your Business Grows by Nathan Tayloe
At some point, most growing businesses hit the same moment. What used to feel straightforward starts to feel more complicated. Marketing takes more effort. Results feel less predictable. What once worked consistently begins delivering mixed outcomes. It is easy to assume something is broken. In many cases, nothing is. The business has simply reached a different stage. What Worked Before Starts to Lose Its Edge Early on, growth is often driven by a few things working well at the same time: Referrals are strong The value of the offering is clear The team is aligned Decisions are made quickly Marketing, in that stage, tends to feel easier because the business itself is easier to understand. As the company grows, that simplicity fades. The audience expands. Services evolve. New people join the team. More channels are added. More decisions are made across more touchpoints. Marketing is no longer communicating one clear story. It is trying to represent a more complex business. Complexity Creates Friction That added complexity does not always show up immediately. It builds over time. Messaging starts to drift. Different parts of the business describe what they do in slightly different ways. The website no longer reflects how the company actually operates. Sales conversations evolve faster than the brand. At the same time, more activity is introduced to try to keep growth moving: New campaigns More content Additional platforms More tools and reporting The volume increases. The clarity does not always keep pace. That is when marketing starts to feel harder. It’s Not a Lack of Effort Most teams respond to this stage by doing more. More output More meetings More adjustments More experimentation That effort is not misplaced. It is often pointed in the wrong direction. When the underlying issue is a lack of alignment, more activity tends to create more noise. Results become harder to interpret. Decisions take longer. Progress feels inconsistent. From the outside, everything looks active. From the inside, it feels less certain. The Real Shift As businesses grow, marketing becomes less about execution and more about alignment. The companies that navigate this transition well tend to refocus on a few fundamentals: A clearly defined audience A strong, consistent position in the market Messaging that reflects how the business actually operates Alignment between leadership, marketing, and sales When those elements are in place, execution becomes more effective again. Marketing does not necessarily become easier, but it becomes more consistent. A Different Kind of Discipline Growth introduces more opportunity, but it also demands more discipline. What worked when the business was smaller often cannot be scaled without adjustment. The systems, messaging, and decision-making that once felt intuitive need to become more intentional. That is not a sign of failure. It is a normal part of growth. Marketing feels harder because the business has become more complex. The solution is not to outwork that complexity. It is to bring clarity to it. The companies that do that well tend to regain momentum quickly. Those who do not often stay busy without seeing the same level of progress. — Learn more about how we help organizations align strategy, brand, and execution. Visit tayloegray.com, or reach out directly at nathan@tayloegray.com.
Oxford physicists just made Schrödinger’s cat even stranger
Oxford physicists have created an entirely new type of Schrödinger’s cat-like quantum state using components that are themselves highly quantum in nature. The advance could open new possibilities for more resilient quantum computers and deeper insights into the strange rules that govern the quantum universe.
Entertainment Notebook:Checking out the Fringe Festival; documentary on sports collectibles; Les Belles Soeurs in Yiddish
Have you been to the Montreal Fringe Festival yet? On Saturday I took in a few shows, Existential Lingerie with Lou Laurence and A Lone Loon.
Athletic director: Eagles sports program drawing students, money to Northwest Arkansas Community College
BENTONVILLE -- Northwest Arkansas Community College is pursuing lofty enrollment growth goals, and athletics are playing a key part in recruiting students, according to the college's athletic director.
Samsung's iPhone Ultra rival reportedly more crease-free than the Galaxy Z Fold8 Ultra thanks to thicker UTG
An industry report from South Korea suggests a significant difference between the more compact and wider Galaxy Z Fold 8 on the one hand, and the "Ultra" version of the classic foldable form factor on the other. According to the report, the wider iPhone Ultra competitor from South Korea appears to be significantly less prone to creases than the Galaxy Z Fold 8 Ultra.
Rod Stewart called 'tone-deaf' for attending World Cup game a day canceling concert due to health issues
Rod Stewart slammed as "tone-deaf" by fans after canceling California concert due to illness then jetting to Boston for Scotland's FIFA World Cup match.
iPhone Ultra Price: Apple’s Foldable Must Protect The iPhone 18 Pro
Apple's rumored $1,999 foldable iPhone could help absorb rising component costs and reduce pressure to raise prices on mainstream models.
In a surprise twist, Brian Kemp endorses Burt Jones for governor
Kemp's endorsement gives Jones a significant boost in the closing days of his bitter runoff against billionaire Rick Jackson
ESSAY: The quiet alienation of a New York Knicks title.
One quick word on the New York Knicks’ transcendent 2026 championship, before we get on with our lives.
Car Nut Sold a 1963 Impala SS 409 (the Great One), Regretted for 45 Years, Got Rare '63 SS in Return
The car was meticulously preserved by the original family for 57 years, and it has a unique dealer modification to accommodate the first buyer’s uncommon size
Users' opinion of T-Mobile reaches a new low after bombshell discovery
T-Mobile users were surprised to learn what the carrier is doing with their data.
World Cup 2026: How Scientists Helped Engineer The Perfect Soccer Field
Ahead of the largest World Cup in history, researchers spent years testing grasses and stadium conditions to create consistent playing surfaces across climate zones.
Arlington Mayor talks World Cup and Inter-city competition
Arlington is ground zero for the FIFA World Cup in North Texas. Mayor Jim Ross just won reelection and speaks with Lone Star Politics about the international event and city vs. city competition in North Texas which just led Plano to steal the Dallas Stars away from downtown Dallas.
Costco Wholesale Corporation (COST) Shows How Digitally Enabled Sales Are Outrunning Its Core Business
Costco Wholesale Corporation (NASDAQ:COST) is one of the best e-commerce stocks to buy as global sales hit records. The company is best known for its warehouse-club model, but its online and digitally enabled sales continue to grow at a faster pace than the broader business. On June 3, Costco reported net sales of $24.01 billion […]
Congo says 782 Ebola cases confirmed, two new health zones affected
The number of confirmed Ebola cases in Democratic Republic of Congo has increased to 782 after 72 new cases were documented in 24 hours, one of the biggest single-day jumps during the ongoing outbreak, government data showed on Sunday.
Menopausal hormone therapy linked to stronger bone health
Women on menopausal hormonal therapy face a decreased risk of low bone mineral density compared to those not using it, according to a study being presented Sunday at ENDO 2026, the Endocrine Society's annual meeting in Chicago, Ill.
Business Notes: Stores open at Norfolk Premium Outlets; 3 women receive Farm Bureau awards
See which businesses are giving back and which ones are celebrating milestones in Hampton Roads.
Flight Crew Reveals Dangerous Passenger Behaviors
"The reason they tell you to ask the cabin crew for help if you lose your phone is not to be friendly or show how helpful they are. It's because if your phone is in a seat mechanism and that seat gets moved, the phone will be shredded, the battery may explode, and if it does, it will likely kill everyone onboard."
Is SMIC N+3’s Metal Pitch Smaller than Intel 18A’s?
Almost four years ago, we published that SMIC had started shipping 7 nm (N+1) chips. Now, SMIC is shipping its third-generation 7 nm (N+3) process in Huawei’s Kirin 9030, with a minimum metal pitch of 32.5 nm, about 10% tighter than the 36 nm minimum metal pitch shipping in Intel’s latest Panther Lake CPUs on 18A. The headline is true, but incomplete cherry picked metric. N+3 reaches the density of TSMC N6 through aggressive DUV multi-patterning and design-technology co-optimization (DTCO), but it pays for that in complexity, efficiency and process control. We found this and more in our reverse engineering and teardown where we cover SMIC’s N3 process technology, Huawei’s packaging, memory, architecture, and more. SemiAnalysis has been building a state-of-the-art teardown lab in Oregon capable of analyzing the world’s most advanced and important chips over the last year and half. We have already generated revenue on advanced datacenter chip teardowns including our recent reverse engineering of a major TSMC customer’s COUPE CPO optical engine + EIC 3D stack. This is the first public report from the SemiAnalysis Teardown Engineering & Evaluation Lab, or STEEL for short. The lab is aggressively scaling up and out and we’re excited to announce it publicly. This is a bit of inconvenient timing for TechInsights as they are private equity owned and currently being sold while having enjoyed virtually no credible competition for decades. This has led to TechInsights underinvesting in CAPEX. SemiAnalysis exceeds TechInsights in revenue despite no venture or private equity ownership and being founded only 6 years ago. Because we have no external investors and are founder led, we move faster, build faster, and we can release client chip teardowns for free regularly, while focusing on datacenter for our major clients. Here’s the first public image from our lab, the HiSilicon Kirin 9030 Pro SoC: This report will detail our teardown of the Kirin 9030 and our findings on SMIC’s N+3 process, the most advanced in China. For comparison, we’ll show our teardown of the MediaTek Helio G99, made on TSMC N6. Through this comparison, we can look at the effect of export controls – SMIC N+3 and TSMC N6 are comparable nodes, but one is heavily export-controlled, the other free to use the West’s most advanced equipment. Here we see both China’s progress and constraints. SMIC N+3 reaches TSMC N6-class logic density, but it requires far more aggressive DUV multi-patterning, so it does not match N6 on process maturity or cost. The Kirin 9030 Pro performs similarly to three-year-old Android flagships, and trails far behind the current flagship SoCs from Apple, Qualcomm, MediaTek, and Samsung. The efficiency gap is even wider. Export controls have not stopped Huawei and SMIC from shipping advanced silicon, but they have forced a different path. Without EUV, SMIC is leaning harder on DUV multi-patterning, DTCO, and increasingly complex integration. The roadmap continues forward through tighter design rules and backside power, but each step adds cost and process risk. Huawei’s τ scaling and LogicFolding show another path: stacking active logic and recovering density through advanced packaging and system-technology co-optimization (STCO). To understand the Kirin 9030, we must first understand Huawei’s SoC history. HiSilicon is Huawei’s chip design arm, responsible for the Kirin smartphone SoCs, Kunpeng server CPUs, Ascend AI accelerators, and switch/router networking silicon. Before export controls, Huawei was TSMC’s largest customer – the only customer on TSMC’s first EUV node, N7+, and among the first on N5, alongside Apple. That ended in late 2020. Huawei switched to Qualcomm SoCs in its flagship smartphones, though export controls limited them to 4G-only variants. In late 2023, Huawei returned to in-house silicon with the Kirin 9000s, a successor to the Kirin 9000, fabricated on SMIC N+2 instead of TSMC N5. In the following years, they released the Kirin 9010 and 9020 on the same N+2 process. These chips used Huawei’s in-house TaiShan CPU cores and Maleoon GPU. We have not torn down a Kirin 9020 ourselves, so the predecessor die shot is from Kurnal. The die shots show how Huawei spent its silicon budget: which functional blocks are where, and how their areas compare to the predecessor. First, a quick guide to the major blocks on the die. The total die area is nearly identical, but the 9030 uses that area more aggressively. A denser process lets Huawei fit an extra middle CPU core, more GPU and NPU cores, and larger caches into the same footprint. In contrast, the Helio G99 is a much smaller, low-cost SoC, built for budget smartphones rather than a flagship device. While the Kirin 9030 is ~140 mm², the G99 is only ~29 mm², roughly one-fifth the area. The underlying TSMC process technology, however, is directly comparable as a baseline for analyzing SMIC’s. The Kirin 9030 is an evolutionary refresh, not a clean-sheet design. Its CPU, GPU and NPU cores carry over the 9020’s families, and the gains come from three levers: the SMIC N+2-to-N+3 process step, DTCO and floorplan work, and incremental microarchitecture. Area is where the first two show up, and the 9030 scales well here. Performance and efficiency are the harder test. Huawei’s design holds up better than its node would suggest, but the chip still trails, both because N+3 sits behind the leading-edge nodes and because its cores, while competent, remain a few generations behind the newest designs. The new prime core is an incremental update. The main changes are a 10% frequency increase from 2.5 GHz to 2.75 GHz and a doubling in the L2 cache from 1 MiB to 2 MiB. Despite the increased cache, the core size decreased by 7.6%. Excluding the private L2 cache, the core size decreased by 21%. This is a large reduction for an incremental node. Compared with the TaiShan New V120 core in the Kirin 9020, the Kirin 9030’s middle core is almost unchanged architecturally, yet each core shrinks by ~22%. Most of that comes from the move from N+2 to N+3, with layout likely accounting for the rest. Visually, the most noticeable change is the increase from 3 middle cores to 4. There is also a 20% increase in the shared L3 cache of the big cluster. This helps to improve multi-core performance without sacrificing much in terms of area. Even with each core shrinking, the big CPU cluster’s total area is essentially unchanged. The per-core savings went back into an additional middle core and larger caches. The tiny cores shrank less than the prime core (excluding its L2 cache) and less than the middle cores. This is likely because fixed overhead is a larger share on a small core. We cannot resolve any architectural changes from the die shot alone, but the per-clock and efficiency gains shown below point to more than pure process and layout scaling. The area reduction was offset by a doubling of the shared L2 cache from 2 MiB to 4 MiB, leaving the total tiny CPU cluster area slightly larger. Area is the easiest improvement to see from a die shot, but it is only one part of PPA (power, performance, area). For modern logic, power and performance matter just as much, and often more. Since Dennard scaling broke down in the mid-2000s, voltage and frequency have not scaled in step with transistor dimensions, so each node has had to fight harder for gains in performance and efficiency. The starkest comparison is not Kirin 9020 versus Kirin 9030 Pro. Apple’s efficiency cores run circles around Huawei’s prime core. Apple’s low-power core delivers 20% higher integer performance while drawing only 1 W, compared with 4.5 W for Huawei’s prime core. N+3 matches TSMC N6, but N6 is several generations old. Apple and Qualcomm build on N4 and N3P, which are denser and sit on a better voltage-frequency curve, giving them a larger transistor budget and more performance per watt. The 9030’s own cores did improve. The middle and tiny cores gained 17% and 14% in per-clock integer performance over the 9020, with floating-point flat on the middle core and up 11% on the tiny. The tiny core improves cleanly, with performance rising while power falls and efficiency increases by 45% in integer and 24% in floating point. The middle core is mixed: integer performance rises but power rises faster, cutting integer efficiency by 7%, while lower power lifts floating-point efficiency 16%. Per-clock gains at the same or lower frequency are microarchitectural, so the cores are tuned, not just shrunk. Both also failed to hold their rated maximum frequencies, pointing to thermal, power, or stability limits. Per clock, the middle core sits around Arm Cortex-A720 and the tiny core near the Cortex-A520; absolute performance trails because Huawei clocks them much lower. The prime core is roughly Cortex-X2 class per clock, a 2021 design. Apple’s 2020 M1 Firestorm core is still 35% higher per clock and 57% faster in absolute integer performance at a similar 4.5 W. The current leading edge is further ahead again: the Apple M5 P-core is 60% higher per clock and 2.7× faster, the Arm C1 Ultra 45% higher and 2× faster. Matching older high-end cores per clock is a genuine design achievement. What Huawei cannot match is the voltage-frequency curve and transistor budget of leading-edge nodes, which let Apple, Qualcomm and others spend more transistors in the same area on wider cores, larger caches and deeper buffers while running at lower voltage. Huawei’s LogicFolding roadmap is one answer, stacking active logic to recover density and shorten signal paths. We return to it later. The GPU compute units (CUs) changed more visibly than the CPU cores, moving to a more rectangular layout for both the arithmetic logic unit (ALU) clusters and the CU overall. Even with ray-tracing support added, a CU shrank ~28%. However, that shrink is offset by the increase from 4 to 6 CUs and the area outside the CUs grew 33%. Overall, the GPU cluster is larger by ~10%. The GPU is where Huawei makes its biggest gains. The Maleoon 935 is not competitive with current flagships, but it is a large step up from the 920 and reaches older-flagship territory. In 3DMark it is 70% faster in Wild Life Extreme (WLE) and 79% faster in Steel Nomad Light (SNL) than the 920; with 11% higher clocks and 50% more CUs, the ~67% theoretical uplift roughly matches WLE and is beaten by SNL. It edges ahead of the Snapdragon 8+ Gen 1 in WLE and SNL, and the Dimensity 9200 and Apple A16 in WLE, but stays far behind newer parts: the Snapdragon 8 Elite Gen 5 and Dimensity 9500 are ~2.4–2.6× faster in WLE and ~3.2× faster in SNL. The Maleoon 935 is Huawei’s first GPU with hardware-accelerated ray tracing; there it lands slightly ahead of the Exynos 2200, and on par with the Apple A16, with current flagships up to 3.7× faster. The Neural Processing Unit (NPU) saw the largest structural changes of any block, moving from a Lite and a Tiny core in the Kirin 9020 to a Lite and two Tiny cores in the Kirin 9030. Both core types also show significant layout changes. This is a reversal in Huawei’s NPU design. The Kirin 9000 5G, its last flagship chip on TSMC N5, used two Lite and one Tiny core. The series of SoCs on SMIC N+2 moved to one Lite and one Tiny core, likely for area savings. With the Kirin 9030, Huawei has shifted back toward a larger multi-core NPU cluster, but with the additional area going to a Tiny core rather than a Lite core. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Before diving into the process stack, the package and memory are worth separating from the SoC itself. The Pro variant of the Kirin 9030 carries 12 GB of Samsung DRAM, with two stacks of four dies each. The dies were identified as the K4L2E165YD, a 12 Gb LPDDR5X-9600 device fabricated on Samsung’s 1a node, the fourth generation of its 10 nm-class DRAM after 1x, 1y and 1z. 1a has shipped in volume since 2022, so this is current memory rather than older-node inventory. The 16 GB Pro Max variants we obtained were found with both CXMT and Samsung packages. The CXMT package is marked CXDD7JEDM, with two stacks of four dies, packaged in week 45 of 2025. The inferred die dimensions from X-ray computed tomography (CT) are consistent with a known density of ~0.3 Gib/mm² for the CXMT G4 process, roughly equivalent to other manufacturers’ 1z processes. The Kirin 9030 uses a typical integrated package-on-package (iPoP) stack: multiple DRAM dies in a memory package sit above an organic redistribution layer (RDL) interposer, which sits above the SoC and package substrate. The full package is then mounted to the printed circuit board (PCB) through ball-grid array (BGA) solder bumps. The memory package substrate is a thin bismaleimide-triazine (BT) laminate carrying the LPDDR5X stack. The organic RDL interposer over the SoC routes the PoP signals around the die and carries possible dummy thermal copper pillars. The package substrate, a thicker Ajinomoto Build-up Film (ABF) build-up over a BT core, fans the flip-chip bumps out to BGA pitch and embeds the power planes. The whole stack is organic. The only silicon is the SoC and the LPDDR5X dies; there is no silicon interposer. Keeping it all-organic brings the package’s coefficient of thermal expansion (CTE) close to the PCB’s, reducing board-level warpage, and avoids the cost of a silicon interposer the SoC’s bandwidth does not need. In an iPoP stack, the memory package connects to the organic RDL interposer through an array of solder bumps. Underfill fills the gap around those bumps, adding stiffness and protecting the joints from mechanical stress. The Pro and Pro Max variants differ here, which we cover behind the paywall. The die shot and architecture tell us how Huawei allocated its silicon budget. The process tells us what SMIC can manufacture. We use the Helio G99 as the process reference for TSMC N6. Both SMIC N+3 and TSMC N6 are evolutions of previous 7 nm-class nodes. We used targeted TEM cross-sections through logic and memory regions, imaged in both fin-cut and gate-cut directions. Each cross-section caption gives its horizontal field width (HFW), the real width of the imaged area. We start at the transistor fins, then move up through standard cells, local interconnect, and SRAM. SMIC has not overtaken Intel or TSMC. It uses aggressive DUV scaling and DTCO to reach N6-class density, but that density doesn’t translate into comparable performance and efficiency, for two reasons: the node gap to leading-edge nodes, and Huawei’s core designs. Fin Profile One of the most important knobs in a FinFET process is the fin profile: the shape of an individual fin and the channel where current passes from source to drain. The ideal fin is tall, narrow, and nearly vertical. A taller fin increases effective channel width, while a narrower fin improves electrostatic control by thinning the body the gate must control. Push either too far, and the process pays for it: weaker drive current, fragile fins, taper, footing and line-edge variation that hit yield and device variability. The Intel 22 nm, 14 nm, and 10 nm fin cross-sections show how FinFET nodes have improved over time. 22 nm fins were a first-generation structure, relatively short, wide and strongly tapered. The shape limits current density and reduces gate control uniformity across the height of the fin. At 14 nm and 10 nm, Intel pushed the fins taller and narrower while also making the sidewalls more vertical. Rather than shrinking the device, these changes increase the effective channel width per fin and improve electrostatic control. The trade-off is that taller fins at tighter pitches are much more difficult to manufacture. Now, let’s compare the Helio G99 on TSMC N6 with the Kirin 9030 on SMIC N+3. Both processes are in the same class, with fin pitch of 30-32 nm on N+3 and 34 nm in our N6 cross-section. The pitch for N6 is especially interesting as N7’s HD library is generally listed with a 33 nm fin pitch, and N6 did not shrink pitches directly. Its density gains came from DTCO instead of tighter pitches. The 34 nm pitch was stable across our sampled region and serves more as a comparison against the SMIC N+3 we have not investigated further. Pinning down N+3’s fin patterning scheme takes more than one core unit. The CPU cores show a dense ~32 nm pitch, with the pitch between N-P fin pairs alternating between 78 and 88 nm. Logic alone may be consistent with dual-pitch mandrels of 120 and 110 nm, but this is a complex and unusual approach. Combining the pitch from the the 8T SRAM, which has more complex repeat unit, with the CPU core sequence allows us to reverse engineer the patterning steps with more confidence. As both the logic and SRAM should share the same base grid, a single CD mandrel lithography pattern with 128 nm pitch undergoing SAQP produces a die-wide ~32 nm grid (128 nm/4), which supports the pitch sequencing seen in both logic and SRAM cells. In the sampled cross-sections, N+3 shows a taller, narrower, higher-aspect-ratio fin than N6. The measured fin aspect ratio is ~9.5:1 on N+3 versus 7.8:1 on N6. N+3 also shows less top rounding, with an estimated radius of ~2 nm, compared with 2.8 nm on N6. Even though the fin widths differ, the ratio of top rounding to fin width tells the same story, with N+3 at 0.37 and N6 at 0.44. In a geometric sense, lower is better; a perfectly rectangular fin would have no top-rounding penalty. These are single-digit-nanometer features measured from a handful of cuts, so treat the absolute numbers as approximate. The important result is the relative gap: N+3’s fins are consistently taller, narrower and less rounded than N6’s. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Standard Cell A standard cell is the basic building block of chip layout: a fixed-height row pairing one NMOS and one PMOS transistor that share a gate, tiled in a grid to build logic blocks. The key dimensions are contacted gate pitch (CGP), cell height (CH), fin count, and the lower-metal routing grid. To measure density, we use the Bohr metric: a weighted average of NAND2 gate area (60%) and scan flip-flop area (40%). This represents a realistic mix of combinational and sequential logic. This metric has its limitations, especially for complex cell layouts like TSMC’s FinFLEX, which alternates cells with different fin counts. Even so, it is the best metric for a pure process-level comparison. Another important measurement is the fin pitch; it refers to the distance between two fins of the same transistor. In a FinFET process, multiple fins are used in each transistor to increase the drive current and thus performance. TSMC N6 ships both a high-density (HD) library with 2 PMOS and 2 NMOS fins per cell, and a high-performance (HP) library with 3 of each. More fins under the shared gate mean more effective channel width. HP cells switch harder at the cost of area. Designers mix the two on a die, primarily spending HP cells on timing-critical paths, and matching their PPA targets. In the Cortex-A55 core of the Helio G99, we found a cell height of 240 nm for the HD cell. MediaTek has used HD cells in the G99 to minimize die size and thus cost. As an SoC for budget smartphones at ~$100, this is essential. By contrast, we found only one library in the Kirin 9030, with 2 NMOS and 2 PMOS fins. This suggests a narrower library strategy than TSMC N6, where both HD and HP libraries are widely used. This likely reflects the smaller customer base and the more constrained domestic design and electronic design automation (EDA) ecosystem. In all three CPU cores of the Kirin 9030, we found cell heights of 228 nm, 5% smaller than on N6. This is also a reduction of 9.5% over SMIC N+2’s cell height of 252 nm. SMIC N+3 and TSMC N6’s HD library both feature a CGP of 57 nm. For SMIC, this is a 9.5% shrink over N+2. In the past, CGP and cell height alone may have been enough to compare transistor density. Now, however, we must consider scaling boosters and DTCO as well. SMIC’s density gain does not come from EUV. It comes from using every available DTCO booster aggressively. First is fin depopulation: reducing the number of NMOS and PMOS fins in each cell. The first FinFET nodes started with 3 or 4 fins for each transistor. SMIC N+3 and TSMC N6 HD both use only 2 fins per transistor, trading drive strength for density. Next is contact over active gate (COAG). By landing the gate contact directly over the active gate, instead of out over the isolation region, the cell height drops. N+3 integrates COAG while N6 does not. Our N+3 gate-cut cross-sections indicate COAG, with the gate contact sitting over the active region, while N6 shows an off-gate contact. Last is single diffusion break (SDB). Diffusion breaks are inserted between cells in the same row to provide electrical isolation, but they also introduce local layout effects (LLE), layout-dependent shifts in electrical characteristics. In the past, a double diffusion break was used, consuming the space of two CGPs. SMIC N+3 and TSMC N6 instead use SDB, saving area but increasing LLE sensitivity. This must be controlled at the process level and accurately modeled in the process design kit (PDK) so that EDA tools can account for it. Overall, SMIC N+3 has a transistor density of 113.4 MTr/mm², slightly above TSMC N6 at 107.7 MTr/mm². Even without EUV, SMIC has achieved density beyond TSMC’s mature N6 node which utilizes EUV. Metal Stack The smallest critical dimension in the teardown is M0; SMIC N+3 uses a 32.5 nm local metal pitch. That is smaller than the 36 nm M0 pitch on Intel 18A in Panther Lake. However, this does not mean that SMIC has a better process than Intel 18A or TSMC N3P. M0 is a local intra-cell routing layer. Its usefulness depends on the full interconnect stack: M1 and M2 pitch, track count, via and line resistance, design rules, mask count, overlay control, and routing flexibility. The 32.5 nm M0 is consistent with self-aligned quadruple patterning (SAQP), whose four-population line-width loading we read coarsely as alternating widths of 21.5 to 24 nm; M1 and M2, at 38 and 40 nm, are consistent with self-aligned double patterning (SADP), a single A/B split. On TSMC N6, M0, M2, and M3 sit at a relaxed ~40 nm and are consistent with SADP-class double patterning, with no need for quadruple patterning. That said, we measure M2 for example at ~43 nm, likely inflated by sparse routing. We do not assign any specific layer to EUV from our cross-sections; the distinction we can draw is double versus quadruple patterning, not lithography wavelength. Transistor-level density in the front-end-of-line (FEOL) sets an upper bound, but the design is ultimately limited by what the interconnect stack can route. The lowest metals are the most important for standard-cell density, but the semi-global and global layers determine how usable that density is at the block and chip level. Two axes are commonly used for chip cross-sections: the fin-cut and the gate-cut. The micrograph above is a fin-cut and shows metals 0 through 3. This axis lets us see the even-numbered metals, with M0 right above the fins. There are two kinds of M0 lines. The first are the power rails; these are wide wires for the VDD and VSS running horizontally at the top and bottom edges of each standard cell. The wide wires measure 55 nm across, more than double the other M0 lines. Their width minimizes resistance and reduces IR drop. The second kind are intra-cell wires, short segments within the cell that connect terminals to M1. These have alternating widths between 21.5 and 24 nm. The M0 pitch is 32.5 nm, a 19% reduction versus N+2 and N6. At this pitch, DUV patterning requires more aggressive multi-patterning, increasing mask count, overlay sensitivity, process complexity and cost. M0 is below what a single DUV-defined spacer (SADP) can resolve, so SMIC cascades a second spacer step (SAQP). The cross-section reflects the cost: the M0 trenches are visibly more re-entrant (narrower at the bottom than the top) than M1 or M2 on the same chip and carry a bright barrier-rich foot where the trench meets the etch-stop layer. That shape is partly the intended damascene profile, as a slightly narrow bottom helps void-free copper fill, but its magnitude at M0 is driven by the tight pitch and the higher trench aspect ratio. Intel 18A supports an M0 pitch of 32 nm, although Panther Lake has only shipped with a looser 36 nm pitch. This is due to Intel’s heavy usage of HP libraries. Among leading-edge nodes, 18A has the loosest M0 pitches due to PowerVia. With power routing moving to the backside, congestion is reduced, and the entire front-side metal stack can be used for signal routing. M2 is the first true inter-cell routing layer. It runs horizontally like M0 but spans across multiple cells to carry block-level signals. The M2 pitch sets the cell’s track height – the number of M2 tracks that fit between the VDD and VSS rails, defining what the library calls a 6-track or 7.5-track cell. This layer is the most important, limiting the routing of entire blocks. SMIC N+3 features a 5.7-track cell. The M2 pitch is 40 nm, a 5% decrease over N+2 and the same as N6. This shrink keeps the pitch at the edge of what is possible with double patterning. Future nodes will need to increase the number of masks for M2 as reducing the number of tracks is much harder due to the limitations in routing. The micrograph above is in the perpendicular direction, the gate-cut, and shows metals 0 through 4. This allows us to see and measure the odd-numbered vertical metal layers. The M1 pitch is 38 nm, 9.5% less than N+2 and 33% less than N6. The M1-to-gate ratio matters because it sets local routing flexibility. N+2 and N+3 use a 3:2 ratio, while N6 uses a 1:1 ratio, explaining the huge differences in M1 pitch. The more M1 lines there are compared with the gates, the more flexibility there is for power and signal crossing within the cell. Routing flexibility enables more complex and better cells. Clean fractional ratios are also preferred as a grid is periodic and improves layouts. The 3:2 ratio gives SMIC more local routing flexibility than a strict 1:1 grid, but it also complicates layout and patterning. This is a DTCO choice, with SMIC increasing process complexity to recover density and routability without EUV. This 3:2 ratio is not very popular in the leading-edge nodes. TSMC has only used it on N7+, the N5 family, and the short-lived N3(B). They have switched back to a 1:1 ratio for N3E. Intel has only used it on the 10 nm/Intel 7 family, with Intel 4, 3 and 18A all using a 1:1 ratio. Samsung is the only one still using a 3:2 ratio at the leading edge, using it in the SF4 and SF3 families. It remains to be seen if SMIC will remain at a 3:2 ratio or move to a 1:1 ratio with its future nodes. The industry is still actively exploring these local-routing ratios. At VLSI 2026, imec will be presenting work on even higher ratios, including a 2:1 scheme that can reduce area by up to 14%. We will be covering the conference in a future newsletter article. Subscribe We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. The final local interconnect layer for N+3 is M3, with a pitch of 44 nm. The M3 pitch is the same as on N+2 and 10% larger than on N6. The semi-global layers carry the majority of block-level signal routing. They have a coarser pitch than the lower local layers. On leading-edge nodes, they are designed to sit at the limit of DUV single patterning. M4 through M11 pitches were found divided between 80–82 nm (M4–M6), 128 nm (M7–M10), and 148 nm (M11). Given limited sampling, it is possible these are divided further in dense routing areas. At the top are two giant metal layers, M12 and M13. These have kept the same pitches as N+2 at 1920 nm and 4600 nm respectively. While the lower layers’ pitches are generally fixed by the process and library, the upper layers vary much more in pitch and count, depending on the design. Even two smartphone SoCs on the same process can have wildly different metal stacks. The Helio G99 carries fewer routing layers, reaching coarse metal pitches of 850 nm by M9, while the larger and higher-performance Kirin 9030 keeps fine pitches until M11. SRAM At the leading edge, SRAM is much more difficult to scale than logic. TSMC’s latest nodes have seen little to no bitcell scaling, while logic still has more DTCO levers to pull. While looking for other logic libraries in the GPU compute units, we stumbled upon the SRAM. The most common type of SRAM has 6 transistors (6T), but this cell had 8 transistors (8T) instead. 8T SRAM adds two transistors to form a dedicated read port. Unlike a 6T cell, where reading disturbs the storage, the decoupled read port removes read-disturb, improving read stability and letting the cell be pushed harder for performance. At first glance, the cut looked like an unusual logic library, with each cell row having 3 fins of one polarity and 5 fins of another. The rows also alternated in orientation. Energy-dispersive X-ray spectroscopy (EDS) resolved our confusion. The cut had not landed on the GPU logic, but on the SRAM macro beside it. The unusual fin pattern was due to the SRAM library. We return to EDS in the process flow analysis behind the paywall. SRAM libraries are not like traditional logic libraries. Due to the unequal number of PMOS and NMOS transistors, they require specialized rules and layout libraries. They do not need the flexibility of logic libraries, so they are hyper-optimized for one purpose: dense, reliable memory. The SRAM cell we found is a 1:2:2-2:2 cell. This means there is 1 fin per pull-up (PU) PMOS transistor, and 2 fins per pull-down (PD) and pass-gate (PG) NMOS transistor. These 2 PU, 2 PD and 2 PG transistors would usually form a single 6T high-current cell (HCC). An 8T HCC adds a read-pull-down (RPD) and a read-pass-gate (RPG) NMOS transistor, each with two fins. We measured a cell height of 406 nm, which brings the bitcell size to 0.0463 µm². That is a theoretical peak density of 21.6 Mib/mm². We estimate that a 6T HCC would have a cell height of 292 nm and a size of 0.0337 µm². This is ~12% larger than a 6T HCC on Intel 3 and 4. We also estimate the 6T high-density cell (HDC) to have a cell height of 228 nm and a size of 0.0260 µm². This is coincidentally the same as the logic standard-cell height measured earlier. The estimate puts the cell near Samsung 7LPP/5LPP and slightly below TSMC N7/N6. That is a theoretical peak density of 38.5 Mib/mm². 6T HDC is arguably the most important cell as it is used for the largest caches in a chip, the L3 caches and system-level cache (SLC). Both the Kirin 9020 and 9030 have split the SLC into 4 banks to raise total SLC bandwidth. In the Kirin 9030, the SLC increased from 2 MiB to 3 MiB per bank. Correspondingly, the number of arrays within the bank also increased by 50%, from 16 to 24. Each array can store 128 KiB and forms an orderly pattern on the die shot. From the Kirin 9020 to the Kirin 9030, the area of a 128 KiB SLC array decreased from 0.0477 mm² to 0.0392 mm², an 18% shrink. The achieved density is 25.5 Mib/mm², 66% of the theoretical maximum. While the SLC was quite similar across both chips, the L3 has seen some major changes, particularly in terms of its layout. The total capacity also went up from 10 MiB to 12 MiB. Much like the SLC, the L3 is also split into 4 banks. In the Kirin 9020, an L3 bank consisted of 16× 128 KiB arrays and 16× 32 KiB arrays. However, an L3 bank in the Kirin 9030 instead consists of 48× 64 KiB arrays. In the Kirin 9020 L3, a 128 KiB array was 0.0513 mm² and a 32 KiB array was 0.0154 mm². The size of the 128 KiB array is different on the L3 and SLC as the assist circuitry for the two arrays differs depending on their purpose. In the Kirin 9030 L3, a 64 KiB array is 0.0210 mm². Although not a like-for-like comparison, normalized for capacity, it is 18% smaller than the 9020’s 128 KiB L3 array and 31% smaller than its 32 KiB L3 array. The achieved density is slightly lower than the SLC, at 23.8 Mib/mm², 62% of the theoretical maximum. Unlike the L3 and SLC, the prime cores’ private L2 cache uses a 2-bank design. As the prime cores’ L2 is latency-critical, it likely uses 6T HCC instead of 6T HDC. The 9020 has 16 arrays in each bank while the 9030 has 32. Each array has a capacity of 32 KiB. A 32 KiB array in the L2 shrank from 0.0171 mm² to 0.0142 mm², ~17% smaller. The density is 17.6 Mib/mm², ~59% of the theoretical maximum for 6T HCC. SRAM scaled well from N+2 to N+3, shrinking by ~19%, close to the theoretical logic shrink. The caveat is that N+2’s bitcells were unusually large, bigger than comparable 7 nm-class nodes, so part of the gain is catch-up rather than true scaling. With the insights from STEEL’s teardowns, we will be doing a deep dive into SRAM in a future newsletter article. Subscribe Everything above came out of a single STEEL teardown: die annotation, block-level area analysis and TEM cross-sections through logic and SRAM. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Future Roadmap The same cross-sections that pin down N+3 also show where SMIC can go next. Although N+3 is already close to the practical limits of DUV multi-patterning in several layers, SMIC still has a few scaling levers left. A theoretical N+4 would likely start with cell height. N+3 uses 5 M0 tracks between its power rails. Moving to 4 M0 tracks, as on SMIC N+2 and TSMC N6, could reduce cell height by roughly 15%. The routing grid is only one side of the shrink; the front end also must fit into the smaller cell. One possible FEOL lever is reducing the p-to-n isolation spacing from two diffusion grid units to one. Intel used this scaling booster on Intel 4, and TSMC did so on its N3 family. This path trades layout flexibility for density. Fewer M0 tracks reduce local routing resources, while tighter p-to-n spacing raises integration and design-rule difficulty. M2 is also constrained by the cell height shrink. For SMIC to maintain a ~5.7-track cell, M2 would need to move toward ~35 nm. That would move another layer into SAQP territory. SMIC could also reduce the CGP from 57 nm to 54 nm. Intel reached a similar CGP on Intel 10 nm/Intel 7 without EUV. The local interconnect is also tougher. If SMIC keeps the 3:2 M1-to-gate ratio, M1 would need to shrink to 36 nm and would likely require SAQP as well. If SMIC moves to a 1:1 ratio, M1 could relax to 54 nm, but it would give up routing flexibility. Under this theoretical path, we estimate that SMIC N+4 could reach a cell height of 198 nm and a CGP of 54 nm, implying a Bohr density of 137.8 MTr/mm², on par with TSMC N5 or Samsung SF4. However, the difficulty is cumulative. Each step is individually plausible, but together they make N+4 harder than the transition from N+2 to N+3. It will likely take longer, cost more, and carry less process margin. A theoretical N+5 would require a larger integration shift. One possible path is backside contacts (BSCon), moving power routing and source/drain contacts to the backside, which would reduce front-side routing pressure and enable another reduction in cell height. The front-side metal pitches could relax to reduce the process complexity. M0 would likely relax slightly to ~34 nm, and M2 and M4 pitches could relax further. CGP is unlikely to shrink much further. Even with EUV, 48 nm has been the practical limit for yield and process control. This approach would allow N+5’s cell height to fall to 170 nm and its CGP to 53 nm. This implies a Bohr density of 163.6 MTr/mm², on par with Intel 18A’s HP library. However, this would not make N+5 cost-competitive with the leading edge. It would reach a similar density through a much more expensive route. The integration difficulty rises sharply, with new process flows for backside alignment, wafer thinning, contact reveal, and backside metallization. Past this point, standard density and interconnect scaling become increasingly unattractive. That is where Huawei’s roadmap stops looking like a normal foundry roadmap and starts looking like a packaging roadmap. At ISCAS 2026, Huawei unveiled its tau (τ) scaling law, reframing process scaling in the time domain. τ is the time cost of data movement and processing: switching delays in transistors, RC signal propagation delays in circuits, compute, memory, and networking latency. Outside Huawei’s terminology, this is called system-technology co-optimization. This is Huawei’s answer to its lack of EUV lithography. Without EUV, planar density cannot keep pace with TSMC, Intel, or Samsung. If transistor density cannot shrink further, Huawei’s alternative is to shorten wires, reduce buffering, and stack logic vertically. “LogicFolding”, Huawei’s implementation of this new scaling idea, is, in practice, an aggressive 3D stacking approach. AMD V-Cache places SRAM above or below a CPU die. AMD’s MI350X places active interposer dies (AIDs) underneath accelerator and compute dies (XCDs), with the AIDs handling cache, IO interfaces, the network-on-chip (NoC) and embedded metal-insulator-metal (MIM) capacitors. With LogicFolding, parts of the same logic block are split across multiple active dies bonded face-to-face at ultra-fine pitch. This allows Huawei to shorten some critical paths and reduce buffer overhead, not merely add cache capacity or offload the IO and interconnect. Shortening wires is where the higher clocks come from. A large share of a modern core’s delay and energy budget goes into driving long interconnects and the repeater buffers along them. LogicFolding distributes a block’s critical-path gates across multiple stacked tiers bonded at a very fine pitch, so the bond interface behaves like an additional metal layer and the longest paths get shorter. That is how Huawei expects to recover frequency and efficiency it cannot get from the process alone. Huawei’s roadmap shows its intent. Prime core frequency is targeted to rise from 2.75 GHz in the Kirin 9030 to roughly 5 GHz by 2031, far beyond what planar scaling alone could deliver. Prime cores with 3.1 and 3.39 GHz clocks are being tested in its labs, although their power consumption is unknown. Beyond that, chips are in the design, simulation or pathfinding phase, meaning the frequencies are targets. However, the direction matters more: LogicFolding also helps with performance, not just density. The catch is that Huawei’s density claim is not directly comparable to foundry densities. A stacked design can report more transistors per package footprint by adding active layers, even if each patterned die remains well behind TSMC or Intel in front-end density. This is how Huawei can claim to reach foundry 14A-equivalent density by 2031. This is not a like-for-like foundry comparison, with Huawei using stacked logic and measuring density per package footprint. On a normalized Bohr-density basis, SMIC N+3 is ~114 MTr/mm², 38% less than Intel 18A’s HD library. Huawei’s 3D roadmap closes the gap by stacking active logic, reaching 215 MTr/mm² by 2030. In 2031, the roadmap density jumps to 295 MTr/mm², implying either a third active layer, partial EUV insertion or aggressive planar DUV scaling. Huawei’s methodology makes other foundries look much denser as well. Applying it to AMD’s MI450X with an N2 top die on an N3P base die yields a theoretical density of 460.2 MTr/mm² in 2026, compared with Huawei’s 295 MTr/mm² in 2031. This Kirin 9030 does not use LogicFolding, remaining in a conventional mobile SoC package. Instead, it forms the baseline for how far Huawei and SMIC can push planar scaling. Future teardowns of Kirin and Ascend chips will show both planar logic density and Huawei’s hybrid bonding solutions. Export controls changed China’s optimization problem rather than ending it. EUV restrictions raised the cost and complexity of leading-edge manufacturing without freezing it. SMIC reaches N6-class logic density through DUV immersion, SAQP and DTCO, while Huawei shifts more of the burden onto architecture, packaging and system-level integration. Future nodes will be tougher. N+3 still had room to tighten local metals and reduce cell height and CGP. Further scaling without EUV leaves fewer levers. More aggressive multi-patterning adds masks and overlay error. SMIC can keep pushing DUV, but each step will get more expensive and less forgiving. The design side is just as critical. Huawei had domestic EDA tools and flows before the Kirin 9030, with the Kirin 9000s, 9010 and 9020 making that clear. Huawei was able to ship multiple consumer SoCs on SMIC N+2 and N+3 while cut off from the Western EDA stack. US export controls restricted EDA tools for advanced chips in 2022 but did not target tools for more mature chips. In 2025, the US government briefly placed much broader restrictions on EDA software from Synopsys, Cadence, and others, before lifting them less than two months later as part of a trade deal tied to rare earths. Huawei has been unable to access those tools because it remains on a US trade blacklist. That forced Huawei, SMIC and Chinese academic institutions to build their own tools and flows. Researchers at Peking University recently announced a prototype EDA tool for Huawei’s LogicFolding architecture, which requires a new flow to handle the multilayer layout and floorplan. This is not the same as replacing the full Synopsys or Cadence stack, but it shows where domestic EDA is headed: toward tighter co-optimization between architecture, process and packaging. These advances are also diffusing into the Chinese ecosystem. SMIC is licensing its N+2 and N+3 processes to HLMC/Hua Hong at the government’s direction rather than by choice. If the same process learning feeds into Ascend accelerators for AI training and inference, the choke point shifts from one named fab to an ecosystem. Alibaba’s T-Head silicon arm and Cambricon, a Chinese AI chip designer that is expected to supply ByteDance, could also be major beneficiaries. Sanctions aimed at SMIC alone become less effective once the manufacturing knowledge has spread to other fabs and design houses. China is not closing the gap with Intel, Samsung and TSMC. The teardown shows the opposite in several places: no EUV, no backside power, higher process complexity, and visible trade-offs. But China is still advancing. If domestic chips become good enough for phones, inference, networking and security-sensitive workloads, they can matter strategically without matching TSMC at the leading edge. Behind the paywall, we show what else STEEL can do, with material and process flow analysis of SMIC N+3, and analysis of the Kirin 9030 package. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline, access the full Kirin 9030 and SMIC N+3 analysis or to commission a custom teardown, contact sales@semianalysis.com.
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