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Is SMIC N+3’s Metal Pitch Smaller than Intel 18A’s?

Almost four years ago, we published that SMIC had started shipping 7 nm (N+1) chips. Now, SMIC is shipping its third-generation 7 nm (N+3) process in Huawei’s Kirin 9030, with a minimum metal pitch of 32.5 nm, about 10% tighter than the 36 nm minimum metal pitch shipping in Intel’s latest Panther Lake CPUs on 18A. The headline is true, but incomplete cherry picked metric. N+3 reaches the density of TSMC N6 through aggressive DUV multi-patterning and design-technology co-optimization (DTCO), but it pays for that in complexity, efficiency and process control. We found this and more in our reverse engineering and teardown where we cover SMIC’s N3 process technology, Huawei’s packaging, memory, architecture, and more. SemiAnalysis has been building a state-of-the-art teardown lab in Oregon capable of analyzing the world’s most advanced and important chips over the last year and half. We have already generated revenue on advanced datacenter chip teardowns including our recent reverse engineering of a major TSMC customer’s COUPE CPO optical engine + EIC 3D stack. This is the first public report from the SemiAnalysis Teardown Engineering & Evaluation Lab, or STEEL for short. The lab is aggressively scaling up and out and we’re excited to announce it publicly. This is a bit of inconvenient timing for TechInsights as they are private equity owned and currently being sold while having enjoyed virtually no credible competition for decades. This has led to TechInsights underinvesting in CAPEX. SemiAnalysis exceeds TechInsights in revenue despite no venture or private equity ownership and being founded only 6 years ago. Because we have no external investors and are founder led, we move faster, build faster, and we can release client chip teardowns for free regularly, while focusing on datacenter for our major clients. Here’s the first public image from our lab, the HiSilicon Kirin 9030 Pro SoC: This report will detail our teardown of the Kirin 9030 and our findings on SMIC’s N+3 process, the most advanced in China. For comparison, we’ll show our teardown of the MediaTek Helio G99, made on TSMC N6. Through this comparison, we can look at the effect of export controls – SMIC N+3 and TSMC N6 are comparable nodes, but one is heavily export-controlled, the other free to use the West’s most advanced equipment. Here we see both China’s progress and constraints. SMIC N+3 reaches TSMC N6-class logic density, but it requires far more aggressive DUV multi-patterning, so it does not match N6 on process maturity or cost. The Kirin 9030 Pro performs similarly to three-year-old Android flagships, and trails far behind the current flagship SoCs from Apple, Qualcomm, MediaTek, and Samsung. The efficiency gap is even wider. Export controls have not stopped Huawei and SMIC from shipping advanced silicon, but they have forced a different path. Without EUV, SMIC is leaning harder on DUV multi-patterning, DTCO, and increasingly complex integration. The roadmap continues forward through tighter design rules and backside power, but each step adds cost and process risk. Huawei’s τ scaling and LogicFolding show another path: stacking active logic and recovering density through advanced packaging and system-technology co-optimization (STCO). To understand the Kirin 9030, we must first understand Huawei’s SoC history. HiSilicon is Huawei’s chip design arm, responsible for the Kirin smartphone SoCs, Kunpeng server CPUs, Ascend AI accelerators, and switch/router networking silicon. Before export controls, Huawei was TSMC’s largest customer – the only customer on TSMC’s first EUV node, N7+, and among the first on N5, alongside Apple. That ended in late 2020. Huawei switched to Qualcomm SoCs in its flagship smartphones, though export controls limited them to 4G-only variants. In late 2023, Huawei returned to in-house silicon with the Kirin 9000s, a successor to the Kirin 9000, fabricated on SMIC N+2 instead of TSMC N5. In the following years, they released the Kirin 9010 and 9020 on the same N+2 process. These chips used Huawei’s in-house TaiShan CPU cores and Maleoon GPU. We have not torn down a Kirin 9020 ourselves, so the predecessor die shot is from Kurnal. The die shots show how Huawei spent its silicon budget: which functional blocks are where, and how their areas compare to the predecessor. First, a quick guide to the major blocks on the die. The total die area is nearly identical, but the 9030 uses that area more aggressively. A denser process lets Huawei fit an extra middle CPU core, more GPU and NPU cores, and larger caches into the same footprint. In contrast, the Helio G99 is a much smaller, low-cost SoC, built for budget smartphones rather than a flagship device. While the Kirin 9030 is ~140 mm², the G99 is only ~29 mm², roughly one-fifth the area. The underlying TSMC process technology, however, is directly comparable as a baseline for analyzing SMIC’s. The Kirin 9030 is an evolutionary refresh, not a clean-sheet design. Its CPU, GPU and NPU cores carry over the 9020’s families, and the gains come from three levers: the SMIC N+2-to-N+3 process step, DTCO and floorplan work, and incremental microarchitecture. Area is where the first two show up, and the 9030 scales well here. Performance and efficiency are the harder test. Huawei’s design holds up better than its node would suggest, but the chip still trails, both because N+3 sits behind the leading-edge nodes and because its cores, while competent, remain a few generations behind the newest designs. The new prime core is an incremental update. The main changes are a 10% frequency increase from 2.5 GHz to 2.75 GHz and a doubling in the L2 cache from 1 MiB to 2 MiB. Despite the increased cache, the core size decreased by 7.6%. Excluding the private L2 cache, the core size decreased by 21%. This is a large reduction for an incremental node. Compared with the TaiShan New V120 core in the Kirin 9020, the Kirin 9030’s middle core is almost unchanged architecturally, yet each core shrinks by ~22%. Most of that comes from the move from N+2 to N+3, with layout likely accounting for the rest. Visually, the most noticeable change is the increase from 3 middle cores to 4. There is also a 20% increase in the shared L3 cache of the big cluster. This helps to improve multi-core performance without sacrificing much in terms of area. Even with each core shrinking, the big CPU cluster’s total area is essentially unchanged. The per-core savings went back into an additional middle core and larger caches. The tiny cores shrank less than the prime core (excluding its L2 cache) and less than the middle cores. This is likely because fixed overhead is a larger share on a small core. We cannot resolve any architectural changes from the die shot alone, but the per-clock and efficiency gains shown below point to more than pure process and layout scaling. The area reduction was offset by a doubling of the shared L2 cache from 2 MiB to 4 MiB, leaving the total tiny CPU cluster area slightly larger. Area is the easiest improvement to see from a die shot, but it is only one part of PPA (power, performance, area). For modern logic, power and performance matter just as much, and often more. Since Dennard scaling broke down in the mid-2000s, voltage and frequency have not scaled in step with transistor dimensions, so each node has had to fight harder for gains in performance and efficiency. The starkest comparison is not Kirin 9020 versus Kirin 9030 Pro. Apple’s efficiency cores run circles around Huawei’s prime core. Apple’s low-power core delivers 20% higher integer performance while drawing only 1 W, compared with 4.5 W for Huawei’s prime core. N+3 matches TSMC N6, but N6 is several generations old. Apple and Qualcomm build on N4 and N3P, which are denser and sit on a better voltage-frequency curve, giving them a larger transistor budget and more performance per watt. The 9030’s own cores did improve. The middle and tiny cores gained 17% and 14% in per-clock integer performance over the 9020, with floating-point flat on the middle core and up 11% on the tiny. The tiny core improves cleanly, with performance rising while power falls and efficiency increases by 45% in integer and 24% in floating point. The middle core is mixed: integer performance rises but power rises faster, cutting integer efficiency by 7%, while lower power lifts floating-point efficiency 16%. Per-clock gains at the same or lower frequency are microarchitectural, so the cores are tuned, not just shrunk. Both also failed to hold their rated maximum frequencies, pointing to thermal, power, or stability limits. Per clock, the middle core sits around Arm Cortex-A720 and the tiny core near the Cortex-A520; absolute performance trails because Huawei clocks them much lower. The prime core is roughly Cortex-X2 class per clock, a 2021 design. Apple’s 2020 M1 Firestorm core is still 35% higher per clock and 57% faster in absolute integer performance at a similar 4.5 W. The current leading edge is further ahead again: the Apple M5 P-core is 60% higher per clock and 2.7× faster, the Arm C1 Ultra 45% higher and 2× faster. Matching older high-end cores per clock is a genuine design achievement. What Huawei cannot match is the voltage-frequency curve and transistor budget of leading-edge nodes, which let Apple, Qualcomm and others spend more transistors in the same area on wider cores, larger caches and deeper buffers while running at lower voltage. Huawei’s LogicFolding roadmap is one answer, stacking active logic to recover density and shorten signal paths. We return to it later. The GPU compute units (CUs) changed more visibly than the CPU cores, moving to a more rectangular layout for both the arithmetic logic unit (ALU) clusters and the CU overall. Even with ray-tracing support added, a CU shrank ~28%. However, that shrink is offset by the increase from 4 to 6 CUs and the area outside the CUs grew 33%. Overall, the GPU cluster is larger by ~10%. The GPU is where Huawei makes its biggest gains. The Maleoon 935 is not competitive with current flagships, but it is a large step up from the 920 and reaches older-flagship territory. In 3DMark it is 70% faster in Wild Life Extreme (WLE) and 79% faster in Steel Nomad Light (SNL) than the 920; with 11% higher clocks and 50% more CUs, the ~67% theoretical uplift roughly matches WLE and is beaten by SNL. It edges ahead of the Snapdragon 8+ Gen 1 in WLE and SNL, and the Dimensity 9200 and Apple A16 in WLE, but stays far behind newer parts: the Snapdragon 8 Elite Gen 5 and Dimensity 9500 are ~2.4–2.6× faster in WLE and ~3.2× faster in SNL. The Maleoon 935 is Huawei’s first GPU with hardware-accelerated ray tracing; there it lands slightly ahead of the Exynos 2200, and on par with the Apple A16, with current flagships up to 3.7× faster. The Neural Processing Unit (NPU) saw the largest structural changes of any block, moving from a Lite and a Tiny core in the Kirin 9020 to a Lite and two Tiny cores in the Kirin 9030. Both core types also show significant layout changes. This is a reversal in Huawei’s NPU design. The Kirin 9000 5G, its last flagship chip on TSMC N5, used two Lite and one Tiny core. The series of SoCs on SMIC N+2 moved to one Lite and one Tiny core, likely for area savings. With the Kirin 9030, Huawei has shifted back toward a larger multi-core NPU cluster, but with the additional area going to a Tiny core rather than a Lite core. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Before diving into the process stack, the package and memory are worth separating from the SoC itself. The Pro variant of the Kirin 9030 carries 12 GB of Samsung DRAM, with two stacks of four dies each. The dies were identified as the K4L2E165YD, a 12 Gb LPDDR5X-9600 device fabricated on Samsung’s 1a node, the fourth generation of its 10 nm-class DRAM after 1x, 1y and 1z. 1a has shipped in volume since 2022, so this is current memory rather than older-node inventory. The 16 GB Pro Max variants we obtained were found with both CXMT and Samsung packages. The CXMT package is marked CXDD7JEDM, with two stacks of four dies, packaged in week 45 of 2025. The inferred die dimensions from X-ray computed tomography (CT) are consistent with a known density of ~0.3 Gib/mm² for the CXMT G4 process, roughly equivalent to other manufacturers’ 1z processes. The Kirin 9030 uses a typical integrated package-on-package (iPoP) stack: multiple DRAM dies in a memory package sit above an organic redistribution layer (RDL) interposer, which sits above the SoC and package substrate. The full package is then mounted to the printed circuit board (PCB) through ball-grid array (BGA) solder bumps. The memory package substrate is a thin bismaleimide-triazine (BT) laminate carrying the LPDDR5X stack. The organic RDL interposer over the SoC routes the PoP signals around the die and carries possible dummy thermal copper pillars. The package substrate, a thicker Ajinomoto Build-up Film (ABF) build-up over a BT core, fans the flip-chip bumps out to BGA pitch and embeds the power planes. The whole stack is organic. The only silicon is the SoC and the LPDDR5X dies; there is no silicon interposer. Keeping it all-organic brings the package’s coefficient of thermal expansion (CTE) close to the PCB’s, reducing board-level warpage, and avoids the cost of a silicon interposer the SoC’s bandwidth does not need. In an iPoP stack, the memory package connects to the organic RDL interposer through an array of solder bumps. Underfill fills the gap around those bumps, adding stiffness and protecting the joints from mechanical stress. The Pro and Pro Max variants differ here, which we cover behind the paywall. The die shot and architecture tell us how Huawei allocated its silicon budget. The process tells us what SMIC can manufacture. We use the Helio G99 as the process reference for TSMC N6. Both SMIC N+3 and TSMC N6 are evolutions of previous 7 nm-class nodes. We used targeted TEM cross-sections through logic and memory regions, imaged in both fin-cut and gate-cut directions. Each cross-section caption gives its horizontal field width (HFW), the real width of the imaged area. We start at the transistor fins, then move up through standard cells, local interconnect, and SRAM. SMIC has not overtaken Intel or TSMC. It uses aggressive DUV scaling and DTCO to reach N6-class density, but that density doesn’t translate into comparable performance and efficiency, for two reasons: the node gap to leading-edge nodes, and Huawei’s core designs. Fin Profile One of the most important knobs in a FinFET process is the fin profile: the shape of an individual fin and the channel where current passes from source to drain. The ideal fin is tall, narrow, and nearly vertical. A taller fin increases effective channel width, while a narrower fin improves electrostatic control by thinning the body the gate must control. Push either too far, and the process pays for it: weaker drive current, fragile fins, taper, footing and line-edge variation that hit yield and device variability. The Intel 22 nm, 14 nm, and 10 nm fin cross-sections show how FinFET nodes have improved over time. 22 nm fins were a first-generation structure, relatively short, wide and strongly tapered. The shape limits current density and reduces gate control uniformity across the height of the fin. At 14 nm and 10 nm, Intel pushed the fins taller and narrower while also making the sidewalls more vertical. Rather than shrinking the device, these changes increase the effective channel width per fin and improve electrostatic control. The trade-off is that taller fins at tighter pitches are much more difficult to manufacture. Now, let’s compare the Helio G99 on TSMC N6 with the Kirin 9030 on SMIC N+3. Both processes are in the same class, with fin pitch of 30-32 nm on N+3 and 34 nm in our N6 cross-section. The pitch for N6 is especially interesting as N7’s HD library is generally listed with a 33 nm fin pitch, and N6 did not shrink pitches directly. Its density gains came from DTCO instead of tighter pitches. The 34 nm pitch was stable across our sampled region and serves more as a comparison against the SMIC N+3 we have not investigated further. Pinning down N+3’s fin patterning scheme takes more than one core unit. The CPU cores show a dense ~32 nm pitch, with the pitch between N-P fin pairs alternating between 78 and 88 nm. Logic alone may be consistent with dual-pitch mandrels of 120 and 110 nm, but this is a complex and unusual approach. Combining the pitch from the the 8T SRAM, which has more complex repeat unit, with the CPU core sequence allows us to reverse engineer the patterning steps with more confidence. As both the logic and SRAM should share the same base grid, a single CD mandrel lithography pattern with 128 nm pitch undergoing SAQP produces a die-wide ~32 nm grid (128 nm/4), which supports the pitch sequencing seen in both logic and SRAM cells. In the sampled cross-sections, N+3 shows a taller, narrower, higher-aspect-ratio fin than N6. The measured fin aspect ratio is ~9.5:1 on N+3 versus 7.8:1 on N6. N+3 also shows less top rounding, with an estimated radius of ~2 nm, compared with 2.8 nm on N6. Even though the fin widths differ, the ratio of top rounding to fin width tells the same story, with N+3 at 0.37 and N6 at 0.44. In a geometric sense, lower is better; a perfectly rectangular fin would have no top-rounding penalty. These are single-digit-nanometer features measured from a handful of cuts, so treat the absolute numbers as approximate. The important result is the relative gap: N+3’s fins are consistently taller, narrower and less rounded than N6’s. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Standard Cell A standard cell is the basic building block of chip layout: a fixed-height row pairing one NMOS and one PMOS transistor that share a gate, tiled in a grid to build logic blocks. The key dimensions are contacted gate pitch (CGP), cell height (CH), fin count, and the lower-metal routing grid. To measure density, we use the Bohr metric: a weighted average of NAND2 gate area (60%) and scan flip-flop area (40%). This represents a realistic mix of combinational and sequential logic. This metric has its limitations, especially for complex cell layouts like TSMC’s FinFLEX, which alternates cells with different fin counts. Even so, it is the best metric for a pure process-level comparison. Another important measurement is the fin pitch; it refers to the distance between two fins of the same transistor. In a FinFET process, multiple fins are used in each transistor to increase the drive current and thus performance. TSMC N6 ships both a high-density (HD) library with 2 PMOS and 2 NMOS fins per cell, and a high-performance (HP) library with 3 of each. More fins under the shared gate mean more effective channel width. HP cells switch harder at the cost of area. Designers mix the two on a die, primarily spending HP cells on timing-critical paths, and matching their PPA targets. In the Cortex-A55 core of the Helio G99, we found a cell height of 240 nm for the HD cell. MediaTek has used HD cells in the G99 to minimize die size and thus cost. As an SoC for budget smartphones at ~$100, this is essential. By contrast, we found only one library in the Kirin 9030, with 2 NMOS and 2 PMOS fins. This suggests a narrower library strategy than TSMC N6, where both HD and HP libraries are widely used. This likely reflects the smaller customer base and the more constrained domestic design and electronic design automation (EDA) ecosystem. In all three CPU cores of the Kirin 9030, we found cell heights of 228 nm, 5% smaller than on N6. This is also a reduction of 9.5% over SMIC N+2’s cell height of 252 nm. SMIC N+3 and TSMC N6’s HD library both feature a CGP of 57 nm. For SMIC, this is a 9.5% shrink over N+2. In the past, CGP and cell height alone may have been enough to compare transistor density. Now, however, we must consider scaling boosters and DTCO as well. SMIC’s density gain does not come from EUV. It comes from using every available DTCO booster aggressively. First is fin depopulation: reducing the number of NMOS and PMOS fins in each cell. The first FinFET nodes started with 3 or 4 fins for each transistor. SMIC N+3 and TSMC N6 HD both use only 2 fins per transistor, trading drive strength for density. Next is contact over active gate (COAG). By landing the gate contact directly over the active gate, instead of out over the isolation region, the cell height drops. N+3 integrates COAG while N6 does not. Our N+3 gate-cut cross-sections indicate COAG, with the gate contact sitting over the active region, while N6 shows an off-gate contact. Last is single diffusion break (SDB). Diffusion breaks are inserted between cells in the same row to provide electrical isolation, but they also introduce local layout effects (LLE), layout-dependent shifts in electrical characteristics. In the past, a double diffusion break was used, consuming the space of two CGPs. SMIC N+3 and TSMC N6 instead use SDB, saving area but increasing LLE sensitivity. This must be controlled at the process level and accurately modeled in the process design kit (PDK) so that EDA tools can account for it. Overall, SMIC N+3 has a transistor density of 113.4 MTr/mm², slightly above TSMC N6 at 107.7 MTr/mm². Even without EUV, SMIC has achieved density beyond TSMC’s mature N6 node which utilizes EUV. Metal Stack The smallest critical dimension in the teardown is M0; SMIC N+3 uses a 32.5 nm local metal pitch. That is smaller than the 36 nm M0 pitch on Intel 18A in Panther Lake. However, this does not mean that SMIC has a better process than Intel 18A or TSMC N3P. M0 is a local intra-cell routing layer. Its usefulness depends on the full interconnect stack: M1 and M2 pitch, track count, via and line resistance, design rules, mask count, overlay control, and routing flexibility. The 32.5 nm M0 is consistent with self-aligned quadruple patterning (SAQP), whose four-population line-width loading we read coarsely as alternating widths of 21.5 to 24 nm; M1 and M2, at 38 and 40 nm, are consistent with self-aligned double patterning (SADP), a single A/B split. On TSMC N6, M0, M2, and M3 sit at a relaxed ~40 nm and are consistent with SADP-class double patterning, with no need for quadruple patterning. That said, we measure M2 for example at ~43 nm, likely inflated by sparse routing. We do not assign any specific layer to EUV from our cross-sections; the distinction we can draw is double versus quadruple patterning, not lithography wavelength. Transistor-level density in the front-end-of-line (FEOL) sets an upper bound, but the design is ultimately limited by what the interconnect stack can route. The lowest metals are the most important for standard-cell density, but the semi-global and global layers determine how usable that density is at the block and chip level. Two axes are commonly used for chip cross-sections: the fin-cut and the gate-cut. The micrograph above is a fin-cut and shows metals 0 through 3. This axis lets us see the even-numbered metals, with M0 right above the fins. There are two kinds of M0 lines. The first are the power rails; these are wide wires for the VDD and VSS running horizontally at the top and bottom edges of each standard cell. The wide wires measure 55 nm across, more than double the other M0 lines. Their width minimizes resistance and reduces IR drop. The second kind are intra-cell wires, short segments within the cell that connect terminals to M1. These have alternating widths between 21.5 and 24 nm. The M0 pitch is 32.5 nm, a 19% reduction versus N+2 and N6. At this pitch, DUV patterning requires more aggressive multi-patterning, increasing mask count, overlay sensitivity, process complexity and cost. M0 is below what a single DUV-defined spacer (SADP) can resolve, so SMIC cascades a second spacer step (SAQP). The cross-section reflects the cost: the M0 trenches are visibly more re-entrant (narrower at the bottom than the top) than M1 or M2 on the same chip and carry a bright barrier-rich foot where the trench meets the etch-stop layer. That shape is partly the intended damascene profile, as a slightly narrow bottom helps void-free copper fill, but its magnitude at M0 is driven by the tight pitch and the higher trench aspect ratio. Intel 18A supports an M0 pitch of 32 nm, although Panther Lake has only shipped with a looser 36 nm pitch. This is due to Intel’s heavy usage of HP libraries. Among leading-edge nodes, 18A has the loosest M0 pitches due to PowerVia. With power routing moving to the backside, congestion is reduced, and the entire front-side metal stack can be used for signal routing. M2 is the first true inter-cell routing layer. It runs horizontally like M0 but spans across multiple cells to carry block-level signals. The M2 pitch sets the cell’s track height – the number of M2 tracks that fit between the VDD and VSS rails, defining what the library calls a 6-track or 7.5-track cell. This layer is the most important, limiting the routing of entire blocks. SMIC N+3 features a 5.7-track cell. The M2 pitch is 40 nm, a 5% decrease over N+2 and the same as N6. This shrink keeps the pitch at the edge of what is possible with double patterning. Future nodes will need to increase the number of masks for M2 as reducing the number of tracks is much harder due to the limitations in routing. The micrograph above is in the perpendicular direction, the gate-cut, and shows metals 0 through 4. This allows us to see and measure the odd-numbered vertical metal layers. The M1 pitch is 38 nm, 9.5% less than N+2 and 33% less than N6. The M1-to-gate ratio matters because it sets local routing flexibility. N+2 and N+3 use a 3:2 ratio, while N6 uses a 1:1 ratio, explaining the huge differences in M1 pitch. The more M1 lines there are compared with the gates, the more flexibility there is for power and signal crossing within the cell. Routing flexibility enables more complex and better cells. Clean fractional ratios are also preferred as a grid is periodic and improves layouts. The 3:2 ratio gives SMIC more local routing flexibility than a strict 1:1 grid, but it also complicates layout and patterning. This is a DTCO choice, with SMIC increasing process complexity to recover density and routability without EUV. This 3:2 ratio is not very popular in the leading-edge nodes. TSMC has only used it on N7+, the N5 family, and the short-lived N3(B). They have switched back to a 1:1 ratio for N3E. Intel has only used it on the 10 nm/Intel 7 family, with Intel 4, 3 and 18A all using a 1:1 ratio. Samsung is the only one still using a 3:2 ratio at the leading edge, using it in the SF4 and SF3 families. It remains to be seen if SMIC will remain at a 3:2 ratio or move to a 1:1 ratio with its future nodes. The industry is still actively exploring these local-routing ratios. At VLSI 2026, imec will be presenting work on even higher ratios, including a 2:1 scheme that can reduce area by up to 14%. We will be covering the conference in a future newsletter article. Subscribe We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. The final local interconnect layer for N+3 is M3, with a pitch of 44 nm. The M3 pitch is the same as on N+2 and 10% larger than on N6. The semi-global layers carry the majority of block-level signal routing. They have a coarser pitch than the lower local layers. On leading-edge nodes, they are designed to sit at the limit of DUV single patterning. M4 through M11 pitches were found divided between 80–82 nm (M4–M6), 128 nm (M7–M10), and 148 nm (M11). Given limited sampling, it is possible these are divided further in dense routing areas. At the top are two giant metal layers, M12 and M13. These have kept the same pitches as N+2 at 1920 nm and 4600 nm respectively. While the lower layers’ pitches are generally fixed by the process and library, the upper layers vary much more in pitch and count, depending on the design. Even two smartphone SoCs on the same process can have wildly different metal stacks. The Helio G99 carries fewer routing layers, reaching coarse metal pitches of 850 nm by M9, while the larger and higher-performance Kirin 9030 keeps fine pitches until M11. SRAM At the leading edge, SRAM is much more difficult to scale than logic. TSMC’s latest nodes have seen little to no bitcell scaling, while logic still has more DTCO levers to pull. While looking for other logic libraries in the GPU compute units, we stumbled upon the SRAM. The most common type of SRAM has 6 transistors (6T), but this cell had 8 transistors (8T) instead. 8T SRAM adds two transistors to form a dedicated read port. Unlike a 6T cell, where reading disturbs the storage, the decoupled read port removes read-disturb, improving read stability and letting the cell be pushed harder for performance. At first glance, the cut looked like an unusual logic library, with each cell row having 3 fins of one polarity and 5 fins of another. The rows also alternated in orientation. Energy-dispersive X-ray spectroscopy (EDS) resolved our confusion. The cut had not landed on the GPU logic, but on the SRAM macro beside it. The unusual fin pattern was due to the SRAM library. We return to EDS in the process flow analysis behind the paywall. SRAM libraries are not like traditional logic libraries. Due to the unequal number of PMOS and NMOS transistors, they require specialized rules and layout libraries. They do not need the flexibility of logic libraries, so they are hyper-optimized for one purpose: dense, reliable memory. The SRAM cell we found is a 1:2:2-2:2 cell. This means there is 1 fin per pull-up (PU) PMOS transistor, and 2 fins per pull-down (PD) and pass-gate (PG) NMOS transistor. These 2 PU, 2 PD and 2 PG transistors would usually form a single 6T high-current cell (HCC). An 8T HCC adds a read-pull-down (RPD) and a read-pass-gate (RPG) NMOS transistor, each with two fins. We measured a cell height of 406 nm, which brings the bitcell size to 0.0463 µm². That is a theoretical peak density of 21.6 Mib/mm². We estimate that a 6T HCC would have a cell height of 292 nm and a size of 0.0337 µm². This is ~12% larger than a 6T HCC on Intel 3 and 4. We also estimate the 6T high-density cell (HDC) to have a cell height of 228 nm and a size of 0.0260 µm². This is coincidentally the same as the logic standard-cell height measured earlier. The estimate puts the cell near Samsung 7LPP/5LPP and slightly below TSMC N7/N6. That is a theoretical peak density of 38.5 Mib/mm². 6T HDC is arguably the most important cell as it is used for the largest caches in a chip, the L3 caches and system-level cache (SLC). Both the Kirin 9020 and 9030 have split the SLC into 4 banks to raise total SLC bandwidth. In the Kirin 9030, the SLC increased from 2 MiB to 3 MiB per bank. Correspondingly, the number of arrays within the bank also increased by 50%, from 16 to 24. Each array can store 128 KiB and forms an orderly pattern on the die shot. From the Kirin 9020 to the Kirin 9030, the area of a 128 KiB SLC array decreased from 0.0477 mm² to 0.0392 mm², an 18% shrink. The achieved density is 25.5 Mib/mm², 66% of the theoretical maximum. While the SLC was quite similar across both chips, the L3 has seen some major changes, particularly in terms of its layout. The total capacity also went up from 10 MiB to 12 MiB. Much like the SLC, the L3 is also split into 4 banks. In the Kirin 9020, an L3 bank consisted of 16× 128 KiB arrays and 16× 32 KiB arrays. However, an L3 bank in the Kirin 9030 instead consists of 48× 64 KiB arrays. In the Kirin 9020 L3, a 128 KiB array was 0.0513 mm² and a 32 KiB array was 0.0154 mm². The size of the 128 KiB array is different on the L3 and SLC as the assist circuitry for the two arrays differs depending on their purpose. In the Kirin 9030 L3, a 64 KiB array is 0.0210 mm². Although not a like-for-like comparison, normalized for capacity, it is 18% smaller than the 9020’s 128 KiB L3 array and 31% smaller than its 32 KiB L3 array. The achieved density is slightly lower than the SLC, at 23.8 Mib/mm², 62% of the theoretical maximum. Unlike the L3 and SLC, the prime cores’ private L2 cache uses a 2-bank design. As the prime cores’ L2 is latency-critical, it likely uses 6T HCC instead of 6T HDC. The 9020 has 16 arrays in each bank while the 9030 has 32. Each array has a capacity of 32 KiB. A 32 KiB array in the L2 shrank from 0.0171 mm² to 0.0142 mm², ~17% smaller. The density is 17.6 Mib/mm², ~59% of the theoretical maximum for 6T HCC. SRAM scaled well from N+2 to N+3, shrinking by ~19%, close to the theoretical logic shrink. The caveat is that N+2’s bitcells were unusually large, bigger than comparable 7 nm-class nodes, so part of the gain is catch-up rather than true scaling. With the insights from STEEL’s teardowns, we will be doing a deep dive into SRAM in a future newsletter article. Subscribe Everything above came out of a single STEEL teardown: die annotation, block-level area analysis and TEM cross-sections through logic and SRAM. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Future Roadmap The same cross-sections that pin down N+3 also show where SMIC can go next. Although N+3 is already close to the practical limits of DUV multi-patterning in several layers, SMIC still has a few scaling levers left. A theoretical N+4 would likely start with cell height. N+3 uses 5 M0 tracks between its power rails. Moving to 4 M0 tracks, as on SMIC N+2 and TSMC N6, could reduce cell height by roughly 15%. The routing grid is only one side of the shrink; the front end also must fit into the smaller cell. One possible FEOL lever is reducing the p-to-n isolation spacing from two diffusion grid units to one. Intel used this scaling booster on Intel 4, and TSMC did so on its N3 family. This path trades layout flexibility for density. Fewer M0 tracks reduce local routing resources, while tighter p-to-n spacing raises integration and design-rule difficulty. M2 is also constrained by the cell height shrink. For SMIC to maintain a ~5.7-track cell, M2 would need to move toward ~35 nm. That would move another layer into SAQP territory. SMIC could also reduce the CGP from 57 nm to 54 nm. Intel reached a similar CGP on Intel 10 nm/Intel 7 without EUV. The local interconnect is also tougher. If SMIC keeps the 3:2 M1-to-gate ratio, M1 would need to shrink to 36 nm and would likely require SAQP as well. If SMIC moves to a 1:1 ratio, M1 could relax to 54 nm, but it would give up routing flexibility. Under this theoretical path, we estimate that SMIC N+4 could reach a cell height of 198 nm and a CGP of 54 nm, implying a Bohr density of 137.8 MTr/mm², on par with TSMC N5 or Samsung SF4. However, the difficulty is cumulative. Each step is individually plausible, but together they make N+4 harder than the transition from N+2 to N+3. It will likely take longer, cost more, and carry less process margin. A theoretical N+5 would require a larger integration shift. One possible path is backside contacts (BSCon), moving power routing and source/drain contacts to the backside, which would reduce front-side routing pressure and enable another reduction in cell height. The front-side metal pitches could relax to reduce the process complexity. M0 would likely relax slightly to ~34 nm, and M2 and M4 pitches could relax further. CGP is unlikely to shrink much further. Even with EUV, 48 nm has been the practical limit for yield and process control. This approach would allow N+5’s cell height to fall to 170 nm and its CGP to 53 nm. This implies a Bohr density of 163.6 MTr/mm², on par with Intel 18A’s HP library. However, this would not make N+5 cost-competitive with the leading edge. It would reach a similar density through a much more expensive route. The integration difficulty rises sharply, with new process flows for backside alignment, wafer thinning, contact reveal, and backside metallization. Past this point, standard density and interconnect scaling become increasingly unattractive. That is where Huawei’s roadmap stops looking like a normal foundry roadmap and starts looking like a packaging roadmap. At ISCAS 2026, Huawei unveiled its tau (τ) scaling law, reframing process scaling in the time domain. τ is the time cost of data movement and processing: switching delays in transistors, RC signal propagation delays in circuits, compute, memory, and networking latency. Outside Huawei’s terminology, this is called system-technology co-optimization. This is Huawei’s answer to its lack of EUV lithography. Without EUV, planar density cannot keep pace with TSMC, Intel, or Samsung. If transistor density cannot shrink further, Huawei’s alternative is to shorten wires, reduce buffering, and stack logic vertically. “LogicFolding”, Huawei’s implementation of this new scaling idea, is, in practice, an aggressive 3D stacking approach. AMD V-Cache places SRAM above or below a CPU die. AMD’s MI350X places active interposer dies (AIDs) underneath accelerator and compute dies (XCDs), with the AIDs handling cache, IO interfaces, the network-on-chip (NoC) and embedded metal-insulator-metal (MIM) capacitors. With LogicFolding, parts of the same logic block are split across multiple active dies bonded face-to-face at ultra-fine pitch. This allows Huawei to shorten some critical paths and reduce buffer overhead, not merely add cache capacity or offload the IO and interconnect. Shortening wires is where the higher clocks come from. A large share of a modern core’s delay and energy budget goes into driving long interconnects and the repeater buffers along them. LogicFolding distributes a block’s critical-path gates across multiple stacked tiers bonded at a very fine pitch, so the bond interface behaves like an additional metal layer and the longest paths get shorter. That is how Huawei expects to recover frequency and efficiency it cannot get from the process alone. Huawei’s roadmap shows its intent. Prime core frequency is targeted to rise from 2.75 GHz in the Kirin 9030 to roughly 5 GHz by 2031, far beyond what planar scaling alone could deliver. Prime cores with 3.1 and 3.39 GHz clocks are being tested in its labs, although their power consumption is unknown. Beyond that, chips are in the design, simulation or pathfinding phase, meaning the frequencies are targets. However, the direction matters more: LogicFolding also helps with performance, not just density. The catch is that Huawei’s density claim is not directly comparable to foundry densities. A stacked design can report more transistors per package footprint by adding active layers, even if each patterned die remains well behind TSMC or Intel in front-end density. This is how Huawei can claim to reach foundry 14A-equivalent density by 2031. This is not a like-for-like foundry comparison, with Huawei using stacked logic and measuring density per package footprint. On a normalized Bohr-density basis, SMIC N+3 is ~114 MTr/mm², 38% less than Intel 18A’s HD library. Huawei’s 3D roadmap closes the gap by stacking active logic, reaching 215 MTr/mm² by 2030. In 2031, the roadmap density jumps to 295 MTr/mm², implying either a third active layer, partial EUV insertion or aggressive planar DUV scaling. Huawei’s methodology makes other foundries look much denser as well. Applying it to AMD’s MI450X with an N2 top die on an N3P base die yields a theoretical density of 460.2 MTr/mm² in 2026, compared with Huawei’s 295 MTr/mm² in 2031. This Kirin 9030 does not use LogicFolding, remaining in a conventional mobile SoC package. Instead, it forms the baseline for how far Huawei and SMIC can push planar scaling. Future teardowns of Kirin and Ascend chips will show both planar logic density and Huawei’s hybrid bonding solutions. Export controls changed China’s optimization problem rather than ending it. EUV restrictions raised the cost and complexity of leading-edge manufacturing without freezing it. SMIC reaches N6-class logic density through DUV immersion, SAQP and DTCO, while Huawei shifts more of the burden onto architecture, packaging and system-level integration. Future nodes will be tougher. N+3 still had room to tighten local metals and reduce cell height and CGP. Further scaling without EUV leaves fewer levers. More aggressive multi-patterning adds masks and overlay error. SMIC can keep pushing DUV, but each step will get more expensive and less forgiving. The design side is just as critical. Huawei had domestic EDA tools and flows before the Kirin 9030, with the Kirin 9000s, 9010 and 9020 making that clear. Huawei was able to ship multiple consumer SoCs on SMIC N+2 and N+3 while cut off from the Western EDA stack. US export controls restricted EDA tools for advanced chips in 2022 but did not target tools for more mature chips. In 2025, the US government briefly placed much broader restrictions on EDA software from Synopsys, Cadence, and others, before lifting them less than two months later as part of a trade deal tied to rare earths. Huawei has been unable to access those tools because it remains on a US trade blacklist. That forced Huawei, SMIC and Chinese academic institutions to build their own tools and flows. Researchers at Peking University recently announced a prototype EDA tool for Huawei’s LogicFolding architecture, which requires a new flow to handle the multilayer layout and floorplan. This is not the same as replacing the full Synopsys or Cadence stack, but it shows where domestic EDA is headed: toward tighter co-optimization between architecture, process and packaging. These advances are also diffusing into the Chinese ecosystem. SMIC is licensing its N+2 and N+3 processes to HLMC/Hua Hong at the government’s direction rather than by choice. If the same process learning feeds into Ascend accelerators for AI training and inference, the choke point shifts from one named fab to an ecosystem. Alibaba’s T-Head silicon arm and Cambricon, a Chinese AI chip designer that is expected to supply ByteDance, could also be major beneficiaries. Sanctions aimed at SMIC alone become less effective once the manufacturing knowledge has spread to other fabs and design houses. China is not closing the gap with Intel, Samsung and TSMC. The teardown shows the opposite in several places: no EUV, no backside power, higher process complexity, and visible trade-offs. But China is still advancing. If domestic chips become good enough for phones, inference, networking and security-sensitive workloads, they can matter strategically without matching TSMC at the leading edge. Behind the paywall, we show what else STEEL can do, with material and process flow analysis of SMIC N+3, and analysis of the Kirin 9030 package. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline, access the full Kirin 9030 and SMIC N+3 analysis or to commission a custom teardown, contact sales@semianalysis.com.

Jun 14 • 3:14 PM EDT • Technology • newsletter.semianalysis.com

The Compass Report: Relative declines seen in Arkansas metro economies

Although job numbers were up broadly, rising jobless rates, declines in manufacturing and construction jobs, and moderation in building activity resulted in lower grades among the four Arkansas metro economies...

Jun 14 • 12:37 PM EDT • Business • talkbusiness.net

NH's Business: New Hampshire's Manufacturing Sector

Fred Kocher sits down with Sabrina Costabile with the NH Manufacturing Alliance and David Richardson of Richardson Manufacturing to talk about spending in the NH manufacturing industry.

Jun 14 • 9:46 AM EDT • Business • wmur.com

The secret behind smoother, better-tasting protein shakes

A new whey protein manufacturing technique could make protein shakes taste better and feel smoother in the mouth. Researchers traced unwanted bitterness to concentrated minerals and found a way to remove them without sacrificing the improved texture.

Jun 14 • 8:00 AM EDT • Science • sciencedaily.com

50 of the oldest actors who are still working in Hollywood

Stacker manually curated a list of 50 of the oldest actors who are still working in the entertainment industry.

Jun 14 • 6:45 AM EDT • Entertainment • hpenews.com

50 of the oldest actors who are still working in Hollywood

Stacker manually curated a list of 50 of the oldest actors who are still working in the entertainment industry.

Jun 14 • 6:45 AM EDT • Entertainment • communitynewspapergroup.com

Manuel Neuer fit to join Germany in first World Cup match

Veteran goalkeeper Manuel Neuer is set to play in Germany's first match in this year's World Cup. He had retired from the national team in August 2024.

Jun 14 • 4:04 AM EDT • Sports • dw.com

Trump and Macron will meet over dinner at Versailles palace after G7 summit in France

President Donald Trump and French President Emmanuel Macron will meet over dinner at the Palace of Versailles after the upcoming G7 summit of leading industrialized nations in France

Jun 13 • 12:42 PM EDT • Politics • washingtonpost.com

Eaton moves one step closer to becoming a cleaner bet on the AI boom

Auto parts manufacturer Dana has agreed to combine with Eaton's Mobility business in a deal that values the unit at $5.1 billion.

Jun 11 • 4:05 PM EDT • Business • cnbc.com

Haiti has to change its World Cup jersey after being deemed too political

The jersey, by Colombian sportswear manufacturer Saeta, originally included a depiction of the final battle of the Haitian War of Independence in 1803 on its front.

Jun 11 • 11:00 AM EDT • Politics • pbs.org

Low-cost laptops with smartphone RAM in metal chassis: Intel reveals details of Project Firefly

The DRAM crisis is making entry-level laptops more and more expensive – or forcing manufacturers to use very old components. Intel Wildcat Lake and Project Firefly are set to change this and provide serious competition for the Apple MacBook Neo. Intel now reveals more details about Project Firefly.

Jun 10 • 4:53 PM EDT • Technology • notebookcheck.net

AI Can Build the Science, But Not the Scientist

Science doesn't just produce discoveries, it produces the minds capable of making them.

Jun 10 • 8:00 AM EDT • Science • psychologytoday.com

Business Restructuring Review Vol. 25 No. 3 May-June 2026

In This Issue Texas Bankruptcy Court Adopts Barnet Rule Requiring Foreign Debtor to Have U.S. Assets to Be Eligible for Chapter 15 Relief In In re Siu-Fung Ceramics Holdings Limited, No. 24-33299, 2026 WL 382424 (Bankr. S.D. Tex. Feb. 10, 2026), the court denied petitions for chapter 15 recognition of Hong Kong bankruptcy and liquidation proceedings commenced on behalf of an individual debtor and a group of companies that he owned or controlled. According to the court: (i) the corporate debtors' Hong Kong liquidation proceeding was not eligible for chapter 15 recognition because the attorney retainer upon which such relief was based was not funded until nine months after the chapter 15 petition date; and (ii) the individual debtor's Hong Kong bankruptcy case could not be recognized because the debtor's "center of main interests" on the chapter 15 petition date was not in Hong Kong, and he did not even maintain an "establishment" there. [read more …] Southern District of Texas Clarifies Post-Purdue Course for Consensual Third-Party Releases and Gatekeeping Provisions In In re Container Store Group, Inc., 676 B.R. 356 (S.D. Tex. 2026), appeal filed, No. 26-20166 (5th Cir. Apr. 14, 2026), cross appeal filed, No. 26-20166 (5th Cir. Apr. 24, 2026), the U.S. District Court for the Southern District of Texas addressed consensual third-party releases and gatekeeping provisions in the aftermath of the U.S. Supreme Court's ruling in Harrington v. Purdue Pharma L.P., 603 U.S. 204 (2024). Consistent with existing Fifth Circuit precedent, the court confirmed that, in appropriate circumstances, consent for third-party releases may be obtained through a creditor's failure to opt out of granting that consent. But, the court ruled, consent through an opt-out mechanism essentially can never be inferred for creditor classes that stand to receive no recovery under a chapter 11 plan and that are deemed to reject the plan by operation of applicable bankruptcy law. Instead, those classes must affirmatively opt in to any release. The court also narrowed and remanded the bankruptcy court's acceptance of a broad gatekeeping provision, ruling that such provisions must correspond to the restrictions established by Fifth Circuit precedent. [read more …] Delaware Bankruptcy Court: Initial Transferee Need Not Be Defendant in Fraudulent Transfer Avoidance and Recovery Litigation The Bankruptcy Code gives a bankruptcy trustee the power to avoid asset transfers that are either made with the intent to defraud creditors or that are "constructively" fraudulent because an insolvent debtor did not receive adequate value in exchange. The Bankruptcy Code also permits recovery of an avoided transfer from not only the initial recipient, but also from subsequent transferees. Courts disagree over whether a transfer must actually be avoided before the trustee can seek recovery from a subsequent transferee and whether the initial transferee must also be a defendant in the recovery litigation against a subsequent transferee. The U.S. Bankruptcy Court for the District of Delaware weighed in on this debate in Phillips v. SS Associates LLC (In re ONH AFC CS Investors, LLC), No. 23-10931 (CTG), 2026 WL 312892 (Bankr. D. Del. Feb. 4, 2026). The court adopted the majority view, ruling that the initial transferee need not be a defendant in avoidance and recovery litigation against a subsequent transferee, but that the trustee must establish the elements necessary to avoid the initial transfer as part of the recovery litigation. [read more …] New York Bankruptcy Court Weighs In on Adequate Assurance of Future Performance under Assigned Leases and Chapter 11 Plan Exculpation Provisions In order to assume and assign an executory contract or unexpired lease, a bankruptcy trustee must cure most defaults under the agreement and provide "adequate assurance" of the assignee's future performance. However, the Bankruptcy Code provides no guidance as to the meaning of "adequate assurance" other than with respect to shopping center leases. In In re Broadway Realty I Co. LLC, No. 25-11050, 2026 WL 147505 (Bankr. S.D.N.Y. Jan. 19, 2026), the U.S. Bankruptcy Court for the Southern District of New York examined this issue in connection with a proposed assignment of thousands of residential leases as part of a free-and-clear sale of debtors' properties. The court held that "adequate assurance" does not mean a guarantee of the assignee's future performance, but merely demonstration that the assignee has the ability to satisfy the underlying obligations. The bankruptcy court also ruled that an exculpation provision in the debtors' chapter 11 plan exonerating non-estate fiduciaries from liability for actions taken in connection with the chapter 11 case was unobjectionable, provided it was limited in scope to postpetition conduct and actions taken in connection with implementation of the plan after its effective date. [read more …] Newsworthy Corinne Ball (New York) (Hall of Fame), Bruce Bennett (Los Angeles), Carl E. Black (Cleveland), Jeffrey B. Ellman (Atlanta), Brad B. Erens (Chicago), Gregory M. Gordon (Dallas), Heather Lennox (Cleveland/New York), Joshua M. Mester (Los Angeles), and Kevyn D. Orr (Washington) were included in the 2026 edition of Lawdragon 500 Leading Bankruptcy and Restructuring Lawyers. The Daily Business Review selected Isel M. Perez (Miami) as an "On the Rise" winner for the Florida Legal Awards. The Florida Legal Awards annually recognize those who have made significant contributions to the legal industry in Florida. Dan T. Moss (Washington/New York) was inducted as a Fellow in the 37th Class of the American College of Bankruptcy at its Annual Meeting in March 2026 in San Antonio, Texas. Christine Borries (Munich) was ranked in the practice area Restructuring/Insolvency in the 2026 edition of Chambers Germany. The 2027 edition of The Best Lawyers in Singapore™ recognized Sushma Jobanputra (Singapore) in the practice area Insolvency & Reorganization. The restructuring transaction involving Eissmann Automotive North America, Inc. received the "2025 Turnaround of the Year (Large Company)" at the Turnaround Management Association (Detroit) Annual Awards Reception. T. Daniel Reynolds (Cleveland) and Nick Buchta (Cleveland) represented subsidiaries of Eissmann Group Automotive in connection with the parent company's German insolvency proceedings. Roger Dobson (Sydney) is among 40 Jones Day lawyers recognized by The Best Lawyers in Australia 2027 for his contributions in Banking and Finance Law; Distressed Investing & Debt Trading; Insolvency and Reorganization Law; Litigation. An article written by Corinne Ball (New York) titled "Ard Finance—A Global Enterprise Combining an LME With a Foreign Insolvency Proceeding and Chapter 15" was published in the April 21, 2026, edition of the New York Law Journal. An article written by Alex Sapp (New York) titled "Recent Developments in Section 510—Subordination" was published in the 2025 edition of the Norton Annual Survey on Bankruptcy Law. An article written by Brad B. Erens (Chicago) titled "New York Bankruptcy Court Approves Insider DIP Litigation Financing" was published on April 6, 2026, by Lexis Practical Guidance. An article written by Corinne Ball (New York), Dan T. Moss (Washington/New York), David S. Torborg (Washington), and Isel M. Perez (Miami) titled "New York District Court Affirms Narrow Scope of 'Public Policy Exception' in Chapter 15 Cases" was published on April 6, 2026, by Lexis Practical Guidance. An article written by Jeffrey B. Ellman (Atlanta) titled "Statutory Cap on Lease Rejection Damage Claims in Bankruptcy Applies to Solvent Debtors" was published on April 6, 2026, by Lexis Practical Guidance. An article written by Trisha L. Mowbray (Real Estate; Chicago) and Ryan Sims (Washington) titled "Chapter 11 Plan that Abridged Non-Debtor Lessee's Rights to Remain in Possession After Rejection Unconfirmable as Having Been Proposed in Bad Faith" was published on April 6, 2026, by Lexis Practical Guidance. Lawyer Spotlight: Ben Rosenblum Ben Rosenblum, a partner in the New York Office, represents debtors, creditors, and other parties in out-of-court restructurings and court-supervised proceedings, including chapter 11 cases, municipal bankruptcies, international insolvency matters, and stockbroker liquidations. His experience spans industries such as manufacturing, shipping, mining, aviation, energy, real estate, and telecommunications. Ben's notable debtor representations include Peabody Energy, the City of Detroit, Chrysler LLC, Spansion Japan, and Dana Corporation. Significant creditor representations include General Maritime Corporation, Calpine Corporation, American Home Mortgage, and Murray Energy. He currently represents creditors in Puerto Rico's restructuring. He also has extensive experience advising financial institutions on bankruptcy law as applied to derivatives.

Jun 10 • 8:00 AM EDT • Business • jonesday.com

Should We Change How We Talk About Mental Health and Neurodivergence?

Why do we continue to conflate terms describing general mental health and those with clinical needs?

Jun 10 • 8:00 AM EDT • Health • psychologytoday.com

Eye health company plans permanent layoffs at St. Louis-area manufacturing facility

Jun 9 • 9:39 AM EDT • Health • ksdk.com

Rahm Emanuel's uphill climb in New Hampshire tests a 2028 presidential bid

Rahm Emanuel has been making moves in New Hampshire, hinting at a possible return to Washington politics

Jun 9 • 5:09 AM EDT • Politics • washingtonpost.com

Rahm Emanuel's uphill climb in New Hampshire tests a 2028 presidential bid

Rahm Emanuel has been making moves in New Hampshire, hinting at a possible return to Washington politics.

Jun 9 • 5:03 AM EDT • Politics • news4jax.com

Manu Ginobili: What a game! Very stressed out!

Manu Ginobili: What a game! Very stressed out!

Jun 8 • 11:46 PM EDT • Sports • sports.yahoo.com

Rahm Emanuel bikes N.H. as he mulls 2028 presidential primary

“Look, I’m not into a politics of retribution, contrary to my image,” Emanuel said. “But I am into totally airing out all of this corruption.”

Jun 8 • 6:55 PM EDT • Politics • bostonglobe.com

We can create the future of science right now

Paul Litvak is the founder and Executive Director of the Robyn Dawes Institute and a Visiting Scholar at UC Berkeley. He has a PhD in Behavioral Decision Research from Carnegie Mellon where he studied emotions and the sunk cost bias. Over 15 years in industry, he solved a wide range of challenging technical problems. At Meta he created models optimizing the ad review process. At Google he ran experiments to measure social influence. At Airbnb, he was a product manager leading machine learning teams optimizing search ranking and price suggestions. He also co-founded and led product at Rhythmic Health, a venture-backed biosensing startup, creating an accurate low cost system using a color changing strip and a smart phone to measure salivary lactate. The bottleneck At this point, it is uncontroversial to say that science needs to stop using the PDF article as the unit of knowledge and currency. The unbearable slowness of scientific publishing, the profit motive and margins: I’m not saying anything new. The PDF also sucks because it’s hard to extract structured information, which makes it hard to do evidence synthesis. As a result, we do much less evidence synthesis than is needed. And evidence synthesis ultimately undergirds most policy and medical decision-making. I can see second-by-second real-time odds for any sporting or newsworthy event, but a school board can’t see the best evidence on whether their 8th graders should be taught algebra. As a society, we don’t treat this as an important problem. Again, not controversial. Not only is the problem well understood, but the solution has already been laid out. What we need is AI-assisted living evidence synthesis - (1) an open knowledge graph of atomic claims, (2) claims linked to evidence, (3) assessment and synthesis of each piece of evidence, and (4) continuous updating with new data. What few realize (yet) is that the technical capacity to build this vision for a significant portion of science already exists. Not only that, scientists and startup teams are already building many of these components. I know this because I’ve been surveying the space and talking to many of the builders. There are some missing pieces: for example, evaluations of how well some of the components work. But at this point, most of what’s missing is a fully end-to-end working integration of all of these parts. In the rest of this essay, I’m going to lay out all the parts of a working living evidence layer for science and who is working on them, and propose concrete next steps for building this system. What’s now possible The diagram above outlines the components of a living evidence synthesis platform, including some of the teams working on each component1. Scientific PDFs are processed into claims with associated evidence. The evidence is subjected to a forensic audit, methodological evaluation and robustness and reproducibility checks. Finally it’s given a weight in a continuously updating synthesis. What follows is a description and status of each component and a few of the teams working on them. Document understanding The first thing you need to be able to do is turn an article into structured data. Mostly that means parsing PDFs. There are often multicolumn layouts that confuse non-specialized PDF to text processing libraries. For scientific papers, there is the added complexity of parsing formulas and tables and figures. This is a really hot area - there are startups offering APIs, and it seems like a new open source package gets posted to Github every few weeks. What follows isn’t exhaustive. A package called GROBID was the state of the art for a while, they didn’t update their package for nearly two years until very recently. In the meantime reducto.ai released an AI powered PDF extraction API, PaddleOCR became popular, IBM released a model called Docling, and both Mistral and Gemini created models and libraries. I also know of at least one other well-funded psychology research group working on a paper parser. By contrast, there are few open evals in this space, with no extensive evals for complex table comprehension in particular. Nonetheless, I’m confident this will be a solved problem soon, given the combination of LLM advances and developer interest. Hypothesis level extraction There has been increasing interest in comprehending the extracted text of papers and linking information to evidence for each hypothesis. A lot of work has already been done. Trialstreamer (Marshall et al. 2020) and RobotReviewer LIVE (Marshall et al. 2023) demonstrated automated extraction of trial population, intervention, and outcome at scale on clinical RCTs. PaperQA2 (Skarlinski et al. 2024) and Ai2 ScholarQA (2024) extended this to retrieval-augmented question answering with citation grounding. Elicit, Consensus, and SciSpace operationalized claim-level extraction for end users. OpenEval (Booeshaghi et al. 2026) is the most recent and most ambitious: 1.96 million atomic claims extracted from 16,087 eLife manuscripts using Claude Sonnet 4.5, grouped into ~299,000 results, with LLM evaluations showing 81% agreement with human peer review on a 2,487-paper subset. None of these solutions link claims to test-statistics, as you would need to evaluate randomized controlled trials. This is why I built the evidence.guide API - to extract hypotheses and associated test statistics from behavioral science papers. The best public eval of this kind of extraction I’m aware of comes from the recent SCORE project - they had humans code thousands of psychology papers to extract their claims by hand. It would be extremely helpful to the world if all scientific PDFs were available as structured open data. I’ve been working to make this happen, both directly at Berkeley and through coordination with large entities I can’t yet speak of; as hard as it is to do, I think it’s possible2. Forensic audit A lot of work has been done on forensic audit, but some gaps remain. Of course, for biology papers that rely on images for evidence, there are a variety of tools (notably Proofig and ImageTwin) to spot anomalies. These are still well short of what sleuths like Elizabeth Bik can do on her own, but these tools are constant companions among fraud analysts. There’s someone working on auditing Excel files for anomalies, and a number of teams are automating numerical checks like GRIM and SPRITE, including Scrutiny project, the INSPECT-SR team as well as statcheck. The regcheck team is building a way to use AI to compare preregistrations to analyses in papers, to ensure there aren’t significant deviations. Nonetheless, there are many other kinds of anomalies to screen for, both public and less publicly known. And there are no formal evals for anomaly detection that I’m aware of. Still, there’s a lot to draw from in this space and I’m pretty certain we will be able to scan papers for most kinds of obvious anomalies in the near future. Methodological review This area has been white hot, though I fear for many of the startups in this space, because this capability may become commoditized. There are at least six different AI peer review companies, including Refine.ink, Reviewer3, ReviewerZero.ai, Q.E.D. Science, Paper Wizard, and Isitcredible. Coarse (a pun on refine) was also recently created as an open source alternative. These systems provide qualitative feedback on the content of papers, spotting methodological weaknesses and mathematical errors. They seem to work pretty well, and many academics report bitterly that they exceed the average quality of typical peer reviewers. But there are few evals here either. What evals exist so far involve using LLM-as-judge (circularity problems abound) or comparing against human reviews of questionable quality. What you’d ideally want is an eval that measures capturing known errors in papers3. Reproducibility and robustness Another active area has been using AI agents to automate computational reproducibility4 and robustness5 checks in papers that report numerical results. For more recent papers where data and code are available, AI agents can see whether they can re-run the analyses and produce the numbers reported in the published paper. In addition to a handful of individual academics who have been experimenting using Claude Code for this, the Institute for Replication is a leading group working on building an end to end system. The evals related to this problem are the most mature, with CORE-Bench (Siegel, Kapoor, Narayanan 2024) and PaperBench (OpenAI 2025) available to benchmark agents on this task. There is also work on getting AI agents to test alternative ways of analyzing the data to ensure the results are robust to small analytic design choices. Synthesis This is the most underdeveloped area where significant investment is required. Although some automated evidence synthesis systems exist — for example, otto-sr is building an AI agent to write systematic reviews — none of these incorporate the full range of paper level signals to weight evidence appropriately. Nor is there anything like an eval or a gold standard for a good systematic review. Arguably Cochrane reviews are the closest we have to gold standard human systematic reviews, though I’ve heard academics in the know complain about their uneven quality. A key question for a synthesis platform is how to weight anomalies and methodological issues in assessing the quality of a piece of evidence. This is an unsolved problem and one I’m very keen to work on. Continuous updating There are many pieces of basic infrastructure available for monitoring for new research and initiating updates. OpenAlex is the current open citation graph. Retraction Watch integrated into Crossref in October 2023. Scite tracks how citations support, contrast, or mention prior claims. The Living Evidence Network demonstrated continuous-update workflows in clinical guidelines. Engineering this is a relatively straightforward task. When you look over this technical architecture and all the progress being made, it’s hard not to be optimistic that a living guide to scientific evidence will be built. The stakeholders are ready The social infrastructure for this is starting to coalesce — it’s not just a pie in the sky academic exercise to imagine this coming into existence. Institutions like the Center for Open Science, the Institute for Replication, the INSPECT-SR, the Living Evidence Network and more are all working on scaling work to improve research quality. Funders are also aligned. The Sloan Foundation has funded living evidence work through COS. Coefficient Giving supports the Institute for Replication and COS. The Astera Institute and the Institute for Progress have shown interest in this space. NIH has established an Office for Replication and Reproducibility. Although there are (very unfortunately) serious headwinds in science funding generally, there is an active group of funders interested in metascience. A brief word about what I’ve been doing at RDI. First, as a Visiting Scholar at Berkeley I’ve been actively figuring out how a non-profit and a public university can conduct and make public the results of large-scale academic article data mining. With some of the money I raised from donors, I commissioned a legal analysis of recent case law and publisher text data mining (TDM) agreements in order to understand whether a massive open data mining of academic articles is possible (with caveats, it is). I’ve also been working to bring together stakeholders in this space, and identify gaps. I’ve also been doing some software development in this space, with more to come. A pilot proposal The assumption undergirding all of this is that an AI, given all this information, would make the right judgment about a scientific claim with lots of conflicting evidence, weighing all the factors appropriately. That’s the hypothesis we need to test. Randomized control trial research is the best place to focus on first. RCTs are used to make many of the important decisions in society - from medical trials to public policy changes. And they use a relatively uniform set of inferential statistics with lots of known and available diagnostics. Behavioral science experiments, within the broader realm of RCTs, should be first used as a testbed whose results can be generalized. Because behavioral science is at the vanguard of open science practices, replications abound (there are thousands of them) to serve as ground truth training data. Key Hypothesis Therefore the pilot would test, in behavioral RCTs that have been replicated, whether the quality of evidence for a claim can be used to accurately predict whether that claim will replicate. Secondary Hypotheses Compared to claims that replicated, non-replicated claims demonstrate a greater share of forensic anomalies in their source literatures. Hypothesis level claim and statistic extraction is accurate enough to scale living evidence without onerous human review costs. Replication prediction is more accurate than prediction markets6 or journal prestige. If all the different quality signals we gather do accurately predict which studies will replicate, then we can use that model to score evidence to power the living evidence layer. Why this is informative regardless of outcome If the pilot succeeds, the architecture extends to medical RCTs (where Living Evidence already operates and integration is mostly about claim representation), then to slices of basic biology with stable replication structure. If it fails, the field learns which quality signals are load-bearing and which ones metascience has oversold. Either result is a contribution to knowing what the literature supports. Implications for funders Because this burgeoning ecosystem of builders already exists, a well-informed philanthropic or government funder could play a crucial catalyzing role in bringing this future about. They could play at least three roles: creating open structured datasets, publishing open benchmarks and incentivizing the solving of key technical challenges. First, open archives of papers that the government maintains, like PubMed, could be turned into structured data amenable to large scale metascience and claim aggregation. I know the US government already has an interest in doing this, though some key open questions remain unanswered. How do you determine the best models and systems for accurately extracting information from papers? How can you establish a robust way to allow researchers to flag errors and correct them? And finally, how do you create a legal regime in working with publishers to maximize the scope of available papers? For the latter, a university or a private philanthropy may be better positioned to make structured data publicly available under journal subscription terms or fair use. Philanthropists or government funders could also coordinate to create or commission benchmarks that evaluate whether important problems have been solved. For example, an open benchmark for claim extraction from a range of different scientific article types would be extremely helpful. Ensuring the underlying data are accurate is vital for creating these evaluations. I’ve discussed opportunistically using various human-created datasets for this purpose, but a consistent problem is that errors in human data make it difficult for them to serve as a gold standard. Finally, with structured data and benchmarks available, the government or private philanthropy could use them to incentivize groups to develop machine learning systems that meet these benchmarks. Prizes are one potentially valuable tool for this. For example, you could establish a prize for a system that accurately updates a living meta-analysis for a small set of claims. Prizes are particularly useful as signals of problem importance, and can help create vibrant ecosystems of public and private research—see, for example the role the government played in kickstarting the current work on nuclear fusion. Conclusion The drawbacks of the current scientific publishing system are known. Scientists agree, metascientists agree, philanthropists agree: the published PDF plus citation graph isn’t the right substrate for maintaining a representation of the evidence base in science. The pieces needed to build the alternative either already exist or are rapidly taking shape. The community is forming around exactly this problem, with concrete partnerships and shared infrastructure. A pilot should start on behavioral science RCTs because that’s the slice of empirical science most amenable to legibility, where replication ground truth is richest, and where the failure modes are best documented. What’s been missing is the galvanizing mission to assemble these pieces into something that works. That’s what I’m proposing to build. *** 1 I have a broader field map that I’ll release publicly soon. This is me, building in public! 2 If this is something that you are excited about, please reach out and talk to me. 3 More on this very soon too! 4 This tests whether, given the code and the data, you can get the same statistics as reported in the published paper. 5 This tests whether the results are the same as a paper’s given alternative analytical decisions in conducting the analysis (like outlier omission). Closely related is the idea of a “multiverse” where you come up with many different ways of answering the same underlying research question with the same data, and test whether the results hold in all those alternative methods. There’s been work on the latter as well. 6 Some of the replications, e.g. those from the SCORE project, had paired the experiments with forecasts from prediction markets. So we get to look at this for free.

Jun 8 • 4:44 PM EDT • Science • goodscience.substack.com

Apple Brings AI Tab Organization and AI-Generated Extensions to Safari

Apple today unveiled a raft of Safari upgrades powered by Apple Intelligence, including automatic tab organization, AI-generated custom extensions, and new privacy-first browsing tools. The centerpiece feature is automatic tab organization, which uses Apple Intelligence to group a user's open tabs into relevant topics without any manual intervention. If someone is planning a weekend trip, for example, Safari can pull all of their travel-related tabs into a single topic.

Jun 8 • 4:18 PM EDT • Technology • macrumors.com

Steve Rao: The AI revolution must include Main Street

Whether it is a family-owned manufacturer exploring automation, a local retailer adopting AI-powered marketing tools or a startup building the next generation of innovative products, small businesses will be among the primary beneficiaries — and users — of AI.

Jun 8 • 4:02 PM EDT • Business • wral.com

GOP Sen. Dan Sullivan is raising alarms about an 11th hour challenger: Dan J. Sullivan

Jun 7 • 10:11 AM EDT • Politics • cnn.com

Best Look at Foldable iPhone Design Revealed, May Only Come in White

Sonny Dickson today shared detailed images of a foldable iPhone dummy unit with what appears to be a finalized design, providing the best look yet at the device's look, with the suggestion that the device may only be available in white. Dummy units are non-functional units intended primarily for display purposes and accessory manufacturers, who need a high level of physical accuracy to mass produce cases and other accessories ahead of a device's announcement.

Jun 7 • 6:28 AM EDT • Technology • macrumors.com

Another Arsenal forward scores in pre-World Cup friendly

Leandro Trossard helped Belgium to extend their unbeaten run by scoring the opening goal in their friendly win over Tunisia on Saturday, their final pre-World Cup fixture.Photo by Emmanuele Ciancaglin...

Jun 7 • 6:05 AM EDT • Sports • sports.yahoo.com

Why the Best Business Ideas Come From the Messiest Workflows

The best business opportunities come from identifying broken workflow systems that customers are struggling to patch together manually.

Jun 6 • 2:00 PM EDT • Business • inc.com

Create Amazon-Ready Business Books with This AI Book Creator for a One-Time $48.99

From idea to manuscript quickly.

Jun 6 • 12:00 PM EDT • Business • entrepreneur.com

Guruzeta, credit for an up-and-down season

Although things did not go well for Athletic as a team, Guruzeta delivered with 17 goals and a personal best.📸 Juan Manuel Serrano Arce - 2026 Getty ImagesIt has not been a good year for Athletic c...

Jun 6 • 4:33 AM EDT • Sports • sports.yahoo.com

Business Alum Joins Hearing Aid Manufacturer as Supply Chain Director

Cal State Fullerton College of Business and Economics alum Garland Wong ’20 (MBA) is now a director of supply chain at Audien Hearing, a hearing aid manufacturer. In this space, being grounded in data is essential, but so is allowing room for testing and exploration. Thanks to CSUF’s MBA program, Wong can rise to the […]

Jun 5 • 3:00 PM EDT • Business • news.fullerton.edu

China's solar majors charge into batteries as panel sales falter

China's major solar panel manufacturers are ramping up higher-margin battery exports to boost revenue ​as growth in photovoltaic (PV) sales slows, betting on rising global demand for renewable energy storage to cut reliance on fossil ‌fuels.

Jun 4 • 7:32 PM EDT • Business • reuters.com

LiveOne Expands Partnership With AT&T, Cisco For Connected-Car Entertainment.

LiveOne has announced an expanded collaboration with AT&T and Cisco aimed at supporting next-generation in-vehicle entertainment through AT&T’s Connected Car platform. Under the agreement, automotive manufacturers will be able to

Jun 4 • 2:42 AM EDT • Entertainment • insideradio.com

Reps. Mejia, Cleaver Demand Trump Administration Automatically Refund Illegal Tariffs Collected from U.S. Small Businesses and Provide Refunds to American Consumers

Reps. Mejia, Cleaver Demand Trump Administration Automatically Refund Illegal Tariffs Collected from U.S. Small Businesses and Provide Refunds to American Consumers Washington D.C. – Today, U.S. Representatives Analilia Mejia (D-NJ) and Emanuel Cleaver, II (D-MO) led dozens of lawmakers in demanding the Trump administration make consumers eligible for tariff refunds and implement an automatic refund[...]

Jun 3 • 11:21 AM EDT • Business • insidernj.com

Illinois hospitals urge Pritzker to quickly sign bill before Eli Lilly cuts off drug discounts

Illinois’ hospital association contends the move by Eli, which has also been threatened by the other large, global GLP-1 manufacturer, Novo Nordisk, is simply an unnecessary roadblock.

Jun 3 • 6:15 AM EDT • Health • chicagobusiness.com

'Seven Days in June': Protests nationwide this week rally against Trump $1 trillion cuts to health care and hospitals

Lin-Manuel Miranda and Noah Wyle are among the celebrities supporting the events, which oppose recent cuts to Medicare, Medicaid, and more.

Jun 2 • 3:15 PM EDT • Health • fastcompany.com

Cable manufacturer eyes $100M expansion at Indianapolis facility

Milan-based Prysmian Cables & Systems USA LLC plans to build a roughly 143,500-square-foot addition to its existing 52,000-square-foot facility along Rockville Road on the western edge of Marion County.

Jun 2 • 12:07 PM EDT • Business • ibj.com

Industry-Specific Survey Shows Shift in Small Business Optimism

The NFIB Research Center recently released an industry-specific quarterly Small Business Economic Trends survey.

Jun 2 • 4:48 AM EDT • Business • businessjournaldaily.com

Towards a responsive health system and equitable access to quality RMNCAH services

Indonesia’s vast geography and sociocultural diversity shape the delivery of reproductive, maternal, newborn, child and adolescent health (RMNCAH) services in ways that are both enabling and challenging. Across provinces, significant variation has been observed in how services are planned, resourced, and delivered. These variations in service standards and quality are felt daily in the lives of women, newborns and adolescents. Despite these challenges, progress is visible. National estimates show a drop in maternal mortality ratio, from 331 to 140 per 100 000 live births since 2000, signaling improvements in care quality and access. Fertility has stabilised and contraceptive use has grown, yet unmet reproductive health needs persist, and adolescent pregnancies continue to reflect early marriage and limited access to youth-friendly services.To better understand how Indonesia’s health system has evolved under decentralisation, the Ministry of Health, supported by World Health Organization (WHO), United Nations Population Fund (UNFPA), the United Nations Children’s Fund (UNICEF), IPAS and the Asian Development Bank (ADB), conducted a joint external review of RMNCAH programmes. This review draws on multiple sources of evidence, including existing literature, policy documents, national health system data, as well as field visits to six selected provinces to represent Indonesia’s geographic and administrative diversity. During the field visits, review teams observed service delivery in health facilities, spoke with health workers and local leaders and met mothers and families to understand how RMNCAH policies are operationalised. One of the challenges identified was the management of low birthweight (LBW) infants, a major contributor to neonatal deaths, under resource constraints. One midwife described a severe case of extremely LBW twins, one stillborn and the other died after three days of care. She recalled how the surviving infant struggled to swallow and may not have received breast milk, while simultaneous emergencies required the team’s attention, affecting the care provided to the infant.A subsequent review of the case by the district health office revealed insufficient antenatal care, fragmented maternal medical history due to population mobility, referral delays, limited provider capacity in neonatal intravenous access and a heavy workload that constrained proper newborn monitoring. These insights informed recommendations to strengthen both system-wide and service-level responses. Since the early 2000s, Indonesia’s decentralisation initiative has given much of the responsibility for funding, staffing and managing health services to regional governments. While the Ministry of Health sets national clinical standards, daily management of public health facilities falls under regional authorities through the Ministry of Internal Affairs. While this arrangement allows services to be tailored to local needs, it also depends heavily on local capacity for planning, budgeting and management. Health facilities and district health offices are better positioned to translate national priorities into local action when they have access to consistent technical support, helping health workers manage resource constraints and infrastructure gaps.The complexity of Indonesia’s health system governance is no easy feat to navigate. Understanding these dynamics is essential to strengthening policy, improving coordination and ensuring more equitable access to services across Indonesia. Under the leadership of Ministry of Health, recommendations from this exercise will be key in guiding the nation’s roadmap to an equitable and quality health system for RMNCAH.Written by Edit Oktavia Manuama, National Professional Officer (Maternal, Newborn, and Child Health), and Jessie Yunus, National Professional Officer (Gender, Rights, Equity, and Disability Inclusion)

Jun 1 • 8:00 PM EDT • Health • who.int

Soccer Glory in France Spurs Violence Again—and Political Backlash

President Emmanuel Macron says the country has had enough, as mass celebrations repeatedly spiral into chaos..

Jun 1 • 1:04 PM EDT • Politics • wsj.com

Wisconsin-based Packer Fastener opens Lebanon site

Green Bay, Wisconsin-based Packer Fastener, which supplies fasteners, tools, welding supplies and other products to manufacturers, contractors and fabricators, has entered the Indiana market.

Jun 1 • 12:28 PM EDT • Business • ibj.com

Foldable 'iPhone Ultra' Rumored to Feature Vapor Chamber Cooling Despite Thin Design

Apple's first foldable iPhone, known as the "iPhone Ultra," will feature impressive vapor chamber cooling and launch in September despite production difficulties, a known leaker today reported. The iPhone 17 Pro's vapor chamber thermal plate. In a new post today on Weibo, the leaker known as "Fixed Focus Digital" said the foldable iPhone's pre-assembly manufacturing processes are facing pressure and that the initial production ramp-up is proving difficult.

Jun 1 • 11:13 AM EDT • Technology • macrumors.com

Apotex Health Seeks to Raise Up to C$1.2 Billion in IPO

Canadian generic drug manufacturer Apotex Inc. is looking to raise C$1.2 billion ($868 million) in an initial public offering in Toronto, the company said Monday.

Jun 1 • 7:29 AM EDT • Health • bloomberg.com

Remal Appoints Ram Sandipam Adhikary as Lead, Business Development & Technical

Remal Alcast Pvt. Ltd., a manufacturer of master alloys, cast alloys, and aluminium billets, is pleased to announce the appointment of Mr. Ram Sandipam Adhikary effective May 20, 2026. Ram will lead and oversee Business Development, and its other integral operations related to - Strategy and Planning, Process Control, Quality Assurance and Sustainability.

Jun 1 • 5:04 AM EDT • Business • finance.yahoo.com

Securing Michigan’s manufacturing legacy with AI and advanced technology

AI is helping Michigan manufacturers improve operations, lower maintenance costs and modernize production with practical, affordable solutions.

Jun 1 • 5:00 AM EDT • Business • crainsdetroit.com

Inter put off by Roma’s asking price for Kone

Manu Koné could leave the capital during the next transfer window. Roma needs to make capital gains by June 30th, and the French midfielder is one of the likely candidates to leave no later than that...

Jun 1 • 3:05 AM EDT • Sports • sports.yahoo.com

Aurelian Tchouameni: Real Madrid’s stance comes to light

Manchester United’s hunt for Casemiro’s ideal replacement is not going according to plan.Manuel Ugarte has been a major disappointment and is set to leave, which leaves INEOS with a massive hole t...

Jun 1 • 1:10 AM EDT • Sports • sports.yahoo.com

Virtual farms created from real-world tomato farm images

The virtual environment (left) is created using real-world tomato farm images (right) manually obtained from camera data collected by agricultural robots.

Jun 1 • 1:04 AM EDT • Science • eurekalert.org

5 Vikings Theories That Aged Poorly as of Late

Heading into every offseason, Minnesota Vikings fans and various media members manufacture some theories that come true — and some […]

May 31 • 12:05 PM EDT • Sports • sports.yahoo.com

Iowa Democrat explains why he’s the best candidate to turn Senate seat blue

May 31 • 9:38 AM EDT • Politics • cnn.com

How Neighborhood Trauma Shapes Mental Health

A neighborhood can carry trauma long before anyone names it. Real healing begins when systems tell the truth about the wounds they helped create.

May 31 • 8:00 AM EDT • Health • psychologytoday.com

Why a Chinese-owned company is bringing factory jobs back to the U.S.

GE Appliances is a poster child for the president’s promised manufacturing revival. But tariffs are making it harder to onshore jobs.

May 31 • 5:00 AM EDT • Business • washingtonpost.com

Modern Graphics Via DisplayLink For Your ISA-Era PC

The monitors used on older computers are now becoming difficult to find, as we doubt anything for MDA, CGA, Hercules, or EGA has been manufactured in decades. Even VGA, though there are plenty of s…

May 31 • 4:00 AM EDT • Technology • hackaday.com

China’s Factory Activity Slows in May, Raising Questions Over Its Economy

BEIJING (AP) — China’s factory activity was flat in May, according to an official survey released Sunday, raising questions about how much further the country’s economy can shield itself from the fallout of the ongoing Iran war and pressure on demand. The official manufacturing purchasing managers ...

May 30 • 11:17 PM EDT • Business • usnews.com

Political tensions run high as America 250 set to take over DC

Security preparations are underway across Washington ahead of a number of celebrations commemorating the nation’s 250th anniversary this summer as the threat of political violence looms. The first …

May 30 • 5:00 PM EDT • Politics • thehill.com

New 3D silicon chip breakthrough could extend Moore’s Law for years

As traditional chip miniaturization slows, researchers have found a way to pack more computing power into the same space by stacking silicon circuits in multiple layers. The new process uses ultra-thin silicon membranes and low-temperature manufacturing techniques to overcome a major obstacle that has long blocked the production of true 3D chips.

May 29 • 8:00 PM EDT • Technology • sciencedaily.com

New 3D silicon chip breakthrough could extend Moore’s Law for years

As traditional chip miniaturization slows, researchers have found a way to pack more computing power into the same space by stacking silicon circuits in multiple layers. The new process uses ultra-thin silicon membranes and low-temperature manufacturing techniques to overcome a major obstacle that has long blocked the production of true 3D chips.

May 29 • 8:00 PM EDT • Science • sciencedaily.com

Kuo: Apple’s iPhone camera roadmap includes a costly upgrade

Analyst Ming-Chi Kuo is out with a new look at Apple’s upcoming iPhone camera plans, including an under-the-hood ultra-wide module change and a surprisingly steep cost increase.

May 29 • 5:05 PM EDT • Technology • 9to5mac.com

Senator Dave McCormick visits Johnstown, discusses PA's role in business and manufacturing

May 29 • 2:43 PM EDT • Business • wjactv.com

Cuba’s Top Two Political Prisoners Are Rapper Maykel ‘Osorbo’ Castillo and Artist Luis Manuel Otero

May 29 • 11:45 AM EDT • Politics • wsj.com

Here's the No. 1 breakfast mistake Americans make every morning, says oncologist and longevity expert

Ezekiel J. Emanuel has spent 35 years as an oncologist and expert on health policy. He shares his breakfast tips for better metabolic health, energy and longevity.

May 29 • 10:47 AM EDT • Health • cnbc.com

Reducing the Stigma Around Mental Health

We have to engage with skeptics if we want people to accept that mental health conditions require medical treatment.

May 29 • 8:00 AM EDT • Health • psychologytoday.com

Philips partners with Disney to incorporate iconic characters in MRI exams

The Amsterdam-based imaging manufacturer said it will utilize beloved animated characters and stories as part of the Philips Ambient Experience.

May 29 • 3:14 AM EDT • Business • radiologybusiness.com

EPA delays reporting requirements for health-harming chemicals

Federal regulators are giving chemical manufacturers and petroleum refiners more time to provide data on a group of chemicals that have been linked to human health harms as officials consider tighter regulations.

May 28 • 3:21 PM EDT • Health • thenewlede.org

French Open: Jannik Sinner upset by Juan Manuel Cerundolo after being granted controversial cramping timeout

May 28 • 8:49 AM EDT • Sports • sports.yahoo.com

10 Billion Pokémon Cards Were Printed Last Year — and It Still Wasn't Enough to Stop Shortages and Scalping

The Pokémon Company manufactured more than 10 billion Pokémon trading cards last year alone, and has now produced a staggering total of 85 billion cards to date.

May 27 • 10:58 AM EDT • Technology • ign.com

Licensable picture: FRANCE-POLITICS-MEETING-EMMANUEL-MACRON-ELYSEE-PALACE-ROUMEN RADEV

Emmanuel Macron (R), President of France, and Roumen Radev (L), prime minister of Bulgaria, pose and wave to the press on the stoop at the main entrance before...

May 27 • 8:03 AM EDT • Politics • reutersconnect.com

'Food Noise' and the Science of Interoceptive Awareness

Eliminating "food noise" comes with a cost. True health requires mindful nourishment rather than total control.

May 27 • 8:00 AM EDT • Science • psychologytoday.com

Vermeer breaks ground on Bondurant facility

Vermeer Corp. marked the beginning of construction of its new manufacturing facility in Bondurant last week. A groundbreaking ceremony was held on May 21, and featured representatives from Vermeer, city leaders, and officials from the Iowa Economic Development Authority and the Greater Des Moines Partnership. The Pella-based company announced plans to expand its operations to…

May 27 • 7:00 AM EDT • Business • businessrecord.com

Life sciences firm planning $16M relocation to Noblesville

Bothell, Washington-based BioLife Solutions Inc. plans to move its manufacturing and research operations from Indianapolis to Hamilton County.

May 27 • 12:27 AM EDT • Business • ibj.com

Christian Menefee Defeats Al Green in Texas Democratic House Runoff

The showdown, manufactured by a Republican gerrymander, created one of many generational clashes consuming Democrats this cycle.

May 26 • 8:38 PM EDT • Politics • nytimes.com

Cornyn: ‘I don’t know what more I could do to support the president’

May 26 • 6:18 PM EDT • Politics • cnn.com

Leaked foldable iPhone Ultra cases leave nothing to the imagination

Accessory manufacturers might be getting specifications for the foldable iPhone Ultra from Apple already.

May 26 • 2:09 PM EDT • Technology • phonearena.com

Why billionaires, CEOs and manufacturers keep choosing Texas as America’s business capital

Gabriela von zur Muehlen, chief policy officer at the Texas Association of Business, says Texas’ low costs and strong supply chains help attract billionaires, CEOs and manufacturers.

May 26 • 10:12 AM EDT • Business • foxnews.com

Rahm Emanuel, a Possible 2028 Contender, Calls for Higher Education Reforms

Republicans have made gains with voters on education issues. A plan championed by Mr. Emanuel, a Democratic former mayor of Chicago, centers on college affordability.

May 26 • 9:36 AM EDT • Politics • nytimes.com

Mental Health Law Needs a Family Bill of Rights

More consensus is emerging that mental health law should better inform and engage loved ones of those with serious mental illness.

May 26 • 8:00 AM EDT • Health • psychologytoday.com

France Politics

French President Emmanuel Macron winks as he delivers a speech during a meeting with the French electrification team to accelerate national mobilization in favour of the electrification of France at

May 26 • 7:14 AM EDT • Politics • springfieldnewssun.com

France Politics

French President Emmanuel Macron delivers a speech during a meeting with the French electrification team to accelerate national mobilization in favour of the electrification of France at the Elysee Palace,

May 26 • 5:58 AM EDT • Politics • journal-news.com

Russian anti-drone turret uses rounds that calculate when to detonate

The newly unveiled ZAK-30 Citadel is Russia's foray into programmable ammo tech, which has already being sold for years by Western manufacturers.

May 26 • 12:38 AM EDT • Business • businessinsider.com

Why Some Phone Manufacturers Stopped Using Gorilla Glass

Not every phone manufacturer is sticking with Gorilla Glass. Some are developing in-house alternatives, and their explanations vary by brand.

May 25 • 9:47 AM EDT • Technology • bgr.com

Plush Toy Manufacturer Yortoob Enters Licensed Character Manufacturing Supply Chain for Global Entertainment IP

/PRNewswire/ -- Today, plush toy manufacturer Yangzhou Home Ka Crafts Co., Ltd. (Yortoob) announced its official entry into the licensed character...

May 25 • 8:45 AM EDT • Entertainment • prnewswire.com

How Microplastics May Be Threatening Women's Sexual Health

Microplastics have been found inside women's ovaries, and they may be hijacking your hormones. Here's what the science says and what you can do about it.

May 25 • 8:00 AM EDT • Health • psychologytoday.com

China’s machinery giant XCMG eyes bigger scoop of global sales

State-owned firm banks on intelligent manufacturing, green technology, product integration and digital services to boost sales overseas.

May 24 • 9:00 PM EDT • Business • scmp.com

How integrating tradition and self-care has strengthened public health in the Americas

On 13 May 2026, a regional dialogue for the Americas titled, Innovative Experiences to Strengthen Health and Self-Care through Traditional, Complementary, and Integrative Medicine, was hosted by EsSalud, the government agency responsible for social security and health care in Peru.The event brought together representatives from the World Health Organization (WHO), the Pan American Health Organization (PAHO), WHO collaborating centres, the health sector and academia. It presented regional perspectives from BrBolivia, Brazil, Mexico and Peru to explore how self-care and traditional medicine can strengthen public health, empower communities and support more inclusive models of care. Across all four countries, a clear message emerged: traditional medicine is not being positioned as an alternative to formal systems, but as a way to strengthen them. In the Americas region, the challenge is to consolidate intercultural and holistic care, with the aim of strengthening the healthcare system – making care more preventive, culturally relevant and community-based.Peru: institutionalizing complementary care over 28 years Dr Martha Villar López from EsSalud Peru demonstrated how integration can be institutionalized over time. With nearly three decades of investment, including a research programme dating back to 1998, traditional medicine is now embedded within public health infrastructure. EsSalud’s flagship programme, Reforma de Vida, operating as Prevenir, takes multidisciplinary teams into workplaces to reduce and detect risk factors for chronic noncommunicable diseases. Education cycles are structured around three pillars: celestial nourishment, focused on life purpose and movement; terrestrial nourishment, centred on regional food and healthy diets; and human nourishment, addressing identity, relationships, stress and spirituality. Grounded in Andean cosmovision and the principle of the ayllu, the programme aligns with local cultural values. Since 2007, it has trained over 6600 health leaders, certified more than 3100 health-friendly organizations and built alliances with nearly 11 000 employers.Bolivia: legal recognition and medical pluralism Adelino Pau Carpacheco, an 82-year-old Callawaya healer, described working with more than 220 medicinal plants, supported by deep generational knowledge. Traditional healers and plant medicine are highly respected in the country. Bolivia’s contribution also highlighted the role of policy in enabling integration. Through Law 459, traditional medicine has been formally recognized within a legal framework and led the country to medical pluralism where traditional medicine coexists with biomedicine, and both are now offered free of charge through the public health system. Mexico: preserving Indigenous knowledge and reinventing food culture Mexico presented two complementary approaches focused on knowledge preservation and food systems. In Veracruz, communities partnered with a university to safeguard Totonac traditional medicine through a diploma programme launched in 2019. This collaboration has already produced practical outputs, including manuals and a dictionary, helping to sustain knowledge at risk due to migration and generational change. Alongside this, Dr Hernán García, Directorate of Traditional Medicine and Intercultural Development – Mexico, explained how the Dieta de la Milpa programme addresses Mexico’s dual burden of malnutrition and rising noncommunicable diseases. Rooted in traditional Mayan cultivation systems and ingredients, it promotes healthier diets through community-led, intercultural approaches involving local authorities, Indigenous leaders and cooks. By reconnecting food, culture and health, it offers a practical pathway to prevention. Brazil: community therapy as a public health tool Brazil’s experience centred on Integrative Community Therapy, a methodology developed over 40 years ago by Dr Adalberto Barreto and now used in more than 47 countries. Therapy circles create spaces where participants share experiences and coping strategies, building social support networks at very low cost. Within Brazil’s Unified Health System, the approach has expanded rapidly since its inclusion in national policy in 2017. By 2025, more than five million integrative practice procedures were delivered annually in primary care, with registrations for this therapy increasing by over 500% in eight years. The main challenge now is equity, with access still concentrated in urban areas such as São Paulo. A shared regional direction against a global backdrop Drawing these experiences together, Dr Natalia Aldana of the TCIM Network of the Americas highlighted the shared outcomes of the interventions discussed. Such approaches strengthen healthy behaviours, social networks and community resilience; they are low-cost, adaptable and enable active participation in care, while showing potential to reduce the burden of noncommunicable diseases.The regional momentum mirrors a broader global shift. Dr João Paulo Souz, Director of BIREME (Latin American and Caribbean Center on Health Sciences Information), the specialized center of PAHO/WHO, emphasized that the Global Traditional Medicine Strategy 2025–2034 promotes a vision centred on people, evidence and integrated use. He noted that health should be understood through the relationships between people, community, nature and spirituality. Self-care interventions as a critical pathway towards universal health coverage Dr Manjulaa Narasimhan, Unit Head for Sexual Health and Well-being across the Life-course at WHO, delivered a presentation titled Advancing Self-Care in Traditional Medicine: Aligning the WHO Traditional Medicine Strategy 2025–2034 with the WHO Self-Care Framework, co-authored by Dr Geetha Krishnan Gopalakrishna Pillai, Unit Head for Research, Data and Innovation at the WHO Global Traditional Medicine Centre. WHO recommends self-care interventions for every country and economic setting as a critical path to reach universal health coverage – and traditional medicine acts as a bridge for self-care. Dr Narasimhan explained that traditional medicine contributes most effectively to self-care when embedded directly into primary health care, not operating in parallel, siloed systems. This, she stated, “is possibly the only sustainable way to deliver continuity of care that meets the needs, rights and priorities of communities and individuals”. The Global Traditional Medicine Strategy 2025–2034 is a move towards a more people-centred approach to health care that champions holistic approaches to health equity and patient autonomy.The integration of traditional medicine and self-care requires collaboration across disciplines, clear referral pathways, trained health and care workers, and strong leadership that supports integration. The WHO self-care competency framework defines 10 key competencies for health and care workers to support self-care in their clinical practice, supported by the WHO guideline on self-care interventions for health and well-being. These documents help health-care workers safeguard their own well-being and ensure that care is consistent, safe and grounded in shared standards and values.Together, the discussion through this dialogue points to a fundamental shift in how health systems are designed in the region, and globally, towards models that are more inclusive, culturally-grounded and responsive to the needs of the communities they serve. It is a move towards a system where traditional medicine is respected and responsibly integrated, where self-care provides empowerment and evidence-based care, and where health systems are supportive rather than being distant from these systems.Traditional medicine perspectives from Bolivia, Mexico and Peru - WHO's "Restoring Balance" seriesInnovative Experiences to Strengthen Health and Self-Care through Traditional, Complementary, and Integrative Medicine was streamed in Spanish, with Spanish and Portuguese subtitles. Recordings are available through the CABSIN YouTube channel with Portuguese subtitles and on the BVS MTCI Americas YouTube channel with Spanish subtitles. Dr Narasimhan’s session can be watched in English on both channels.

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