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FMOL Health | St. Francis Medical Center hosting annual health fair
FMOL Health | St. Francis Medical Center is hosting their annual Healthy Starts with Hello health fair!
Washington Huskies Head Coach Voices Support For Expanded Playoff
Jedd Fisch seemed optimistic about the College Football Playoff expanding from 12 to 24 teams.
Ojeda wants to end Iran War, improve economy and affordable healthcare
Richard Ojeda chats about the campaign trail, the war in Iran and much more as the challenger gets ready for the final sprint to election day.
Food Science Pilot Plant internship helps student find passion and gain experience
The University of Illinois Food Science Pilot Plant offers space for food processing companies to test new ingredients and technologies. And it gives students real-world experience to prepare for food science careers.
Washington Huskies Head Coach Gets Honest About Program's Financial Limitations
Jedd Fisch expanded about the money the teams poured into the roster, which ranks near the bottom of the Big Ten.
Jedd Fisch Provides Update on Demond Williams
“He's a day-to-day situation,” Jedd Fisch initially said of quarterback Demond Williams during his Monday afternoon press conference. “He's got a rib injury. So we will monitor that each day on where he's at… Just kind of waiting on imaging and then treatment and what that looks like.” The Washington head coach said that Elijah …
Apple TV 4K Getting A19 Chip and Easier-to-Find Siri Remote
Apple's new Apple TV 4K will be powered by a standard A19 chip, up from the A15 in the current 2022 model, reports Bloomberg's Mark Gurman. Writing in his Power On newsletter, Gurman also said a refreshed Siri Remote will come with a speaker to make it easier to find between couch cushions.
Spence makes Inter debut: how the former Tottenham defender fared
Djed Spence finally made his Inter debut in Saturday’s 3-0 win over Parma, and showed a few glimpses of what he can offer.The former Tottenham defender came on in the 73rd minute with the result lon...
Washington’s Physicality Gap Amplified in Iowa Loss
Elijah Brown’s second-half performance struck life into the Washington offense, but it wasn’t enough to overcome the hole it dug itself against Iowa in the first half. The Huskies began the game with five straight punts. In what Jedd Fisch called a measuring stick game against the Hawkeyes, his team failed to measure up to …
Trump establishes committee to investigate Federal Reserve's Lisa Cook in latest effort to fire her
The inquiry will include a hearing at the White House Nov. 5, President Donald Trump said in a written memo, that Cook “shall” attend to answer questions from the committee.
Spence in contention for Inter debut against Parma: ‘He’s available’
England international Djed Spence is finally in contention to make his Inter debut this coming weekend after being declared fit and available by head coach Cristian Chivu: ‘We’re pleased that he��...
Utah expands healthcare AI sandbox with August AI, Nolla Health pilots, adds third-party evaluators
Utah is expanding the state's AI regulatory sandbox program with new pilots to test AI-supported prescription renewals, dermatology and physical therapy, while adding physician oversight and indepe | Utah is expanding the state's AI regulatory sandbox program with new pilots to test AI-supported prescription renewals, dermatology and physical therapy, while adding physician oversight and independent third-party evaluators to strengthen safety and accountability.
Measuring Stick for the Washington Run Defense Against Iowa
Two years ago, Iowa rushed for 220 yards on the Washington run defense, averaging nearly six yards per carry inside Kinnick Stadium. The Huskies lost 40-16 in what was just the fourth Big Ten game of Jedd Fisch’s tenure in Seattle. The loss demonstrated the physicality and stylistic gap that Washington aimed to close as …
Islamic Development Bank and Global Fund Strengthen Partnership to Advance Sustainable Health Financing
GENEVA/JEDDAH – The Islamic Development Bank (IsDB) and the Global Fund to Fight AIDS, Tuberculosis and Malaria (the Global Fund) signed on 6 October a new Partnership Agreement to strengthen collaboration and accelerate investments in health across low- and middle-income countries. The agreement, which marks a new chapter in a long-standing relationship, establishes a framework for aligning investments and coordinating financing, mobilizing additional resources, and supporting country-led efforts to build…
Former first-round pick Jedrick Wills lands in Arizona
The Arizona Cardinals signed free-agent offensive tackle Jedrick Wills on Tuesday
Arkansas Advocate on Ozarks at Large: Maternal health, Kentucky's governor and political debates
Arkansas Advocate Editor-in-Chief Andrew DeMillo joined Ozarks at Large Senior Producer Matthew Moore on KUAF this week to discuss recent grants for maternal health, Kentucky's governor rallying Democrats and the history of political debates.
Arkansas Advocate on Ozarks at Large: Maternal health, Kentucky's governor and political debates
Arkansas Advocate Editor-in-Chief Andrew DeMillo joined Ozarks at Large Senior Producer Matthew Moore on KUAF this week to discuss recent grants for maternal health, Kentucky's governor rallying Democrats and the history of political debates.
Northwest Arkansas growing pains, national concerns top issues at Springdale political gathering
Rain and overcast skies didn’t dampen the mood at the annual Chickin, Peelin’ & Politickin’ event Thursday at Springdale’s Shiloh Square as residents, business owners and elected officials networked over plates of fried chicken and shrimp.
'War's devious mole strategy, explained
Archie Renaux explains "War"s extra devious move.
Arkansas, Kentucky each awarded $10M grants for maternal health efforts
A nonprofit founded by philanthropist Olivia Walton announced Thursday it is awarding $10 million grants to Arkansas and Kentucky to improve maternal health in rural communities.
How Washington Funded the Politicization of Science
Over the last half-decade, the National Science Foundation (NSF) has spent hundreds of millions of dollars on projects designed to influence academic policies, both in the sciences and other disciplines. The aim was to foster a progressive conception of social justice in these fields. In pursuit of this end, the foundation earmarked nearly a million dollars for a project titled “Creating Inclusive Scientific Societies through Policies and Practices,” over a million for a project on “Faculty Online Learning Communities for Gender Equity,” and over $2 million to foster “racial equity focused departmental change.” Through a public records request, I’ve obtained the proposals and progress reports for dozens of NSF grants designed to promote social justice. Although funding for these grants was eventually halted by the Trump administration, the projects illustrate an important facet of recent higher-education policy. Many of the university policies that promised “social transformation” didn’t arise in a vacuum. They were actively encouraged by outside funders—often by the federal government itself. Subscribe Accreditation—the peer-review process which enables universities to receive federal grants and student loans—has recently become a policy battleground, with accreditors wielding significant power over both universities and academic disciplines. In 2020, when Oregon Health and Science University’s medical school issued an extensive diversity action plan—which promised “consequences” for employees who failed to support “DEI, anti-racism and social justice”—it specifically pointed to the Liaison Committee on Medical Education (LCME), the medical-school accrediting body, to justify the overhaul. The NSF actively promoted DEI-focused accreditation policies. The proposal for a $1.2 million program on promoting “community engagement” in STEM, which I obtained through a records request, notes that the Accreditation Board for Engineering and Technology was exploring changes to its criteria “that would incorporate JEDI [justice, equity, diversity, and inclusion].” The proposal promised to “support broader JEDI efforts in the general criteria for engineering.” Another grant funded a conference designed to “identify and share best practices and strategies to integrate IDEA principles in accreditation criteria”—referring to an acronym that stands for “inclusion, diversity, equity, and accessibility.” Scholarly societies have become another flashpoint in debates over higher education. Critics argue that many of these societies, which have the power to shape entire disciplines, have become increasingly politicized. Again, through its giving, the NSF played a role in promoting this politicization. In one million-dollar grant that received funding in 2024, a group of psychologists proposed a series of social-justice reforms to the Society for the Psychological Study of Social Issues. The proposal, which I obtained via a records request, asserts that “[r]edistributing resources (such as moving different people into leadership roles) is not enough” and that the society’s “governance structures do not yet reflect its stated values of diversity, equity, and inclusion.” Its solution: review and rework the society’s criteria for leadership development, academic awards, conferences, and publications. Adjusting review criteria informed by “intersectionality” designed to fight “epistemic exclusion” is an easy way to introduce de facto ideological litmus tests into the peer-review process. For many of the grants I obtained, such litmus tests seem to be the point. “Academic departments are racialized social systems that produce and sustain the byproducts of systemic racism,” a proposal for a $2.7 million project funded in 2024 asserts, promising to develop “departmentally-focused change efforts that cultivate values, assumptions, and behaviors that advance racial equity.” The University of Illinois Urbana Champaign’s million-dollar “I-ADVANCE” project, which effectively created a small DEI bureaucracy on campus, promised to Embed 28 ADVANCE faculty fellows in STEM departments” to amplify its equity goals. Another $1.2 million project promised to create “faculty online learning communities,” made up of scientists at universities around the country, that would eventually build department-level diversity action plans. “Ultimately,” the proposal asserts, perhaps more perceptively than its authors realized, “both organizational change and intersectionality frameworks deal with power.” Indeed, such grants confer a great deal of power to administrators and scholar-activists, who can even use the mere availability of funding as a tool to advance their causes. That history is worth remembering amid today’s debate over federal involvement in higher education: Washington has been shaping university priorities for years, including by financing efforts to instill progressive ideas about race, gender, and equity into academic institutions—and many of the policies those grants encouraged remain embedded within universities long after the federal money has stopped flowing. John D. Sailer is the director of higher education policy and a senior fellow at Manhattan Institute. Share
Is it your personality or a psychological disorder? TikTok has answers.
Maladaptive daydreaming, obsessional jealousy and misophonia are now topics of study as social media trends force psychiatrists to rethink their diagnostic “bible.”
Respawn Entertainment’s Star Wars Jedi 3 will reportedly be shown off before the end of 2026
Respawn Entertainment’s Star Wars Jedi series is one of the most celebrated modern iterations of thi
Washington’s 2026 Season Is Built on Poor Decisions
What makes Washington’s mediocre start to the 2026 campaign so frustrating is the core issue: poor decision-making. But that was bound to be the story of the season, wasn’t it? Between quarterback Demond Williams’ offseason drama and head coach Jedd Fisch’s overall approach, the Huskies were doomed from the beginning. Days removed from Washington’s loss […]
Fifth graders pitch business ideas at ‘Swimming With the Big Fish’ competition
Students from three area schools spent weeks preparing proposals for local executives.
Evaluating UW Offense, Matchups Against Minnesota
The UW offense found its stride last week against Eastern Washington. It had three explosive run plays, ten explosive passing plays, and over 500 yards of offense. The run game, and how the offensive line contributes to it, continues to be the weak point for this offense, however. Jedd Fisch’s group is averaging 129 rush …
Oracle Health rolls out AI solutions for RCM, oncology as part of broader healthcare, life sciences strategy
ORLANDO, Fla.—Healthcare is entering an AI era, and the industry needs a fundamentally different architecture designed for AI from the start, Oracle Health executives said Wednesday. | Healthcare is entering an AI era, and the industry needs a fundamentally different architecture designed for AI from the start, Oracle Health executives said Wednesday.
New Jersey Politics (Episode 529)
This week on New Jersey Politics, a new law signed by Gov. Mikie Sherrill creates an employee-ownership transition program through the NJEDA, with education,
Good, Bad, and Ugly from Washington Football's Non-Conference Slate
The Huskies are 3-0 entering Big Ten play, but questions still remain around Jedd Fisch's team.
Inter ready to welcome Spence back after Tottenham move
Djed Spence hasn’t yet played for Inter since his move from Tottenham, but according to Gazzetta, the Englishman will be available when Serie A resumes in October.English defender Spence is preparin...
BAAN Holding: Playocity Entertainment Project in Jeddah to Cost SAR 25 Million
BAAN Holding Group Company announced that the estimated cost of its new Playocity entertainment project, in partnership with global brand Hasbro, is…
Texas Tech Health Sciences Center receives $24.5 million NIH grant
The Texas Tech University Health Sciences Center has received a $24.5 million grant from the National Institutes of Health.
Texas Tech Health Sciences Center receives $24.5 million NIH grant
The Texas Tech University Health Sciences Center has received a $24.5 million grant from the National Institutes of Health.
Jedd Fisch Addresses UW Offensive Line, Run Game
“The running game needs to improve for us to be the type of offense that we want to be,” Jedd Fisch said on Monday after the Utah State win. “Understanding that complementary football is the most important thing we can do.” Washington’s running backs finished Saturday’s game with a combined 49 rushing yards on 21 …
Jedd Fisch shares plans for Washington football's RB rotation
The Washington Huskies are planning on utilizing a heavy rotation at running back against Utah State.
Columbia and JED partner on teen mental health and AI safety | ETIH EdTech News
Columbia University’s Technology & Democracy Initiative and The Jed Foundation have partnered on teen mental health and AI safety. ETIH covers the edtech news project, including an expert roundtable, working paper and planned guidance for AI developers, policymakers and youth mental health speci
CJ CheilJedang sets Singapore hub for APAC seasoning business
CJ CheilJedang has opened a Global Technical Center in Singapore to expand its food seasoning ingredients business in the Asia-Pacific region. The company held
Washington offense overcomes early struggles in Apple Cup win
Despite his obvious frustration, Washington coach Jedd Fisch had a few compliments for his offense after it scored a pair of fourth-quarter touchdowns to finish off a 24-10 victory over Washington State on Sunday in the Apple Cup. It was markedly different from Fisch’s mood a few hours prior, when he had some harsh words after the Huskies failed to score a touchdown on fourth-and-1 from the 1, which would’ve put them ahead 17-0. “We’ve got to run the ball a lot better than we’re running the ball, we’ve got to hit passes that we’re not hitting,” Fisch said during his halftime sideline interview.
15 discouraging hours with Onimusha: Way of the Sword, and 10 brilliant ones with He Who Watches
In the last few weeks, while playing some video games that I might review, I emailed two cries for help. I sent the first to a rep for Capcom, confessing that the company’s samurai game Onimusha Way of the Sword (out today for PC and console) was crushing me. “Feels like I’m playing ‘hard’ mode, not ‘normal,’” I wrote. “And I don’t want to have to knock it down to “story”. I’m exploring, trying to level my gear, but these two-phase boss fights with no mid-fight checkpoints are brutal.” I wagered I was only about halfway through the game, if that. I wasn’t sure I could keep up with the steepening difficulty curve. Was I missing something? Then, on Monday, I took some photos of some puzzles that were baffling me in the mind-bending He Who Watches (out now on PC), wrote out lengthy descriptions of how I’d been trying to solve them and asked Bobby Vanden, the game’s solo developer, for a nudge in the right direction. I told Vanden I’d spent hours on these puzzles. “I’m stuck in triplicate,” I told him. Could he tell me if the solutions I was attempting were even on the right track? I didn’t mention that the puzzles—coupled with major time pressures from other work—were stressing me out so much that playing the game was giving me headaches. This double dose of panic was unusual. I’m used to managing a workload full of reporting and reviewing, used to a crowded schedule and the need to stay calm amid the bustle. But I was stressed about these games. No one was forcing me to review them, nor even play them. I’d simply found them interesting enough to start, hoped they’d be interesting enough to write about and I’d sunk hours into them assuming I’d made the right call. Suddenly, however, I felt trapped. I was emailing for a way out. Above: This guy took me about an hour to beat. The feedback I got from Capcom confirmed my fears. They didn’t say it, but I will: Onimusha Way of the Sword is not for me. It’s a brutally hard game in need of a normal difficulty level. It’s a game that spikes so severely during its abundant boss fights—yet offers such flawed ways to improve when outside of them—that it feels like a bait-and-switch. In the new Onimusha, you play as famed samurai Musashi Miyamoto, aided by a magical soul-absorbing gauntlet that is possessed by a lady who offers advice. (Way of the Sword is a continuation of Capcom’s long-dormant Onimusha series, but that set-up had me wondering if the company was cribbing from their ill-fated Bionic Commando reboot; read about “wife-arm” when you get a chance). Way of the Sword is partially set in 17th century Kyoto, an explorable city where Miyamoto can fight demons, help civilians and eventually rescue ghostly dogs. The city evolves over time, with new mini adventures and obtainable loot on offer, all feeding into systems that promise to upgrade your gear and sword-fighting skills. Upgrades, however, are so incremental as to be imperceptible, causing the exploration of Kyoto to feel like inconsequential busywork. From that hub, players can go on linear missions into forests and old temples, where they will encounter many of the game’s tough bosses. Combat in Way of the Sword is akin to many modern melee games. Players are asked to mix attacks with dodges and parries. They’re encouraged to deplete an enemy’s stamina bar in order to do greater damage to its health bar. The old Onimusha games’ signature move was the issen, a counter-attack so sudden it’s all but pre-emptive. You strike just as they begin to strike toward you, beating them to the cut. By definition, the issen is a high risk move, leaving you wide open to pain. It feels risky in the game, especially against bosses, who can maul you in just a few blows. A game might train you to perform an issen well by offering a variety of lesser enemies who are not as tough as the boss but get close. Or it might offer a toehold against bosses by saving or checkpointing the player’s progress when a boss’ first health bar has been destroyed and before the second health bar appears. It might offer the less skilled player a chance to over-level their character, should the player simply commit to playing through its optional sidequests. Way of the Sword does none of this. Fighting its trivially easy grunt enemies and then its ferociously adept bosses is like playing a game of chess where I’ve got a rook, while the opposing side is all pawns and five queens. Bosses simply don’t checkpoint. You may be able to clear a boss’ first phase without taking much damage. Good for you. Do it again, every time you fail the second phase. As for the the central Kyoto hub, I kept pace with all of its added side activities and never felt like I was overpowered. Bosses could still easily buckle me. The new Onimusha, I concluded, is just too discouraging to keep playing. The advice I got from Capcom had been well-intentioned. They reminded me of the game’s various systems. They alerted me to an optional assist that flashes recommended button inputs (basically: counter this move; dodge that move). It was a little helpful. So was dropping down to “story mode,” which I tried last night. Story mode turns on those button prompts by default. It makes countering and dodging way too easy, nearly automatic. I don’t consider myself a master of action games like these, but I’ve cleared the likes of God of War, Stellar Blade, Star Wars Jedi and others of sub-Sekiro difficulty and had a fun time doing so. Not here. Not yet. Unless they patch Onimusha: Way of the Sword and add a middle difficulty or just checkpoint the damn bosses when they’re between health bars, my streak of loving Capcom games released in 2026 will likely end at two. It’s a shame, because I was having a good time finding those ghostly dogs. And then there’s He Who Watches, a phenomenal first person puzzle game with Portal vibes, except instead of a portal gun you’ve got a magical bow that shoots one arrow that can activate switches or be used to drag blocks. The twist is an actual twist: you can also walk on walls and the ceiling, reorienting gravity as you do, thereby placing blocks onto those other surfaces. Walking on walls and ceilings to solve problems is really the best thing. Would that I could in reality. He Who Watches consists of locked-room challenges, each brief enough to only require about a minute to actually solving, though it will take five, 10, eventually 30 minutes to figure out said solutions. They are not obvious! It’s a game of layered mechanics and shocking solutions. For example, see if you can follow this: You can drag a block to a wall. Then you can walk on the wall, which now feels like the floor, and drag that block across the wall. Later, back on the floor, you might realize you can look up. The block is still on the wall, stuck to it. You can shoot your magic arrow to its underside. Doing so creates a tether, so that you can yank the block off the wall and carry it, as if it were a balloon, into the spot where you need it to be to solve the puzzle. Here, watch Vanden explain some of the game’s basics in this launch trailer: As with any great puzzle game, the solutions to He Who Watches’ puzzles elicit relief and amazement. Oh my god, that worked! I didn’t even think that could be possible! Learning to solve the game’s puzzles feels like learning magic. But, oh, does the game get hard. Its Steam reviews, mostly glowing, are full of players remarking how quickly He Who Watches made them sweat. Wrote one: “loving this one already although my brain is hurting!” Wrote another: “As you get further in the game it feels like you need an IQ level of at least 120+.” Vanden has shown some mercy. Each locked room puzzle includes an optional junior version of the puzzle, meant to teach you. Difficulty nevertheless ramps severely. By the time I was emailing Vanden for help, I was struggling to even clear one of the hint puzzles. When I messaged him, my stress was exacerbated by strange things I’d found in the game’s various hubs: suspicious passageways, odd blocks and some intriguing locked doors. These were hints of secrets, I realized, yet I sensed I needed to play further into the game to understand them. I was stuck, but I wanted to see the rest. Vanden offered to give me the exact solutions, to solve those three puzzles for me, but first he gave four nudges. Three were for the specific puzzles, but his best hint was for all and ultimately proved to be a terrific life lesson: go back a bit, he suggested. Do the puzzles right before those. They were teaching you something. Focus on what their lesson was. Don’t rush, in other words. Recognize what you’ve accomplished. Build off of that. I did so. I absorbed the lessons. I saw those three tough puzzles in a new light. I solved one the night after he wrote back, another the morning after. I left a third for another time. I didn’t need it and I wanted to plunge deeper into the game, closer to the moment when I was sure I could start unlocking those secret doors. My head stopped hurting, too. He Who Watches feels special. It’s got more challenges, and I’m undeterred. It’s also nice that its puzzles don’t have a surprise second health bar. Game File is a reader-supported publication. To receive new posts and support my work, consider becoming a free or paid subscriber. Subscribe Item 2: In brief… 🎮 Ilari Kuittinen, co-founder of Helsinki-based Housemarque (Super Stardust HD, Resogun, Returnal) has stepped down from his studio, after a 31-year run, saying he’s “ taking a rare and well-deserved breather.” Sony purchased Housemarque in 2021, and the studio released its newest game, Saros, earlier this year. Trend-watch: Sony-owned Insomniac saw its founder Ted Price retire in early 2025, after a 30-year run. Sony-owned Sucker Punch saw its co-founder Brian Fleming step down in late 2025, after a 28-year run. 👀 Savvy Games Group chief Brian Ward is stepping down from the Saudi-government-backed games conglomerate, Bloomberg reports. No word on a long-term successor yet, nor if this augurs any closer integration between Savvy and Electronic Arts. EA was purchased by a consortium led by Saudi’s sovereign wealth fund, in early August. 💿 Square Enix has denied a Japanese media report that the company was planning to go private. In very different Square Enix news, the company revealed that the physical version of Final Fantasy VII: Revelation, the April 2027 finale of its radical remakes of FFVII, will include just one disc in its case, requiring a download for the rest. The first two FFVII remakes in the trilogy shipped on two discs apiece. While Square hasn’t commented on the reason why, a feature here in Game File last month broke down the processes and costs for physical games. The expense of a second disc comes out of the game publisher’s cut of each copy. Square could be saving in excess of a dollar a copy with this move. 🟥 Grand Theft Auto IV’s 26-minute ’‘extended look” gameplay showcase that premiered on Netflix last week—and was exclusive to the platform for six hours—drew 31.1 million views in its first four days, the streamer announced. (Netflix calculates views as total viewed hours divided by runtime; excludes replays). Compared to YouTube: The version that later premiered on Rockstar Games’ YouTube channel is sitting at 22.6 million views after seven days (YouTube’s more liberal counting system tallies anyone who viewed even just the first few second.) Compared to other Netflix mega-events: Last year, Stranger Things season 5’s first four episodes, which debuted together, drew a record 59.6 million views in their first few days on Netflix. For more of a live event type of comparison, in 2024, the Jake Paul vs. Mike Tyson boxing match drew 65 million concurrent streams as it happened; Netflix didn’t release live numbers for the GTA premiere. ☁️ Microsoft is changing the way it charges for cloud gaming, from an all-you-can-play offer for Xbox Game Pass subscribers, to caps for the subscription’s tiers (15 hours per month at the Ultimate tier), with the option to buy more hours in bulk beyond that. The company also said it will sell batches of cloud gaming time to non-Game Pass subscribers, details TBA. Microsoft does not release figures for cloud game usage, but said its changes would impact 4% of Game Pass subscribers. That implies a small portion of its subscribers exceed the 15-hour monthly mark. Cloud gaming offers the promise of playing games without the need for console or PC hardware, as the graphics, sound and controls are all transmitted via a streaming connection. Microsoft notes that its cloud gaming service can be used for a range of things, including Xbox One players using it to play newer-gen Xbox Series games via streaming; and people playing games via streaming, sans any console, “in markets where consoles are less available or affordable.” (That latter use case could even be relevant in Xbox’s home market soon, as console prices keep rising.) Take Two Interactive chairman Strauss Zelnick recently told investors he expects game-streaming tech, which has been only lightly adopted by gamers for over a decade, to be widely used within three years. 🇺🇸 The Trump administration has published multiple agenda-driven web video games to the White House’s website. One called Build The Wall partially clones Tetris as it asks players to build a wall to stop a “zombie border siege.” While actual Tetris involves clearing lines and basically not building a wall, the Trump-backed game omits the line-clearing aspect (and omits the fun as well). On Instagram, Tetris’ official license holders reacted by stating: “At Tetris we believe in the power of connection and bringing people together, not dividing them. To our fans everywhere: we love you, we see you, and we’re grateful to have you in our community. P.S. The Tetris Company was not involved in the creation of ‘Build the Wall.’ P.P.S.: We take copyright infringement very seriously.” Item 3: The week ahead: Tuesday, September 8 Game releases: Mewgenics (consoles; already out on PC) is an engrossing tactical combat game (with cats). It is getting its console port right after the release of a Star Wars tactics game and ahead of the late September launch of a Fire Emblem–a bumper crop for the genre. Wanderburg (PC) is an auto-shooting game like Vampire Survivors, but you’re a castle on wheels Event: Nintendo airs a 30-minute Nintendo Direct (10am ET) focused on The Legend of Zelda’s 40th Anniversary. A full unveiling of the upcoming remake of The Legend of Zelda Ocarina of Time is expected. Will they also show footage from next year’s live action movie? Tease the next big 3D Zelda? Add Link to Mario Kart World? Shadow-drop a new Tingle game? Wednesday, September 9 Event: Nintendo again! On this day, they’re planning to air a 45-minute Nintendo Direct (10am ET) focused on games heading to Switch 2 this winter. Followed by about an hour of gameplay demoed by the company’s Treehouse team. The September Nintendo Directs are always some of the year’s biggest. The 2025 edition included announcements of several major 2026 Switch/Switch 2 games: Pokémon Pokopia, Mario Tennis Fever, Yoshi and the Mysterious Book, Fire Emblem Fortune’s Weave. Plus the return of the Virtual Boy. Friday, September 11 Game release: EA Sports NHL 27 (PlayStation, Xbox) is a hockey game. There are so few that an indie studio that had been making wacky sci-fi first-person shooters just announced that, hey, we’re going to fill a void and make a hockey game for PC.
Apple Cup Preparation for Washington, Prediction
For the second straight year, Jedd Fisch and Washington have to prepare for a reshuffled Washington State program with a coaching staff and personnel overhaul. Former Oregon State defensive coordinator and head coach Trent Bray now calls the Cougar defense. Washington State head coach Kirby Moore’s offense stems from his stint as the offensive coordinator …
Jed York, 49ers' brass are making plans in advance of potential suspension
This Sneaky 'Jedi Mind Trick' Hack Can Hijack a Business's AI Chatbot and Cost It Millions
Prompt injections can lead to devastating losses. Here's how to protect yourself.
Northwest Arkansas hospital becomes latest site for state's maternal health program
A program aimed at supporting high-risk pregnancies has expanded to Mercy Hospital Northwest Arkansas, Department of Human Services officials announced Monday.
Byron Donalds, Bill Maher discuss Lindsay Clancy, Jed York
The Congressman balanced tragedy and levity.
49ers coach Kyle Shanahan has business-as-usual approach to Jed York situation
San Francisco 49ers coach Kyle Shanahan addressed the situation surrounding Jed York's arrest.
Next Apple TV Rumored to Have Five New Features, Including Siri AI
According to rumors, the next-generation Apple TV 4K will have at least five new features, including an A17 Pro chip or newer, increased RAM, Siri AI support, an Apple-designed N1 chip with Wi-Fi 7 support, and an updated Siri Remote. Below, we recap everything rumored for the next Apple TV, along with potential launch timing.
Maury Povich details how infamous ‘Jenny Jones Show’ killing ‘changed everything’ for daytime TV
Scott Amedure’s 1995 murder by fellow ‘Jenny Jones Show’ guest Jonathan Schmitz ‘changed everything’ about the landscape of daytime TV, talk show legend Maury Povich says.
Science Says ‘Grandma Hobbies’ May Have Real Health Benefits
Knitting, gardening, and other hands on, old-fashioned activities can be more than just relaxing—here’s what they can do for your brain, mood, and more.
ICYMI: NJEDA to Auction Up to $25M in Business Tax Credits
The New Jersey Economic Development Authority (NJEDA) will auction up to $25 million in corporation business tax and insurance premiums tax credits in the
Sadie Sink opens up about Marvel role and prepping for ‘X-Men’
Sadie Sink finally talks about her Marvel role and what comes after ‘Spider-Man: Brand New Day’
Atlanta sports radio news: John Kincade set to join 680/93.7 The Fan
John Kincade takes over for Chuck Oliver with Matt Chernoff on Atlanta sports radio show 680/93.7 The Fan.
Disney's 'Toy Story 5' fuels streaming business and merchandise sales for June quarter
Disney said the blockbuster success of "Toy Story 5" extended beyond the box office for the June quarter, as the hit film fueled sales of merchandise, added to engagement on the Disney+ streaming service, and attracted more visitors to its theme parks.
Missouri Gov. Kehoe addresses Springfield business leaders at annual Chamber of Commerce event
Gov. Mike Kehoe visited Springfield on Wednesday to speak to local business leaders at the Springfield Area Chamber of Commerce’s annual State of the State address.
Ancient human relative cannibalized both adults and children in a cave in Spain 850,000 years ago, fossils reveal
Newly excavated bones from Gran Dolina cave in Spain reveal an ancient human relative practiced cannibalism on adults and children, but researchers still don't know why.
Greechan looks to future after Guernsey defeat
Jersey's Taylor Greechan hopes his experience at Glasgow 2026 can help him in future Commonwealth Games.
Stanford lecturer says red light therapy has real science behind it — but not every device works
Red light therapy has become a fixture on social media, with influencers claiming it can improve skin, reduce pain and speed recovery. Rachele Pojednic, faculty at Stanford University and chief science officer at Restore Hyper Wellness, said the science behind it is more solid than many people assume.
Red Light Therapy - social media fad or real science?
Red light therapy has become a fixture on social media, with influencers claiming it can improve skin, reduce pain and speed recovery. Rachele Pojednic, faculty at Stanford University and chief science officer at Restore Hyper Wellness, said the science behind it is more solid than many people assume.
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Is SMIC N+3’s Metal Pitch Smaller than Intel 18A’s?
Almost four years ago, we published that SMIC had started shipping 7 nm (N+1) chips. Now, SMIC is shipping its third-generation 7 nm (N+3) process in Huawei’s Kirin 9030, with a minimum metal pitch of 32.5 nm, about 10% tighter than the 36 nm minimum metal pitch shipping in Intel’s latest Panther Lake CPUs on 18A. The headline is true, but incomplete cherry picked metric. N+3 reaches the density of TSMC N6 through aggressive DUV multi-patterning and design-technology co-optimization (DTCO), but it pays for that in complexity, efficiency and process control. We found this and more in our reverse engineering and teardown where we cover SMIC’s N3 process technology, Huawei’s packaging, memory, architecture, and more. SemiAnalysis has been building a state-of-the-art teardown lab in Oregon capable of analyzing the world’s most advanced and important chips over the last year and half. We have already generated revenue on advanced datacenter chip teardowns including our recent reverse engineering of a major TSMC customer’s COUPE CPO optical engine + EIC 3D stack. This is the first public report from the SemiAnalysis Teardown Engineering & Evaluation Lab, or STEEL for short. The lab is aggressively scaling up and out and we’re excited to announce it publicly. This is a bit of inconvenient timing for TechInsights as they are private equity owned and currently being sold while having enjoyed virtually no credible competition for decades. This has led to TechInsights underinvesting in CAPEX. SemiAnalysis exceeds TechInsights in revenue despite no venture or private equity ownership and being founded only 6 years ago. Because we have no external investors and are founder led, we move faster, build faster, and we can release client chip teardowns for free regularly, while focusing on datacenter for our major clients. Here’s the first public image from our lab, the HiSilicon Kirin 9030 Pro SoC: This report will detail our teardown of the Kirin 9030 and our findings on SMIC’s N+3 process, the most advanced in China. For comparison, we’ll show our teardown of the MediaTek Helio G99, made on TSMC N6. Through this comparison, we can look at the effect of export controls – SMIC N+3 and TSMC N6 are comparable nodes, but one is heavily export-controlled, the other free to use the West’s most advanced equipment. Here we see both China’s progress and constraints. SMIC N+3 reaches TSMC N6-class logic density, but it requires far more aggressive DUV multi-patterning, so it does not match N6 on process maturity or cost. The Kirin 9030 Pro performs similarly to three-year-old Android flagships, and trails far behind the current flagship SoCs from Apple, Qualcomm, MediaTek, and Samsung. The efficiency gap is even wider. Export controls have not stopped Huawei and SMIC from shipping advanced silicon, but they have forced a different path. Without EUV, SMIC is leaning harder on DUV multi-patterning, DTCO, and increasingly complex integration. The roadmap continues forward through tighter design rules and backside power, but each step adds cost and process risk. Huawei’s τ scaling and LogicFolding show another path: stacking active logic and recovering density through advanced packaging and system-technology co-optimization (STCO). To understand the Kirin 9030, we must first understand Huawei’s SoC history. HiSilicon is Huawei’s chip design arm, responsible for the Kirin smartphone SoCs, Kunpeng server CPUs, Ascend AI accelerators, and switch/router networking silicon. Before export controls, Huawei was TSMC’s largest customer – the only customer on TSMC’s first EUV node, N7+, and among the first on N5, alongside Apple. That ended in late 2020. Huawei switched to Qualcomm SoCs in its flagship smartphones, though export controls limited them to 4G-only variants. In late 2023, Huawei returned to in-house silicon with the Kirin 9000s, a successor to the Kirin 9000, fabricated on SMIC N+2 instead of TSMC N5. In the following years, they released the Kirin 9010 and 9020 on the same N+2 process. These chips used Huawei’s in-house TaiShan CPU cores and Maleoon GPU. We have not torn down a Kirin 9020 ourselves, so the predecessor die shot is from Kurnal. The die shots show how Huawei spent its silicon budget: which functional blocks are where, and how their areas compare to the predecessor. First, a quick guide to the major blocks on the die. The total die area is nearly identical, but the 9030 uses that area more aggressively. A denser process lets Huawei fit an extra middle CPU core, more GPU and NPU cores, and larger caches into the same footprint. In contrast, the Helio G99 is a much smaller, low-cost SoC, built for budget smartphones rather than a flagship device. While the Kirin 9030 is ~140 mm², the G99 is only ~29 mm², roughly one-fifth the area. The underlying TSMC process technology, however, is directly comparable as a baseline for analyzing SMIC’s. The Kirin 9030 is an evolutionary refresh, not a clean-sheet design. Its CPU, GPU and NPU cores carry over the 9020’s families, and the gains come from three levers: the SMIC N+2-to-N+3 process step, DTCO and floorplan work, and incremental microarchitecture. Area is where the first two show up, and the 9030 scales well here. Performance and efficiency are the harder test. Huawei’s design holds up better than its node would suggest, but the chip still trails, both because N+3 sits behind the leading-edge nodes and because its cores, while competent, remain a few generations behind the newest designs. The new prime core is an incremental update. The main changes are a 10% frequency increase from 2.5 GHz to 2.75 GHz and a doubling in the L2 cache from 1 MiB to 2 MiB. Despite the increased cache, the core size decreased by 7.6%. Excluding the private L2 cache, the core size decreased by 21%. This is a large reduction for an incremental node. Compared with the TaiShan New V120 core in the Kirin 9020, the Kirin 9030’s middle core is almost unchanged architecturally, yet each core shrinks by ~22%. Most of that comes from the move from N+2 to N+3, with layout likely accounting for the rest. Visually, the most noticeable change is the increase from 3 middle cores to 4. There is also a 20% increase in the shared L3 cache of the big cluster. This helps to improve multi-core performance without sacrificing much in terms of area. Even with each core shrinking, the big CPU cluster’s total area is essentially unchanged. The per-core savings went back into an additional middle core and larger caches. The tiny cores shrank less than the prime core (excluding its L2 cache) and less than the middle cores. This is likely because fixed overhead is a larger share on a small core. We cannot resolve any architectural changes from the die shot alone, but the per-clock and efficiency gains shown below point to more than pure process and layout scaling. The area reduction was offset by a doubling of the shared L2 cache from 2 MiB to 4 MiB, leaving the total tiny CPU cluster area slightly larger. Area is the easiest improvement to see from a die shot, but it is only one part of PPA (power, performance, area). For modern logic, power and performance matter just as much, and often more. Since Dennard scaling broke down in the mid-2000s, voltage and frequency have not scaled in step with transistor dimensions, so each node has had to fight harder for gains in performance and efficiency. The starkest comparison is not Kirin 9020 versus Kirin 9030 Pro. Apple’s efficiency cores run circles around Huawei’s prime core. Apple’s low-power core delivers 20% higher integer performance while drawing only 1 W, compared with 4.5 W for Huawei’s prime core. N+3 matches TSMC N6, but N6 is several generations old. Apple and Qualcomm build on N4 and N3P, which are denser and sit on a better voltage-frequency curve, giving them a larger transistor budget and more performance per watt. The 9030’s own cores did improve. The middle and tiny cores gained 17% and 14% in per-clock integer performance over the 9020, with floating-point flat on the middle core and up 11% on the tiny. The tiny core improves cleanly, with performance rising while power falls and efficiency increases by 45% in integer and 24% in floating point. The middle core is mixed: integer performance rises but power rises faster, cutting integer efficiency by 7%, while lower power lifts floating-point efficiency 16%. Per-clock gains at the same or lower frequency are microarchitectural, so the cores are tuned, not just shrunk. Both also failed to hold their rated maximum frequencies, pointing to thermal, power, or stability limits. Per clock, the middle core sits around Arm Cortex-A720 and the tiny core near the Cortex-A520; absolute performance trails because Huawei clocks them much lower. The prime core is roughly Cortex-X2 class per clock, a 2021 design. Apple’s 2020 M1 Firestorm core is still 35% higher per clock and 57% faster in absolute integer performance at a similar 4.5 W. The current leading edge is further ahead again: the Apple M5 P-core is 60% higher per clock and 2.7× faster, the Arm C1 Ultra 45% higher and 2× faster. Matching older high-end cores per clock is a genuine design achievement. What Huawei cannot match is the voltage-frequency curve and transistor budget of leading-edge nodes, which let Apple, Qualcomm and others spend more transistors in the same area on wider cores, larger caches and deeper buffers while running at lower voltage. Huawei’s LogicFolding roadmap is one answer, stacking active logic to recover density and shorten signal paths. We return to it later. The GPU compute units (CUs) changed more visibly than the CPU cores, moving to a more rectangular layout for both the arithmetic logic unit (ALU) clusters and the CU overall. Even with ray-tracing support added, a CU shrank ~28%. However, that shrink is offset by the increase from 4 to 6 CUs and the area outside the CUs grew 33%. Overall, the GPU cluster is larger by ~10%. The GPU is where Huawei makes its biggest gains. The Maleoon 935 is not competitive with current flagships, but it is a large step up from the 920 and reaches older-flagship territory. In 3DMark it is 70% faster in Wild Life Extreme (WLE) and 79% faster in Steel Nomad Light (SNL) than the 920; with 11% higher clocks and 50% more CUs, the ~67% theoretical uplift roughly matches WLE and is beaten by SNL. It edges ahead of the Snapdragon 8+ Gen 1 in WLE and SNL, and the Dimensity 9200 and Apple A16 in WLE, but stays far behind newer parts: the Snapdragon 8 Elite Gen 5 and Dimensity 9500 are ~2.4–2.6× faster in WLE and ~3.2× faster in SNL. The Maleoon 935 is Huawei’s first GPU with hardware-accelerated ray tracing; there it lands slightly ahead of the Exynos 2200, and on par with the Apple A16, with current flagships up to 3.7× faster. The Neural Processing Unit (NPU) saw the largest structural changes of any block, moving from a Lite and a Tiny core in the Kirin 9020 to a Lite and two Tiny cores in the Kirin 9030. Both core types also show significant layout changes. This is a reversal in Huawei’s NPU design. The Kirin 9000 5G, its last flagship chip on TSMC N5, used two Lite and one Tiny core. The series of SoCs on SMIC N+2 moved to one Lite and one Tiny core, likely for area savings. With the Kirin 9030, Huawei has shifted back toward a larger multi-core NPU cluster, but with the additional area going to a Tiny core rather than a Lite core. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Before diving into the process stack, the package and memory are worth separating from the SoC itself. The Pro variant of the Kirin 9030 carries 12 GB of Samsung DRAM, with two stacks of four dies each. The dies were identified as the K4L2E165YD, a 12 Gb LPDDR5X-9600 device fabricated on Samsung’s 1a node, the fourth generation of its 10 nm-class DRAM after 1x, 1y and 1z. 1a has shipped in volume since 2022, so this is current memory rather than older-node inventory. The 16 GB Pro Max variants we obtained were found with both CXMT and Samsung packages. The CXMT package is marked CXDD7JEDM, with two stacks of four dies, packaged in week 45 of 2025. The inferred die dimensions from X-ray computed tomography (CT) are consistent with a known density of ~0.3 Gib/mm² for the CXMT G4 process, roughly equivalent to other manufacturers’ 1z processes. The Kirin 9030 uses a typical integrated package-on-package (iPoP) stack: multiple DRAM dies in a memory package sit above an organic redistribution layer (RDL) interposer, which sits above the SoC and package substrate. The full package is then mounted to the printed circuit board (PCB) through ball-grid array (BGA) solder bumps. The memory package substrate is a thin bismaleimide-triazine (BT) laminate carrying the LPDDR5X stack. The organic RDL interposer over the SoC routes the PoP signals around the die and carries possible dummy thermal copper pillars. The package substrate, a thicker Ajinomoto Build-up Film (ABF) build-up over a BT core, fans the flip-chip bumps out to BGA pitch and embeds the power planes. The whole stack is organic. The only silicon is the SoC and the LPDDR5X dies; there is no silicon interposer. Keeping it all-organic brings the package’s coefficient of thermal expansion (CTE) close to the PCB’s, reducing board-level warpage, and avoids the cost of a silicon interposer the SoC’s bandwidth does not need. In an iPoP stack, the memory package connects to the organic RDL interposer through an array of solder bumps. Underfill fills the gap around those bumps, adding stiffness and protecting the joints from mechanical stress. The Pro and Pro Max variants differ here, which we cover behind the paywall. The die shot and architecture tell us how Huawei allocated its silicon budget. The process tells us what SMIC can manufacture. We use the Helio G99 as the process reference for TSMC N6. Both SMIC N+3 and TSMC N6 are evolutions of previous 7 nm-class nodes. We used targeted TEM cross-sections through logic and memory regions, imaged in both fin-cut and gate-cut directions. Each cross-section caption gives its horizontal field width (HFW), the real width of the imaged area. We start at the transistor fins, then move up through standard cells, local interconnect, and SRAM. SMIC has not overtaken Intel or TSMC. It uses aggressive DUV scaling and DTCO to reach N6-class density, but that density doesn’t translate into comparable performance and efficiency, for two reasons: the node gap to leading-edge nodes, and Huawei’s core designs. Fin Profile One of the most important knobs in a FinFET process is the fin profile: the shape of an individual fin and the channel where current passes from source to drain. The ideal fin is tall, narrow, and nearly vertical. A taller fin increases effective channel width, while a narrower fin improves electrostatic control by thinning the body the gate must control. Push either too far, and the process pays for it: weaker drive current, fragile fins, taper, footing and line-edge variation that hit yield and device variability. The Intel 22 nm, 14 nm, and 10 nm fin cross-sections show how FinFET nodes have improved over time. 22 nm fins were a first-generation structure, relatively short, wide and strongly tapered. The shape limits current density and reduces gate control uniformity across the height of the fin. At 14 nm and 10 nm, Intel pushed the fins taller and narrower while also making the sidewalls more vertical. Rather than shrinking the device, these changes increase the effective channel width per fin and improve electrostatic control. The trade-off is that taller fins at tighter pitches are much more difficult to manufacture. Now, let’s compare the Helio G99 on TSMC N6 with the Kirin 9030 on SMIC N+3. Both processes are in the same class, with fin pitch of 30-32 nm on N+3 and 34 nm in our N6 cross-section. The pitch for N6 is especially interesting as N7’s HD library is generally listed with a 33 nm fin pitch, and N6 did not shrink pitches directly. Its density gains came from DTCO instead of tighter pitches. The 34 nm pitch was stable across our sampled region and serves more as a comparison against the SMIC N+3 we have not investigated further. Pinning down N+3’s fin patterning scheme takes more than one core unit. The CPU cores show a dense ~32 nm pitch, with the pitch between N-P fin pairs alternating between 78 and 88 nm. Logic alone may be consistent with dual-pitch mandrels of 120 and 110 nm, but this is a complex and unusual approach. Combining the pitch from the the 8T SRAM, which has more complex repeat unit, with the CPU core sequence allows us to reverse engineer the patterning steps with more confidence. As both the logic and SRAM should share the same base grid, a single CD mandrel lithography pattern with 128 nm pitch undergoing SAQP produces a die-wide ~32 nm grid (128 nm/4), which supports the pitch sequencing seen in both logic and SRAM cells. In the sampled cross-sections, N+3 shows a taller, narrower, higher-aspect-ratio fin than N6. The measured fin aspect ratio is ~9.5:1 on N+3 versus 7.8:1 on N6. N+3 also shows less top rounding, with an estimated radius of ~2 nm, compared with 2.8 nm on N6. Even though the fin widths differ, the ratio of top rounding to fin width tells the same story, with N+3 at 0.37 and N6 at 0.44. In a geometric sense, lower is better; a perfectly rectangular fin would have no top-rounding penalty. These are single-digit-nanometer features measured from a handful of cuts, so treat the absolute numbers as approximate. The important result is the relative gap: N+3’s fins are consistently taller, narrower and less rounded than N6’s. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Standard Cell A standard cell is the basic building block of chip layout: a fixed-height row pairing one NMOS and one PMOS transistor that share a gate, tiled in a grid to build logic blocks. The key dimensions are contacted gate pitch (CGP), cell height (CH), fin count, and the lower-metal routing grid. To measure density, we use the Bohr metric: a weighted average of NAND2 gate area (60%) and scan flip-flop area (40%). This represents a realistic mix of combinational and sequential logic. This metric has its limitations, especially for complex cell layouts like TSMC’s FinFLEX, which alternates cells with different fin counts. Even so, it is the best metric for a pure process-level comparison. Another important measurement is the fin pitch; it refers to the distance between two fins of the same transistor. In a FinFET process, multiple fins are used in each transistor to increase the drive current and thus performance. TSMC N6 ships both a high-density (HD) library with 2 PMOS and 2 NMOS fins per cell, and a high-performance (HP) library with 3 of each. More fins under the shared gate mean more effective channel width. HP cells switch harder at the cost of area. Designers mix the two on a die, primarily spending HP cells on timing-critical paths, and matching their PPA targets. In the Cortex-A55 core of the Helio G99, we found a cell height of 240 nm for the HD cell. MediaTek has used HD cells in the G99 to minimize die size and thus cost. As an SoC for budget smartphones at ~$100, this is essential. By contrast, we found only one library in the Kirin 9030, with 2 NMOS and 2 PMOS fins. This suggests a narrower library strategy than TSMC N6, where both HD and HP libraries are widely used. This likely reflects the smaller customer base and the more constrained domestic design and electronic design automation (EDA) ecosystem. In all three CPU cores of the Kirin 9030, we found cell heights of 228 nm, 5% smaller than on N6. This is also a reduction of 9.5% over SMIC N+2’s cell height of 252 nm. SMIC N+3 and TSMC N6’s HD library both feature a CGP of 57 nm. For SMIC, this is a 9.5% shrink over N+2. In the past, CGP and cell height alone may have been enough to compare transistor density. Now, however, we must consider scaling boosters and DTCO as well. SMIC’s density gain does not come from EUV. It comes from using every available DTCO booster aggressively. First is fin depopulation: reducing the number of NMOS and PMOS fins in each cell. The first FinFET nodes started with 3 or 4 fins for each transistor. SMIC N+3 and TSMC N6 HD both use only 2 fins per transistor, trading drive strength for density. Next is contact over active gate (COAG). By landing the gate contact directly over the active gate, instead of out over the isolation region, the cell height drops. N+3 integrates COAG while N6 does not. Our N+3 gate-cut cross-sections indicate COAG, with the gate contact sitting over the active region, while N6 shows an off-gate contact. Last is single diffusion break (SDB). Diffusion breaks are inserted between cells in the same row to provide electrical isolation, but they also introduce local layout effects (LLE), layout-dependent shifts in electrical characteristics. In the past, a double diffusion break was used, consuming the space of two CGPs. SMIC N+3 and TSMC N6 instead use SDB, saving area but increasing LLE sensitivity. This must be controlled at the process level and accurately modeled in the process design kit (PDK) so that EDA tools can account for it. Overall, SMIC N+3 has a transistor density of 113.4 MTr/mm², slightly above TSMC N6 at 107.7 MTr/mm². Even without EUV, SMIC has achieved density beyond TSMC’s mature N6 node which utilizes EUV. Metal Stack The smallest critical dimension in the teardown is M0; SMIC N+3 uses a 32.5 nm local metal pitch. That is smaller than the 36 nm M0 pitch on Intel 18A in Panther Lake. However, this does not mean that SMIC has a better process than Intel 18A or TSMC N3P. M0 is a local intra-cell routing layer. Its usefulness depends on the full interconnect stack: M1 and M2 pitch, track count, via and line resistance, design rules, mask count, overlay control, and routing flexibility. The 32.5 nm M0 is consistent with self-aligned quadruple patterning (SAQP), whose four-population line-width loading we read coarsely as alternating widths of 21.5 to 24 nm; M1 and M2, at 38 and 40 nm, are consistent with self-aligned double patterning (SADP), a single A/B split. On TSMC N6, M0, M2, and M3 sit at a relaxed ~40 nm and are consistent with SADP-class double patterning, with no need for quadruple patterning. That said, we measure M2 for example at ~43 nm, likely inflated by sparse routing. We do not assign any specific layer to EUV from our cross-sections; the distinction we can draw is double versus quadruple patterning, not lithography wavelength. Transistor-level density in the front-end-of-line (FEOL) sets an upper bound, but the design is ultimately limited by what the interconnect stack can route. The lowest metals are the most important for standard-cell density, but the semi-global and global layers determine how usable that density is at the block and chip level. Two axes are commonly used for chip cross-sections: the fin-cut and the gate-cut. The micrograph above is a fin-cut and shows metals 0 through 3. This axis lets us see the even-numbered metals, with M0 right above the fins. There are two kinds of M0 lines. The first are the power rails; these are wide wires for the VDD and VSS running horizontally at the top and bottom edges of each standard cell. The wide wires measure 55 nm across, more than double the other M0 lines. Their width minimizes resistance and reduces IR drop. The second kind are intra-cell wires, short segments within the cell that connect terminals to M1. These have alternating widths between 21.5 and 24 nm. The M0 pitch is 32.5 nm, a 19% reduction versus N+2 and N6. At this pitch, DUV patterning requires more aggressive multi-patterning, increasing mask count, overlay sensitivity, process complexity and cost. M0 is below what a single DUV-defined spacer (SADP) can resolve, so SMIC cascades a second spacer step (SAQP). The cross-section reflects the cost: the M0 trenches are visibly more re-entrant (narrower at the bottom than the top) than M1 or M2 on the same chip and carry a bright barrier-rich foot where the trench meets the etch-stop layer. That shape is partly the intended damascene profile, as a slightly narrow bottom helps void-free copper fill, but its magnitude at M0 is driven by the tight pitch and the higher trench aspect ratio. Intel 18A supports an M0 pitch of 32 nm, although Panther Lake has only shipped with a looser 36 nm pitch. This is due to Intel’s heavy usage of HP libraries. Among leading-edge nodes, 18A has the loosest M0 pitches due to PowerVia. With power routing moving to the backside, congestion is reduced, and the entire front-side metal stack can be used for signal routing. M2 is the first true inter-cell routing layer. It runs horizontally like M0 but spans across multiple cells to carry block-level signals. The M2 pitch sets the cell’s track height – the number of M2 tracks that fit between the VDD and VSS rails, defining what the library calls a 6-track or 7.5-track cell. This layer is the most important, limiting the routing of entire blocks. SMIC N+3 features a 5.7-track cell. The M2 pitch is 40 nm, a 5% decrease over N+2 and the same as N6. This shrink keeps the pitch at the edge of what is possible with double patterning. Future nodes will need to increase the number of masks for M2 as reducing the number of tracks is much harder due to the limitations in routing. The micrograph above is in the perpendicular direction, the gate-cut, and shows metals 0 through 4. This allows us to see and measure the odd-numbered vertical metal layers. The M1 pitch is 38 nm, 9.5% less than N+2 and 33% less than N6. The M1-to-gate ratio matters because it sets local routing flexibility. N+2 and N+3 use a 3:2 ratio, while N6 uses a 1:1 ratio, explaining the huge differences in M1 pitch. The more M1 lines there are compared with the gates, the more flexibility there is for power and signal crossing within the cell. Routing flexibility enables more complex and better cells. Clean fractional ratios are also preferred as a grid is periodic and improves layouts. The 3:2 ratio gives SMIC more local routing flexibility than a strict 1:1 grid, but it also complicates layout and patterning. This is a DTCO choice, with SMIC increasing process complexity to recover density and routability without EUV. This 3:2 ratio is not very popular in the leading-edge nodes. TSMC has only used it on N7+, the N5 family, and the short-lived N3(B). They have switched back to a 1:1 ratio for N3E. Intel has only used it on the 10 nm/Intel 7 family, with Intel 4, 3 and 18A all using a 1:1 ratio. Samsung is the only one still using a 3:2 ratio at the leading edge, using it in the SF4 and SF3 families. It remains to be seen if SMIC will remain at a 3:2 ratio or move to a 1:1 ratio with its future nodes. The industry is still actively exploring these local-routing ratios. At VLSI 2026, imec will be presenting work on even higher ratios, including a 2:1 scheme that can reduce area by up to 14%. We will be covering the conference in a future newsletter article. Subscribe We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. The final local interconnect layer for N+3 is M3, with a pitch of 44 nm. The M3 pitch is the same as on N+2 and 10% larger than on N6. The semi-global layers carry the majority of block-level signal routing. They have a coarser pitch than the lower local layers. On leading-edge nodes, they are designed to sit at the limit of DUV single patterning. M4 through M11 pitches were found divided between 80–82 nm (M4–M6), 128 nm (M7–M10), and 148 nm (M11). Given limited sampling, it is possible these are divided further in dense routing areas. At the top are two giant metal layers, M12 and M13. These have kept the same pitches as N+2 at 1920 nm and 4600 nm respectively. While the lower layers’ pitches are generally fixed by the process and library, the upper layers vary much more in pitch and count, depending on the design. Even two smartphone SoCs on the same process can have wildly different metal stacks. The Helio G99 carries fewer routing layers, reaching coarse metal pitches of 850 nm by M9, while the larger and higher-performance Kirin 9030 keeps fine pitches until M11. SRAM At the leading edge, SRAM is much more difficult to scale than logic. TSMC’s latest nodes have seen little to no bitcell scaling, while logic still has more DTCO levers to pull. While looking for other logic libraries in the GPU compute units, we stumbled upon the SRAM. The most common type of SRAM has 6 transistors (6T), but this cell had 8 transistors (8T) instead. 8T SRAM adds two transistors to form a dedicated read port. Unlike a 6T cell, where reading disturbs the storage, the decoupled read port removes read-disturb, improving read stability and letting the cell be pushed harder for performance. At first glance, the cut looked like an unusual logic library, with each cell row having 3 fins of one polarity and 5 fins of another. The rows also alternated in orientation. Energy-dispersive X-ray spectroscopy (EDS) resolved our confusion. The cut had not landed on the GPU logic, but on the SRAM macro beside it. The unusual fin pattern was due to the SRAM library. We return to EDS in the process flow analysis behind the paywall. SRAM libraries are not like traditional logic libraries. Due to the unequal number of PMOS and NMOS transistors, they require specialized rules and layout libraries. They do not need the flexibility of logic libraries, so they are hyper-optimized for one purpose: dense, reliable memory. The SRAM cell we found is a 1:2:2-2:2 cell. This means there is 1 fin per pull-up (PU) PMOS transistor, and 2 fins per pull-down (PD) and pass-gate (PG) NMOS transistor. These 2 PU, 2 PD and 2 PG transistors would usually form a single 6T high-current cell (HCC). An 8T HCC adds a read-pull-down (RPD) and a read-pass-gate (RPG) NMOS transistor, each with two fins. We measured a cell height of 406 nm, which brings the bitcell size to 0.0463 µm². That is a theoretical peak density of 21.6 Mib/mm². We estimate that a 6T HCC would have a cell height of 292 nm and a size of 0.0337 µm². This is ~12% larger than a 6T HCC on Intel 3 and 4. We also estimate the 6T high-density cell (HDC) to have a cell height of 228 nm and a size of 0.0260 µm². This is coincidentally the same as the logic standard-cell height measured earlier. The estimate puts the cell near Samsung 7LPP/5LPP and slightly below TSMC N7/N6. That is a theoretical peak density of 38.5 Mib/mm². 6T HDC is arguably the most important cell as it is used for the largest caches in a chip, the L3 caches and system-level cache (SLC). Both the Kirin 9020 and 9030 have split the SLC into 4 banks to raise total SLC bandwidth. In the Kirin 9030, the SLC increased from 2 MiB to 3 MiB per bank. Correspondingly, the number of arrays within the bank also increased by 50%, from 16 to 24. Each array can store 128 KiB and forms an orderly pattern on the die shot. From the Kirin 9020 to the Kirin 9030, the area of a 128 KiB SLC array decreased from 0.0477 mm² to 0.0392 mm², an 18% shrink. The achieved density is 25.5 Mib/mm², 66% of the theoretical maximum. While the SLC was quite similar across both chips, the L3 has seen some major changes, particularly in terms of its layout. The total capacity also went up from 10 MiB to 12 MiB. Much like the SLC, the L3 is also split into 4 banks. In the Kirin 9020, an L3 bank consisted of 16× 128 KiB arrays and 16× 32 KiB arrays. However, an L3 bank in the Kirin 9030 instead consists of 48× 64 KiB arrays. In the Kirin 9020 L3, a 128 KiB array was 0.0513 mm² and a 32 KiB array was 0.0154 mm². The size of the 128 KiB array is different on the L3 and SLC as the assist circuitry for the two arrays differs depending on their purpose. In the Kirin 9030 L3, a 64 KiB array is 0.0210 mm². Although not a like-for-like comparison, normalized for capacity, it is 18% smaller than the 9020’s 128 KiB L3 array and 31% smaller than its 32 KiB L3 array. The achieved density is slightly lower than the SLC, at 23.8 Mib/mm², 62% of the theoretical maximum. Unlike the L3 and SLC, the prime cores’ private L2 cache uses a 2-bank design. As the prime cores’ L2 is latency-critical, it likely uses 6T HCC instead of 6T HDC. The 9020 has 16 arrays in each bank while the 9030 has 32. Each array has a capacity of 32 KiB. A 32 KiB array in the L2 shrank from 0.0171 mm² to 0.0142 mm², ~17% smaller. The density is 17.6 Mib/mm², ~59% of the theoretical maximum for 6T HCC. SRAM scaled well from N+2 to N+3, shrinking by ~19%, close to the theoretical logic shrink. The caveat is that N+2’s bitcells were unusually large, bigger than comparable 7 nm-class nodes, so part of the gain is catch-up rather than true scaling. With the insights from STEEL’s teardowns, we will be doing a deep dive into SRAM in a future newsletter article. Subscribe Everything above came out of a single STEEL teardown: die annotation, block-level area analysis and TEM cross-sections through logic and SRAM. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Future Roadmap The same cross-sections that pin down N+3 also show where SMIC can go next. Although N+3 is already close to the practical limits of DUV multi-patterning in several layers, SMIC still has a few scaling levers left. A theoretical N+4 would likely start with cell height. N+3 uses 5 M0 tracks between its power rails. Moving to 4 M0 tracks, as on SMIC N+2 and TSMC N6, could reduce cell height by roughly 15%. The routing grid is only one side of the shrink; the front end also must fit into the smaller cell. One possible FEOL lever is reducing the p-to-n isolation spacing from two diffusion grid units to one. Intel used this scaling booster on Intel 4, and TSMC did so on its N3 family. This path trades layout flexibility for density. Fewer M0 tracks reduce local routing resources, while tighter p-to-n spacing raises integration and design-rule difficulty. M2 is also constrained by the cell height shrink. For SMIC to maintain a ~5.7-track cell, M2 would need to move toward ~35 nm. That would move another layer into SAQP territory. SMIC could also reduce the CGP from 57 nm to 54 nm. Intel reached a similar CGP on Intel 10 nm/Intel 7 without EUV. The local interconnect is also tougher. If SMIC keeps the 3:2 M1-to-gate ratio, M1 would need to shrink to 36 nm and would likely require SAQP as well. If SMIC moves to a 1:1 ratio, M1 could relax to 54 nm, but it would give up routing flexibility. Under this theoretical path, we estimate that SMIC N+4 could reach a cell height of 198 nm and a CGP of 54 nm, implying a Bohr density of 137.8 MTr/mm², on par with TSMC N5 or Samsung SF4. However, the difficulty is cumulative. Each step is individually plausible, but together they make N+4 harder than the transition from N+2 to N+3. It will likely take longer, cost more, and carry less process margin. A theoretical N+5 would require a larger integration shift. One possible path is backside contacts (BSCon), moving power routing and source/drain contacts to the backside, which would reduce front-side routing pressure and enable another reduction in cell height. The front-side metal pitches could relax to reduce the process complexity. M0 would likely relax slightly to ~34 nm, and M2 and M4 pitches could relax further. CGP is unlikely to shrink much further. Even with EUV, 48 nm has been the practical limit for yield and process control. This approach would allow N+5’s cell height to fall to 170 nm and its CGP to 53 nm. This implies a Bohr density of 163.6 MTr/mm², on par with Intel 18A’s HP library. However, this would not make N+5 cost-competitive with the leading edge. It would reach a similar density through a much more expensive route. The integration difficulty rises sharply, with new process flows for backside alignment, wafer thinning, contact reveal, and backside metallization. Past this point, standard density and interconnect scaling become increasingly unattractive. That is where Huawei’s roadmap stops looking like a normal foundry roadmap and starts looking like a packaging roadmap. At ISCAS 2026, Huawei unveiled its tau (τ) scaling law, reframing process scaling in the time domain. τ is the time cost of data movement and processing: switching delays in transistors, RC signal propagation delays in circuits, compute, memory, and networking latency. Outside Huawei’s terminology, this is called system-technology co-optimization. This is Huawei’s answer to its lack of EUV lithography. Without EUV, planar density cannot keep pace with TSMC, Intel, or Samsung. If transistor density cannot shrink further, Huawei’s alternative is to shorten wires, reduce buffering, and stack logic vertically. “LogicFolding”, Huawei’s implementation of this new scaling idea, is, in practice, an aggressive 3D stacking approach. AMD V-Cache places SRAM above or below a CPU die. AMD’s MI350X places active interposer dies (AIDs) underneath accelerator and compute dies (XCDs), with the AIDs handling cache, IO interfaces, the network-on-chip (NoC) and embedded metal-insulator-metal (MIM) capacitors. With LogicFolding, parts of the same logic block are split across multiple active dies bonded face-to-face at ultra-fine pitch. This allows Huawei to shorten some critical paths and reduce buffer overhead, not merely add cache capacity or offload the IO and interconnect. Shortening wires is where the higher clocks come from. A large share of a modern core’s delay and energy budget goes into driving long interconnects and the repeater buffers along them. LogicFolding distributes a block’s critical-path gates across multiple stacked tiers bonded at a very fine pitch, so the bond interface behaves like an additional metal layer and the longest paths get shorter. That is how Huawei expects to recover frequency and efficiency it cannot get from the process alone. Huawei’s roadmap shows its intent. Prime core frequency is targeted to rise from 2.75 GHz in the Kirin 9030 to roughly 5 GHz by 2031, far beyond what planar scaling alone could deliver. Prime cores with 3.1 and 3.39 GHz clocks are being tested in its labs, although their power consumption is unknown. Beyond that, chips are in the design, simulation or pathfinding phase, meaning the frequencies are targets. However, the direction matters more: LogicFolding also helps with performance, not just density. The catch is that Huawei’s density claim is not directly comparable to foundry densities. A stacked design can report more transistors per package footprint by adding active layers, even if each patterned die remains well behind TSMC or Intel in front-end density. This is how Huawei can claim to reach foundry 14A-equivalent density by 2031. This is not a like-for-like foundry comparison, with Huawei using stacked logic and measuring density per package footprint. On a normalized Bohr-density basis, SMIC N+3 is ~114 MTr/mm², 38% less than Intel 18A’s HD library. Huawei’s 3D roadmap closes the gap by stacking active logic, reaching 215 MTr/mm² by 2030. In 2031, the roadmap density jumps to 295 MTr/mm², implying either a third active layer, partial EUV insertion or aggressive planar DUV scaling. Huawei’s methodology makes other foundries look much denser as well. Applying it to AMD’s MI450X with an N2 top die on an N3P base die yields a theoretical density of 460.2 MTr/mm² in 2026, compared with Huawei’s 295 MTr/mm² in 2031. This Kirin 9030 does not use LogicFolding, remaining in a conventional mobile SoC package. Instead, it forms the baseline for how far Huawei and SMIC can push planar scaling. Future teardowns of Kirin and Ascend chips will show both planar logic density and Huawei’s hybrid bonding solutions. Export controls changed China’s optimization problem rather than ending it. EUV restrictions raised the cost and complexity of leading-edge manufacturing without freezing it. SMIC reaches N6-class logic density through DUV immersion, SAQP and DTCO, while Huawei shifts more of the burden onto architecture, packaging and system-level integration. Future nodes will be tougher. N+3 still had room to tighten local metals and reduce cell height and CGP. Further scaling without EUV leaves fewer levers. More aggressive multi-patterning adds masks and overlay error. SMIC can keep pushing DUV, but each step will get more expensive and less forgiving. The design side is just as critical. Huawei had domestic EDA tools and flows before the Kirin 9030, with the Kirin 9000s, 9010 and 9020 making that clear. Huawei was able to ship multiple consumer SoCs on SMIC N+2 and N+3 while cut off from the Western EDA stack. US export controls restricted EDA tools for advanced chips in 2022 but did not target tools for more mature chips. In 2025, the US government briefly placed much broader restrictions on EDA software from Synopsys, Cadence, and others, before lifting them less than two months later as part of a trade deal tied to rare earths. Huawei has been unable to access those tools because it remains on a US trade blacklist. That forced Huawei, SMIC and Chinese academic institutions to build their own tools and flows. Researchers at Peking University recently announced a prototype EDA tool for Huawei’s LogicFolding architecture, which requires a new flow to handle the multilayer layout and floorplan. This is not the same as replacing the full Synopsys or Cadence stack, but it shows where domestic EDA is headed: toward tighter co-optimization between architecture, process and packaging. These advances are also diffusing into the Chinese ecosystem. SMIC is licensing its N+2 and N+3 processes to HLMC/Hua Hong at the government’s direction rather than by choice. If the same process learning feeds into Ascend accelerators for AI training and inference, the choke point shifts from one named fab to an ecosystem. Alibaba’s T-Head silicon arm and Cambricon, a Chinese AI chip designer that is expected to supply ByteDance, could also be major beneficiaries. Sanctions aimed at SMIC alone become less effective once the manufacturing knowledge has spread to other fabs and design houses. China is not closing the gap with Intel, Samsung and TSMC. The teardown shows the opposite in several places: no EUV, no backside power, higher process complexity, and visible trade-offs. But China is still advancing. If domestic chips become good enough for phones, inference, networking and security-sensitive workloads, they can matter strategically without matching TSMC at the leading edge. Behind the paywall, we show what else STEEL can do, with material and process flow analysis of SMIC N+3, and analysis of the Kirin 9030 package. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline, access the full Kirin 9030 and SMIC N+3 analysis or to commission a custom teardown, contact sales@semianalysis.com.
Jedify raises $24M to help companies arm AI agents with context on their business
The funding round was led by Norwest, with participation S Capital VC, Cerca Partners, and Oceans Ventures. Snowflake Ventures also participated as a strategic investor.
Jedify raises $24M to give enterprise AI agents the business context they lack
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Sarah Shelke and Kyra Wagner Named 2026 Student Voice of Mental Health Award Recipients by The Jed Foundation
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$5M in Funding Still Available for NJEDA’s Cannabis Business Development Grant Program
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Anxiety and anger: New report explores mental health struggles of boys and young men
A new report from The Jed Foundation (JED) examines the mental health challenges facing boys and young men.
Anxiety and anger: New report explores mental health struggles of boys and young men
A new report from The Jed Foundation (JED) examines the mental health challenges facing boys and young men.
Anxiety and anger: New report explores mental health struggles of boys and young men
A new report from The Jed Foundation (JED) examines the mental health challenges facing boys and young men.
Anxiety and anger: New report explores mental health struggles of boys and young men
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Kansas City Royals' Kris Bubic Gives Salvador Perez Big Shoutout
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Is the FDA Really Suppressing Science? Plus. . .
It’s Thursday, May 7. This is The Front Page, your daily window into the world of The Free Press—and our take on the world at large. Today: Aaron MacLean says Trump is poised to snatch defeat from the jaws of victory in the Iran war. Joe Klein on the life of CNN founder Ted Turner. Jillian Lederman on why cruise ships are here to stay. And much more. But first: Is the FDA suppressing science? On Tuesday, The New York Times published a story with an alarming takeaway. “FDA Blocked Publication of Research Finding Covid and Shingles Vaccines Were Safe,” read the headline. It is the latest in a string of stories that all have the same message: The Food and Drug Administration (FDA), and other agencies, are engaged in a cover-up—and silencing scientists trying to get the word out about the Covid vaccine. What all these stories suggest—some more subtly than others—is that the outsiders now running the public health establishment, officials such as Marty Makary at the FDA and Jay Bhattacharya at the National Institutes of Health, are on a revenge tour. That they are doing harm to the country to get back at the scientists and bureaucrats who ostracized them for deviating from the public-health consensus during the pandemic. It’s a seductive narrative. But is it true? That’s the question we address in our latest editorial. —The Editors Read [ Marty Makary's FDA Has All the Right Enemies ](https://www.thefp.com/p/marty-makary-vaccine-study-fda) [ Trump Blinks First ](https://www.thefp.com/p/iran-peace-deal-pakistan-trump-strait-of-hormuz) Aaron MacLean In return for no detectable concessions, President Trump this week gave up on forcing open the Strait of Hormuz. Now, the Trump administration looks desperate for a deal to end the war with Iran. It’s easy to understand the desire to end the war, but are they blowing the chance at victory? Aaron MacLean makes sense of the administration’s latest moves—and Iran’s response—in his column today. Read full story Aaron MacLean and Niall Ferguson: Live in New York City Join Aaron MacLean and Niall Ferguson on May 19 for a live recording of School of War at the iconic New York Historical. In a conversation as timely as it is wide-ranging, Aaron and Niall will explore the strategic stakes of the moment, including the Middle East, China, and the future of American leadership on the global stage. Get Tickets Now [ Ted Turner, the Optimist Who Built CNN ](https://www.thefp.com/p/ted-turner-cnn-tribute) Joe Klein The man who gave us CNN and the 24-hour news cycle, Ted Turner, died Wednesday at the age of 87. Today, political writer Joe Klein—who almost ghostwrote Turner’s autobiography—remembers his friend, the American media mogul who stood out for his idealism and lack of a filter—something that got Turner in trouble more than once. “His was not a traditional intelligence, but one of horizon: Ted saw things before other people did,” Joe writes. Read full story [ Nothing Can Sink the Cruise Ship ](https://www.thefp.com/p/cruise-ship-hantavirus) Jillian Lederman A viral outbreak on a cruise ship that left three passengers dead has left some people wondering: Are cruise ships on the way out? Not so fast, says Jillian Lederman, who has been on many a cruise herself. Read her piece on why 38 million people a year take a cruise—and aren’t about to stop. Read full story [ The Great Writers Who Were Terrible People ](https://www.thefp.com/p/the-great-writers-who-were-terrible) Shilo Brooks Throughout history, some of the greatest literary geniuses have also been immoral bigots. In the latest episode of Old School, Shilo Brooks is joined by Eli Lake for a conversation about those geniuses, from Voltaire to Norman Mailer and Roald Dahl—and why we should read their work despite their odious prejudices. Listen on MORE FROM THE FREE PRESS [ Inside the Digital Intifada ](https://www.thefp.com/p/digital-intifada-social-media-hamas-terror) Warren Kinsella Read full story [ This Week in American History: Trump’s Over-Arching Problem ](https://www.thefp.com/p/this-week-in-american-history-trumps-over-arching-problem) Jonathan Horn Read full story [ Humanity Is Still Evolving—and Fast ](https://www.thefp.com/p/humanity-is-still-evolvingand-fast) Razib Khan Read full story THE NEWS Thirteen D.C. Metropolitan Police officers have been placed on administrative leave and could face termination after an internal investigation found evidence that crime statistics were manipulated to make the city look safer. The Republican-led House Oversight Committee previously alleged that former D.C. police chief Pamela Smith pressured officers to skew data. Tennessee Republicans unveiled a redrawn U.S. House map yesterday that would split up Memphis’s black-majority Democratic district, the latest move in a nationwide push to redraw congressional boundaries ahead of the midterms. The effort follows a Supreme Court ruling last week on Louisiana’s districts, which Tennessee House Speaker Cameron Sexton said gave states the green light to redraw maps along partisan lines. Israel struck Beirut for the first time since a ceasefire with Hezbollah took effect last month, saying it targeted a commander of the militant group’s elite Radwan force in the city’s southern suburbs. The strikes risk destabilizing that truce at a delicate moment, as Iran and the U.S. report progress toward a deal to resolve their own standoff. The U.S. Air Force is aiming for a Fourth of July delivery of a Boeing 747 gifted by Qatar, hoping to add it to the Air Force One fleet in time for the U.S.’s 250th anniversary, Reuters reported. (For more on the controversy surrounding the aircraft, read Jed Rubenfeld’s piece “It’s a Terrible Idea, but Trump Probably Can Accept a Free Jet from Qatar.”) Commerce Secretary Howard Lutnick testified privately before Congress that he has no memory of why he and his family dined on Jeffrey Epstein’s private island in 2012, according to Reuters. The admission contradicts Lutnick’s earlier claim that he had cut ties with the convicted sex offender well before that visit. Weeks before a former JPMorgan investment banker filed a lawsuit packed with explosive allegations, the bank reportedly offered him $1 million to settle his sexual assault and harassment claims, according to The Wall Street Journal. The suit, filed by Chirayu Rana, alleges he was sexually assaulted by a female colleague, subjected to racial discrimination, and forced into a degrading dynamic at work. JPMorgan says the claims lack merit, and the female colleague’s lawyers call the accusations fabricated. A new report from the Hartford Institute for Religion Research shows that, for the first time in roughly 20 years, church attendance is trending upward, with more people volunteering and clergy expressing renewed optimism. The study’s authors described the findings, based on a survey of more than 7,400 congregations, as showing signs of widespread recovery from low attendance numbers.
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I tried this $5 laundry hack for a spotless shower — and the results have totally surprised me
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Mental health series presented by MSPR and campus partners
Morehead State Public Radio, in collaboration with the Department of Sociology, Social Work & Criminology, Counseling & Health Services, and the JED Foundation, will present a five-part radio series throughout May 2026 in recognition of Mental Health Awareness Month. The series, “Call to Mind,” is produced by American Public Media and hosted by veteran journalist Angela Davis. The hour-long programs feature sound-rich storytelling and expert insight, highlighting the experiences of individuals navigating mental health challenges and exploring ways to support well-being. You can listen to WMKY at 90.3FM at www.wmky.org, via a phone app, or by smart speaker (“Play WMKY”). For additional information, email Hitchcock at p.hitchc@moreheadstate.edu or call 606-783-2334.
Oklou enhances excellent debut album with bold Milwaukee concert
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CBL Scholars Program Opens Pathways to Business Law Careers - UC Law San Francisco (Formerly UC Hastings)
First-year law students and 2026 CBL Scholars Deniz Masjedi, Alvaro Flores, and Tavia Pappaly gain mentorship connections with leading industry professionals as they prepare for careers in business law. Created by the UC Center for Business Law San Francisco (CBL), the CBL Scholars Program aims to develop the next generation of business law leaders, supported by contributions from individuals and corporate sponsors. The highly competitive program provides funding along with academic and professional mentorship to students from disadvantaged backgrounds. Scholars gain exposure to the Bay Area’s technology and venture capital ecosystems and access to UC Law SF’s broad network of senior legal professionals. Now in its sixth year, the CBL Scholars Program provides a scholarship and academic and professional mentorship to students entering the business law community from disadvantaged educational, economic, social, or physical backgrounds. The program is generously sponsored by the law firms Gunderson Dettmer and Goodwin Procter. Meet this year’s CBL Scholars: Deniz Masjedi, Alvaro Flores, and Tavia Pappaly. All three have secured summer associate positions at prestigious law firms. Deniz Masjedi: A Passion for Helping Founders Grow Companies Deniz Masjedi, who was born in Iran and moved to Southern California as a teenager, traces her interest in law to her family’s immigration journey and her desire to advocate for herself and her family. She earned a bachelor’s degree at UC Berkeley, where she studied political science and sociology. At UC Law SF, she serves as a 1L representative for the Iranian Law Students Association and is active in the Business Law Society and Technology & Law Society. Next fall, she will serve as director of mentorship for the Technology & Law Society and director of professional development for the Business Law Society. She will join Sidley Austin this year as a 1L/2L summer associate. Q: What draws you to business law? A: Prior to law school, I worked in Cooley LLP’s Private Companies practice group as a corporate paralegal for three years, supporting over 100 venture-backed startups and venture capital funds. I found purpose in helping founders transform their vision into successful companies. It was incredibly rewarding being part of their journeys—from company formation and initial financing to major transactions such as M&A deals. What excites me most about this field is the potential for a small, innovative company to become the next Google or Zoom, shaping how people communicate and access information. I hope to continue supporting entrepreneurs and investors as a corporate attorney. Q: What does it mean to you to have been awarded this scholarship? A: As the first person in my family to attend law school in the United States, receiving this scholarship is a tremendous honor. My parents and I left everything behind so that I could enjoy the freedom to practice my religion without persecution and pursue a career in law as a woman. This award is an acknowledgment of my dedication to business law and motivates me to continue pursuing excellence in this field. It also recognizes years of hard work—learning a new language, navigating the college and law school application process, and ultimately building a career in the legal profession. Q: How will this scholarship help support your future goals? A: This scholarship will provide access to mentorship from leaders in the field, enabling me to develop the skills necessary to offer practical advice and effective representation to future clients. It also eases the financial burden of law school, letting me focus on my coursework and deepen my commitment to corporate law. As an immigrant, breaking into the legal profession has not always been easy, and the time that mentors have invested in me has been instrumental to my progress. This scholarship will allow me to continue building those relationships while positioning me to one day mentor others pursuing similar paths. Alvaro Flores: Inspired by Entrepreneurs The son of Mexican immigrants raised in San Antonio, Texas, Alvaro Flores says he has long been interested in how policy, markets, and culture shape society. He studied international relations and global economy at the University of Southern California, with minors in business finance and legal studies. His experiences span local political organizing, venture capital and startup work, and teaching entrepreneurship. At UC Law SF, he is involved in the Business Law Society, Technology & Law Society, and the Latinx Law Student Association. He will join Perkins Coie as a 1L/2L summer associate with the firm’s Emerging Companies & Venture Capital practice. Q: What draws you to business law? A: I’m drawn to stories of entrepreneurs whose simple ideas become companies that shape the economy and society. Spending time in venture capital and working directly with founders has shown me that many important decisions in the scaling process are ultimately legal ones, particularly how companies are structured and how capital is raised. Business law sits at the intersection of innovation and equity. It offers a way to stay close to the pace of technological change while also helping expand who gets to participate in it. There is something special about being part of that process here in the Bay Area, where the American Dream feels like it is reimagined in real time. Q: What does it mean to you to have been awarded this scholarship? A: I am truly grateful for the support and belief this scholarship represents. I see it not just as recognition, but also as alignment. The CBL Scholars Program’s focus on developing individuals who engage deeply with the business and technology ecosystem reflects the path I have been intentionally building. More than anything, it feels like an investment in that journey. I have been thoughtful about each next step–whether teaching, working in venture capital, or building multidisciplinary experiences–and this scholarship reinforces that those efforts come together in a meaningful way. Q: How will this scholarship help support your future goals? A: It allows me to focus more on developing as a business lawyer, without the distraction of financial constraints. Beyond that, the mentorship and access to the Bay Area network are just as valuable. I’m especially interested in working with early-stage companies and investors, so the opportunity to learn directly from people operating at a high level in that space is huge. Tavia Pappaly: Working in the Wine Industry Sparked Interest in Business and Law Tavia Pappaly spent five years in the wine industry before deciding to pursue law school with a goal of becoming a corporate transactions attorney. Pappaly says she wants to use her legal skills to help business grow and thrive. A first-generation law student from Fairfield, California, she is a member of the Legal Education Opportunity Program (LEOP) and will serve as vice president of social planning for the UC Law SF Sports Law Society in her 2L year. She plans to work as a summer associate at Gibson Dunn in San Francisco after her 2L year. Q: What draws you to business law? A: Business law brings together many of my interests and personal experiences. As the daughter of immigrants who grew up around a family-owned small business, I saw firsthand both the opportunities and challenges of building something from the ground up. That perspective, combined with my experience in the wine industry, solidified my interest in helping businesses of all sizes tackle evolving legal challenges. I’m excited to grow within the corporate law space and develop the skills and experience to support businesses at every stage. I’m deeply motivated to give back to immigrant communities and small business owners, whose experiences often intersect. By building a strong foundation in corporate law, I hope to support those working to create generational stability and to contribute in a meaningful way to the communities that have shaped me. Q: What does it mean to you to have been awarded this scholarship? A: Receiving this scholarship is incredibly meaningful to me. I take great pride in my background as a first-generation student and a woman of color, so being recognized for my potential in a field that has historically underrepresented those communities is both affirming and empowering. This program will help connect me to the resources and committed mentors that will help me succeed. Beyond that, it is no secret that law school is a significant financial commitment. This scholarship helps ease both the financial burden and the stress that comes with it, allowing me to focus more on my education and long-term goals. I am incredibly grateful! Q: How will this scholarship help support your future goals? A: This scholarship has already connected me with an incredible network of faculty, business law professionals, and like-minded students. The community fostered by the Center for Business Law is deeply supportive, and I’m excited to grow alongside my cohort. I truly believe this network will play an important role in helping me thrive in law school and position me for success in business law. As I have seen firsthand how impactful both financial scholarship and mentorship are, I hope to give back in this same way later in my career.
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