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Residents near Maui wildfires show elevated metals linked to impacted lung health, study says
A new study finds that metal mixtures found in smoke, ash and debris after the 2023 Maui wildfires affected human lung health
People Are Going Completely Wild Over Fortnite's FNAF Crossover Announcement
Fortnite's post revealing the horror-themed crossover has become the game's biggest tweet ever
How to help wildlife after a nor’easter
Always check fallen trees for animals before chopping them up.
How to Watch: White Sox at Astros, Wild Card Series
Your broadcast guide this week, including every permutation of Game 3 start times!
Every Upgrade In ‘The Witcher 3: Wild Hunt
'The Witcher 3: Wild Hunt - Remastered' is out Sept. 29, and now we have the full patch notes for everything that has changed in the game.
Fubo to Stream Minnesota Wild Games Through New Distribution Agreement with National Hockey League
SAINT PAUL, Minn. – FuboTV Inc. (NYSE: FUBO) today announced a new multi-year distribution agreement with the National Hockey League (NHL) for carriage of four regional sports networks (RSNs) ahead of the 2026-27 season. As part of this agreement, coverage of Minnesota Wild games on Wild+ will be available on
5 ‘trailblazing’ caribou return to Canada’s wilderness
The animals were raised in North America's first conservation breeding program for Caribou.
Houston Astros rebound from 11 games under .500 and win AL West
Houston will host the Chicago White Sox in a best-of-three Wild Card Series starting Tuesday.
Houston Astros rebound from 11 games under .500 and win AL West
Houston will host the Chicago White Sox in a best-of-three Wild Card Series starting Tuesday.
Padres Wild Card roster predictions: Who’s in, who’s out
Manager Craig Stammen has more than a few decisions before finalizing the postseason roster.
Wild Salmon vs. Farmed Salmon: Which One Is Better for Your Health?
Here’s exactly what you need to know next time you’re standing in the seafood aisle.
Your 2026 MLB Wild Card Series announcing schedule
Major League Baseball revealed the television schedule and scenarios for the 2026 postseason’s Wild Card Series on Sunday. Details have since emerged about the announcing crews that will call the games across NBC platforms. As was the case during the regular season, local analysts will be in the booth to give each broadcast a familiar…
Snow is critical for Arizona's water, this study found that measurements can vary wildly
A new study from the University of Washington found that snow measurement tools can produce very different estimates for water availability.
CD Projekt Releases Official List of All the Improvements in The Witcher 3: Wild Hunt
CD Projekt has released an official list of all the improvements made for The Witcher 3: Wild Hunt — Remastered.
SEC Football Power Rankings Week 5
With one-third of the regular season officially in the books, the SEC delivered another wild weekend.
Braves Announce Major News Days Before Phillies Playoff Series
The Atlanta Braves announced major news before the team's playoff series against the Philadelphia Phillies. Find out more on the rivalry Wild Card series. The post Braves Announce Major News Days Before Phillies Playoff Series appeared first on HEAVY.
Astros Are Playoff Bound after 9-0 Whitewashing of Athletics
There’s a new worst record to go to the postseason, but at least it isn’t a sub-.500 one. The Houston Astros handled business today in West Sacramento against the Athletics, 9-0. With the victory, the Astros are AL West Champions and will host the Chicago White Sox in the AL Wild Card Round beginning Tuesday […]
Red Sox Facing A Nightmare Bronx Trip
The Red Sox postseason starts with a brutal trip to the Bronx. Between injuries and a Cy Young favorite, Boston's Wild Card hopes look shaky.
Cubs Wild Card Schedule: Start Times and Broadcast Info
The Chicago Cubs will head to San Diego for a Wild Card Series rematch against the Padres, with late-night start times and a challenging matchup awaiting.
New-Look MLB Playoff Field Is Now Set
A wild and wet Sunday completed the 2026 regular season.
MLB playoffs 2026 tracker: Astros win AL West, Phillies hang on for wild card — final playoff bracket, seeding and postseason schedule after MLB finish
Braves learn Wild Card series opponent
The Atlanta Braves now know who they will face in the Wild Card series.
The Wackiest And Wildest Looks From The VMAs Red Carpet
From Lady Gaga’s legendary meat dress to live animals, the VMAs red carpet is home to some of the most outrageous pop culture moments.
Verizon is Selling $2 Samsung and iPhone Cases, $3 MagSafe Wallets in Big Accessory Sale
Verizon is hosting a wild case sale at the moment that’ll get you cases for as little as $2. You’ll find more for $4 or $5 too, plus we have them for almost any phone and from various casemaker brands. If you have a few minutes today, you might want to browse and see if...
Cats want to talk to us. Scientists are trying to decipher the meow
LOS ANGELES — For decades scientists and researchers have been vexed by a sound emanating from cats. Not a call of the wild, a roar or a hiss. No, multiple
The New Season: Fall 2026 - The most anticipated new movies, music, TV and more
University of Washington study suggests more coyotes are living in cities
University of Washington researchers found that coyote density in Seattle was nine times higher than in the wild.
Can Science Solve Smoke Taint?
With wildfires an increasing problem worldwide, Chris Boiling investigates the solutions to smoke taint. Read the latest wine news & opinion on wine-searcher
Martin McDonagh Says ‘Wild Horse Nine’ Is His Most Political Film
Martin McDonagh revisits his past at Zurich Film Festival and explains why John Malkovich starrer 'Wild Horse Nine’ is his most political film yet.
Ospreys are disappearing along the East Coast. Scientists think they know why.
At the center of a widening crisis for one of the nation's great wildlife comebacks is a fish most Americans would hardly recognize.
Dogs Will Fight Bears. But Not Because of the Reason You Might Think.
Scientists analyzed hundreds of encounters between bears and canines. The results raise the suggestion that dogs may not always protect people in the wild.
'Wild Horse Nine' review: Is John Malkovich at the center of a meta puzzle?
Martin McDonagh reteams with Sam Rockwell for another dark comedy about charismatic killers.
Around the Empire: Wild Card Series previews and predictions
All your Wild Card Series questions answered; Wells’ well-timed turnaround; JV calls it a career.
Arizona at Washington State: Players of the Game
Saturday night saw the Arizona Wildcats travel to Pullman, Washington to take on the Cougars of Washington State. After a pretty up and down first half, the ‘Cats settled down and found their rhythm in the second half, winning a hard-fought contest 34-24. Even with the inconsistencies, there were plenty of clutch plays and career […]
FINAL: Cincinnati 31, K-State 26
It’s a familiar refrain from the past: a disastrous third quarter doomed the Kansas State Wildcats to defeat.
Quinshon Judkins could run wild
Cleveland Browns RB Quinshon Judkins facing struggling run defense in Week 3
No. 1 Texas Survives Tennessee in Wild SEC Showdown!
The Texas Longhorns are 4-0. No. 1 Texas traveled into one of the toughest environments in college football on Saturday and escaped Neyland Stadium with a 20-17 victory over No. 14 Tennessee in a thrilling SEC showdown. It wasn’t always pretty for the Longhorns, but when the game was on the line, Texas’ defense came…
Scientists believe avian keratin disorder is cause of fishhook beaks in Alaska chickadee population
The virus is causing “the highest concentration of (visible) deformities ever recorded in a wild bird population.”
What to expect at Sunday’s MTV Video Music Awards
NEW YORK — MTV’s Video Music Awards will be handed out Sunday at the Peacock Theater in Los Angeles. While anything can happen at this traditionally wild event, Madonna is
The Witcher 3 Remastered Download Size, Global Release Times and Review Embargo Lift Dates Revealed
In case you missed the big announcement at gamescom last month, CD Projekt RED is set to unleash The Witcher 3: Wild Hunt Remastered this coming week, and it'll be…
Intel Panther Lake Teardown, 18A, BSPD, GAAFET, SemiAnalysis STEEL
Panther Lake debuts the first commercial implementation of backside power delivery (BSPDN), introduces Intel’s first iteration of gate-all-around (GAA) transistors, and showcases their advanced packaging capabilities with its Foveros-S assembly. With Panther Lake, Intel’s manufacturing arc has shifted from nebulous roadmaps to shipped silicon, a significant milestone on their long road back to competitive semiconductor manufacturing. To evaluate the extent of Intel’s comeback, we tore down Panther Lake. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Our teardown traces 18A from its four-sheet RibbonFETs (Intel’s marketing name for GAAFETs) and gate stacks through contacts, frontside and backside wiring, and the bonded carrier. We explain how these material and integration choices improve gate control and reduce resistance, while adding capacitance, thermal resistance, and process complexity. Our measurements put Panther Lake’s 18A compute logic and TSMC N3E GPU logic at similar logic density. However, 18A does not lead TSMC N3P, N2 or Samsung SF2 in peak density. Panther Lake’s CPU cores are incremental updates, and the high-end GPU still uses TSMC N3E. Panther Lake assembles one compute tile, one GPU tile, and one I/O tile atop a passive base tile using Intel’s Foveros-S advanced packaging. Both compute tile variants use Intel 18A. The Xe3 GPU options are a 4-core GT1 tile on Intel 3 and a larger 12-core GT2 tile on TSMC N3E. Both I/O tile variants use TSMC N6. [1], [2] Our analysis centers on the PTL-U compute tile, both the 4-core and 12-core GPU tiles, as well as the 12-lane I/O tile. In conventional chips, power and signal are routed through the same frontside metal stack towards the device frontend. Power rails consume scarce routing resources near the transistors, while tall via stacks carry VDD and VSS from the coarse upper wires to local rails. Backside power delivery (BSPD) moves the main power network behind the transistor layer, to the backside, separating it from frontside signal routing. We covered BSPD and its impacts in 2024. [3], [4], [5] Intel’s BSPD implementation, branded as “PowerVia”, routes power through dedicated backside metals to nano-TSVs, which connect those rails to local source/drain (S/D) contacts. Implementing that separation requires Intel to build the interconnect stacks from both sides of the wafer. The frontside comprises the M0-M14 signal stack, while the backside comprises the BM0-BM5 power stack. M0 and BM0 are closest to the transistors. The nano-TSVs connect the two sides, but Intel patterns and etches each via from the front after forming the contacts. A narrow via runs from the side of the contact deep into the silicon substrate. Intel then completes the frontside signal metal stack, bonds the wafer to a carrier, flips it and removes the original substrate until the buried via tips are exposed. The backside metal stack is then deposited directly on the revealed vias. The nano-TSV and backside-via profiles taper in opposite directions because Intel forms them from opposite sides of the wafer. The transistor structures form the FEOL. Local contacts and nano-TSVs connect them to the wiring. M0 begins the frontside interconnect stack. The silicon carrier remains attached above the frontside interconnects. It supports the device wafer during substrate removal and backside processing and remains part of the finished chip’s thermal path. PowerVia removes the main power distribution from the congested frontside metals, routing supply through shorter and wider backside wires. Its lateral landing still occupies area in the standard cell, so it recovers less cell area than a direct backside contact. [3] Nano-TSVs beside the logic devices carry VDD or VSS from the backside power network, while signal connections continue upward through the frontside metals. Backside Interconnects Samsung SF2 data is included for comparison to Panther Lake’s within this article. SF2 is the incumbent GAA foundry node but lacks BSPD, serving as a useful reference to evaluate 18A. A full teardown of Samsung’s S26 products, processed on SF2, will be shared soon.Nanosheet-cut EDS comparison. The PowerVia supply path runs from the backside Cu rails through Mo-lined W nano-TSVs to the local transistor contacts. In this cross section, the tapered connection spans roughly 150 nm from the contact level to BM0. The Ta liner confines Cu and promotes adhesion to the surrounding stack; the AlOₓ etch stop controls the next dielectric etch above the rail. Dielectric beneath the ribbons electrically separates the devices from the backside wiring and removes the conducting silicon body below the channel. [6] AlOₓ serves as an etchstop (ES), enabling endpointing and protecting the underlying layers. Low-volatility aluminum fluoride reaction products resist the fluorinated plasma, allowing a thin AlOₓ film to protect the metal while the surrounding low-k dielectric is removed. [6], [7]. While the BM0 and layers above the M1 lines show double AlOx layers, Our SMIC N+3 teardown showed single AlOₓ layers. SMIC uses a simpler local AlOₓ substack, while the remaining cap and etch sequence provide the required landing protection. So why double layers? The closely spaced AlOₓ doublets provide two protected endpoints in the etch sequence. Intel documents an AlOₓ/SiN/AlOₓ stack that explains the benefit. The main dielectric plasma etch stops on the first AlOₓ film; a selective wet clear opens that film; a second plasma etch removes the intermediate SiN and stops on the second AlOₓ film. The final wet clear exposes the metal landing surface. SiN is the intermediate dielectric in Intel’s published example. [8] The second stop protects the metal through a cap breakthrough. Wide openings can etch faster than narrow ones, and etch depth varies across the wafer. Metal under an early-clearing opening would otherwise be exposed while other openings still need more etching. Staged protection widens the process window and reduces metal erosion, corrosion and void formation. [8] TSMC documents AlN/AlOₓ/SiOC/AlOₓ above Cu, with AlN blocking Cu diffusion, and a simpler AlN/SiOC/AlOₓ variant that omits one AlOx film. [9] Levels with different opening sizes, aspect ratios, pattern densities and cap materials need different etch margins. A double AlOx stop is useful where another protected endpoint justifies the added processing. The extra film adds formation, selective opening and cleaning steps, plus another set of interfaces to control adhesion, moisture, and stress. These blanket films are opened through the existing via pattern, so each film does not require another lithography mask. AlOₓ adds parasitic capacitance when it replaces lower-k dielectric; two thin AlOₓ films can nevertheless contain less AlOₓ than one thick film. Total thickness, placement, and theintermediate dielectric determine the electrical cost. Deposition chemistry also changes AlOx permittivity and residual hydroxyl content, which can oxidize the underlying metal. [7], [8], [10], [11] The backside stack separates into relatively fine BM0-BM2 wiring near the devices and coarser BM3-BM5 power distribution. The largest pitch increase occurs between BM2 and BM3. BM0’s pitch closely matches the logic-row height, fitting local power delivery to the cell rows. Higher levels aggregate current through larger conductors: routing density becomes less important than low resistance and current capacity as the network approaches the package. This hierarchy provides wide power wiring for the power delivery network without consuming scarce frontside signal-routing resources. [3] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Frontside Interconnects Intel 18A combines Mo-lined W contacts and nano-TSVs with a separate backside Cu power network. Samsung SF2 keeps power on the frontside, using Ti-based contact interfaces and Ta-based barriers and Co liners around Cu wiring. In 18A standard-cell rows, backside power rails supply the devices through nano-TSVs within the cells, freeing frontside routing resources. Samsung’s M0 accommodates both power and signal connections. From the device toward M0, the connection runs through a Ti-based S/D interface, W contact fill, a Mo-lined W via, and the Cu M0 wire. Mo supplies a conductive nucleation and adhesion layer for W, replacing the resistive TiN liner used in conventional W integration. This increases the effective conduction volume within the feature while retaining W fill and its established polishing, cleaning and etching processes. Intel’s Mo/W patent describes this integration tradeoff. The nano-TSV uses the same Mo-lined W construction in the backside supply path. [12] The move from TiN to Mo is an incremental change. While a full Co or Mo fill can also reduce the volume lost to liners in very small features, it requires new integration schemes that increase complexity and risk. Cu remains attractive for wider wires due to its low resistance. As wires and vias shrink, the diffusion barrier consumes an increasing fraction of their cross-section. [12], [12], [14] Intel uses Co/Ru liners at M0-M1, Co at M2-M4, and Nb at M5-M9. The lower-level liners help Cu adhere and reduce void formation during trench fills. Applied Materials’ Endura has new thermal control that facilitate wetting process, so the thin film continuity is good enough that good capillary pressure will drive Cu atoms to the via bottom without voiding. Intel’s choice to use Nb is particularly interesting. Intel’s Nb patent describes a conductive diffusion barrier intended to reduce the barrier’s contribution to resistance relative to conventional Ta-based barriers, particularly at via bottoms where all current crosses the barrier. The patent pairs Nb in coarser levels with the option of lower-cost PVD processing. [15], [16] The upper metal layers support thicker barriers formed through physical vapor deposition (PVD) despite its worse coverage and uniformity. Meanwhile, the lower metal layers require thinner barriers deposited through conformal atomic layer deposition (ALD). Co/Ru adds another material interface and requires controlled deposition and Cu fill. Changing liners and barriers by metal layer allows Intel to optimize interconnect resistance, process complexity, and reliability. [15, 16] RibbonFET, Intel’s name for its gate-all-around FETs (GAAFETs), replaces the FinFET’s vertical fins with four stacked horizontal silicon nanosheets, allowing the gate to surround the channel on every side. The path to GAAFET begins with the planar transistor. A planar MOSFET places the gate above the channel between its source and drain. Pairing an NMOS with a PMOS transistor creates a CMOS inverter, in which the NMOS pulls the output low for a high input, and the PMOS pulls it high for a low input. The gate must retain electrostatic control of the channel to ensure clean switching. As gate lengths shrank, the drain began to compete with the gate for that control, increasing off-state leakage. Electrostatic control was restored through an architectural evolution that raised the channel into a vertical fin and wrapping the gate around three sides. Called “FinFET”, this new architecture packed more effective channel width into a smaller footprint. Further scaling made it harder to maintain both drive current and leakage within smaller cells, and reintroduced the same problems planar MOSFETs faced. Nanosheet GAAFETs close the fourth side by replacing the vertical fin with a stack of horizontal nanosheets, each surrounded by the gate. The tighter electrostatic control suppresses leakage at shorter gate lengths while stacking adds effective channel width within the cell footprint. In a FinFET process, channel width changes in discrete steps as designers must add or remove whole fins. Nanosheet width can instead be adjusted continuously within the process’s design rules. Wider sheets increase drive current, while narrower sheets reduce capacitance at the cost of drive current. Intel 18A uses stacks of four nanosheets each and varies their widths across logic and SRAM. At the process level, adding more sheets to each stack increases effective channel width and drive current, but complicates fabrication. RibbonFET vs MBCFET Samsung began GAAFET production in 2022 with SF3E, following with SF3 and now SF2. Its ‘MBCFET’ provides a useful structural comparison with Intel’s first RibbonFET implementation. [17] STEEL is digging deeper into SF2, used in the Exynos 2600, and TSMC’s GAAFET N2, used in Apple’s A20 Pro, in upcoming newsletter articles. We’re throwing some teasers on X. Let’s compare Samsung SF2’s MBCFET with Intel 18A’s RibbonFET. Subscribe Even to the untrained eye, Intel’s extra nanosheet is obvious. Intel stacks four ribbons to Samsung’s three. Samsung’s sheets are much wider in these fields, so both sheet count and width matter to the available channel perimeter. Sheet width also changes which silicon surfaces carry current. On conventional (001) silicon, wide nanosheets emphasize the broad top and bottom surfaces, favoring electron transport; the larger sidewall contribution in a narrow sheet favors hole transport. Thinner sheets improve gate control but increase confinement and scattering. This makes width and thickness part of the NMOS/PMOS balance, alongside strain and threshold voltage. [18], [19] GAAFET designs like 18A use different work-function-metal (WFM) stacks for NMOS and PMOS. Around each ribbon, a thin SiOx interfacial layer separates the silicon channel from the HfOx high-k dielectric, with La providing dipole tuning and the WFM wrapping the dielectric. NMOS uses a TiAl-based stack, while PMOS uses TiN WFM. W fills the remaining gate trench, providing a lower-resistivity path where the work-function layers are no longer needed. In this field, the PMOS stacks leave room for W between ribbons, while the NMOS stacks occupy more of those gaps. A silicon-based dielectric marks the P/N boundary, allowing the PMOS and NMOS gates, sharing the same gate trench, to be processed sequentially. Fast logic paths, retention circuits, and SRAM need a family of threshold options. Changing threshold without substantially changing device dimensions, capacitance or fabrication complexity is valuable. FinFET processes typically use different work-function-metal stacks. In a four-ribbon GAA stack, the narrow sheet-to-sheet gap limits how much WFM can fit around each channel. La in the gate dielectric creates interfacial dipoles at the SiOx/HfOx boundary, shifting effective work function and tuning threshold voltage. This gives Intel another control alongside its NMOS and PMOS WFM stacks. Low-threshold devices improve critical-path drive; higher thresholds reduce leakage elsewhere. Dipole tuning is especially useful in GAA because it changes threshold without consuming the narrow intersheet gap with thicker WFM. Precise control of La incorporation, diffusion and interface quality has long been a challenge, limiting viability in high volume production but is now seen from every leading-edge foundry. Intel’s patent describes depositing a dipole-forming oxide above HfOx and annealing it toward the interfacial oxide before completing the work-function and fill metals. This separates threshold tuning from the space available for metal. Newer research addresses the thermal cost: imec’s 2026 dipole-middle research inserts the shifter between two HfOx depositions, shortening the diffusion path while protecting SiOx during patterning. [20], [21]Matched-cut EDS, Intel 18A (left) vs. Samsung SF2 (right). Intel retains raised source/drain epi beneath its contacts, while Samsung recesses W deep into the epi to form a V-shaped Ti-lined interface. The deeper contact increases metal-to-semiconductor area and shortens the current path from the lower sheets, reducing contact and spreading resistance. It also removes epi volume and brings the contact etch closer to the channel ends. Retaining more epi preserves the material available for strain transfer, especially from SiGe into PMOS. These geometries balance contact access against stress engineering and etch margin. [22], [23] Samsung stacks three sheets to Intel’s four ribbons, and both processes use sheet width to tune drive strength. In our Samsung cross-sections, widths range roughly from 19 to 30 nm in the NPU rows and 37 to 50 nm in the CU cell. The Samsung nanosheets taper, with the widest sheet at the bottom and the narrowest at the top. Both processes use HfOx gate dielectric and Ti-based work-function stacks, with Al in the NMOS stack. In the Samsung devices shown here, the dielectric and WFM occupy the intersheet gaps, leaving W above the top sheet. Intel’s PMOS stack leaves more room between ribbons, and W fills those gaps while the thicker NMOS stack leaves W mainly in the upper trench. Gate-stack EDS maps. The W between Intel’s PMOS ribbons provides a conductive path close to the lower gates. Where WFM fills the entire gap, the gate still surrounds the channel, but voltage reaches it through the more resistive work-function films. Thinner WFM and dipole tuning preserve room for low-resistivity fill; Mo and Ru are alternative fill metals being developed for further scaling. [24] A masked, sequential WFM flow explains the different gate heights and inter-nanosheet fill. The proposed sequence below shows how separate NMOS and PMOS work-function steps produce that geometry. Enabled by the BSPDN process, Intel replaces the dense-logic silicon subfin with dielectric, removing the parasitic conduction path below the ribbons and reducing substrate-related capacitance. A retained silicon body as in classical, non-SOI, planar and FinFET designs needs junction and punchthrough-stop engineering to suppress leakage. Dielectric isolation makes that leakage less sensitive to the subfin doping profile but adds removal and fill steps. It also weakens the direct thermal path through silicon, making the contacts, metal stacks and package more important for heat extraction. [24], [26] Fluorine is concentrated around selected Intel device structures in the maps. WF6 is a standard precursor for W nucleation and fill, while barrier films protect adjacent dielectrics from fluorine attack. Low-fluorine W processes reduce the residual-F burden. Chloride-based precursors avoid introducing F during W deposition, but require control of chlorine attack, nucleation and fill quality. The integration target is a continuous, low-resistance W path with a thin protective liner and minimal chemical damage to the surrounding stack. [20], [27], [28] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. We measured cell height, gate pitch, metal geometry, and ribbon dimensions at the XTEM sites shown below. The tables group these dimensions by site and device polarity. Our “sheet cuts” cross the silicon channel and show the ribbons end-on. “gate cuts” run along the channel through successive gates. The 18A logic cell dimensions point to a five-track logic library while the N3E and Intel 3 cell dimensions evidence a seven-track logic library. The DDR-PHY uses wider M0 wires and much larger spacing than core logic. That trades routing density for lower wire resistance and weaker coupling between neighboring nets. The geometry suits the current delivery and coupling requirements of analog, clock, and I/O circuitry. PowerVia lets 18A combine a compact cell height with wider M0 geometry by moving the main power rails off the signal-routing tracks. That relaxes local wire scaling while preserving a small cell footprint. Cell height and gate pitch set the geometric density; pin access and routability determine how much of it a real block can use. [29] The biggest takeaway from our gate-pitch measurements is that Intel 18A compute logic and TSMC N3E GPU logic have similar density in the Bohr representative-cell model. The 18A example is 18.6% denser than the Intel 3 GPU example. Gate pitches are nearly identical across the three sites, so cell height drives most of the difference. The Bohr model combines a four-transistor NAND2 spanning three gate pitches and a 32-transistor scan flip-flop (SFF) spanning nineteen pitches, weighting their densities 60:40. The sensitivity column shows how independently changing cell height and gate pitch by ±1 nm changes the result. This compares representative cell geometries; whole-die density also depends on cell mix and placement. The 18A P-core gives M0 substantially more metal cross section than the N3E vector engine. Treating each profile as a trapezoid gives 2.63 times the area per line and 1.84 times the area after normalization by routing pitch. The larger section reduces the geometric contribution to line resistance and lowers current density for a given current. Taller and wider wires also add capacitance, so circuit delay depends on the balance of resistance and capacitance. The DDR-PHY has less metal area per routing width than the 18A core fields, while remaining above N3E. [30] Area = height × (top CD + bottom CD) / 2, including liners. Area/pitch normalizes by routing width. Taper is the symmetric sidewall angle from vertical, with the largest angle belonging to the DDR-PHY. Compute tile The measurements show how ribbon dimensions and gate-stack geometry vary across the compute tile and between NMOS and PMOS to balance channel drive, gate load and the space needed for the dielectric/WFM stack across logic, SRAM and the DDR-PHY. Width mainly changes available channel perimeter; thickness also changes electrostatic control and carrier confinement. Gate-stack thickness then determines the space left for low-resistivity fill P-core and LP E-core logic Both the P-core and LP E-core use multiple nanosheet widths. Widths are measured on high-magnification XTEMs while wider-field images demonstrate additional width choices within the LP E-core. Multiple widths are expected even within an LP E-core. Timing-critical paths, buffers and cells with different fanout need different drive strengths. The lower-magnification fields show this width diversity beyond the sites quantified in the table. L2 and L3 SRAM GAA gives SRAM designers another way to balance the pull-up (PU), pass-gate (PG), and pull-down (PD) transistors. FinFET bitcells set device strength through fin count while GAA adds nanosheet width as a sizing knob. In a 6T SRAM cell, a strong pull-down relative to the pass-gate limits read disturbance, while a strong pass-gate relative to the pull-up improves writability. During a write, the pass-gate and write driver pull the node storing “1” below the inverter trip point. During a read, the pull-down holds the node storing “0” low. Bias, threshold voltage, mismatch and assist circuitry set the remaining margin. FinFET high-current cells commonly use a PU:PG:PD fin-count pattern of 1:2:2, a device-sizing ratio rather than a current ratio. Ribbon width lets Intel balance SRAM strengths without adding whole fins. The L2 cell uses its narrowest ribbons for PU and widest for PD, improving writability and read stability respectively. Intel’s disclosed HCC operates without assist; its denser HDC uses negative-bitline write assist. Pulling the selected bitline briefly below ground increases pass-gate overdrive so it can overpower the pull-up at lower supply voltage. That buys density and low voltage writability at the cost of boosting circuitry, switching energy, and additional voltage stress that must be controlled. [31], [32] Four rectangular ribbons give the perimeter = 8 × (width + thickness), before corner rounding. PG/PU is 1.49 and PD/PG is 1.16. The L3 structures closely resemble L2 in layout and cell height. Fewer L3 nanosheet widths are tabulated because fewer high-magnification images were available. DDR PHY The DDR-PHY trades density for controlled analog behavior and reliable off-chip signaling. It contains drivers, receivers, delay circuits, and calibration logic that set drive strength, sampling time, and voltage margin. Repeated four-sheet devices with similar widths fit the use of regular transistor units for matching and programmable drive. Its wider local wiring provides room for current delivery and separation of sensitive signals, while consuming more area than a dense core-logic grid. The layout serves the memory channel’s electrical requirements as well as digital logic density. [33] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Intel 3 GPU devices Vector engine logic Intel 3’s XVE logic uses two-fin PMOS and NMOS devices with power rails in M0. Its cell height and M0 pitch give a seven-track geometry, two tracks more than the 18A logic. One-fin groups also appear among the two-fin devices. Intel 3 L2 SRAM The Intel 3 L2 SRAM uses the familiar HCC sizing pattern: one PU fin, two PG fins, and two PD fins. N3E GPU devices Vector engine logic The N3E XVE field contains repeated two-fin devices with seven-track cell geometry. N3E remains a FinFET process, giving Panther Lake a direct FinFET-to-RibbonFET comparison. N3E L2 SRAM The N3E L2 SRAM uses the same PU:PG:PD fin-count pattern of 1:2:2. Panther Lake-U follows Lunar Lake’s floorplan quite closely. Both pair 4 P-cores with 4 LP E-cores and NPU, media and display engines in similar locations. Lunar Lake also uses Xe2, the direct predecessor to Panther Lake’s Xe3 GPU. This makes Lunar Lake the most direct basis for our comparisons. Arrow Lake differs in core count and uses the older Xe-LPG GPU architecture, so we only use it where it offers a more direct component-level comparison. Compute tile Panther Lake compute-tile floorplans remain sparse even months after launch. Intel 18A’s backside metal and dielectric stack must be removed without damaging the underlying structures before a clean transistor-level floorplan can be imaged. Most published die shots hide or heavily process the background, but we are quite proud of the die shot we achieved and are excited to show the work we have done. We measured the areas of the key components on the compute tile and compared them with their Lunar Lake predecessors on TSMC N3B. These help us to capture changes in block area and compare the two chips across process nodes and designs. Our total tile areas exclude the scribe-line area. The compute-plus-GPU subtotal below uses the PTL-U compute tile and GT1 GPU; it excludes the I/O tile and passive base. Individual block areas use the boundaries marked on the floorplans The compute-plus-GPU row is recomputed from the displayed PTL-U and GT1 areas. Component rows use their stated per-region counts and are not an additive partition of the whole tile. The P-core area remains almost unchanged between Lunar Lake and Panther Lake, despite L2 capacity increasing from 2.5 MiB to 3 MiB. Arrow Lake uses the same Lion Cove core as Lunar Lake but also has a 3 MiB L2. Cougar Cove fits 20% more L2 into the same P-core area. The larger private cache keeps more of each core’s working set close to its execution units, reducing access to shared L3 and DRAM. Extra capacity adds storage leakage and lookup energy, so designers balance it against avoided lower-level accesses. The shared P-core L3 cache also shrank by 14.8%. [2] Cougar Cove combines a similar footprint with Intel’s reported power-efficiency improvements. RibbonFET’s tighter channel control reduces leakage, while PowerVia reduces supply droop and allows tighter voltage guardbands. [1] Darkmont’s four-core LP E-core cluster is 5.0% smaller than Skymont’s on Lunar Lake, with most of the reduction in its L2 regions. The 1 MiB region shrank by 8.4% and the 1.5 MiB region by 14.9%. The tag arrays also use one fewer visible row. Tags identify which memory addresses the data array holds, so rearranging them changes the cache’s layout and wiring without requiring less data capacity. [2] The LP E-cores share one L2. This pools capacity and avoids duplicating all the cache machinery, but the four cores contend for its banks and bandwidth. Their separate cluster also keeps light work away from the performance cluster and its L3, allowing that larger domain to sleep. [1], [2] Cache area includes more than the storage cells. Tags identify each line, decoders select rows, sense amplifiers read the small bitline signal, and wires connect to the banks. Splitting an array into smaller sections shortens wordlines and bitlines, improving access speed, but duplicates peripheral circuits. Panther Lake’s smaller cache regions therefore reflect the complete memory implementation, including how much of each region is devoted to storage. [34] Unlike Meteor Lake and Arrow Lake, Panther Lake has no separate SoC tile. The NPU, LP E-cores, memory controllers, PHYs, media and display engines now share the compute tile. This removes an active die and keeps CPU memory traffic on one die. The cost is moving PHY and I/O-related circuitry onto 18A: drivers, receivers and analog circuits must still meet external voltage, loading and signal-integrity requirements, so their area does not shrink like dense digital logic. [1], [2] The biggest shrink comes from the NPU, which occupies 36.9% less area. NPU 5 consolidates the same total INT8 MAC count into half as many neural compute engines. Each of the three NCEs has a larger MAC array to make the complete NCE envelope 22.6% larger than an NPU 4 engine. Consolidation also halves the number of scratchpads and SHAVE DSPs, from 12 to 6. The MAC array handles matrix multiplication and convolution, while SHAVE executes vector and custom operations that fit the array poorly. [1], [2], [35] The paired floorplans identify each NCE envelope and its scratchpad, MAC, and SHAVE regions. Each measured MAC polygon is counted once per NCE in the area accounting below. The scratchpads store weights, activations, and intermediate results near the MAC arrays, allowing repeated use without fetching them again from DRAM. Halving their number delivers the largest measured area saving but leaves less local storage for the same total MAC count. Layers that no longer fit locally require smaller working tiles or more transfers of intermediate data. The benefit depends on keeping the enlarged arrays busy while managing that tighter storage budget. [36] NPU 5 also adds native FP8. Using half the operand width of FP16 reduces storage and transfer demand, helping workloads fit the smaller local memory budget. Lower precision and format-dependent range make scaling and model validation part of deployment. Hardware activation functions further reduce work that would otherwise occupy the programmable DSPs. [1], [2] Microsoft requires an NPU to deliver at least 40 TOPS for Copilot+ PCs. Both Lunar Lake and Panther Lake meet this threshold, but Panther Lake uses significantly less silicon. GPU tiles Panther Lake is Intel’s first product with Xe3, its latest GPU architecture. It offers two different GPU tiles: a smaller GT1 tile with 4 Xe3 cores on Intel 3 and a larger GT2 tile with 12 Xe3 cores on TSMC N3E. Panther Lake allows us to compare the same GPU architecture across both Intel 3 and TSMC N3E. Wildcat Lake adds a third Xe3 implementation on Intel 18A. A future newsletter will detail Xe3 and its implementation differences across all three process nodes. GT2 scales Xe3 to a different physical layout, with render slices arranged vertically instead of GT1’s horizontal arrangement. Slice placement sets the distances to shared cache banks and the D2D interface. Those wires consume area and add delay, so scaling the number of Xe cores also requires a new balance of cache placement, routing and timing. [1] What’s immediately obvious is that the GT2 tile on TSMC N3E has much smaller Xe cores than GT1. These block areas include logic, caches, and routing. An Xe core on the GT1 tile is ~69% larger than one on Lunar Lake, and ~55% larger than one on GT2. Intel 3 therefore uses substantially more area per Xe core. The block-area gap exceeds the measured logic and SRAM density gaps, bringing routing, timing targets, cell mix, and floorplan allocation into the comparison. The measured vector/matrix engine region is almost unchanged between Lunar Lake and Panther Lake’s GT2 tile. Xe3 retains eight 512-bit vector engines and eight 2048-bit XMX engines per core. Its gains also come from feeding those engines more effectively: more resident threads hide stalls, and variable register allocation lets shaders trade registers per thread against the number of threads kept active. [1] The shared L1/SLM capacity increased by 33% from 192 KiB to 256 KiB, while its area increased only 5%, raising effective density by 27%. L1 retains reused cache lines, while software-managed SLM lets a thread group share data locally. Both reduce traffic to more distant memory. Allocating more SLM per group can also limit how many groups reside on a core at once. [1], [37] The GT1 tile carries 4 MiB of L2 against 16 MiB on the GT2 tile. GT1 divides its L2 cache into four 1 MiB banks, while GT2 uses eight 2 MiB banks. Each bank contains 128 macros, but each N3E macro stores 16 KiB, twice the Intel 3 macro’s 8 KiB capacity. The N3E macro is only 54% larger while holding twice as many bits, giving it 30% higher density: ~23.7 Mbit/mm² versus 18.3 Mbit/mm². Including bank-level circuitry, the gap widens to ~16.9 Mbit/mm² on GT2 versus ~10.4 Mbit/mm² on GT1. GT2 gains density with its macros storing more bits per unit area, and those macros occupy more of each cache bank. Larger macros spread decoder and sense-amplifier overhead across more storage, while a more compact bank layout reduces the share spent on control and routing. The compromise is longer wordlines and bitlines that carry more capacitance. [34] I/O tile Panther Lake uses two I/O tile variants, both fabricated on TSMC N6. The smaller one provides 4 PCIe 5.0 and 8 PCIe 4.0 lanes and serves lower-tier systems as well as those without a discrete GPU, while the larger one adds 8 PCIe 5.0 lanes, bringing the total to 20 lanes, for discrete-GPU connectivity. Panther Lake SKUs with the larger 10- or 12-Xe GPUs use the smaller I/O tile. [38] The smaller I/O tile adds a PCIe 4.0 block and a Thunderbolt block to Lunar Lake’s I/O layout, providing four additional PCIe 4.0 lanes and another Thunderbolt 4 port. Its repeated N6 blocks retain nearly identical areas and layouts. Reusing these proven PHYs and controllers avoids porting and requalifying external interfaces on 18A, where faster digital logic offers less benefit to circuits constrained by the off-chip link. [38] SemiAnalysis’s teardown lab (STEEL) dives deep into the world’s advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. We’re hiring technical experts from system to transistor and everywhere in between. Check out our Careers page. Panther Lake offers scalability and modularity through its disaggregated packaging that partition compute, GPU, and I/O silicon into separate tiles allowing for a suite of tile configurations. This partitioning makes the package part of Intel’s node economics as it determines how much leading-edge wafer area each product consumes, which functions can remain on other processes, and how much configuration freedom Intel can offer from a shared set of tiles. Furthermore, fabricating the compute and GPU tiles separately confines the new 18A process to the compute tile and allows graphics and I/O to use other, more established, and more cost-effective processes. For Panther Lake, the GPU and I/O tiles are assembled alongside the compute tile on a passive silicon base using Foveros-S. Intel’s current technology brief lists a nominal 36 µm pitch for Foveros-S. Through-silicon vias (TSVs) in the base connect the fine wiring above to the larger package connections below. The functional tiles sit side by side on that passive base in a 2.5D configuration. [39] Our cross-section through the compute and GPU tiles shows the package’s wiring hierarchy. Microbumps connect each active tile to the passive silicon base; its fine redistribution layer (RDL) carries the short, dense tile-to-tile links. TSVs carry connections through the base to the package substrate, which fans them out to the much coarser motherboard solder joints. The base supplies interconnect, while computation remains in the active tiles above it. [39] At the compute-tile edge, the higher-magnification inset shows a local microbump spacing of approximately 25.24 µm and a feature width of 12.33 µm. These local spacings are finer than Intel’s nominal Foveros-S value. The X-ray fields further confirm tighter neighboring bumps, consistent across every die-to-die area found on each tile. Additional X-ray analysis is offered after the paywall. Putting the memory controller beside the CPU removes the D2D transfer that CPU memory requests required in Meteor Lake and Arrow Lake. This avoids the extra transmitter, receiver, and link traversal, saving interface energy and latency. Panther Lake’s separate GPU still crosses a D2D link to reach DRAM, so its larger local caches also help contain package traffic. [1], [40] Smaller dies are less likely to contain a random fatal defect, and screening them before assembly prevents one bad tile from consuming a complete package of good silicon. Reuse also spreads design and qualification work across more products. Against those gains, Intel pays for the passive base, D2D circuits, extra bonding and test steps, and losses during assembly. Cost per working product across the portfolio captures the combined effect of wafer yield, reuse, test, and assembly. [29] Wildcat Lake packaging Intel launched Core Series 3, formerly Wildcat Lake, on 16 April 2026 for value mobile and edge systems. Wildcat Lake keeps 18A but removes the passive base and combines more functions on one die to simplify the package. The two products therefore reveal two distinct ways to commercialize the same leading-edge process. [41] Wildcat Lake’s 18A die combines up to two Cougar Cove P-cores, four Darkmont LP E-cores, two Xe3 cores and a smaller NPU. A separate platform-controller die supplies I/O, connected through UCIe, Intel’s first processor implementation of the standard. Consolidating graphics remove a tile boundary and the passive base, reducing assembly complexity for a modest-bandwidth value product. It also ties CPU and graphics scaling to the same die, giving up Panther Lake’s ability to swap in a much larger GPU. [42], [43] In July 2021, Intel CEO Pat Gelsinger set out an ambitious process roadmap aimed at regaining performance leadership by 2025, later described as five nodes in four years. Five years and one CEO later, Intel’s comeback story is not as unambiguously positive as Pat may have hoped. [44], [45] Intel once set the pace for process technology, bringing high-k metal gate technology and FinFETs into volume production years ahead of the rest of the industry. Its 22 nm FinFET process reached consumers with Ivy Bridge in 2012. [46] Intel’s integrated device manufacturing (IDM) model allowed its architects and process engineers to co-optimize products and processes. Starting with Sandy Bridge, Intel dominated x86, while AMD struggled with Bulldozer. That lead faltered at 14 nm and broke at 10 nm. Intel targeted a massive 2.7× density increase, but the node arrived years late and required several revisions before it could support Intel’s full lineup. This delay forced Intel to stretch 14 nm across six generations, while TSMC moved ahead in process technology and AMD recovered in x86. By 2019, Intel was still shipping 14 nm across most of its product stack, with its 10 nm client ramp focused on Ice Lake mobile processors. Meanwhile, TSMC was shipping N7 and N7+, and AMD’s Zen 2 compute chiplets used N7 to raise core counts and improve efficiency. Intel’s process failures were central to its decline, but unsound business decisions furthered their downward slide. Product delays compounded product mistakes, pushing client, server, and FPGA roadmaps off schedule. Several attempts to enter AI (Nervana and Gaudi) and networking (Tofino) also failed to establish lasting businesses. Intel’s recovery has focused on consumer CPUs and advanced packaging. Tiger Lake, Alder Lake, Lunar Lake and now Panther Lake have restored Intel’s consumer roadmap. On the process side, Intel 4 shipped with Meteor Lake, Intel 3 with Granite Rapids and Sierra Forest, and Intel 18A with Panther Lake. Intel has also made advanced packaging part of its foundry offering. However, Intel is still playing catch-up in servers. Several Xeon generations arrived years late and trailed contemporary AMD and Arm server CPUs in performance, efficiency, and core count. The process roadmap is back, but Intel does not hold the same process-technology leadership position it held prior to 10 nm. The introduction of gate-all-around nanosheets and backside power delivery are two of the biggest changes to transistor integration in a decade. Intel took on both changes at once: 18A paired its first RibbonFET with PowerVia in Panther Lake. Panther Lake is a substantial manufacturing milestone. Our cross-sections show how RibbonFET and PowerVia reshape local contacts and wiring, while the floorplans show where architectural consolidation and process choices save area. A sustained competitive lead depends on product performance, cost, yield, and the next implementation. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page.. 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How to Protect Yourself From Wildfire Smoke
New evidence suggests wildfire smoke is particularly harmful. Luckily, there are ways to stay safe.
Yankees Handed Rotation Prediction for Red Sox Wild Card Series
For the second straight year, the New York Yankees will face the Boston Red Sox in the Wild Card Series. The question will be who the Yankees will go with to open the series, and WFAN’s Chris McMonigle already sees how New York will line up its rotation for this series. Rather than having Cam […] The post Yankees Handed Rotation Prediction for Red Sox Wild Card Series appeared first on HEAVY.
Northwestern Wildcats Fall Just Short Against No. 5 Indiana
The Wildcats fought until the end against the Hoosiers in Bloomington.
Red Sox eager to ‘take care of business’ in Wild Card rematch with Yankees
Members of the Red Sox are eager to ‘take care of business’ after Wild Card rematch with Yankees made official
What to watch for when Arizona football visits Washington State
Though Arizona has already played a conference game, Saturday’s trip to Washington State feels like the end of the warmup portion of the 2026 season. Starting next week the rest of the opponents are in Big 12 play. The Wildcats (2-1) are seeking their fourth consecutive 3-1 start, which last happened during Rich Rodriguez’s first […]
Stunned scientists discover new wild cat species after a century—see the photos - Futura-Sciences
A Mysterious Cat in the Clouds High in the Andean forests—almost always wrapped in mist—a pint-sized cat was living its life unnoticed by the scientific community, although locals might have crossed its path many times. The story kicked off in 2016, when a Bolivian animal shelter contacted biologist Paola Nogales-Ascarrunz...
What is the Diamondbacks’ path to the 2026 MLB postseason?
PHOENIX – With just three games left in the 2026 MLB season, the Arizona Diamondbacks have created one final opportunity to make October. The D-backs enter the final weekend two games behind the Philadelphia Phillies for the National League’s final Wild Card spot.
Scientists clone Southern Africa’s wild fruit trees as forests disappear
Plant geneticist Alice Muchugi recalls meeting a group of furious fruit sellers on the side of a dusty road not far from Zimbabwe’s capital, Harare, in 2024. They told her that a group of men armed with chainsaws had felled some of the district’s most prolific fruit trees, robbing the women of a steady source […]
After seven years, a spacecraft company is releasing its Otters into the wild
There is always a tension that comes with seeing the first of anything fly."
Next Week on XBOX: New Games for September 28 to October 2
Minecraft Dungeons II, Gears of War: E- Day Premium Edition, Ace Combat 8: Wings of Theve, The Witcher 3: Wild Hunt — Remastered, and more coming soon to XBOX.
Focus: Americans navigate 'wild West' of health insurance options after dropping Obamacare plans
When Stacy Cox, a self-employed photographer in Kanab, Utah, dropped her Obamacare health insurance plan this year, routine preventive care became a financial dilemma. Now she finds herself weighing $1,200 for a mammogram against survival of her business.
Alex DeBrincat, Moritz Seider Get in Double Fight vs. Sabres
Alex DeBrincat and Moritz Seider dropped the gloves in a wild double fight during Detroit’s preseason game against Buffalo.
13 Terrifying Statistics That Will Keep You Up At Night
"But if you stop and think about it, it's actually pretty wild."
Thomas Sorber Is Thunder's Forgotten First-Round Wild Card
Hidden behind injuries and draft-day hype, the physical Georgetown product offers a bruising interior presence and elite wingspan that could redefine the Thunder’s versatile frontcourt rotation.
3 things to watch for as Indiana football hosts Northwestern
Indiana starts Big Ten play on Friday night with a home game against the 2-0 Northwestern Wildcats.
Wild GM Bill Guerin’s contract reportedly has been extended
Minnesota Wild general manager Bill Guerin reportedly has signed a contract extension, another sign of the organization’s all-in pursuit of a Stanley Cup title.
Free Play Days – PGA TOUR 2K25, The Escapists 2, Young Suns, and The Division 2
This weekend, Polterguys: Possession Party is available this weekend for XBOX Game Pass members, while WWE 2K26 and Wildgate are free for all. Jump in!
The Witcher 3: Wild Hunt – Remastered Global Release Times Confirmed by CD Projekt
CD Projekt has confirmed the global release times for The Witcher 3: Wild Hunt – Remastered. Here's when you can play in your region.
Three Glaring Issues for the Yankees Heading Into the Postseason
The New York Yankees have played the majority of their season without Aaron Judge, and until Wednesday, it looked like that would continue into the Yankees' postseason action. But Judge does intend to be available in time for New York's Wild Card series against the Boston Red Sox, which would have major implications for the …
In rural Pa., doctors confront the hidden health impacts of environmental disasters
This article originally appeared on Inside Climate News, a nonprofit, non-partisan news organization that covers climate, energy and the environment. In February 2023, George Garrow jumped in his car and hurried to help people impacted by a freight train that had derailed in East Palestine, Ohio. The crash happened about a quarter-mile west of the […]
Aaron Boone Gives Surprising Yankees Wild Card Rotation Update
The New York Yankees have a huge Wild Card series coming up against the Boston Red Sox for a chance to compete for the World Series. Aaron Boone has lucked out with a tremendous MLB pitching staff of superstars giving NY a viable chance in every series. However, a new quote from Boone claims that […] The post Aaron Boone Gives Surprising Yankees Wild Card Rotation Update appeared first on HEAVY.
How the Cubs Playoff Rotation is Shaping Up
With the MLB postseason race shaping up, the Chicago Cubs' playoff rotation is becoming clearer. They have occasionally had a rough time with their pitching staff this season, and it has been hard to know who they can trust. However, they are heading for a best-of-three series in the Wild Card round. This means that …
Phillies playoff tracker: Wild Card race, clinching scenarios and seeding
Track the Phillies’ path to another Red October, including their magic number, Wild Card standings, remaining schedule and potential playoff matchups
Octopuses Can Disappear Right Before Your Eyes: Here’s The Incredible Science Behind Their Powers
The octopus rarely stays the same shape or color for long. In the wild, its ability to disappear against a shimmering coral or jagged rockface continues to baffle even the most experienced marine researchers. These creatures transform their appearance not only in an instant, but with a precision that seems logic-defying.
Can the Marlins Spoil Another Cubs' Clinching Opportunity?
With an 8-2 win on Tuesday, Miami tripped up Chicago on their way to the Wild Card
Judge’s Calf Injury Leaves Yankees Without Captain For Wild Card
Aaron Judge likely misses the first playoff round due to a calf strain. The Yankees must win without their MVP as they host Boston.
Lawrenceville hosts Around the World in the DTL this weekend
Presented by the city of Lawrenceville and the wildly popular International Night Market, Around the World in the DTL is set for this weekend on the Lawrenceville Lawn on Luckie
Yankees Are About To Make Huge Mistake With Gerrit Cole
The New York Yankees seem destined to start Gerrit Cole in the Wild Card Series
Wildfire Smoke Is an Escalating Public Health Crisis
Wildfires produce immense smoke and chemicals that can impact the health of individuals across cities. Discover global wildfire trends and how to prepar...
Fans Seem to Think The Witcher 3 Remastered Looks Worse Than the Original
The Witcher 3: Wild Hunt Remastered comes out in about a week, and when CD Projekt Red put out a comparison clip on Twitter, some fans really didn't like what they saw.
Short-series science: Why one wild-card opponent fits Phillies better than the rest
The race for the National League Wild Card spots got a little wilder on Tuesday night. The Phillies defeated Milwaukee; […]
Feline film fest, kid builders and a wild gala at the LASM: 3 things to do this weekend
Our top 3 picks for your weekend ...
Monster Hunter Wilds: Ascendance Is the Iceborne-Like Adrenaline Boost That Wilds Needed
The first taste of Monster Hunter Wilds: Ascendance already has me salivating. The new tricks, new (and returning) monsters, and brand new suite of boosts are going to significantly disrupt how I do my builds, and how I approach hunts. Just thinking about it now has my synapses firing, and there are still so many weapons who're boosted actions I have yet to try, and who knows what new armor set bonuses might be ahead of us. The endgame of Monster Hunter Wilds was too easy, but this might be what Monster Hunter sickos are looking for.
Wild announce Spectrum deal under new TV contract
Spectrum customers will be able to watch Minnesota Wild games this season.
Why this version of Astros is the 'worst' since 2014
This has been a wildly interesting season for the Astros.
Behind closed doors, the politics of solar geoengineering are shifting
More politicians in the U.S. and around the globe are taking a look at sunlight-reflecting technologies, two experts said.
Wildlife management should be based on science not emotion (Opinion)
Wildlife research is essential because it protects biodiversity, guides conservation policies, and helps humans understand complex ecosystems. Without that research wildlife conservation/management and human/wildlife conflict mitigation would be equal to swinging a plastic pool noodle...
Yankees news: Judge expected to miss first round
The captain unlikely to return for Wild Card Series; Rays clinch East, Yankees to host Red Sox in Wild Card round; pitchers’ steady devaluation
What Carlos Rodon gem does for Yankees’ postseason rotation
The Yankees probably will be playing the Red Sox in a best-of-three Wild Card Series when the postseason begins next week.
Sunderland’s Etihad Adventure: Brobbey, Banter & Beautiful Chaos
From a chaotic journey to Manchester to a wild afternoon at the Etihad, Sunderland showed they can compete with the best - but can they turn promise into points?
Boom Year for Desert Blooms
Carpets of wildflowers burst from arid, ochre-colored land in Western Australia following winter rains.
First New Wild Cat Species Identified in Over 100 Years Is An Adorably Tiny 'Tiger'
A once-in-a-lifetime discovery.
Dodgers notes: Blake Snell, Dalton Rushing, Will Klein
LOS ANGELES — It’s the final week of the regular season and the Dodgers are sorting things out as they prepare for the postseason, which they hope will start on October 3 in the National League Division Series rather than September 29 in the wild card round. Before Tuesday’s game, Blake Snell pitched a bullpen […]
Grand Canyon businesses report their hardest year amid wildfires and deadly flooding
The Grand Canyon has seen a decline in visitation numbers over the last year and likely this year as well.
Maui Wildfire Exposure Study gets $6M in federal funding to extend post-fire health tracking to 2031
Two grants from the National Institutes of Health will allow a critical post-wildfire University of Hawai'i study to continue and expand.
Rain transforms Florida Everglades after drought, benefiting wildlife and businesses
How can the Diamondbacks still make the 2026 MLB postseason?
PHOENIX – With six games remaining, the Diamondbacks are still alive in the NL Wild Card race, but barely. Arizona sits four games behind Philadelphia for the third National League Wild Card spot.
Wild reportedly sign GM Bill Guerin to multi-year extension
Guerin has overseen the Wild front office since taking the GM role in 2019.
2 wild animals in Harford County test positive for rabies, health officials warn
Two wild animals in Harford County recently tested positive for rabies, the Harford County Health Department announced.
Why scientists want your photos of wildlife eating lunch
With a new platform called Who Eats Whom, citizen scientists reveal the fascinating, sometimes shocking interactions between species.
Why scientists want your photos of wildlife eating lunch
With a new platform called Who Eats Whom, citizen scientists reveal the fascinating, sometimes shocking interactions between species.
Yankees' Aaron Judge set to miss wild card series, says Aaron Boone
Judge was placed on the IL last week with a calf strain.
How The Dogist turned dog street photography into a business
Seeing a puppy in the wild sparks joy for any dog lover. But when you spot a puppy with The Dogist, you're also on a mission to meet it.
How The Dogist turned dog street photography into a business
Seeing a puppy in the wild sparks joy for any dog lover. But when you spot a puppy with The Dogist, you're also on a mission to meet it.