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Aaron Judge reportedly left off Yankees' wild-card roster for series, Giancarlo Stanton makes the cut
MLB wild card schedule: Four Games 1 on Tuesday
The 2026 Major League Baseball postseason is officially underway with four games on Tuesday, all Games 1 of the best-of-3 wild card series. And due to a combination of injuries and some of these teams scrambling to even make the postseason, three of the eight teams involved will use a bullpen game in their first […]
SteelSeries’ new mice are super light, have UWB and swappable batteries
Plus, SteelSeries now has a web version of GG.
Paramount+ Picks Up US Rights for 3 British Series From A24
Paramount+ has picked up the U.S. rights for three British series from A24, "It Gets Worse," "Major Players" and "The Ministry of Time"
DeWitt’s ‘Pink for the Cure’ returns for 15th year to boost breast health awareness
The Crossroads Health Foundation will celebrate the 15th anniversary of "Pink for the Cure" this October with a series of community events in DeWitt aimed at funding free screening mammograms.
Unlikely playoff teams collide as Astros face White Sox in AL Wild Card Series
The Astros are the first team to reach the postseason without a winning record, and the White Sox are the only team in major league history to follow consecutive 100-loss seasons with a playoff berth.
NY Yankees can unleash a very different playoff weapon
Carlos Rodon is available out of the bullpen for the Yankees in the Wild Card Series. Aaron Boone confirmed the […]
Biggest Questions For Every MLB Wild-Card Series
The 2026 MLB postseason is here , and the path to the World Series is loaded with familiar contenders, unexpected arrivals, and a few teams carrying serious momentum into October. From the White Sox completing a remarkable turnaround to the Brewers chasing the first championship in franchise history, there is no shortage of intrigue .…
Tiny Health Raises $33M To Explore What Gut Data Can Reveal About Future Health
Austin-based Tiny Health has raised $33 million in a Series B funding round led by B Capital to help it meet growing demand for its at-home microbiome tests.
“The Swan” contestant recalls fluid filling lungs after plastic surgery for divisive show: ‘I almost died’ for reality TV
Hulu’s nightmare-fuel documentary “The Swan: Behind the Mirror” takes viewers inside one of the most twisted reality series of all time.
Tuesday BP: Wild Card series Game 1
All four NL/AL Wild Card series begin today. Who are Giants fans rooting for?
Lesbian Bar Project Co-Founder: Purity Politics Could Destroy Our Remaining Spaces
Subscribe As a professional lesbian and Massachusetts native, I’ve recently been asked by a lot of folks what I think about the saga unfolding at Last Ditch. The now-viral story, first reported by The Boston Globe, centers on a Western Massachusetts lesbian bar that lifted its mask requirement for one night a week to help drum up business. The decision ignited an intra-queer controversy that has been feasted on by media outlets across the political spectrum—from the New York Post to LGBTQ Nation—and is even reportedly being eyed for a Hollywood adaptation. Apparently nothing is more entertaining than a bunch of lesbians and queers fighting with each other over KN-95s. What has been lost in all of the chatter and media coverage is the very real possibility that Last Ditch, which just opened in April 2025, will have to close its doors. The venue’s one remaining founder, Jackie Matellian, revealed in a community Zoom meeting that she’s working four jobs, is now solely responsible for the bar’s $50,000 business loan and is struggling to keep up with the bills. So as we laugh about the controversy’s similarity to a “Portlandia” skit and how one of the bar’s founders left to enroll in clown school, we forget that yet another lesbian bar is facing an existential crisis—and this time the call is coming from inside the house. In 2020, my friend Elina Street and I created The Lesbian Bar Project, an Emmy-, Webby- and GLAAD Media Award-winning docuseries and initiative that tells the stories of lesbian queer bars around the world. We were moved to act because at the time there were only an estimated 16 lesbian bars in the United States, and the pandemic threatened to bring that number down even further. There are now more sapphic bars than there were just before the pandemic—about 36 of them in total—but this is down from approximately 200 in 1980. Maybe that doesn’t mean much to you, but for the millions of sapphics living in the U.S., this number is calamitous. As the world laughs at lesbians and sapphics, I want to take a second and tell you what I feel when I walk into one of these bars, which are all unique and irreplaceable in their own way: I feel seen. Sometimes I think Cubbyhole in New York City’s West Village neighborhood knew I was gay before I did. When I walked in there for the first time, before I was even out, I was transfixed by the colorful array of tchotchkes hanging from the ceiling and how the women standing next to me were completely unafraid to express their desire for one another. I knew the minute I was ready to come out, I had a home. I also felt the joy of a new couple falling in love at Seattle’s Wildrose, the quiet confidence of a short king lining up her shot at the pool table at Ginger’s in Brooklyn and the kick of cayenne pepper in Julie Mabry’s crawfish at Houston’s Pearl Bar. Subscribe Lesbian bars don’t just serve lesbians; they serve queer folks across the spectrum, including bisexual, pansexual and trans people. As Elina and I traveled across the U.S. and Europe and to parts of Latin America to document the bar owners, staff and patrons that make up the ecosystems of these spaces, we also became uniquely acquainted with the factors that threaten their existence: gentrification, wage gaps, sexism, environmental disasters, gun violence, rising insurance premiums and political administrations working to annihilate queer people and their families. Lesbian bar owners, like all leaders and entrepreneurs, are imperfect. There have been significant issues over the years at lesbian bars: employee harassment, racism, lack of accessibility, sexual assault and transphobia. All bar owners should be held accountable and should listen to their communities to evolve into safer and more equitable spaces. I also acknowledge my privilege: I am able-bodied, white, cis and from a family system that loves me for who I am. Not everyone has that. Queer people, especially trans and bisexual people, are suffering from disproportionately high levels of depression, and our mental health system isn’t equipped to support them. Immunocompromised people and long COVID are real, and many of my friends are suffering to this day. The people with the least safety net are often the ones for whom a bar closing costs the most. And yet, as we’re seeing with Last Ditch, the queer community often lashes out at each other. It’s also the mainstream media taking the internal conflict and making a mockery out of it, distracting from the real possibility that this bar could close due to financial pressures. A bar that many people loved and needed is facing extinction. Perhaps it’s safer to dissent with one another than with the larger forces trying to eradicate us, but in doing so, we risk destroying the few spaces we have left. Due to the constraints of purity politics—some in good faith, some not so much—lesbian bar owners, almost all of whom are queer women themselves, are forced to be everything for everyone, similarly to how women are forced to be everything for everyone. By asking these bars to uphold impossible standards—standards very few other third spaces are asked to consider—we all end up losing. I want to move as a community toward dialogue, compassionate dissent and collaboration to make our spaces better with the goal of keeping them OPEN and thriving, rather than destroying them from the inside with expectations that are arguably unattainable. Subscribe While I have your attention—for this fleeting second of the news cycle—may I urge us to spearhead a way to keep these small businesses afloat without attacking our own community along the way? Bar owners are left with an impasse: They want to be community-centered, but they also have to make money to keep their doors open. Sometimes they might make business decisions that don’t work for everyone—and that’s partly because different patrons have different priorities and want different things—but these owners deserve the opportunity for productive dialogue**.** We have to work with them and with each other to keep our spaces open, to keep them growing. Lesbian bars raised me into the queer woman I am today. One thing I think about as I reflect on the six years of work we’ve done to document these spaces is that shared, unspoken language I have with a stranger the moment we both walk into one of these bars: the nod, the ease, the not having to explain ourselves. I don’t want to lose that, and neither should you. If objective, nonpartisan, rigorous, LGBTQ-focused journalism is important to you, please consider making a tax-deductible donation through our 501(c)(3) fiscal sponsor, Resource Impact, by clicking this button: Donate
2026 MLB Wild Card Series Preview
Taking a quick look at the four Wild Card Series across the league this week
Yankees news: Aaron Judge playoff roster debate nears decision
Judge returning for Wild Card series?; Overview of Yankees-Red Sox rosters; Cam on online hate; ZiPS playoff odds
Canada Goose Teams Up with Elixir Films and Lief Entertainment on Documentary Series Starring Ewan McGregor
The performance brand brings its legacy in exploration to the open ocean, setting sail with Ewan McGregor and his crew on their journey across the Atlantic Ocean
As public worries about AI grow, Newsom's political calculus is changing
In recent weeks, Newsom has signed a series of AI oversight bills and called for stronger safeguards as some of the industry's own leaders warn about the risks of increasingly powerful AI systems.
Galaxy S27 Ultra camera could solve two major issues seen on Samsung phones
The launch of the Galaxy S27 series is still four months away, but most details about the lineup's phones have already leaked. While the Galaxy S27 Ultra's basi
Daniel Suarez sits 16th in Chase standings after Kansas
Daniel Suarez sits 16th in the Chase standings after the NASCAR Cup Series race at Kansas Speedway.
Tyler Reddick's championship hopes fading after Kansas in 2026
Tyler Reddick's championship hopes are fading after a tough NASCAR Cup Series race at Kansas Speedway.
Kyle Larson controls Chase after win at Kansas in 2026
Kyle Larson controls the Chase after his big NASCAR Cup Series win at Kansas Speedway during the 2026 season.
Braves Must Crush Phillies In Atlanta To End Playoff Ghosts
The Braves face the Phillies again at Truist Park. A look at the stats, the history, and why Atlanta needs to win this series at home.
ODU political experts analyze new Trump messages
NORFOLK, Va. (WAVY) — President Donald Trump told voters several weeks ago in the face of discouraging GOP polling numbers to “pretend I’m on the ballot.” That should be especially easy now that a series of new messages from the White House have begun running, though the administration emphatically denies that they are propaganda. The […]
Here's How Much The Xbox Cost In 2001 Vs. 2026
Microsoft's original Xbox retailed for $299 in November 2001, when it first launched, but now the Xbox Series X goes for up to $899, while the Series S is $499.
watchOS 27.0.1 is now available for all compatible Apple Watch models
Apple today expanded the availability of watchOS 27.0.1 to more Apple Watch models, following last week’s initial release for Apple Watch Series 12 and Ultra 4
Apple Releases watchOS 27.0.1 for Additional Models
After releasing watchOS 27.0.1 for the Apple Watch Series 12 and Apple Watch Ultra 4 last week to address a bug that was causing devices to restart unexpectedly, Apple has now released the update for all eligible watches, which includes Series 9 and later.
Freeman Wants Dodgers World Series Win for Rojas
Freddie Freeman rallies the 100-win Los Angeles Dodgers roster around a veteran’s farewell while battling through personal injury to secure another World Series for Miguel Rojas.
Takeaways: Nationals finish 2026 with series win vs. Mets
The Washington Nationals beat the New York Mets to complete three straight series wins and close out the 2026 MLB season.
The Galaxy S25 series plus the Galaxy Z Fold7 and Z Flip7 are now getting stable One UI 9
The update has started rolling out to users in South Korea. Samsung announced the One UI 9 update for the S26 series – it started rolling out in South...
Behind the Science with Paleontologist and Curator of Dinosauria Dr. Matthew Carrano
Is the 21st Century the real Age of Dinosaurs? Today, more paleontologists are discovering more dinosaur fossils from more places in the world than ever before. Our understanding of these amazing creatures has leapt forward while their popularity has surged. Museums sit at the junction of these phenomena. The Smithsonian has been a center for dinosaur research for more than a century, and its collections include many iconic and scientifically important specimens. Today, Smithsonian researchers continue to discover new dinosaurs, but they are also uncovering more information about the ones we already know and love. New techniques and approaches allow them to investigate aspects of dinosaur biology, ecology, and evolution in ways that would have been inconceivable to early paleontologists. The result is an ever-improving understanding of dinosaurs as living, breathing, and thriving animals. This month, go behind the science with paleontologist Dr. Matthew Carrano, Curator of Dinosauria at the National Museum of Natural History as he discusses new discoveries at home and abroad, in the field and in the museum. Registration is encouraged. Space is filled on a first come first served basis. ---------------- About the Series: Behind the Science A monthly after-hours series featuring NMNH scientists and researchers Each month, join the National Museum of Natural History for the new series, Behind the Science, where NMNH researchers share insights into their latest discoveries and explore the fascinating questions driving their work—from the origins of life to the future of our planet. Come learn what’s happening behind the scenes and how science shapes our understanding of the natural world. Programs take place in Q?rius, the Coralyn W. Whitney Science Education Center. Topics and speakers announced on a rolling basis, but save the dates now!
Dayton Mall owner launches multi-phase makeover
The owners of the Dayton Mall in Miami Twp. are renovating the property in an effort to strengthen the property through a series of interior and exterior upgrades.
WildBrain Unveils New Strawberry Shortcake Launches
WildBrain releases trailer for new Strawberry Shortcake series as franchise builds toward 50th anniversary with new partnerships.
TCL’s new ‘Designer’ Google TVs are just like Samsung’s The Frame, starting at $899
TCL has launched a new “Designer Series” of TV sets running Google TV with a flush mount design and matte...
How to Watch: White Sox at Astros, Wild Card Series
Your broadcast guide this week, including every permutation of Game 3 start times!
Trump administration uses taxpayer money to air 2024 Trump campaign ad
A television advertisement from Donald Trump's 2024 presidential campaign is the latest in a series of ads promoting the president ahead of the midterms that the White House maintains are “public service announcements.”
Trump administration begins airing 2024 Trump campaign ad
WASHINGTON (AP) — The Trump administration is using taxpayer funds to air a television advertisement from Donald Trump’s 2024 presidential campaign in the latest in a series of ads promoting the president ahead of the midterms that the White House maintains are “public service announcements.” The 30-second video, which is virtually identical to one that […]
Business Breakdown series being revived in Greenfield
Greenspace CoWork is reviving its Business Breakdown series on Oct. 1 with guest Victoria Tubbs of Magic Wings Butterfly Conservatory.
Poll: 2026 A.L. Champions
Who will be the American League representative in the 2026 World Series?
In 'Open Season' Draymond Green takes you on his mental health journey
Warriors star Draymond Green discusses the docuseries of unscripted therapy sessions, LeBron James, Steve Kerr and more.
Samsung rolling out Android 17, One UI 9 for more Galaxy S26 users
Samsung is widening the rollout of Android 17 and One UI 9 to the Galaxy S26 series in the US, but the floodgates aren't fully open yet.
Houston Astros rebound from 11 games under .500 and win AL West
Houston will host the Chicago White Sox in a best-of-three Wild Card Series starting Tuesday.
Houston Astros rebound from 11 games under .500 and win AL West
Houston will host the Chicago White Sox in a best-of-three Wild Card Series starting Tuesday.
Why the Boston Red Sox will win the World Series
The Boston Red Sox are going to win the 2026 World Series. That’s right—the whole shebang, the Fall Classic, the big one, the World Series. Vegas, if you’re into that kind of thing, has the odds at about 14-1. Vegas is famously wrong, however, and I’m here to tell you that the odds are 100%. […]
Why the Yankees can win the World Series
The Yankees’ road to No. 28 is treacherous but not impassable.
Famitsu sales (9/14/26 - 9/20/26) - first week sales revealed for Fire Emblem: Fortune's Weave
The latest Japanese hardware sales from Famitsu are as follows: Switch 2 – 34,341 PS5 Digital Edition – 7,441 Switch OLED – 2,634 Switch Lite – 2,248 Switch – 823 PS5 Pro – 219 PS5 – 187 Xbox Series X – 136 Xbox Series X Digital Edition – 116 Xbox Series S – 19 For comparison’s sake, here are the...
Business Beyond the Beach: David Sexton| President, Normandy Fountain Business Assoc.
Getting your Trinity Audio player ready... 🎙 Welcome to the Business Beyond the Beach Talk Show! The Miami Beach Chamber of Commerce is proud to present Business Beyond the Beach, the exclusive Chamber talk show created in partnership with Miami’s Community Newspapers. This series highlights the stories of Miami Beach Chamber members making an impact […]
Your 2026 MLB Wild Card Series announcing schedule
Major League Baseball revealed the television schedule and scenarios for the 2026 postseason’s Wild Card Series on Sunday. Details have since emerged about the announcing crews that will call the games across NBC platforms. As was the case during the regular season, local analysts will be in the booth to give each broadcast a familiar…
Buttler out of tri-series while England prepare central contracts
Wicketkeeper Jos Buttler will miss England's 50-over tri-series in Pakistan next month, with Jordan Cox set to be given another chance to impress in his place.
The Xbox Series X Can Now Play PlayStation 5 Games - Here's How
A modder named Devran Cosmo Uenal has created a special port of the KytyPS5 emulator for Xbox Series X, allowing some PS5 games to be played on the console.
E.l.f. jams to second music album under entertainment marketing arm
“Mirror Mix” features seven rising artists and will be promoted through a partnership with song lyrics platform Genius around its Open Mic content series.
NASCAR reveals Cup post-race inspection results from Kansas
NASCAR has revealed the Cup Series post-race inspection results from the 2026 Hollywood Casino 400 at Kansas Speedway in September.
Castlevania's Iconic Soundtrack Gets Its Own Symphony, Brought to Life by a 25-Piece Power Rock Orchestra
Konami is celebrating Castlevania’s 40th birthday with a special symphony made up of a 25-member rock orchestra that will bring the series’ iconic sounds to fans in Tokyo, London, and Los Angeles.
Braves Announce Major News Days Before Phillies Playoff Series
The Atlanta Braves announced major news before the team's playoff series against the Philadelphia Phillies. Find out more on the rivalry Wild Card series. The post Braves Announce Major News Days Before Phillies Playoff Series appeared first on HEAVY.
What to Stream: Quavo album, 'East of Eden' series and 'Minecraft Dungeons II'
A limited series adaptation of “East of Eden” and a new album from Quavo are among streaming releases coming in October. “Teenage Sex and Death at Camp Miasma” premieres Friday
MLB playoff picks 2026: Dodgers? Yankees? Rays? Brewers? Yahoo Sports makes postseason predictions all the way to the World Series
NASCAR Cup Series Standings After Kansas: Full Chase Points Update
Kyle Larson did more than win Sunday at Kansas Speedway. He left the track with a commanding lead atop the NASCAR Cup Series Chase standings. Larson’s victory, his fourth career Cup win at Kansas, capped a massive points day for the Hendrick Motorsports driver. He earned 76 points, the most by any driver in a […] The post NASCAR Cup Series Standings After Kansas: Full Chase Points Update appeared first on HEAVY.
Cubs Wild Card Schedule: Start Times and Broadcast Info
The Chicago Cubs will head to San Diego for a Wild Card Series rematch against the Padres, with late-night start times and a challenging matchup awaiting.
Dan Wilson out as Seattle Mariners manager
Dan Wilson will not return as the Seattle Mariners' manager next season, he and the team said Sunday. Wilson made the announcement shortly after the Mariners finished off a 7-3 win over the Los Angeles Angels, the ending to a disappointing 76-86 season that began with World Series hopes after the Mariners made it to Game 7 of the ALCS last season. “Collectively we failed to meet our own expectations this season,” Mariners President of Baseball Operations Jerry Dipoto said in a statement.
Braves at Marlins series recap: It’s onto October for Atlanta
The Braves take a Fall jaunt to South Beach before rocking and rolling into the Postseason
Lesley-Anne Down says ‘everybody thought’ Patrick Swayze was having an affair with her, but he was really ‘out all night’ with this costar
The pair played star-crossed lovers in the miniseries “North and South,” but Down ended up with a different collaborator.
Braves learn Wild Card series opponent
The Atlanta Braves now know who they will face in the Wild Card series.
Trump administration begins airing 2024 Trump campaign ad in latest taxpayer-funded messaging
The Trump administration is using taxpayer funds to air a television advertisement from Donald Trump’s 2024 presidential campaign in the latest in a series of ads promoting the president ahead of the midterms that the White House maintains are “public service announcements.” | 830 WCCO
Trump administration begins airing 2024 Trump campaign ad in latest taxpayer-funded messaging
The Trump administration is using taxpayer funds to air a television advertisement from Donald Trump’s 2024 presidential campaign in the latest in a series of ads promoting the president ahead of the midterms that the White House maintains are “public service announcements.”.
Trump administration begins airing 2024 Trump campaign ad in latest taxpayer-funded messaging
The Trump administration is using taxpayer funds to air a television advertisement from Donald Trump’s 2024 presidential campaign in the latest in a series of ads promoting the president ahead of the midterms that the White House maintains are “public service announcements.”.
The pros and cons of using a foldable phone
Foldable phones like the Apple Duo and the Samsung Galaxy Z Fold series are useful in some scenarios, but there are also some downsides, including price.
See Madonna's son's transformation for 21st birthday in 6 photos
Madonna shared a series of photos of her son David Banda through the years in honor of his 21st birthday
England win series as Banton delivers on potential
Tom Banton delivers on all of his potential by crashing a brilliant first international century as England wrapped up their summer with an ODI series win over Sri Lanka.
Brewers' Homefield Advantage Bolsters World Series Hopes
The Milwaukee Brewers have the homefield advantage throughout the National League playoffs.
For Sale: Luc Donckerwolke’s RUF-Modified 1970 Porsche 914/6
This is a 1970 Porsche 914/6 that benefits from a series of major upgrades, including an upgrade to M471 GT specification by Antwerpse Automobile Company
Around the Empire: Wild Card Series previews and predictions
All your Wild Card Series questions answered; Wells’ well-timed turnaround; JV calls it a career.
Trump posts series of attacks on GOP congresswoman who criticized him on immigration
President Donald Trump appeared to intensify his irritation with GOP Rep. Maria Elvira Salazar on Saturday evening after reposting a series of social media attacks on the congresswoman who made waves last week for breaking with him on his immigration tactics.
Revisiting Dontrelle Willis’ Career With Miami Marlins
From Rookie of the Year honors to a World Series ring, witness the electric rise of the "D-Train" and his lasting legacy as a Marlins Hall-of-Famer.
San Antonio's Michelle Beadle joins Matthew Berry for new Roku sports show
The two-hour talk series will stream live and free on the Roku Sports Channel Monday through Friday from 11 a.m. to 1 p.m. CST.
“Resident Evil” (2026) Review and Film Franchise Retrospective
After years of poorly made adaptations, “Resident Evil” (2026), directed by Zach Cregger, attempts a new approach to a story that fans have witnessed many times. From 2002 to 2017, Sony released six action-horror movies based on the game series. Mostly directed by Paul W. S. Anderson, the films would create new characters and seemed...
NASCAR Chase has been best blend of entertainment and integrity
Cup Series drivers say this format is doing everything it set out to accomplish
TST Best Bets: September 26, 2026
Two ranked Big Ten battles highlight Saturday’s slate, led by No. 12 USC hosting No. 20 Oregon at the Coliseum. The Ducks have won four straight in the series, but the Trojans have a chance to end that skid while strengthening their place in the College Football Playoff race.No. 17 Iowa and No. 18 Michigan also put their undefeated records on the line in Ann Arbor. With both teams leaning on physical rushing attacks and two of the nation’s better defenses, points could be difficult to come by at
Apple Watch Series 12 one week later: There's so much more than meets the eye
When Apple unveiled the Apple Watch Series 12, two features stood out: the new Siri Recap feature, as well as...
RTX 5080 and RX 7900 XTX showed almost identical FPS in Ace Combat 8 in 4K
We have carried out detailed benchmarking of the latest NVIDIA GeForce RTX series graphics accelerators and AMD Radeon RX in the flight simulator Ace Combat...
Castlevania celebrates turning 40 by giving away the original game for free
Konami is giving away the original 1986 Castlevania for free to mark the series' 40th anniversary, alongside deep sales and a new game, Belmont's Curse.
Rangers Thumped 10-2 by Twins to Open Massive Series
With their playoff hopes on the line, the Texas Rangers started their massive series against the Minnesota Twins with a 10-2 defeat.
Intel Panther Lake Teardown, 18A, BSPD, GAAFET, SemiAnalysis STEEL
Panther Lake debuts the first commercial implementation of backside power delivery (BSPDN), introduces Intel’s first iteration of gate-all-around (GAA) transistors, and showcases their advanced packaging capabilities with its Foveros-S assembly. With Panther Lake, Intel’s manufacturing arc has shifted from nebulous roadmaps to shipped silicon, a significant milestone on their long road back to competitive semiconductor manufacturing. To evaluate the extent of Intel’s comeback, we tore down Panther Lake. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Our teardown traces 18A from its four-sheet RibbonFETs (Intel’s marketing name for GAAFETs) and gate stacks through contacts, frontside and backside wiring, and the bonded carrier. We explain how these material and integration choices improve gate control and reduce resistance, while adding capacitance, thermal resistance, and process complexity. Our measurements put Panther Lake’s 18A compute logic and TSMC N3E GPU logic at similar logic density. However, 18A does not lead TSMC N3P, N2 or Samsung SF2 in peak density. Panther Lake’s CPU cores are incremental updates, and the high-end GPU still uses TSMC N3E. Panther Lake assembles one compute tile, one GPU tile, and one I/O tile atop a passive base tile using Intel’s Foveros-S advanced packaging. Both compute tile variants use Intel 18A. The Xe3 GPU options are a 4-core GT1 tile on Intel 3 and a larger 12-core GT2 tile on TSMC N3E. Both I/O tile variants use TSMC N6. [1], [2] Our analysis centers on the PTL-U compute tile, both the 4-core and 12-core GPU tiles, as well as the 12-lane I/O tile. In conventional chips, power and signal are routed through the same frontside metal stack towards the device frontend. Power rails consume scarce routing resources near the transistors, while tall via stacks carry VDD and VSS from the coarse upper wires to local rails. Backside power delivery (BSPD) moves the main power network behind the transistor layer, to the backside, separating it from frontside signal routing. We covered BSPD and its impacts in 2024. [3], [4], [5] Intel’s BSPD implementation, branded as “PowerVia”, routes power through dedicated backside metals to nano-TSVs, which connect those rails to local source/drain (S/D) contacts. Implementing that separation requires Intel to build the interconnect stacks from both sides of the wafer. The frontside comprises the M0-M14 signal stack, while the backside comprises the BM0-BM5 power stack. M0 and BM0 are closest to the transistors. The nano-TSVs connect the two sides, but Intel patterns and etches each via from the front after forming the contacts. A narrow via runs from the side of the contact deep into the silicon substrate. Intel then completes the frontside signal metal stack, bonds the wafer to a carrier, flips it and removes the original substrate until the buried via tips are exposed. The backside metal stack is then deposited directly on the revealed vias. The nano-TSV and backside-via profiles taper in opposite directions because Intel forms them from opposite sides of the wafer. The transistor structures form the FEOL. Local contacts and nano-TSVs connect them to the wiring. M0 begins the frontside interconnect stack. The silicon carrier remains attached above the frontside interconnects. It supports the device wafer during substrate removal and backside processing and remains part of the finished chip’s thermal path. PowerVia removes the main power distribution from the congested frontside metals, routing supply through shorter and wider backside wires. Its lateral landing still occupies area in the standard cell, so it recovers less cell area than a direct backside contact. [3] Nano-TSVs beside the logic devices carry VDD or VSS from the backside power network, while signal connections continue upward through the frontside metals. Backside Interconnects Samsung SF2 data is included for comparison to Panther Lake’s within this article. SF2 is the incumbent GAA foundry node but lacks BSPD, serving as a useful reference to evaluate 18A. A full teardown of Samsung’s S26 products, processed on SF2, will be shared soon.Nanosheet-cut EDS comparison. The PowerVia supply path runs from the backside Cu rails through Mo-lined W nano-TSVs to the local transistor contacts. In this cross section, the tapered connection spans roughly 150 nm from the contact level to BM0. The Ta liner confines Cu and promotes adhesion to the surrounding stack; the AlOₓ etch stop controls the next dielectric etch above the rail. Dielectric beneath the ribbons electrically separates the devices from the backside wiring and removes the conducting silicon body below the channel. [6] AlOₓ serves as an etchstop (ES), enabling endpointing and protecting the underlying layers. Low-volatility aluminum fluoride reaction products resist the fluorinated plasma, allowing a thin AlOₓ film to protect the metal while the surrounding low-k dielectric is removed. [6], [7]. While the BM0 and layers above the M1 lines show double AlOx layers, Our SMIC N+3 teardown showed single AlOₓ layers. SMIC uses a simpler local AlOₓ substack, while the remaining cap and etch sequence provide the required landing protection. So why double layers? The closely spaced AlOₓ doublets provide two protected endpoints in the etch sequence. Intel documents an AlOₓ/SiN/AlOₓ stack that explains the benefit. The main dielectric plasma etch stops on the first AlOₓ film; a selective wet clear opens that film; a second plasma etch removes the intermediate SiN and stops on the second AlOₓ film. The final wet clear exposes the metal landing surface. SiN is the intermediate dielectric in Intel’s published example. [8] The second stop protects the metal through a cap breakthrough. Wide openings can etch faster than narrow ones, and etch depth varies across the wafer. Metal under an early-clearing opening would otherwise be exposed while other openings still need more etching. Staged protection widens the process window and reduces metal erosion, corrosion and void formation. [8] TSMC documents AlN/AlOₓ/SiOC/AlOₓ above Cu, with AlN blocking Cu diffusion, and a simpler AlN/SiOC/AlOₓ variant that omits one AlOx film. [9] Levels with different opening sizes, aspect ratios, pattern densities and cap materials need different etch margins. A double AlOx stop is useful where another protected endpoint justifies the added processing. The extra film adds formation, selective opening and cleaning steps, plus another set of interfaces to control adhesion, moisture, and stress. These blanket films are opened through the existing via pattern, so each film does not require another lithography mask. AlOₓ adds parasitic capacitance when it replaces lower-k dielectric; two thin AlOₓ films can nevertheless contain less AlOₓ than one thick film. Total thickness, placement, and theintermediate dielectric determine the electrical cost. Deposition chemistry also changes AlOx permittivity and residual hydroxyl content, which can oxidize the underlying metal. [7], [8], [10], [11] The backside stack separates into relatively fine BM0-BM2 wiring near the devices and coarser BM3-BM5 power distribution. The largest pitch increase occurs between BM2 and BM3. BM0’s pitch closely matches the logic-row height, fitting local power delivery to the cell rows. Higher levels aggregate current through larger conductors: routing density becomes less important than low resistance and current capacity as the network approaches the package. This hierarchy provides wide power wiring for the power delivery network without consuming scarce frontside signal-routing resources. [3] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Frontside Interconnects Intel 18A combines Mo-lined W contacts and nano-TSVs with a separate backside Cu power network. Samsung SF2 keeps power on the frontside, using Ti-based contact interfaces and Ta-based barriers and Co liners around Cu wiring. In 18A standard-cell rows, backside power rails supply the devices through nano-TSVs within the cells, freeing frontside routing resources. Samsung’s M0 accommodates both power and signal connections. From the device toward M0, the connection runs through a Ti-based S/D interface, W contact fill, a Mo-lined W via, and the Cu M0 wire. Mo supplies a conductive nucleation and adhesion layer for W, replacing the resistive TiN liner used in conventional W integration. This increases the effective conduction volume within the feature while retaining W fill and its established polishing, cleaning and etching processes. Intel’s Mo/W patent describes this integration tradeoff. The nano-TSV uses the same Mo-lined W construction in the backside supply path. [12] The move from TiN to Mo is an incremental change. While a full Co or Mo fill can also reduce the volume lost to liners in very small features, it requires new integration schemes that increase complexity and risk. Cu remains attractive for wider wires due to its low resistance. As wires and vias shrink, the diffusion barrier consumes an increasing fraction of their cross-section. [12], [12], [14] Intel uses Co/Ru liners at M0-M1, Co at M2-M4, and Nb at M5-M9. The lower-level liners help Cu adhere and reduce void formation during trench fills. Applied Materials’ Endura has new thermal control that facilitate wetting process, so the thin film continuity is good enough that good capillary pressure will drive Cu atoms to the via bottom without voiding. Intel’s choice to use Nb is particularly interesting. Intel’s Nb patent describes a conductive diffusion barrier intended to reduce the barrier’s contribution to resistance relative to conventional Ta-based barriers, particularly at via bottoms where all current crosses the barrier. The patent pairs Nb in coarser levels with the option of lower-cost PVD processing. [15], [16] The upper metal layers support thicker barriers formed through physical vapor deposition (PVD) despite its worse coverage and uniformity. Meanwhile, the lower metal layers require thinner barriers deposited through conformal atomic layer deposition (ALD). Co/Ru adds another material interface and requires controlled deposition and Cu fill. Changing liners and barriers by metal layer allows Intel to optimize interconnect resistance, process complexity, and reliability. [15, 16] RibbonFET, Intel’s name for its gate-all-around FETs (GAAFETs), replaces the FinFET’s vertical fins with four stacked horizontal silicon nanosheets, allowing the gate to surround the channel on every side. The path to GAAFET begins with the planar transistor. A planar MOSFET places the gate above the channel between its source and drain. Pairing an NMOS with a PMOS transistor creates a CMOS inverter, in which the NMOS pulls the output low for a high input, and the PMOS pulls it high for a low input. The gate must retain electrostatic control of the channel to ensure clean switching. As gate lengths shrank, the drain began to compete with the gate for that control, increasing off-state leakage. Electrostatic control was restored through an architectural evolution that raised the channel into a vertical fin and wrapping the gate around three sides. Called “FinFET”, this new architecture packed more effective channel width into a smaller footprint. Further scaling made it harder to maintain both drive current and leakage within smaller cells, and reintroduced the same problems planar MOSFETs faced. Nanosheet GAAFETs close the fourth side by replacing the vertical fin with a stack of horizontal nanosheets, each surrounded by the gate. The tighter electrostatic control suppresses leakage at shorter gate lengths while stacking adds effective channel width within the cell footprint. In a FinFET process, channel width changes in discrete steps as designers must add or remove whole fins. Nanosheet width can instead be adjusted continuously within the process’s design rules. Wider sheets increase drive current, while narrower sheets reduce capacitance at the cost of drive current. Intel 18A uses stacks of four nanosheets each and varies their widths across logic and SRAM. At the process level, adding more sheets to each stack increases effective channel width and drive current, but complicates fabrication. RibbonFET vs MBCFET Samsung began GAAFET production in 2022 with SF3E, following with SF3 and now SF2. Its ‘MBCFET’ provides a useful structural comparison with Intel’s first RibbonFET implementation. [17] STEEL is digging deeper into SF2, used in the Exynos 2600, and TSMC’s GAAFET N2, used in Apple’s A20 Pro, in upcoming newsletter articles. We’re throwing some teasers on X. Let’s compare Samsung SF2’s MBCFET with Intel 18A’s RibbonFET. Subscribe Even to the untrained eye, Intel’s extra nanosheet is obvious. Intel stacks four ribbons to Samsung’s three. Samsung’s sheets are much wider in these fields, so both sheet count and width matter to the available channel perimeter. Sheet width also changes which silicon surfaces carry current. On conventional (001) silicon, wide nanosheets emphasize the broad top and bottom surfaces, favoring electron transport; the larger sidewall contribution in a narrow sheet favors hole transport. Thinner sheets improve gate control but increase confinement and scattering. This makes width and thickness part of the NMOS/PMOS balance, alongside strain and threshold voltage. [18], [19] GAAFET designs like 18A use different work-function-metal (WFM) stacks for NMOS and PMOS. Around each ribbon, a thin SiOx interfacial layer separates the silicon channel from the HfOx high-k dielectric, with La providing dipole tuning and the WFM wrapping the dielectric. NMOS uses a TiAl-based stack, while PMOS uses TiN WFM. W fills the remaining gate trench, providing a lower-resistivity path where the work-function layers are no longer needed. In this field, the PMOS stacks leave room for W between ribbons, while the NMOS stacks occupy more of those gaps. A silicon-based dielectric marks the P/N boundary, allowing the PMOS and NMOS gates, sharing the same gate trench, to be processed sequentially. Fast logic paths, retention circuits, and SRAM need a family of threshold options. Changing threshold without substantially changing device dimensions, capacitance or fabrication complexity is valuable. FinFET processes typically use different work-function-metal stacks. In a four-ribbon GAA stack, the narrow sheet-to-sheet gap limits how much WFM can fit around each channel. La in the gate dielectric creates interfacial dipoles at the SiOx/HfOx boundary, shifting effective work function and tuning threshold voltage. This gives Intel another control alongside its NMOS and PMOS WFM stacks. Low-threshold devices improve critical-path drive; higher thresholds reduce leakage elsewhere. Dipole tuning is especially useful in GAA because it changes threshold without consuming the narrow intersheet gap with thicker WFM. Precise control of La incorporation, diffusion and interface quality has long been a challenge, limiting viability in high volume production but is now seen from every leading-edge foundry. Intel’s patent describes depositing a dipole-forming oxide above HfOx and annealing it toward the interfacial oxide before completing the work-function and fill metals. This separates threshold tuning from the space available for metal. Newer research addresses the thermal cost: imec’s 2026 dipole-middle research inserts the shifter between two HfOx depositions, shortening the diffusion path while protecting SiOx during patterning. [20], [21]Matched-cut EDS, Intel 18A (left) vs. Samsung SF2 (right). Intel retains raised source/drain epi beneath its contacts, while Samsung recesses W deep into the epi to form a V-shaped Ti-lined interface. The deeper contact increases metal-to-semiconductor area and shortens the current path from the lower sheets, reducing contact and spreading resistance. It also removes epi volume and brings the contact etch closer to the channel ends. Retaining more epi preserves the material available for strain transfer, especially from SiGe into PMOS. These geometries balance contact access against stress engineering and etch margin. [22], [23] Samsung stacks three sheets to Intel’s four ribbons, and both processes use sheet width to tune drive strength. In our Samsung cross-sections, widths range roughly from 19 to 30 nm in the NPU rows and 37 to 50 nm in the CU cell. The Samsung nanosheets taper, with the widest sheet at the bottom and the narrowest at the top. Both processes use HfOx gate dielectric and Ti-based work-function stacks, with Al in the NMOS stack. In the Samsung devices shown here, the dielectric and WFM occupy the intersheet gaps, leaving W above the top sheet. Intel’s PMOS stack leaves more room between ribbons, and W fills those gaps while the thicker NMOS stack leaves W mainly in the upper trench. Gate-stack EDS maps. The W between Intel’s PMOS ribbons provides a conductive path close to the lower gates. Where WFM fills the entire gap, the gate still surrounds the channel, but voltage reaches it through the more resistive work-function films. Thinner WFM and dipole tuning preserve room for low-resistivity fill; Mo and Ru are alternative fill metals being developed for further scaling. [24] A masked, sequential WFM flow explains the different gate heights and inter-nanosheet fill. The proposed sequence below shows how separate NMOS and PMOS work-function steps produce that geometry. Enabled by the BSPDN process, Intel replaces the dense-logic silicon subfin with dielectric, removing the parasitic conduction path below the ribbons and reducing substrate-related capacitance. A retained silicon body as in classical, non-SOI, planar and FinFET designs needs junction and punchthrough-stop engineering to suppress leakage. Dielectric isolation makes that leakage less sensitive to the subfin doping profile but adds removal and fill steps. It also weakens the direct thermal path through silicon, making the contacts, metal stacks and package more important for heat extraction. [24], [26] Fluorine is concentrated around selected Intel device structures in the maps. WF6 is a standard precursor for W nucleation and fill, while barrier films protect adjacent dielectrics from fluorine attack. Low-fluorine W processes reduce the residual-F burden. Chloride-based precursors avoid introducing F during W deposition, but require control of chlorine attack, nucleation and fill quality. The integration target is a continuous, low-resistance W path with a thin protective liner and minimal chemical damage to the surrounding stack. [20], [27], [28] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. We measured cell height, gate pitch, metal geometry, and ribbon dimensions at the XTEM sites shown below. The tables group these dimensions by site and device polarity. Our “sheet cuts” cross the silicon channel and show the ribbons end-on. “gate cuts” run along the channel through successive gates. The 18A logic cell dimensions point to a five-track logic library while the N3E and Intel 3 cell dimensions evidence a seven-track logic library. The DDR-PHY uses wider M0 wires and much larger spacing than core logic. That trades routing density for lower wire resistance and weaker coupling between neighboring nets. The geometry suits the current delivery and coupling requirements of analog, clock, and I/O circuitry. PowerVia lets 18A combine a compact cell height with wider M0 geometry by moving the main power rails off the signal-routing tracks. That relaxes local wire scaling while preserving a small cell footprint. Cell height and gate pitch set the geometric density; pin access and routability determine how much of it a real block can use. [29] The biggest takeaway from our gate-pitch measurements is that Intel 18A compute logic and TSMC N3E GPU logic have similar density in the Bohr representative-cell model. The 18A example is 18.6% denser than the Intel 3 GPU example. Gate pitches are nearly identical across the three sites, so cell height drives most of the difference. The Bohr model combines a four-transistor NAND2 spanning three gate pitches and a 32-transistor scan flip-flop (SFF) spanning nineteen pitches, weighting their densities 60:40. The sensitivity column shows how independently changing cell height and gate pitch by ±1 nm changes the result. This compares representative cell geometries; whole-die density also depends on cell mix and placement. The 18A P-core gives M0 substantially more metal cross section than the N3E vector engine. Treating each profile as a trapezoid gives 2.63 times the area per line and 1.84 times the area after normalization by routing pitch. The larger section reduces the geometric contribution to line resistance and lowers current density for a given current. Taller and wider wires also add capacitance, so circuit delay depends on the balance of resistance and capacitance. The DDR-PHY has less metal area per routing width than the 18A core fields, while remaining above N3E. [30] Area = height × (top CD + bottom CD) / 2, including liners. Area/pitch normalizes by routing width. Taper is the symmetric sidewall angle from vertical, with the largest angle belonging to the DDR-PHY. Compute tile The measurements show how ribbon dimensions and gate-stack geometry vary across the compute tile and between NMOS and PMOS to balance channel drive, gate load and the space needed for the dielectric/WFM stack across logic, SRAM and the DDR-PHY. Width mainly changes available channel perimeter; thickness also changes electrostatic control and carrier confinement. Gate-stack thickness then determines the space left for low-resistivity fill P-core and LP E-core logic Both the P-core and LP E-core use multiple nanosheet widths. Widths are measured on high-magnification XTEMs while wider-field images demonstrate additional width choices within the LP E-core. Multiple widths are expected even within an LP E-core. Timing-critical paths, buffers and cells with different fanout need different drive strengths. The lower-magnification fields show this width diversity beyond the sites quantified in the table. L2 and L3 SRAM GAA gives SRAM designers another way to balance the pull-up (PU), pass-gate (PG), and pull-down (PD) transistors. FinFET bitcells set device strength through fin count while GAA adds nanosheet width as a sizing knob. In a 6T SRAM cell, a strong pull-down relative to the pass-gate limits read disturbance, while a strong pass-gate relative to the pull-up improves writability. During a write, the pass-gate and write driver pull the node storing “1” below the inverter trip point. During a read, the pull-down holds the node storing “0” low. Bias, threshold voltage, mismatch and assist circuitry set the remaining margin. FinFET high-current cells commonly use a PU:PG:PD fin-count pattern of 1:2:2, a device-sizing ratio rather than a current ratio. Ribbon width lets Intel balance SRAM strengths without adding whole fins. The L2 cell uses its narrowest ribbons for PU and widest for PD, improving writability and read stability respectively. Intel’s disclosed HCC operates without assist; its denser HDC uses negative-bitline write assist. Pulling the selected bitline briefly below ground increases pass-gate overdrive so it can overpower the pull-up at lower supply voltage. That buys density and low voltage writability at the cost of boosting circuitry, switching energy, and additional voltage stress that must be controlled. [31], [32] Four rectangular ribbons give the perimeter = 8 × (width + thickness), before corner rounding. PG/PU is 1.49 and PD/PG is 1.16. The L3 structures closely resemble L2 in layout and cell height. Fewer L3 nanosheet widths are tabulated because fewer high-magnification images were available. DDR PHY The DDR-PHY trades density for controlled analog behavior and reliable off-chip signaling. It contains drivers, receivers, delay circuits, and calibration logic that set drive strength, sampling time, and voltage margin. Repeated four-sheet devices with similar widths fit the use of regular transistor units for matching and programmable drive. Its wider local wiring provides room for current delivery and separation of sensitive signals, while consuming more area than a dense core-logic grid. The layout serves the memory channel’s electrical requirements as well as digital logic density. [33] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Intel 3 GPU devices Vector engine logic Intel 3’s XVE logic uses two-fin PMOS and NMOS devices with power rails in M0. Its cell height and M0 pitch give a seven-track geometry, two tracks more than the 18A logic. One-fin groups also appear among the two-fin devices. Intel 3 L2 SRAM The Intel 3 L2 SRAM uses the familiar HCC sizing pattern: one PU fin, two PG fins, and two PD fins. N3E GPU devices Vector engine logic The N3E XVE field contains repeated two-fin devices with seven-track cell geometry. N3E remains a FinFET process, giving Panther Lake a direct FinFET-to-RibbonFET comparison. N3E L2 SRAM The N3E L2 SRAM uses the same PU:PG:PD fin-count pattern of 1:2:2. Panther Lake-U follows Lunar Lake’s floorplan quite closely. Both pair 4 P-cores with 4 LP E-cores and NPU, media and display engines in similar locations. Lunar Lake also uses Xe2, the direct predecessor to Panther Lake’s Xe3 GPU. This makes Lunar Lake the most direct basis for our comparisons. Arrow Lake differs in core count and uses the older Xe-LPG GPU architecture, so we only use it where it offers a more direct component-level comparison. Compute tile Panther Lake compute-tile floorplans remain sparse even months after launch. Intel 18A’s backside metal and dielectric stack must be removed without damaging the underlying structures before a clean transistor-level floorplan can be imaged. Most published die shots hide or heavily process the background, but we are quite proud of the die shot we achieved and are excited to show the work we have done. We measured the areas of the key components on the compute tile and compared them with their Lunar Lake predecessors on TSMC N3B. These help us to capture changes in block area and compare the two chips across process nodes and designs. Our total tile areas exclude the scribe-line area. The compute-plus-GPU subtotal below uses the PTL-U compute tile and GT1 GPU; it excludes the I/O tile and passive base. Individual block areas use the boundaries marked on the floorplans The compute-plus-GPU row is recomputed from the displayed PTL-U and GT1 areas. Component rows use their stated per-region counts and are not an additive partition of the whole tile. The P-core area remains almost unchanged between Lunar Lake and Panther Lake, despite L2 capacity increasing from 2.5 MiB to 3 MiB. Arrow Lake uses the same Lion Cove core as Lunar Lake but also has a 3 MiB L2. Cougar Cove fits 20% more L2 into the same P-core area. The larger private cache keeps more of each core’s working set close to its execution units, reducing access to shared L3 and DRAM. Extra capacity adds storage leakage and lookup energy, so designers balance it against avoided lower-level accesses. The shared P-core L3 cache also shrank by 14.8%. [2] Cougar Cove combines a similar footprint with Intel’s reported power-efficiency improvements. RibbonFET’s tighter channel control reduces leakage, while PowerVia reduces supply droop and allows tighter voltage guardbands. [1] Darkmont’s four-core LP E-core cluster is 5.0% smaller than Skymont’s on Lunar Lake, with most of the reduction in its L2 regions. The 1 MiB region shrank by 8.4% and the 1.5 MiB region by 14.9%. The tag arrays also use one fewer visible row. Tags identify which memory addresses the data array holds, so rearranging them changes the cache’s layout and wiring without requiring less data capacity. [2] The LP E-cores share one L2. This pools capacity and avoids duplicating all the cache machinery, but the four cores contend for its banks and bandwidth. Their separate cluster also keeps light work away from the performance cluster and its L3, allowing that larger domain to sleep. [1], [2] Cache area includes more than the storage cells. Tags identify each line, decoders select rows, sense amplifiers read the small bitline signal, and wires connect to the banks. Splitting an array into smaller sections shortens wordlines and bitlines, improving access speed, but duplicates peripheral circuits. Panther Lake’s smaller cache regions therefore reflect the complete memory implementation, including how much of each region is devoted to storage. [34] Unlike Meteor Lake and Arrow Lake, Panther Lake has no separate SoC tile. The NPU, LP E-cores, memory controllers, PHYs, media and display engines now share the compute tile. This removes an active die and keeps CPU memory traffic on one die. The cost is moving PHY and I/O-related circuitry onto 18A: drivers, receivers and analog circuits must still meet external voltage, loading and signal-integrity requirements, so their area does not shrink like dense digital logic. [1], [2] The biggest shrink comes from the NPU, which occupies 36.9% less area. NPU 5 consolidates the same total INT8 MAC count into half as many neural compute engines. Each of the three NCEs has a larger MAC array to make the complete NCE envelope 22.6% larger than an NPU 4 engine. Consolidation also halves the number of scratchpads and SHAVE DSPs, from 12 to 6. The MAC array handles matrix multiplication and convolution, while SHAVE executes vector and custom operations that fit the array poorly. [1], [2], [35] The paired floorplans identify each NCE envelope and its scratchpad, MAC, and SHAVE regions. Each measured MAC polygon is counted once per NCE in the area accounting below. The scratchpads store weights, activations, and intermediate results near the MAC arrays, allowing repeated use without fetching them again from DRAM. Halving their number delivers the largest measured area saving but leaves less local storage for the same total MAC count. Layers that no longer fit locally require smaller working tiles or more transfers of intermediate data. The benefit depends on keeping the enlarged arrays busy while managing that tighter storage budget. [36] NPU 5 also adds native FP8. Using half the operand width of FP16 reduces storage and transfer demand, helping workloads fit the smaller local memory budget. Lower precision and format-dependent range make scaling and model validation part of deployment. Hardware activation functions further reduce work that would otherwise occupy the programmable DSPs. [1], [2] Microsoft requires an NPU to deliver at least 40 TOPS for Copilot+ PCs. Both Lunar Lake and Panther Lake meet this threshold, but Panther Lake uses significantly less silicon. GPU tiles Panther Lake is Intel’s first product with Xe3, its latest GPU architecture. It offers two different GPU tiles: a smaller GT1 tile with 4 Xe3 cores on Intel 3 and a larger GT2 tile with 12 Xe3 cores on TSMC N3E. Panther Lake allows us to compare the same GPU architecture across both Intel 3 and TSMC N3E. Wildcat Lake adds a third Xe3 implementation on Intel 18A. A future newsletter will detail Xe3 and its implementation differences across all three process nodes. GT2 scales Xe3 to a different physical layout, with render slices arranged vertically instead of GT1’s horizontal arrangement. Slice placement sets the distances to shared cache banks and the D2D interface. Those wires consume area and add delay, so scaling the number of Xe cores also requires a new balance of cache placement, routing and timing. [1] What’s immediately obvious is that the GT2 tile on TSMC N3E has much smaller Xe cores than GT1. These block areas include logic, caches, and routing. An Xe core on the GT1 tile is ~69% larger than one on Lunar Lake, and ~55% larger than one on GT2. Intel 3 therefore uses substantially more area per Xe core. The block-area gap exceeds the measured logic and SRAM density gaps, bringing routing, timing targets, cell mix, and floorplan allocation into the comparison. The measured vector/matrix engine region is almost unchanged between Lunar Lake and Panther Lake’s GT2 tile. Xe3 retains eight 512-bit vector engines and eight 2048-bit XMX engines per core. Its gains also come from feeding those engines more effectively: more resident threads hide stalls, and variable register allocation lets shaders trade registers per thread against the number of threads kept active. [1] The shared L1/SLM capacity increased by 33% from 192 KiB to 256 KiB, while its area increased only 5%, raising effective density by 27%. L1 retains reused cache lines, while software-managed SLM lets a thread group share data locally. Both reduce traffic to more distant memory. Allocating more SLM per group can also limit how many groups reside on a core at once. [1], [37] The GT1 tile carries 4 MiB of L2 against 16 MiB on the GT2 tile. GT1 divides its L2 cache into four 1 MiB banks, while GT2 uses eight 2 MiB banks. Each bank contains 128 macros, but each N3E macro stores 16 KiB, twice the Intel 3 macro’s 8 KiB capacity. The N3E macro is only 54% larger while holding twice as many bits, giving it 30% higher density: ~23.7 Mbit/mm² versus 18.3 Mbit/mm². Including bank-level circuitry, the gap widens to ~16.9 Mbit/mm² on GT2 versus ~10.4 Mbit/mm² on GT1. GT2 gains density with its macros storing more bits per unit area, and those macros occupy more of each cache bank. Larger macros spread decoder and sense-amplifier overhead across more storage, while a more compact bank layout reduces the share spent on control and routing. The compromise is longer wordlines and bitlines that carry more capacitance. [34] I/O tile Panther Lake uses two I/O tile variants, both fabricated on TSMC N6. The smaller one provides 4 PCIe 5.0 and 8 PCIe 4.0 lanes and serves lower-tier systems as well as those without a discrete GPU, while the larger one adds 8 PCIe 5.0 lanes, bringing the total to 20 lanes, for discrete-GPU connectivity. Panther Lake SKUs with the larger 10- or 12-Xe GPUs use the smaller I/O tile. [38] The smaller I/O tile adds a PCIe 4.0 block and a Thunderbolt block to Lunar Lake’s I/O layout, providing four additional PCIe 4.0 lanes and another Thunderbolt 4 port. Its repeated N6 blocks retain nearly identical areas and layouts. Reusing these proven PHYs and controllers avoids porting and requalifying external interfaces on 18A, where faster digital logic offers less benefit to circuits constrained by the off-chip link. [38] SemiAnalysis’s teardown lab (STEEL) dives deep into the world’s advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. We’re hiring technical experts from system to transistor and everywhere in between. Check out our Careers page. Panther Lake offers scalability and modularity through its disaggregated packaging that partition compute, GPU, and I/O silicon into separate tiles allowing for a suite of tile configurations. This partitioning makes the package part of Intel’s node economics as it determines how much leading-edge wafer area each product consumes, which functions can remain on other processes, and how much configuration freedom Intel can offer from a shared set of tiles. Furthermore, fabricating the compute and GPU tiles separately confines the new 18A process to the compute tile and allows graphics and I/O to use other, more established, and more cost-effective processes. For Panther Lake, the GPU and I/O tiles are assembled alongside the compute tile on a passive silicon base using Foveros-S. Intel’s current technology brief lists a nominal 36 µm pitch for Foveros-S. Through-silicon vias (TSVs) in the base connect the fine wiring above to the larger package connections below. The functional tiles sit side by side on that passive base in a 2.5D configuration. [39] Our cross-section through the compute and GPU tiles shows the package’s wiring hierarchy. Microbumps connect each active tile to the passive silicon base; its fine redistribution layer (RDL) carries the short, dense tile-to-tile links. TSVs carry connections through the base to the package substrate, which fans them out to the much coarser motherboard solder joints. The base supplies interconnect, while computation remains in the active tiles above it. [39] At the compute-tile edge, the higher-magnification inset shows a local microbump spacing of approximately 25.24 µm and a feature width of 12.33 µm. These local spacings are finer than Intel’s nominal Foveros-S value. The X-ray fields further confirm tighter neighboring bumps, consistent across every die-to-die area found on each tile. Additional X-ray analysis is offered after the paywall. Putting the memory controller beside the CPU removes the D2D transfer that CPU memory requests required in Meteor Lake and Arrow Lake. This avoids the extra transmitter, receiver, and link traversal, saving interface energy and latency. Panther Lake’s separate GPU still crosses a D2D link to reach DRAM, so its larger local caches also help contain package traffic. [1], [40] Smaller dies are less likely to contain a random fatal defect, and screening them before assembly prevents one bad tile from consuming a complete package of good silicon. Reuse also spreads design and qualification work across more products. Against those gains, Intel pays for the passive base, D2D circuits, extra bonding and test steps, and losses during assembly. Cost per working product across the portfolio captures the combined effect of wafer yield, reuse, test, and assembly. [29] Wildcat Lake packaging Intel launched Core Series 3, formerly Wildcat Lake, on 16 April 2026 for value mobile and edge systems. Wildcat Lake keeps 18A but removes the passive base and combines more functions on one die to simplify the package. The two products therefore reveal two distinct ways to commercialize the same leading-edge process. [41] Wildcat Lake’s 18A die combines up to two Cougar Cove P-cores, four Darkmont LP E-cores, two Xe3 cores and a smaller NPU. A separate platform-controller die supplies I/O, connected through UCIe, Intel’s first processor implementation of the standard. Consolidating graphics remove a tile boundary and the passive base, reducing assembly complexity for a modest-bandwidth value product. It also ties CPU and graphics scaling to the same die, giving up Panther Lake’s ability to swap in a much larger GPU. [42], [43] In July 2021, Intel CEO Pat Gelsinger set out an ambitious process roadmap aimed at regaining performance leadership by 2025, later described as five nodes in four years. Five years and one CEO later, Intel’s comeback story is not as unambiguously positive as Pat may have hoped. [44], [45] Intel once set the pace for process technology, bringing high-k metal gate technology and FinFETs into volume production years ahead of the rest of the industry. Its 22 nm FinFET process reached consumers with Ivy Bridge in 2012. [46] Intel’s integrated device manufacturing (IDM) model allowed its architects and process engineers to co-optimize products and processes. Starting with Sandy Bridge, Intel dominated x86, while AMD struggled with Bulldozer. That lead faltered at 14 nm and broke at 10 nm. Intel targeted a massive 2.7× density increase, but the node arrived years late and required several revisions before it could support Intel’s full lineup. This delay forced Intel to stretch 14 nm across six generations, while TSMC moved ahead in process technology and AMD recovered in x86. By 2019, Intel was still shipping 14 nm across most of its product stack, with its 10 nm client ramp focused on Ice Lake mobile processors. Meanwhile, TSMC was shipping N7 and N7+, and AMD’s Zen 2 compute chiplets used N7 to raise core counts and improve efficiency. Intel’s process failures were central to its decline, but unsound business decisions furthered their downward slide. Product delays compounded product mistakes, pushing client, server, and FPGA roadmaps off schedule. Several attempts to enter AI (Nervana and Gaudi) and networking (Tofino) also failed to establish lasting businesses. Intel’s recovery has focused on consumer CPUs and advanced packaging. Tiger Lake, Alder Lake, Lunar Lake and now Panther Lake have restored Intel’s consumer roadmap. On the process side, Intel 4 shipped with Meteor Lake, Intel 3 with Granite Rapids and Sierra Forest, and Intel 18A with Panther Lake. Intel has also made advanced packaging part of its foundry offering. However, Intel is still playing catch-up in servers. Several Xeon generations arrived years late and trailed contemporary AMD and Arm server CPUs in performance, efficiency, and core count. The process roadmap is back, but Intel does not hold the same process-technology leadership position it held prior to 10 nm. The introduction of gate-all-around nanosheets and backside power delivery are two of the biggest changes to transistor integration in a decade. Intel took on both changes at once: 18A paired its first RibbonFET with PowerVia in Panther Lake. Panther Lake is a substantial manufacturing milestone. Our cross-sections show how RibbonFET and PowerVia reshape local contacts and wiring, while the floorplans show where architectural consolidation and process choices save area. A sustained competitive lead depends on product performance, cost, yield, and the next implementation. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page.. 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Jalen Brunson hosts ‘Saturday Night Live’ Season 52 premiere tonight
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