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Erika Alexander compares 'Reggie Dinkins' costar Daniel Radcliffe to 'a therapy dog'
'The Fall and Rise of Reggie Dinkins' star Daniel Radcliffe is a calming presence on set, but will also jump to protect Tracy Morgan from being bit by a dog.
Go the route of Coach K or Brad Stevens? Dusty May's NBA jump shouldn't shock anyone — and neither should any success he has there
Nearly All EAE Business School Grads Found Jobs In 2025, With Salaries Growing 70%
Spanish school's employment report tracks grads across master's & MBA programs, finding a pronounced tendency to ‘triple jump’.
Twins 16, Diamondbacks 8: The Beautiful Game
In the dumbest Twins game any of us will see all year, the Twins jumped out to your classic 16-0, fifth-inning lead, then handed the ball over to the bullpen to drag us kicking and screaming towards a finish line placed just ahead of 12:30 am CT. You’ve maybe never seen a former All-Star become […]
Xbox Forces PS5 Players To Jump Through Hoops To Play ‘Halo: Campaign Evolved’
PlayStation and Xbox players are getting a look at just how many hoops they or their friends have to jump through in order to play Halo: Campaign Evolved together.
Nobel-winning AlphaFold pioneer leaves Google DeepMind for Anthropic
John Jumper, a key member of the team at Google DeepMind for nearly a decade, is decamping for Anthropic.
Kansas City’s Black-owned businesses court World Cup visitors with a new shopping guide
The hope is that the World Cup, predicted to bring in more prospective shoppers than Kansas City has ever seen at once, jumpstarts long-term growth.
‘If it doesn’t work out, I’m blaming JD’: Vance’s risky gambit on Iran peace efforts
As the Trump administration neared a breakthrough in its negotiations with Iran, Vice President JD Vance jumped at the chance to be the face of a peace agreement designed to end months of unpopular war.
AMC Entertainment Stock Advances As Retail Traders Fuel Volatility Following Latest Corporate Equity Capital Raise
AMC Entertainment stock jumps 9.8% on record May attendance, CEO insider buying, and improving U.S. box office — but balance sheet risks remain elevated.
Intel Stock Jumps On Reported Apple Chip Business
Intel stock jumped after U.S. President Donald Trump said Apple has reached a chip manufacturing deal with Intel.
Why Extreme Sports Enthusiasts Keep Jumping After a String of Tragedies
Often considered thrill seekers looking for the next adrenaline hit, participants say they’re actually drawn to control and a sense of time slowing down.
Kansas City’s Black-owned businesses court World Cup visitors with a new shopping guide
Kansas City G.I.F.T, a nonprofit focused on growing Black entrepreneurship, will distribute a guide in June that features 30 Black-owned businesses. The hope is that the World Cup, predicted to bring in more prospective shoppers than Kansas City has ever seen at once, jumpstarts long-term growth.
A Google veteran who founded character.AI is jumping to OpenAI
Noam Shazeer, a co-lead at Gemini and the founder of Character.AI is leaving Google to join OpenAI in the latest AI talent war move.
You won't be able to buy iPhone 19 as Apple reportedly plans jump to iPhone 20 next year
To celebrate 20 years of iPhone, Apple plans a radical design change for 2027.
Seattle business group says JumpStart tax is pushing jobs, investment toward Bellevue
Seattle’s payroll tax was created nearly six years ago with a promise to tax the city’s highest-paid workers and use the money to help with economic recovery
Congo reports 72 new Ebola cases Sunday, one of the largest daily jumps since outbreak was declared
Nearly a million people have been displaced by years of conflict in the region, complicating efforts to contain the outbreak.
Stars react to Knicks NBA Finals win: Timothée disses Oscars, Cardi B screams, Ben Stiller sprints, and more
Timothée Chalamet shades the Oscars, Ben Stiller jumps into director more, Jennifer Lopez screams at the top of her lungs, and more in EW's roundup of the starriest reactions to the Knicks becoming NBA champions for the first time in 53 years.
Congo says 782 Ebola cases confirmed, two new health zones affected
The number of confirmed Ebola cases in Democratic Republic of Congo has increased to 782 after 72 new cases were documented in 24 hours, one of the biggest single-day jumps during the ongoing outbreak, government data showed on Sunday.
Is SMIC N+3’s Metal Pitch Smaller than Intel 18A’s?
Almost four years ago, we published that SMIC had started shipping 7 nm (N+1) chips. Now, SMIC is shipping its third-generation 7 nm (N+3) process in Huawei’s Kirin 9030, with a minimum metal pitch of 32.5 nm, about 10% tighter than the 36 nm minimum metal pitch shipping in Intel’s latest Panther Lake CPUs on 18A. The headline is true, but incomplete cherry picked metric. N+3 reaches the density of TSMC N6 through aggressive DUV multi-patterning and design-technology co-optimization (DTCO), but it pays for that in complexity, efficiency and process control. We found this and more in our reverse engineering and teardown where we cover SMIC’s N3 process technology, Huawei’s packaging, memory, architecture, and more. SemiAnalysis has been building a state-of-the-art teardown lab in Oregon capable of analyzing the world’s most advanced and important chips over the last year and half. We have already generated revenue on advanced datacenter chip teardowns including our recent reverse engineering of a major TSMC customer’s COUPE CPO optical engine + EIC 3D stack. This is the first public report from the SemiAnalysis Teardown Engineering & Evaluation Lab, or STEEL for short. The lab is aggressively scaling up and out and we’re excited to announce it publicly. This is a bit of inconvenient timing for TechInsights as they are private equity owned and currently being sold while having enjoyed virtually no credible competition for decades. This has led to TechInsights underinvesting in CAPEX. SemiAnalysis exceeds TechInsights in revenue despite no venture or private equity ownership and being founded only 6 years ago. Because we have no external investors and are founder led, we move faster, build faster, and we can release client chip teardowns for free regularly, while focusing on datacenter for our major clients. Here’s the first public image from our lab, the HiSilicon Kirin 9030 Pro SoC: This report will detail our teardown of the Kirin 9030 and our findings on SMIC’s N+3 process, the most advanced in China. For comparison, we’ll show our teardown of the MediaTek Helio G99, made on TSMC N6. Through this comparison, we can look at the effect of export controls – SMIC N+3 and TSMC N6 are comparable nodes, but one is heavily export-controlled, the other free to use the West’s most advanced equipment. Here we see both China’s progress and constraints. SMIC N+3 reaches TSMC N6-class logic density, but it requires far more aggressive DUV multi-patterning, so it does not match N6 on process maturity or cost. The Kirin 9030 Pro performs similarly to three-year-old Android flagships, and trails far behind the current flagship SoCs from Apple, Qualcomm, MediaTek, and Samsung. The efficiency gap is even wider. Export controls have not stopped Huawei and SMIC from shipping advanced silicon, but they have forced a different path. Without EUV, SMIC is leaning harder on DUV multi-patterning, DTCO, and increasingly complex integration. The roadmap continues forward through tighter design rules and backside power, but each step adds cost and process risk. Huawei’s τ scaling and LogicFolding show another path: stacking active logic and recovering density through advanced packaging and system-technology co-optimization (STCO). To understand the Kirin 9030, we must first understand Huawei’s SoC history. HiSilicon is Huawei’s chip design arm, responsible for the Kirin smartphone SoCs, Kunpeng server CPUs, Ascend AI accelerators, and switch/router networking silicon. Before export controls, Huawei was TSMC’s largest customer – the only customer on TSMC’s first EUV node, N7+, and among the first on N5, alongside Apple. That ended in late 2020. Huawei switched to Qualcomm SoCs in its flagship smartphones, though export controls limited them to 4G-only variants. In late 2023, Huawei returned to in-house silicon with the Kirin 9000s, a successor to the Kirin 9000, fabricated on SMIC N+2 instead of TSMC N5. In the following years, they released the Kirin 9010 and 9020 on the same N+2 process. These chips used Huawei’s in-house TaiShan CPU cores and Maleoon GPU. We have not torn down a Kirin 9020 ourselves, so the predecessor die shot is from Kurnal. The die shots show how Huawei spent its silicon budget: which functional blocks are where, and how their areas compare to the predecessor. First, a quick guide to the major blocks on the die. The total die area is nearly identical, but the 9030 uses that area more aggressively. A denser process lets Huawei fit an extra middle CPU core, more GPU and NPU cores, and larger caches into the same footprint. In contrast, the Helio G99 is a much smaller, low-cost SoC, built for budget smartphones rather than a flagship device. While the Kirin 9030 is ~140 mm², the G99 is only ~29 mm², roughly one-fifth the area. The underlying TSMC process technology, however, is directly comparable as a baseline for analyzing SMIC’s. The Kirin 9030 is an evolutionary refresh, not a clean-sheet design. Its CPU, GPU and NPU cores carry over the 9020’s families, and the gains come from three levers: the SMIC N+2-to-N+3 process step, DTCO and floorplan work, and incremental microarchitecture. Area is where the first two show up, and the 9030 scales well here. Performance and efficiency are the harder test. Huawei’s design holds up better than its node would suggest, but the chip still trails, both because N+3 sits behind the leading-edge nodes and because its cores, while competent, remain a few generations behind the newest designs. The new prime core is an incremental update. The main changes are a 10% frequency increase from 2.5 GHz to 2.75 GHz and a doubling in the L2 cache from 1 MiB to 2 MiB. Despite the increased cache, the core size decreased by 7.6%. Excluding the private L2 cache, the core size decreased by 21%. This is a large reduction for an incremental node. Compared with the TaiShan New V120 core in the Kirin 9020, the Kirin 9030’s middle core is almost unchanged architecturally, yet each core shrinks by ~22%. Most of that comes from the move from N+2 to N+3, with layout likely accounting for the rest. Visually, the most noticeable change is the increase from 3 middle cores to 4. There is also a 20% increase in the shared L3 cache of the big cluster. This helps to improve multi-core performance without sacrificing much in terms of area. Even with each core shrinking, the big CPU cluster’s total area is essentially unchanged. The per-core savings went back into an additional middle core and larger caches. The tiny cores shrank less than the prime core (excluding its L2 cache) and less than the middle cores. This is likely because fixed overhead is a larger share on a small core. We cannot resolve any architectural changes from the die shot alone, but the per-clock and efficiency gains shown below point to more than pure process and layout scaling. The area reduction was offset by a doubling of the shared L2 cache from 2 MiB to 4 MiB, leaving the total tiny CPU cluster area slightly larger. Area is the easiest improvement to see from a die shot, but it is only one part of PPA (power, performance, area). For modern logic, power and performance matter just as much, and often more. Since Dennard scaling broke down in the mid-2000s, voltage and frequency have not scaled in step with transistor dimensions, so each node has had to fight harder for gains in performance and efficiency. The starkest comparison is not Kirin 9020 versus Kirin 9030 Pro. Apple’s efficiency cores run circles around Huawei’s prime core. Apple’s low-power core delivers 20% higher integer performance while drawing only 1 W, compared with 4.5 W for Huawei’s prime core. N+3 matches TSMC N6, but N6 is several generations old. Apple and Qualcomm build on N4 and N3P, which are denser and sit on a better voltage-frequency curve, giving them a larger transistor budget and more performance per watt. The 9030’s own cores did improve. The middle and tiny cores gained 17% and 14% in per-clock integer performance over the 9020, with floating-point flat on the middle core and up 11% on the tiny. The tiny core improves cleanly, with performance rising while power falls and efficiency increases by 45% in integer and 24% in floating point. The middle core is mixed: integer performance rises but power rises faster, cutting integer efficiency by 7%, while lower power lifts floating-point efficiency 16%. Per-clock gains at the same or lower frequency are microarchitectural, so the cores are tuned, not just shrunk. Both also failed to hold their rated maximum frequencies, pointing to thermal, power, or stability limits. Per clock, the middle core sits around Arm Cortex-A720 and the tiny core near the Cortex-A520; absolute performance trails because Huawei clocks them much lower. The prime core is roughly Cortex-X2 class per clock, a 2021 design. Apple’s 2020 M1 Firestorm core is still 35% higher per clock and 57% faster in absolute integer performance at a similar 4.5 W. The current leading edge is further ahead again: the Apple M5 P-core is 60% higher per clock and 2.7× faster, the Arm C1 Ultra 45% higher and 2× faster. Matching older high-end cores per clock is a genuine design achievement. What Huawei cannot match is the voltage-frequency curve and transistor budget of leading-edge nodes, which let Apple, Qualcomm and others spend more transistors in the same area on wider cores, larger caches and deeper buffers while running at lower voltage. Huawei’s LogicFolding roadmap is one answer, stacking active logic to recover density and shorten signal paths. We return to it later. The GPU compute units (CUs) changed more visibly than the CPU cores, moving to a more rectangular layout for both the arithmetic logic unit (ALU) clusters and the CU overall. Even with ray-tracing support added, a CU shrank ~28%. However, that shrink is offset by the increase from 4 to 6 CUs and the area outside the CUs grew 33%. Overall, the GPU cluster is larger by ~10%. The GPU is where Huawei makes its biggest gains. The Maleoon 935 is not competitive with current flagships, but it is a large step up from the 920 and reaches older-flagship territory. In 3DMark it is 70% faster in Wild Life Extreme (WLE) and 79% faster in Steel Nomad Light (SNL) than the 920; with 11% higher clocks and 50% more CUs, the ~67% theoretical uplift roughly matches WLE and is beaten by SNL. It edges ahead of the Snapdragon 8+ Gen 1 in WLE and SNL, and the Dimensity 9200 and Apple A16 in WLE, but stays far behind newer parts: the Snapdragon 8 Elite Gen 5 and Dimensity 9500 are ~2.4–2.6× faster in WLE and ~3.2× faster in SNL. The Maleoon 935 is Huawei’s first GPU with hardware-accelerated ray tracing; there it lands slightly ahead of the Exynos 2200, and on par with the Apple A16, with current flagships up to 3.7× faster. The Neural Processing Unit (NPU) saw the largest structural changes of any block, moving from a Lite and a Tiny core in the Kirin 9020 to a Lite and two Tiny cores in the Kirin 9030. Both core types also show significant layout changes. This is a reversal in Huawei’s NPU design. The Kirin 9000 5G, its last flagship chip on TSMC N5, used two Lite and one Tiny core. The series of SoCs on SMIC N+2 moved to one Lite and one Tiny core, likely for area savings. With the Kirin 9030, Huawei has shifted back toward a larger multi-core NPU cluster, but with the additional area going to a Tiny core rather than a Lite core. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Before diving into the process stack, the package and memory are worth separating from the SoC itself. The Pro variant of the Kirin 9030 carries 12 GB of Samsung DRAM, with two stacks of four dies each. The dies were identified as the K4L2E165YD, a 12 Gb LPDDR5X-9600 device fabricated on Samsung’s 1a node, the fourth generation of its 10 nm-class DRAM after 1x, 1y and 1z. 1a has shipped in volume since 2022, so this is current memory rather than older-node inventory. The 16 GB Pro Max variants we obtained were found with both CXMT and Samsung packages. The CXMT package is marked CXDD7JEDM, with two stacks of four dies, packaged in week 45 of 2025. The inferred die dimensions from X-ray computed tomography (CT) are consistent with a known density of ~0.3 Gib/mm² for the CXMT G4 process, roughly equivalent to other manufacturers’ 1z processes. The Kirin 9030 uses a typical integrated package-on-package (iPoP) stack: multiple DRAM dies in a memory package sit above an organic redistribution layer (RDL) interposer, which sits above the SoC and package substrate. The full package is then mounted to the printed circuit board (PCB) through ball-grid array (BGA) solder bumps. The memory package substrate is a thin bismaleimide-triazine (BT) laminate carrying the LPDDR5X stack. The organic RDL interposer over the SoC routes the PoP signals around the die and carries possible dummy thermal copper pillars. The package substrate, a thicker Ajinomoto Build-up Film (ABF) build-up over a BT core, fans the flip-chip bumps out to BGA pitch and embeds the power planes. The whole stack is organic. The only silicon is the SoC and the LPDDR5X dies; there is no silicon interposer. Keeping it all-organic brings the package’s coefficient of thermal expansion (CTE) close to the PCB’s, reducing board-level warpage, and avoids the cost of a silicon interposer the SoC’s bandwidth does not need. In an iPoP stack, the memory package connects to the organic RDL interposer through an array of solder bumps. Underfill fills the gap around those bumps, adding stiffness and protecting the joints from mechanical stress. The Pro and Pro Max variants differ here, which we cover behind the paywall. The die shot and architecture tell us how Huawei allocated its silicon budget. The process tells us what SMIC can manufacture. We use the Helio G99 as the process reference for TSMC N6. Both SMIC N+3 and TSMC N6 are evolutions of previous 7 nm-class nodes. We used targeted TEM cross-sections through logic and memory regions, imaged in both fin-cut and gate-cut directions. Each cross-section caption gives its horizontal field width (HFW), the real width of the imaged area. We start at the transistor fins, then move up through standard cells, local interconnect, and SRAM. SMIC has not overtaken Intel or TSMC. It uses aggressive DUV scaling and DTCO to reach N6-class density, but that density doesn’t translate into comparable performance and efficiency, for two reasons: the node gap to leading-edge nodes, and Huawei’s core designs. Fin Profile One of the most important knobs in a FinFET process is the fin profile: the shape of an individual fin and the channel where current passes from source to drain. The ideal fin is tall, narrow, and nearly vertical. A taller fin increases effective channel width, while a narrower fin improves electrostatic control by thinning the body the gate must control. Push either too far, and the process pays for it: weaker drive current, fragile fins, taper, footing and line-edge variation that hit yield and device variability. The Intel 22 nm, 14 nm, and 10 nm fin cross-sections show how FinFET nodes have improved over time. 22 nm fins were a first-generation structure, relatively short, wide and strongly tapered. The shape limits current density and reduces gate control uniformity across the height of the fin. At 14 nm and 10 nm, Intel pushed the fins taller and narrower while also making the sidewalls more vertical. Rather than shrinking the device, these changes increase the effective channel width per fin and improve electrostatic control. The trade-off is that taller fins at tighter pitches are much more difficult to manufacture. Now, let’s compare the Helio G99 on TSMC N6 with the Kirin 9030 on SMIC N+3. Both processes are in the same class, with fin pitch of 30-32 nm on N+3 and 34 nm in our N6 cross-section. The pitch for N6 is especially interesting as N7’s HD library is generally listed with a 33 nm fin pitch, and N6 did not shrink pitches directly. Its density gains came from DTCO instead of tighter pitches. The 34 nm pitch was stable across our sampled region and serves more as a comparison against the SMIC N+3 we have not investigated further. Pinning down N+3’s fin patterning scheme takes more than one core unit. The CPU cores show a dense ~32 nm pitch, with the pitch between N-P fin pairs alternating between 78 and 88 nm. Logic alone may be consistent with dual-pitch mandrels of 120 and 110 nm, but this is a complex and unusual approach. Combining the pitch from the the 8T SRAM, which has more complex repeat unit, with the CPU core sequence allows us to reverse engineer the patterning steps with more confidence. As both the logic and SRAM should share the same base grid, a single CD mandrel lithography pattern with 128 nm pitch undergoing SAQP produces a die-wide ~32 nm grid (128 nm/4), which supports the pitch sequencing seen in both logic and SRAM cells. In the sampled cross-sections, N+3 shows a taller, narrower, higher-aspect-ratio fin than N6. The measured fin aspect ratio is ~9.5:1 on N+3 versus 7.8:1 on N6. N+3 also shows less top rounding, with an estimated radius of ~2 nm, compared with 2.8 nm on N6. Even though the fin widths differ, the ratio of top rounding to fin width tells the same story, with N+3 at 0.37 and N6 at 0.44. In a geometric sense, lower is better; a perfectly rectangular fin would have no top-rounding penalty. These are single-digit-nanometer features measured from a handful of cuts, so treat the absolute numbers as approximate. The important result is the relative gap: N+3’s fins are consistently taller, narrower and less rounded than N6’s. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Standard Cell A standard cell is the basic building block of chip layout: a fixed-height row pairing one NMOS and one PMOS transistor that share a gate, tiled in a grid to build logic blocks. The key dimensions are contacted gate pitch (CGP), cell height (CH), fin count, and the lower-metal routing grid. To measure density, we use the Bohr metric: a weighted average of NAND2 gate area (60%) and scan flip-flop area (40%). This represents a realistic mix of combinational and sequential logic. This metric has its limitations, especially for complex cell layouts like TSMC’s FinFLEX, which alternates cells with different fin counts. Even so, it is the best metric for a pure process-level comparison. Another important measurement is the fin pitch; it refers to the distance between two fins of the same transistor. In a FinFET process, multiple fins are used in each transistor to increase the drive current and thus performance. TSMC N6 ships both a high-density (HD) library with 2 PMOS and 2 NMOS fins per cell, and a high-performance (HP) library with 3 of each. More fins under the shared gate mean more effective channel width. HP cells switch harder at the cost of area. Designers mix the two on a die, primarily spending HP cells on timing-critical paths, and matching their PPA targets. In the Cortex-A55 core of the Helio G99, we found a cell height of 240 nm for the HD cell. MediaTek has used HD cells in the G99 to minimize die size and thus cost. As an SoC for budget smartphones at ~$100, this is essential. By contrast, we found only one library in the Kirin 9030, with 2 NMOS and 2 PMOS fins. This suggests a narrower library strategy than TSMC N6, where both HD and HP libraries are widely used. This likely reflects the smaller customer base and the more constrained domestic design and electronic design automation (EDA) ecosystem. In all three CPU cores of the Kirin 9030, we found cell heights of 228 nm, 5% smaller than on N6. This is also a reduction of 9.5% over SMIC N+2’s cell height of 252 nm. SMIC N+3 and TSMC N6’s HD library both feature a CGP of 57 nm. For SMIC, this is a 9.5% shrink over N+2. In the past, CGP and cell height alone may have been enough to compare transistor density. Now, however, we must consider scaling boosters and DTCO as well. SMIC’s density gain does not come from EUV. It comes from using every available DTCO booster aggressively. First is fin depopulation: reducing the number of NMOS and PMOS fins in each cell. The first FinFET nodes started with 3 or 4 fins for each transistor. SMIC N+3 and TSMC N6 HD both use only 2 fins per transistor, trading drive strength for density. Next is contact over active gate (COAG). By landing the gate contact directly over the active gate, instead of out over the isolation region, the cell height drops. N+3 integrates COAG while N6 does not. Our N+3 gate-cut cross-sections indicate COAG, with the gate contact sitting over the active region, while N6 shows an off-gate contact. Last is single diffusion break (SDB). Diffusion breaks are inserted between cells in the same row to provide electrical isolation, but they also introduce local layout effects (LLE), layout-dependent shifts in electrical characteristics. In the past, a double diffusion break was used, consuming the space of two CGPs. SMIC N+3 and TSMC N6 instead use SDB, saving area but increasing LLE sensitivity. This must be controlled at the process level and accurately modeled in the process design kit (PDK) so that EDA tools can account for it. Overall, SMIC N+3 has a transistor density of 113.4 MTr/mm², slightly above TSMC N6 at 107.7 MTr/mm². Even without EUV, SMIC has achieved density beyond TSMC’s mature N6 node which utilizes EUV. Metal Stack The smallest critical dimension in the teardown is M0; SMIC N+3 uses a 32.5 nm local metal pitch. That is smaller than the 36 nm M0 pitch on Intel 18A in Panther Lake. However, this does not mean that SMIC has a better process than Intel 18A or TSMC N3P. M0 is a local intra-cell routing layer. Its usefulness depends on the full interconnect stack: M1 and M2 pitch, track count, via and line resistance, design rules, mask count, overlay control, and routing flexibility. The 32.5 nm M0 is consistent with self-aligned quadruple patterning (SAQP), whose four-population line-width loading we read coarsely as alternating widths of 21.5 to 24 nm; M1 and M2, at 38 and 40 nm, are consistent with self-aligned double patterning (SADP), a single A/B split. On TSMC N6, M0, M2, and M3 sit at a relaxed ~40 nm and are consistent with SADP-class double patterning, with no need for quadruple patterning. That said, we measure M2 for example at ~43 nm, likely inflated by sparse routing. We do not assign any specific layer to EUV from our cross-sections; the distinction we can draw is double versus quadruple patterning, not lithography wavelength. Transistor-level density in the front-end-of-line (FEOL) sets an upper bound, but the design is ultimately limited by what the interconnect stack can route. The lowest metals are the most important for standard-cell density, but the semi-global and global layers determine how usable that density is at the block and chip level. Two axes are commonly used for chip cross-sections: the fin-cut and the gate-cut. The micrograph above is a fin-cut and shows metals 0 through 3. This axis lets us see the even-numbered metals, with M0 right above the fins. There are two kinds of M0 lines. The first are the power rails; these are wide wires for the VDD and VSS running horizontally at the top and bottom edges of each standard cell. The wide wires measure 55 nm across, more than double the other M0 lines. Their width minimizes resistance and reduces IR drop. The second kind are intra-cell wires, short segments within the cell that connect terminals to M1. These have alternating widths between 21.5 and 24 nm. The M0 pitch is 32.5 nm, a 19% reduction versus N+2 and N6. At this pitch, DUV patterning requires more aggressive multi-patterning, increasing mask count, overlay sensitivity, process complexity and cost. M0 is below what a single DUV-defined spacer (SADP) can resolve, so SMIC cascades a second spacer step (SAQP). The cross-section reflects the cost: the M0 trenches are visibly more re-entrant (narrower at the bottom than the top) than M1 or M2 on the same chip and carry a bright barrier-rich foot where the trench meets the etch-stop layer. That shape is partly the intended damascene profile, as a slightly narrow bottom helps void-free copper fill, but its magnitude at M0 is driven by the tight pitch and the higher trench aspect ratio. Intel 18A supports an M0 pitch of 32 nm, although Panther Lake has only shipped with a looser 36 nm pitch. This is due to Intel’s heavy usage of HP libraries. Among leading-edge nodes, 18A has the loosest M0 pitches due to PowerVia. With power routing moving to the backside, congestion is reduced, and the entire front-side metal stack can be used for signal routing. M2 is the first true inter-cell routing layer. It runs horizontally like M0 but spans across multiple cells to carry block-level signals. The M2 pitch sets the cell’s track height – the number of M2 tracks that fit between the VDD and VSS rails, defining what the library calls a 6-track or 7.5-track cell. This layer is the most important, limiting the routing of entire blocks. SMIC N+3 features a 5.7-track cell. The M2 pitch is 40 nm, a 5% decrease over N+2 and the same as N6. This shrink keeps the pitch at the edge of what is possible with double patterning. Future nodes will need to increase the number of masks for M2 as reducing the number of tracks is much harder due to the limitations in routing. The micrograph above is in the perpendicular direction, the gate-cut, and shows metals 0 through 4. This allows us to see and measure the odd-numbered vertical metal layers. The M1 pitch is 38 nm, 9.5% less than N+2 and 33% less than N6. The M1-to-gate ratio matters because it sets local routing flexibility. N+2 and N+3 use a 3:2 ratio, while N6 uses a 1:1 ratio, explaining the huge differences in M1 pitch. The more M1 lines there are compared with the gates, the more flexibility there is for power and signal crossing within the cell. Routing flexibility enables more complex and better cells. Clean fractional ratios are also preferred as a grid is periodic and improves layouts. The 3:2 ratio gives SMIC more local routing flexibility than a strict 1:1 grid, but it also complicates layout and patterning. This is a DTCO choice, with SMIC increasing process complexity to recover density and routability without EUV. This 3:2 ratio is not very popular in the leading-edge nodes. TSMC has only used it on N7+, the N5 family, and the short-lived N3(B). They have switched back to a 1:1 ratio for N3E. Intel has only used it on the 10 nm/Intel 7 family, with Intel 4, 3 and 18A all using a 1:1 ratio. Samsung is the only one still using a 3:2 ratio at the leading edge, using it in the SF4 and SF3 families. It remains to be seen if SMIC will remain at a 3:2 ratio or move to a 1:1 ratio with its future nodes. The industry is still actively exploring these local-routing ratios. At VLSI 2026, imec will be presenting work on even higher ratios, including a 2:1 scheme that can reduce area by up to 14%. We will be covering the conference in a future newsletter article. Subscribe We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. The final local interconnect layer for N+3 is M3, with a pitch of 44 nm. The M3 pitch is the same as on N+2 and 10% larger than on N6. The semi-global layers carry the majority of block-level signal routing. They have a coarser pitch than the lower local layers. On leading-edge nodes, they are designed to sit at the limit of DUV single patterning. M4 through M11 pitches were found divided between 80–82 nm (M4–M6), 128 nm (M7–M10), and 148 nm (M11). Given limited sampling, it is possible these are divided further in dense routing areas. At the top are two giant metal layers, M12 and M13. These have kept the same pitches as N+2 at 1920 nm and 4600 nm respectively. While the lower layers’ pitches are generally fixed by the process and library, the upper layers vary much more in pitch and count, depending on the design. Even two smartphone SoCs on the same process can have wildly different metal stacks. The Helio G99 carries fewer routing layers, reaching coarse metal pitches of 850 nm by M9, while the larger and higher-performance Kirin 9030 keeps fine pitches until M11. SRAM At the leading edge, SRAM is much more difficult to scale than logic. TSMC’s latest nodes have seen little to no bitcell scaling, while logic still has more DTCO levers to pull. While looking for other logic libraries in the GPU compute units, we stumbled upon the SRAM. The most common type of SRAM has 6 transistors (6T), but this cell had 8 transistors (8T) instead. 8T SRAM adds two transistors to form a dedicated read port. Unlike a 6T cell, where reading disturbs the storage, the decoupled read port removes read-disturb, improving read stability and letting the cell be pushed harder for performance. At first glance, the cut looked like an unusual logic library, with each cell row having 3 fins of one polarity and 5 fins of another. The rows also alternated in orientation. Energy-dispersive X-ray spectroscopy (EDS) resolved our confusion. The cut had not landed on the GPU logic, but on the SRAM macro beside it. The unusual fin pattern was due to the SRAM library. We return to EDS in the process flow analysis behind the paywall. SRAM libraries are not like traditional logic libraries. Due to the unequal number of PMOS and NMOS transistors, they require specialized rules and layout libraries. They do not need the flexibility of logic libraries, so they are hyper-optimized for one purpose: dense, reliable memory. The SRAM cell we found is a 1:2:2-2:2 cell. This means there is 1 fin per pull-up (PU) PMOS transistor, and 2 fins per pull-down (PD) and pass-gate (PG) NMOS transistor. These 2 PU, 2 PD and 2 PG transistors would usually form a single 6T high-current cell (HCC). An 8T HCC adds a read-pull-down (RPD) and a read-pass-gate (RPG) NMOS transistor, each with two fins. We measured a cell height of 406 nm, which brings the bitcell size to 0.0463 µm². That is a theoretical peak density of 21.6 Mib/mm². We estimate that a 6T HCC would have a cell height of 292 nm and a size of 0.0337 µm². This is ~12% larger than a 6T HCC on Intel 3 and 4. We also estimate the 6T high-density cell (HDC) to have a cell height of 228 nm and a size of 0.0260 µm². This is coincidentally the same as the logic standard-cell height measured earlier. The estimate puts the cell near Samsung 7LPP/5LPP and slightly below TSMC N7/N6. That is a theoretical peak density of 38.5 Mib/mm². 6T HDC is arguably the most important cell as it is used for the largest caches in a chip, the L3 caches and system-level cache (SLC). Both the Kirin 9020 and 9030 have split the SLC into 4 banks to raise total SLC bandwidth. In the Kirin 9030, the SLC increased from 2 MiB to 3 MiB per bank. Correspondingly, the number of arrays within the bank also increased by 50%, from 16 to 24. Each array can store 128 KiB and forms an orderly pattern on the die shot. From the Kirin 9020 to the Kirin 9030, the area of a 128 KiB SLC array decreased from 0.0477 mm² to 0.0392 mm², an 18% shrink. The achieved density is 25.5 Mib/mm², 66% of the theoretical maximum. While the SLC was quite similar across both chips, the L3 has seen some major changes, particularly in terms of its layout. The total capacity also went up from 10 MiB to 12 MiB. Much like the SLC, the L3 is also split into 4 banks. In the Kirin 9020, an L3 bank consisted of 16× 128 KiB arrays and 16× 32 KiB arrays. However, an L3 bank in the Kirin 9030 instead consists of 48× 64 KiB arrays. In the Kirin 9020 L3, a 128 KiB array was 0.0513 mm² and a 32 KiB array was 0.0154 mm². The size of the 128 KiB array is different on the L3 and SLC as the assist circuitry for the two arrays differs depending on their purpose. In the Kirin 9030 L3, a 64 KiB array is 0.0210 mm². Although not a like-for-like comparison, normalized for capacity, it is 18% smaller than the 9020’s 128 KiB L3 array and 31% smaller than its 32 KiB L3 array. The achieved density is slightly lower than the SLC, at 23.8 Mib/mm², 62% of the theoretical maximum. Unlike the L3 and SLC, the prime cores’ private L2 cache uses a 2-bank design. As the prime cores’ L2 is latency-critical, it likely uses 6T HCC instead of 6T HDC. The 9020 has 16 arrays in each bank while the 9030 has 32. Each array has a capacity of 32 KiB. A 32 KiB array in the L2 shrank from 0.0171 mm² to 0.0142 mm², ~17% smaller. The density is 17.6 Mib/mm², ~59% of the theoretical maximum for 6T HCC. SRAM scaled well from N+2 to N+3, shrinking by ~19%, close to the theoretical logic shrink. The caveat is that N+2’s bitcells were unusually large, bigger than comparable 7 nm-class nodes, so part of the gain is catch-up rather than true scaling. With the insights from STEEL’s teardowns, we will be doing a deep dive into SRAM in a future newsletter article. Subscribe Everything above came out of a single STEEL teardown: die annotation, block-level area analysis and TEM cross-sections through logic and SRAM. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Future Roadmap The same cross-sections that pin down N+3 also show where SMIC can go next. Although N+3 is already close to the practical limits of DUV multi-patterning in several layers, SMIC still has a few scaling levers left. A theoretical N+4 would likely start with cell height. N+3 uses 5 M0 tracks between its power rails. Moving to 4 M0 tracks, as on SMIC N+2 and TSMC N6, could reduce cell height by roughly 15%. The routing grid is only one side of the shrink; the front end also must fit into the smaller cell. One possible FEOL lever is reducing the p-to-n isolation spacing from two diffusion grid units to one. Intel used this scaling booster on Intel 4, and TSMC did so on its N3 family. This path trades layout flexibility for density. Fewer M0 tracks reduce local routing resources, while tighter p-to-n spacing raises integration and design-rule difficulty. M2 is also constrained by the cell height shrink. For SMIC to maintain a ~5.7-track cell, M2 would need to move toward ~35 nm. That would move another layer into SAQP territory. SMIC could also reduce the CGP from 57 nm to 54 nm. Intel reached a similar CGP on Intel 10 nm/Intel 7 without EUV. The local interconnect is also tougher. If SMIC keeps the 3:2 M1-to-gate ratio, M1 would need to shrink to 36 nm and would likely require SAQP as well. If SMIC moves to a 1:1 ratio, M1 could relax to 54 nm, but it would give up routing flexibility. Under this theoretical path, we estimate that SMIC N+4 could reach a cell height of 198 nm and a CGP of 54 nm, implying a Bohr density of 137.8 MTr/mm², on par with TSMC N5 or Samsung SF4. However, the difficulty is cumulative. Each step is individually plausible, but together they make N+4 harder than the transition from N+2 to N+3. It will likely take longer, cost more, and carry less process margin. A theoretical N+5 would require a larger integration shift. One possible path is backside contacts (BSCon), moving power routing and source/drain contacts to the backside, which would reduce front-side routing pressure and enable another reduction in cell height. The front-side metal pitches could relax to reduce the process complexity. M0 would likely relax slightly to ~34 nm, and M2 and M4 pitches could relax further. CGP is unlikely to shrink much further. Even with EUV, 48 nm has been the practical limit for yield and process control. This approach would allow N+5’s cell height to fall to 170 nm and its CGP to 53 nm. This implies a Bohr density of 163.6 MTr/mm², on par with Intel 18A’s HP library. However, this would not make N+5 cost-competitive with the leading edge. It would reach a similar density through a much more expensive route. The integration difficulty rises sharply, with new process flows for backside alignment, wafer thinning, contact reveal, and backside metallization. Past this point, standard density and interconnect scaling become increasingly unattractive. That is where Huawei’s roadmap stops looking like a normal foundry roadmap and starts looking like a packaging roadmap. At ISCAS 2026, Huawei unveiled its tau (τ) scaling law, reframing process scaling in the time domain. τ is the time cost of data movement and processing: switching delays in transistors, RC signal propagation delays in circuits, compute, memory, and networking latency. Outside Huawei’s terminology, this is called system-technology co-optimization. This is Huawei’s answer to its lack of EUV lithography. Without EUV, planar density cannot keep pace with TSMC, Intel, or Samsung. If transistor density cannot shrink further, Huawei’s alternative is to shorten wires, reduce buffering, and stack logic vertically. “LogicFolding”, Huawei’s implementation of this new scaling idea, is, in practice, an aggressive 3D stacking approach. AMD V-Cache places SRAM above or below a CPU die. AMD’s MI350X places active interposer dies (AIDs) underneath accelerator and compute dies (XCDs), with the AIDs handling cache, IO interfaces, the network-on-chip (NoC) and embedded metal-insulator-metal (MIM) capacitors. With LogicFolding, parts of the same logic block are split across multiple active dies bonded face-to-face at ultra-fine pitch. This allows Huawei to shorten some critical paths and reduce buffer overhead, not merely add cache capacity or offload the IO and interconnect. Shortening wires is where the higher clocks come from. A large share of a modern core’s delay and energy budget goes into driving long interconnects and the repeater buffers along them. LogicFolding distributes a block’s critical-path gates across multiple stacked tiers bonded at a very fine pitch, so the bond interface behaves like an additional metal layer and the longest paths get shorter. That is how Huawei expects to recover frequency and efficiency it cannot get from the process alone. Huawei’s roadmap shows its intent. Prime core frequency is targeted to rise from 2.75 GHz in the Kirin 9030 to roughly 5 GHz by 2031, far beyond what planar scaling alone could deliver. Prime cores with 3.1 and 3.39 GHz clocks are being tested in its labs, although their power consumption is unknown. Beyond that, chips are in the design, simulation or pathfinding phase, meaning the frequencies are targets. However, the direction matters more: LogicFolding also helps with performance, not just density. The catch is that Huawei’s density claim is not directly comparable to foundry densities. A stacked design can report more transistors per package footprint by adding active layers, even if each patterned die remains well behind TSMC or Intel in front-end density. This is how Huawei can claim to reach foundry 14A-equivalent density by 2031. This is not a like-for-like foundry comparison, with Huawei using stacked logic and measuring density per package footprint. On a normalized Bohr-density basis, SMIC N+3 is ~114 MTr/mm², 38% less than Intel 18A’s HD library. Huawei’s 3D roadmap closes the gap by stacking active logic, reaching 215 MTr/mm² by 2030. In 2031, the roadmap density jumps to 295 MTr/mm², implying either a third active layer, partial EUV insertion or aggressive planar DUV scaling. Huawei’s methodology makes other foundries look much denser as well. Applying it to AMD’s MI450X with an N2 top die on an N3P base die yields a theoretical density of 460.2 MTr/mm² in 2026, compared with Huawei’s 295 MTr/mm² in 2031. This Kirin 9030 does not use LogicFolding, remaining in a conventional mobile SoC package. Instead, it forms the baseline for how far Huawei and SMIC can push planar scaling. Future teardowns of Kirin and Ascend chips will show both planar logic density and Huawei’s hybrid bonding solutions. Export controls changed China’s optimization problem rather than ending it. EUV restrictions raised the cost and complexity of leading-edge manufacturing without freezing it. SMIC reaches N6-class logic density through DUV immersion, SAQP and DTCO, while Huawei shifts more of the burden onto architecture, packaging and system-level integration. Future nodes will be tougher. N+3 still had room to tighten local metals and reduce cell height and CGP. Further scaling without EUV leaves fewer levers. More aggressive multi-patterning adds masks and overlay error. SMIC can keep pushing DUV, but each step will get more expensive and less forgiving. The design side is just as critical. Huawei had domestic EDA tools and flows before the Kirin 9030, with the Kirin 9000s, 9010 and 9020 making that clear. Huawei was able to ship multiple consumer SoCs on SMIC N+2 and N+3 while cut off from the Western EDA stack. US export controls restricted EDA tools for advanced chips in 2022 but did not target tools for more mature chips. In 2025, the US government briefly placed much broader restrictions on EDA software from Synopsys, Cadence, and others, before lifting them less than two months later as part of a trade deal tied to rare earths. Huawei has been unable to access those tools because it remains on a US trade blacklist. That forced Huawei, SMIC and Chinese academic institutions to build their own tools and flows. Researchers at Peking University recently announced a prototype EDA tool for Huawei’s LogicFolding architecture, which requires a new flow to handle the multilayer layout and floorplan. This is not the same as replacing the full Synopsys or Cadence stack, but it shows where domestic EDA is headed: toward tighter co-optimization between architecture, process and packaging. These advances are also diffusing into the Chinese ecosystem. SMIC is licensing its N+2 and N+3 processes to HLMC/Hua Hong at the government’s direction rather than by choice. If the same process learning feeds into Ascend accelerators for AI training and inference, the choke point shifts from one named fab to an ecosystem. Alibaba’s T-Head silicon arm and Cambricon, a Chinese AI chip designer that is expected to supply ByteDance, could also be major beneficiaries. Sanctions aimed at SMIC alone become less effective once the manufacturing knowledge has spread to other fabs and design houses. China is not closing the gap with Intel, Samsung and TSMC. The teardown shows the opposite in several places: no EUV, no backside power, higher process complexity, and visible trade-offs. But China is still advancing. If domestic chips become good enough for phones, inference, networking and security-sensitive workloads, they can matter strategically without matching TSMC at the leading edge. Behind the paywall, we show what else STEEL can do, with material and process flow analysis of SMIC N+3, and analysis of the Kirin 9030 package. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline, access the full Kirin 9030 and SMIC N+3 analysis or to commission a custom teardown, contact sales@semianalysis.com.
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Australian business investment boomed in the March quarter as firms ploughed yet more money into data centers, figures showed on Thursday, while companies also upgraded spending plans for coming months.
31 hours with the spit-shined Mina the Hollower (and 34 with the four games that came before it)
To truly appreciate Mina The Hollower, an extraordinary new throwback of a game, I sent myself to Yacht Club University. That’s not a real institution of higher learning, but it’s the best way I can explain much of the past several weeks as I prepared to play Mina by playing the four biggest game previously made by studio Yacht Club Games. I had expected Mina the Hollower, in development for six years for PC and consoles, to potentially be something special. A demo I tried in March had felt great. Mina the Hollower had an old-school premise: a singular move for its hero that felt so good to control and so rich with possibilities that, in the hands of skilled designers, it could be riffed on in various ways for the length of a full game. Mina’s core maneuver, her hollowing, made her sort of an upside down Super Mario. Nintendo’s hero jumps through the air, discovering power-ups at the apex of his jump by bonking overhead blocks, then defeating enemies by landing on them. Mina essentially jumps into the ground, digging (“hollowing”) into the earth to fetch buried treasure, then burrows for a short distance to emerge on the other side of a wall that hides treasure or an enemy that needs some battering. I wanted to understand how good Yacht Club was at making games. I wanted to see how far they’d come. If Mina was terrific—as I predicted it might be—I wanted to feel how they got there, one button press at a time. On May 6, 21 days before the writing of this review, I checked with Yacht Club Games co-founder and programmer David D’Angelo, to ask which of the studio’s games I should play to truly appreciate the new one’s design. “Hmmm all of them?” he wrote back. “Starting with Shovel Knight definitely is helpful,” he continued, referring to Yacht Club’s first game. He gave me a link to a spreadsheet of over 400 cheat codes that could help me out, if I found the game too tough.1 “Most folks say Specter of Torment is the least difficult and quickest to finish in terms of playtime, and [it] refines much of Shovel Knight,” he told me. “King of Cards is a big celebration of everything we did in [the Shovel Knight compilation] Treasure Trove— might work for you better if you’re a fan of shorter, Mario-style courses. And it’s probably the closest to Mina in terms of polish.” So that was that. Four games, none of which were required. Mina is a whole new game in a whole new world, best I can tell. I’d barely played that first Shovel Knight before and never the other three. I just thought it’d help. It did. It turns out that playing a game studios major works before their latest is very illuminating.
Meta stock price jumps 3% on plan to sell AI subscriptions
Shares of Meta gained nearly 4% on Wednesday as investors cheered the company's move to start generating recurring revenue from its platforms.
Rudolph Moise jumps into CD 24 Primary even though Frederica Wilson hasn't announced retirement
The South Florida Democrat just left a crowded field in another district.
'The Super Mario Galaxy Movie' Leaps Atop Weekly U.K. Home Entertainment Sales Chart Through May 27
Universal/Illumination’s The Super Mario Galaxy Movie, the top-grossing box office release ($983.7 million) thus far in 2026, jumped atop the Official Film Chart, the weekly U.K. home entertainment sales chart, through May 27. Amazon MGM Studios’ sci-fi adventure Project Hail Mary, starring Ryan Gosling, dropped to No. 2 in its second week on the chart, followed … Continue reading "‘The Super Mario Galaxy Movie’ Leaps Atop Weekly U.K. Home Entertainment Sales Chart Through May 27"
'The Super Mario Galaxy Movie' Leaps Atop Weekly U.K. Home Entertainment Sales Chart Through May 27
Universal/Illumination’s The Super Mario Galaxy Movie, the top-grossing box office release ($983.7 million) thus far in 2026, jumped atop the Official Film Chart, the weekly U.K. home entertainment sales chart, through May 27. Amazon MGM Studios’ sci-fi adventure Project Hail Mary, starring Ryan Gosling, dropped to No. 2 in its second week on the chart, followed … Continue reading "‘The Super Mario Galaxy Movie’ Leaps Atop Weekly U.K. Home Entertainment Sales Chart Through May 27"
Dodgers prospect Kendall George may have sustained serious knee injury while avoiding team's bat dog
Kendall George came up limping after jumping out of the way to avoid a bat dog.
Ebola, chemical plants and health, hantavirus, common colds, heat and more
As they say, bugs have ears. Public health has had a relentless May. Chemical plant (near) explosions, Ebola, hantavirus, and that's before you even get to the usual suspects: common colds, heat, and ticks. Here’s an attempt to keep you up to speed and, more importantly, what it means for you and your community. But first, an announcement: World Cup The World Cup starts in 15 days (not like anyone is counting down), and we are hanging TVs in the Health Security Operations Center. It’s going to be a gorgeous, chaotic celebration of basically every culture on earth. And it’s going to take a team effort—from communities to individuals, from public health to health care—to keep people healthy. That’s where you come in. If you’re going to the games or live within 30 miles of a stadium, we would love to hear from you. Sign up for a weekly survey here. Thanks to the more than 1,280 people who have already signed up…you will be hearing from us soon!! Global disease “weather report” Hantavirus: Two more cases The global count of cruise ship passengers with hantavirus has now increased to 13 cases (11 confirmed), with three deaths. The two new cases are overseas and among people who were already quarantining: A crew member in the Netherlands. A Spanish national passenger who was quarantining at home tested positive through daily monitoring. They are now in a biocontainment unit. In the U.S., everyone remains negative. There may be more cases, given that the incubation period of hantavirus (the time from exposure to infection) is 45 days. But this week, we will reach a major milestone: the median incubation window is 18 days, and that will pass on May 29. What this means for you: Your risk from this cruise ship outbreak remains essentially nil at this point. Ebola rages on in Central Africa Big thanks to Dr. Craig Spencer, a humanitarian physician who has treated and survived Ebola, for jumping in to provide the YLE community with an update. Craig, take it from here… The combined confirmed and suspected Ebola cases in DRC are now more than 1,000. All signs are pointing to a very long and catastrophic outbreak in Central Africa: This is a vast undercount. We know this because the test positivity rate is hovering around 50%, only 20% of contacts are being traced (and in some areas, no contacts at all), and more cases keep popping up with no known connection. This all points to widespread and undetected community transmission. This is in only a week of detection. Compared to previous outbreaks, the growth is very fast, as the huge West Africa outbreak in 2016 was first detected at 49 cases and rose to 208 cases a month later. It took four months for that outbreak to reach the size of the current one in the DR Congo. The cases are spread out across 16 health zones. There are now multiple epicenters, making containment very difficult. Next door in Uganda, the case count is seven. While this number is low compared to DRC, a concerning development is that two health care workers recently tested positive with uncertain exposure histories. If they weren’t treating known Ebola cases, this means it’s spreading undetected in Uganda as well. On the ground, backlash, including the burning of health centers, has emerged, a pattern seen in nearly every outbreak and rooted in deep community distrust. It often stems from outside actors working in communities without fully understanding or addressing local priorities. Affected populations may recognize the severity of Ebola while still holding other concerns as more pressing, such as where their loved ones are buried. Community trust is essential to an effective response, but difficult to build during an active emergency. It is best established long before a crisis begins. U.S. priorities are made clear, and may backfire. The U.S. Administration has shown that its first priority is keeping Ebola out, with helping end the outbreak in the DRC a secondary concern. That's meant travel restrictions broader than anything we've imposed before — covering travelers from across the region, and reportedly some green card holders and permanent residents as well. For example, just these past two days, news broke that high-risk American travelers will be subject to a mandatory quarantine in Kenya before they are allowed to return. If an American is infected, the U.S. government plans to send them to a hospital it is standing up from scratch in Kenya. (Currently, Americans who were in the area are allowed to return but are diverted to three airports—Houston, Atlanta, and DC—for further screening.) Past administrations have used travel notices and stepped-up screening; this goes much further. At first blush, these strict precautions may sound prudent. But this approach could backfire in three ways: Restrictions this blunt give people every reason to hide where they’ve been and whom they’ve been near — making the people we most need to find harder to track, not easier. They also breed a false sense that this is someone else’s problem. But diseases are humbling. They find the small cracks in even the most impenetrable-seeming defenses. Lives lost. There is no treatment for this Ebola strain, which means survival depends heavily on the quality of the health system. We have that system in the States, but we are choosing not to use it for infected Americans. This is unbelievable and infuriating. (See a deeper dive from me here.) The only real way to lower the risk to Americans — and everyone else — is to end the outbreak in the DRC and across the region. What this means for you: If you have travel plans to this region, it’s time to cancel them. This is a high-risk situation in Central Africa, and CDC released a Level 4 Travel Advisory. There is also great uncertainty if and when the Administration will let you back in. To the general public in the U.S., your risk remains very, very low right now. U.S. disease “weather report” Ticks: past peak season? Good news, especially for people in the Northeast and Midwest: tick numbers continue to decline. Though we are at the peak of the season, this unusually early year is trending favorably. Heat-related illnesses in the North Heat risk is certainly not blanketing the entire country yet, but this week it will be moderate in the Midwest and the Southeast. What this means for you: Be sure to check the CDC HeatRisk tool. A red day isn’t the best day for that soccer game for a kid with asthma, and a stretch of orange days is a great time to check on your elderly neighbor. Common colds surging As far as respiratory viruses go, the only thing really going around right now is the common cold. It is higher this year than last year, but should peak very soon before returning this fall. Spotlight: Chemical plants Over the weekend, YLE California covered the serious situation that unfolded around a chemical plant in Orange County, California. Thankfully, the worst-case scenario (a chemical explosion) was mitigated, but only through luck. The health implications in a densely populated area could have been catastrophic. As the situation was winding down, another chemical explosion struck Washington State. This one was fatal. Health officials say the risk to surrounding residents from chemicals in the air and ground remains low, though the community deserves far greater clarity. Clean air and clean water consistently rank as Americans’ top public health concerns — yet when chemical disasters strike, communities are too often met with reassurances rather than transparency and accountability. Residents near the 2023 East Palestine, Ohio train derailment, for example, are still waiting to understand the long-term impact on their health, with few clear answers. What this means for you: Many are wondering if facilities processing potentially dangerous materials are in their neighborhoods. This interactive map allows you to enter your ZIP code and see all facilities monitored by the EPA, including any violations. Good news Ebola vaccines and treatment for the Bundibugyo species are in development. Two vaccine platforms are being explored, at least one of which may be deployable in as little as 2 months. One vaccine is being developed by Oxford, and the other uses the same biotechnology as the FDA-approved Zaire species of Ebola. (It may provide cross-protection, but it’s unclear at this point.) On the treatment side, two promising monoclonal antibody cocktails are likely to be deployed, though doses are limited and logistical hurdles remain significant challenges. Anni over at The Biotech Tea had a great explainer about the Ebola vaccine gap, if you want to read more. [ The Biotech Tea The Ebola vaccine gap, reading vessel damage, & the Makary exit 🗝️ Paid subscribers get the Biotech Term of the Week at $30/year (~$2.50/month). I try to keep it intentionally accessible, but if cost is ever a barrier, send me a message. A few people asked about expensing your subscription, so I put together a short email template… Read more 6 days ago · 10 likes · Annicka Evans, PhD ](https://www.thebiotechtea.com/p/the-ebola-vaccine-gap-reading-vessel?utm_source=substack&utm_campaign=post_embed&utm_medium=web) Polycystic ovary syndrome (PCOS) has been officially renamed polyendocrine metabolic ovarian syndrome (PMOS), following more than a decade of debate and input from roughly 22,000 clinicians, researchers, and patients worldwide. This is good because the old name was medically misleading, leading to patients without visible cysts being dismissed or overlooked entirely. The WHO estimates that 70% of people with the condition remain undiagnosed. A more accurate name should improve recognition, reduce stigma, and ultimately help the millions of people living with this condition get diagnosed and treated sooner. Poll Loading... Bottom line Public health situations are everywhere right now. Staying healthy takes public health professionals and systems working tirelessly behind the scenes and each of us showing up for our neighbors and communities. Love, YLE Big thanks to Ed Nirenberg for staying on top of the Ebola vaccines, Hannah Totte for all the figures, Dr. Craig Spencer for the Ebola insight, and Dr. Matt Willis for covering the chemical situation in CA. Your Local Epidemiologist (YLE) comprises a team of experts, ranging from physicians to immunologists to epidemiologists to nutritionists, working together with one goal: to “Translate” ever-evolving public health science so that people are well-equipped to make evidence-based decisions. YLE suite of newsletters reaches over 475,000 people across more than 132 countries. This newsletter is free to everyone, thanks to the generous support of fellow YLE community members. To support the effort, subscribe or upgrade below: Subscribe
Balancing act: Robinson shines in four sports, including two in the same season
MADISON, Wis. — Sun Prairie West junior Skye Robinson competed in high jump, cheered on her teammates and then rushed across town to pitch in a playoff softball game —
Bari Weiss: Think For Yourself, Not By Yourself
When we launched The Free Press, the plan was simple: Tell the truth plainly, and let readers come to their own conclusions. I thought there would be a sizable enough group of people who would pay the cost of one coffee a month to read high-quality news and opinion journalism. But what happened next surprised even me. Yes, you came for the stories—for the investigations, essays, debates, interviews, podcasts, and arguments. But over the past few years, you also found one another. I’ve watched strangers become friends in the lobby before our debates. I’ve seen people trade numbers after live recordings of Honestly, launch businesses after Free Press dinners, fall in love after our meetups—even get married (!?), and say some version of the same sentence over and over again: I thought I was the only one. We live in the most connected age in history, and yet, millions of people feel isolated, alienated, politically homeless, and starved for real conversation. We have followers and no neighbors. Algorithms instead of interlocutors. Our social media feeds are like troughs, but what we really need is a table to gather around. The Free Press is a publication, yes, but it is also a gathering place for independent minds. So today, I’m thrilled to share our new investment in you. We are launching a new world of community experiences for our paid subscribers, designed to bring _Free Press_ers together online and in real life. Introducing Our Community Launch The Free Press Forum Our new digital home for paid subscribers, the Forum, is now live. This is where _Free Press_ers can meet, debate, recommend, organize, joke, argue, and converse like civilized people. Imagine that. This is not social media as you know it. No bots. No algorithmic rage bait. No performative nonsense. Just smart people talking to one another. Inside the Forum, you’ll find conversations on the things our readers already care about most: the issues of the day, recommendations (books, music, travel), work and networking, parenting, dating, and where to find your people—online and in real life. Jump in! Introduce yourself and join the first conversations in the Free Press Forum here. You’ll also find announcements from us (paid subscribers are first to hear!) and our writers, hosting regular Ask Me Anythings (AMAs)—live conversations where subscribers can ask questions, push back, and continue the discussion beyond the page. This Thursday, subscribers can chat with our brilliant reporter, culture vulture, and co-founder Suzy Weiss. Friday, I’ll be lending you Nellie Bowles, queen of TGIF, to answer subscriber questions live. Read more about The Forum directly from Nellie here. The Free Press Supper Club The best part of being a _Free Press_er is meeting other _Free Press_ers. So we’re inviting you all to dinner to do just that. It’s part salon, part blind date, part old-fashioned dinner party. Here’s how it works: You answer a short questionnaire. We match you with a small group of _Free Press_ers in your city. We send you to a great restaurant. You show up for supper. The rest is up to you. Your next best friend, co-founder, or future spouse may already be waiting at the table. Learn more and sign up here for our first Supper Club in 12 cities in three countries taking place on June 18. Don’t see your city? Raise your hand if you’d like a Free Press Supper Club near you. Yes, St. Louis—we hear you. The Free Press Retreats and Excursions We’re also building something new for 2027: immersive experiences for Free Press readers who want to continue the conversation trailside, poolside, or around a fire long after dessert. The Free Press Retreat will be an intimate long weekend built around big ideas, outdoor adventure, great meals, and the kinds of discussions that happen when curious people spend meaningful time together. Bring your spouse, your parents, your children—or come on your own. Free Press Excursions will take us farther afield: curated trips with Free Press writers and contributors exploring places that help explain the world we live in, from the battlefields of Gettysburg and Normandy to the Vatican in Rome. We’ll share more details this summer. If you’d like an early look when these experiences open for registration, show your interest here.**A Note to Our Subscribers** These new offerings exist because of our paying subscribers. If you’re already one: Thank you. You built this. And you keep us going. If you’ve been reading us for free and wondering whether to join, this is a very good time. For a short while only, we’re offering a rare 20 percent discount for you to join our community as a paid subscriber. You’ll unlock everything we publish, plus exclusive access to our members-only Forum, Supper Clubs, and more insider perks. Thinking for yourself shouldn’t mean thinking by yourself. See you there. —Bari
Unemployment rate increases for fourth straight month in Florida
Florida's jobless figure stood at 4.8% in April, a jump more than 1 percentage point compared to a year ago.
MSG Sports Stock Jumps as Winning Never Hurts. New York Knicks Make First NBA Finals in 27 Years.
The New York Knicks will face either the San Antonio Spurs or the Oklahoma City Thunder in the NBA Finals in June.
Athletics call up MLB top prospect amid series with Mariners
Scuffling as of late, the Athletics are deciding to call up their No. 3 prospect, left-hander Gage Jump, to help add more depth to their starting rotation or bullpen.
K-State long jumper Tah Chikomba joins K-Nation
MANHATTAN (KSNT) — The 2026 Big 12 Outdoor long jump champ joins K-Nation. The junior long jumper, Tah Chikomba, jumped 8.27 meters at the Big 12 Championships to clinch first place. That jump broke his personal record, his own school record, a Big 12 record and a Drachman Stadium record. After spending two seasons at […]
Steelers' second-year RB turning heads at OTAs
Pittsburgh Steelers running back Kaleb Johnson is apparently primed for a massive Year 2 jump, as he's standing out in a big way at OTAs.
Bond breakout? Big effects of bad data. Immigration and thermostatic politics & dad-chat is coming for dad-books.
Thank you for opening your Chartbook email. Anna Airy, A Shell Forge at a National Projectile Factory, Hackney Marshes, London, 1918 Bond breakout - John Authers Across the developed markets, bond markets are staging a slow-motion car wreck. Looking at the drastic moves in the US, Japan, the UK and France, Barclays’ Ajay Rajadhyaksha commented: “Last week, long bonds broke. Not in one country. In all of them. Simultaneously. Four countries. Four different political systems. Four different central banks. But the same trade — “get me out of duration!”” Each country has its own contributing political problems, but the uniformity of the shift out of long-term bonds with high duration makes clear that something broader is afoot. For Rajadhyaksha, it is “simple and uncomfortable.” The developed world “has too much debt, too little fiscal discipline, and no political appetite for fixing either.” If there’s a trigger, it has been the Iran war and the resulting shock to oil supply. Source: Bloomberg G7 countries are now borrowing at rates that were enjoyed by EM in the early 2020s For contributing subscribers only. Subscribe Trade between China and Russia has grown in recent years For contributing subscribers only. Subscribe Big effects of bad data A decade ago nearly nine in ten Americans, when approached, agreed to fill out the Current Population Survey, which is administered to about 60,000 households each month and asks about, among other things, employment. Fewer than seven in ten do so now (see chart 1). For the Consumer Expenditure Survey, which tries to capture 3,700 households monthly, the response rate is down from 68% to 40%. … When the information becomes less reliable, investment decisions get more difficult to make. Some may be delayed, creating a potential drag on the economy. A new working paper by Nicholas Bloom of Stanford University, Erica Groshen, former head of the Bureau of Labour Statistics (BLS) now at Cornell University, and Duncan Hobbs and Michael Strain of the American Enterprise Institute, a think-tank, hazards an estimate. Preserving trust in “the integrity and quality of official statistics”, the authors claim, generates economic benefits of about $25 for every $1 spent on the BLS, the agency with an annual budget of $700m that is responsible for many of these data. To arrive at their conclusion the quartet analysed an ignoble episode in the BLS’s recent history. On August 1st 2025 Donald Trump sacked Erika McEntarfer, appointed as the agency’s commissioner by his predecessor, Joe Biden. The president alleged, without evidence, that the BLS’s steep downward revision to recent jobs numbers had been “RIGGED in order to make the Republicans, and ME, look bad”. In fact, it was the wanton dismissal that looked bad in the eyes of many observers. In the following seven days there was a 50% leap, relative to the week before, in the average value of the index of Economic Policy Uncertainty (EPU), which tracks the number of articles mentioning such uncertainty that are published daily in American newspapers. This was a discernible jump even when compared to the chaos caused by Mr Trump’s trade war in April 2025 and his real one in Iran in the past two months (see chart 2). Based on Mr Bloom’s earlier study with other colleagues of the EPU’s impact on business investment, industrial production and employment, the authors estimate that the jump reduced American GDP by over $100bn (0.3%) and non-farm payrolls by 168,000 (0.1%). Source: The Economist Immigration and thermostatic politics (Sarah O’Connor in the FT) A strange thing happened a year and a half ago. No sooner had Americans elected Donald Trump as president on an explicitly anti-immigration platform than US public opinion began to swing much more favourably towards immigration. … to political scientists who study “thermostatic” politics, this development is no surprise at all. Public opinion often moves against the prevailing party, especially if they are perceived to have gone “too far” in one direction. The phenomenon was first explored in the 1990s with reference to fiscal policy, but in recent years it has been particularly evident in the realm of immigration policy. While these swings in opinion polls can make it seem as if people don’t know their own minds, they can be a useful democratic check on governments by sending bright flashing warning lights when policies stray too far from the public’s comfort zone. The problem comes when politicians misinterpret those signals. When people tell pollsters they want less immigration, or think it is bad for the country overall (or the converse), they are often expressing an opinion about how things appear to be going in that moment relative to their preferences, rather than a deep shift in their underlying views. According to Alexander Kustov, a political scientist, most Americans’ views are quite stable and moderate: they support immigration that is controlled and in the national interest, and oppose flows that are disorderly or under-enforced. In the US, he argues the Trump administration over-interpreted dissatisfaction with high immigration under Joe Biden, and implemented policies that went too far for many voters. “People don’t necessarily change their idea about their ideal immigration policy, but they can react to what the government is currently doing,” he told me. “A lot of people are not happy with what the Trump administration are doing — right now we’re not talking about border enforcement, we’re talking about people not just getting harassed, but killed.” But similarly, he added, pro-immigration advocates would be making a mistake to interpret the recent, more favourable swing towards immigration as a deep-seated ideological shift in attitudes. The recent history of UK immigration policy offers another cautionary tale. After the 2016 Brexit referendum, public concern about immigration fell. This was partly because net migration statistics declined, but also because people felt a sense of catharsis and control, says Sunder Katwala, director of British Future, a think-tank. By 2019, the public ranked immigration as only the ninth biggest issue of concern, according to Ipsos polling. But when the Conservative government liberalised visa routes for students and care workers between 2019 and 2022, that helped net migration to surge. And so, too, did public concern. Today’s Labour government has implemented another sharply restrictive turn in immigration policy. As Kustov and researcher Caitlyn Yates argue, thermostatic public opinion should be a useful check on politicians. Instead it seems to have helped to magnify the pendulum swing in the UK. The government over-interprets and overreacts to a change in public opinion, which reacts in turn, prompting a sudden swing the other way. Source: Financial Times HEY READERS, THANK YOU for opening the Chartbook email. I hope it brightens your day. I enjoy putting out the newsletter, but tbh, what keeps this flow going is the generosity of those readers who clicked the subscription button. If you are persuaded to click, please consider the annual subscription of $50. It is both better value for you and a much better deal for me, as it involves only one credit card charge. Why feed the payments companies if we don’t have to. Subscribe Anna Airy, Shop for Machining 15-Inch Shells: Singer Manufacturing Company, Clydebank, Glasgow, 1918 Racing for a vaccine … we have been here before! The deadly Ebola outbreak in two African countries driven by a virus species with no vaccine has triggered an urgent search for a potential jab, in a test of troubled global efforts to avert threats posed by emerging diseases. A World Health Organization advisory group is due to would meet on Tuesday to recommend candidate jabs to prioritise for clinical trials, the global health body said. It will assess data including an analysis by the Coalition for Epidemic Preparedness Innovations (Cepi), which was set up after failures in the international response to a previous Ebola crisis. The latest Ebola outbreak in Democratic Republic of Congo and Uganda has infected hundreds of people and killed more than 80, health authorities say. Cepi’s reaction will be a crucial indicator of its progress towards its wider goal of producing vaccines for pandemic threats in just 100 days, despite steep cuts to international health funding. “If there was ever a time that we could show the world why Cepi is needed and show the world why the 100-day mission is needed, it’s now,” Nicole Lurie, the organisation’s executive director for preparedness and response, told the FT. “We’re happy to accept that responsibility, but obviously we need help from partners — particularly financial help in the long run.” DR Congo and Uganda would make the final decision on whether to press ahead with any vaccine candidates endorsed for clinical trials by the WHO experts, the global health body said. “Other ethical and community acceptability issues will be considered,” said the WHO, which declared the latest outbreak a public health emergency of international concern on Sunday. “This will be important to make sure that the trial, if it happens, will be adequately communicated to the population.” Lurie said Cepi had provided information from a survey of research teams and companies working on drugs that might be effective against the Bundibugyo virus behind the outbreak. The organisation hoped soon to announce partners in the quest for a jab, she added, although she declined to give a timescale for when one might be developed. Cepi’s Nicole Laurie said global health bodies were ‘getting some live-fire drills’ with hantavirus and the latest Ebola outbreak. The hunt for a vaccine should be helped by scientific advances including the use of artificial intelligence to find drugs active against viruses, Lurie said. Existing jabs against the Zaire Ebola virus responsible for many previous outbreaks might provide a basis for tackling the Bundibugyo species, she added. “We’ll see how far and how fast we can get,” Lurie said, adding that Cepi had done preliminary work recently on a possible jab for the rat-borne hantavirus responsible for a recent fatal outbreak on a cruise ship. “Both with hantavirus and now with Ebola, [we] are getting some live-fire drills.” Source: Michael Peel in the Financial Times Dad-chat is coming for dad-books. (By Pamela Paul and Jeffrey A. Trachtenberg in the WSJ) They were the go-to gifts for Father’s Day: a book about some little-known chapter of World War II, the sweeping narrative of a shipwreck, perhaps the latest presidential biography. These days, dad books are a dying breed. Nonfiction book sales have been in decline for the past four years, and are now the most challenged segment of the print book market. Publishers say certain types of books still fare well—including celebrity memoirs and religious titles. But in recent years, print sales in such categories as biography, current affairs and business and economics—what publishers refer to as “serious nonfiction” and which tend to resonate especially with men—have fallen considerably. Sales of nonfiction print titles were down nearly 8% through May 9 this year, and sales of books about politics and current affairs were down 19%, according to book tracker Circana BookScan. Publishing has long been subject to cyclical changes, with trends in format and genre taking over bookshelves in grand sweeps. (Remember the adult coloring-book craze? Or the stratospheric rise of romantasy?) But many in publishing believe the decline in serious nonfiction is more existential. “The trend couldn’t be clearer,” said Jonathan Karp, the former chief executive of Simon & Schuster and publisher of the new Simon Six imprint. “This is a sea change and people should wake up and realize we’re living in a new world.” One culprit for the shift: a new media diet for fans of more serious nonfiction. … Sixty-two percent of men and 54% of women consumed a podcast in the prior month, according to a recent survey by Edison Research at SSRS, up from 46% and 39%, respectively, in 2023. “When we have internal meetings to talk about this problem, it always comes around to podcasts,” said Jonathan Burnham, president and publisher of the Harper Group at HarperCollins Publishers. “The man who wants to read American history is now tuning into one of the many good podcasts about history that lends the quiet attention to a serious subject he’s looking for. It makes the idea of sitting down with a 700-page Ron Chernow book less appealing. You’ve scratched that itch.” Source: Wall Street Journal Remarkable report by Novara from the nationalist rally in London in mid May. Anna Airy, Leopard Moth and Plums, 1915 If you’ve scrolled this far, you know you want to click: Subscribe
Spring sports surge: How to avoid foot and ankle injuries
One warm weekend — and suddenly everyone is back outside running, playing pickleball, or hitting the basketball court. But doctors say jumping into intense activity too quickly can lead to painful injuries that may keep you sidelined for weeks.
How Josh Hart's resilience jump-started the Knicks and pushed them two games from the NBA Finals
AMC Entertainment Stock Surges After CEO Buys Thousands of Shares
AMC Entertainment stock jumps 14.6% after CEO Adam Aron personally buys 250,000 shares, citing confidence in the 2026 box office recovery.
The Whitakers: 21 relatives. One great sporting dynasty: ‘You’ve always got family around’
The Whitakers are a successful show jumping family, a sporting dynasty that was started on a family farm decades ago.
Bungie Plans Layoffs After Ending ‘Destiny 2’ Development
The Sony subsidiary will focus on ‘Marathon’ rather than jumping directly to ‘Destiny 3’
Plex appeal fades as Lifetime Pass jumps to $750
How many times would you have to watch Lord of the Rings to cover that?
Casey Askar jumps into increasingly competitive CD 22 contest
He last ran for an open seat in 2020, but feels ready to take on Debbie Wasserman Schultz in a swing district under the new map.
Suda51 and Swery's Hotel Barcelona coming to Nintendo Switch 2, Switch
Hotel Barcelona is making the jump to Nintendo Switch 2 and Switch, Eden Industries and White Owls revealed today. Launch timing will be shared soon. Hotel Barcelona is a 2.5D action horror roguelite coming from Suda51 and Swery. When it hits Nintendo platforms, the game will come with the base game, the Under New Management overhaul, the Late Check-Out DLC,...
Indianapolis named No. 3 Best Sports Business City
With the No. 3 ranking, Indianapolis jumps eight spots from the inaugural rankings in 2023, when it was ranked No. 11.
Heart health screenings deliver lifesaving impact
Two weeks after her father suffered a stroke, Courtney Barclay, 46, jumped at the chance to get a free blood pressure check while grocery shopping in Carlisle. “With everything going on with my dad…
Indianapolis tabbed No. 3 Best Sports Business City by Sports Business Journal
Indy jumped eight spots since the inaugural rankings in 2023.
Indianapolis tabbed No. 3 Best Sports Business City by Sports Business Journal
Indy jumped eight spots since the inaugural rankings in 2023.
Dominion stock price pops on NextEra merger to create utility giant
Dominion Energy stock jumped on Monday after the company announced it's combining with NextEra Energy. The deal comes as power demand is surging in the US.