SCROLL NEWS / DISCOVERY
Search headlines
Find the stories shaping the conversation.
Results for " Face " 7,918 found 🔀 AI-powered Shuffle
Intel Panther Lake Teardown, 18A, BSPD, GAAFET, SemiAnalysis STEEL
Panther Lake debuts the first commercial implementation of backside power delivery (BSPDN), introduces Intel’s first iteration of gate-all-around (GAA) transistors, and showcases their advanced packaging capabilities with its Foveros-S assembly. With Panther Lake, Intel’s manufacturing arc has shifted from nebulous roadmaps to shipped silicon, a significant milestone on their long road back to competitive semiconductor manufacturing. To evaluate the extent of Intel’s comeback, we tore down Panther Lake. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Our teardown traces 18A from its four-sheet RibbonFETs (Intel’s marketing name for GAAFETs) and gate stacks through contacts, frontside and backside wiring, and the bonded carrier. We explain how these material and integration choices improve gate control and reduce resistance, while adding capacitance, thermal resistance, and process complexity. Our measurements put Panther Lake’s 18A compute logic and TSMC N3E GPU logic at similar logic density. However, 18A does not lead TSMC N3P, N2 or Samsung SF2 in peak density. Panther Lake’s CPU cores are incremental updates, and the high-end GPU still uses TSMC N3E. Panther Lake assembles one compute tile, one GPU tile, and one I/O tile atop a passive base tile using Intel’s Foveros-S advanced packaging. Both compute tile variants use Intel 18A. The Xe3 GPU options are a 4-core GT1 tile on Intel 3 and a larger 12-core GT2 tile on TSMC N3E. Both I/O tile variants use TSMC N6. [1], [2] Our analysis centers on the PTL-U compute tile, both the 4-core and 12-core GPU tiles, as well as the 12-lane I/O tile. In conventional chips, power and signal are routed through the same frontside metal stack towards the device frontend. Power rails consume scarce routing resources near the transistors, while tall via stacks carry VDD and VSS from the coarse upper wires to local rails. Backside power delivery (BSPD) moves the main power network behind the transistor layer, to the backside, separating it from frontside signal routing. We covered BSPD and its impacts in 2024. [3], [4], [5] Intel’s BSPD implementation, branded as “PowerVia”, routes power through dedicated backside metals to nano-TSVs, which connect those rails to local source/drain (S/D) contacts. Implementing that separation requires Intel to build the interconnect stacks from both sides of the wafer. The frontside comprises the M0-M14 signal stack, while the backside comprises the BM0-BM5 power stack. M0 and BM0 are closest to the transistors. The nano-TSVs connect the two sides, but Intel patterns and etches each via from the front after forming the contacts. A narrow via runs from the side of the contact deep into the silicon substrate. Intel then completes the frontside signal metal stack, bonds the wafer to a carrier, flips it and removes the original substrate until the buried via tips are exposed. The backside metal stack is then deposited directly on the revealed vias. The nano-TSV and backside-via profiles taper in opposite directions because Intel forms them from opposite sides of the wafer. The transistor structures form the FEOL. Local contacts and nano-TSVs connect them to the wiring. M0 begins the frontside interconnect stack. The silicon carrier remains attached above the frontside interconnects. It supports the device wafer during substrate removal and backside processing and remains part of the finished chip’s thermal path. PowerVia removes the main power distribution from the congested frontside metals, routing supply through shorter and wider backside wires. Its lateral landing still occupies area in the standard cell, so it recovers less cell area than a direct backside contact. [3] Nano-TSVs beside the logic devices carry VDD or VSS from the backside power network, while signal connections continue upward through the frontside metals. Backside Interconnects Samsung SF2 data is included for comparison to Panther Lake’s within this article. SF2 is the incumbent GAA foundry node but lacks BSPD, serving as a useful reference to evaluate 18A. A full teardown of Samsung’s S26 products, processed on SF2, will be shared soon.Nanosheet-cut EDS comparison. The PowerVia supply path runs from the backside Cu rails through Mo-lined W nano-TSVs to the local transistor contacts. In this cross section, the tapered connection spans roughly 150 nm from the contact level to BM0. The Ta liner confines Cu and promotes adhesion to the surrounding stack; the AlOₓ etch stop controls the next dielectric etch above the rail. Dielectric beneath the ribbons electrically separates the devices from the backside wiring and removes the conducting silicon body below the channel. [6] AlOₓ serves as an etchstop (ES), enabling endpointing and protecting the underlying layers. Low-volatility aluminum fluoride reaction products resist the fluorinated plasma, allowing a thin AlOₓ film to protect the metal while the surrounding low-k dielectric is removed. [6], [7]. While the BM0 and layers above the M1 lines show double AlOx layers, Our SMIC N+3 teardown showed single AlOₓ layers. SMIC uses a simpler local AlOₓ substack, while the remaining cap and etch sequence provide the required landing protection. So why double layers? The closely spaced AlOₓ doublets provide two protected endpoints in the etch sequence. Intel documents an AlOₓ/SiN/AlOₓ stack that explains the benefit. The main dielectric plasma etch stops on the first AlOₓ film; a selective wet clear opens that film; a second plasma etch removes the intermediate SiN and stops on the second AlOₓ film. The final wet clear exposes the metal landing surface. SiN is the intermediate dielectric in Intel’s published example. [8] The second stop protects the metal through a cap breakthrough. Wide openings can etch faster than narrow ones, and etch depth varies across the wafer. Metal under an early-clearing opening would otherwise be exposed while other openings still need more etching. Staged protection widens the process window and reduces metal erosion, corrosion and void formation. [8] TSMC documents AlN/AlOₓ/SiOC/AlOₓ above Cu, with AlN blocking Cu diffusion, and a simpler AlN/SiOC/AlOₓ variant that omits one AlOx film. [9] Levels with different opening sizes, aspect ratios, pattern densities and cap materials need different etch margins. A double AlOx stop is useful where another protected endpoint justifies the added processing. The extra film adds formation, selective opening and cleaning steps, plus another set of interfaces to control adhesion, moisture, and stress. These blanket films are opened through the existing via pattern, so each film does not require another lithography mask. AlOₓ adds parasitic capacitance when it replaces lower-k dielectric; two thin AlOₓ films can nevertheless contain less AlOₓ than one thick film. Total thickness, placement, and theintermediate dielectric determine the electrical cost. Deposition chemistry also changes AlOx permittivity and residual hydroxyl content, which can oxidize the underlying metal. [7], [8], [10], [11] The backside stack separates into relatively fine BM0-BM2 wiring near the devices and coarser BM3-BM5 power distribution. The largest pitch increase occurs between BM2 and BM3. BM0’s pitch closely matches the logic-row height, fitting local power delivery to the cell rows. Higher levels aggregate current through larger conductors: routing density becomes less important than low resistance and current capacity as the network approaches the package. This hierarchy provides wide power wiring for the power delivery network without consuming scarce frontside signal-routing resources. [3] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Frontside Interconnects Intel 18A combines Mo-lined W contacts and nano-TSVs with a separate backside Cu power network. Samsung SF2 keeps power on the frontside, using Ti-based contact interfaces and Ta-based barriers and Co liners around Cu wiring. In 18A standard-cell rows, backside power rails supply the devices through nano-TSVs within the cells, freeing frontside routing resources. Samsung’s M0 accommodates both power and signal connections. From the device toward M0, the connection runs through a Ti-based S/D interface, W contact fill, a Mo-lined W via, and the Cu M0 wire. Mo supplies a conductive nucleation and adhesion layer for W, replacing the resistive TiN liner used in conventional W integration. This increases the effective conduction volume within the feature while retaining W fill and its established polishing, cleaning and etching processes. Intel’s Mo/W patent describes this integration tradeoff. The nano-TSV uses the same Mo-lined W construction in the backside supply path. [12] The move from TiN to Mo is an incremental change. While a full Co or Mo fill can also reduce the volume lost to liners in very small features, it requires new integration schemes that increase complexity and risk. Cu remains attractive for wider wires due to its low resistance. As wires and vias shrink, the diffusion barrier consumes an increasing fraction of their cross-section. [12], [12], [14] Intel uses Co/Ru liners at M0-M1, Co at M2-M4, and Nb at M5-M9. The lower-level liners help Cu adhere and reduce void formation during trench fills. Applied Materials’ Endura has new thermal control that facilitate wetting process, so the thin film continuity is good enough that good capillary pressure will drive Cu atoms to the via bottom without voiding. Intel’s choice to use Nb is particularly interesting. Intel’s Nb patent describes a conductive diffusion barrier intended to reduce the barrier’s contribution to resistance relative to conventional Ta-based barriers, particularly at via bottoms where all current crosses the barrier. The patent pairs Nb in coarser levels with the option of lower-cost PVD processing. [15], [16] The upper metal layers support thicker barriers formed through physical vapor deposition (PVD) despite its worse coverage and uniformity. Meanwhile, the lower metal layers require thinner barriers deposited through conformal atomic layer deposition (ALD). Co/Ru adds another material interface and requires controlled deposition and Cu fill. Changing liners and barriers by metal layer allows Intel to optimize interconnect resistance, process complexity, and reliability. [15, 16] RibbonFET, Intel’s name for its gate-all-around FETs (GAAFETs), replaces the FinFET’s vertical fins with four stacked horizontal silicon nanosheets, allowing the gate to surround the channel on every side. The path to GAAFET begins with the planar transistor. A planar MOSFET places the gate above the channel between its source and drain. Pairing an NMOS with a PMOS transistor creates a CMOS inverter, in which the NMOS pulls the output low for a high input, and the PMOS pulls it high for a low input. The gate must retain electrostatic control of the channel to ensure clean switching. As gate lengths shrank, the drain began to compete with the gate for that control, increasing off-state leakage. Electrostatic control was restored through an architectural evolution that raised the channel into a vertical fin and wrapping the gate around three sides. Called “FinFET”, this new architecture packed more effective channel width into a smaller footprint. Further scaling made it harder to maintain both drive current and leakage within smaller cells, and reintroduced the same problems planar MOSFETs faced. Nanosheet GAAFETs close the fourth side by replacing the vertical fin with a stack of horizontal nanosheets, each surrounded by the gate. The tighter electrostatic control suppresses leakage at shorter gate lengths while stacking adds effective channel width within the cell footprint. In a FinFET process, channel width changes in discrete steps as designers must add or remove whole fins. Nanosheet width can instead be adjusted continuously within the process’s design rules. Wider sheets increase drive current, while narrower sheets reduce capacitance at the cost of drive current. Intel 18A uses stacks of four nanosheets each and varies their widths across logic and SRAM. At the process level, adding more sheets to each stack increases effective channel width and drive current, but complicates fabrication. RibbonFET vs MBCFET Samsung began GAAFET production in 2022 with SF3E, following with SF3 and now SF2. Its ‘MBCFET’ provides a useful structural comparison with Intel’s first RibbonFET implementation. [17] STEEL is digging deeper into SF2, used in the Exynos 2600, and TSMC’s GAAFET N2, used in Apple’s A20 Pro, in upcoming newsletter articles. We’re throwing some teasers on X. Let’s compare Samsung SF2’s MBCFET with Intel 18A’s RibbonFET. Subscribe Even to the untrained eye, Intel’s extra nanosheet is obvious. Intel stacks four ribbons to Samsung’s three. Samsung’s sheets are much wider in these fields, so both sheet count and width matter to the available channel perimeter. Sheet width also changes which silicon surfaces carry current. On conventional (001) silicon, wide nanosheets emphasize the broad top and bottom surfaces, favoring electron transport; the larger sidewall contribution in a narrow sheet favors hole transport. Thinner sheets improve gate control but increase confinement and scattering. This makes width and thickness part of the NMOS/PMOS balance, alongside strain and threshold voltage. [18], [19] GAAFET designs like 18A use different work-function-metal (WFM) stacks for NMOS and PMOS. Around each ribbon, a thin SiOx interfacial layer separates the silicon channel from the HfOx high-k dielectric, with La providing dipole tuning and the WFM wrapping the dielectric. NMOS uses a TiAl-based stack, while PMOS uses TiN WFM. W fills the remaining gate trench, providing a lower-resistivity path where the work-function layers are no longer needed. In this field, the PMOS stacks leave room for W between ribbons, while the NMOS stacks occupy more of those gaps. A silicon-based dielectric marks the P/N boundary, allowing the PMOS and NMOS gates, sharing the same gate trench, to be processed sequentially. Fast logic paths, retention circuits, and SRAM need a family of threshold options. Changing threshold without substantially changing device dimensions, capacitance or fabrication complexity is valuable. FinFET processes typically use different work-function-metal stacks. In a four-ribbon GAA stack, the narrow sheet-to-sheet gap limits how much WFM can fit around each channel. La in the gate dielectric creates interfacial dipoles at the SiOx/HfOx boundary, shifting effective work function and tuning threshold voltage. This gives Intel another control alongside its NMOS and PMOS WFM stacks. Low-threshold devices improve critical-path drive; higher thresholds reduce leakage elsewhere. Dipole tuning is especially useful in GAA because it changes threshold without consuming the narrow intersheet gap with thicker WFM. Precise control of La incorporation, diffusion and interface quality has long been a challenge, limiting viability in high volume production but is now seen from every leading-edge foundry. Intel’s patent describes depositing a dipole-forming oxide above HfOx and annealing it toward the interfacial oxide before completing the work-function and fill metals. This separates threshold tuning from the space available for metal. Newer research addresses the thermal cost: imec’s 2026 dipole-middle research inserts the shifter between two HfOx depositions, shortening the diffusion path while protecting SiOx during patterning. [20], [21]Matched-cut EDS, Intel 18A (left) vs. Samsung SF2 (right). Intel retains raised source/drain epi beneath its contacts, while Samsung recesses W deep into the epi to form a V-shaped Ti-lined interface. The deeper contact increases metal-to-semiconductor area and shortens the current path from the lower sheets, reducing contact and spreading resistance. It also removes epi volume and brings the contact etch closer to the channel ends. Retaining more epi preserves the material available for strain transfer, especially from SiGe into PMOS. These geometries balance contact access against stress engineering and etch margin. [22], [23] Samsung stacks three sheets to Intel’s four ribbons, and both processes use sheet width to tune drive strength. In our Samsung cross-sections, widths range roughly from 19 to 30 nm in the NPU rows and 37 to 50 nm in the CU cell. The Samsung nanosheets taper, with the widest sheet at the bottom and the narrowest at the top. Both processes use HfOx gate dielectric and Ti-based work-function stacks, with Al in the NMOS stack. In the Samsung devices shown here, the dielectric and WFM occupy the intersheet gaps, leaving W above the top sheet. Intel’s PMOS stack leaves more room between ribbons, and W fills those gaps while the thicker NMOS stack leaves W mainly in the upper trench. Gate-stack EDS maps. The W between Intel’s PMOS ribbons provides a conductive path close to the lower gates. Where WFM fills the entire gap, the gate still surrounds the channel, but voltage reaches it through the more resistive work-function films. Thinner WFM and dipole tuning preserve room for low-resistivity fill; Mo and Ru are alternative fill metals being developed for further scaling. [24] A masked, sequential WFM flow explains the different gate heights and inter-nanosheet fill. The proposed sequence below shows how separate NMOS and PMOS work-function steps produce that geometry. Enabled by the BSPDN process, Intel replaces the dense-logic silicon subfin with dielectric, removing the parasitic conduction path below the ribbons and reducing substrate-related capacitance. A retained silicon body as in classical, non-SOI, planar and FinFET designs needs junction and punchthrough-stop engineering to suppress leakage. Dielectric isolation makes that leakage less sensitive to the subfin doping profile but adds removal and fill steps. It also weakens the direct thermal path through silicon, making the contacts, metal stacks and package more important for heat extraction. [24], [26] Fluorine is concentrated around selected Intel device structures in the maps. WF6 is a standard precursor for W nucleation and fill, while barrier films protect adjacent dielectrics from fluorine attack. Low-fluorine W processes reduce the residual-F burden. Chloride-based precursors avoid introducing F during W deposition, but require control of chlorine attack, nucleation and fill quality. The integration target is a continuous, low-resistance W path with a thin protective liner and minimal chemical damage to the surrounding stack. [20], [27], [28] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. We measured cell height, gate pitch, metal geometry, and ribbon dimensions at the XTEM sites shown below. The tables group these dimensions by site and device polarity. Our “sheet cuts” cross the silicon channel and show the ribbons end-on. “gate cuts” run along the channel through successive gates. The 18A logic cell dimensions point to a five-track logic library while the N3E and Intel 3 cell dimensions evidence a seven-track logic library. The DDR-PHY uses wider M0 wires and much larger spacing than core logic. That trades routing density for lower wire resistance and weaker coupling between neighboring nets. The geometry suits the current delivery and coupling requirements of analog, clock, and I/O circuitry. PowerVia lets 18A combine a compact cell height with wider M0 geometry by moving the main power rails off the signal-routing tracks. That relaxes local wire scaling while preserving a small cell footprint. Cell height and gate pitch set the geometric density; pin access and routability determine how much of it a real block can use. [29] The biggest takeaway from our gate-pitch measurements is that Intel 18A compute logic and TSMC N3E GPU logic have similar density in the Bohr representative-cell model. The 18A example is 18.6% denser than the Intel 3 GPU example. Gate pitches are nearly identical across the three sites, so cell height drives most of the difference. The Bohr model combines a four-transistor NAND2 spanning three gate pitches and a 32-transistor scan flip-flop (SFF) spanning nineteen pitches, weighting their densities 60:40. The sensitivity column shows how independently changing cell height and gate pitch by ±1 nm changes the result. This compares representative cell geometries; whole-die density also depends on cell mix and placement. The 18A P-core gives M0 substantially more metal cross section than the N3E vector engine. Treating each profile as a trapezoid gives 2.63 times the area per line and 1.84 times the area after normalization by routing pitch. The larger section reduces the geometric contribution to line resistance and lowers current density for a given current. Taller and wider wires also add capacitance, so circuit delay depends on the balance of resistance and capacitance. The DDR-PHY has less metal area per routing width than the 18A core fields, while remaining above N3E. [30] Area = height × (top CD + bottom CD) / 2, including liners. Area/pitch normalizes by routing width. Taper is the symmetric sidewall angle from vertical, with the largest angle belonging to the DDR-PHY. Compute tile The measurements show how ribbon dimensions and gate-stack geometry vary across the compute tile and between NMOS and PMOS to balance channel drive, gate load and the space needed for the dielectric/WFM stack across logic, SRAM and the DDR-PHY. Width mainly changes available channel perimeter; thickness also changes electrostatic control and carrier confinement. Gate-stack thickness then determines the space left for low-resistivity fill P-core and LP E-core logic Both the P-core and LP E-core use multiple nanosheet widths. Widths are measured on high-magnification XTEMs while wider-field images demonstrate additional width choices within the LP E-core. Multiple widths are expected even within an LP E-core. Timing-critical paths, buffers and cells with different fanout need different drive strengths. The lower-magnification fields show this width diversity beyond the sites quantified in the table. L2 and L3 SRAM GAA gives SRAM designers another way to balance the pull-up (PU), pass-gate (PG), and pull-down (PD) transistors. FinFET bitcells set device strength through fin count while GAA adds nanosheet width as a sizing knob. In a 6T SRAM cell, a strong pull-down relative to the pass-gate limits read disturbance, while a strong pass-gate relative to the pull-up improves writability. During a write, the pass-gate and write driver pull the node storing “1” below the inverter trip point. During a read, the pull-down holds the node storing “0” low. Bias, threshold voltage, mismatch and assist circuitry set the remaining margin. FinFET high-current cells commonly use a PU:PG:PD fin-count pattern of 1:2:2, a device-sizing ratio rather than a current ratio. Ribbon width lets Intel balance SRAM strengths without adding whole fins. The L2 cell uses its narrowest ribbons for PU and widest for PD, improving writability and read stability respectively. Intel’s disclosed HCC operates without assist; its denser HDC uses negative-bitline write assist. Pulling the selected bitline briefly below ground increases pass-gate overdrive so it can overpower the pull-up at lower supply voltage. That buys density and low voltage writability at the cost of boosting circuitry, switching energy, and additional voltage stress that must be controlled. [31], [32] Four rectangular ribbons give the perimeter = 8 × (width + thickness), before corner rounding. PG/PU is 1.49 and PD/PG is 1.16. The L3 structures closely resemble L2 in layout and cell height. Fewer L3 nanosheet widths are tabulated because fewer high-magnification images were available. DDR PHY The DDR-PHY trades density for controlled analog behavior and reliable off-chip signaling. It contains drivers, receivers, delay circuits, and calibration logic that set drive strength, sampling time, and voltage margin. Repeated four-sheet devices with similar widths fit the use of regular transistor units for matching and programmable drive. Its wider local wiring provides room for current delivery and separation of sensitive signals, while consuming more area than a dense core-logic grid. The layout serves the memory channel’s electrical requirements as well as digital logic density. [33] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Intel 3 GPU devices Vector engine logic Intel 3’s XVE logic uses two-fin PMOS and NMOS devices with power rails in M0. Its cell height and M0 pitch give a seven-track geometry, two tracks more than the 18A logic. One-fin groups also appear among the two-fin devices. Intel 3 L2 SRAM The Intel 3 L2 SRAM uses the familiar HCC sizing pattern: one PU fin, two PG fins, and two PD fins. N3E GPU devices Vector engine logic The N3E XVE field contains repeated two-fin devices with seven-track cell geometry. N3E remains a FinFET process, giving Panther Lake a direct FinFET-to-RibbonFET comparison. N3E L2 SRAM The N3E L2 SRAM uses the same PU:PG:PD fin-count pattern of 1:2:2. Panther Lake-U follows Lunar Lake’s floorplan quite closely. Both pair 4 P-cores with 4 LP E-cores and NPU, media and display engines in similar locations. Lunar Lake also uses Xe2, the direct predecessor to Panther Lake’s Xe3 GPU. This makes Lunar Lake the most direct basis for our comparisons. Arrow Lake differs in core count and uses the older Xe-LPG GPU architecture, so we only use it where it offers a more direct component-level comparison. Compute tile Panther Lake compute-tile floorplans remain sparse even months after launch. Intel 18A’s backside metal and dielectric stack must be removed without damaging the underlying structures before a clean transistor-level floorplan can be imaged. Most published die shots hide or heavily process the background, but we are quite proud of the die shot we achieved and are excited to show the work we have done. We measured the areas of the key components on the compute tile and compared them with their Lunar Lake predecessors on TSMC N3B. These help us to capture changes in block area and compare the two chips across process nodes and designs. Our total tile areas exclude the scribe-line area. The compute-plus-GPU subtotal below uses the PTL-U compute tile and GT1 GPU; it excludes the I/O tile and passive base. Individual block areas use the boundaries marked on the floorplans The compute-plus-GPU row is recomputed from the displayed PTL-U and GT1 areas. Component rows use their stated per-region counts and are not an additive partition of the whole tile. The P-core area remains almost unchanged between Lunar Lake and Panther Lake, despite L2 capacity increasing from 2.5 MiB to 3 MiB. Arrow Lake uses the same Lion Cove core as Lunar Lake but also has a 3 MiB L2. Cougar Cove fits 20% more L2 into the same P-core area. The larger private cache keeps more of each core’s working set close to its execution units, reducing access to shared L3 and DRAM. Extra capacity adds storage leakage and lookup energy, so designers balance it against avoided lower-level accesses. The shared P-core L3 cache also shrank by 14.8%. [2] Cougar Cove combines a similar footprint with Intel’s reported power-efficiency improvements. RibbonFET’s tighter channel control reduces leakage, while PowerVia reduces supply droop and allows tighter voltage guardbands. [1] Darkmont’s four-core LP E-core cluster is 5.0% smaller than Skymont’s on Lunar Lake, with most of the reduction in its L2 regions. The 1 MiB region shrank by 8.4% and the 1.5 MiB region by 14.9%. The tag arrays also use one fewer visible row. Tags identify which memory addresses the data array holds, so rearranging them changes the cache’s layout and wiring without requiring less data capacity. [2] The LP E-cores share one L2. This pools capacity and avoids duplicating all the cache machinery, but the four cores contend for its banks and bandwidth. Their separate cluster also keeps light work away from the performance cluster and its L3, allowing that larger domain to sleep. [1], [2] Cache area includes more than the storage cells. Tags identify each line, decoders select rows, sense amplifiers read the small bitline signal, and wires connect to the banks. Splitting an array into smaller sections shortens wordlines and bitlines, improving access speed, but duplicates peripheral circuits. Panther Lake’s smaller cache regions therefore reflect the complete memory implementation, including how much of each region is devoted to storage. [34] Unlike Meteor Lake and Arrow Lake, Panther Lake has no separate SoC tile. The NPU, LP E-cores, memory controllers, PHYs, media and display engines now share the compute tile. This removes an active die and keeps CPU memory traffic on one die. The cost is moving PHY and I/O-related circuitry onto 18A: drivers, receivers and analog circuits must still meet external voltage, loading and signal-integrity requirements, so their area does not shrink like dense digital logic. [1], [2] The biggest shrink comes from the NPU, which occupies 36.9% less area. NPU 5 consolidates the same total INT8 MAC count into half as many neural compute engines. Each of the three NCEs has a larger MAC array to make the complete NCE envelope 22.6% larger than an NPU 4 engine. Consolidation also halves the number of scratchpads and SHAVE DSPs, from 12 to 6. The MAC array handles matrix multiplication and convolution, while SHAVE executes vector and custom operations that fit the array poorly. [1], [2], [35] The paired floorplans identify each NCE envelope and its scratchpad, MAC, and SHAVE regions. Each measured MAC polygon is counted once per NCE in the area accounting below. The scratchpads store weights, activations, and intermediate results near the MAC arrays, allowing repeated use without fetching them again from DRAM. Halving their number delivers the largest measured area saving but leaves less local storage for the same total MAC count. Layers that no longer fit locally require smaller working tiles or more transfers of intermediate data. The benefit depends on keeping the enlarged arrays busy while managing that tighter storage budget. [36] NPU 5 also adds native FP8. Using half the operand width of FP16 reduces storage and transfer demand, helping workloads fit the smaller local memory budget. Lower precision and format-dependent range make scaling and model validation part of deployment. Hardware activation functions further reduce work that would otherwise occupy the programmable DSPs. [1], [2] Microsoft requires an NPU to deliver at least 40 TOPS for Copilot+ PCs. Both Lunar Lake and Panther Lake meet this threshold, but Panther Lake uses significantly less silicon. GPU tiles Panther Lake is Intel’s first product with Xe3, its latest GPU architecture. It offers two different GPU tiles: a smaller GT1 tile with 4 Xe3 cores on Intel 3 and a larger GT2 tile with 12 Xe3 cores on TSMC N3E. Panther Lake allows us to compare the same GPU architecture across both Intel 3 and TSMC N3E. Wildcat Lake adds a third Xe3 implementation on Intel 18A. A future newsletter will detail Xe3 and its implementation differences across all three process nodes. GT2 scales Xe3 to a different physical layout, with render slices arranged vertically instead of GT1’s horizontal arrangement. Slice placement sets the distances to shared cache banks and the D2D interface. Those wires consume area and add delay, so scaling the number of Xe cores also requires a new balance of cache placement, routing and timing. [1] What’s immediately obvious is that the GT2 tile on TSMC N3E has much smaller Xe cores than GT1. These block areas include logic, caches, and routing. An Xe core on the GT1 tile is ~69% larger than one on Lunar Lake, and ~55% larger than one on GT2. Intel 3 therefore uses substantially more area per Xe core. The block-area gap exceeds the measured logic and SRAM density gaps, bringing routing, timing targets, cell mix, and floorplan allocation into the comparison. The measured vector/matrix engine region is almost unchanged between Lunar Lake and Panther Lake’s GT2 tile. Xe3 retains eight 512-bit vector engines and eight 2048-bit XMX engines per core. Its gains also come from feeding those engines more effectively: more resident threads hide stalls, and variable register allocation lets shaders trade registers per thread against the number of threads kept active. [1] The shared L1/SLM capacity increased by 33% from 192 KiB to 256 KiB, while its area increased only 5%, raising effective density by 27%. L1 retains reused cache lines, while software-managed SLM lets a thread group share data locally. Both reduce traffic to more distant memory. Allocating more SLM per group can also limit how many groups reside on a core at once. [1], [37] The GT1 tile carries 4 MiB of L2 against 16 MiB on the GT2 tile. GT1 divides its L2 cache into four 1 MiB banks, while GT2 uses eight 2 MiB banks. Each bank contains 128 macros, but each N3E macro stores 16 KiB, twice the Intel 3 macro’s 8 KiB capacity. The N3E macro is only 54% larger while holding twice as many bits, giving it 30% higher density: ~23.7 Mbit/mm² versus 18.3 Mbit/mm². Including bank-level circuitry, the gap widens to ~16.9 Mbit/mm² on GT2 versus ~10.4 Mbit/mm² on GT1. GT2 gains density with its macros storing more bits per unit area, and those macros occupy more of each cache bank. Larger macros spread decoder and sense-amplifier overhead across more storage, while a more compact bank layout reduces the share spent on control and routing. The compromise is longer wordlines and bitlines that carry more capacitance. [34] I/O tile Panther Lake uses two I/O tile variants, both fabricated on TSMC N6. The smaller one provides 4 PCIe 5.0 and 8 PCIe 4.0 lanes and serves lower-tier systems as well as those without a discrete GPU, while the larger one adds 8 PCIe 5.0 lanes, bringing the total to 20 lanes, for discrete-GPU connectivity. Panther Lake SKUs with the larger 10- or 12-Xe GPUs use the smaller I/O tile. [38] The smaller I/O tile adds a PCIe 4.0 block and a Thunderbolt block to Lunar Lake’s I/O layout, providing four additional PCIe 4.0 lanes and another Thunderbolt 4 port. Its repeated N6 blocks retain nearly identical areas and layouts. Reusing these proven PHYs and controllers avoids porting and requalifying external interfaces on 18A, where faster digital logic offers less benefit to circuits constrained by the off-chip link. [38] SemiAnalysis’s teardown lab (STEEL) dives deep into the world’s advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. We’re hiring technical experts from system to transistor and everywhere in between. Check out our Careers page. Panther Lake offers scalability and modularity through its disaggregated packaging that partition compute, GPU, and I/O silicon into separate tiles allowing for a suite of tile configurations. This partitioning makes the package part of Intel’s node economics as it determines how much leading-edge wafer area each product consumes, which functions can remain on other processes, and how much configuration freedom Intel can offer from a shared set of tiles. Furthermore, fabricating the compute and GPU tiles separately confines the new 18A process to the compute tile and allows graphics and I/O to use other, more established, and more cost-effective processes. For Panther Lake, the GPU and I/O tiles are assembled alongside the compute tile on a passive silicon base using Foveros-S. Intel’s current technology brief lists a nominal 36 µm pitch for Foveros-S. Through-silicon vias (TSVs) in the base connect the fine wiring above to the larger package connections below. The functional tiles sit side by side on that passive base in a 2.5D configuration. [39] Our cross-section through the compute and GPU tiles shows the package’s wiring hierarchy. Microbumps connect each active tile to the passive silicon base; its fine redistribution layer (RDL) carries the short, dense tile-to-tile links. TSVs carry connections through the base to the package substrate, which fans them out to the much coarser motherboard solder joints. The base supplies interconnect, while computation remains in the active tiles above it. [39] At the compute-tile edge, the higher-magnification inset shows a local microbump spacing of approximately 25.24 µm and a feature width of 12.33 µm. These local spacings are finer than Intel’s nominal Foveros-S value. The X-ray fields further confirm tighter neighboring bumps, consistent across every die-to-die area found on each tile. Additional X-ray analysis is offered after the paywall. Putting the memory controller beside the CPU removes the D2D transfer that CPU memory requests required in Meteor Lake and Arrow Lake. This avoids the extra transmitter, receiver, and link traversal, saving interface energy and latency. Panther Lake’s separate GPU still crosses a D2D link to reach DRAM, so its larger local caches also help contain package traffic. [1], [40] Smaller dies are less likely to contain a random fatal defect, and screening them before assembly prevents one bad tile from consuming a complete package of good silicon. Reuse also spreads design and qualification work across more products. Against those gains, Intel pays for the passive base, D2D circuits, extra bonding and test steps, and losses during assembly. Cost per working product across the portfolio captures the combined effect of wafer yield, reuse, test, and assembly. [29] Wildcat Lake packaging Intel launched Core Series 3, formerly Wildcat Lake, on 16 April 2026 for value mobile and edge systems. Wildcat Lake keeps 18A but removes the passive base and combines more functions on one die to simplify the package. The two products therefore reveal two distinct ways to commercialize the same leading-edge process. [41] Wildcat Lake’s 18A die combines up to two Cougar Cove P-cores, four Darkmont LP E-cores, two Xe3 cores and a smaller NPU. A separate platform-controller die supplies I/O, connected through UCIe, Intel’s first processor implementation of the standard. Consolidating graphics remove a tile boundary and the passive base, reducing assembly complexity for a modest-bandwidth value product. It also ties CPU and graphics scaling to the same die, giving up Panther Lake’s ability to swap in a much larger GPU. [42], [43] In July 2021, Intel CEO Pat Gelsinger set out an ambitious process roadmap aimed at regaining performance leadership by 2025, later described as five nodes in four years. Five years and one CEO later, Intel’s comeback story is not as unambiguously positive as Pat may have hoped. [44], [45] Intel once set the pace for process technology, bringing high-k metal gate technology and FinFETs into volume production years ahead of the rest of the industry. Its 22 nm FinFET process reached consumers with Ivy Bridge in 2012. [46] Intel’s integrated device manufacturing (IDM) model allowed its architects and process engineers to co-optimize products and processes. Starting with Sandy Bridge, Intel dominated x86, while AMD struggled with Bulldozer. That lead faltered at 14 nm and broke at 10 nm. Intel targeted a massive 2.7× density increase, but the node arrived years late and required several revisions before it could support Intel’s full lineup. This delay forced Intel to stretch 14 nm across six generations, while TSMC moved ahead in process technology and AMD recovered in x86. By 2019, Intel was still shipping 14 nm across most of its product stack, with its 10 nm client ramp focused on Ice Lake mobile processors. Meanwhile, TSMC was shipping N7 and N7+, and AMD’s Zen 2 compute chiplets used N7 to raise core counts and improve efficiency. Intel’s process failures were central to its decline, but unsound business decisions furthered their downward slide. Product delays compounded product mistakes, pushing client, server, and FPGA roadmaps off schedule. Several attempts to enter AI (Nervana and Gaudi) and networking (Tofino) also failed to establish lasting businesses. Intel’s recovery has focused on consumer CPUs and advanced packaging. Tiger Lake, Alder Lake, Lunar Lake and now Panther Lake have restored Intel’s consumer roadmap. On the process side, Intel 4 shipped with Meteor Lake, Intel 3 with Granite Rapids and Sierra Forest, and Intel 18A with Panther Lake. Intel has also made advanced packaging part of its foundry offering. However, Intel is still playing catch-up in servers. Several Xeon generations arrived years late and trailed contemporary AMD and Arm server CPUs in performance, efficiency, and core count. The process roadmap is back, but Intel does not hold the same process-technology leadership position it held prior to 10 nm. The introduction of gate-all-around nanosheets and backside power delivery are two of the biggest changes to transistor integration in a decade. Intel took on both changes at once: 18A paired its first RibbonFET with PowerVia in Panther Lake. Panther Lake is a substantial manufacturing milestone. Our cross-sections show how RibbonFET and PowerVia reshape local contacts and wiring, while the floorplans show where architectural consolidation and process choices save area. A sustained competitive lead depends on product performance, cost, yield, and the next implementation. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page.. [1] Intel, “Intel Tech Tour 2025 Panther Lake recap,” Doc. 866361, 2025. Accessed: Sep. 14, 2026. [Online]. Available: https://cdrdv2-public.intel.com/866361/ITT_2025_Panther_Lake_Recap1.pdf [2] Intel, “Core Ultra processors Series 3 datasheet, volume 1,” Doc. 872188-001, Jan. 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://cdrdv2-public.intel.com/872188/872188-001.pdf [3] N. Horiguchi and E. Beyne, “Backside power delivery: How to power chips from the backside,” imec Reading Room, Nov. 25, 2022. Accessed: Sep. 14, 2026. [Online]. Available: https://www.imec-int.com/en/articles/how-power-chips-backside [4] W. Hafez et al., “Intel PowerVia technology: Backside power delivery for high density and high-performance computing,” in Proc. IEEE Symp. VLSI Technol. Circuits, Kyoto, Japan, Jun. 2023, pp. 1–2, doi: 10.23919/vlsitechnologyandcir57934.2023.10185208. [5] K. Fischer et al., “Intel 18A platform technology featuring RibbonFET (GAA) and PowerVia for advanced high-performance computing,” in Proc. Symp. VLSI Technol. Circuits, Kyoto, Japan, Jun. 2025, pp. 1–3, doi: 10.23919/vlsitechnologyandcir65189.2025.11075006. [6] K.-F. Cheng, C.-L. Teng, H.-Y. Huang, and H.-C. Chen, “Metal oxide composite as etch stop layer,” U.S. Patent 12 176 247 B2, Dec. 24, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US12176247B2/en [7] S. W. King, “Dielectric barrier, etch stop, and metal capping materials for state of the art and beyond metal interconnects,” ECS J. Solid State Sci. Technol., vol. 4, no. 1, pp. N3029–N3047, 2015, doi: 10.1149/2.0051501jss. [8] A. V. Mule’, D. J. Towner, D. Seghete, C. R. Ryder, and A. A. Gonzalez, “Multi-layer etch stop layers for advanced integrated circuit structure fabrication,” U.S. Patent Appl. 20220102343 A1, Mar. 31, 2022. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US20220102343A1/en [9] C.-C. Wang and J. H. Wang, “Interconnect structure with dielectric cap layer and etch stop layer stack,” U.S. Patent Appl. 20230253247 A1, Aug. 10, 2023. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US20230253247A1/en [10] Y. J. Wu, K.-F. Cheng, C.-C. Lee, H.-K. Chang, and H.-Y. Huang, “Etch stop layer for interconnect structures,” U.S. Patent Appl. 20240332070 A1, Oct. 3, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US20240332070A1/en [11] M. G. Rainville, N. Shankar, K. S. Reddy, and D. M. Hausmann, “Deposition of aluminum oxide etch stop layers,” U.S. Patent Appl. 20180197770 A1, Jul. 12, 2018. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.justia.com/patent/20180197770 [12] J. S. Leib et al., “Conductive lines having molybdenum liner and tungsten fill for advanced integrated circuit structure fabrication,” U.S. Patent Appl. 20240429126 A1, Dec. 26, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.justia.com/patent/20240429126 [13] M. Naik, “Cobalt enables power and performance scaling at single-digit logic nodes,” Applied Materials, Dec. 17, 2018. Accessed: Sep. 14, 2026. [Online]. Available: https://www.appliedmaterials.com/us/en/blog/blog-posts/cobalt-enables-power-and-performance-scaling-at-single-digit-logic-nodes.html [14] Lam Research, “Breaking through AI’s invisible barrier with molybdenum,” Lam Research Newsroom, May 6, 2025. Accessed: Sep. 14, 2026. [Online]. Available: https://newsroom.lamresearch.com/molybdenum-metallization-ai-revolution [15] P. Yashar, G. Malyavanatham, and H. Vijwani, “Integrated circuit interconnect structures with niobium barrier materials,” U.S. Patent Appl. 20240112951 A1, Apr. 4, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US20240112951A1/en [16] Applied Materials, “Applied Materials unveils chip wiring innovations for more energy-efficient computing,” Applied Materials Investor Relations, Jul. 8, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://ir.appliedmaterials.com/news-releases/news-release-details/applied-materials-unveils-chip-wiring-innovations-more-energy [17] Samsung, “Samsung showcases AI-era vision and latest foundry technologies at SFF 2024,” Samsung Semiconductor, Jun. 13, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://semiconductor.samsung.com/news-events/news/samsung-showcases-ai-era-vision-and-latest-foundry-technologies-at-sff-2024/ [18] C. W. Yeung et al., “Channel geometry impact and narrow sheet effect of stacked nanosheet,” in Proc. IEEE Int. Electron Devices Meeting (IEDM), Dec. 2018, pp. 28.6.1–28.6.4, doi: 10.1109/iedm.2018.8614608. [19] S. Mochizuki et al., “Evaluation of (110) versus (001) channel orientation for improved nFET/pFET device performance trade-off in gate-all-around nanosheet technology,” in Proc. Int. Electron Devices Meeting (IEDM), Dec. 2023, pp. 1–4, doi: 10.1109/iedm45741.2023.10413854. [20] D. G. Ouellette et al., “Fabrication of gate-all-around integrated circuit structures having molybdenum nitride metal gates and gate dielectrics with a dipole layer,” U.S. Patent 12 051 698 B2, Jul. 30, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US12051698B2/en [21] imec, “Advancing the CFET-based device roadmap with novel integration modules and standard-cell architectures,” imec, 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://www.imec-int.com/en/articles/advancing-cfet-based-device-roadmap-novel-integration-modules-and-standard-cell [22] A. Reznicek, X. Miao, C. Lee, and J. Zhang, “Wrap around contact for nanosheet source drain epitaxy,” U.S. Patent 11 302 813 B2, Apr. 12, 2022. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US11302813B2/en [23] J. A. Kittl, J. G. Hong, D. R. Palle, and M. S. Rodder, “Methods for varied strain on nano-scale field effect transistor devices,” U.S. Patent 9 978 833 B2, May 22, 2018. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US9978833B2/en [24] S. Gandikota et al., “Method of reducing metal gate resistance for next generation NMOS device application,” Int. Patent Appl. WO 2024/137272 A1, Jun. 27, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/WO2024137272A1/en [25] J. Zhang et al., “Full bottom dielectric isolation to enable stacked nanosheet transistor for low power and high performance applications,” in Proc. IEEE Int. Electron Devices Meeting (IEDM), Dec. 2019, pp. 11.6.1–11.6.4, doi: 10.1109/iedm19573.2019.8993490. [26] C. Yoo, J. Chang, Y. Seon, H. Kim, and J. Jeon, “Analysis of self-heating effects in multi-nanosheet FET considering bottom isolation and package options,” IEEE Trans. Electron Devices, vol. 69, no. 3, pp. 1524–1531, Mar. 2022, doi: 10.1109/ted.2022.3141327. [27] S. S. Pradhan, D. B. Bergstrom, J.-S. Chun, and J. Chiu, “Tungsten gates for non-planar transistors,” European Patent Appl. EP 3 506 367 A1, Jul. 3, 2019. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/EP3506367A1/en [28] L. Schloss and X. Ba, “Tungsten films having low fluorine content,” U.S. Patent 9 754 824 B2, Sep. 5, 2017. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US9754824B2/en [29] Intel Foundry, “Accelerating AI and HPC with advanced process and packaging technologies,” Doc. 367370-001US, Jun. 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intel.com/content/dam/www/central-libraries/us/en/documents/2025-11/intel-foundry-hpc-ai-brief.pdf [30] M. Lofrano, X. Chang, H. Oprins, and Z. Tokei, “Mitigating the thermal bottleneck in advanced interconnects,” imec, Sep. 28, 2023. Accessed: Sep. 14, 2026. [Online]. Available: https://www.imec-int.com/en/articles/mitigating-thermal-bottleneck-advanced-interconnects [31] S. Bair, “Intel at ISSCC 2025: Navid Shahriari invited talk, eight papers, forums, panelist & product details,” Intel Community, Feb. 19, 2025. Accessed: Sep. 14, 2026. [Online]. Available: https://community.intel.com/t5/Blogs/Tech-Innovation/Edge-5G/Intel-at-ISSCC-2025-Navid-Shahriari-Invited-Talk-Eight-Papers/post/1667592 [32] D. Chandra, E. Potladhurthi, D. R. S. Reddy, and K. S. Rengarajan, “Tunable negative bitline write assist and boost attenuation circuit,” U.S. Patent Appl. 20160203857 A1, Jul. 14, 2016. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US20160203857A1/en [33] Synopsys, “Advantages of firmware-based training in high-speed DDR IP,” Synopsys IP Technical Bulletin. Accessed: Sep. 14, 2026. [Online]. Available: https://www.synopsys.com/articles/firmware-based-training-ddr-ip.html [34] N. Muralimanohar, R. Balasubramonian, and N. P. Jouppi, “CACTI 6.0: A tool to understand large caches,” Hewlett-Packard Laboratories, 2009. Accessed: Sep. 14, 2026. [Online]. Available: https://users.cs.utah.edu/~rajeev/cacti6/cacti6-tr.pdf [35] Intel, “Intel Tech Tour 2024 Lunar Lake AI hardware accelerators,” Doc. 824436, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://cdrdv2-public.intel.com/824436/2024_Intel_Tech%20Tour%20TW_Lunar%20Lake%20AI%20Hardware%20Accelerators.pdf [36] Y.-H. Chen, J. Emer, and V. Sze, “Eyeriss: A spatial architecture for energy-efficient dataflow for convolutional neural networks,” in Proc. 43rd ACM/IEEE Annu. Int. Symp. Comput. Archit. (ISCA), Jun. 2016, pp. 367–379, doi: 10.1109/isca.2016.40. [37] Intel, “Introduction to the Xe-HPG architecture,” Doc. 758306, Nov. 4, 2022. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intel.com/content/www/us/en/developer/articles/technical/introduction-to-the-xe-hpg-architecture.html [38] Intel, “Core Ultra processors Series 3 for the edge,” Doc. 855291. Accessed: Sep. 14, 2026. [Online]. Available: https://cdrdv2-public.intel.com/855291/Intel%C2%AE%20Core%E2%84%A2%20Ultra%20Processors%20Series%203%20for%20Edge%20Overview_2.pdf [39] Intel Foundry, “Foveros technology brief,” Doc. 366411-001US, Feb. 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intel.com/content/dam/www/central-libraries/us/en/documents/2025-07/foveros-25d-product-brief.pdf [40] D. Das Sharma, “UCIe: Building an open chiplet ecosystem,” UCIe Consortium, 2022. Accessed: Sep. 14, 2026. [Online]. Available: https://www.uciexpress.org/_files/ugd/0c1418_c5970a68ab214ffc97fab16d11581449.pdf [41] Intel, “Intel launches Intel Core Series 3 processors,” Intel Newsroom, Apr. 16, 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intel.com/content/www/us/en/newsroom/news/client-computing/intel-launches-intel-core-series-3-processors-changing-the-game-for-everyday-computing.html [42] Intel, “Core Series 3 launch press deck,” Apr. 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://download.intel.com/newsroom/2026/Intel-Core-Series-3/Intel-Core-Series-3-Launch-Press-Deck.pdf [43] Intel, “Intel outlines architectures for agentic AI at Hot Chips 2026,” Intel Newsroom, Aug. 24, 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intel.com/content/www/us/en/newsroom/news/client-computing/intel-outlines-architectures-for-agentic-ai-at-hot-chips-2026.html [44] Intel, “Intel accelerates process and packaging innovations,” Intel Investor Relations, Jul. 26, 2021. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intc.com/filings-reports/all-sec-filings/content/0001193125-21-224438/d199788dex991.htm [45] Intel, “Intel reports third-quarter 2021 financial results,” Intel Investor Relations, Oct. 21, 2021. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intc.com/news-events/press-releases/detail/1505/intel-reports-third-quarter-2021-financial-results [46] Intel, “3rd generation Intel Core processors bring exciting new experiences and fun to the PC,” Intel Investor Relations, Apr. 23, 2012. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intc.com/news-events/press-releases/detail/577/3rd-generation-intel-core-processors-bring-exciting
As A.I. Makes Law Firms More Efficient, Clients Ask: ‘Where’s My Discount?’
There’s growing pressure to move beyond the billable hour. But big firms aren’t ready to blow up their trusted business model.
Two astronauts who flew farther than anyone before are taking new NASA roles
Artemis II astronauts Victor Glover and Reid Wiseman are transitioning to emeritus status at NASA after their historic journey around the Moon earlier this year. The pair will continue advising and mentoring NASA teams as preparations accelerate for Artemis III and future lunar missions. Their experience with Orion and deep-space operations could prove especially valuable as NASA works toward returning astronauts to the lunar surface.
Press pool dispute escalates as White House cuts CNN from Air Force One travel
The White House has barred CNN from traveling on Air Force One this weekend. It's another chapter in President Trump's fight with the press, and it appears there will be no TV pool coverage today.
Week in Politics: Trump faces Republican defections; U.S.-China summit; press feud
Some GOP candidates are stepping back from unpopular Trump administration policies. Meanwhile, a U.S.-China summit at the White House and tensions with the press corps.
Saturday Sports: MLB playoff race; college football; NFL kickoff; Pope Leo on baseball
NPR's Scott Simon and sports reporter Michele Steele talk about the possible divine intervention on behalf of Chicago baseball.
Rosholt fourth-graders kick off yearlong NASA science program
Over the coming months, students will work in small groups called Crews to take surface temperature readings.
Video: Opinion | Will the Midterms Bring a Political Realignment?
This week in politics: Midwest realignment and what’s next for conservatives.
My favorite Pixel 11 Pro feature is something no other Android phone can match
It's been about 3 years since Google revamped Face Unlock on Pixel phones, and the Pixel 11 Pro reminded me just how magical it is.
Five stats from Juventus Women-Napoli
Juventus Women and Napoli Women face each other on Saturday, 26 September at 12:30 CEST on Matchday 1 of the 2026/27 Serie A Women season.Let’s take a look at five stats ahead of the match.150Juvent...
Do Wales have what it takes to survive League A?
Wales know the importance of preserving their Nations League A status but face a tough battle to stay in the top tier of the competition.
Yankees Handed Rotation Prediction for Red Sox Wild Card Series
For the second straight year, the New York Yankees will face the Boston Red Sox in the Wild Card Series. The question will be who the Yankees will go with to open the series, and WFAN’s Chris McMonigle already sees how New York will line up its rotation for this series. Rather than having Cam […] The post Yankees Handed Rotation Prediction for Red Sox Wild Card Series appeared first on HEAVY.
Why are Northern Ireland playing Ukraine in Slovakia?
Northern Ireland will head to Slovakia to face Ukraine in the Nations League
Team News and Predicted Line-Ups: Germany vs. Greece
Jurgen Klopp’s revamped Germany faces a surging Greece as injury setbacks force tactical shifts ahead of this pivotal Nations League clash at the WWK Arena.
Till vs. Romero Start Time, Full Fight Card Details!
Former Ultimate Fighting Championship (UFC) standouts Darren Till and Yoel Romero will face off against one another later TODAY (Sat., Sept. 26, 2026) in the main event of BKFC 94 from inside Manchester Arena, Manchester, England live on DAZN. It’s a bout between two former UFC castoffs who are looking to remain relevant in what […]
Which Premier League clubs seek compensation from Manchester City?
Manchester City have been found guilty of 114 of the 115 charges relating to alleged breaches of the Premier League’s financial regulations.The eight-time Premier League winners now face the possibi...
Svensson, Bellingham, Nwaneri and Bensebaini win for their countries
Daniel Svensson and the Swedish national team faced Romania in the UEFA Nations League. Svensson was not initially in the starting lineup, but came on in the 63rd minute with the score at 2-1 and help...
Opposition Lowdown: Tom Hounsell’s Wycombe Wanderers
Reading face a short trip along the M4 this Saturday when they visit Wycombe. Join us as we take a closer look at the opposition.
Israeli scientists help solve genetic mystery linking hearing loss and gray hair
Researchers from Tel Aviv University and international partners identified a rare genetic variant that disrupts hearing and may alter hair pigmentation.
I tried Microsoft’s new haptic Surface Mouse — standard mice now feel completely broken to me
This is a game-changer
Mt. Carmel claims over time victory against Olney
MOUNT CARMEL, Ill. (WEHT) — The Mt. Carmel Aces beat Olney, 38-30 in over time. The Aces will look to keep the win streak alive as they face Casey-Westfield next week.
England vs Spain – Predicted lineup and team news
England are due to face Spain, the reigning World Cup and European Championship holders, in their opening UEFA Nations League fixture on Saturday at the famous Wembley Stadium.The Three Lions come int...
At Meta Connect, the company's smart glasses were everywhere
The company behind Facebook and Instagram wants to keep consumers connected to the digital world via its ever-growing line of smart glasses.
Boston 25 News
On a beautiful Friday afternoon in Stow, business is brisk at Shelburne Farm. There is a big storm coming, and people are getting their weekend apples now.
Family of paralyzed Marine vet allegedly shot by migrant speaks out as health issue could delay testimony
Jimmy Friesenhahn, a Marine veteran paralyzed in a San Antonio shooting, faces a health crisis before trial, his family told Fox News Digital.
Monumental Sports & Entertainment and MedStar Health Celebrate $1.1 Million Gift to Services Supporting Women, Infants, and Community Pediatrics
/PRNewswire/ -- MedStar Health and Monumental Sports & Entertainment (MSE) are proud to continue their philanthropic partnership supporting some of the...
Monumental Sports & Entertainment and MedStar Health Celebrate $1.1 Million Gift to Services Supporting Women, Infants, and Community Pediatrics
/PRNewswire/ -- MedStar Health and Monumental Sports & Entertainment (MSE) are proud to continue their philanthropic partnership supporting some of the...
Supreme Court blocks Trump-backed Missouri congressional map
The ruling is a defeat for Republicans seeking to give their party an edge in the midterm elections for control of the House. It means voters will face a different map than the one used in the primary elections.
Supreme Court blocks Trump-backed Missouri congressional map
The ruling is a defeat for Republicans seeking to give their party an edge in the midterm elections for control of the House. It means voters will face a different map than the one used in the primary elections.
Maple Leafs Face Financial Headache Due to Star’s Bonus Payments
The Toronto Maple Leafs have a financial headache to deal with due to potential bonus payments to a budding star forward. The post Maple Leafs Face Financial Headache Due to Star’s Bonus Payments appeared first on HEAVY.
As Xi Leaves Washington, Divisions Still Simmer Beneath the Surface
President Trump welcomed Xi Jinping of China for a state visit that was heavy on pomp and ceremony. But surprisingly little time was spent on the issues that most divide the two superpowers.
ProTributeBands.com Clarifies Direct Booking Model for Corporate Event Entertainment Planners
SAN RAMON, CA - September 25, 2026 - PRESSADVANTAGE -ProTributeBands.com, the curated booking and lead generation platform for high-end tribute bands, has outlined how its direct-booking structure works for event planners seeking corporate event entertainment. Under the model, bands featured on the platform negotiate terms and close each booking directly with the client, while ProTributeBands follows up to keep the transaction moving smoothly.The structure separates ProTributeBands.com from traditional booking agencies that insert themselves into every contract. Rather than acting as an intermediary that controls the final agreement, the platform connects event planners, performing arts centers, festivals, wedding clients, and private party hosts with pre-screened, national-act-caliber tribute acts, then steps back so the parties can settle details themselves. The platform maintains contact with both sides to ensure momentum is not lost during the process.Founded by David Victor, former guitarist and co-lead vocalist of the multiplatinum band BOSTON, ProTributeBands.com features tribute acts covering artists such as Queen, The Beatles, ABBA, Journey, The Eagles, and Pink Floyd. Selected bands receive optimized profile pages and booking leads generated through the platform."Event planners often assume a booking platform means another layer of negotiation and markup," said David Victor, Founder of ProTributeBands.com. "The approach here is different. The bands negotiate terms and close each booking directly, which keeps the conversation honest and the details accurate. The platform stays involved by following up so nothing stalls between the first inquiry and the signed agreement."The direct-booking method reflects how corporate and private event planning typically operates. Planners frequently need to confirm technical requirements, stage dimensions, scheduling, and performance specifics with the people who will actually be on stage. By allowing those conversations to happen between the client and the band, the model aims to reduce miscommunication that can occur when information passes through a third party.ProTributeBands.com applies a screening process before an act appears on the platform, focusing on production quality, musicianship, and readiness for larger venues. The company ranks tribute bands across categories including Queen, The Beatles, The Eagles, Journey, Pink Floyd, and BOSTON tributes, drawing on performance quality and audience response.The ProTributeBands guide to hiring a tribute band offers additional context for planners weighing these decisions, covering topics such as understanding the audience and event, assessing entertainment value, viewing an act in person before hiring, and reviewing rider and insurance requirements. The guide addresses the practical considerations planners face when selecting an act for a corporate function, festival, or private celebration."A tribute production for a corporate audience has to hold the room the same way a headline act would," Victor said. "The vetting exists so planners can trust that the act they see listed can deliver at that level, and the direct-booking structure lets them confirm every detail with the band before committing."ProTributeBands.com serves clients across the United States and abroad, working with tribute acts that perform at performing arts centers, summer concert series, product launches, corporate parties, private parties, and wedding receptions. The platform also accepts artist submissions from tribute bands seeking consideration for inclusion. The company operates online at protributebands.com.###For more information about ProTributeBands.com, contact the company here:ProTributeBands.comDavid Victor(925) 236-0217hello@protributebands.com11040 Bollinger Canyon Road Suite E-938, San Ramon, CA 94582
Trump promised to campaign in midterm battlegrounds. He's starting in deep red states instead
While organizers insist the rallies are in locations with media markets that span state lines and they will help bolster broader turnout, Trump's itinerary is yet another sign of the uphill fight that his party faces.
Man City fans face up to reality of guilty verdict
How Manchester City fans have reacted to news that the club have been found guilty of a majority of the financial rule breaches they were accused of.
NeuroSense Provides Business Update and Progress for the First Half of 2026
/PRNewswire/ -- Therapeutics Ltd. (NASDAQ: NRSN) ("NeuroSense" or the "Company"), a late-stage clinical biotechnology company focused on developing...
Revisiting Collin Gillespie’s Breakout Potential for Phoenix Suns
As Phoenix faces a crossroads, the sharpshooting guard must expand his offensive repertoire and seize a high-volume role to transform from a reliable starter into a legitimate star.
Manchester City Could Pay a Bigger Price Than Any Sanction
Manchester City could face a much harsher penalty than just financial sanctions following the stunning news on Friday. The post Manchester City Could Pay a Bigger Price Than Any Sanction appeared first on HEAVY.
Lionel Richie Has Big ‘American Idol’ News Amid Recent Health Issues
Lionel Richie has given fans a major update about his future on American Idol. The singer recently faced health problems that forced him to step away from some work. Now, he has confirmed that he plan...
Kansas’ Offensive Line Faces Questions After Arizona State Loss
Kansas’ Offensive Line Faces Questions After Arizona State Loss
Microsoft stops insisting you need a "Copilot+ PC"
Microsoft's new Surface laptops forgo Copilot+ PC branding.
Report: Cubs, Red Sox Could Finish Series In Tampa
As a looming nor’easter forces scheduling shifts and doubleheaders, the regular-season finale faces a potential relocation to Tropicana Field to bypass Boston’s worsening weekend weather forecast.
watchOS 27 upgrades popular Apple Watch face with new options
Apple Watch offers lots of custom faces to personalize your Watch, and the popular Modular face gets even more versatile in watchOS 27.
Texas A&M Offense Faces Major Test Against LSU’s Dominant Defense
Texas A&M must protect Marcel Reed, establish the run and finish drives against an LSU defense allowing only 33 rushing yards per game.
Sherrill wants Caldwell to resign. If he stays, lawmakers may face an impeachment fight.
If he remains in office, the controversy could continue limiting her ability to travel outside New Jersey while intensifying pressure on lawmakers to consider impeachment.
MindsEye: Ex-GTA developer's studio faces closure
Build A Rocket Boy, founded by Leslie Benzies, has gone into administration after its debut game flopped.
Maple Leafs release former Stanley Cup champion right before season
The NHL season is just days away, and the Toronto Maple Leafs have made a notable roster move involving a familiar face as they continue trimming their squad ahead of opening night. Steven Lorentz was placed on waivers by the…
Montgomery County business owner pleads guilty in SEPTA bid-rigging case
A former Montgomery County business owner could face prison after pleading guilty in a SEPTA bid-rigging scheme.
Spring Health Opens VERA-MH Harm-From-Others Safety Rubric for Public Comment
/PRNewswire/ -- Spring Health, a global mental health company built on one AI-native platform, today expanded VERA-MH, the first open-source AI safety...
Avoiding complacency in business
Commentary: Complacency is one of the quietest threats a business can face.
Employees of Eddy Street restaurants discuss recent shooting, impacts on business
Employees from restaurants near Notre Dame say the recent shooting on Eddy Street has negatively impacted business. Gun violence in the neighborhood to the south of Notre Dame has spiked in the past two years.
Parker Health Group Names Mark Lenhard as Next President & CEO
/PRNewswire/ -- Parker Health Group, a nationally recognized nonprofit provider of aging services, announced today that Mark Lenhard, MS, LNFA, has been named...
In tight R.I. lieutenant governor’s race, Matos, Loughlin to face off in first debate
Republican John Loughlin is seen as having the best chance to win a statewide election for his party since 2006. But incumbent Lieutenant Governor Sabina Matos has an advantage, she doesn’t approach politics as a my-way-or-the-highway proposition.
A 'decent start' or are Liverpool 'underperforming'?
Defence looks sharp with the new additions, the middle looks imbalanced as we persist with Florian Wirtz. Gareth: Let's face it, we were spoiled in Arne Slot's first season. Iraola is still finding out about players and who will fit into his style of play.
Mets close out 2026 season against Nationals
The season ends with a whimper as the two bottom teams in the NL East face off looking to escape the cellar.
My Word: Gazan performance art
An opening act chanting “Free Palestine” and falsely accusing Israel of genocide sets the stage for more violence.
R360 rebel series given ultimatum on overdue accounts
The company behind R360, the controversial all-star rugby start-up, has been ordered to publish overdue accounts or face being dissolved.
A 60-beam ultraviolet laser flash-vaporized the surface of tiny diamonds so the blast would kick a shock wave through them, melting the hardest material on Earth at 12,680 degrees and 145 million psi, and solid diamond turned out to float on its own melt like ice on water
The experiments ran on the OMEGA laser at the University of Rochester's Laboratory for Laser Energetics, which fires 60 ultraviolet beams into a target
NFL gameday: Brock Purdy 'in prime' for San Francisco 49ers, Patrick Mahomes chases Tom Brady record and Dexter Lawrence leads Cincinnati Bengals Super Bowl charge
Watch the Los Angeles Chargers against the Buffalo Bills exclusively live on Sky Sports from 5.30pm on Sunday, before the Dallas Cowboys face the Baltimore Ravens in the first NFL game to be played at the Maracana Stadium in Rio de Janeiro, Brazil from 9.25pm
Assertive Professionals Awarded $14.7 Million DCSA Business Operations Support Services Task Order
/PRNewswire/ -- Assertive Professionals (AP), a Service-Disabled Veteran-Owned and Woman-Owned Small Business, has been awarded a task order by the Defense...
Gurucul Launches AI Risk and Response to Detect and Stop Risky AI Behavior Before It Escalates
LOS ANGELES, Sept. 25, 2026 — Gurucul has announced the general availability of Gurucul AI Risk and Response, bringing behavioral AI to the growing attack surface created as AI moves from assistant to actor. With hundreds of AI detections connecting activity to identity, access, data and broader security telemetry, the solution helps SOC and Insider […]
Friendly, another poor showing for Ancelotti's Brazil
Brazil got away with one...In their first match since the 2026 World Cup, Brazil faced Australia in a friendly this Friday at noon.Three months after their unfortunately historic round-of-16 eliminati...
Juventus to Send Out Scouts for a Few Brazilian Talents
Juventus reorganized their management very late last summer and faced a race against the clock. Instead, the officials will have more time to scout and shortlist players ahead of January and especiall...
Democrats press RFK Jr. on an ethics agreement change involving law firm fees
Health Secretary Robert F. Kennedy Jr. faces scrutiny from congressional Democrats over ethics disclosures | Newsradio 1140 WRVA
Grand River businesses experience influx of students with campus outages
Dining halls served adapted menus to cater to the lack of gas, but limited options led many students to Grand River Ave businesses instead.
Microsoft unveils Copilot super app, targeting business users with AI agents
Microsoft is launching its super app as a central interface through which customers can chat with AI bots, write code, and access a new "Autopilot" feature that brings agentic capabilities to its flagship AI app.
Can the Left Make America Fun Again?
Hi friends, I’ve got a piece in The New York Times today about how collective joy — participatory, youthful, anti-corporate — can defeat Trumpism and transform our lives. The basic argument is that politics used to be embedded in communal life: dances, sports leagues, union halls. As that infrastructure disappeared — and more of everyday life was atomized and privatized — politics became something broadcast at people rather than something they did together. NYC-DSA and Zohran provide another model, where socials and face-to-face organizing are tied to a fight vs the corporations that fenced off so much of the good life. Rebuilding that kind of collective fun, I argue, could help bring young people back into politics and, by redistributing America’s wealth, make everyday life more joyful. I would super appreciate it if you’d read the piece, share it, or post comments on it. Thank you! p.s. FYI, Opinion writers don’t get any say over their headlines! More Take action to support the fight of licensed deck officers at Alaska Tanker Company and Overseas Shipholding Group to win a first union contract. This is one of the most important, and underreported, unionization campaigns in America: these workers have a huge amount of power over domestic energy distribution and maritime supply chains, and they’re still without a contract two years after having voted overwhelmingly to unionize. Please sign the public petition here, and if you’re an academic you can sign this support letter.
No. 7 Ohio State faces Big Ten opener against Illinois
With three important October road tests on the horizon, Day is seeking more balance on offense
Netanyahu turned the UN into campaign theater – but will Israelis buy the show?
NATIONAL AFFAIRS: The prime minister presents himself on the global stage as a leader uniquely equipped to defend Israel in a hostile world, seeking to bring that same message home to Israeli voters.
The hard choice Democrats face on Republicans’ anti-trans attacks
They’re being bombarded with attack ads. How do they respond without betraying a vulnerable community?
‘Worth the wait’: Social science faculty members describe move to newly renovated 2001 Sheridan Road
For decades, much of Northwestern’s anthropology department had been working out of a two-story house at 1810 Hinman Ave., an Evanston landmark which has faced maintenance issues and is nearly as old as the university. But starting in the 2026-27 academic year, anthropology is one of multiple social science departments moving into one of the...
Surprising Short-Notice Welterweight Bout Added to UFC 332
A surprising short-notice welterweight bout has been added to UFC 332, which takes place next Saturday night.As first reported by MMAMania.com, welterweight prospect Jacobe Smith will return to the Octagon to face UFC newcomer Bruce Whitehead in a surprising booking that has MMA fans scratching their heads.Heavy’s Marcel Dorff further confirmed that Smith vs. Whitehead […] The post Surprising Short-Notice Welterweight Bout Added to UFC 332 appeared first on HEAVY.
Kath Smith: Winning breeds winning
Leeds United Women will once again travel to Silsden AFC to face West Yorkshire rivals Bradford City Women, with the two sides meeting in the final Group T fixture of the FA WNL Cup.The Whites current...
Women's Preview: Whites face Bradford in FA WNL Cup
Leeds United Women travel to Silsden AFC for the second week running, this time facing Bradford City Women in the FA WNL Cup after securing victory over Sunday’s hosts in the league last weekend.The...
Wellness kiosk in the Memorial Union makes it convenient for OSU community to buy basic healthcare products, STI tests and more
A new vending machine in the basement of the Memorial Union on Oregon State University’s Corvallis campus is now stocked with a variety of over-the-counter healthcare products, from cortisone to contraceptives to COVID tests.
France XI vs Turkiye – Predicted lineup and team news
France and Turkey are set to face off in their first UEFA Nations League A match on Friday, with the game taking place at the Turca Arac Muayene Kocaeli Stadium.France begins this campaign under the l...
The World Health Organization in crisis
The World Health Organization faces a deepening crisis of funding, authority and relevance as alternatives emerge for disease surveillance and emergency response.
Olympiacos Eyeing OFI Goalkeeper as Panathinaikos Complicates Move
Olympiacos face a strategic battle for OFI Crete's Nikolaos Christogeorgos, as a complex resale clause grants fierce rivals Panathinaikos the power to hijack the deal.
Brazil XI vs Australia – Predicted lineup and team news
Brazil is heading across the globe to face Australia on Friday at Queensland Country Bank Stadium, marking their first game since the World Cup.Brazil arrives in this new chapter keen to move on from ...
Rob Pelinka Confirms Luka Doncic Influenced Offseason Moves
The Los Angeles Lakers have put their full trust in Luka Doncic as the face of the franchise. General Manager Rob Pelinka confirmed that Doncic was strongly involved into the decisions he made to build a team around the All-NBA superstar. Moves like adding center Walker Kessler and extending Austin Reaves to a long-term contract […] The post Rob Pelinka Confirms Luka Doncic Influenced Offseason Moves appeared first on HEAVY.
Microsoft Copilot+ Branding Disappears from Latest Surface PCs
Microsoft's recent Snapdragon-powered Surface Laptop and Surface Pro launch was surprisingly absent the usual Copilot+ branding, aside from as a callout to the inclusion of the actual AI assistant on the devices. Apparently, this was an intentional branding change, according to Surface Corporate...
What Kotek, Drazan said at Oregon business forum
Gov. Tina Kotek and Sen. Christine Drazan faced off for the first time this election at a Portland business forum. Here's where they stand on taxes, tariffs and Oregon's economy.
Congo faces health worker shortage as Ebola remains out of control, WHO says
Congo is running short of health workers to staff treatment centers for history's fastest-growing Ebola outbreak, particularly in the eastern province of North Kivu where cases have surged 73% over three weeks, the World Health Organization said Wednesday.
Open AI attacked Australia’s health system – and then doubled down on its negligence. The time for ‘wait and see’ is over
Human hackers face serious consequences, and so must AI companies. There is no excuse for what happened
Pa. lawmakers face deadline to regulate and tax skill games
Pa. lawmakers have less than three weeks to reach a deal on skill games, including how to regulate and tax the machines.
Montana State Employee Health Plan Costs Change Under New Union Agreement
The State of Montana Benefit Plan faces rising medical and prescription drug costs. The state says its self-funded plan is expected to see nearly double-digit h
Students try health care careers at Finley Hospital amid worker shortage
Dubuque students got a hands-on look at their potential future in health care on Thursday as the U.S. faces a projected 250,000 worker shortfall in the industry by 2038.
Medicare Beneficiaries with Multiple and Complex Health Needs Face Challenges
New KFF polling focuses on the health care access and affordability challenges among adults with multiple or complex health conditions, including older Medicare beneficiaries. The results suggest important opportunities for policymakers to strengthen Medicare access and affordability. Medicare Beneficiaries Often Have High Health Needs Many Medicare enrollees have multiple or serious health conditions. More than […]
Conflict mapping research group founded by OSU researcher wins national award for open science
The American Geophysical Union has awarded the 2026 Open Science Recognition Prize to the Decentralized Damage Mapping Group, an international research team co-founded by Oregon State University Professor Jamon Van Den Hoek and postdoctoral scholar Corey Scher.The prestigious award is in recognition of DDMG’s contributions of satellite mapping data of regions beset by war, conflict or natural disasters to the public sphere, particularly to aid in humanitarian response and provide journalists with up-to-date information.
Paolo Banchero Plummets in Latest NBA Player Rankings
Despite elite production and playoff heroics, efficiency concerns and inconsistent decision-making have sparked a significant slide for Orlando’s cornerstone as he faces a pivotal make-or-break season.
Acuña’s Health And Sale’s 200 Strikeouts Define Braves’ Playoff Run
Ronald Acuna Jr. returns without a limp while Chris Sale hits 200 strikeouts. The Braves look healthy but face a shaky offense heading into the postseason.
Acuña’s Health And Sale’s 200 Strikeouts Define Braves’ Playoff Run
Ronald Acuna Jr. returns without a limp while Chris Sale hits 200 strikeouts. The Braves look healthy but face a shaky offense heading into the postseason.
Who Replaces Labaron Philon Jr for Alabama Basketball
Alabama basketball faces a major offensive problem with the loss of Labaron Philon Jr. Despite testing the NBA waters his freshman year, Philon Jr. decided to return to Alabama. In his sophomore year, Philon took a massive step in his game, becoming more than just a good defender and decent scorer. Last season, he averaged …
This Book Made Bill Nye the Science Guy
Bill Nye joins Books That Changed My Life to discuss the Newbery Medal-winning novel that set his life’s course: "Carry On, Mr. Bowditch."
Gemini 3.8 Live with Live Avatar gives Google’s AI a face
The AI avatar can transition between 97 languages.
Novellia Named One of Crain's New York Business' 2026 Best Places to Work in NYC
/PRNewswire/ -- Novellia, the patient data company that unifies a person's clinical histories across every system, practice, and provider they've used, today...
Trail Blazers Should Let Their Newest Players Grade the Team
Fresh faces provide a unique lens to test Portland’s chemistry, forcing veterans to refine their communication and ensuring new coach Micah Nori’s system is truly battle-ready.
Microsoft’s New Surface Laptops Embody the PC-Phone Marriage Snapdragon Promised Years Ago
Qualcomm's PC chips were developed with the company's phone DNA. Two generations in, we're seeing payoffs.
FSU HEALTH COMMUNICATION EXPERT FINDS GLP-1 USERS FACE STIGMA WITHIN THEIR SOCIAL CIRCLES
Sept 24 2026 – People taking popular GLP-1 medications such as Ozempic, Wegovy and Zepbound may face stigma from those closest to them, according to a new study by a Florida State University professor. Braidyn Lazenby, an assistant professor at FSU’s College of Communication & Information, led the study “‘They Call Us Cheaters:” Exploring Stigma […]
Scientists Discovered a Mysterious Force Eating Away at Cars, Bridges, and Monuments
When water slides on a surface, it can pick up an electric charge—and that can have consequences for metals exposed to the elements.
OpenAI agent hacks Australian healthcare database
The AI company informed Australian authorities of the incident on Sept. 10.