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Should Juventus start thinking of replacing Spalletti?
Having a look at the history of Juventus CEO Giovanni Carnevali shows that managers are usually safe under him, and they are often given enough chances to turn things around.He has now spoken about th...
Borderless Gaming adds DLSS 5 Neural Rendering without modifying game files
Borderless Gaming can now apply DLSS 5 Neural Rendering without replacing game DLLs or modifying game files. The quantized BGFX effect can run on GPUs including the RTX 3090.
The Best Way to Eat Avocados for Better Heart Health
Avocados are packed with fiber, healthy fats and micronutrients. Learn how replacing saturated fats with this fiber-rich fruit can support your heart health.
AI isn’t replacing workers. It’s creating bosses.
The boom of startups is good news for workers — and a challenge to labor laws written for another era.
Man City v Coventry: Key stats and talking points
Life back in the Premier League after 25 years away does not get any easier for Coventry City. Manchester City flexed their muscles last time out with a 4-1 win over Crystal Palace. After only just edging past Bournemouth in their first game, new head coach Enzo Maresca has enjoyed an encouraging start in the unenviable position of replacing Pep Guardiola.
LinkedIn adds a button to report AI-generated 'slop'
LinkedIn is introducing new ways to reduce low-quality AI-generated posts, including a “seems like AI slop” reporting option. It's also replacing its own AI writing feature with a proofreading tool.
Old Dominion University Selected for Two Federal Genesis Mission Awards Advancing Artificial Intelligence for Scientific Discovery
The next generation of scientific discovery will not come from artificial intelligence (AI) replacing scientists. It will come from AI helping them ask better questions, solve more complex problems and reach reliable answers faster.
Highmark Health Plans names new president
Gustavo (Gus) Giraldo has been named president of Highmark Health Plans, replacing Tom Doran, who is leaving the organization to pursue other opportunities,...
Eagles bring preseason standout back on the practice squad
Replacing some CB depth that they lost earlier in the week.
How Maresca is tackling football's impossible job
Enzo Maresca seemingly took on an impossible job in the summer when replacing the legendary Pep Guardiola at Manchester City, but is making it look an easy task in the early stages of his tenure.
Ernst and Young selects new Boston managing partner
Brendan McCorry, a 34-year EY veteran, takes over as Boston managing partner, replacing Jane Steinmetz, who was promoted to lead the firm's Northeast region.
Hydrogen-powered shipping could deliver $284 billion in annual health benefits
Researchers modeled how replacing conventional global shipping fuels with hydrogen could change PM2.5 and ozone pollution, premature mortality, and monetized health benefits. Under complete transition, the model estimated 129,458 fewer premature deaths and US$284 billion in annual monetized health benefits, although some regions experienced increased pollution from hydrogen production or altered ozone chemistry.
Gemini app replacing Gems with skills in November
In 2024, Google introduced Gems as “custom versions of Gemini.” The Gemini app will soon replace Gems with “skills.”
Fox Business reveals replacement for Maria Bartiromo's morning show
Fox Business Network revealed the new lineup replacing "Mornings with Maria" after Maria Bartiromo's sudden exit.
Mattel Picks Roger Lynch to Lead Toy Company After Ynon Kreiz Exit
Condé Nast chief Roger Lynch will become chairman of Mattel on Oct. 2 and CEO by Nov. 2, replacing Ynon Kreiz, who is leaving for another…
Drew Brees replaces Maxx Crosby on SiriusXM’s ‘Let’s Go!’
The media renaissance of Drew Brees continues unabated. Not only will the former New Orleans Saints quarterback embark on his first full season in the booth alongside Adam Amin for the NFL on Fox, but the 47-year-old will also co-host SiriusXM’s Let’s Go! alongside Matthew Stafford, Jim Gray and Peter King, effectively replacing Las Vegas…
Fall fashions, accessories that are going out of style, from stylists
We asked stylists about jacket, shoe, clothing, and accessory trends going out of style this fall, and the fashions worth replacing them with.
‘He’s irreplaceable’: How Lindsey Graham made an indelible mark on foreign policy and Trump
Republicans have confronted the reality that there will be no replacing Graham when it comes to foreign policy or as a conduit to Trump.
Full interview: Southcoast Health offers total joint replacement program
Replacing a joint is no simple feat, but the process has come a long way thanks to advanced technology, and the procedure can greatly improve a patient’s quality of life.
‘GTA 6’ Publisher Dismisses Digital Replacing Discs Controversy
'Grand Theft Auto 6' will only be sold digitally, and now Take Two is dismissing complaints about that, saying its business is already digital.
Stevenson School opens new science and math centers in Del Monte Forest
Stevenson School has opened two new academic centers, replacing an older building and featuring eco-friendly designs funded entirely by donors.
How University Core Curriculums Are Getting Political
Politics and other factors are causing universities to reconsider what classes are core requirements. In some places, civics and classics are replacing climate change and sociology.
Bill Gates wants to tax robots to deter businesses from replacing humans with machines
"The tax system nudges you toward replacing people with machines."
Luc Holtz set to leave Ligue 2 side FC Metz
Luc Holtz, who only arrived at FC Metz this summer, replacing Benoit Tavenot, is set to be sacked, as per a report from L’Équipe. The Ligue 2 club are already working on nominating a replacement fo...
Newrez, eXp Realty Form Joint Venture To Target Purchase Business
eXp Realty is replacing Kind Lending with Newrez as its mortgage joint venture partner, bringing one of the nation's largest nonbank lenders into its national real estate network in a move that could expand Newrez's reach into purchase lending.
ChatGPT for Mac adds opt-in Computer History feature, replacing Chronicle
OpenAI is giving ChatGPT and Codex a new way to learn from and remember how you use your Mac, even...
J.J. Watt officially announced as CBS Sports' lead NFL game analyst, replacing Tony Romo
J.J. Watt was promoted to CBS' top broadcasting crew after Tony Romo was placed on leave.
Why a food and drinks giant is betting big on crop science
At a multigeneration family farm in Alberta, drones and data are replacing guesswork—part of PepsiCo’s broader bet that healthier soil means a more resilient global supply chain
Colts' Alec Pierce Officially Lands On IR, Replaced On Roster
The Indianapolis Colts placed wide receiver Alec Pierce on injured reserve on Saturday, replacing his roster spot with another receiver from the practice squad.
Gemini app gains new ‘Map’ tool, replacing ‘/’ with ‘@’
Google has introduced a “Map” tool to aid your location-based Gemini app prompts on Android and iOS. Meanwhile...
Saber denies replacing Rideshare Stimulator’s writers with ChatGPT
Stella Sacco says Saber is “trying to have it both ways” on AI.
Democrats Reset the Maine Senate Race. Now Comes the Tricky Part.
Troy Jackson is replacing Graham Platner, but Republicans are seeking to tie them together as a remade race kicks off with high stakes.
M6 iMac Coming This Year in New Colors
Apple is readying new iMac models with an upgraded chip and new color options, according to Bloomberg's Mark Gurman. Writing in his latest Power On newsletter, Gurman says the new version is likely to be an updated 24-inch model with an M6 chip, replacing the existing M4 model that arrived in October 2024. New colors are also said to be on the menu, though Gurman does not say what they are. The current iMac comes in seven colors, including green, yellow, orange, pink, purple, blue, and silver.
I tried replacing Photoshop, Lightroom, and Acrobat with free vibe-coded alternatives, and they're surprisingly good
Got to give credit where credit's due
Developer Eyes Clearwater Golf Course for $180M Sports Complex
Developer proposes replacing Clearwater's municipal golf course with a $180 million sports and entertainment complex.
As shortfall looms, Pillen installs allies on board meant to keep politics out of budget forecast
In an unprecedented move, Gov. Jim Pillen has reshaped the state board that predicts Nebraska’s tax revenues for budget writers, replacing three members with appointees that include two former Republi...
Sen. Darline Graham wins her first election
Sen. Darline Graham has won the special Republican Senate runoff in South Carolina, replacing her late brother, Sen. Lindsey Graham, on the general election ballot. CNN’s Dianne Gallagher reports.
Kyndryl Report: As AI Broadens Modernization Agenda, Leaders Prioritize Business Outcomes Over Replacing Legacy Systems
Global survey reveals how 2,000 business and technology leaders are addressing AI-driven demand across IT elements Nearly half of organizations are behind...
Matt Campbell Surprised With Iowa State Head Coach Hiring
Matt Campbell was surprised the route the Iowa State Cyclones took replacing him as head coach.
AI identifies 800 plant proteins for sustainable food emulsifiers
Scientists at the University of Leeds have developed an AI-driven process capable of rapidly identifying plant proteins with emulsifying properties, potentially replacing synthetic and animal-derived alternatives in food and cosmetic applications.
Ikea closing Bolingbrook location for small-format Naperville store
Ikea is replacing its Bolingbrook location with a smaller-format store in Naperville in 2027, part of the Swedish furniture retailer's shifting strategy.
AI race redraws Asian air cargo, replacing e-commerce as growth engine
The global race to build artificial intelligence is redrawing Asia's air cargo map, prompting airlines to redesign networks around growing semiconductor manufacturing hubs as cross-border e-commerce loses momentum.
Business 77 could go from freeway to boulevard under TxDOT plan
TxDOT is proposing changes to US Hwy 77 Business in Waco, replacing aging infrastructure and adding accommodations.
McDonald’s replaces U.S. boss after slowest growth in over a year
The chain named long-time executive Skye Anderson as president of its US business to lead turnaround efforts, replacing Joe Erlinger, who is leaving the company and has held the role for about seven years.
Unified Communications Platform Helps Businesses Simplify Communications Across Sparklight Service Areas
Sparklight Business Launches Unified Communications Platform Sparklight Unified Communications helps businesses simplify communications with cloud-based voice, messaging, video meetings and collaboration. Cloud-based communications platform combines voice, messaging, video and collaboration into a single platformSupports office, remote and hybrid workforces with desktop and mobile accessIntegrates with Microsoft Teams while replacing traditional on-premises phone systemsFlexible, scalable soluti
County Approves Affordable Housing and Health Facility in Logan Heights
The Board of Supervisors Tuesday approved the construction of 121 affordable homes and a health care facility on surplus County property in Logan Heights. For the first time in the County’s surplus-land housing program, the development includes replacing an aging health clinic on the site.
Keane presence at Celtic Park defeat played down
Despite many putting two-and-two together following Roy Keane's appearance at Sunday's defeat by Rangers, the former Celtic midfielder and friend of under pressure current boss Martin O'Neill made it abundantly clear on the most recent Stick to Football podcast he would never attend a game with the ulterior motive of replacing a manager. Reacting to Celtic's defeat by Rangers, Roy Keane remarked to Celtic AM that it was the "ups and downs of football".
Valorant Player Banned Due To Previous GPU Owner’s Cheating
In a wild coincidence a German player was penalized over the playing habits of their Ryzen 7's previous owner, claiming that nothing short of replacing the entire PC will overcome Riot's infamous anti-cheat detection
Saber Interactive denies replacing writer with AI
Saber Interactive has denied replacing a writer with ChatGPT on its upcoming driving game Rideshare Stimulator.
Cardinal Newman reloads for title defense with Atlantic transfers
Replacing championship MVP Jyron Hughley won't be easy. Cardinal Newman hopes transfers Pedro Martinez and Justin Barrera can help.
Rosie O’Donnell joins “The Rocky Horror Show” on Broadway after successful gig guest-hosting “Jimmy Kimmel Live”
The former talk show host is set to take the stage next month, briefly replacing Rachel Dratch.
'Cahill calm over owners unlikely to ease fan concern'
Tim Cahill has suggested Everton fans should not be concerned about the owners' lack of visibility and that supporters "have to be careful what you wish for". Most understood The Friedkin Group needed time to unpick the tangled financial web left behind by the Farhad Moshiri era. The early business deals, such as consolidating the club's high-interest debt and replacing it with a long-term financing deal with JPMorgan Chase, felt a healthy step forward.
How telehealth is helping close the healthcare gap in rural Zimbabwe
Virtual consultations are replacing hours of travel, bringing affordable healthcare closer to rural Zimbabweans.
Gemini app expands Google Maps Personal Intelligence, replacing Deep Think
Besides coming to Android Auto this week, Personal Intelligence in the Gemini app is also expanding its Google Maps integration.
Funding forensic science is essential to keeping New Mexico’s justice system working - NM Department of Public Safety
At the New Mexico Department of Public Safety’s Forensic Laboratory, continuing to produce reliable, accredited results is not necessarily about chasing the newest technology. Often, it is about replacing equipment that has simply reached the end of its useful life. That distinction is important as the state considers how much to invest in the laboratory […]
Trump announces staff secretary Will Scharf will be his new White House counsel
President Donald Trump says Will Scharf will be the new White House counsel, replacing David Warrington
Ceramic Apple Watch Rumored to Return With Series 12
Apple plans to resurrect its ceramic Apple Watch casing with this year's Series 12 model, according to the leaker and prototype collector known as "Kosutami". In a new post on X, Kosutami said that the casing will return with the Series 12. Apple first introduced a ceramic Apple Watch Edition with the Series 2 in September 2016, replacing the original gold Edition model and bringing the line's price down from thousands of dollars to a comparatively modest $1,249.
Gov. Braun appoints new public access counselor after complaints mount
Former Bartholomew County Circuit Court Magistrate Judge Brittney Long has been named Indiana’s public access counselor, replacing attorney Jennifer Ruby, whose 18-month tenure in that job was marked by long
SpaceX Is Betting on Cybertrucks to Save NASA Astronauts in an Emergency
Tesla's controversial vehicle is replacing a tactical military transport designed to deflect landmine blasts.
VA accelerates electronic health record rollout
After years of delays, the Department of Veterans Affairs says its federal electronic health record (EHR) program is now firmly back on track. VA Secretary Douglas Collins has accelerated the program with a renewed goal: full deployment across all VA medical centers by 2031. A major governance overhaul, replacing multiple competing councils with a single decision-making body, has cut through bureaucratic delays and allowed the VA to move faster and more consistently. Deputy Secretary Paul Lawrence has taken a hands-on role, including visiting deployment sites and holding daily meetings with Oracle Health to ensure front-line clinicians have what they need. Here’s how the rollout is going, according to the VA: The federal EHR has only experienced four outages since December 2025. The system has gone nearly two consecutive years without a major incident. It is currently live at six sites, supporting care for over 188,000 veterans. The system creates a lifelong medical record, integrating data across the VA, the Department of Defense and private community providers. With the first new deployments underway and four Michigan medical centers already live in 2026, the VA is entering its first true expansion phase since the program’s reset. Officials say the system’s improved stability, streamlined governance and standardized national workflows have cleared the obstacles that once stalled progress. With 13 sites scheduled for deployment in 2026 and a market‑based rollout strategy guiding future waves, the department believes it’s finally positioned to move at scale toward a modern, fully interoperable EHR, advancing steadily toward its goal of reaching every VA medical center in five years.
Founder-Led Growth Is Replacing The Old Business Playbook
Most of the money founders spend on growth adds complexity and never builds trust. Here are the 4 parts of founder-led growth that make people buy before you pitch.
Who is Josh Hoover? Meet Indiana's new QB1 replacing Fernando Mendoza
Curt Cignetti is hoping a transfer portal quarterback can take Indiana back to the promise land.
Trump announces staff secretary Will Scharf will be his new White House counsel
President Donald Trump says Will Scharf will be the new White House counsel, replacing David Warrington.
CERN has begun disconnecting the Large Hadron Collider
CERN has started replacing some of the Large Hadron Collider’s most important magnets as part of its High-Luminosity upgrade. The new superconducting magnets will produce fields about 40% stronger, allowing particle beams to be squeezed more tightly before they collide. That should create far more collisions for the ATLAS and CMS experiments to analyze, giving physicists a much larger window into the fundamental workings of the universe.
KFC replacing Pepsi with Coca-Cola at 3,700 US restaurants after nearly four decades
KFC will replace Pepsi with Coca-Cola at all U.S. restaurants by spring 2027, ending a beverage partnership that lasted nearly four decades.
As Food Companies Ditch Artificial Dyes, What Does Science Say About Their Health Effects?
General Mills has removed artificial colors from all of its U.S. cereals, including Lucky Charms and Trix, replacing synthetic dyes with colors derived from fruits, vegetables and spices such as turmeric and paprika. The move comes as food companies face growing pressure from consumers, retailers and policymakers to eliminate artificial dyes. GW public health experts are available to discuss what this shift means for consumers and what we actually know about the health effects of artificial foo
Utah football position preview: Offensive line entering 2026 fall camp
Replacing five NFL-bound starters, a veteran transfer and highly touted recruits battle to anchor the trenches and protect the Utes’ high-powered offense during a championship hunt.
Meet new Miami Dolphins head coach Jeff Hafley
Jeff Hafley, who had been the Green Bay Packers defensive coordinator, was introduced to South Florida on January 19, replacing the fired Mike McDaniel.
A familiar Android feature is disappearing and users have plenty to say
Google is replacing Google Assistant with Gemini on Android phones, with some users reporting issues during the transition.
Why so many women are replacing Kegels with this pelvic floor trainer
Pelvic floor disorders affect millions of women, but many struggle to perform Kegel exercises correctly. Here's how the Pelvic Partner provides real-time feedback.
Oil Price Spike Strengthens Business Case for Replacing Polluting Diesel Trucks With Cleaner Alternatives, Especially RNG, Updated Energy Vision Report Finds
The NGO Energy Vision today issued an update of its 2025 report "A Path to a Healthier America: Ditching Old Diesel Trucks" which explores replacing aging, polluting heavy-duty diesel trucks with clean alternatives. The updated version takes into account the 60% rise in diesel prices (currently $6.23/gallon nationwide, $8.15 in California) since the Iran War.
Consumer apprehension grows as US retailers adopt AI-assisted pricing tools
U.S. consumers are uneasy about the increasingly high-tech ways that restaurant chains and major retailers are setting prices. Digital price tags are replacing paper ones in grocery aisles. AI tools
New Science Says Scrapping A Working Gas Car For An EV Is Usually Greener
New lifecycle research finds that scrapping some working gasoline cars early and replacing them with EVs can substantially cut cumulative emissions.
The four unsolved problems threatening to derail Liverpool’s season
SEASON PREVIEW : Taking over an unfinished squad and an injury prone defence while tasked with fitting in last year’s expensive signings and replacing Mohamed Salah means Andoni Iraola inherits many of the issues that plagued Arne Slot’s second season, writes Richard Jolly
Lack of Center Depth Could Lead to Disaster for 76ers
Joel Embiid will be healthy to start the season. If he doesn't make it through the season, the 76ers will have a hard time replacing his production.
New Fox Business Network FBN Lineup Replacing Maria Bartiromo
FBN will replace Bartiromo's old timeslot with 'Big Money in the Morning,' with new co-hosts for the lunchtime program and Li Claman adding a Friday evening program.
Fulham 2-3 Crystal Palace
Tom: Who would have thought that replacing Premier League experience with novices on and off the pitch would backfire almost immediately? If we don't win before the international break, then Alvaro Arbeloa will have to go. Brian: We knew it would be a massive change from Marco Silva as the majority of players were/are his and that losing Harry Wilson and Raul Jimenez would change the dynamics.
WVU Health signs appear at Independence Health hospitals as systems work to finalize acquisition
Signs of West Virginia University Health System’s acquisition of Independence Health System, slated to be finalized in October, are popping up in Westmoreland County — literally. Workers from Blue Sky Sign Co. removed the “Independence Health System” letters posted in front of Westmoreland Hospital in Greensburg on Aug. 19, replacing
How AI is reshaping microdramas as video format takes a ‘generational jump’
Microdrama industry insiders share effects of recent AI advances, from aiding editing to replacing actors. Is it a useful tool or a curse?
810 Entertainment replacing Punch Bowl Social in Downtown Commons
Founded in Myrtle Beach, South Carolina, 810 Entertainment will fill a spot previously occupied by Punch Bowl Social in Sacramento's Downtown Commons.
City Council advances plan to replace KC's minority- and women-owned business program
Kansas City is replacing its Minority- and Women-owned Business Enterprise program with a broader program designed to help more businesses than before while still abiding by new legal rulings.
Game AI Expert on Where AI Actually Belongs in Game Development
Luke Dicken has been researching AI technology for gaming for decades, and he joined us to share his perspective on the history of AI in games, modern generative AI, game development, production pipelines, player personalization, and why the industry's biggest opportunity doesn't lie in replacing human talent.
UCLA fires AD Martin Jarmond, hires ex-Lakers exec Tim Harris
UCLA chancellor Julio Frenk announced on Monday that Martin Jarmond's tenure as UCLA athletic director is over, replacing him former Lakers executive Tim Harris.
A Major Labor Boom in CNY? Not Here Yet
With so many major projects going on — Micron, I-81 viaduct and others — job growth is predicted to increase. But so far the number of jobs in the region has declined By Aaron Gifford [caption id=attachment_11065 align=alignright width=350] Amy Stage, deputy director at the Manufacturers Association of Central New York (MACNY): “For us, the conversation isn’t just about filling jobs. It’s about creating sustainable pathways that help people see a future for themselves in manufacturing.”[/caption] The I-81 viaduct project in Syracuse and Micron facility construction in Clay are expected to create a major labor boom for Central New York. But for the time being, the number of jobs here has actually decreased in the past year. The New York State Department of Labor reported that, for the annual comparison of June 2025 to this past June, private sector jobs decreased by 2,200 or less than 1% to 260,000. Job gains were concentrated in leisure and hospitality (+700), private education and health services (+400) and other services (+300). Job losses for that annual period were reported in the areas of trade, transportation and utilities (-1,500); professional and business services (-1,000); financial activities (-500); mining, logging and construction (-300); manufacturing (-200); and information (-100). The public sector job count rose over 12 months, with most growth concentrated in education, the state Department of Labor reported. Looking ahead, the Central New York economy is expected to benefit from both the Micron and I-81 viaduct projects over a period of several years. Initial job growth is foreseen in construction and computer and electronic manufacturing. Spin-off jobs will be created in the areas of professional and business services, health care and education, the state Department of Labor said in an email response to Oswego County Business magazine. “Population growth tied to the buildout of Micron Technology semiconductor complex in Clay is also expected to bring more workers and residents to the region, increasing demand for transportation services,” the agency said. New York Department of Labor highlighted current or projected job growth trends in various sectors. An increase in defense-related contracts at local high-tech employers has continued to support employment growth in the computer and electronic product manufacturing sector and Micron is expected to generate thousands of direct and indirect jobs as the project progresses. This sector paid an annual average wage of $117,500 in 2025 and employment in the sector is projected to grow by over 60% through 2032, making it the fastest-growing industry in the region. Typical occupations in this industry include electrical, electronic and electromechanical assemblers, software developers and industrial engineers, the state agency reported. Specialty trade contractors include several different types of tradespeople — electricians, plumbers, pipefitters and steamfitters and HVAC (heating, ventilation and air conditioning) mechanics and installers. Many of these positions are trained through apprenticeships, the state Department of Labor reported. The Interstate 81 construction project is generating local jobs, including construction laborers, projected to grow at a 6.4% rate, and operating engineers and other construction equipment operators, projected to grow at a 7.3% rate over the next several years. Construction of the Micron Technology facility is also “creating thousands of job opportunities that will continue over the next two decades,” the state agency reported. The specialty trade contractors sector paid an annual average wage of $86,200 in 2025. For Central New York, the challenge isn’t creating jobs, it’s filling them. Amy Stage, a deputy director at the Manufacturers Association of Central New York (MACNY), said meeting this unprecedented growth is a much larger task than just replacing retirees. “We’re seeing workforce gaps at every experience level,” she said. “Companies need entry-level employees, experienced technicians, supervisors, engineers and skilled trades professionals. The opportunity is tremendous, but we need more people entering these career pathways.” Employers are looking for people who can troubleshoot, read technical information, use computers and learn new processes, not just perform repetitive production work, Stage said. To address this demand, the MACNY created the Manufacturers Talent Institute, which aims to connect students and job seekers with meaningful career pathways while helping employers build their workforce. Twenty-one companies have so far signed up to provide opportunities for more than 800 students. “For us, the conversation isn’t just about filling jobs,” Stage said. “It’s about creating sustainable pathways that help people see a future for themselves in manufacturing.” Several manufacturing facilities in the region are in the midst of expansion: • TTM Technologies, a leading U.S. manufacturer of advanced electronics and interconnect solutions for aerospace, defense and high-technology markets, which has a plant in DeWitt, completed its buildout of an additional facility, adding 400 jobs and expanding production of high-tech circuit boards for defense and critical electronics applications. • In Cortlandville, the Byrne Hollow Crossing Plant, a dairy manufacturing and processing facility, is increasing its operations, creating 100 new jobs. • The Chobani yogurt company is building a 1.4-million square foot dairy processing facility in Oneida County. This will create more than 1,000 good-paying jobs and double Chobani’s New York state workforce, Stage said. Stage noted several ways that local, state and federal governments can help spur manufacturing job growth in this region. Elected leaders and public agencies could work with industry representatives to create pre-apprenticeship and registered apprenticeship programs seeking to upskill workers and improve employee retention. New York state has a variety of grants, tax incentives and financing programs to support site preparation, infrastructure, workforce development and capital investment. The U.S. Department of Labor has a pay-for-performance incentive program that provides employers $3,500 per new apprentice hired and retained for 90 days. MACNY was previously awarded an $87,000 federal grant that will cover 25 apprentices at nine companies. The manufacturing skills gap in the United States, at its current rate, could result in 2.1 million unfilled jobs by 2030, according to a study by Deloitte and The Manufacturing Institute. In New York state, that gap is on pace to exceed 100,000 unfilled positions within six years. Manufacturing companies will be counting on more women to help fill that gap. While women make up half of the overall U.S. workforce, they only account for 29% of the manufacturing workforce in this country, Stage said. “Pre-apprenticeship programs like Real Life Rosies help to bring awareness to the manufacturing industry to fill some of the gaps, but we have a long way to go and it starts with educating people at younger ages about careers in manufacturing and earn-and-learn opportunities,” she said. As for Micron, that $100 billion-plus project, considered the largest private investment in New York state history, is expected to eventually create up to 50,000 jobs throughout the region, factoring in the spin-off opportunities for construction and supply chains. The plant’s foundation was poured on July 9. “As America celebrates its 250th anniversary, data and memory are foundational to the modern economy — and Micron is increasing our U.S. investments to more than $250 billion through 2035 to meet that moment,” the company’s president and CEO, Sanjay Mehrotra, said in a news release. Bechtel, Micon’s construction partner in the project, reported that 4,500 people will be employed to help build the facility, including skilled craft professionals, local union members representing various trades and apprentices. The Syracuse-based CenterState CEO organization tallies the regional labor force at 397,582 workers (Onondaga, Cayuga, Cortland, Madison and Oswego counties). Job growth isn’t limited to the Central New York region. For the larger area covering portions of the Mohawk Valley, the North Country, the Southern tier, and the western part of the state, there are 155,601 employees in the advanced manufacturing sector, and 155,275 construction workers. The agency’s 2026 Economic Forecast report noted that 41% of community and business leaders surveyed said a shortage of skilled workers in this area remains a problem, though 77% shared a positive economic outlook for the year ahead. Beyond the semiconductor and advanced manufacturing areas, local business leaders also see growth in small manufacturing companies, storage businesses, housing, unmanned flight technology and general construction. “Productive reuse of property,” the report said, “will hopefully continue to preserve unique architecture while driving business.” The report identified several challenges for economic growth in the region, including an aging workforce, outdated equipment, the rising cost of raw materials and “the disconnect between the speed of business needs and the pace of talent readiness.”
In Maine, the new politics meets the old
Replacing the old politics is the new politics whose maxim is: “All Politics Is National.”
Opinion: AI isn’t the business
AI will transform how businesses operate without replacing what makes them valuable.
DAZN replacing Gotham Sports as YES Network, MSG streaming home
DAZN will replace Gotham Sports as the streaming home for YES and MSG Networks beginning this fall.
Intel Panther Lake Teardown, 18A, BSPD, GAAFET, SemiAnalysis STEEL
Panther Lake debuts the first commercial implementation of backside power delivery (BSPDN), introduces Intel’s first iteration of gate-all-around (GAA) transistors, and showcases their advanced packaging capabilities with its Foveros-S assembly. With Panther Lake, Intel’s manufacturing arc has shifted from nebulous roadmaps to shipped silicon, a significant milestone on their long road back to competitive semiconductor manufacturing. To evaluate the extent of Intel’s comeback, we tore down Panther Lake. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Our teardown traces 18A from its four-sheet RibbonFETs (Intel’s marketing name for GAAFETs) and gate stacks through contacts, frontside and backside wiring, and the bonded carrier. We explain how these material and integration choices improve gate control and reduce resistance, while adding capacitance, thermal resistance, and process complexity. Our measurements put Panther Lake’s 18A compute logic and TSMC N3E GPU logic at similar logic density. However, 18A does not lead TSMC N3P, N2 or Samsung SF2 in peak density. Panther Lake’s CPU cores are incremental updates, and the high-end GPU still uses TSMC N3E. Panther Lake assembles one compute tile, one GPU tile, and one I/O tile atop a passive base tile using Intel’s Foveros-S advanced packaging. Both compute tile variants use Intel 18A. The Xe3 GPU options are a 4-core GT1 tile on Intel 3 and a larger 12-core GT2 tile on TSMC N3E. Both I/O tile variants use TSMC N6. [1], [2] Our analysis centers on the PTL-U compute tile, both the 4-core and 12-core GPU tiles, as well as the 12-lane I/O tile. In conventional chips, power and signal are routed through the same frontside metal stack towards the device frontend. Power rails consume scarce routing resources near the transistors, while tall via stacks carry VDD and VSS from the coarse upper wires to local rails. Backside power delivery (BSPD) moves the main power network behind the transistor layer, to the backside, separating it from frontside signal routing. We covered BSPD and its impacts in 2024. [3], [4], [5] Intel’s BSPD implementation, branded as “PowerVia”, routes power through dedicated backside metals to nano-TSVs, which connect those rails to local source/drain (S/D) contacts. Implementing that separation requires Intel to build the interconnect stacks from both sides of the wafer. The frontside comprises the M0-M14 signal stack, while the backside comprises the BM0-BM5 power stack. M0 and BM0 are closest to the transistors. The nano-TSVs connect the two sides, but Intel patterns and etches each via from the front after forming the contacts. A narrow via runs from the side of the contact deep into the silicon substrate. Intel then completes the frontside signal metal stack, bonds the wafer to a carrier, flips it and removes the original substrate until the buried via tips are exposed. The backside metal stack is then deposited directly on the revealed vias. The nano-TSV and backside-via profiles taper in opposite directions because Intel forms them from opposite sides of the wafer. The transistor structures form the FEOL. Local contacts and nano-TSVs connect them to the wiring. M0 begins the frontside interconnect stack. The silicon carrier remains attached above the frontside interconnects. It supports the device wafer during substrate removal and backside processing and remains part of the finished chip’s thermal path. PowerVia removes the main power distribution from the congested frontside metals, routing supply through shorter and wider backside wires. Its lateral landing still occupies area in the standard cell, so it recovers less cell area than a direct backside contact. [3] Nano-TSVs beside the logic devices carry VDD or VSS from the backside power network, while signal connections continue upward through the frontside metals. Backside Interconnects Samsung SF2 data is included for comparison to Panther Lake’s within this article. SF2 is the incumbent GAA foundry node but lacks BSPD, serving as a useful reference to evaluate 18A. A full teardown of Samsung’s S26 products, processed on SF2, will be shared soon.Nanosheet-cut EDS comparison. The PowerVia supply path runs from the backside Cu rails through Mo-lined W nano-TSVs to the local transistor contacts. In this cross section, the tapered connection spans roughly 150 nm from the contact level to BM0. The Ta liner confines Cu and promotes adhesion to the surrounding stack; the AlOₓ etch stop controls the next dielectric etch above the rail. Dielectric beneath the ribbons electrically separates the devices from the backside wiring and removes the conducting silicon body below the channel. [6] AlOₓ serves as an etchstop (ES), enabling endpointing and protecting the underlying layers. Low-volatility aluminum fluoride reaction products resist the fluorinated plasma, allowing a thin AlOₓ film to protect the metal while the surrounding low-k dielectric is removed. [6], [7]. While the BM0 and layers above the M1 lines show double AlOx layers, Our SMIC N+3 teardown showed single AlOₓ layers. SMIC uses a simpler local AlOₓ substack, while the remaining cap and etch sequence provide the required landing protection. So why double layers? The closely spaced AlOₓ doublets provide two protected endpoints in the etch sequence. Intel documents an AlOₓ/SiN/AlOₓ stack that explains the benefit. The main dielectric plasma etch stops on the first AlOₓ film; a selective wet clear opens that film; a second plasma etch removes the intermediate SiN and stops on the second AlOₓ film. The final wet clear exposes the metal landing surface. SiN is the intermediate dielectric in Intel’s published example. [8] The second stop protects the metal through a cap breakthrough. Wide openings can etch faster than narrow ones, and etch depth varies across the wafer. Metal under an early-clearing opening would otherwise be exposed while other openings still need more etching. Staged protection widens the process window and reduces metal erosion, corrosion and void formation. [8] TSMC documents AlN/AlOₓ/SiOC/AlOₓ above Cu, with AlN blocking Cu diffusion, and a simpler AlN/SiOC/AlOₓ variant that omits one AlOx film. [9] Levels with different opening sizes, aspect ratios, pattern densities and cap materials need different etch margins. A double AlOx stop is useful where another protected endpoint justifies the added processing. The extra film adds formation, selective opening and cleaning steps, plus another set of interfaces to control adhesion, moisture, and stress. These blanket films are opened through the existing via pattern, so each film does not require another lithography mask. AlOₓ adds parasitic capacitance when it replaces lower-k dielectric; two thin AlOₓ films can nevertheless contain less AlOₓ than one thick film. Total thickness, placement, and theintermediate dielectric determine the electrical cost. Deposition chemistry also changes AlOx permittivity and residual hydroxyl content, which can oxidize the underlying metal. [7], [8], [10], [11] The backside stack separates into relatively fine BM0-BM2 wiring near the devices and coarser BM3-BM5 power distribution. The largest pitch increase occurs between BM2 and BM3. BM0’s pitch closely matches the logic-row height, fitting local power delivery to the cell rows. Higher levels aggregate current through larger conductors: routing density becomes less important than low resistance and current capacity as the network approaches the package. This hierarchy provides wide power wiring for the power delivery network without consuming scarce frontside signal-routing resources. [3] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Frontside Interconnects Intel 18A combines Mo-lined W contacts and nano-TSVs with a separate backside Cu power network. Samsung SF2 keeps power on the frontside, using Ti-based contact interfaces and Ta-based barriers and Co liners around Cu wiring. In 18A standard-cell rows, backside power rails supply the devices through nano-TSVs within the cells, freeing frontside routing resources. Samsung’s M0 accommodates both power and signal connections. From the device toward M0, the connection runs through a Ti-based S/D interface, W contact fill, a Mo-lined W via, and the Cu M0 wire. Mo supplies a conductive nucleation and adhesion layer for W, replacing the resistive TiN liner used in conventional W integration. This increases the effective conduction volume within the feature while retaining W fill and its established polishing, cleaning and etching processes. Intel’s Mo/W patent describes this integration tradeoff. The nano-TSV uses the same Mo-lined W construction in the backside supply path. [12] The move from TiN to Mo is an incremental change. While a full Co or Mo fill can also reduce the volume lost to liners in very small features, it requires new integration schemes that increase complexity and risk. Cu remains attractive for wider wires due to its low resistance. As wires and vias shrink, the diffusion barrier consumes an increasing fraction of their cross-section. [12], [12], [14] Intel uses Co/Ru liners at M0-M1, Co at M2-M4, and Nb at M5-M9. The lower-level liners help Cu adhere and reduce void formation during trench fills. Applied Materials’ Endura has new thermal control that facilitate wetting process, so the thin film continuity is good enough that good capillary pressure will drive Cu atoms to the via bottom without voiding. Intel’s choice to use Nb is particularly interesting. Intel’s Nb patent describes a conductive diffusion barrier intended to reduce the barrier’s contribution to resistance relative to conventional Ta-based barriers, particularly at via bottoms where all current crosses the barrier. The patent pairs Nb in coarser levels with the option of lower-cost PVD processing. [15], [16] The upper metal layers support thicker barriers formed through physical vapor deposition (PVD) despite its worse coverage and uniformity. Meanwhile, the lower metal layers require thinner barriers deposited through conformal atomic layer deposition (ALD). Co/Ru adds another material interface and requires controlled deposition and Cu fill. Changing liners and barriers by metal layer allows Intel to optimize interconnect resistance, process complexity, and reliability. [15, 16] RibbonFET, Intel’s name for its gate-all-around FETs (GAAFETs), replaces the FinFET’s vertical fins with four stacked horizontal silicon nanosheets, allowing the gate to surround the channel on every side. The path to GAAFET begins with the planar transistor. A planar MOSFET places the gate above the channel between its source and drain. Pairing an NMOS with a PMOS transistor creates a CMOS inverter, in which the NMOS pulls the output low for a high input, and the PMOS pulls it high for a low input. The gate must retain electrostatic control of the channel to ensure clean switching. As gate lengths shrank, the drain began to compete with the gate for that control, increasing off-state leakage. Electrostatic control was restored through an architectural evolution that raised the channel into a vertical fin and wrapping the gate around three sides. Called “FinFET”, this new architecture packed more effective channel width into a smaller footprint. Further scaling made it harder to maintain both drive current and leakage within smaller cells, and reintroduced the same problems planar MOSFETs faced. Nanosheet GAAFETs close the fourth side by replacing the vertical fin with a stack of horizontal nanosheets, each surrounded by the gate. The tighter electrostatic control suppresses leakage at shorter gate lengths while stacking adds effective channel width within the cell footprint. In a FinFET process, channel width changes in discrete steps as designers must add or remove whole fins. Nanosheet width can instead be adjusted continuously within the process’s design rules. Wider sheets increase drive current, while narrower sheets reduce capacitance at the cost of drive current. Intel 18A uses stacks of four nanosheets each and varies their widths across logic and SRAM. At the process level, adding more sheets to each stack increases effective channel width and drive current, but complicates fabrication. RibbonFET vs MBCFET Samsung began GAAFET production in 2022 with SF3E, following with SF3 and now SF2. Its ‘MBCFET’ provides a useful structural comparison with Intel’s first RibbonFET implementation. [17] STEEL is digging deeper into SF2, used in the Exynos 2600, and TSMC’s GAAFET N2, used in Apple’s A20 Pro, in upcoming newsletter articles. We’re throwing some teasers on X. Let’s compare Samsung SF2’s MBCFET with Intel 18A’s RibbonFET. Subscribe Even to the untrained eye, Intel’s extra nanosheet is obvious. Intel stacks four ribbons to Samsung’s three. Samsung’s sheets are much wider in these fields, so both sheet count and width matter to the available channel perimeter. Sheet width also changes which silicon surfaces carry current. On conventional (001) silicon, wide nanosheets emphasize the broad top and bottom surfaces, favoring electron transport; the larger sidewall contribution in a narrow sheet favors hole transport. Thinner sheets improve gate control but increase confinement and scattering. This makes width and thickness part of the NMOS/PMOS balance, alongside strain and threshold voltage. [18], [19] GAAFET designs like 18A use different work-function-metal (WFM) stacks for NMOS and PMOS. Around each ribbon, a thin SiOx interfacial layer separates the silicon channel from the HfOx high-k dielectric, with La providing dipole tuning and the WFM wrapping the dielectric. NMOS uses a TiAl-based stack, while PMOS uses TiN WFM. W fills the remaining gate trench, providing a lower-resistivity path where the work-function layers are no longer needed. In this field, the PMOS stacks leave room for W between ribbons, while the NMOS stacks occupy more of those gaps. A silicon-based dielectric marks the P/N boundary, allowing the PMOS and NMOS gates, sharing the same gate trench, to be processed sequentially. Fast logic paths, retention circuits, and SRAM need a family of threshold options. Changing threshold without substantially changing device dimensions, capacitance or fabrication complexity is valuable. FinFET processes typically use different work-function-metal stacks. In a four-ribbon GAA stack, the narrow sheet-to-sheet gap limits how much WFM can fit around each channel. La in the gate dielectric creates interfacial dipoles at the SiOx/HfOx boundary, shifting effective work function and tuning threshold voltage. This gives Intel another control alongside its NMOS and PMOS WFM stacks. Low-threshold devices improve critical-path drive; higher thresholds reduce leakage elsewhere. Dipole tuning is especially useful in GAA because it changes threshold without consuming the narrow intersheet gap with thicker WFM. Precise control of La incorporation, diffusion and interface quality has long been a challenge, limiting viability in high volume production but is now seen from every leading-edge foundry. Intel’s patent describes depositing a dipole-forming oxide above HfOx and annealing it toward the interfacial oxide before completing the work-function and fill metals. This separates threshold tuning from the space available for metal. Newer research addresses the thermal cost: imec’s 2026 dipole-middle research inserts the shifter between two HfOx depositions, shortening the diffusion path while protecting SiOx during patterning. [20], [21]Matched-cut EDS, Intel 18A (left) vs. Samsung SF2 (right). Intel retains raised source/drain epi beneath its contacts, while Samsung recesses W deep into the epi to form a V-shaped Ti-lined interface. The deeper contact increases metal-to-semiconductor area and shortens the current path from the lower sheets, reducing contact and spreading resistance. It also removes epi volume and brings the contact etch closer to the channel ends. Retaining more epi preserves the material available for strain transfer, especially from SiGe into PMOS. These geometries balance contact access against stress engineering and etch margin. [22], [23] Samsung stacks three sheets to Intel’s four ribbons, and both processes use sheet width to tune drive strength. In our Samsung cross-sections, widths range roughly from 19 to 30 nm in the NPU rows and 37 to 50 nm in the CU cell. The Samsung nanosheets taper, with the widest sheet at the bottom and the narrowest at the top. Both processes use HfOx gate dielectric and Ti-based work-function stacks, with Al in the NMOS stack. In the Samsung devices shown here, the dielectric and WFM occupy the intersheet gaps, leaving W above the top sheet. Intel’s PMOS stack leaves more room between ribbons, and W fills those gaps while the thicker NMOS stack leaves W mainly in the upper trench. Gate-stack EDS maps. The W between Intel’s PMOS ribbons provides a conductive path close to the lower gates. Where WFM fills the entire gap, the gate still surrounds the channel, but voltage reaches it through the more resistive work-function films. Thinner WFM and dipole tuning preserve room for low-resistivity fill; Mo and Ru are alternative fill metals being developed for further scaling. [24] A masked, sequential WFM flow explains the different gate heights and inter-nanosheet fill. The proposed sequence below shows how separate NMOS and PMOS work-function steps produce that geometry. Enabled by the BSPDN process, Intel replaces the dense-logic silicon subfin with dielectric, removing the parasitic conduction path below the ribbons and reducing substrate-related capacitance. A retained silicon body as in classical, non-SOI, planar and FinFET designs needs junction and punchthrough-stop engineering to suppress leakage. Dielectric isolation makes that leakage less sensitive to the subfin doping profile but adds removal and fill steps. It also weakens the direct thermal path through silicon, making the contacts, metal stacks and package more important for heat extraction. [24], [26] Fluorine is concentrated around selected Intel device structures in the maps. WF6 is a standard precursor for W nucleation and fill, while barrier films protect adjacent dielectrics from fluorine attack. Low-fluorine W processes reduce the residual-F burden. Chloride-based precursors avoid introducing F during W deposition, but require control of chlorine attack, nucleation and fill quality. The integration target is a continuous, low-resistance W path with a thin protective liner and minimal chemical damage to the surrounding stack. [20], [27], [28] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. We measured cell height, gate pitch, metal geometry, and ribbon dimensions at the XTEM sites shown below. The tables group these dimensions by site and device polarity. Our “sheet cuts” cross the silicon channel and show the ribbons end-on. “gate cuts” run along the channel through successive gates. The 18A logic cell dimensions point to a five-track logic library while the N3E and Intel 3 cell dimensions evidence a seven-track logic library. The DDR-PHY uses wider M0 wires and much larger spacing than core logic. That trades routing density for lower wire resistance and weaker coupling between neighboring nets. The geometry suits the current delivery and coupling requirements of analog, clock, and I/O circuitry. PowerVia lets 18A combine a compact cell height with wider M0 geometry by moving the main power rails off the signal-routing tracks. That relaxes local wire scaling while preserving a small cell footprint. Cell height and gate pitch set the geometric density; pin access and routability determine how much of it a real block can use. [29] The biggest takeaway from our gate-pitch measurements is that Intel 18A compute logic and TSMC N3E GPU logic have similar density in the Bohr representative-cell model. The 18A example is 18.6% denser than the Intel 3 GPU example. Gate pitches are nearly identical across the three sites, so cell height drives most of the difference. The Bohr model combines a four-transistor NAND2 spanning three gate pitches and a 32-transistor scan flip-flop (SFF) spanning nineteen pitches, weighting their densities 60:40. The sensitivity column shows how independently changing cell height and gate pitch by ±1 nm changes the result. This compares representative cell geometries; whole-die density also depends on cell mix and placement. The 18A P-core gives M0 substantially more metal cross section than the N3E vector engine. Treating each profile as a trapezoid gives 2.63 times the area per line and 1.84 times the area after normalization by routing pitch. The larger section reduces the geometric contribution to line resistance and lowers current density for a given current. Taller and wider wires also add capacitance, so circuit delay depends on the balance of resistance and capacitance. The DDR-PHY has less metal area per routing width than the 18A core fields, while remaining above N3E. [30] Area = height × (top CD + bottom CD) / 2, including liners. Area/pitch normalizes by routing width. Taper is the symmetric sidewall angle from vertical, with the largest angle belonging to the DDR-PHY. Compute tile The measurements show how ribbon dimensions and gate-stack geometry vary across the compute tile and between NMOS and PMOS to balance channel drive, gate load and the space needed for the dielectric/WFM stack across logic, SRAM and the DDR-PHY. Width mainly changes available channel perimeter; thickness also changes electrostatic control and carrier confinement. Gate-stack thickness then determines the space left for low-resistivity fill P-core and LP E-core logic Both the P-core and LP E-core use multiple nanosheet widths. Widths are measured on high-magnification XTEMs while wider-field images demonstrate additional width choices within the LP E-core. Multiple widths are expected even within an LP E-core. Timing-critical paths, buffers and cells with different fanout need different drive strengths. The lower-magnification fields show this width diversity beyond the sites quantified in the table. L2 and L3 SRAM GAA gives SRAM designers another way to balance the pull-up (PU), pass-gate (PG), and pull-down (PD) transistors. FinFET bitcells set device strength through fin count while GAA adds nanosheet width as a sizing knob. In a 6T SRAM cell, a strong pull-down relative to the pass-gate limits read disturbance, while a strong pass-gate relative to the pull-up improves writability. During a write, the pass-gate and write driver pull the node storing “1” below the inverter trip point. During a read, the pull-down holds the node storing “0” low. Bias, threshold voltage, mismatch and assist circuitry set the remaining margin. FinFET high-current cells commonly use a PU:PG:PD fin-count pattern of 1:2:2, a device-sizing ratio rather than a current ratio. Ribbon width lets Intel balance SRAM strengths without adding whole fins. The L2 cell uses its narrowest ribbons for PU and widest for PD, improving writability and read stability respectively. Intel’s disclosed HCC operates without assist; its denser HDC uses negative-bitline write assist. Pulling the selected bitline briefly below ground increases pass-gate overdrive so it can overpower the pull-up at lower supply voltage. That buys density and low voltage writability at the cost of boosting circuitry, switching energy, and additional voltage stress that must be controlled. [31], [32] Four rectangular ribbons give the perimeter = 8 × (width + thickness), before corner rounding. PG/PU is 1.49 and PD/PG is 1.16. The L3 structures closely resemble L2 in layout and cell height. Fewer L3 nanosheet widths are tabulated because fewer high-magnification images were available. DDR PHY The DDR-PHY trades density for controlled analog behavior and reliable off-chip signaling. It contains drivers, receivers, delay circuits, and calibration logic that set drive strength, sampling time, and voltage margin. Repeated four-sheet devices with similar widths fit the use of regular transistor units for matching and programmable drive. Its wider local wiring provides room for current delivery and separation of sensitive signals, while consuming more area than a dense core-logic grid. The layout serves the memory channel’s electrical requirements as well as digital logic density. [33] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Intel 3 GPU devices Vector engine logic Intel 3’s XVE logic uses two-fin PMOS and NMOS devices with power rails in M0. Its cell height and M0 pitch give a seven-track geometry, two tracks more than the 18A logic. One-fin groups also appear among the two-fin devices. Intel 3 L2 SRAM The Intel 3 L2 SRAM uses the familiar HCC sizing pattern: one PU fin, two PG fins, and two PD fins. N3E GPU devices Vector engine logic The N3E XVE field contains repeated two-fin devices with seven-track cell geometry. N3E remains a FinFET process, giving Panther Lake a direct FinFET-to-RibbonFET comparison. N3E L2 SRAM The N3E L2 SRAM uses the same PU:PG:PD fin-count pattern of 1:2:2. Panther Lake-U follows Lunar Lake’s floorplan quite closely. Both pair 4 P-cores with 4 LP E-cores and NPU, media and display engines in similar locations. Lunar Lake also uses Xe2, the direct predecessor to Panther Lake’s Xe3 GPU. This makes Lunar Lake the most direct basis for our comparisons. Arrow Lake differs in core count and uses the older Xe-LPG GPU architecture, so we only use it where it offers a more direct component-level comparison. Compute tile Panther Lake compute-tile floorplans remain sparse even months after launch. Intel 18A’s backside metal and dielectric stack must be removed without damaging the underlying structures before a clean transistor-level floorplan can be imaged. Most published die shots hide or heavily process the background, but we are quite proud of the die shot we achieved and are excited to show the work we have done. We measured the areas of the key components on the compute tile and compared them with their Lunar Lake predecessors on TSMC N3B. These help us to capture changes in block area and compare the two chips across process nodes and designs. Our total tile areas exclude the scribe-line area. The compute-plus-GPU subtotal below uses the PTL-U compute tile and GT1 GPU; it excludes the I/O tile and passive base. Individual block areas use the boundaries marked on the floorplans The compute-plus-GPU row is recomputed from the displayed PTL-U and GT1 areas. Component rows use their stated per-region counts and are not an additive partition of the whole tile. The P-core area remains almost unchanged between Lunar Lake and Panther Lake, despite L2 capacity increasing from 2.5 MiB to 3 MiB. Arrow Lake uses the same Lion Cove core as Lunar Lake but also has a 3 MiB L2. Cougar Cove fits 20% more L2 into the same P-core area. The larger private cache keeps more of each core’s working set close to its execution units, reducing access to shared L3 and DRAM. Extra capacity adds storage leakage and lookup energy, so designers balance it against avoided lower-level accesses. The shared P-core L3 cache also shrank by 14.8%. [2] Cougar Cove combines a similar footprint with Intel’s reported power-efficiency improvements. RibbonFET’s tighter channel control reduces leakage, while PowerVia reduces supply droop and allows tighter voltage guardbands. [1] Darkmont’s four-core LP E-core cluster is 5.0% smaller than Skymont’s on Lunar Lake, with most of the reduction in its L2 regions. The 1 MiB region shrank by 8.4% and the 1.5 MiB region by 14.9%. The tag arrays also use one fewer visible row. Tags identify which memory addresses the data array holds, so rearranging them changes the cache’s layout and wiring without requiring less data capacity. [2] The LP E-cores share one L2. This pools capacity and avoids duplicating all the cache machinery, but the four cores contend for its banks and bandwidth. Their separate cluster also keeps light work away from the performance cluster and its L3, allowing that larger domain to sleep. [1], [2] Cache area includes more than the storage cells. Tags identify each line, decoders select rows, sense amplifiers read the small bitline signal, and wires connect to the banks. Splitting an array into smaller sections shortens wordlines and bitlines, improving access speed, but duplicates peripheral circuits. Panther Lake’s smaller cache regions therefore reflect the complete memory implementation, including how much of each region is devoted to storage. [34] Unlike Meteor Lake and Arrow Lake, Panther Lake has no separate SoC tile. The NPU, LP E-cores, memory controllers, PHYs, media and display engines now share the compute tile. This removes an active die and keeps CPU memory traffic on one die. The cost is moving PHY and I/O-related circuitry onto 18A: drivers, receivers and analog circuits must still meet external voltage, loading and signal-integrity requirements, so their area does not shrink like dense digital logic. [1], [2] The biggest shrink comes from the NPU, which occupies 36.9% less area. NPU 5 consolidates the same total INT8 MAC count into half as many neural compute engines. Each of the three NCEs has a larger MAC array to make the complete NCE envelope 22.6% larger than an NPU 4 engine. Consolidation also halves the number of scratchpads and SHAVE DSPs, from 12 to 6. The MAC array handles matrix multiplication and convolution, while SHAVE executes vector and custom operations that fit the array poorly. [1], [2], [35] The paired floorplans identify each NCE envelope and its scratchpad, MAC, and SHAVE regions. Each measured MAC polygon is counted once per NCE in the area accounting below. The scratchpads store weights, activations, and intermediate results near the MAC arrays, allowing repeated use without fetching them again from DRAM. Halving their number delivers the largest measured area saving but leaves less local storage for the same total MAC count. Layers that no longer fit locally require smaller working tiles or more transfers of intermediate data. The benefit depends on keeping the enlarged arrays busy while managing that tighter storage budget. [36] NPU 5 also adds native FP8. Using half the operand width of FP16 reduces storage and transfer demand, helping workloads fit the smaller local memory budget. Lower precision and format-dependent range make scaling and model validation part of deployment. Hardware activation functions further reduce work that would otherwise occupy the programmable DSPs. [1], [2] Microsoft requires an NPU to deliver at least 40 TOPS for Copilot+ PCs. Both Lunar Lake and Panther Lake meet this threshold, but Panther Lake uses significantly less silicon. GPU tiles Panther Lake is Intel’s first product with Xe3, its latest GPU architecture. It offers two different GPU tiles: a smaller GT1 tile with 4 Xe3 cores on Intel 3 and a larger GT2 tile with 12 Xe3 cores on TSMC N3E. Panther Lake allows us to compare the same GPU architecture across both Intel 3 and TSMC N3E. Wildcat Lake adds a third Xe3 implementation on Intel 18A. A future newsletter will detail Xe3 and its implementation differences across all three process nodes. GT2 scales Xe3 to a different physical layout, with render slices arranged vertically instead of GT1’s horizontal arrangement. Slice placement sets the distances to shared cache banks and the D2D interface. Those wires consume area and add delay, so scaling the number of Xe cores also requires a new balance of cache placement, routing and timing. [1] What’s immediately obvious is that the GT2 tile on TSMC N3E has much smaller Xe cores than GT1. These block areas include logic, caches, and routing. An Xe core on the GT1 tile is ~69% larger than one on Lunar Lake, and ~55% larger than one on GT2. Intel 3 therefore uses substantially more area per Xe core. The block-area gap exceeds the measured logic and SRAM density gaps, bringing routing, timing targets, cell mix, and floorplan allocation into the comparison. The measured vector/matrix engine region is almost unchanged between Lunar Lake and Panther Lake’s GT2 tile. Xe3 retains eight 512-bit vector engines and eight 2048-bit XMX engines per core. Its gains also come from feeding those engines more effectively: more resident threads hide stalls, and variable register allocation lets shaders trade registers per thread against the number of threads kept active. [1] The shared L1/SLM capacity increased by 33% from 192 KiB to 256 KiB, while its area increased only 5%, raising effective density by 27%. L1 retains reused cache lines, while software-managed SLM lets a thread group share data locally. Both reduce traffic to more distant memory. Allocating more SLM per group can also limit how many groups reside on a core at once. [1], [37] The GT1 tile carries 4 MiB of L2 against 16 MiB on the GT2 tile. GT1 divides its L2 cache into four 1 MiB banks, while GT2 uses eight 2 MiB banks. Each bank contains 128 macros, but each N3E macro stores 16 KiB, twice the Intel 3 macro’s 8 KiB capacity. The N3E macro is only 54% larger while holding twice as many bits, giving it 30% higher density: ~23.7 Mbit/mm² versus 18.3 Mbit/mm². Including bank-level circuitry, the gap widens to ~16.9 Mbit/mm² on GT2 versus ~10.4 Mbit/mm² on GT1. GT2 gains density with its macros storing more bits per unit area, and those macros occupy more of each cache bank. Larger macros spread decoder and sense-amplifier overhead across more storage, while a more compact bank layout reduces the share spent on control and routing. The compromise is longer wordlines and bitlines that carry more capacitance. [34] I/O tile Panther Lake uses two I/O tile variants, both fabricated on TSMC N6. The smaller one provides 4 PCIe 5.0 and 8 PCIe 4.0 lanes and serves lower-tier systems as well as those without a discrete GPU, while the larger one adds 8 PCIe 5.0 lanes, bringing the total to 20 lanes, for discrete-GPU connectivity. Panther Lake SKUs with the larger 10- or 12-Xe GPUs use the smaller I/O tile. [38] The smaller I/O tile adds a PCIe 4.0 block and a Thunderbolt block to Lunar Lake’s I/O layout, providing four additional PCIe 4.0 lanes and another Thunderbolt 4 port. Its repeated N6 blocks retain nearly identical areas and layouts. Reusing these proven PHYs and controllers avoids porting and requalifying external interfaces on 18A, where faster digital logic offers less benefit to circuits constrained by the off-chip link. [38] SemiAnalysis’s teardown lab (STEEL) dives deep into the world’s advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. We’re hiring technical experts from system to transistor and everywhere in between. Check out our Careers page. Panther Lake offers scalability and modularity through its disaggregated packaging that partition compute, GPU, and I/O silicon into separate tiles allowing for a suite of tile configurations. This partitioning makes the package part of Intel’s node economics as it determines how much leading-edge wafer area each product consumes, which functions can remain on other processes, and how much configuration freedom Intel can offer from a shared set of tiles. Furthermore, fabricating the compute and GPU tiles separately confines the new 18A process to the compute tile and allows graphics and I/O to use other, more established, and more cost-effective processes. For Panther Lake, the GPU and I/O tiles are assembled alongside the compute tile on a passive silicon base using Foveros-S. Intel’s current technology brief lists a nominal 36 µm pitch for Foveros-S. Through-silicon vias (TSVs) in the base connect the fine wiring above to the larger package connections below. The functional tiles sit side by side on that passive base in a 2.5D configuration. [39] Our cross-section through the compute and GPU tiles shows the package’s wiring hierarchy. Microbumps connect each active tile to the passive silicon base; its fine redistribution layer (RDL) carries the short, dense tile-to-tile links. TSVs carry connections through the base to the package substrate, which fans them out to the much coarser motherboard solder joints. The base supplies interconnect, while computation remains in the active tiles above it. [39] At the compute-tile edge, the higher-magnification inset shows a local microbump spacing of approximately 25.24 µm and a feature width of 12.33 µm. These local spacings are finer than Intel’s nominal Foveros-S value. The X-ray fields further confirm tighter neighboring bumps, consistent across every die-to-die area found on each tile. Additional X-ray analysis is offered after the paywall. Putting the memory controller beside the CPU removes the D2D transfer that CPU memory requests required in Meteor Lake and Arrow Lake. This avoids the extra transmitter, receiver, and link traversal, saving interface energy and latency. Panther Lake’s separate GPU still crosses a D2D link to reach DRAM, so its larger local caches also help contain package traffic. [1], [40] Smaller dies are less likely to contain a random fatal defect, and screening them before assembly prevents one bad tile from consuming a complete package of good silicon. Reuse also spreads design and qualification work across more products. Against those gains, Intel pays for the passive base, D2D circuits, extra bonding and test steps, and losses during assembly. Cost per working product across the portfolio captures the combined effect of wafer yield, reuse, test, and assembly. [29] Wildcat Lake packaging Intel launched Core Series 3, formerly Wildcat Lake, on 16 April 2026 for value mobile and edge systems. Wildcat Lake keeps 18A but removes the passive base and combines more functions on one die to simplify the package. The two products therefore reveal two distinct ways to commercialize the same leading-edge process. [41] Wildcat Lake’s 18A die combines up to two Cougar Cove P-cores, four Darkmont LP E-cores, two Xe3 cores and a smaller NPU. A separate platform-controller die supplies I/O, connected through UCIe, Intel’s first processor implementation of the standard. Consolidating graphics remove a tile boundary and the passive base, reducing assembly complexity for a modest-bandwidth value product. It also ties CPU and graphics scaling to the same die, giving up Panther Lake’s ability to swap in a much larger GPU. [42], [43] In July 2021, Intel CEO Pat Gelsinger set out an ambitious process roadmap aimed at regaining performance leadership by 2025, later described as five nodes in four years. Five years and one CEO later, Intel’s comeback story is not as unambiguously positive as Pat may have hoped. [44], [45] Intel once set the pace for process technology, bringing high-k metal gate technology and FinFETs into volume production years ahead of the rest of the industry. Its 22 nm FinFET process reached consumers with Ivy Bridge in 2012. [46] Intel’s integrated device manufacturing (IDM) model allowed its architects and process engineers to co-optimize products and processes. Starting with Sandy Bridge, Intel dominated x86, while AMD struggled with Bulldozer. That lead faltered at 14 nm and broke at 10 nm. Intel targeted a massive 2.7× density increase, but the node arrived years late and required several revisions before it could support Intel’s full lineup. This delay forced Intel to stretch 14 nm across six generations, while TSMC moved ahead in process technology and AMD recovered in x86. By 2019, Intel was still shipping 14 nm across most of its product stack, with its 10 nm client ramp focused on Ice Lake mobile processors. Meanwhile, TSMC was shipping N7 and N7+, and AMD’s Zen 2 compute chiplets used N7 to raise core counts and improve efficiency. Intel’s process failures were central to its decline, but unsound business decisions furthered their downward slide. Product delays compounded product mistakes, pushing client, server, and FPGA roadmaps off schedule. Several attempts to enter AI (Nervana and Gaudi) and networking (Tofino) also failed to establish lasting businesses. Intel’s recovery has focused on consumer CPUs and advanced packaging. Tiger Lake, Alder Lake, Lunar Lake and now Panther Lake have restored Intel’s consumer roadmap. On the process side, Intel 4 shipped with Meteor Lake, Intel 3 with Granite Rapids and Sierra Forest, and Intel 18A with Panther Lake. Intel has also made advanced packaging part of its foundry offering. However, Intel is still playing catch-up in servers. Several Xeon generations arrived years late and trailed contemporary AMD and Arm server CPUs in performance, efficiency, and core count. The process roadmap is back, but Intel does not hold the same process-technology leadership position it held prior to 10 nm. The introduction of gate-all-around nanosheets and backside power delivery are two of the biggest changes to transistor integration in a decade. Intel took on both changes at once: 18A paired its first RibbonFET with PowerVia in Panther Lake. Panther Lake is a substantial manufacturing milestone. Our cross-sections show how RibbonFET and PowerVia reshape local contacts and wiring, while the floorplans show where architectural consolidation and process choices save area. A sustained competitive lead depends on product performance, cost, yield, and the next implementation. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page.. 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September Monthly Review: Health MCP Guy?
For all the time I spend talking about APIs and data exchange, this newsletter has had embarrassingly little interoperability of its own. It’s old-school SaaS, baby - UI or bust. Not all of that is my fault! Substack, for all its popularity, is (as mentioned before) really frustrating as my system of record. The primary user it optimizes towards is the reader, whose attention feeds the app, the Notes feed, and the recommendation network that Substack is actually selling. Health API Guy is a reader-supported publication. To receive new posts and support my work, consider becoming a free or paid subscriber. Subscribe They’re falling into the same trap that Medium once sprinted into, albeit at a much more glacial speed. Younger generations may not remember (or never knew) it, but Medium once lured publications like The Ringer and Signal v. Noise onto its platform, only to lose them as it rebuilt itself around a paywall and an algorithmic feed. Substack’s original pitch circa 2020 was the antidote (you own your list), but every new feed feature chips away at it. I get it: writers are generic supply in the eyes of the Substack product team. Generic supply follows demand, so the consistent pressure on the PMs is to generate demand, which leads to every product cycle going toward discovery (Notes, recommendations, the app, live video). The end result lackluster author tools (laggy and broken analytics are truly crippling) all despite the premium price point. The archive is where it crosses from authorial gripes to actual reader impact, though. Across Substack and LinkedIn, I’ve published 1,218 posts and nearly 900,000 words since 2018. Substack’s native search can see only the 464 posts that live on Substack, and even there it’s woefully inadequate at surfacing relevant content (even for the guy who wrote it)! Readers have the same problem, writ large. Ask the Archive Fixing search (for both my readers and my own use) turned out to be extremely non-trivial, unfortunately: There’s no public API for readers to access content RSS exists for new content notification, but it only carries the 20 most recent posts and cuts paid ones off at the preview The only Substack MCP is an admin tool for analytics The export exists for authors, but it’s painfully awkward and slow. So I built something to work around that: the Health API Guy MCP. It’s a private MCP server holding the full text of everything I’ve written across Substack and LinkedIn. Add it to Claude or ChatGPT as a connector and you can ask things like: It pairs keyword search (for acronyms and case names, of which we have many) with semantic search. Every post is also labeled by topic, form, and court case, so you can pull a lawsuit’s (or multiple cases’) entire docket across Substack and LinkedIn in one query: Hail, Healthapiguyhydra This is also a bit of me eating my own cooking. I’ve spent the year arguing that headless healthcare is arriving and that developers want primitives over abstractions. Last week in Hail, Benihydra, I watched Salesforce plug its platform into Claude and bet that the records underneath outlive whatever interface sits on top: Salesforce must believe that the Hydra’s immortal head is the records, permissions, and business logic (in that they will survive whatever happens to the interface). It felt a bit hypocritical to keep my own archive behind a Substack search bar. The archive is the body. Substack is one head, and now whatever tool you might use is another. Will the EHRs follow my lead? Probably not imminently, but one can hope! Why Founding Members Only The MCP is available to Founding Member subscribers. A few reasons: It costs money and time to run. Hosting, the database, Clerk usage and AI compute for search and labeling are significant operational costs (that increase with usage). Substack gives me no way to automate access. There’s no API to check whether someone is a paid subscriber, so every user is manual operations for now. It’s a beta. We’ll need to improve things and parts will break. I’d rather they break for a small group of dedicated readers who will tell me about it. The Founding tier deserved a real benefit. Until now it was mostly a generous tip. Now it comes with something. If you’re already a Founding Member, reply to this email with the address you’d like provisioned. If you’re not and want in, upgrade here. Larger teams (such as companies) can get access too: group subscriptions at the Founding tier come with the group discount. The admin for the subscription can reply with the list of addresses to provision. Get 20% off a group subscription Pricing Founding membership is now a flat $200 a year, replacing the old suggested $150 that readers could adjust. Existing Founding Members will have access grandfathered in at their previous rate. Month in Review Articles Published Make Networks Dumb Again (Sep 11): AI is making old analog networks cheaper to use and flooding them with machine traffic in the process. A plea for agent-native rails with the intelligence at the endpoints, and for Washington to drag them to ubiquity. Interoperability, Unbuttoned (Sep 29): Interoperability is a series of workflows in a trenchcoat, and this post finally takes the trenchcoat off. A color-coded map shows which provider workflows went digital, which are fragmented, and which still run on fax. Video Content Antitrust’s System of Record Problem (Sep 3): The FTC’s investigation into Epic prompted a ninety-minute webinar, now posted with chapters and a smoothed transcript. We get into why market definition, missing B2B share data, and the SSNIP test leave antitrust poorly suited to systems of record, plus why information blocking may be doing more than any pending lawsuit. The Information Exchange: Cerner Milking Edition (Sep 18): This was so fucking fun. Ryan Tucker, Ryan Brickner, Brad Thorson, and I try an Around the Horn format, complete with points, penalties, and a mute button. We debate whether Oracle Health is dead, who would actually buy Cerner (IBM enters the chat), p(Doom), and why the front desk still hands you a clipboard. Regulatory Ask Not What Your Network Can Do (Sep 23): CDC’s RFI on public health data intermediaries lists use cases already served, unevenly, by eCR, lab reporting, IZ Gateway, and syndromic surveillance. The real opportunity sits in one question about AI: a network that can handle the next emergency without another interface project. Court cases Particle v. Epic: The Naughty Schoolteacher (Sep 4): After a summer-long vigil, the answer on Epic’s early summary judgment bid is two paragraphs and a remedial assignment. Particle advances to the next grade, and market definition gets another year of discovery. The Epic Discovery Files (Sep 8): Texas’s motions to compel arrive with a 251-page appendix of requests, objections, and meet-and-confer letters with Cravath. Inside: Epic using generative AI for document review, denied interoperability requests in scope, and Noerr-Pennington raised against lobbying discovery. Epic v. Health Gorilla: “Working as Designed” (Sep 9): Epic wants nothing to do with the data breach MDL, and explaining why puts fresh discovery on the public docket. The spiciest allegation: Health Gorilla told GuardDog to scrub its law firm business from its website instead of cutting off access. Veeva v. Epic: Legal Bypass Surgery (Sep 15): Veeva asks the Wisconsin Supreme Court to skip the Court of Appeals, while law professors and three policy groups line up as amici. Meanwhile, Epic’s lawyers apologize for another round of citation errors, including a quote that never existed. Texas v. Epic: Behind the Black Bars (Sep 17): The court portal served up Epic’s unredacted filings, revealing a $5 million document review budget and the AI workflow behind it. Also inside: the 200-plus company names Texas wants searched, and one very expensive Zoom invitation. OpenEvidence v. Doximity: Consequences Will Follow (Sep 25): OpenEvidence tells the court it will not comply with a discovery order, and its own lawyers at Quinn Emanuel say they won’t defend the choice. Add years of Slack reported unrecoverable, and Rule 37 sanctions come into view. Health Tech Keeps Choosing Violence (Sep 28): Doximity moves to end OpenEvidence’s case, Epic asks Texas to show its work, and a sleepy Audacious Inquiry patent fight sprouts antitrust and information blocking counterclaims. The main event is a long-sealed Cognizant v. Infosys ruling that hints where system of record antitrust claims can survive. EHRs One Verb for Oracle Health (Sep 14): Oracle’s earnings call quantifies every data center to the decimal point, while Oracle Health gets a single verb: “accelerate.” Panning the few healthcare mentions turns up an agentic care management system, a research-to-care ledger play, and the question of whether healthcare gets Larry’s patience. Epic’s Forretress Under Siege (Sep 30): Judy Faulkner tells a panel Epic paused hundreds of projects to harden its software and calls it a “shame,” while a spokesperson insists the roadmap hasn’t changed. Project Glasswing, a Pokémon-branded QAN sprint, and a trove of Jodel grievances reconcile the two Epics and preview the Jevons paradox coming for all software. Industry Analysis Scanning for a Network (Sep 1): Scan.com raises $220M to build the imaging network labs never got, speedrunning Zocdoc’s consumer-to-B2B pivot. Its wedge to network density may be the most American one available: personal injury litigation. The Front Desk Wants the Damn Whole Building (Sep 16): Hello Patient buys Converse Health, pushing its AI front desk into referrals, chart work, and prior auth. The copilot categories keep blurring, and your distribution partner is still your final boss. Cross-industry Comparisons A Different Patchwork Quilt (Sep 10): Healthcare loves to envy open banking, but the US version has no mandate, a toll booth at Chase, and data quality problems of its own. The grass isn’t greener; it’s another American patchwork quilt, and perhaps a worse one. Hail, Benihydra (Sep 21): Salesforce brings its platform into Claude, Slack, and its own agent, inviting the interfaces that might replace it. Cut off one head and more grow back, so long as the records underneath stay put. Living on A Trade Secret Prayer (Sep 22): Six credit unions are suing Fiserv, the Epic of core banking, by claiming their own member records as trade secrets. Banking has no Cures Act, so its lawyers reach for legal alchemy that healthcare has already tried. Other News None this month External Media Nabla Accelerate NYC: I kicked off fall conference season at Nabla’s Accelerate event in New York, where Delphine Groll opened by asking the room to picture the company it wants to become and the one it doesn’t. I liked her framework of bureaucracy, fear, and ego as the blockers. I also love vendor conferences/events in general - different vibe than industry biggies. Healthcare 101 with Nikhil Krishnan: I briefly guest lectured Out-Of-Pocket’s Healthcare 101 class. Appreciated Nikhil’s takeaways cover whether AI doctors can query HIEs, why healthcare’s data-liberation rules beat most industries’, and the hi-res graphic is in the comments. HCN: Epic Probed by the FTC: I joined the HCN guys to talk through the FTC’s investigation into Epic. Cedric’s new hairdo was an unexpected plot twist. The episode also covers MFN drug pricing, healthcare M&A and Eli Lilly’s acquisition streak. Fall Conferences: At eHealth Exchange’s Annual Meeting in Austin on Oct 27, I’ll moderate a panel on the tensions between AI, HIEs, and timely patient access with Jean Ross (Primary Record), Therasa Bell (Kno2), Byron Crowe (Doctronic), and Michael Marchant (Freenome). Here’s the rest of my schedule if you want to meet up: CommonWell (Redwood Shores, CA): Oct 13-14 Will be participating in a fun Jeopardy event Open@Epic (Madison, WI): Oct 20-23 Will be enjoying Verona, Willy Street, and other local adventures eHealth Exchange and Sequoia Project (Austin, TX): Oct 27-29 Yeehaw HLTH (Vegas): Nov 15-18 Groundhog Day, Venetian Edition RSNA (Chicago): Nov 30-Dec 2 See me at “Governing AI in Breast Imaging: What Health Systems Are Actually Doing” Digital Health Counsel 2026 AI Summit (Seattle): December 2-3 Will likely be speaking to a bunch of lawyers about information blocking Posts I Liked ChatGPT’s Epic integration: game changer or nothing burger?: Joshua Liu, MD offers five thoughts on OpenAI’s Epic launch, starting from the point that it rides the same open APIs available to anyone. He argues read-only access leaves ordering to Art and the ambient startups, and asks why HCA is piloting it alongside Commure. He’s sorta a must-follow at this point - consistently excellent, thought-provoking takes. Epic, Lilly, and the Discovery pass: Seth Chaney reads Epic’s first major Discovery deal (with Eli Lilly), as well as its revised developer terms on commercial displays, as the pipe finally opening between EHRs and pharma. Life sciences and health continue to collide. Scott Rossignol on EHR payer platforms and ePA fees: Scott argues the top ambulatory EHR vendors are turning the prior auth mandate into a per-member-per-year toll on payers, for an API whose operating cost has nothing to do with covered lives. His fix is two lines of regulatory text: put the CRD/DTR/PAS certification criteria in the Base EHR definition, and bring payer-facing ePA connectivity under § 170.404’s cost-based fee rules. It’s a good solution. Health API Guy is a reader-supported publication. To receive new posts and support my work, consider becoming a free or paid subscriber. Subscribe
Analysis: Huge relief for Maresca's City
Manchester City showed improvement from the side who were bashed 3-0 by Arsenal in last Sunday's Community Shield - but for most of this game it looked as if Enzo Maresca was going to start with consecutive defeats. Replacing a legend is always difficult - as David Moyes experienced when Sir Alex Ferguson left neighbours Manchester United in 2013 - and the late comeback will come as a major relief in their first Premier League game without Pep Guardiola in a decade. City did not exactly promote from within when hiring Maresca, who quit as Chelsea manager at the start of 2026, but the Italian was Guardiola's City assistant in 2022-23 and would perhaps be seen as something of a continuity candidate.
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