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Lunchbreak: Myles Price Continues Vikings Streak on FOX Sports’ All-Star List
Minnesota Vikings Latest News
A sensory-friendly space makes science learning more accessible
Orlando Science Center has a Sensory Room available for those individuals and families who need a calming environment when activities in the exhibit halls become overwhelming. Created in collaboration with KultureCity and presented by AdventHealth for Children, the Sensory Room on Level 4 is designed to make OSC more accessible for guests with sensory issues.
Microsoft releases Windows 11 version 26H2, calls it a "predictable and low-disruption update" with no compatibility concerns
The next version of Windows 11 is now generally available. Here's what's now and how you can get it.
Office of Personnel Management uncovers $500M in fraud and waste in federal health benefits programs
The Trump administration's Office of Personnel Management uncovered $510 million in fraud and waste across federal employee health benefits programs.
Fire Emblem: Fortune's Weave Is So Full Of Stuff That Isn't Major Battles That It's Putting Me To Sleep
I enjoy this game, but everything between major battles is snooze-inducing
Tom Cruise is best part of ambitious but sterile 'Digger'
Alejandro Iñárritu's surreal, over-the-top environmental satire is part Wes Anderson, part Stanley Kubrick and all frustrating.
PS5 Jailbreak Exploit For Systems Running July 2026 Firmware
According to those who have installed the new Relapse exploit, it works with everything from Marvel's Wolverine to The Witcher 3: Remastered
Warriors' Kristaps Porzingis out indefinitely with unspecified health issue
The former Celtics big man will reportedly miss the Warriors' preseason trip to Hawaii.
GTA 5 Modder Cancels Nintendo Switch Port Just Days Before Launch After Previously Taunting Rockstar: 'I Am Thankful For Take-Two's Mercy'
The creator behind the planned port will not release any code or assets online in order to avoid a possible lawsuit
Kustom Entertainment executes 1-for-10 reverse stock split
Kustom Entertainment executes 1-for-10 reverse stock split
Raiders TE Brock Bowers' Week 3 usage was beautifully insane
Las Vegas Raiders tight end Brock Bowers' Week 3 usage was beautifully insane by HC Klint Kubiak.
Kustom Entertainment, Inc. Announces Reverse Stock Split
Olathe, KS, Sept. 29, 2026 (GLOBE NEWSWIRE) -- Kustom Entertainment, Inc. (NASDAQ: KUST) (the “Company”), a leader in live event production and ticketing...
Ten Kustom shares will become one as it seeks to meet Nasdaq's $1 minimum bid-price rule.
The stated outstanding-share count drops from 6,506,860 to 650,686, subject to rounding up fractional shares. Split-adjusted trading is expected Oct. 1.
Avex Increases Ownership of Brandon Silverstein's S10 Entertainment
Japanese entertainment giant Avex Inc. owns 85% of Brandon Silverstein's S10 Entertainment with a shared goal of reaching 100%.
Kustom Entertainment, Inc. Announces Reverse Stock Split
Olathe, KS, Sept. 29, 2026 (GLOBE NEWSWIRE) -- Kustom Entertainment, Inc. (NASDAQ: KUST) (the “Company”), a leader in live event production and ticketing technology, today announced a 1-for-10 reverse split (the "Reverse Stock Split") of the Company’s common stock (the "Common Stock") and proportional reduction of the number of shares of Common Stock authorized (the “Capital Stock Reduction”). The Company anticipates that the Common Stock will begin trading on the Nasdaq Capital Market (“Nasdaq”
Avex Music Group CEO Brandon Silverstein Expands Global Role as Avex Acquires His S10 Entertainment
/PRNewswire/ -- Avex Inc. (TSE: 7860) ("Avex"), the publicly traded global entertainment conglomerate led by CEO Katsumi Kuroiwa, has increased its ownership...
Meta laid me off in May, but here's why I felt prepared
Adekunle Ayodele shares his experience getting laid off from Meta in May, including what preparation helped it feel like less of a shock.
Control Resonant’s City Is A Slog Compared To The First Game's Unforgettable Office Building
Remedy's sequel to Control changes its venue, to diminishing returns
Brisket is missing from Texas menus. A Democrat blames Republicans.
Vicente Gonzalez releases a new ad connecting high beef costs to the loss of an important South Texas tradition.
Lesbian Bar Project Co-Founder: Purity Politics Could Destroy Our Remaining Spaces
Subscribe As a professional lesbian and Massachusetts native, I’ve recently been asked by a lot of folks what I think about the saga unfolding at Last Ditch. The now-viral story, first reported by The Boston Globe, centers on a Western Massachusetts lesbian bar that lifted its mask requirement for one night a week to help drum up business. The decision ignited an intra-queer controversy that has been feasted on by media outlets across the political spectrum—from the New York Post to LGBTQ Nation—and is even reportedly being eyed for a Hollywood adaptation. Apparently nothing is more entertaining than a bunch of lesbians and queers fighting with each other over KN-95s. What has been lost in all of the chatter and media coverage is the very real possibility that Last Ditch, which just opened in April 2025, will have to close its doors. The venue’s one remaining founder, Jackie Matellian, revealed in a community Zoom meeting that she’s working four jobs, is now solely responsible for the bar’s $50,000 business loan and is struggling to keep up with the bills. So as we laugh about the controversy’s similarity to a “Portlandia” skit and how one of the bar’s founders left to enroll in clown school, we forget that yet another lesbian bar is facing an existential crisis—and this time the call is coming from inside the house. In 2020, my friend Elina Street and I created The Lesbian Bar Project, an Emmy-, Webby- and GLAAD Media Award-winning docuseries and initiative that tells the stories of lesbian queer bars around the world. We were moved to act because at the time there were only an estimated 16 lesbian bars in the United States, and the pandemic threatened to bring that number down even further. There are now more sapphic bars than there were just before the pandemic—about 36 of them in total—but this is down from approximately 200 in 1980. Maybe that doesn’t mean much to you, but for the millions of sapphics living in the U.S., this number is calamitous. As the world laughs at lesbians and sapphics, I want to take a second and tell you what I feel when I walk into one of these bars, which are all unique and irreplaceable in their own way: I feel seen. Sometimes I think Cubbyhole in New York City’s West Village neighborhood knew I was gay before I did. When I walked in there for the first time, before I was even out, I was transfixed by the colorful array of tchotchkes hanging from the ceiling and how the women standing next to me were completely unafraid to express their desire for one another. I knew the minute I was ready to come out, I had a home. I also felt the joy of a new couple falling in love at Seattle’s Wildrose, the quiet confidence of a short king lining up her shot at the pool table at Ginger’s in Brooklyn and the kick of cayenne pepper in Julie Mabry’s crawfish at Houston’s Pearl Bar. Subscribe Lesbian bars don’t just serve lesbians; they serve queer folks across the spectrum, including bisexual, pansexual and trans people. As Elina and I traveled across the U.S. and Europe and to parts of Latin America to document the bar owners, staff and patrons that make up the ecosystems of these spaces, we also became uniquely acquainted with the factors that threaten their existence: gentrification, wage gaps, sexism, environmental disasters, gun violence, rising insurance premiums and political administrations working to annihilate queer people and their families. Lesbian bar owners, like all leaders and entrepreneurs, are imperfect. There have been significant issues over the years at lesbian bars: employee harassment, racism, lack of accessibility, sexual assault and transphobia. All bar owners should be held accountable and should listen to their communities to evolve into safer and more equitable spaces. I also acknowledge my privilege: I am able-bodied, white, cis and from a family system that loves me for who I am. Not everyone has that. Queer people, especially trans and bisexual people, are suffering from disproportionately high levels of depression, and our mental health system isn’t equipped to support them. Immunocompromised people and long COVID are real, and many of my friends are suffering to this day. The people with the least safety net are often the ones for whom a bar closing costs the most. And yet, as we’re seeing with Last Ditch, the queer community often lashes out at each other. It’s also the mainstream media taking the internal conflict and making a mockery out of it, distracting from the real possibility that this bar could close due to financial pressures. A bar that many people loved and needed is facing extinction. Perhaps it’s safer to dissent with one another than with the larger forces trying to eradicate us, but in doing so, we risk destroying the few spaces we have left. Due to the constraints of purity politics—some in good faith, some not so much—lesbian bar owners, almost all of whom are queer women themselves, are forced to be everything for everyone, similarly to how women are forced to be everything for everyone. By asking these bars to uphold impossible standards—standards very few other third spaces are asked to consider—we all end up losing. I want to move as a community toward dialogue, compassionate dissent and collaboration to make our spaces better with the goal of keeping them OPEN and thriving, rather than destroying them from the inside with expectations that are arguably unattainable. Subscribe While I have your attention—for this fleeting second of the news cycle—may I urge us to spearhead a way to keep these small businesses afloat without attacking our own community along the way? Bar owners are left with an impasse: They want to be community-centered, but they also have to make money to keep their doors open. Sometimes they might make business decisions that don’t work for everyone—and that’s partly because different patrons have different priorities and want different things—but these owners deserve the opportunity for productive dialogue**.** We have to work with them and with each other to keep our spaces open, to keep them growing. Lesbian bars raised me into the queer woman I am today. One thing I think about as I reflect on the six years of work we’ve done to document these spaces is that shared, unspoken language I have with a stranger the moment we both walk into one of these bars: the nod, the ease, the not having to explain ourselves. I don’t want to lose that, and neither should you. If objective, nonpartisan, rigorous, LGBTQ-focused journalism is important to you, please consider making a tax-deductible donation through our 501(c)(3) fiscal sponsor, Resource Impact, by clicking this button: Donate
Ex-Trump prosecutor Smith will tell senators he won't 'be silenced' by threats of prosecution
The former Justice Department special counsel who brought two federal indictments against President Donald Trump will tell lawmakers he “will not be silenced by continued threats of prosecution” from the Trump administration and believes the rule of law is being threatened like never before
How to watch 'Hokum': Where and when to stream one of the best horror films of 2026
Adam Scott is truly in his horror era.
$10 for a gallon of gas has red Alaska thinking about a Democratic senator
Mary Peltola hopes to unseat Republican Sen. Dan Sullivan in a race all about prices, federal aid and Donald Trump.
Dana White Kills Stevenson-Pacquiao Talk
Dana White shut down Shakur Stevenson vs. Manny Pacquiao at a Zuffa Boxing press conference. An offer is out to Gary Antuanne Russell to unify at 140.
Chicago Bears 27-7 Philadelphia Eagles: Case Keenum drives Bears to three touchdowns in first NFL game since 2023
Case Keenum pushed Chicago Bears to 27-7 victory against Philadelphia Eagles on Monday night, as the backup quarterback made his first appearance since 2023; watch Steelers @ Browns on Thursday Night Football live on Sky Sports from 12.05am on Friday
Kurt Olsen, key Trump 2020 election denier, departs Justice Department
Kurt Olsen, a lawyer who aided President Donald Trump’s 2020 election reversal schemes before joining his second administration, left the Justice Department Monday, a person familiar with the departure told CNN.
Beyond 'normal' and 'abnormal': Health checkup values show nonlinear links to future health care costs
As populations age and health care expenditures continue to rise worldwide, there is growing interest in understanding how routinely collected health data may help characterize future health care needs ...
iPhone Duo StandBy Leak Reveals Five Unannounced Faces
We've seen previews of iOS 27 running on the iPhone Duo, including a new StandBy mode that activates even when the iPhone isn't charging. Apple showed the mode in press materials, but leaker pdfu today shared a more in-depth look at some of the options. There are multiple StandBy faces available on the iPhone Duo, five of which we weren't aware of. A Home Camera view will show a single camera feed or a grid of up to nine camera feeds.
Mat3ra and the University of Tsukuba’s Center for Computational Sciences Sign MoU to Expand Access to Cloud-Based Materials Modeling in Japan
Mat3ra Japan K.K., the Japan entity of Exabyte Inc., the developers of Mat3ra.com, and the Center for Computational Sciences (CCS) of the University of Tsukuba today announced the signing of a Memorandum of Understanding (MoU) that establishes a framework for the use and dissemination of the Mat3ra.com computational materials platform within CCS and associated academic institutions in Japan. Under the MoU, Mat3ra provides CCS with free access to the platform for research and educational p...
Control Resonant Director Explains The Game's Lack Of Yellow Paint: 'It Was A Conscious Decision, Obviously'
'If you want to get the most out of this world, you have to participate'
FEMA can’t condition security grants on election changes, judge says
The Trump administration had sought to limit anti-terrorism funding for local governments that didn’t check the citizenship status of voters.
Circuit of the Americas celebrates grand opening of new theme park
COTALAND celebrated its grand opening weekend at the Circuit of the Americas, offering more than 30 experiences, rides and dining options.
Scotts Valley walk honors loved ones and raises mental health awareness
Community members in Scotts Valley gathered for a mental health awareness and suicide prevention walk, honoring those lost and spreading a message of support.
Changing the color of fire
The Science of It: Meteorologist Victoria Wisniewski is using elements from the periodic table to create a colorful scene at the Orlando Science Center
Senate Health Panel Delays Bill as Nominees Await Vote
Senate Health Committee recesses HHS markup as measles cases rise. Surgeon General nominee delayed. See why this matters for public health policy.
GTA 6's Collector's Box Gator Statue Can Now Be 3D Printed: '$400 And No Disc? F**k You Rockstar'
At least one person is so fed up with Rockstar that they modeled a cartoon gator in retaliation
2 men charged with arson in connection with fire at Kansas City business
Two men have been charged with arson in connection with a fire at a Kansas City business earlier this month.
People Are Going Completely Wild Over Fortnite's FNAF Crossover Announcement
Fortnite's post revealing the horror-themed crossover has become the game's biggest tweet ever
NH's Business: What do New Hampshire and New England economies look like this fall?
Brian Gottlob, director of the New Hampshire Economic and Labor Information Bureau, looks at employment trends, inflation, consumer spending and more.
Buffalo Museum of Science unveils permanent Bills, Sabres and Bandits exhibit
The Buffalo Museum of Science opened the $3M Science Stadium interactive, a permanent exhibit that focuses on the Bills, Sabres and Bandits and brings the science and engineering behind professional sports to life.
Kierra M with the latest in entertainment headlines
Family members of Chadwick Boseman are said to be at odds over a documentary.
Jarell Quansah Ahead Of Alexander-Arnold In Tuchel’s England Hierarchy
Thomas Tuchel prioritizes physical presence and versatility, leaving the Real Madrid star sidelined while the Leverkusen defender cements his unexpected status as England’s preferred right-back.
Gautam Mukunda: The incentives for entrepreneurs have become warped
A recent New York Times investigation found that sports betting company DraftKings Inc. built a machine-learning model that scored customers by how much they would lose for each free bet
Scanning the waiver wire for intriguing options
The Penguins would probably figure to not use waivers to boost their lineup, given all the depth they already have. However with four players placed on IR yesterday plus the statuses of Bryan Rust (injured) and Andrei Kuzmenko (personal) still up in the air for the start of the season, the waiver wire could hold […]
Arsenal and Tottenham step up interest in Ibrahim Maza
Arsenal and Tottenham are keeping a close watch on Bayer Leverkusen midfielder Ibrahim Maza as the 20-year-old continues to attract growing Premier League interest.Maza has made an encouraging start t...
Packers Position Coach Put on Hot Seat After Brutal Start
The Green Bay Packers‘ offensive line is a massive problem. A lot of that can be attributed to the injuries on the line. However, just as much blame can be placed on offensive line coach Luke Butkus. There have been plenty of potential suggestions for the Packers to make changes in the layoff between Week […] The post Packers Position Coach Put on Hot Seat After Brutal Start appeared first on HEAVY.
Man shot, killed inside Hyde Park business identified
Boston police have identified a man who was shot and killed inside a business in the city's Hyde Park neighborhood.
Kodiak Sciences Stock Surges 125% After Late-Stage Drug Trial Success
The trial tested two experimental eye drugs, Zenkuda and tabirafusp-ted, for treating wet age-related macular degeneration.
Stanley Parable Co-Designer Perfectly Explains Why People Play 1,600 Hours Of Dota 2 And Still Hate It
This is exactly how I've felt
Explainer: The political chess behind the ECB's next leadership shake-up
The euro zone will choose a new European Central Bank president next year and replace up to two-thirds of the bank's six-member executive board in an intricate game of political chess among the bloc's 21 countries.
KU School of Education & Human Sciences launches online master’s in higher education administration
The University of Kansas School of Education & Human Sciences is launching a fully online M.S.E in Higher Education Administration housed within the Department of Educational Leadership & Policy Studies. The program builds on KU's established in-person higher education administration graduate degree.
Massachusetts mom builds healthy muffin business during pandemic
Melissa Bermudez, co-founder and CEO of Unrefined Foods, turned her passion for baking into a business offering frozen, whole-grain muffins made with clean ingredients.
From pickups to idle plants: automakers seek lifeline from defence boom
Western automakers are chasing a defence spending boom as a way to sell more vehicles and make use of underemployed factories, though executives say military work will not make up for slowing car sales and growing Chinese competition.
80% of Americans take (mostly useless) supplements for their health
Nearly eight in ten Americans take at least one pill, powder or gummy in the name of good health, as Pew Research Center’s Emma Kikuchi and Brian Kennedy
2026 MTV VMAs red carpet: The best, boldest and most 'wait, what?!' outfits, from Belmont Cameli's Canadian tuxedo to Sombr's sexy skunk
Presenting the MTV VMAs' most stylish — and, OK, out-there — red carpet looks.
Trump to travel to Ohio to stump for Sen. Jon Husted as the Republican faces competitive challenge
President Donald Trump plans to visit Ohio on Saturday in support of Sen. Jon Husted as the Republican tries to fend off a competitive challenge from Democratic former Sen. Sherrod Brown.
Trump to travel to Ohio to stump for Sen. Jon Husted as the Republican faces competitive challenge
President Donald Trump plans to visit Ohio on Saturday in support of Sen. Jon Husted as the Republican tries to fend off a competitive challenge from Democratic former Sen. Sherrod Brown.
Trump to travel to Ohio to stump for Sen. Jon Husted as the Republican faces competitive challenge
President Donald Trump plans to visit Ohio on Saturday in support of Sen. Jon Husted as the Republican tries to fend off a competitive challenge from Democratic former Sen. Sherrod Brown.
Kruk and Kuip: Baseball's legendary Bay Area duo make final call for Giants
San Francisco Giants legendary broadcasters Mike Krukow and Duane Kuiper make their final call together.
Big Ten rushing yardage leaders after Week 4
UCLA running back Wayne Knight continues to lead the Big Ten in rushing, and Indiana's backup has rocketed up the leaderboard after Week 4.
Recommended Reads: 'Lessons From the Front Lines' offers practical wisdom for running a business
Lessons From the Front Lines by Kurt Schauermann Readers looking for practical business wisdom grounded in real-world experience will find this book informative and inspiring. Drawing on more than four […]
South Texas Health System (@stxhealthsystem)
0 likes, 1 comments - stxhealthsystem on September 27, 2026: "Support Recovery, Strengthen Your Future: South Texas Health System, the Rio Grande Valley's largest integrated healthcare network, is seeking passionate physical therapy professionals to join its nationally recognized inpatient and outpatient rehabilitation teams at STHS McAllen, STHS Edinburg and STHS Heart. Physical therapists play a vital role in helping patients regain strength, mobility and independence following illness, injury or surgery. If you're passionate about empowering patients on their road to recovery, STHS offers an opportunity to make a lasting impact every day. Join a collaborative team dedicated to exceptional patient care and helping individuals return to the activities and quality of life they value most. Ready to move your career forward? View current openings and apply today at the link in our bio.".
Business People: Evereve hires Target exec Alanna Baker to lead digital
RETAIL Evereve, an Edina-based national women’s fashion chain, announced the appointment of Alanna Baker as its first chief digital officer. Baker joins Evereve from Target Corp., where she most recently served as vice president of…
In Knoxville, cheers for Trump
The president, booed at other big sporting events this year, drew mostly cheers at Neyland Stadium. In the parking lots, some of his own voters had misgivings.
California voters to decide on Props 41 and 42, challenging the billionaire tax
California voters will face two ballot measures this November—Propositions 41 and 42—that aim to challenge the proposed billionaire tax and other future taxes like it.
Phone-free school year: How schools are adjusting to new law
This summer, a new California law required all school districts in the state to have policies either limiting or prohibiting the use of cellphones in school.
Attorney General Rob Bonta defends settlement with Paramount as judge delays merger
A federal judge has delayed approval of the settlement in the Paramount-Warner merger case, following concerns raised by critics and New Jersey Sen. Cory Booker about its potential impact on competition, jobs, and media independence.
Shirley Weber explains why she should be reelected as California's Secretary of State
California Secretary of State Shirley Weber reflected on her tenure and outlined her vision for a second term in an interview on California Politics 360.
California Politics 360 full episode | Attorney General Rob Bonta reacts to Paramount settlement
After several states, including California, agreed to settle an antitrust case with Paramount, a federal judge wants to learn more about the settlement.
Quansah: England Were Punished For Their Mistakes Against Spain
Jarell Quansah warns that squandered chances and missed penalties proved fatal against the world champions, emphasizing the unforgiving margins England must bridge to conquer elite international opposition.
Sunday Puzzle: So-so
NPR's Ayesha Rascoe and WYPR listener Katherine Jakuta of Baltimore, Maryland play the puzzle with Weekend Edition puzzle master Will Shortz.
Takuma Inoue vs. Tenshin Nasukawa 2 live results update
Welcome to the live results update for the Takuma Inoue (22-2, 5 KOs) vs. Tenshin Nasukawa (8-1, 3 KOs) rematch! Their bout headlines a Teiken Promotions card at the Toyota Arena in Tokyo, Japan. Fight fans in Japan will be able to catch the action live on Prime Video. The rest of the world will […]
Max Verstappen Reveals What Went Wrong in Baku Qualifying
The Dutchman reveals that the internal combustion engine stopped working correctly from Q1 causing a loss of half a second and a chain of electrical failures. He trusts in changing the unit without penalty and aspires to the podium from eighth place.
Takuma Inoue vs Tenshin Nasukawa 2: Live blog and results
Takuma Inoue and Tenshin Nasukawa run it back in Tokyo!
Families and healthcare providers reunite at Nebraska Medicine's annual NICU reunion
Families and healthcare providers shared hugs, appreciation and gratitude; celebrating the bond between them.
Car seat checks held during National Child Passenger Safety Week
Free car seat checks in Oklahoma City
Mount Dora restaurant says nearby roundabout construction is cutting off business
A Lake County restaurant owner said nearby construction is keeping customers away and cutting into sales; that's why he's asking for help.
San Antonio's Michelle Beadle joins Matthew Berry for new Roku sports show
The two-hour talk series will stream live and free on the Roku Sports Channel Monday through Friday from 11 a.m. to 1 p.m. CST.
Thunderbirds visit Monterey mental health facility to inspire youth
A U.S. Air Force Thunderbirds pilot and team members visited Ohana, a mental health facility in California, to share messages of teamwork, perseverance, and hope with young patients.
Jaguars will have new backup quarterback vs. Patriots
The Jaguars are elevating a LB for their Week 3 matchup and they'll also have a new backup QB this week.
Man shot and killed inside Hyde Park business, police say
Police are investigating a fatal shooting inside a Boston business on Saturday afternoon.
ENTERTAINMENT: Fantasies, folk songs on Festival of the Senses program
Violinist Andrew Irvin, cellist David Gerstein and pianists Jaeyeon Park Hakutani and Naoki Hakutani perform for the opening Festival of the Senses concert Tuesday at St. Luke’s Episcopal Church in North Little Rock.
How educational institutions should operate during power outages — the Ministry of Education and Science has issued recommendations
УНН Society ✎ The Ministry of Education and Science recommends that educational institutions maintain resource reserves, backup power, and shelters ready for use fo…
Local health experts to go door to door and survey Birmingham area
Jefferson County Health experts will visit certain neighborhoods to get health perspectives
What's a pumpkin concierge? Meet the southern Indiana business delivering fall magic
"Hello Pumpkin LLC" is a luxury pumpkin concierge service that delivers pumpkins to your front porch, creates a porch display for you and removes them at the end of the season.
Scientists reveal surprisingly easy exercise that may boost your mood in just 10 minutes
A University of Tsukuba study found that a slow 10-minute jog boosted attention, self-control and mood in young adults by activating the prefrontal cortex.
Patriots Week 3 Roster Updates
The NFL season is in its third week. Everyone's favorite teams are playing, and the rosters are changing. For the New England Patriots, there are spots to fill. With all the injuries that have happened so far, someone needs to step up, and someone needs to be a backup for the backup. Who's Filling in […] The post Patriots Week 3 Roster Updates appeared first on Stadium Rant.
Leverkusen's Rising Star Names Ibrahim Maza As His Role Model
Gabriel Minutillo eyes a first-team breakthrough, mirroring the creative flair and defensive work rate of his idol to forge a path alongside the Algerian playmaker.
Intel Panther Lake Teardown, 18A, BSPD, GAAFET, SemiAnalysis STEEL
Panther Lake debuts the first commercial implementation of backside power delivery (BSPDN), introduces Intel’s first iteration of gate-all-around (GAA) transistors, and showcases their advanced packaging capabilities with its Foveros-S assembly. With Panther Lake, Intel’s manufacturing arc has shifted from nebulous roadmaps to shipped silicon, a significant milestone on their long road back to competitive semiconductor manufacturing. To evaluate the extent of Intel’s comeback, we tore down Panther Lake. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Our teardown traces 18A from its four-sheet RibbonFETs (Intel’s marketing name for GAAFETs) and gate stacks through contacts, frontside and backside wiring, and the bonded carrier. We explain how these material and integration choices improve gate control and reduce resistance, while adding capacitance, thermal resistance, and process complexity. Our measurements put Panther Lake’s 18A compute logic and TSMC N3E GPU logic at similar logic density. However, 18A does not lead TSMC N3P, N2 or Samsung SF2 in peak density. Panther Lake’s CPU cores are incremental updates, and the high-end GPU still uses TSMC N3E. Panther Lake assembles one compute tile, one GPU tile, and one I/O tile atop a passive base tile using Intel’s Foveros-S advanced packaging. Both compute tile variants use Intel 18A. The Xe3 GPU options are a 4-core GT1 tile on Intel 3 and a larger 12-core GT2 tile on TSMC N3E. Both I/O tile variants use TSMC N6. [1], [2] Our analysis centers on the PTL-U compute tile, both the 4-core and 12-core GPU tiles, as well as the 12-lane I/O tile. In conventional chips, power and signal are routed through the same frontside metal stack towards the device frontend. Power rails consume scarce routing resources near the transistors, while tall via stacks carry VDD and VSS from the coarse upper wires to local rails. Backside power delivery (BSPD) moves the main power network behind the transistor layer, to the backside, separating it from frontside signal routing. We covered BSPD and its impacts in 2024. [3], [4], [5] Intel’s BSPD implementation, branded as “PowerVia”, routes power through dedicated backside metals to nano-TSVs, which connect those rails to local source/drain (S/D) contacts. Implementing that separation requires Intel to build the interconnect stacks from both sides of the wafer. The frontside comprises the M0-M14 signal stack, while the backside comprises the BM0-BM5 power stack. M0 and BM0 are closest to the transistors. The nano-TSVs connect the two sides, but Intel patterns and etches each via from the front after forming the contacts. A narrow via runs from the side of the contact deep into the silicon substrate. Intel then completes the frontside signal metal stack, bonds the wafer to a carrier, flips it and removes the original substrate until the buried via tips are exposed. The backside metal stack is then deposited directly on the revealed vias. The nano-TSV and backside-via profiles taper in opposite directions because Intel forms them from opposite sides of the wafer. The transistor structures form the FEOL. Local contacts and nano-TSVs connect them to the wiring. M0 begins the frontside interconnect stack. The silicon carrier remains attached above the frontside interconnects. It supports the device wafer during substrate removal and backside processing and remains part of the finished chip’s thermal path. PowerVia removes the main power distribution from the congested frontside metals, routing supply through shorter and wider backside wires. Its lateral landing still occupies area in the standard cell, so it recovers less cell area than a direct backside contact. [3] Nano-TSVs beside the logic devices carry VDD or VSS from the backside power network, while signal connections continue upward through the frontside metals. Backside Interconnects Samsung SF2 data is included for comparison to Panther Lake’s within this article. SF2 is the incumbent GAA foundry node but lacks BSPD, serving as a useful reference to evaluate 18A. A full teardown of Samsung’s S26 products, processed on SF2, will be shared soon.Nanosheet-cut EDS comparison. The PowerVia supply path runs from the backside Cu rails through Mo-lined W nano-TSVs to the local transistor contacts. In this cross section, the tapered connection spans roughly 150 nm from the contact level to BM0. The Ta liner confines Cu and promotes adhesion to the surrounding stack; the AlOₓ etch stop controls the next dielectric etch above the rail. Dielectric beneath the ribbons electrically separates the devices from the backside wiring and removes the conducting silicon body below the channel. [6] AlOₓ serves as an etchstop (ES), enabling endpointing and protecting the underlying layers. Low-volatility aluminum fluoride reaction products resist the fluorinated plasma, allowing a thin AlOₓ film to protect the metal while the surrounding low-k dielectric is removed. [6], [7]. While the BM0 and layers above the M1 lines show double AlOx layers, Our SMIC N+3 teardown showed single AlOₓ layers. SMIC uses a simpler local AlOₓ substack, while the remaining cap and etch sequence provide the required landing protection. So why double layers? The closely spaced AlOₓ doublets provide two protected endpoints in the etch sequence. Intel documents an AlOₓ/SiN/AlOₓ stack that explains the benefit. The main dielectric plasma etch stops on the first AlOₓ film; a selective wet clear opens that film; a second plasma etch removes the intermediate SiN and stops on the second AlOₓ film. The final wet clear exposes the metal landing surface. SiN is the intermediate dielectric in Intel’s published example. [8] The second stop protects the metal through a cap breakthrough. Wide openings can etch faster than narrow ones, and etch depth varies across the wafer. Metal under an early-clearing opening would otherwise be exposed while other openings still need more etching. Staged protection widens the process window and reduces metal erosion, corrosion and void formation. [8] TSMC documents AlN/AlOₓ/SiOC/AlOₓ above Cu, with AlN blocking Cu diffusion, and a simpler AlN/SiOC/AlOₓ variant that omits one AlOx film. [9] Levels with different opening sizes, aspect ratios, pattern densities and cap materials need different etch margins. A double AlOx stop is useful where another protected endpoint justifies the added processing. The extra film adds formation, selective opening and cleaning steps, plus another set of interfaces to control adhesion, moisture, and stress. These blanket films are opened through the existing via pattern, so each film does not require another lithography mask. AlOₓ adds parasitic capacitance when it replaces lower-k dielectric; two thin AlOₓ films can nevertheless contain less AlOₓ than one thick film. Total thickness, placement, and theintermediate dielectric determine the electrical cost. Deposition chemistry also changes AlOx permittivity and residual hydroxyl content, which can oxidize the underlying metal. [7], [8], [10], [11] The backside stack separates into relatively fine BM0-BM2 wiring near the devices and coarser BM3-BM5 power distribution. The largest pitch increase occurs between BM2 and BM3. BM0’s pitch closely matches the logic-row height, fitting local power delivery to the cell rows. Higher levels aggregate current through larger conductors: routing density becomes less important than low resistance and current capacity as the network approaches the package. This hierarchy provides wide power wiring for the power delivery network without consuming scarce frontside signal-routing resources. [3] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Frontside Interconnects Intel 18A combines Mo-lined W contacts and nano-TSVs with a separate backside Cu power network. Samsung SF2 keeps power on the frontside, using Ti-based contact interfaces and Ta-based barriers and Co liners around Cu wiring. In 18A standard-cell rows, backside power rails supply the devices through nano-TSVs within the cells, freeing frontside routing resources. Samsung’s M0 accommodates both power and signal connections. From the device toward M0, the connection runs through a Ti-based S/D interface, W contact fill, a Mo-lined W via, and the Cu M0 wire. Mo supplies a conductive nucleation and adhesion layer for W, replacing the resistive TiN liner used in conventional W integration. This increases the effective conduction volume within the feature while retaining W fill and its established polishing, cleaning and etching processes. Intel’s Mo/W patent describes this integration tradeoff. The nano-TSV uses the same Mo-lined W construction in the backside supply path. [12] The move from TiN to Mo is an incremental change. While a full Co or Mo fill can also reduce the volume lost to liners in very small features, it requires new integration schemes that increase complexity and risk. Cu remains attractive for wider wires due to its low resistance. As wires and vias shrink, the diffusion barrier consumes an increasing fraction of their cross-section. [12], [12], [14] Intel uses Co/Ru liners at M0-M1, Co at M2-M4, and Nb at M5-M9. The lower-level liners help Cu adhere and reduce void formation during trench fills. Applied Materials’ Endura has new thermal control that facilitate wetting process, so the thin film continuity is good enough that good capillary pressure will drive Cu atoms to the via bottom without voiding. Intel’s choice to use Nb is particularly interesting. Intel’s Nb patent describes a conductive diffusion barrier intended to reduce the barrier’s contribution to resistance relative to conventional Ta-based barriers, particularly at via bottoms where all current crosses the barrier. The patent pairs Nb in coarser levels with the option of lower-cost PVD processing. [15], [16] The upper metal layers support thicker barriers formed through physical vapor deposition (PVD) despite its worse coverage and uniformity. Meanwhile, the lower metal layers require thinner barriers deposited through conformal atomic layer deposition (ALD). Co/Ru adds another material interface and requires controlled deposition and Cu fill. Changing liners and barriers by metal layer allows Intel to optimize interconnect resistance, process complexity, and reliability. [15, 16] RibbonFET, Intel’s name for its gate-all-around FETs (GAAFETs), replaces the FinFET’s vertical fins with four stacked horizontal silicon nanosheets, allowing the gate to surround the channel on every side. The path to GAAFET begins with the planar transistor. A planar MOSFET places the gate above the channel between its source and drain. Pairing an NMOS with a PMOS transistor creates a CMOS inverter, in which the NMOS pulls the output low for a high input, and the PMOS pulls it high for a low input. The gate must retain electrostatic control of the channel to ensure clean switching. As gate lengths shrank, the drain began to compete with the gate for that control, increasing off-state leakage. Electrostatic control was restored through an architectural evolution that raised the channel into a vertical fin and wrapping the gate around three sides. Called “FinFET”, this new architecture packed more effective channel width into a smaller footprint. Further scaling made it harder to maintain both drive current and leakage within smaller cells, and reintroduced the same problems planar MOSFETs faced. Nanosheet GAAFETs close the fourth side by replacing the vertical fin with a stack of horizontal nanosheets, each surrounded by the gate. The tighter electrostatic control suppresses leakage at shorter gate lengths while stacking adds effective channel width within the cell footprint. In a FinFET process, channel width changes in discrete steps as designers must add or remove whole fins. Nanosheet width can instead be adjusted continuously within the process’s design rules. Wider sheets increase drive current, while narrower sheets reduce capacitance at the cost of drive current. Intel 18A uses stacks of four nanosheets each and varies their widths across logic and SRAM. At the process level, adding more sheets to each stack increases effective channel width and drive current, but complicates fabrication. RibbonFET vs MBCFET Samsung began GAAFET production in 2022 with SF3E, following with SF3 and now SF2. Its ‘MBCFET’ provides a useful structural comparison with Intel’s first RibbonFET implementation. [17] STEEL is digging deeper into SF2, used in the Exynos 2600, and TSMC’s GAAFET N2, used in Apple’s A20 Pro, in upcoming newsletter articles. We’re throwing some teasers on X. Let’s compare Samsung SF2’s MBCFET with Intel 18A’s RibbonFET. Subscribe Even to the untrained eye, Intel’s extra nanosheet is obvious. Intel stacks four ribbons to Samsung’s three. Samsung’s sheets are much wider in these fields, so both sheet count and width matter to the available channel perimeter. Sheet width also changes which silicon surfaces carry current. On conventional (001) silicon, wide nanosheets emphasize the broad top and bottom surfaces, favoring electron transport; the larger sidewall contribution in a narrow sheet favors hole transport. Thinner sheets improve gate control but increase confinement and scattering. This makes width and thickness part of the NMOS/PMOS balance, alongside strain and threshold voltage. [18], [19] GAAFET designs like 18A use different work-function-metal (WFM) stacks for NMOS and PMOS. Around each ribbon, a thin SiOx interfacial layer separates the silicon channel from the HfOx high-k dielectric, with La providing dipole tuning and the WFM wrapping the dielectric. NMOS uses a TiAl-based stack, while PMOS uses TiN WFM. W fills the remaining gate trench, providing a lower-resistivity path where the work-function layers are no longer needed. In this field, the PMOS stacks leave room for W between ribbons, while the NMOS stacks occupy more of those gaps. A silicon-based dielectric marks the P/N boundary, allowing the PMOS and NMOS gates, sharing the same gate trench, to be processed sequentially. Fast logic paths, retention circuits, and SRAM need a family of threshold options. Changing threshold without substantially changing device dimensions, capacitance or fabrication complexity is valuable. FinFET processes typically use different work-function-metal stacks. In a four-ribbon GAA stack, the narrow sheet-to-sheet gap limits how much WFM can fit around each channel. La in the gate dielectric creates interfacial dipoles at the SiOx/HfOx boundary, shifting effective work function and tuning threshold voltage. This gives Intel another control alongside its NMOS and PMOS WFM stacks. Low-threshold devices improve critical-path drive; higher thresholds reduce leakage elsewhere. Dipole tuning is especially useful in GAA because it changes threshold without consuming the narrow intersheet gap with thicker WFM. Precise control of La incorporation, diffusion and interface quality has long been a challenge, limiting viability in high volume production but is now seen from every leading-edge foundry. Intel’s patent describes depositing a dipole-forming oxide above HfOx and annealing it toward the interfacial oxide before completing the work-function and fill metals. This separates threshold tuning from the space available for metal. Newer research addresses the thermal cost: imec’s 2026 dipole-middle research inserts the shifter between two HfOx depositions, shortening the diffusion path while protecting SiOx during patterning. [20], [21]Matched-cut EDS, Intel 18A (left) vs. Samsung SF2 (right). Intel retains raised source/drain epi beneath its contacts, while Samsung recesses W deep into the epi to form a V-shaped Ti-lined interface. The deeper contact increases metal-to-semiconductor area and shortens the current path from the lower sheets, reducing contact and spreading resistance. It also removes epi volume and brings the contact etch closer to the channel ends. Retaining more epi preserves the material available for strain transfer, especially from SiGe into PMOS. These geometries balance contact access against stress engineering and etch margin. [22], [23] Samsung stacks three sheets to Intel’s four ribbons, and both processes use sheet width to tune drive strength. In our Samsung cross-sections, widths range roughly from 19 to 30 nm in the NPU rows and 37 to 50 nm in the CU cell. The Samsung nanosheets taper, with the widest sheet at the bottom and the narrowest at the top. Both processes use HfOx gate dielectric and Ti-based work-function stacks, with Al in the NMOS stack. In the Samsung devices shown here, the dielectric and WFM occupy the intersheet gaps, leaving W above the top sheet. Intel’s PMOS stack leaves more room between ribbons, and W fills those gaps while the thicker NMOS stack leaves W mainly in the upper trench. Gate-stack EDS maps. The W between Intel’s PMOS ribbons provides a conductive path close to the lower gates. Where WFM fills the entire gap, the gate still surrounds the channel, but voltage reaches it through the more resistive work-function films. Thinner WFM and dipole tuning preserve room for low-resistivity fill; Mo and Ru are alternative fill metals being developed for further scaling. [24] A masked, sequential WFM flow explains the different gate heights and inter-nanosheet fill. The proposed sequence below shows how separate NMOS and PMOS work-function steps produce that geometry. Enabled by the BSPDN process, Intel replaces the dense-logic silicon subfin with dielectric, removing the parasitic conduction path below the ribbons and reducing substrate-related capacitance. A retained silicon body as in classical, non-SOI, planar and FinFET designs needs junction and punchthrough-stop engineering to suppress leakage. Dielectric isolation makes that leakage less sensitive to the subfin doping profile but adds removal and fill steps. It also weakens the direct thermal path through silicon, making the contacts, metal stacks and package more important for heat extraction. [24], [26] Fluorine is concentrated around selected Intel device structures in the maps. WF6 is a standard precursor for W nucleation and fill, while barrier films protect adjacent dielectrics from fluorine attack. Low-fluorine W processes reduce the residual-F burden. Chloride-based precursors avoid introducing F during W deposition, but require control of chlorine attack, nucleation and fill quality. The integration target is a continuous, low-resistance W path with a thin protective liner and minimal chemical damage to the surrounding stack. [20], [27], [28] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. We measured cell height, gate pitch, metal geometry, and ribbon dimensions at the XTEM sites shown below. The tables group these dimensions by site and device polarity. Our “sheet cuts” cross the silicon channel and show the ribbons end-on. “gate cuts” run along the channel through successive gates. The 18A logic cell dimensions point to a five-track logic library while the N3E and Intel 3 cell dimensions evidence a seven-track logic library. The DDR-PHY uses wider M0 wires and much larger spacing than core logic. That trades routing density for lower wire resistance and weaker coupling between neighboring nets. The geometry suits the current delivery and coupling requirements of analog, clock, and I/O circuitry. PowerVia lets 18A combine a compact cell height with wider M0 geometry by moving the main power rails off the signal-routing tracks. That relaxes local wire scaling while preserving a small cell footprint. Cell height and gate pitch set the geometric density; pin access and routability determine how much of it a real block can use. [29] The biggest takeaway from our gate-pitch measurements is that Intel 18A compute logic and TSMC N3E GPU logic have similar density in the Bohr representative-cell model. The 18A example is 18.6% denser than the Intel 3 GPU example. Gate pitches are nearly identical across the three sites, so cell height drives most of the difference. The Bohr model combines a four-transistor NAND2 spanning three gate pitches and a 32-transistor scan flip-flop (SFF) spanning nineteen pitches, weighting their densities 60:40. The sensitivity column shows how independently changing cell height and gate pitch by ±1 nm changes the result. This compares representative cell geometries; whole-die density also depends on cell mix and placement. The 18A P-core gives M0 substantially more metal cross section than the N3E vector engine. Treating each profile as a trapezoid gives 2.63 times the area per line and 1.84 times the area after normalization by routing pitch. The larger section reduces the geometric contribution to line resistance and lowers current density for a given current. Taller and wider wires also add capacitance, so circuit delay depends on the balance of resistance and capacitance. The DDR-PHY has less metal area per routing width than the 18A core fields, while remaining above N3E. [30] Area = height × (top CD + bottom CD) / 2, including liners. Area/pitch normalizes by routing width. Taper is the symmetric sidewall angle from vertical, with the largest angle belonging to the DDR-PHY. Compute tile The measurements show how ribbon dimensions and gate-stack geometry vary across the compute tile and between NMOS and PMOS to balance channel drive, gate load and the space needed for the dielectric/WFM stack across logic, SRAM and the DDR-PHY. Width mainly changes available channel perimeter; thickness also changes electrostatic control and carrier confinement. Gate-stack thickness then determines the space left for low-resistivity fill P-core and LP E-core logic Both the P-core and LP E-core use multiple nanosheet widths. Widths are measured on high-magnification XTEMs while wider-field images demonstrate additional width choices within the LP E-core. Multiple widths are expected even within an LP E-core. Timing-critical paths, buffers and cells with different fanout need different drive strengths. The lower-magnification fields show this width diversity beyond the sites quantified in the table. L2 and L3 SRAM GAA gives SRAM designers another way to balance the pull-up (PU), pass-gate (PG), and pull-down (PD) transistors. FinFET bitcells set device strength through fin count while GAA adds nanosheet width as a sizing knob. In a 6T SRAM cell, a strong pull-down relative to the pass-gate limits read disturbance, while a strong pass-gate relative to the pull-up improves writability. During a write, the pass-gate and write driver pull the node storing “1” below the inverter trip point. During a read, the pull-down holds the node storing “0” low. Bias, threshold voltage, mismatch and assist circuitry set the remaining margin. FinFET high-current cells commonly use a PU:PG:PD fin-count pattern of 1:2:2, a device-sizing ratio rather than a current ratio. Ribbon width lets Intel balance SRAM strengths without adding whole fins. The L2 cell uses its narrowest ribbons for PU and widest for PD, improving writability and read stability respectively. Intel’s disclosed HCC operates without assist; its denser HDC uses negative-bitline write assist. Pulling the selected bitline briefly below ground increases pass-gate overdrive so it can overpower the pull-up at lower supply voltage. That buys density and low voltage writability at the cost of boosting circuitry, switching energy, and additional voltage stress that must be controlled. [31], [32] Four rectangular ribbons give the perimeter = 8 × (width + thickness), before corner rounding. PG/PU is 1.49 and PD/PG is 1.16. The L3 structures closely resemble L2 in layout and cell height. Fewer L3 nanosheet widths are tabulated because fewer high-magnification images were available. DDR PHY The DDR-PHY trades density for controlled analog behavior and reliable off-chip signaling. It contains drivers, receivers, delay circuits, and calibration logic that set drive strength, sampling time, and voltage margin. Repeated four-sheet devices with similar widths fit the use of regular transistor units for matching and programmable drive. Its wider local wiring provides room for current delivery and separation of sensitive signals, while consuming more area than a dense core-logic grid. The layout serves the memory channel’s electrical requirements as well as digital logic density. [33] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Intel 3 GPU devices Vector engine logic Intel 3’s XVE logic uses two-fin PMOS and NMOS devices with power rails in M0. Its cell height and M0 pitch give a seven-track geometry, two tracks more than the 18A logic. One-fin groups also appear among the two-fin devices. Intel 3 L2 SRAM The Intel 3 L2 SRAM uses the familiar HCC sizing pattern: one PU fin, two PG fins, and two PD fins. N3E GPU devices Vector engine logic The N3E XVE field contains repeated two-fin devices with seven-track cell geometry. N3E remains a FinFET process, giving Panther Lake a direct FinFET-to-RibbonFET comparison. N3E L2 SRAM The N3E L2 SRAM uses the same PU:PG:PD fin-count pattern of 1:2:2. Panther Lake-U follows Lunar Lake’s floorplan quite closely. Both pair 4 P-cores with 4 LP E-cores and NPU, media and display engines in similar locations. Lunar Lake also uses Xe2, the direct predecessor to Panther Lake’s Xe3 GPU. This makes Lunar Lake the most direct basis for our comparisons. Arrow Lake differs in core count and uses the older Xe-LPG GPU architecture, so we only use it where it offers a more direct component-level comparison. Compute tile Panther Lake compute-tile floorplans remain sparse even months after launch. Intel 18A’s backside metal and dielectric stack must be removed without damaging the underlying structures before a clean transistor-level floorplan can be imaged. Most published die shots hide or heavily process the background, but we are quite proud of the die shot we achieved and are excited to show the work we have done. We measured the areas of the key components on the compute tile and compared them with their Lunar Lake predecessors on TSMC N3B. These help us to capture changes in block area and compare the two chips across process nodes and designs. Our total tile areas exclude the scribe-line area. The compute-plus-GPU subtotal below uses the PTL-U compute tile and GT1 GPU; it excludes the I/O tile and passive base. Individual block areas use the boundaries marked on the floorplans The compute-plus-GPU row is recomputed from the displayed PTL-U and GT1 areas. Component rows use their stated per-region counts and are not an additive partition of the whole tile. The P-core area remains almost unchanged between Lunar Lake and Panther Lake, despite L2 capacity increasing from 2.5 MiB to 3 MiB. Arrow Lake uses the same Lion Cove core as Lunar Lake but also has a 3 MiB L2. Cougar Cove fits 20% more L2 into the same P-core area. The larger private cache keeps more of each core’s working set close to its execution units, reducing access to shared L3 and DRAM. Extra capacity adds storage leakage and lookup energy, so designers balance it against avoided lower-level accesses. The shared P-core L3 cache also shrank by 14.8%. [2] Cougar Cove combines a similar footprint with Intel’s reported power-efficiency improvements. RibbonFET’s tighter channel control reduces leakage, while PowerVia reduces supply droop and allows tighter voltage guardbands. [1] Darkmont’s four-core LP E-core cluster is 5.0% smaller than Skymont’s on Lunar Lake, with most of the reduction in its L2 regions. The 1 MiB region shrank by 8.4% and the 1.5 MiB region by 14.9%. The tag arrays also use one fewer visible row. Tags identify which memory addresses the data array holds, so rearranging them changes the cache’s layout and wiring without requiring less data capacity. [2] The LP E-cores share one L2. This pools capacity and avoids duplicating all the cache machinery, but the four cores contend for its banks and bandwidth. Their separate cluster also keeps light work away from the performance cluster and its L3, allowing that larger domain to sleep. [1], [2] Cache area includes more than the storage cells. Tags identify each line, decoders select rows, sense amplifiers read the small bitline signal, and wires connect to the banks. Splitting an array into smaller sections shortens wordlines and bitlines, improving access speed, but duplicates peripheral circuits. Panther Lake’s smaller cache regions therefore reflect the complete memory implementation, including how much of each region is devoted to storage. [34] Unlike Meteor Lake and Arrow Lake, Panther Lake has no separate SoC tile. The NPU, LP E-cores, memory controllers, PHYs, media and display engines now share the compute tile. This removes an active die and keeps CPU memory traffic on one die. The cost is moving PHY and I/O-related circuitry onto 18A: drivers, receivers and analog circuits must still meet external voltage, loading and signal-integrity requirements, so their area does not shrink like dense digital logic. [1], [2] The biggest shrink comes from the NPU, which occupies 36.9% less area. NPU 5 consolidates the same total INT8 MAC count into half as many neural compute engines. Each of the three NCEs has a larger MAC array to make the complete NCE envelope 22.6% larger than an NPU 4 engine. Consolidation also halves the number of scratchpads and SHAVE DSPs, from 12 to 6. The MAC array handles matrix multiplication and convolution, while SHAVE executes vector and custom operations that fit the array poorly. [1], [2], [35] The paired floorplans identify each NCE envelope and its scratchpad, MAC, and SHAVE regions. Each measured MAC polygon is counted once per NCE in the area accounting below. The scratchpads store weights, activations, and intermediate results near the MAC arrays, allowing repeated use without fetching them again from DRAM. Halving their number delivers the largest measured area saving but leaves less local storage for the same total MAC count. Layers that no longer fit locally require smaller working tiles or more transfers of intermediate data. The benefit depends on keeping the enlarged arrays busy while managing that tighter storage budget. [36] NPU 5 also adds native FP8. Using half the operand width of FP16 reduces storage and transfer demand, helping workloads fit the smaller local memory budget. Lower precision and format-dependent range make scaling and model validation part of deployment. Hardware activation functions further reduce work that would otherwise occupy the programmable DSPs. [1], [2] Microsoft requires an NPU to deliver at least 40 TOPS for Copilot+ PCs. Both Lunar Lake and Panther Lake meet this threshold, but Panther Lake uses significantly less silicon. GPU tiles Panther Lake is Intel’s first product with Xe3, its latest GPU architecture. It offers two different GPU tiles: a smaller GT1 tile with 4 Xe3 cores on Intel 3 and a larger GT2 tile with 12 Xe3 cores on TSMC N3E. Panther Lake allows us to compare the same GPU architecture across both Intel 3 and TSMC N3E. Wildcat Lake adds a third Xe3 implementation on Intel 18A. A future newsletter will detail Xe3 and its implementation differences across all three process nodes. GT2 scales Xe3 to a different physical layout, with render slices arranged vertically instead of GT1’s horizontal arrangement. Slice placement sets the distances to shared cache banks and the D2D interface. Those wires consume area and add delay, so scaling the number of Xe cores also requires a new balance of cache placement, routing and timing. [1] What’s immediately obvious is that the GT2 tile on TSMC N3E has much smaller Xe cores than GT1. These block areas include logic, caches, and routing. An Xe core on the GT1 tile is ~69% larger than one on Lunar Lake, and ~55% larger than one on GT2. Intel 3 therefore uses substantially more area per Xe core. The block-area gap exceeds the measured logic and SRAM density gaps, bringing routing, timing targets, cell mix, and floorplan allocation into the comparison. The measured vector/matrix engine region is almost unchanged between Lunar Lake and Panther Lake’s GT2 tile. Xe3 retains eight 512-bit vector engines and eight 2048-bit XMX engines per core. Its gains also come from feeding those engines more effectively: more resident threads hide stalls, and variable register allocation lets shaders trade registers per thread against the number of threads kept active. [1] The shared L1/SLM capacity increased by 33% from 192 KiB to 256 KiB, while its area increased only 5%, raising effective density by 27%. L1 retains reused cache lines, while software-managed SLM lets a thread group share data locally. Both reduce traffic to more distant memory. Allocating more SLM per group can also limit how many groups reside on a core at once. [1], [37] The GT1 tile carries 4 MiB of L2 against 16 MiB on the GT2 tile. GT1 divides its L2 cache into four 1 MiB banks, while GT2 uses eight 2 MiB banks. Each bank contains 128 macros, but each N3E macro stores 16 KiB, twice the Intel 3 macro’s 8 KiB capacity. The N3E macro is only 54% larger while holding twice as many bits, giving it 30% higher density: ~23.7 Mbit/mm² versus 18.3 Mbit/mm². Including bank-level circuitry, the gap widens to ~16.9 Mbit/mm² on GT2 versus ~10.4 Mbit/mm² on GT1. GT2 gains density with its macros storing more bits per unit area, and those macros occupy more of each cache bank. Larger macros spread decoder and sense-amplifier overhead across more storage, while a more compact bank layout reduces the share spent on control and routing. The compromise is longer wordlines and bitlines that carry more capacitance. [34] I/O tile Panther Lake uses two I/O tile variants, both fabricated on TSMC N6. The smaller one provides 4 PCIe 5.0 and 8 PCIe 4.0 lanes and serves lower-tier systems as well as those without a discrete GPU, while the larger one adds 8 PCIe 5.0 lanes, bringing the total to 20 lanes, for discrete-GPU connectivity. Panther Lake SKUs with the larger 10- or 12-Xe GPUs use the smaller I/O tile. [38] The smaller I/O tile adds a PCIe 4.0 block and a Thunderbolt block to Lunar Lake’s I/O layout, providing four additional PCIe 4.0 lanes and another Thunderbolt 4 port. Its repeated N6 blocks retain nearly identical areas and layouts. Reusing these proven PHYs and controllers avoids porting and requalifying external interfaces on 18A, where faster digital logic offers less benefit to circuits constrained by the off-chip link. [38] SemiAnalysis’s teardown lab (STEEL) dives deep into the world’s advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. We’re hiring technical experts from system to transistor and everywhere in between. Check out our Careers page. Panther Lake offers scalability and modularity through its disaggregated packaging that partition compute, GPU, and I/O silicon into separate tiles allowing for a suite of tile configurations. This partitioning makes the package part of Intel’s node economics as it determines how much leading-edge wafer area each product consumes, which functions can remain on other processes, and how much configuration freedom Intel can offer from a shared set of tiles. Furthermore, fabricating the compute and GPU tiles separately confines the new 18A process to the compute tile and allows graphics and I/O to use other, more established, and more cost-effective processes. For Panther Lake, the GPU and I/O tiles are assembled alongside the compute tile on a passive silicon base using Foveros-S. Intel’s current technology brief lists a nominal 36 µm pitch for Foveros-S. Through-silicon vias (TSVs) in the base connect the fine wiring above to the larger package connections below. The functional tiles sit side by side on that passive base in a 2.5D configuration. [39] Our cross-section through the compute and GPU tiles shows the package’s wiring hierarchy. Microbumps connect each active tile to the passive silicon base; its fine redistribution layer (RDL) carries the short, dense tile-to-tile links. TSVs carry connections through the base to the package substrate, which fans them out to the much coarser motherboard solder joints. The base supplies interconnect, while computation remains in the active tiles above it. [39] At the compute-tile edge, the higher-magnification inset shows a local microbump spacing of approximately 25.24 µm and a feature width of 12.33 µm. These local spacings are finer than Intel’s nominal Foveros-S value. The X-ray fields further confirm tighter neighboring bumps, consistent across every die-to-die area found on each tile. Additional X-ray analysis is offered after the paywall. Putting the memory controller beside the CPU removes the D2D transfer that CPU memory requests required in Meteor Lake and Arrow Lake. This avoids the extra transmitter, receiver, and link traversal, saving interface energy and latency. Panther Lake’s separate GPU still crosses a D2D link to reach DRAM, so its larger local caches also help contain package traffic. [1], [40] Smaller dies are less likely to contain a random fatal defect, and screening them before assembly prevents one bad tile from consuming a complete package of good silicon. Reuse also spreads design and qualification work across more products. Against those gains, Intel pays for the passive base, D2D circuits, extra bonding and test steps, and losses during assembly. Cost per working product across the portfolio captures the combined effect of wafer yield, reuse, test, and assembly. [29] Wildcat Lake packaging Intel launched Core Series 3, formerly Wildcat Lake, on 16 April 2026 for value mobile and edge systems. Wildcat Lake keeps 18A but removes the passive base and combines more functions on one die to simplify the package. The two products therefore reveal two distinct ways to commercialize the same leading-edge process. [41] Wildcat Lake’s 18A die combines up to two Cougar Cove P-cores, four Darkmont LP E-cores, two Xe3 cores and a smaller NPU. A separate platform-controller die supplies I/O, connected through UCIe, Intel’s first processor implementation of the standard. Consolidating graphics remove a tile boundary and the passive base, reducing assembly complexity for a modest-bandwidth value product. It also ties CPU and graphics scaling to the same die, giving up Panther Lake’s ability to swap in a much larger GPU. [42], [43] In July 2021, Intel CEO Pat Gelsinger set out an ambitious process roadmap aimed at regaining performance leadership by 2025, later described as five nodes in four years. Five years and one CEO later, Intel’s comeback story is not as unambiguously positive as Pat may have hoped. [44], [45] Intel once set the pace for process technology, bringing high-k metal gate technology and FinFETs into volume production years ahead of the rest of the industry. Its 22 nm FinFET process reached consumers with Ivy Bridge in 2012. [46] Intel’s integrated device manufacturing (IDM) model allowed its architects and process engineers to co-optimize products and processes. Starting with Sandy Bridge, Intel dominated x86, while AMD struggled with Bulldozer. That lead faltered at 14 nm and broke at 10 nm. Intel targeted a massive 2.7× density increase, but the node arrived years late and required several revisions before it could support Intel’s full lineup. This delay forced Intel to stretch 14 nm across six generations, while TSMC moved ahead in process technology and AMD recovered in x86. By 2019, Intel was still shipping 14 nm across most of its product stack, with its 10 nm client ramp focused on Ice Lake mobile processors. Meanwhile, TSMC was shipping N7 and N7+, and AMD’s Zen 2 compute chiplets used N7 to raise core counts and improve efficiency. Intel’s process failures were central to its decline, but unsound business decisions furthered their downward slide. Product delays compounded product mistakes, pushing client, server, and FPGA roadmaps off schedule. Several attempts to enter AI (Nervana and Gaudi) and networking (Tofino) also failed to establish lasting businesses. Intel’s recovery has focused on consumer CPUs and advanced packaging. Tiger Lake, Alder Lake, Lunar Lake and now Panther Lake have restored Intel’s consumer roadmap. On the process side, Intel 4 shipped with Meteor Lake, Intel 3 with Granite Rapids and Sierra Forest, and Intel 18A with Panther Lake. Intel has also made advanced packaging part of its foundry offering. However, Intel is still playing catch-up in servers. Several Xeon generations arrived years late and trailed contemporary AMD and Arm server CPUs in performance, efficiency, and core count. The process roadmap is back, but Intel does not hold the same process-technology leadership position it held prior to 10 nm. The introduction of gate-all-around nanosheets and backside power delivery are two of the biggest changes to transistor integration in a decade. Intel took on both changes at once: 18A paired its first RibbonFET with PowerVia in Panther Lake. Panther Lake is a substantial manufacturing milestone. Our cross-sections show how RibbonFET and PowerVia reshape local contacts and wiring, while the floorplans show where architectural consolidation and process choices save area. A sustained competitive lead depends on product performance, cost, yield, and the next implementation. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page.. 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