SCROLL NEWS / DISCOVERY
Search headlines
Find the stories shaping the conversation.
Results for " covering " 746 found 🔀 AI-powered Shuffle
Citizen Science Reveals A Hidden Map Of Sharks And Rays In Mozambique
Citizen science data from iNaturalist reveal 44 species of sharks and rays in Mozambique, covering about a third of known national diversity. Most records are from southern regions and many species are threatened, highlighting both the power and the bias of crowd-sourced biodiversity data.
Local businesses recovering after recent flooding
KERRVILLE, TEXAS - Cleanup is underway at a strip mall of Junction Highway in Kerrville after two feet of water tore through businesses. Stephen and Alton Flore
Local businesses recovering after recent flooding
KERRVILLE, TEXAS - Cleanup is underway at a strip mall of Junction Highway in Kerrville after two feet of water tore through businesses. Stephen and Alton Flore
Rice materials science triumphs with pair of Telly Awards
Rice is a double winner in the 47th annual Telly Awards, which honor excellence in video and television. The university won a silver Telly in the Education and Discovery category for a social media series titled “Discovering Materials Science and Engineering: Engineering Solutions for a Changing World,” which followed freshmen as they were introduced to how materials shape the world in a materials science and nanoengineering course of the same name. Additionally, Rice won a bronze Telly in the Educational Institution category for a nonbroadcast campaign titled “RAMI Undergraduate Research Fellows at Rice University,” which showcases cutting-edge undergraduate research.
PSN Down But Slowly Recovering After Amazon Web Services Outage
Not quite full health yet
New cost for local businesses? Winter Garden weighs 5% tax increase
Winter Garden commissioners are expected to vote Thursday on a proposal to increase the city’s local business tax by 5%, a move city leaders say is needed to keep pace with inflation but one that comes as some downtown businesses continue recovering from months of disruption.
Jonathan Jones confirms CBS Sports departure
CBS Sports will be in need of a new NFL reporter and insider when their coverage of the 2026 season begins this fall as Jonathan Jones is leaving the company. Jones first joined CBS in 2019 after tenures nationally at Sports Illustrated and locally covering the Carolina Panthers for the Charlotte Observer. Earlier this month,…
CNN, Variety expand partnership for entertainment programming
CNN and Variety are expanding their relationship through a long-term partnership covering entertainment programming, live ... Read More
Seedy K’s Ville Report: La Familia III
For reasons soon to be explained, this can’t be called a GameCap. I had every intention of covering it normally. Running box score on the MacBook. Notepad in hand. Then, at 4:52, I got a call from my ex-, with whom I’m better friends than ever. Even when we were together. It was granddaughter — […]
Mamdani battles politics tied to Legionnaires', failed Israeli PM arrest threat
Since discovering the outbreak in early July, five New Yorkers have died from Legionnaires' disease.
Health Care Roundup: Market Talk
Find insight on CSL, Sandoz Group and more in the latest Market Talks covering the Health Care sector.
2nd flood in a week in Gallup damages businesses
GALLUP, N.M. (KRQE) – Residents in Gallup are cleaning up the aftermath left by floods covering entire streets. City leaders said they haven’t seen a storm like this in years. Those waters ha…
Beyond the byline: Rediscovering the magic of pure sports fandom
How my experience at Fanatics Fest 2026 resurrected my inner child.
Businesses begin recovering after Cincinnati neighborhood hit with flash flooding
How eczema and acne can affect your mental health
Scientists are uncovering a complex communication network linking the skin, immune system, and brain—one that could transform how chronic skin disease and mental health are treated.
Hyde Park residents, business owners recovering after floodwaters take over neighborhood
Residents, business owners left to pick up the pieces after extreme flooding impacts Hyde Park.
Rock music pioneer known for discovering legendary band dead at 83
He had been in hospice for several weeks.
Uber Announces Acquisition Offer for Delivery Hero
Cash consideration of €41.50 per share offered to all Delivery Hero shareholders, representing an Equity Value of $14.8 billion, or $13.7 billion adjusted for Uber’s prior stake purchases The transaction is expected to be accretive to Non-GAAP EPS upon close; high-single-digit percentage accretion by year three Delivery Hero has separately agreed to sell part of its business covering 14 markets to SSW Partners Management Board and Supervisory Board of Delivery Hero unanimously welcome and support the Takeover Offer and intend to recommend Delivery Hero shareholders to tender into the offer, subject to their review of the Offer Document Prosus has irrevocably committed to tender their shares, which would bring Uber’s total economic interest to ~53% Uber Technologies, Inc. (NYSE: UBER) has entered into a business combination agreement with Delivery Hero, extending the world’s largest mobility and delivery platform to a total of 99 markets, with combined pro-forma Gross Bookings of $236
ZeniMax Online Studios leadership to exit as part of Xbox cuts
There are major changes happening atop Maryland-based ZeniMax Online Studios, developer of the Elder Scrolls Online, Game File has learned. Joe Burba, a 14-year veteran of the studio who was appointed to run it last July, is departing, along with ESO executive producer Susan Kath, studio game director Rich Lambert and production director Ala Diaz. Their roles were listed among hundreds of others cut last week from the Maryland offices of ZeniMax, in a WARN letter sent to the state by ZeniMax and obtained today by Game File. Tonight, BUrbam Kath, Lambert and Diaz notified Zenimax Online Studios workers of plans to “transition” to a new leadership team consisting of promoted ZOS veterans. That transition will occur “over the next few months,” they told workers, according to a copy of the notice reviewed by Game File. “We will remain in place during the transition period to help ensure a smooth handoff.” Last week, Microsoft laid off of 1,600 workers across its vast gaming teams in locations around the U.S. and abroad. Just who has been impacted and how hard various studios have been hit has been emerging day by day. Game File reported last week that Microsoft/ZeniMax notified officials in Maryland that 379 gaming jobs were being cut across the state. They tallied cuts in two locations: one for ZeniMax Media Inc. (covering Elder Scrolls/Starfield/Fallout-maker Bethesda Game Studios and central Bethesda game publishing) and one for ZeniMax Online Studios (Elder Scrolls Online). More than 200 jobs were cut at the latter. Last week’s totals did not reveal job titles, nor did Microsoft announce any leadership changes in the ZeniMax group. That has now happened. Earlier today, Game File obtained from Maryland officials a breakdown of the 379 impacted roles, which, extraordinarily, included “studio head.” Microsoft later confirmed to Game File which studio head that referred to: ZeniMax Online Studios’. Microsoft has since has notified studio employees and internally announced new leadership. ZOS will now be run by Josh Henderson, previously head of business operations at the studio, and Nick Giacomini, who was promoted to game director for ESO last August. Game File is a reader-supported publication. To receive new posts and support my journalism, please consider becoming a free or paid subscriber. Subscribe Last week’s news of 200+ cuts at ZeniMax Online Studios generated public sympathy for those workers and questions about the long-term viability of the Elder Scrolls Online. ESO is a massively multiplayer online game that inherently persists on the strength of new content being developed for it. Earlier today, fans and workers in Maryland protested the cuts at the ZeniMax teams in a rally organized by the Communication Workers of America, the union that represents many of the impacted employees. Regarding concerns around the game, a community manager stated on Saturday: “The plan is still to deliver great content, and we will hopefully have an update soon.” In their note to the studio today, the outgoing leaders of ZeniMax Online Studios predicted “growth” for the game: We have tremendous confidence in Josh and Nick, the future of this studio, and the continued growth of ESO. With exciting experiences still ahead for our players as we wrap up work for Update 51 and beyond, we believe that your passion, creativity, and commitment to each other and the community will continue serving as the heartbeat of ESO. The list of jobs cut in the ZeniMax WARN notice in Maryland includes several very senior roles, including: Studio Head Studio Operations Director Studio Game Director Studio Audio Director Studio Art Manager Vice President and Controller VP, Global Sales & Business Development While some of those job descriptions match the exiting ZOS leadership team, Game File couldn’t verify if all were from that studio. The full list of cut roles shared by Maryland officials also covers workers at Bethesda Game Studios and its central publishing office. The following is an excerpt: The list of 379 eliminated ZeniMax jobs in Maryland also includes: four animators three bilingual CS (community service) leads for Chinese, Italian, and Japanese a creative director for the Elder Scrolls Online Player Life Cycle two food service workers seven producers more than 60 senior QA testers. and many others The WARN notice states that almost all of the 379 workers were notified of their layoff on July 6. In fine print, it states: “Approximately 9 employees were notified of the elimination of their position prior to July 6, 2026.” A 2021 mega-merger scaled back Microsoft announced in 2020 that it intended to buy ZeniMax and its network of game studios in 2020, and closed the $7.5 billion deal in March 2021. The purchase, which preceded Microsoft’s acquisition of Activision Blizzard, added several award-winning studios to Microsoft’s portfolio, including Bethesda (Elder Scrolls, Fallout), Arkane (Dishonored), and id Software (Doom). The studios’ output since then included a 2024 Game of the Year contented from MachineGames in the form of Indiana Jones and the Great Circle along with Starfield from Bethesda and the poorly-received Redfall from Arkane Austin. In recent years, a Microsoft repeatedly in cutback mode closed ZeniMax’s Tango Gameworks (which was reconstituted by Krafton) and closed Arkane Austin. The Xbox cuts last week have hit the ZeniMax group hard, with 158 jobs eliminated in Texas, many of them at id, and 379 from the ZeniMax teams in Maryland. Xbox also said last week that it would be entering a consultation process around Arkane Lyon, a process expected to end in a sale, shutdown or other form of divestment. The Lyon team has been working on a game tied to Marvel’s Blade vampire-hunting super-hero.
Future scientists explore the wonders of biology at STC summer camp
From growing plants and examining cells under microscopes to culturing bacteria and dissecting organisms, middle school students are discovering the excitement of science through STC annual Biology Explorers Camp.
In Good Health: The Alzheimer’s Research Revolution
An Alzheimer’s diagnosis can have a real impact on a person and their family. There’s a lot to consider — what the future will hold, what symptoms they’ll experience, and on what timeline.About 7.5 million people in the U.S. currently suffer from Alzheimer’s. Every year, around half a million more are diagnosed with the disease or another form of dementia. As the population gets older, that figure will continue to rise.For decades, researchers have struggled to understand these kinds of diseases. But when it comes to testing and treatment, particularly for Alzheimer’s, there have been significant advances in the past few years.In this installment of our series, “In Good Health,” we tackle the revolution in dementia research. What will that mean for patients?For more information on dementia research, find Pam Belluck’s latest reporting at the New York Times. And Dr. Karlawish’s “Neurotransmissions” column at STAT News, covering dementia care and research.Find more of our programs online. Listen to 1A sponsor-free by signing up for 1A+ at plus.npr.org/the1a.
3 businesses recovering after fire in Lebanon County
The cleanup continues after a fire damaged three businesses and an apartment in Lebanon County on Saturday morning.
Holland & Knight Health Dose: July 14, 2026 | Insights
Weekly healthcare policy briefing covering congressional action, FDA and CMS developments, 340B reform, Medicare updates, AI oversight and key regulatory changes.
How is Mitch McConnell’s health? When is his term up? See the latest
When will Sen. Mitch McConnell's term end? GOP powerhouse says he is recovering from a fall and pneumonia while continuing to work on Senate business.
Data Sharing in Life Sciences: How to Share Research Data Without Sharing What You Shouldn't
Discover how to manage research data sharing in life sciences, covering NIH and UKRI funder mandates, GDPR compliance, embargoes, and data availability rules.
Mitch McConnell shares health update after fall, now in rehab
Sen. Mitch McConnell says he’s recovering at a rehabilitation center after a fall last month and a mild case of pneumonia. He’s not yet cleared to return to the Senate floor to vote, but says he’s continuing to work with his staff during recovery.
After weeks of questions, McConnell provides information on health
Former Senate Majority Leader Mitch McConnell on Sunday ended weeks of speculation about his health with a statement saying he’s on the mend. The Republican, who was hospitalized June 14, issued a letter to fellow Kentuckians telling them he has been recovering from a fall, followed by what he termed “a mild case of pneumonia.” […]
Sen. Mitch McConnell breaks silence, says fall led to hospitalization
Sen. Mitch McConnell says he was briefly unconscious after a fall and later developed pneumonia but is now recovering at a rehabilitation center.
Tencent Music Entertainment Group Sponsored ADR (NYSE:TME) Given Average Rating of "Hold" by Brokerages
Tencent Music Entertainment Group Sponsored ADR (NYSE:TME - Get Free Report) has earned an average recommendation of "Hold" from the fourteen ratings firms that are presently covering the firm, Marketbeat reports. Eight equities research analysts have rated the stock with a hold rating and six have
At Family Science Night, Wonder Comes Before Answers.
BAR HARBOR—Family Science Night isn’t really about science. It’s about wonder. It’s about watching a five-year-old realize that the tiny creature under a microscope is a real living thing. It’s about a teenager discovering that the scientist explaining genetics or regeneration isn’t much older than they are. It’s about parents seeing curiosity spread across a child’s face the way excitement spreads across a crowd at a Fourth of July parade. For one evening, families realize that the laboratory isn’t some secretive place where knowledge is hidden behind white coats and closed doors. They learn that the lab is a place their neighbors work, their friends’ parents work, and it becomes a place where questions matter more than answers. It’s a place where wonder is the origin for knowledge. At the lab, children learn that it’s okay not to know. Adults remember that they once asked “Why?” about everything. Scientists are reminded why they fell in love with discovery in the first place. There are experiments, games, obstacle courses, and demonstrations, of course. But those are really just invitations—to touch, to explore, to laugh, to make mistakes, and to ask one more question. In a world that often rewards certainty, Family Science Night celebrates curiosity. And perhaps that’s its greatest gift. Long after the microscopes are packed away and the experiments are over, what families take home isn’t just a few new facts about biology. They take home the feeling that discovery belongs to everyone—that science isn’t something happening somewhere else by someone else. It’s simply what happens when people are given permission to wonder. A Family Science Night at the Mount Desert Island Biological Laboratory is one of those rare community events where children and adults can experience science as something they do, not just something they read about. Hands on discovery allows hands-on learning and joy. Real scientists, some local, some scientist-interns (but still scientists) just in college make science real, approachable, and exciting. And there, complex ideas like forever chemical-filtration, DNA and so much more become not complex. Instead, they become fun. Summer fellows are challenged to explain cutting-edge biomedical research in ways a first-grader—and their grandparent—can understand. Past activities have explored gene expression, kidney function, axolotl regeneration, worms, microplastics, and phytoplankton through games and creative demonstrations. Though it’s called family night, you can also see adults going from station to station, exploring, learning together across ages. Family Science Night reflects the laboratory’s broader mission of breaking down barriers between researchers and the public, helping people understand how scientific discoveries relate to everyday life and the health of Maine’s environment. Family Science Night transforms a world-class research laboratory into a giant interactive classroom, where curiosity is encouraged, questions are celebrated, and families discover that science isn’t just something that happens in a lab—it’s an adventure anyone can join. About MDI Biological Laboratory For more than 125 years, MDI Bio Lab has been a center for training and research in comparative biology. In the last two decades its biomedical research has focused on aging, regeneration, and environmental toxins. The Laboratory houses 11 research groups staffed by an international team of world-class scientists and graduate students. It also leads a statewide network of colleges, universities and research institutions that collaborate to provide training, research experiences and financial support to help young Mainers play a bigger role in today’s biomedical revolution. Located on Maine’s rugged coast, the Laboratory’s 100+ acre campus houses research facilities, cottages and dorms that house visiting scientists and students. It is also home to MDI Bioscience, a subsidiary working to design innovative techniques to speed the drug discovery process. LINKS TO LEARN MORE NIH INBRE MDI BIOLOGICAL LABORATORY Photos: Carrie Jones and Shaun Farrar/Bar Harbor Story HELP SUPPORT THE BAR HARBOR STORY When we started The Bar Harbor Story, we didn’t know if anyone would read it. But you showed up. You shared. You sent tips. Now—over 400,000 views every month later—it’s clear: people here care about their community and each other. We’ve kept everything free because news should never be out of reach, but every one of our stories takes time to write, and your support keeps The Bar Harbor Story going. If you value our work, please consider a paid subscription, a founding membership, or a sponsorship. It truly helps us cover one more meeting, tell one more story, shine one more light. Even $5 a month makes a difference. Click here to become a one-time supporter now. Thank you so much for being here. Founding member information can be found here. Have questions about sponsorships? Just send Shaun an email at sfarrar86@gmail.com, he’d love to hear from you. Subscribe Share Bar Harbor Story Share Leave a comment
China targets Namibia’s oil, uranium and lithium in fresh strategic partnership
China and Namibia have signed agreements covering energy, critical minerals and infrastructure as Beijing strengthens ties with one of Africa’s fastest-growing resource economies
Populist politicians on the right and left take a page out of Donald Trump’s playbook
The world’s modern populists are discovering a common trait that seems to serve them more than the voters they claim to champion.
Mayor Mamdani addresses whether Taylor Swift is covering costs for police presence at MSG wedding
New York City mayor Zohran Mamdani addresses whether newlywed Taylor Swift is covering costs for the extra police presence at her and Travis Kelce’s Madison Square Garden wedding.
Basic Materials Roundup: Market Talk
Find insight on Rio Tinto, YYY, Air Liquide and more in the latest Market Talks covering basic materials.
Fort Bend County Fair Announces 2026 Entertainment Lineup Featuring Sawyer Brown, Pat Green
ROSENBERG, Texas (Covering Katy News) — The Fort Bend County Fair has announced its entertainment lineup for its 90th annual celebration, featuring a mix of Texas country stars, Tejano favorites and nationally recognized performers during Championship BBQ Weekend and the fair's 10-day run. The 2026 Fort Bend County Fair begins with Championship BBQ Weekend on Sept. 18-19, followed by the fair Sept. 25 through Oct. 4. The entertainment schedule opens Friday, Sept. 18, with Tejano group Los Morales, followed by Texas country artist Cole Phillips on Saturday, Sept. 19. Phillips has gained attention for his traditional country sound influenced by classic honky-tonk music. The fair officially opens Friday, Sept. 25, with Tyce Delk, a New Mexico native whose touring schedule has expanded across the country. Country music veterans Sawyer Brown will headline Saturday, Sept. 26. The band, whose career spans more than four decades, remains known for hits including "Some Girls Do," "The Race Is On" and "Thank God for You." Go Tejano Day on Sunday, Sept. 27, will feature Prófugos de Nuevo León, along with performances by Los Rinches and Grupo Zenio. The second week of the fair begins Wednesday, Sept. 30, with Bellville singer-songwriter David Lewis, a recent Texas Country Music Association Male Artist of the Year nominee. Oklahoma Red Dirt artist Josh Meloy will perform Thursday, Oct. 1. Texas country star Pat Green returns to the Fort Bend County Fair stage Friday, Oct. 2. Green, whose career includes three Grammy Award nominations, has sold more than 2 million albums and amassed more than 200 million career streams. He is best known for songs including "Wave on Wave" and "Carry On." Country newcomer Vincent Mason will perform Saturday, Oct. 3. Mason has accumulated more than 500 million career streams and was recently nominated for Academy of Country Music New Male Artist of the Year. The fair concludes Sunday, Oct. 4, with Texas music legend Gary P. Nunn, whose "London Homesick Blues" remains one of the state's most recognizable songs. Weekend visitors also can enjoy performances on Music Row by J Paul Jr. & the Zydeco Nubreeds, Southern County Line, Los Rangerz and Horizon. The Fort Bend County Fair Association, a nonprofit organization, supports youth, agriculture and education. According to the association, it has awarded more than $2 million in scholarships during the past decade and generated $1.4 million through its 2025 youth auctions. Tickets go on sale at 10 a.m. Friday, July 10. Guests are encouraged to purchase tickets in advance and select the specific day they plan to attend, as tickets are valid only for the date purchased. Admission includes entry to the fairgrounds, access to the carnival, shopping, exhibits, food vendors and, when scheduled, admission to the rodeo and that day's concert. Season passes and single-day tickets will be available. For tickets and additional information, visit fortbendcountyfair.com or call the Fair Office at 281-342-6171. The address of the Fairgrounds is 4310 Texas 36 S in Rosenberg. 2026 Fort Bend County Fair Entertainment Schedule Championship BBQ Weekend Friday, Sept. 18: Los Morales Saturday, Sept. 19: Cole Phillips Fair Entertainment Friday, Sept. 25: Tyce Delk Saturday, Sept. 26: Sawyer Brown Sunday, Sept. 27 (Go Tejano Day): Prófugos de Nuevo León, Los Rinches and Grupo Zenio Wednesday, Sept. 30: David Lewis Thursday, Oct. 1: Josh Meloy Friday, Oct. 2: Pat Green Saturday, Oct. 3: Vincent Mason Sunday, Oct. 4: Gary P. Nunn × Expand FBCF Fort Bend County Fair 2026 Artist Lineup
Machine Learning for Life Scientists: A Practical Methods Guide
Learn practical machine learning methods for life science research, covering supervised learning, model evaluation, and how to choose the right approach.
Scientists finally solved a 150-year-old gallium mystery
Scientists have rewritten the story of gallium after discovering that its unusual atomic bonds re-form at high temperatures, contradicting decades of accepted theory. The finding changes how researchers explain why the metal melts so easily and behaves unlike almost any other metal. Beyond solving a long-standing scientific mystery, the work could lead to advances in semiconductors, nanotechnology, and liquid metal engineering.
AI helped scientists discover two new superconductors, bringing them closer to a room-temperature breakthrough that could change electronics
Artificial intelligence is now fast becoming an important component in scientific investigations, and its recent achievement may have very significant effects on the advancement of technology. Scientists devised a way to utilise artificial intelligence in scientific research, which has not only resulted in the discovery of two new superconductors, but has also expedited the process of discovering even more superconductors.
From KSU Owl Network to FIFA World Cup, alumna builds sports media career
In preparation for the 2026 FIFA World Cup, Kennesaw State University alumna Maddie Crews ’24 marked her calendar for 49 consecutive days of covering the competition for multiple media outlets.
Tech, Media & Telecom Roundup: Market Talk
Find insight on SpaceX, LG Electronics, Tencent, and more in the latest Market Talks covering technology, media and telecom.
Oregon eyes $421 million in Medicaid cuts, including fewer benefits and limits on prescription drugs
Major cuts are coming to the Oregon Health Plan, the state’s free healthcare program covering 1.4 million children and low-income adults. But the group of experts Gov. Tina Kotek charged with minimizing the harm of those cuts has given her no definitive recommendations.
AI and Data Science in Life Science Research: A Practical Guide for Scientists
Discover how AI and data science are reshaping life science research, covering genomics, imaging, ML methods, data management, and LLM tools for scientists.
Basic Materials Roundup: Market Talk
Find insight on Vault, gold and more in the latest Market Talks covering basic materials.
Fort Bend County Fair to Reveal 2026 Entertainment Lineup at Free Sugar Land Event
SUGAR LAND, Texas (Covering Katy News) — The Fort Bend County Fair and Rodeo will reveal its 2026 entertainment lineup during a free public event Wednesday as the organization prepares to celebrate its 90th anniversary. Fort Bend County Fair 2026 Lineup Reveal Set for July 8 in Sugar Land The “Who’s Playing at the Fair?” gathering is scheduled for 6 to 8 p.m. at Talyard Brewing Company, 1033 Imperial Blvd. Attendees will be the first to learn which artists are set to perform, with giveaways, special guests and family-friendly activities planned. Food and beverages will be available for purchase.2026 Fort Bend County Fair Dates and Schedule The fair’s Championship BBQ Cook-Off is set for Sept. 18-19, with the main fair and rodeo running Sept. 25 through Oct. 4. The events will feature nightly concerts, livestock shows, youth competitions, rodeo performances and carnival attractions. What to Expect at the Fort Bend County Fair 90th Anniversary Celebration "We’re excited to kick off our 90th year by answering the question everyone is asking — who’s playing at the fair?” Fair President Brian Graeber said. “This event is a chance for residents to come together, become part of our fair family, and get an early look at what’s in store for our milestone celebration.” Fort Bend County Fair Scholarship and Youth Impact For 90 years, the Fort Bend County Fair and Rodeo has focused on benefiting youth, promoting agriculture and supporting education. This year, the organization awarded $250,000 in scholarships and generated more than $1.4 million through its junior livestock and other auctions. The lineup reveal is free and open to the public. For more information, visit fortbendcountyfair.com or follow the fair on social media. The fairgrounds are located at 4310 Hwy. 36 South in Rosenberg.
Oil slips after OPEC+ agrees to raise output targets
Oil prices inched lower on Monday after OPEC+ agreed to further increase its output targets from August while exports from key producers via the Strait of Hormuz are recovering, potentially adding to global supplies.
Parkour for seniors helps prevent falls, build strength, confidence
Parkour classes for older adults focus on balance, strength, and recovering safely from falls. See how these seniors are redefining healthy aging.
Minnesota Star Tribune columnist Jim Souhan retiring after 36 years
After 36 years covering the most notable teams, players, and stories in Minnesota sports, Jim Souhan is retiring. The longtime Minneapolis Star Tribune columnist and reporter announced his plans to retire on Saturday in a column titled Reflecting on 36 years of scoops, spats and Minnesota sports history. “Belatedly reflecting on more than 40 years…
The World Cup is just now discovering Middle America’s big heart. These Irish bingo kingpins built a $24 million business knowing it all along
Craig Reynolds and Will Meara launched Bingo Loco in a Dublin basement in 2017. Nine years later, Locomotive sells a million tickets a year in 300 cities.
New Mexico residents push to save nearly 80-year-old Sunspot Solar Observatory as demolition nears
The National Science Foundation announced it would demolish New Mexico's Sunspot Solar Observatory after discovering a mercury leak.
Dr. Oz on Medicare covering weight loss drugs, America's health innovation
Dr. Mehmet Oz discusses health innovation for America's 250th birthday, highlighting a new initiative where Medicare will cover GLP-1 weight loss medications for $50 a month, aiming to reduce health complications.
Oura Ring 5 In-Depth Review: Smaller yes, but still worth it?
The Oura Ring 5 In-Depth Review, covering accuracy, new features, size comparisons, and plenty more. I dive into whether or not it's worth it.
Auto & Transport Roundup: Market Talk
Find insight on Maersk, Wizz Air and more in the latest Market Talks covering the auto and transport sector.
Valley Golf Center owners say it's been an 'honor' as business closes
KMPH Fox 26 is the Central Valley's news leader, covering Fresno, California and the surrounding area, including Clovis, Madera, Hanford, Visalia, Biola, Kerman, Tranquillity, San Joaquin, Reedley, Coalinga, Avenal, Lemoore, Tulare, Selma, Caruthers, Tollhouse, Three Rivers, Porterville, and Merced.
The 17-year-old beekeeper busy with his own bee business
Harry took up the hobby after discovering his grandmother's old bee equipment in his family's shed.
First human case of West Nile detected in Sacramento County, health officials say
A woman in her 60s tested positive for the disease and is still recovering, the county said Thursday.
Gen Z is discovering daytime TV's most unhinged storyline. Deidre Hall is loving every minute.
Even Elle Woods was glued to Marlena's possession. Three decades after the iconic "Days of Our Lives "storyline aired, it's finding new fans — and Deidre Hall couldn't be more thrilled.
Recovering emotionally from the gut punch trade
Unpacking the emotion of the Jaylen Brown trade for Celtics fans
Healthy Returns: Walmart, CVS step in to help seniors navigate Medicare coverage of obesity drugs
Medicare has started covering obesity drugs for the first time – and companies like Walmart and CVS Health are playing an important role for patients.
WATCH: Rep. Tom Kean Jr. says he was recovering from depression during months-long absence from Congress
Netflix director Carl Rinsch sentenced to over 2 years in prison
The judge said Carl Rinsch may have been in a "manic state" when he bought five Rolls-Royces and a Ferrari but he spent years covering it up.
Medicare will start covering weight-loss drugs on July 1 for the first time.
Millions of Medicare enrollees will gain their first-ever coverage for drugs for weight loss under a temporary pilot program that launches July 1.
Medicare will start covering weight-loss drugs on July 1 for the first time. Here’s what you need to know
Millions of Medicare enrollees will gain their first-ever coverage for drugs for weight loss under a temporary pilot program that launches July 1.
New Ballard coffee shop burglarized two months into business
Highland Espresso is recovering after thieves broke in and stole thousands of dollars worth of equipment early Thursday morning.
I spent weeks thinking my Pixel's camera lens was smeared before discovering the real culprit
I can finally take good pictures again!
Bond girl Eva Green is 'recovering' after suffering an injury on “Wednesday” set
The frequent Tim Burton collaborator has joined the show as Aunt Ophelia Frump.
Bond girl Eva Green is 'recovering' after suffering an injury on 'Wednesday' set
Former Bond girl Eva Green is recovering after suffering an injury on the set of 'Wednesday' season 3, which will see her portray Aunt Ophelia Frump.
Sony’s New Blu-ray & DVD Player Upscales DVDs to Near-HD Quality - Bring Your Old DVDs To Life Again
In a time when streaming services continue to raise prices, fragment content libraries, remove content, and push intrusive ads, many households are rediscovering the reliability and ownership of physical DVDs and Blu-rays. Sony has answered this shift with the release of its latest affordable disc player: the Sony BDP-S1700U. Priced at just $114.99, this sleek […]
🗞 Today’s back pages: Baena downs Uruguay, the Dembélé show...
Spain’s victory over Uruguay dominates the sports newspaper headlines, but let’s take a look at how the main newspapers around the world are covering it.MARCAASMundo DeportivoSPORTL'EquipeSuperdep...
Sweden and WHO launch new long-term initiative to transform Ukraine’s health system
WHO and the Swedish International Development Cooperation Agency (Sida) have launched a new multi-year cooperation project to support the long-term recovery and transformation of Ukraine’s health system. The new project, “Ukraine’s Health System Transformation Initiative: Strengthening Health Governance, Health Financing and Service Delivery for Long-Term Recovery”, was launched at the Ukraine Recovery Conference 2026 in Gdansk, Poland on 26 June, and will run from June 2026 to 2029. Sweden will contribute approximately US$ 26 million (240 million Swedish krona) to support this project. This contribution forms part of Sweden’s broader support to Ukraine through the Team Europe approach, which brings together the European Union, its Member States, and key partners such as the European Commission’s Directorate-General for Enlargement and Eastern Neighbourhood and Enabel, and WHO as lead health agency, to support Ukraine’s recovery, reform agenda and European integration.“Ukraine’s health recovery cannot be measured only by what is rebuilt, but by whether people can count on the health system when they need it most. The scale of the task is immense, with health reconstruction and modernization needs estimated at US$ 19.4 billion over the next decade. Sweden’s US$ 26 million contribution to Ukraine’s Health System Transformation Initiative is a timely investment in the institutions, financing and services that will support Ukraine’s long-term recovery and European integration. WHO remains a trusted partner of the Government of Ukraine in advancing this process. I am deeply grateful to Sweden for its consistent support and partnership,” said Dr Hans Henri P. Kluge, WHO Regional Director for Europe. More than 4 years of war have placed unprecedented pressure on Ukraine’s health system, creating 3 interconnected challenges. The first is responding to the immediate consequences of the war and the urgent health needs of the population. The second is recovering and modernizing health services today. The third is continuing reforms and aligning the health system with European standards in the context of Ukraine’s future accession to the European Union. The war has led to large-scale population displacement, an increasing need for trauma care and rehabilitation, and shortages of health workers. High out-of-pocket payments in Ukraine make access to health services more difficult. Around 46% of total health expenditure is paid directly by individuals, placing a significant financial burden on many households and underscoring the need for reforms in health financing. Older people, persons with disabilities, women, children and veterans continue to face the greatest difficulties in accessing health services. “Ukraine is demonstrating that health system transformation can continue even during war. Ukraine is also continuing to align its health system with European norms and standards. WHO is committed to supporting Ukraine on this journey. We provide technical support, help coordinate partners’ efforts and support the institutional changes needed to strengthen the system. We are grateful to Sweden for its support. Through this partnership, we can help Ukraine build a more resilient, accessible and people-centred health system,” said Dr Jarno Habicht, WHO Representative in Ukraine. About the Health System Transformation InitiativeThe new initiative will support Ukraine through 3 interconnected areas: strengthening governance and coordination of health sector reforms through more inclusive coordination platforms and structured policy dialogue; transforming service delivery by reinforcing a primary health care-centred model that integrates family medicine, nursing and midwifery; and improving financial sustainability by supporting reforms that ensure the long-term viability of the national health system and reduce out-of-pocket payments for households. Overall, these reforms are expected to make the health system more coherent and easier to navigate, improve the quality and continuity of care, and ensure more equitable access to services, particularly for those who need them most. They will also support Ukraine’s progress towards a more modern health system aligned with European standards. “We are convinced that long-term recovery is not possible without strong, high-quality, person-centred health services that are accessible to everyone. Our partnership with WHO is designed to support deep and lasting systemic changes. Investments in human capital especially autonomous midwives, whose role for maternal, newborn and adolescent sexual and reproductive health cannot be understated, stronger governance, digital transformation and the financial sustainability of the health system are investments in Ukraine’s future. We are proud to support this process,” said Malin Perhult, the Head of the Ukraine Unit at Sida. Focus throughout implementation will be given to the most vulnerable population groups, including older people, women and children, and persons with disabilities, who have been affected by the war and face greater health-care needs. The initiative will be implemented in close cooperation with the Ministry of Health of Ukraine, the National Health Service of Ukraine, the Public Health Centre of Ukraine, regional authorities and international partners. This project will help Ukraine move towards a system where everyone can access the health care they need. It will strengthen primary care, make the health finance system more stable and predictable, and reduce the out-of-pocket costs that Ukrainians face when using health services. As a result, the Ukrainian health system will become more aligned with European standards and more sustainable in the long run.
Reasoning For Pitching Prospect's Absence From Rehab Assignment Revealed
Left-handed pitcher Ricky Tiedemann didn't make an appearance in his rehab assignment in Single-A due a separate injury than the one he's recovering from.
Health Care Roundup: Market Talk
Find insight on GSK and Fresenius Medical Care in the latest Market Talks covering the Health Care sector.
Living with a cat: the mental health impact scientists are only now discovering - Futura-Sciences
A Surprising Connection Between Cats and Schizophrenia? An Australian study has revealed an unexpected link between cat ownership and the risk of developing schizophrenia. Researchers analyzed 17 studies conducted over 44 years, spanning 11 different countries. Their conclusion? Living with a cat could actually double your risk of developing schizophrenia-related...
Mount Dora business owner scrambles to help homeless man, learns Lake County has no emergency homeless shelter
A Mount Dora laundromat co-owner is rallying support for a homeless man after discovering Lake County has no emergency shelter and few local resources.
NFL Legend Jim Kelly Recovering Following Stroke
Legendary NFL quarterback Jim Kelly announced this week that he suffered a medical issue earlier this year. Kelly, 66, says that he recently suffered a stroke. However, the former Buffalo Bills great is feeling good now. Kelly opened up about his medical status while speaking with reporters at the ...
Businesses say smoke from Boyle Heights warehouse fire is keeping customers away
After days of thick smoke covering the region from the warehouse fire in Boyle Heights, conditions are finally improving — a positive sign for some nearby businesses that say the smoke has been keeping customers away. The fire sparked last Wednesday at the 500,000-square-foot building, which was being leased by Lineage for use as a cold-storage facility and holding about…
Bills legend Jim Kelly provides update on condition after stroke
After beating cancer in 2019, Bills legend Jim Kelly revealed that he suffered a setback while recovering from a spring stroke.
Daryl Hall reveals he recently had kidney transplant: 'Get ready for more music'
Daryl Hall is recovering after receiving a kidney from 'a very kind and generous living donor.'
Hidden bird species discovered in Japan after DNA reveals a stunning secret
A bird long thought to be a single rare species in Japan has turned out to be two. Scientists discovered that the elusive Ijima’s Leaf Warbler and a newly identified Tokara Leaf Warbler look almost identical, but their DNA and songs reveal they are distinct species. The finding marks Japan’s first new bird species discovery in more than 40 years and highlights how modern genetic tools are uncovering hidden biodiversity that would otherwise go unnoticed.
Huge Amazon Prime Days 2026 Sports Tech Deals Tracker!
Here's your complete Amazon Prime Days 2026 Sports Tech Gear Guide, covering 100+ sports tech product deals!
Finnish scientist Wickström awarded Körber Prize for cell research
Finnish researcher Sara Wickström has been awarded the Körber European Science Prize for discovering that cells sense physical forces, a finding that might open new possibilities for the treatment of ...
Rod Stewart says he 'nearly fainted' during Utah concert
Rod Stewart is recovering after nearly fainting onstage over the weekend.
Katy Growth Tracker: New Restaurants, Entertainment Expansion and 348-Unit Apartment Project
Several commercial and residential development projects are moving forward across the Katy area, including new restaurants, an entertainment venue expansion and a large apartment community planned in Jordan Ranch.
The Pulse: Women's Health is Having a Reckoning - The Longevity Gap is Where it Starts
Welcome to our new series The Pulse, covering everything you need to know about the age of intelligent health.From ovarian aging and maternal health to cardiovascular and dementia risk, HLTH USA 2026 is programming the women’s health conversations medicine has been too slow to have.While women live longer than men, they spend 25% longer in poor health. The healthspan gap, between how long women live and how long they live in good health, is the defining focus of the next frontier in women’s health. “Diminished healthspan ...
With the opening of the Obama Presidential Center, NPR's Don Gonyea looks back on covering the former president
The opening of the Obama Presidential Center in Chicago is a full circle moment for at least one the journalists who covered his political rise.
World Cup presenter quits mid-tournament after Lionel Messi controversy
Luzu TV presenter Florencia Pena stepped down after falsely reporting that Lionel Messi's father, Jorge, had died, with the Messi family confirming that Jorge is recovering from a health situation
AMC Entertainment (AMC) Is Up 24.1% After Record May Attendance And $150 Million Equity Sale - Has The Bull Case Changed?
Earlier in June 2026, AMC Entertainment Holdings completed a US$150,000,000 at-the-market equity offering, issuing roughly 105,300,000 new common shares across multiple tranches priced between about US$1.03 and US$1.50. This fundraising comes as AMC reports record May attendance of 25.5 million guests, its strongest May since 2019, highlighting a recovering box office alongside continued reliance on equity issuance to support its balance sheet. Next, we’ll examine how record May attendance...
More than a game: Football, friendship and mental health recovery
Men recovering from bipolar disorder, schizophrenia and other mental health challenges find help through football.
Take-Two's ex-AI boss says the generative AI hype is "poisoning the well" and could ward off all use of traditional AI in the future
According to the former head of AI at Take-Two, the hype around generative AI is not healthy, but he doesn't want you to write off AI entirely.
Health Care Roundup: Market Talk
Find insight on Top Glove, BeOne Medicine and more in the latest Market Talks covering the health care sector.
Scientists are uncovering how common viruses may quietly increase cancer risk
Everyday viral infections may be quietly reshaping the body’s network of molecules that support cells and tissues in ways that can raise cancer risk over time
Texas Science & Natural History Museum opens new bat exhibit
During summer sunsets, Austin locals and tourists alike eagerly wait near the Congress Avenue bridge. Each evening, nearly 1.5 million bats emerge from underneath the bridge to begin their nightly flight to find food, covering the orange sky with black silhouettes. Open until August 2027, the Texas Science & Natural History Museum’s newest exhibit, “Masters...
Thousands of 1199SEIU health care workers flood Foley Square, saying they can’t afford the city they care for amid contract fight
A sea of purple washed over Foley Square on Wednesday evening as thousands of 1199SEIU health care workers rallied for a new contract covering workers at
Health Care Roundup: Market Talk
Find insight on ResMed and more in the latest Market Talks covering the Health Care sector.
Dentsu Expands Fandom Intelligence Globally to Guide Brand Partnerships in Entertainment
Little Black Book, Platform, first created in 2020, combines Japanese fandom data with new proprietary research across the US, UK, India and the Greater China market, covering 200 entertainment titles and more than 21,000 fans
Health Care Roundup: Market Talk
Find insight on Eli Lilly, AstraZeneca, Sandoz and more in the latest Market Talks covering Health Care.
Politics News: Latest on Trump Administration, Congress, Elections and More
Find the latest political news stories, photos, and videos on NBCNews.com. Read breaking headlines covering Congress, Democrats, Republicans, and more.
Visitors' viral World Cup videos show what really makes America great
International soccer fans discovering the wonders of America, from spacious skies to chicken fried steak, is giving the U.S. a much-needed morale (and PR) boost.
Analyst recommendations: Accenture, Caesars Entertainment, Roku, Adobe, Salesforce…
Every morning, find a selection of analysts' recommendations covering North America. The list only includes companies that have been the subject of a change of opinion or price target, or of a new...
Is SMIC N+3’s Metal Pitch Smaller than Intel 18A’s?
Almost four years ago, we published that SMIC had started shipping 7 nm (N+1) chips. Now, SMIC is shipping its third-generation 7 nm (N+3) process in Huawei’s Kirin 9030, with a minimum metal pitch of 32.5 nm, about 10% tighter than the 36 nm minimum metal pitch shipping in Intel’s latest Panther Lake CPUs on 18A. The headline is true, but incomplete cherry picked metric. N+3 reaches the density of TSMC N6 through aggressive DUV multi-patterning and design-technology co-optimization (DTCO), but it pays for that in complexity, efficiency and process control. We found this and more in our reverse engineering and teardown where we cover SMIC’s N3 process technology, Huawei’s packaging, memory, architecture, and more. SemiAnalysis has been building a state-of-the-art teardown lab in Oregon capable of analyzing the world’s most advanced and important chips over the last year and half. We have already generated revenue on advanced datacenter chip teardowns including our recent reverse engineering of a major TSMC customer’s COUPE CPO optical engine + EIC 3D stack. This is the first public report from the SemiAnalysis Teardown Engineering & Evaluation Lab, or STEEL for short. The lab is aggressively scaling up and out and we’re excited to announce it publicly. This is a bit of inconvenient timing for TechInsights as they are private equity owned and currently being sold while having enjoyed virtually no credible competition for decades. This has led to TechInsights underinvesting in CAPEX. SemiAnalysis exceeds TechInsights in revenue despite no venture or private equity ownership and being founded only 6 years ago. Because we have no external investors and are founder led, we move faster, build faster, and we can release client chip teardowns for free regularly, while focusing on datacenter for our major clients. Here’s the first public image from our lab, the HiSilicon Kirin 9030 Pro SoC: This report will detail our teardown of the Kirin 9030 and our findings on SMIC’s N+3 process, the most advanced in China. For comparison, we’ll show our teardown of the MediaTek Helio G99, made on TSMC N6. Through this comparison, we can look at the effect of export controls – SMIC N+3 and TSMC N6 are comparable nodes, but one is heavily export-controlled, the other free to use the West’s most advanced equipment. Here we see both China’s progress and constraints. SMIC N+3 reaches TSMC N6-class logic density, but it requires far more aggressive DUV multi-patterning, so it does not match N6 on process maturity or cost. The Kirin 9030 Pro performs similarly to three-year-old Android flagships, and trails far behind the current flagship SoCs from Apple, Qualcomm, MediaTek, and Samsung. The efficiency gap is even wider. Export controls have not stopped Huawei and SMIC from shipping advanced silicon, but they have forced a different path. Without EUV, SMIC is leaning harder on DUV multi-patterning, DTCO, and increasingly complex integration. The roadmap continues forward through tighter design rules and backside power, but each step adds cost and process risk. Huawei’s τ scaling and LogicFolding show another path: stacking active logic and recovering density through advanced packaging and system-technology co-optimization (STCO). To understand the Kirin 9030, we must first understand Huawei’s SoC history. HiSilicon is Huawei’s chip design arm, responsible for the Kirin smartphone SoCs, Kunpeng server CPUs, Ascend AI accelerators, and switch/router networking silicon. Before export controls, Huawei was TSMC’s largest customer – the only customer on TSMC’s first EUV node, N7+, and among the first on N5, alongside Apple. That ended in late 2020. Huawei switched to Qualcomm SoCs in its flagship smartphones, though export controls limited them to 4G-only variants. In late 2023, Huawei returned to in-house silicon with the Kirin 9000s, a successor to the Kirin 9000, fabricated on SMIC N+2 instead of TSMC N5. In the following years, they released the Kirin 9010 and 9020 on the same N+2 process. These chips used Huawei’s in-house TaiShan CPU cores and Maleoon GPU. We have not torn down a Kirin 9020 ourselves, so the predecessor die shot is from Kurnal. The die shots show how Huawei spent its silicon budget: which functional blocks are where, and how their areas compare to the predecessor. First, a quick guide to the major blocks on the die. The total die area is nearly identical, but the 9030 uses that area more aggressively. A denser process lets Huawei fit an extra middle CPU core, more GPU and NPU cores, and larger caches into the same footprint. In contrast, the Helio G99 is a much smaller, low-cost SoC, built for budget smartphones rather than a flagship device. While the Kirin 9030 is ~140 mm², the G99 is only ~29 mm², roughly one-fifth the area. The underlying TSMC process technology, however, is directly comparable as a baseline for analyzing SMIC’s. The Kirin 9030 is an evolutionary refresh, not a clean-sheet design. Its CPU, GPU and NPU cores carry over the 9020’s families, and the gains come from three levers: the SMIC N+2-to-N+3 process step, DTCO and floorplan work, and incremental microarchitecture. Area is where the first two show up, and the 9030 scales well here. Performance and efficiency are the harder test. Huawei’s design holds up better than its node would suggest, but the chip still trails, both because N+3 sits behind the leading-edge nodes and because its cores, while competent, remain a few generations behind the newest designs. The new prime core is an incremental update. The main changes are a 10% frequency increase from 2.5 GHz to 2.75 GHz and a doubling in the L2 cache from 1 MiB to 2 MiB. Despite the increased cache, the core size decreased by 7.6%. Excluding the private L2 cache, the core size decreased by 21%. This is a large reduction for an incremental node. Compared with the TaiShan New V120 core in the Kirin 9020, the Kirin 9030’s middle core is almost unchanged architecturally, yet each core shrinks by ~22%. Most of that comes from the move from N+2 to N+3, with layout likely accounting for the rest. Visually, the most noticeable change is the increase from 3 middle cores to 4. There is also a 20% increase in the shared L3 cache of the big cluster. This helps to improve multi-core performance without sacrificing much in terms of area. Even with each core shrinking, the big CPU cluster’s total area is essentially unchanged. The per-core savings went back into an additional middle core and larger caches. The tiny cores shrank less than the prime core (excluding its L2 cache) and less than the middle cores. This is likely because fixed overhead is a larger share on a small core. We cannot resolve any architectural changes from the die shot alone, but the per-clock and efficiency gains shown below point to more than pure process and layout scaling. The area reduction was offset by a doubling of the shared L2 cache from 2 MiB to 4 MiB, leaving the total tiny CPU cluster area slightly larger. Area is the easiest improvement to see from a die shot, but it is only one part of PPA (power, performance, area). For modern logic, power and performance matter just as much, and often more. Since Dennard scaling broke down in the mid-2000s, voltage and frequency have not scaled in step with transistor dimensions, so each node has had to fight harder for gains in performance and efficiency. The starkest comparison is not Kirin 9020 versus Kirin 9030 Pro. Apple’s efficiency cores run circles around Huawei’s prime core. Apple’s low-power core delivers 20% higher integer performance while drawing only 1 W, compared with 4.5 W for Huawei’s prime core. N+3 matches TSMC N6, but N6 is several generations old. Apple and Qualcomm build on N4 and N3P, which are denser and sit on a better voltage-frequency curve, giving them a larger transistor budget and more performance per watt. The 9030’s own cores did improve. The middle and tiny cores gained 17% and 14% in per-clock integer performance over the 9020, with floating-point flat on the middle core and up 11% on the tiny. The tiny core improves cleanly, with performance rising while power falls and efficiency increases by 45% in integer and 24% in floating point. The middle core is mixed: integer performance rises but power rises faster, cutting integer efficiency by 7%, while lower power lifts floating-point efficiency 16%. Per-clock gains at the same or lower frequency are microarchitectural, so the cores are tuned, not just shrunk. Both also failed to hold their rated maximum frequencies, pointing to thermal, power, or stability limits. Per clock, the middle core sits around Arm Cortex-A720 and the tiny core near the Cortex-A520; absolute performance trails because Huawei clocks them much lower. The prime core is roughly Cortex-X2 class per clock, a 2021 design. Apple’s 2020 M1 Firestorm core is still 35% higher per clock and 57% faster in absolute integer performance at a similar 4.5 W. The current leading edge is further ahead again: the Apple M5 P-core is 60% higher per clock and 2.7× faster, the Arm C1 Ultra 45% higher and 2× faster. Matching older high-end cores per clock is a genuine design achievement. What Huawei cannot match is the voltage-frequency curve and transistor budget of leading-edge nodes, which let Apple, Qualcomm and others spend more transistors in the same area on wider cores, larger caches and deeper buffers while running at lower voltage. Huawei’s LogicFolding roadmap is one answer, stacking active logic to recover density and shorten signal paths. We return to it later. The GPU compute units (CUs) changed more visibly than the CPU cores, moving to a more rectangular layout for both the arithmetic logic unit (ALU) clusters and the CU overall. Even with ray-tracing support added, a CU shrank ~28%. However, that shrink is offset by the increase from 4 to 6 CUs and the area outside the CUs grew 33%. Overall, the GPU cluster is larger by ~10%. The GPU is where Huawei makes its biggest gains. The Maleoon 935 is not competitive with current flagships, but it is a large step up from the 920 and reaches older-flagship territory. In 3DMark it is 70% faster in Wild Life Extreme (WLE) and 79% faster in Steel Nomad Light (SNL) than the 920; with 11% higher clocks and 50% more CUs, the ~67% theoretical uplift roughly matches WLE and is beaten by SNL. It edges ahead of the Snapdragon 8+ Gen 1 in WLE and SNL, and the Dimensity 9200 and Apple A16 in WLE, but stays far behind newer parts: the Snapdragon 8 Elite Gen 5 and Dimensity 9500 are ~2.4–2.6× faster in WLE and ~3.2× faster in SNL. The Maleoon 935 is Huawei’s first GPU with hardware-accelerated ray tracing; there it lands slightly ahead of the Exynos 2200, and on par with the Apple A16, with current flagships up to 3.7× faster. The Neural Processing Unit (NPU) saw the largest structural changes of any block, moving from a Lite and a Tiny core in the Kirin 9020 to a Lite and two Tiny cores in the Kirin 9030. Both core types also show significant layout changes. This is a reversal in Huawei’s NPU design. The Kirin 9000 5G, its last flagship chip on TSMC N5, used two Lite and one Tiny core. The series of SoCs on SMIC N+2 moved to one Lite and one Tiny core, likely for area savings. With the Kirin 9030, Huawei has shifted back toward a larger multi-core NPU cluster, but with the additional area going to a Tiny core rather than a Lite core. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Before diving into the process stack, the package and memory are worth separating from the SoC itself. The Pro variant of the Kirin 9030 carries 12 GB of Samsung DRAM, with two stacks of four dies each. The dies were identified as the K4L2E165YD, a 12 Gb LPDDR5X-9600 device fabricated on Samsung’s 1a node, the fourth generation of its 10 nm-class DRAM after 1x, 1y and 1z. 1a has shipped in volume since 2022, so this is current memory rather than older-node inventory. The 16 GB Pro Max variants we obtained were found with both CXMT and Samsung packages. The CXMT package is marked CXDD7JEDM, with two stacks of four dies, packaged in week 45 of 2025. The inferred die dimensions from X-ray computed tomography (CT) are consistent with a known density of ~0.3 Gib/mm² for the CXMT G4 process, roughly equivalent to other manufacturers’ 1z processes. The Kirin 9030 uses a typical integrated package-on-package (iPoP) stack: multiple DRAM dies in a memory package sit above an organic redistribution layer (RDL) interposer, which sits above the SoC and package substrate. The full package is then mounted to the printed circuit board (PCB) through ball-grid array (BGA) solder bumps. The memory package substrate is a thin bismaleimide-triazine (BT) laminate carrying the LPDDR5X stack. The organic RDL interposer over the SoC routes the PoP signals around the die and carries possible dummy thermal copper pillars. The package substrate, a thicker Ajinomoto Build-up Film (ABF) build-up over a BT core, fans the flip-chip bumps out to BGA pitch and embeds the power planes. The whole stack is organic. The only silicon is the SoC and the LPDDR5X dies; there is no silicon interposer. Keeping it all-organic brings the package’s coefficient of thermal expansion (CTE) close to the PCB’s, reducing board-level warpage, and avoids the cost of a silicon interposer the SoC’s bandwidth does not need. In an iPoP stack, the memory package connects to the organic RDL interposer through an array of solder bumps. Underfill fills the gap around those bumps, adding stiffness and protecting the joints from mechanical stress. The Pro and Pro Max variants differ here, which we cover behind the paywall. The die shot and architecture tell us how Huawei allocated its silicon budget. The process tells us what SMIC can manufacture. We use the Helio G99 as the process reference for TSMC N6. Both SMIC N+3 and TSMC N6 are evolutions of previous 7 nm-class nodes. We used targeted TEM cross-sections through logic and memory regions, imaged in both fin-cut and gate-cut directions. Each cross-section caption gives its horizontal field width (HFW), the real width of the imaged area. We start at the transistor fins, then move up through standard cells, local interconnect, and SRAM. SMIC has not overtaken Intel or TSMC. It uses aggressive DUV scaling and DTCO to reach N6-class density, but that density doesn’t translate into comparable performance and efficiency, for two reasons: the node gap to leading-edge nodes, and Huawei’s core designs. Fin Profile One of the most important knobs in a FinFET process is the fin profile: the shape of an individual fin and the channel where current passes from source to drain. The ideal fin is tall, narrow, and nearly vertical. A taller fin increases effective channel width, while a narrower fin improves electrostatic control by thinning the body the gate must control. Push either too far, and the process pays for it: weaker drive current, fragile fins, taper, footing and line-edge variation that hit yield and device variability. The Intel 22 nm, 14 nm, and 10 nm fin cross-sections show how FinFET nodes have improved over time. 22 nm fins were a first-generation structure, relatively short, wide and strongly tapered. The shape limits current density and reduces gate control uniformity across the height of the fin. At 14 nm and 10 nm, Intel pushed the fins taller and narrower while also making the sidewalls more vertical. Rather than shrinking the device, these changes increase the effective channel width per fin and improve electrostatic control. The trade-off is that taller fins at tighter pitches are much more difficult to manufacture. Now, let’s compare the Helio G99 on TSMC N6 with the Kirin 9030 on SMIC N+3. Both processes are in the same class, with fin pitch of 30-32 nm on N+3 and 34 nm in our N6 cross-section. The pitch for N6 is especially interesting as N7’s HD library is generally listed with a 33 nm fin pitch, and N6 did not shrink pitches directly. Its density gains came from DTCO instead of tighter pitches. The 34 nm pitch was stable across our sampled region and serves more as a comparison against the SMIC N+3 we have not investigated further. Pinning down N+3’s fin patterning scheme takes more than one core unit. The CPU cores show a dense ~32 nm pitch, with the pitch between N-P fin pairs alternating between 78 and 88 nm. Logic alone may be consistent with dual-pitch mandrels of 120 and 110 nm, but this is a complex and unusual approach. Combining the pitch from the the 8T SRAM, which has more complex repeat unit, with the CPU core sequence allows us to reverse engineer the patterning steps with more confidence. As both the logic and SRAM should share the same base grid, a single CD mandrel lithography pattern with 128 nm pitch undergoing SAQP produces a die-wide ~32 nm grid (128 nm/4), which supports the pitch sequencing seen in both logic and SRAM cells. In the sampled cross-sections, N+3 shows a taller, narrower, higher-aspect-ratio fin than N6. The measured fin aspect ratio is ~9.5:1 on N+3 versus 7.8:1 on N6. N+3 also shows less top rounding, with an estimated radius of ~2 nm, compared with 2.8 nm on N6. Even though the fin widths differ, the ratio of top rounding to fin width tells the same story, with N+3 at 0.37 and N6 at 0.44. In a geometric sense, lower is better; a perfectly rectangular fin would have no top-rounding penalty. These are single-digit-nanometer features measured from a handful of cuts, so treat the absolute numbers as approximate. The important result is the relative gap: N+3’s fins are consistently taller, narrower and less rounded than N6’s. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Standard Cell A standard cell is the basic building block of chip layout: a fixed-height row pairing one NMOS and one PMOS transistor that share a gate, tiled in a grid to build logic blocks. The key dimensions are contacted gate pitch (CGP), cell height (CH), fin count, and the lower-metal routing grid. To measure density, we use the Bohr metric: a weighted average of NAND2 gate area (60%) and scan flip-flop area (40%). This represents a realistic mix of combinational and sequential logic. This metric has its limitations, especially for complex cell layouts like TSMC’s FinFLEX, which alternates cells with different fin counts. Even so, it is the best metric for a pure process-level comparison. Another important measurement is the fin pitch; it refers to the distance between two fins of the same transistor. In a FinFET process, multiple fins are used in each transistor to increase the drive current and thus performance. TSMC N6 ships both a high-density (HD) library with 2 PMOS and 2 NMOS fins per cell, and a high-performance (HP) library with 3 of each. More fins under the shared gate mean more effective channel width. HP cells switch harder at the cost of area. Designers mix the two on a die, primarily spending HP cells on timing-critical paths, and matching their PPA targets. In the Cortex-A55 core of the Helio G99, we found a cell height of 240 nm for the HD cell. MediaTek has used HD cells in the G99 to minimize die size and thus cost. As an SoC for budget smartphones at ~$100, this is essential. By contrast, we found only one library in the Kirin 9030, with 2 NMOS and 2 PMOS fins. This suggests a narrower library strategy than TSMC N6, where both HD and HP libraries are widely used. This likely reflects the smaller customer base and the more constrained domestic design and electronic design automation (EDA) ecosystem. In all three CPU cores of the Kirin 9030, we found cell heights of 228 nm, 5% smaller than on N6. This is also a reduction of 9.5% over SMIC N+2’s cell height of 252 nm. SMIC N+3 and TSMC N6’s HD library both feature a CGP of 57 nm. For SMIC, this is a 9.5% shrink over N+2. In the past, CGP and cell height alone may have been enough to compare transistor density. Now, however, we must consider scaling boosters and DTCO as well. SMIC’s density gain does not come from EUV. It comes from using every available DTCO booster aggressively. First is fin depopulation: reducing the number of NMOS and PMOS fins in each cell. The first FinFET nodes started with 3 or 4 fins for each transistor. SMIC N+3 and TSMC N6 HD both use only 2 fins per transistor, trading drive strength for density. Next is contact over active gate (COAG). By landing the gate contact directly over the active gate, instead of out over the isolation region, the cell height drops. N+3 integrates COAG while N6 does not. Our N+3 gate-cut cross-sections indicate COAG, with the gate contact sitting over the active region, while N6 shows an off-gate contact. Last is single diffusion break (SDB). Diffusion breaks are inserted between cells in the same row to provide electrical isolation, but they also introduce local layout effects (LLE), layout-dependent shifts in electrical characteristics. In the past, a double diffusion break was used, consuming the space of two CGPs. SMIC N+3 and TSMC N6 instead use SDB, saving area but increasing LLE sensitivity. This must be controlled at the process level and accurately modeled in the process design kit (PDK) so that EDA tools can account for it. Overall, SMIC N+3 has a transistor density of 113.4 MTr/mm², slightly above TSMC N6 at 107.7 MTr/mm². Even without EUV, SMIC has achieved density beyond TSMC’s mature N6 node which utilizes EUV. Metal Stack The smallest critical dimension in the teardown is M0; SMIC N+3 uses a 32.5 nm local metal pitch. That is smaller than the 36 nm M0 pitch on Intel 18A in Panther Lake. However, this does not mean that SMIC has a better process than Intel 18A or TSMC N3P. M0 is a local intra-cell routing layer. Its usefulness depends on the full interconnect stack: M1 and M2 pitch, track count, via and line resistance, design rules, mask count, overlay control, and routing flexibility. The 32.5 nm M0 is consistent with self-aligned quadruple patterning (SAQP), whose four-population line-width loading we read coarsely as alternating widths of 21.5 to 24 nm; M1 and M2, at 38 and 40 nm, are consistent with self-aligned double patterning (SADP), a single A/B split. On TSMC N6, M0, M2, and M3 sit at a relaxed ~40 nm and are consistent with SADP-class double patterning, with no need for quadruple patterning. That said, we measure M2 for example at ~43 nm, likely inflated by sparse routing. We do not assign any specific layer to EUV from our cross-sections; the distinction we can draw is double versus quadruple patterning, not lithography wavelength. Transistor-level density in the front-end-of-line (FEOL) sets an upper bound, but the design is ultimately limited by what the interconnect stack can route. The lowest metals are the most important for standard-cell density, but the semi-global and global layers determine how usable that density is at the block and chip level. Two axes are commonly used for chip cross-sections: the fin-cut and the gate-cut. The micrograph above is a fin-cut and shows metals 0 through 3. This axis lets us see the even-numbered metals, with M0 right above the fins. There are two kinds of M0 lines. The first are the power rails; these are wide wires for the VDD and VSS running horizontally at the top and bottom edges of each standard cell. The wide wires measure 55 nm across, more than double the other M0 lines. Their width minimizes resistance and reduces IR drop. The second kind are intra-cell wires, short segments within the cell that connect terminals to M1. These have alternating widths between 21.5 and 24 nm. The M0 pitch is 32.5 nm, a 19% reduction versus N+2 and N6. At this pitch, DUV patterning requires more aggressive multi-patterning, increasing mask count, overlay sensitivity, process complexity and cost. M0 is below what a single DUV-defined spacer (SADP) can resolve, so SMIC cascades a second spacer step (SAQP). The cross-section reflects the cost: the M0 trenches are visibly more re-entrant (narrower at the bottom than the top) than M1 or M2 on the same chip and carry a bright barrier-rich foot where the trench meets the etch-stop layer. That shape is partly the intended damascene profile, as a slightly narrow bottom helps void-free copper fill, but its magnitude at M0 is driven by the tight pitch and the higher trench aspect ratio. Intel 18A supports an M0 pitch of 32 nm, although Panther Lake has only shipped with a looser 36 nm pitch. This is due to Intel’s heavy usage of HP libraries. Among leading-edge nodes, 18A has the loosest M0 pitches due to PowerVia. With power routing moving to the backside, congestion is reduced, and the entire front-side metal stack can be used for signal routing. M2 is the first true inter-cell routing layer. It runs horizontally like M0 but spans across multiple cells to carry block-level signals. The M2 pitch sets the cell’s track height – the number of M2 tracks that fit between the VDD and VSS rails, defining what the library calls a 6-track or 7.5-track cell. This layer is the most important, limiting the routing of entire blocks. SMIC N+3 features a 5.7-track cell. The M2 pitch is 40 nm, a 5% decrease over N+2 and the same as N6. This shrink keeps the pitch at the edge of what is possible with double patterning. Future nodes will need to increase the number of masks for M2 as reducing the number of tracks is much harder due to the limitations in routing. The micrograph above is in the perpendicular direction, the gate-cut, and shows metals 0 through 4. This allows us to see and measure the odd-numbered vertical metal layers. The M1 pitch is 38 nm, 9.5% less than N+2 and 33% less than N6. The M1-to-gate ratio matters because it sets local routing flexibility. N+2 and N+3 use a 3:2 ratio, while N6 uses a 1:1 ratio, explaining the huge differences in M1 pitch. The more M1 lines there are compared with the gates, the more flexibility there is for power and signal crossing within the cell. Routing flexibility enables more complex and better cells. Clean fractional ratios are also preferred as a grid is periodic and improves layouts. The 3:2 ratio gives SMIC more local routing flexibility than a strict 1:1 grid, but it also complicates layout and patterning. This is a DTCO choice, with SMIC increasing process complexity to recover density and routability without EUV. This 3:2 ratio is not very popular in the leading-edge nodes. TSMC has only used it on N7+, the N5 family, and the short-lived N3(B). They have switched back to a 1:1 ratio for N3E. Intel has only used it on the 10 nm/Intel 7 family, with Intel 4, 3 and 18A all using a 1:1 ratio. Samsung is the only one still using a 3:2 ratio at the leading edge, using it in the SF4 and SF3 families. It remains to be seen if SMIC will remain at a 3:2 ratio or move to a 1:1 ratio with its future nodes. The industry is still actively exploring these local-routing ratios. At VLSI 2026, imec will be presenting work on even higher ratios, including a 2:1 scheme that can reduce area by up to 14%. We will be covering the conference in a future newsletter article. Subscribe We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. The final local interconnect layer for N+3 is M3, with a pitch of 44 nm. The M3 pitch is the same as on N+2 and 10% larger than on N6. The semi-global layers carry the majority of block-level signal routing. They have a coarser pitch than the lower local layers. On leading-edge nodes, they are designed to sit at the limit of DUV single patterning. M4 through M11 pitches were found divided between 80–82 nm (M4–M6), 128 nm (M7–M10), and 148 nm (M11). Given limited sampling, it is possible these are divided further in dense routing areas. At the top are two giant metal layers, M12 and M13. These have kept the same pitches as N+2 at 1920 nm and 4600 nm respectively. While the lower layers’ pitches are generally fixed by the process and library, the upper layers vary much more in pitch and count, depending on the design. Even two smartphone SoCs on the same process can have wildly different metal stacks. The Helio G99 carries fewer routing layers, reaching coarse metal pitches of 850 nm by M9, while the larger and higher-performance Kirin 9030 keeps fine pitches until M11. SRAM At the leading edge, SRAM is much more difficult to scale than logic. TSMC’s latest nodes have seen little to no bitcell scaling, while logic still has more DTCO levers to pull. While looking for other logic libraries in the GPU compute units, we stumbled upon the SRAM. The most common type of SRAM has 6 transistors (6T), but this cell had 8 transistors (8T) instead. 8T SRAM adds two transistors to form a dedicated read port. Unlike a 6T cell, where reading disturbs the storage, the decoupled read port removes read-disturb, improving read stability and letting the cell be pushed harder for performance. At first glance, the cut looked like an unusual logic library, with each cell row having 3 fins of one polarity and 5 fins of another. The rows also alternated in orientation. Energy-dispersive X-ray spectroscopy (EDS) resolved our confusion. The cut had not landed on the GPU logic, but on the SRAM macro beside it. The unusual fin pattern was due to the SRAM library. We return to EDS in the process flow analysis behind the paywall. SRAM libraries are not like traditional logic libraries. Due to the unequal number of PMOS and NMOS transistors, they require specialized rules and layout libraries. They do not need the flexibility of logic libraries, so they are hyper-optimized for one purpose: dense, reliable memory. The SRAM cell we found is a 1:2:2-2:2 cell. This means there is 1 fin per pull-up (PU) PMOS transistor, and 2 fins per pull-down (PD) and pass-gate (PG) NMOS transistor. These 2 PU, 2 PD and 2 PG transistors would usually form a single 6T high-current cell (HCC). An 8T HCC adds a read-pull-down (RPD) and a read-pass-gate (RPG) NMOS transistor, each with two fins. We measured a cell height of 406 nm, which brings the bitcell size to 0.0463 µm². That is a theoretical peak density of 21.6 Mib/mm². We estimate that a 6T HCC would have a cell height of 292 nm and a size of 0.0337 µm². This is ~12% larger than a 6T HCC on Intel 3 and 4. We also estimate the 6T high-density cell (HDC) to have a cell height of 228 nm and a size of 0.0260 µm². This is coincidentally the same as the logic standard-cell height measured earlier. The estimate puts the cell near Samsung 7LPP/5LPP and slightly below TSMC N7/N6. That is a theoretical peak density of 38.5 Mib/mm². 6T HDC is arguably the most important cell as it is used for the largest caches in a chip, the L3 caches and system-level cache (SLC). Both the Kirin 9020 and 9030 have split the SLC into 4 banks to raise total SLC bandwidth. In the Kirin 9030, the SLC increased from 2 MiB to 3 MiB per bank. Correspondingly, the number of arrays within the bank also increased by 50%, from 16 to 24. Each array can store 128 KiB and forms an orderly pattern on the die shot. From the Kirin 9020 to the Kirin 9030, the area of a 128 KiB SLC array decreased from 0.0477 mm² to 0.0392 mm², an 18% shrink. The achieved density is 25.5 Mib/mm², 66% of the theoretical maximum. While the SLC was quite similar across both chips, the L3 has seen some major changes, particularly in terms of its layout. The total capacity also went up from 10 MiB to 12 MiB. Much like the SLC, the L3 is also split into 4 banks. In the Kirin 9020, an L3 bank consisted of 16× 128 KiB arrays and 16× 32 KiB arrays. However, an L3 bank in the Kirin 9030 instead consists of 48× 64 KiB arrays. In the Kirin 9020 L3, a 128 KiB array was 0.0513 mm² and a 32 KiB array was 0.0154 mm². The size of the 128 KiB array is different on the L3 and SLC as the assist circuitry for the two arrays differs depending on their purpose. In the Kirin 9030 L3, a 64 KiB array is 0.0210 mm². Although not a like-for-like comparison, normalized for capacity, it is 18% smaller than the 9020’s 128 KiB L3 array and 31% smaller than its 32 KiB L3 array. The achieved density is slightly lower than the SLC, at 23.8 Mib/mm², 62% of the theoretical maximum. Unlike the L3 and SLC, the prime cores’ private L2 cache uses a 2-bank design. As the prime cores’ L2 is latency-critical, it likely uses 6T HCC instead of 6T HDC. The 9020 has 16 arrays in each bank while the 9030 has 32. Each array has a capacity of 32 KiB. A 32 KiB array in the L2 shrank from 0.0171 mm² to 0.0142 mm², ~17% smaller. The density is 17.6 Mib/mm², ~59% of the theoretical maximum for 6T HCC. SRAM scaled well from N+2 to N+3, shrinking by ~19%, close to the theoretical logic shrink. The caveat is that N+2’s bitcells were unusually large, bigger than comparable 7 nm-class nodes, so part of the gain is catch-up rather than true scaling. With the insights from STEEL’s teardowns, we will be doing a deep dive into SRAM in a future newsletter article. Subscribe Everything above came out of a single STEEL teardown: die annotation, block-level area analysis and TEM cross-sections through logic and SRAM. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Future Roadmap The same cross-sections that pin down N+3 also show where SMIC can go next. Although N+3 is already close to the practical limits of DUV multi-patterning in several layers, SMIC still has a few scaling levers left. A theoretical N+4 would likely start with cell height. N+3 uses 5 M0 tracks between its power rails. Moving to 4 M0 tracks, as on SMIC N+2 and TSMC N6, could reduce cell height by roughly 15%. The routing grid is only one side of the shrink; the front end also must fit into the smaller cell. One possible FEOL lever is reducing the p-to-n isolation spacing from two diffusion grid units to one. Intel used this scaling booster on Intel 4, and TSMC did so on its N3 family. This path trades layout flexibility for density. Fewer M0 tracks reduce local routing resources, while tighter p-to-n spacing raises integration and design-rule difficulty. M2 is also constrained by the cell height shrink. For SMIC to maintain a ~5.7-track cell, M2 would need to move toward ~35 nm. That would move another layer into SAQP territory. SMIC could also reduce the CGP from 57 nm to 54 nm. Intel reached a similar CGP on Intel 10 nm/Intel 7 without EUV. The local interconnect is also tougher. If SMIC keeps the 3:2 M1-to-gate ratio, M1 would need to shrink to 36 nm and would likely require SAQP as well. If SMIC moves to a 1:1 ratio, M1 could relax to 54 nm, but it would give up routing flexibility. Under this theoretical path, we estimate that SMIC N+4 could reach a cell height of 198 nm and a CGP of 54 nm, implying a Bohr density of 137.8 MTr/mm², on par with TSMC N5 or Samsung SF4. However, the difficulty is cumulative. Each step is individually plausible, but together they make N+4 harder than the transition from N+2 to N+3. It will likely take longer, cost more, and carry less process margin. A theoretical N+5 would require a larger integration shift. One possible path is backside contacts (BSCon), moving power routing and source/drain contacts to the backside, which would reduce front-side routing pressure and enable another reduction in cell height. The front-side metal pitches could relax to reduce the process complexity. M0 would likely relax slightly to ~34 nm, and M2 and M4 pitches could relax further. CGP is unlikely to shrink much further. Even with EUV, 48 nm has been the practical limit for yield and process control. This approach would allow N+5’s cell height to fall to 170 nm and its CGP to 53 nm. This implies a Bohr density of 163.6 MTr/mm², on par with Intel 18A’s HP library. However, this would not make N+5 cost-competitive with the leading edge. It would reach a similar density through a much more expensive route. The integration difficulty rises sharply, with new process flows for backside alignment, wafer thinning, contact reveal, and backside metallization. Past this point, standard density and interconnect scaling become increasingly unattractive. That is where Huawei’s roadmap stops looking like a normal foundry roadmap and starts looking like a packaging roadmap. At ISCAS 2026, Huawei unveiled its tau (τ) scaling law, reframing process scaling in the time domain. τ is the time cost of data movement and processing: switching delays in transistors, RC signal propagation delays in circuits, compute, memory, and networking latency. Outside Huawei’s terminology, this is called system-technology co-optimization. This is Huawei’s answer to its lack of EUV lithography. Without EUV, planar density cannot keep pace with TSMC, Intel, or Samsung. If transistor density cannot shrink further, Huawei’s alternative is to shorten wires, reduce buffering, and stack logic vertically. “LogicFolding”, Huawei’s implementation of this new scaling idea, is, in practice, an aggressive 3D stacking approach. AMD V-Cache places SRAM above or below a CPU die. AMD’s MI350X places active interposer dies (AIDs) underneath accelerator and compute dies (XCDs), with the AIDs handling cache, IO interfaces, the network-on-chip (NoC) and embedded metal-insulator-metal (MIM) capacitors. With LogicFolding, parts of the same logic block are split across multiple active dies bonded face-to-face at ultra-fine pitch. This allows Huawei to shorten some critical paths and reduce buffer overhead, not merely add cache capacity or offload the IO and interconnect. Shortening wires is where the higher clocks come from. A large share of a modern core’s delay and energy budget goes into driving long interconnects and the repeater buffers along them. LogicFolding distributes a block’s critical-path gates across multiple stacked tiers bonded at a very fine pitch, so the bond interface behaves like an additional metal layer and the longest paths get shorter. That is how Huawei expects to recover frequency and efficiency it cannot get from the process alone. Huawei’s roadmap shows its intent. Prime core frequency is targeted to rise from 2.75 GHz in the Kirin 9030 to roughly 5 GHz by 2031, far beyond what planar scaling alone could deliver. Prime cores with 3.1 and 3.39 GHz clocks are being tested in its labs, although their power consumption is unknown. Beyond that, chips are in the design, simulation or pathfinding phase, meaning the frequencies are targets. However, the direction matters more: LogicFolding also helps with performance, not just density. The catch is that Huawei’s density claim is not directly comparable to foundry densities. A stacked design can report more transistors per package footprint by adding active layers, even if each patterned die remains well behind TSMC or Intel in front-end density. This is how Huawei can claim to reach foundry 14A-equivalent density by 2031. This is not a like-for-like foundry comparison, with Huawei using stacked logic and measuring density per package footprint. On a normalized Bohr-density basis, SMIC N+3 is ~114 MTr/mm², 38% less than Intel 18A’s HD library. Huawei’s 3D roadmap closes the gap by stacking active logic, reaching 215 MTr/mm² by 2030. In 2031, the roadmap density jumps to 295 MTr/mm², implying either a third active layer, partial EUV insertion or aggressive planar DUV scaling. Huawei’s methodology makes other foundries look much denser as well. Applying it to AMD’s MI450X with an N2 top die on an N3P base die yields a theoretical density of 460.2 MTr/mm² in 2026, compared with Huawei’s 295 MTr/mm² in 2031. This Kirin 9030 does not use LogicFolding, remaining in a conventional mobile SoC package. Instead, it forms the baseline for how far Huawei and SMIC can push planar scaling. Future teardowns of Kirin and Ascend chips will show both planar logic density and Huawei’s hybrid bonding solutions. Export controls changed China’s optimization problem rather than ending it. EUV restrictions raised the cost and complexity of leading-edge manufacturing without freezing it. SMIC reaches N6-class logic density through DUV immersion, SAQP and DTCO, while Huawei shifts more of the burden onto architecture, packaging and system-level integration. Future nodes will be tougher. N+3 still had room to tighten local metals and reduce cell height and CGP. Further scaling without EUV leaves fewer levers. More aggressive multi-patterning adds masks and overlay error. SMIC can keep pushing DUV, but each step will get more expensive and less forgiving. The design side is just as critical. Huawei had domestic EDA tools and flows before the Kirin 9030, with the Kirin 9000s, 9010 and 9020 making that clear. Huawei was able to ship multiple consumer SoCs on SMIC N+2 and N+3 while cut off from the Western EDA stack. US export controls restricted EDA tools for advanced chips in 2022 but did not target tools for more mature chips. In 2025, the US government briefly placed much broader restrictions on EDA software from Synopsys, Cadence, and others, before lifting them less than two months later as part of a trade deal tied to rare earths. Huawei has been unable to access those tools because it remains on a US trade blacklist. That forced Huawei, SMIC and Chinese academic institutions to build their own tools and flows. Researchers at Peking University recently announced a prototype EDA tool for Huawei’s LogicFolding architecture, which requires a new flow to handle the multilayer layout and floorplan. This is not the same as replacing the full Synopsys or Cadence stack, but it shows where domestic EDA is headed: toward tighter co-optimization between architecture, process and packaging. These advances are also diffusing into the Chinese ecosystem. SMIC is licensing its N+2 and N+3 processes to HLMC/Hua Hong at the government’s direction rather than by choice. If the same process learning feeds into Ascend accelerators for AI training and inference, the choke point shifts from one named fab to an ecosystem. Alibaba’s T-Head silicon arm and Cambricon, a Chinese AI chip designer that is expected to supply ByteDance, could also be major beneficiaries. Sanctions aimed at SMIC alone become less effective once the manufacturing knowledge has spread to other fabs and design houses. China is not closing the gap with Intel, Samsung and TSMC. The teardown shows the opposite in several places: no EUV, no backside power, higher process complexity, and visible trade-offs. But China is still advancing. If domestic chips become good enough for phones, inference, networking and security-sensitive workloads, they can matter strategically without matching TSMC at the leading edge. Behind the paywall, we show what else STEEL can do, with material and process flow analysis of SMIC N+3, and analysis of the Kirin 9030 package. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline, access the full Kirin 9030 and SMIC N+3 analysis or to commission a custom teardown, contact sales@semianalysis.com.