SCROLL NEWS / DISCOVERY

Search headlines

Find the stories shaping the conversation.

Search mode
Refine results
Active filters Keyword All time

Results for " manu " 1,405 found 🔀 AI-powered Shuffle

Cosmos Health's Brands Reach More Than 40 Countries Across Europe, the Middle East, North America and Asia, Addressing Global Markets Estimated at Approximately $946 Billion

The portfolio comprises more than 15 proprietary brands and product lines and 10 branded generics across five product categories, sold in more than 40 countries through pharmacies, hospitals, retail chains and e-commerce. It is manufactured at GMP-certified facilities in Europe and the United States and supported by the Company's services in contract manufacturing, pharmaceutical distribution, telehealth and research and development.

finance.yahoo.com logo
Oct 1 • 3:58 PM EDT • Health • finance.yahoo.com
Politics doesn't always 'reward what it should': Brian Brenberg

'The Big Money Show' panelists analyze economic data, GDP growth and President Donald Trump's manufacturing push in Texas.

foxbusiness.com logo
Oct 1 • 3:32 PM EDT • Politics • foxbusiness.com
NC Chamber Announces ‘Coolest Things’ for the Year

Coinciding with National Manufacturing Day, the NC Chamber announced winners of this year’s “Coolest Thing Made in NC” competition.

thepilot.com logo
Oct 1 • 3:08 PM EDT • Business • thepilot.com
Manufacturing Depends on Logistics to Keep Supply Chain Moving

When JBE Inc. opened in Hartsville in 1982, the “old school manufacturing company” was mainly working with metal — clinging it, grinding it, whatever the manufacturing companies the subcontractor served needed. More than 40 years later, the...

greenvillebusinessmag.com logo
Oct 1 • 12:31 PM EDT • Business • greenvillebusinessmag.com
Cabinetworks Group expands employee access to health care with third on-site clinic

/PRNewswire/ -- Cabinetworks Group, the country's largest privately owned cabinet manufacturer, recently expanded employee access to health care with the...

prnewswire.com logo
Oct 1 • 11:34 AM EDT • Health • prnewswire.com
Jason Jones, Co-Creator of Halo and Destiny and Co-Founder of Bungie, Announces New Studio

Jason Jones, one of the co-founders of Bungie and a co-creator of Halo and Destiny, has announced his new studio, Stone Kite, which will work on projects across various entertainment mediums. The studio's first release is One Zero One, a limited-series comic book based on a manuscript written by Jones.

ign.com logo
Oct 1 • 10:42 AM EDT • Technology • ign.com
90% of Life Sciences Manufacturers Say Digital Transformation Is Now Business-Critical, According to New Rockwell Automation Report

/PRNewswire/ -- Rockwell Automation, Inc. (NYSE: ROK), the global leader in industrial automation and digital transformation, today released "The New Operating...

prnewswire.com logo
Oct 1 • 10:00 AM EDT • Business • prnewswire.com
90% of Life Sciences Manufacturers Say Digital Transformation Is Now Business-Critical, According to New Rockwell Automation Report

/PRNewswire/ -- Rockwell Automation, Inc. (NYSE: ROK), the global leader in industrial automation and digital transformation, today released "The New Operating...

prnewswire.com logo
Oct 1 • 10:00 AM EDT • Business • prnewswire.com
Two Nerazzurri in action in the Nations League

The international action continued on Tuesday 29 September, with two Inter players featuring for their respective national teams: Petar Sučić and Manuel Akanji.Akanji’s Switzerland made it two win...

sports.yahoo.com logo
Oct 1 • 8:08 AM EDT • Sports • sports.yahoo.com
Rahm Emanuel, former Chicago mayor, tours New Orleans schools. 'Louisiana is working.'

Rahm Emanuel, the former Mayor of Chicago and former Ambassador to Japan, toured New Orleans schools on Wednesday as he floats a presidential run in 2028.

nola.com logo
Oct 1 • 5:00 AM EDT • Politics • nola.com
September Monthly Review: Health MCP Guy?

For all the time I spend talking about APIs and data exchange, this newsletter has had embarrassingly little interoperability of its own. It’s old-school SaaS, baby - UI or bust. Not all of that is my fault! Substack, for all its popularity, is (as mentioned before) really frustrating as my system of record. The primary user it optimizes towards is the reader, whose attention feeds the app, the Notes feed, and the recommendation network that Substack is actually selling. Health API Guy is a reader-supported publication. To receive new posts and support my work, consider becoming a free or paid subscriber. Subscribe They’re falling into the same trap that Medium once sprinted into, albeit at a much more glacial speed. Younger generations may not remember (or never knew) it, but Medium once lured publications like The Ringer and Signal v. Noise onto its platform, only to lose them as it rebuilt itself around a paywall and an algorithmic feed. Substack’s original pitch circa 2020 was the antidote (you own your list), but every new feed feature chips away at it. I get it: writers are generic supply in the eyes of the Substack product team. Generic supply follows demand, so the consistent pressure on the PMs is to generate demand, which leads to every product cycle going toward discovery (Notes, recommendations, the app, live video). The end result lackluster author tools (laggy and broken analytics are truly crippling) all despite the premium price point. The archive is where it crosses from authorial gripes to actual reader impact, though. Across Substack and LinkedIn, I’ve published 1,218 posts and nearly 900,000 words since 2018. Substack’s native search can see only the 464 posts that live on Substack, and even there it’s woefully inadequate at surfacing relevant content (even for the guy who wrote it)! Readers have the same problem, writ large. Ask the Archive Fixing search (for both my readers and my own use) turned out to be extremely non-trivial, unfortunately: There’s no public API for readers to access content RSS exists for new content notification, but it only carries the 20 most recent posts and cuts paid ones off at the preview The only Substack MCP is an admin tool for analytics The export exists for authors, but it’s painfully awkward and slow. So I built something to work around that: the Health API Guy MCP. It’s a private MCP server holding the full text of everything I’ve written across Substack and LinkedIn. Add it to Claude or ChatGPT as a connector and you can ask things like: It pairs keyword search (for acronyms and case names, of which we have many) with semantic search. Every post is also labeled by topic, form, and court case, so you can pull a lawsuit’s (or multiple cases’) entire docket across Substack and LinkedIn in one query: Hail, Healthapiguyhydra This is also a bit of me eating my own cooking. I’ve spent the year arguing that headless healthcare is arriving and that developers want primitives over abstractions. Last week in Hail, Benihydra, I watched Salesforce plug its platform into Claude and bet that the records underneath outlive whatever interface sits on top: Salesforce must believe that the Hydra’s immortal head is the records, permissions, and business logic (in that they will survive whatever happens to the interface). It felt a bit hypocritical to keep my own archive behind a Substack search bar. The archive is the body. Substack is one head, and now whatever tool you might use is another. Will the EHRs follow my lead? Probably not imminently, but one can hope! Why Founding Members Only The MCP is available to Founding Member subscribers. A few reasons: It costs money and time to run. Hosting, the database, Clerk usage and AI compute for search and labeling are significant operational costs (that increase with usage). Substack gives me no way to automate access. There’s no API to check whether someone is a paid subscriber, so every user is manual operations for now. It’s a beta. We’ll need to improve things and parts will break. I’d rather they break for a small group of dedicated readers who will tell me about it. The Founding tier deserved a real benefit. Until now it was mostly a generous tip. Now it comes with something. If you’re already a Founding Member, reply to this email with the address you’d like provisioned. If you’re not and want in, upgrade here. Larger teams (such as companies) can get access too: group subscriptions at the Founding tier come with the group discount. The admin for the subscription can reply with the list of addresses to provision. Get 20% off a group subscription Pricing Founding membership is now a flat $200 a year, replacing the old suggested $150 that readers could adjust. Existing Founding Members will have access grandfathered in at their previous rate. Month in Review Articles Published Make Networks Dumb Again (Sep 11): AI is making old analog networks cheaper to use and flooding them with machine traffic in the process. A plea for agent-native rails with the intelligence at the endpoints, and for Washington to drag them to ubiquity. Interoperability, Unbuttoned (Sep 29): Interoperability is a series of workflows in a trenchcoat, and this post finally takes the trenchcoat off. A color-coded map shows which provider workflows went digital, which are fragmented, and which still run on fax. Video Content Antitrust’s System of Record Problem (Sep 3): The FTC’s investigation into Epic prompted a ninety-minute webinar, now posted with chapters and a smoothed transcript. We get into why market definition, missing B2B share data, and the SSNIP test leave antitrust poorly suited to systems of record, plus why information blocking may be doing more than any pending lawsuit. The Information Exchange: Cerner Milking Edition (Sep 18): This was so fucking fun. Ryan Tucker, Ryan Brickner, Brad Thorson, and I try an Around the Horn format, complete with points, penalties, and a mute button. We debate whether Oracle Health is dead, who would actually buy Cerner (IBM enters the chat), p(Doom), and why the front desk still hands you a clipboard. Regulatory Ask Not What Your Network Can Do (Sep 23): CDC’s RFI on public health data intermediaries lists use cases already served, unevenly, by eCR, lab reporting, IZ Gateway, and syndromic surveillance. The real opportunity sits in one question about AI: a network that can handle the next emergency without another interface project. Court cases Particle v. Epic: The Naughty Schoolteacher (Sep 4): After a summer-long vigil, the answer on Epic’s early summary judgment bid is two paragraphs and a remedial assignment. Particle advances to the next grade, and market definition gets another year of discovery. The Epic Discovery Files (Sep 8): Texas’s motions to compel arrive with a 251-page appendix of requests, objections, and meet-and-confer letters with Cravath. Inside: Epic using generative AI for document review, denied interoperability requests in scope, and Noerr-Pennington raised against lobbying discovery. Epic v. Health Gorilla: “Working as Designed” (Sep 9): Epic wants nothing to do with the data breach MDL, and explaining why puts fresh discovery on the public docket. The spiciest allegation: Health Gorilla told GuardDog to scrub its law firm business from its website instead of cutting off access. Veeva v. Epic: Legal Bypass Surgery (Sep 15): Veeva asks the Wisconsin Supreme Court to skip the Court of Appeals, while law professors and three policy groups line up as amici. Meanwhile, Epic’s lawyers apologize for another round of citation errors, including a quote that never existed. Texas v. Epic: Behind the Black Bars (Sep 17): The court portal served up Epic’s unredacted filings, revealing a $5 million document review budget and the AI workflow behind it. Also inside: the 200-plus company names Texas wants searched, and one very expensive Zoom invitation. OpenEvidence v. Doximity: Consequences Will Follow (Sep 25): OpenEvidence tells the court it will not comply with a discovery order, and its own lawyers at Quinn Emanuel say they won’t defend the choice. Add years of Slack reported unrecoverable, and Rule 37 sanctions come into view. Health Tech Keeps Choosing Violence (Sep 28): Doximity moves to end OpenEvidence’s case, Epic asks Texas to show its work, and a sleepy Audacious Inquiry patent fight sprouts antitrust and information blocking counterclaims. The main event is a long-sealed Cognizant v. Infosys ruling that hints where system of record antitrust claims can survive. EHRs One Verb for Oracle Health (Sep 14): Oracle’s earnings call quantifies every data center to the decimal point, while Oracle Health gets a single verb: “accelerate.” Panning the few healthcare mentions turns up an agentic care management system, a research-to-care ledger play, and the question of whether healthcare gets Larry’s patience. Epic’s Forretress Under Siege (Sep 30): Judy Faulkner tells a panel Epic paused hundreds of projects to harden its software and calls it a “shame,” while a spokesperson insists the roadmap hasn’t changed. Project Glasswing, a Pokémon-branded QAN sprint, and a trove of Jodel grievances reconcile the two Epics and preview the Jevons paradox coming for all software. Industry Analysis Scanning for a Network (Sep 1): Scan.com raises $220M to build the imaging network labs never got, speedrunning Zocdoc’s consumer-to-B2B pivot. Its wedge to network density may be the most American one available: personal injury litigation. The Front Desk Wants the Damn Whole Building (Sep 16): Hello Patient buys Converse Health, pushing its AI front desk into referrals, chart work, and prior auth. The copilot categories keep blurring, and your distribution partner is still your final boss. Cross-industry Comparisons A Different Patchwork Quilt (Sep 10): Healthcare loves to envy open banking, but the US version has no mandate, a toll booth at Chase, and data quality problems of its own. The grass isn’t greener; it’s another American patchwork quilt, and perhaps a worse one. Hail, Benihydra (Sep 21): Salesforce brings its platform into Claude, Slack, and its own agent, inviting the interfaces that might replace it. Cut off one head and more grow back, so long as the records underneath stay put. Living on A Trade Secret Prayer (Sep 22): Six credit unions are suing Fiserv, the Epic of core banking, by claiming their own member records as trade secrets. Banking has no Cures Act, so its lawyers reach for legal alchemy that healthcare has already tried. Other News None this month External Media Nabla Accelerate NYC: I kicked off fall conference season at Nabla’s Accelerate event in New York, where Delphine Groll opened by asking the room to picture the company it wants to become and the one it doesn’t. I liked her framework of bureaucracy, fear, and ego as the blockers. I also love vendor conferences/events in general - different vibe than industry biggies. Healthcare 101 with Nikhil Krishnan: I briefly guest lectured Out-Of-Pocket’s Healthcare 101 class. Appreciated Nikhil’s takeaways cover whether AI doctors can query HIEs, why healthcare’s data-liberation rules beat most industries’, and the hi-res graphic is in the comments. HCN: Epic Probed by the FTC: I joined the HCN guys to talk through the FTC’s investigation into Epic. Cedric’s new hairdo was an unexpected plot twist. The episode also covers MFN drug pricing, healthcare M&A and Eli Lilly’s acquisition streak. Fall Conferences: At eHealth Exchange’s Annual Meeting in Austin on Oct 27, I’ll moderate a panel on the tensions between AI, HIEs, and timely patient access with Jean Ross (Primary Record), Therasa Bell (Kno2), Byron Crowe (Doctronic), and Michael Marchant (Freenome). Here’s the rest of my schedule if you want to meet up: CommonWell (Redwood Shores, CA): Oct 13-14 Will be participating in a fun Jeopardy event Open@Epic (Madison, WI): Oct 20-23 Will be enjoying Verona, Willy Street, and other local adventures eHealth Exchange and Sequoia Project (Austin, TX): Oct 27-29 Yeehaw HLTH (Vegas): Nov 15-18 Groundhog Day, Venetian Edition RSNA (Chicago): Nov 30-Dec 2 See me at “Governing AI in Breast Imaging: What Health Systems Are Actually Doing” Digital Health Counsel 2026 AI Summit (Seattle): December 2-3 Will likely be speaking to a bunch of lawyers about information blocking Posts I Liked ChatGPT’s Epic integration: game changer or nothing burger?: Joshua Liu, MD offers five thoughts on OpenAI’s Epic launch, starting from the point that it rides the same open APIs available to anyone. He argues read-only access leaves ordering to Art and the ambient startups, and asks why HCA is piloting it alongside Commure. He’s sorta a must-follow at this point - consistently excellent, thought-provoking takes. Epic, Lilly, and the Discovery pass: Seth Chaney reads Epic’s first major Discovery deal (with Eli Lilly), as well as its revised developer terms on commercial displays, as the pipe finally opening between EHRs and pharma. Life sciences and health continue to collide. Scott Rossignol on EHR payer platforms and ePA fees: Scott argues the top ambulatory EHR vendors are turning the prior auth mandate into a per-member-per-year toll on payers, for an API whose operating cost has nothing to do with covered lives. His fix is two lines of regulatory text: put the CRD/DTR/PAS certification criteria in the Base EHR definition, and bring payer-facing ePA connectivity under § 170.404’s cost-based fee rules. It’s a good solution. Health API Guy is a reader-supported publication. To receive new posts and support my work, consider becoming a free or paid subscriber. Subscribe

healthapiguy.substack.com logo
Oct 1 • 4:36 AM EDT • Health • healthapiguy.substack.com
SANY Nutrition Group opens snack food plant in Jonesboro

SANY Nutrition Group, a family-owned and family-operated food manufacturer headquartered in Jonesboro announced Wednesday (Sept. 30) that the company’s Jonesboro plant is now fully operational and it has launched its...

talkbusiness.net logo
Sep 30 • 9:26 PM EDT • Business • talkbusiness.net
Deep dive
😐 Neutral (10%)
wow
72%
ahah
28%
Mad about Science: The Voynich Manuscript » Sandpoint Reader

By Brenden BobbyReader Staff Pumpkin spice, cobwebs and pumpkins can mean only one thing: spooky season is upon us! To celebrate the season, we are going to look at one of the most elaborate...

sandpointreader.com logo
Sep 30 • 8:47 PM EDT • Science • sandpointreader.com
Japan’s patchy business mood takes pressure off BOJ for immediate hike

By Makiko Yamazaki and Leika Kihara TOKYO, Oct 1 (Reuters) - Japanese manufacturers' confidence hit an eight-year high over July-September but non-manufacturers' mood soured, a central bank survey showed, painting a mixed picture of the economy that ma...

wtvbam.com logo
Sep 30 • 8:14 PM EDT • Business • wtvbam.com
Grasshopper Manufacture Leaves NetEase Games to Operate as Independent Studio

Suda51's studio, maker of No More Heroes and Killer7, has split from NetEase Games to work as an independent developer again.

northeasttimes.com logo
Sep 30 • 11:57 AM EDT • Entertainment • northeasttimes.com
Iowa Association of Business and Industry members have postive outlook on the economy

Iowa Association of Business and Industry (ABI) president Nicole Crain says 63% of members still plan to make capital expenditures in the fourth quarter. “We’ve seen that number this year be between 60 and 70%, which is really remarkable,” she says. “That shows that Iowa companies and Iowa manufacturing, they’re investing in their businesses, they’re […]

radioiowa.com logo
Sep 30 • 11:26 AM EDT • Business • radioiowa.com
Grasshopper Manufacture splits from NetEase Games

Grasshopper Manufacture has split from now-former parent company NetEase Games, the company announced. NetEase Games acquired the developer from previous parent company GungHo Online Entertainment …

gematsu.com logo
Sep 30 • 9:06 AM EDT • Technology • gematsu.com
Debt service and the Pentagon. Private equity and the politics of the US housing market. The return of black lung disease & the Franco-Prussian War in color.

Thank you for opening your Chartbook email. RALPH BALSON. 1890—1964. Oil and enamel, signed. Source: Gavekal This going to hurt - the two 7s in the US: diesel and mortgage rates Source: Gavekal In the US housing market, costs are soaring and the role of corporate, private equity-backed buyers is high on the mid-term election agenda. HEY READERS, THANK YOU for opening the Chartbook email. I hope it brightens your day. I enjoy putting out the newsletter, but tbh, what keeps this flow going is the generosity of those readers who clicked the subscription button. If you are persuaded to click, please consider the annual subscription of $60. It is both better value for you and a much better deal for me, as it involves only one credit card charge. Why feed the payments companies if we don’t have to. Subscribe It is striking how, since 2020, big banks have dropped out of the political spotlight in the US. For contributing subscribers only. Subscribe Rates of the lung disease pneumoconiosis among working US coal miners have risen to levels not seen in nearly 40 years Source: Bloomberg Chinese Clean Technology Exports For contributing subscribers only. Subscribe Ralph Balson (1939) Portrait of Grace Crowley Cole, G. O. & Haseman, S. M., (2023) “‘The Substance of Paint’: Class and Materiality in the Work of Ralph Balson”, Open Library of Humanities 9(2). Ralph Balson (1890–1964) was an English plumber and house painter who emigrated to Australia in 1913 and subsequently became a key member of Sydney’s artistic avant-garde. He is credited with having the first solo exhibition of purely abstract painting in Australia in 1941. Despite his role in developing Australian non-objective painting, Balson remained principally a house painter, working on his art practice at weekends. In 1955 he retired on a state pension and became a full-time artist. Balson’s artistic education and methods were critically shaped by his working-class background. He did not travel abroad until 1960 and was an avid auto-didact. His materials, palette, techniques and compositional strategies were likewise informed by his trade. Balson’s profession as a painter-decorator made him conspicuous within the predominantly middle-class Sydney art scene, though his painting partner Grace Crowley considered it an advantage in their pursuit of constructive painting. This paper explores the impact of Balson’s trade on his trajectory towards pure abstraction. While his art was at odds with the predominantly figurative mode of class-conscious art in Australian Modernism, we argue that it is embedded in the experience of class through its creative adaptation of labour into aesthetics. Source: OLH Svetlana Alexievich, The Art of Oral History No. 1 Paris Review Issue 257, Fall 2026 Interviewed by Elena Kostyuchenko INTERVIEWER How were you able to go to Chernobyl? Did you need special papers? ALEXIEVICH It was a time of chaos. They let me right into the zone. … More than anything, there was confusion. Adamovich [Ales Adamovich, the Soviet Belarusian writer], I remember, persuaded Gorbachev to send in the scientists, who showed up without even bringing their shaving kits. They were told that there had been an explosion at a nuclear power plant, but for some reason they thought that they’d be there for only a day or two. The first time I went was several months later, and people kept telling me about things they didn’t understand—how the fishermen couldn’t find worms, because they’d burrowed deep into the earth, how the milk wouldn’t curdle at the cheese factories. The honeybees wouldn’t come out of their hives. The evacuations started, I think, in the first month. The old women hid, they wouldn’t leave. I mentioned radiation to one of them and she said, “I’ve seen that radiation, all right! It’s yellow with green in it. I saw puddles of it in my garden, and I told the other women, and we ran and looked, and she had it in her garden, and the other one, too!” God, it was wild, the way the mind made sense of it. There was a story going around about Gorbachev telling the scientists to show him the radiation. “We can’t, it’s invisible.” “But I want to see it!” I also ran into the soldiers who’d been flown in on helicopters from Afghanistan. I asked them, “What are you doing here with your machine guns?” They said, “We’re collecting the radiation, that’s what.” So you had some of them running around with their guns, others out in the village washing off firewood or burying soil in the soil. These were the kinds of things that exploded our worldview. They made you realize that culture was just a chest filled with old manuscripts. There were no books in there that could help me. Our philosophers turned out to be useless when faced with the unprecedented. Derrida, Baudrillard—philosophy fell silent. What was happening? How would we live with it? That’s when I decided it simply needed to be witnessed. Which is what I did. INTERVIEWER I wanted to ask about how you talk to people. … ALEXIEVICH Yes, we sit and we talk—about what interests me and about life in general. About love, about everything in the world. That way, what comes out is three-dimensional. If you cut straight to the part you need, which is what journalists do, it won’t be interesting, and it won’t be the truth, either. Not the whole truth. INTERVIEWER Do people always open up when you ask questions, or can questions get in the way? ALEXIEVICH You have to ask questions, of course. Your job is to scour away the banality and return people to their true selves, to make them face what they rarely tap into. With every new person, you have to find a new way to do it. When you ask an interesting question or you share what happened to you, you help people really think about what they’re saying and not just repeat whatever they’ve picked up from the newspaper. But not everybody is capable of it, not everyone wants to put themselves through that. Either the chemistry starts to kick in or it doesn’t. A person might be wonderful, but you can tell that the conversation just isn’t going to happen. You can try to push it, but it will be a product of your own intellect, rather than of that mysterious connection. Life doesn’t come from the mind. Some people I can call two years after our last conversation, and they’ll say, “Oh, Svetochka! I think of you all the time,” and we’ll start talking again. With others, that won’t happen. That doesn’t mean they’re not extraordinary people, just that you can’t connect with them. They might have some insight, but you don’t have the right antenna to pick up their signal. Source: The Paris Review Colorized Franco-Prussian war … the ruins of Strasbourg with a French photographer and his mobile dark room. Ralph Balson (1961) Matter Painting If you’ve scrolled this far, you know you want to click: Subscribe

adamtooze.substack.com logo
Sep 30 • 6:25 AM EDT • Politics • adamtooze.substack.com
Deep dive
😐 Neutral (16%)
wow
53%
ahah
47%
From napkin drawing to final product, this Fairfax business helps inventors through the process

Fairfax, Virginia-based X-Pro helps inventors bring product ideas to life, offering engineering, prototyping, manufacturing and fulfillment under one roof.

wtop.com logo
Sep 30 • 4:43 AM EDT • Business • wtop.com
😐 Neutral (8%)
wow
59%
ahah
41%
El Niño is strengthening. Is your business ready?

Manual and Guideline in English on World about Climate Change and Environment and Disaster Management; published on 13 Aug 2026 by UNDRR

reliefweb.int logo
Sep 30 • 2:33 AM EDT • Business • reliefweb.int
Timken Co. completes sale of belts business to Gates Industrial

Jackson Township-based Timken Co. has completed the sale of its belts manufacturing assets to the Denver-based Gates Industrial Corporation.

indeonline.com logo
Sep 29 • 11:58 AM EDT • Business • indeonline.com
Bayern Munich considering Bernd Leno as Manuel Neuer replacement

Bayern Munich are considering Bernd Leno as Manuel Neuer's replacement this summer, according to German outlet Bild.

sports.yahoo.com logo
Sep 29 • 8:23 AM EDT • Sports • sports.yahoo.com
Ukraine’s Academy of Sciences warns against Russian cooperation after attack

The National Academy of Sciences of Ukraine has urged the international scientific community not to “restore or legitimise institutional cooperation with Russian state scientific and educational structures,” after a Russian drone hit its Presidium building in central Kyiv, killing at least two people and injuring several others. The drone strike took place in the early afternoon on September 28 while staff were working.The academy called the strike, one of several Russian attacks on Ukraine’s capital using jet-powered drones in recent days, an act of terrorism. “It is a strike [. . .] on the very idea that knowledge, research, and the search for truth should serve life, not its destruction,” it said in a statement.The academy thanked the global scientific community for its solidarity following the attack and warned against any temptation to normalise scientific relations with Russia.“Science cannot exist outside of moral responsibility. There can be no ‘ordinary scientific cooperation’ with a state that kills people and destroys scientific institutions of another country,” it said.“We urge not to create opportunities for Russian state institutions to return to the international scientific community as if nothing happened. There can be no ‘science beyond politics’ when science is attacked with weapons.”After the full-scale invasion of Ukraine in 2022, Europe almost entirely cut institutional ties and joint programmes with Russian science, although personal academic contacts are still ongoing.Related articlesRussia widens targeting of European research centresHow geopolitical rifts cut scientific collaborationThe European Federation of Academies of Sciences and Humanities (ALLEA), for instance, continues to exclude the Russian Academy of Sciences from its network.ALLEA condemned the latest attack as a “barbaric act” and part of a broader “systematic targeting of Ukraine’s scientific and cultural infrastructure.” This is a “deliberate attempt to erase the conditions under which free inquiry, knowledge, and democratic life are possible,” it said in a statement.Since Russia’s full-scale invasion, more than 4,650 educational institutions across Ukraine have been damaged, and a further 423 have been destroyed, according to ALLEA.National academies across Europe joined ALLEA in condemning the attack. “Science is about the pursuit of knowledge for the benefit of humanity, so this is an attack on civilisation itself,” said Paul Nurse, president of the UK’s Royal Society.Attacks on scientific, university and cultural institutions “are attacks on the foundations of society and constitute a clear violation of international law,” wrote the German National Academy of Sciences Leopoldina.The presidents of the US National Academies of Sciences, Engineering and Medicine also released a joint statement condemning the attack and pledging to continue to support the Ukrainian research community.The targeting of the Ukrainian academy prompted outcry from European leaders. “Today, science became a target for Russia,” European Commission President Ursula von der Leyen wrote on social media.“These strikes are the latest illustration of the Russian regime’s hostile contempt for science and truth,” said French President Emmanuel Macron.

sciencebusiness.net logo
Sep 29 • 8:00 AM EDT • Science • sciencebusiness.net
MPP Signs Multiple Regional Agreements To Expand Access To Flu Antiviral Medicine

The Medicines Patent Pool (MPP) has signed sublicense agreements with 11 manufacturers across multiple regions to expand access to generic baloxavir marboxil,

healthpolicy-watch.news logo
Sep 29 • 7:38 AM EDT • Health • healthpolicy-watch.news
Optimi Health Appoints Melanie Pump to Board of Directors

Seasoned finance executive brings more than 25 years of leadership experience across technology, digital infrastructure, software, fintech and emerging growth companiesVANCOUVER, British Columbia, Sept. 29, 2026 (GLOBE NEWSWIRE) -- Optimi Health Corp. (NASDAQ: OPTH) (CSE: OPTI) (FSE: 8BN) ("Optimi" or the “Company"), a commercial-stage manufacturer and clinical-stage developer of regulated psychedelic drug products, today announced the appointment of Melanie Pump to its Board of Directors (the "

finance.yahoo.com logo
Sep 29 • 7:30 AM EDT • Health • finance.yahoo.com
AMLO Son Poses Political Problems for Mexico’s President Sheinbaum

Andrés Manuel López Beltrán has joined the list of figures who, critics say, may end up harming the left-wing movement his father founded, as well as the president who succeeded him.

nytimes.com logo
Sep 29 • 5:02 AM EDT • Politics • nytimes.com
BMW Manufacturing hosting 900 students for career day Oct. 6

BMW Manufacturing will welcome more than 900 middle and high school students Oct. 6 for the company’s Manufacturing Careers Day 2026.

upstatebusinessjournal.com logo
Sep 28 • 6:00 PM EDT • Business • upstatebusinessjournal.com
Iowa businesses recognized as top 100 US small businesses

Three Iowa businesses were named to the U.S. Chamber of Commerce’s 2026 CO—100: America’s Top 100 Small Businesses list. The CO—100 recognizes small businesses for their growth, innovation and commitment to their customers, according to a news release. Original Group Holdings, a woodworking equipment manufacturer in Britt, was recognized as a community champion. The company…

businessrecord.com logo
Sep 28 • 5:14 PM EDT • Business • businessrecord.com
NAVANEETHAKRISHNAN: You do not know women’s sports

When female autonomy is still marketed through male desire, is it really empowerment or just the same gaze repackaged?

vanderbilthustler.com logo
Sep 28 • 5:01 PM EDT • Sports • vanderbilthustler.com
Trump unveils $15B planned Iowa steel project

Mesabi Metallics plans a $15 billion steel mill in Iowa using iron ore from its Minnesota mine, creating thousands of jobs and boosting us manufacturing.

virginiabusiness.com logo
Sep 28 • 4:50 PM EDT • Business • virginiabusiness.com
Opioid settlement funds could bridge some health gaps

Back when now-Gov. Maura Healey was the Massachusetts attorney general, in July 2021, she sued opioid distributors, manufacturers, and pharmacies for their prescription practices, which the state argued contributed to a national opioid crisis. What resulted was a settlement of more than $1 billion from opioid-makers Johnson and Johnson and opioid-distributors McKesson, Cardinal, and AmerisourceBergen. […]

mvtimes.com logo
Sep 28 • 4:16 PM EDT • Health • mvtimes.com
HYROX Partnership Brings Fitness Racing to The HFA Show 2027

Health & Fitness Association submitted comments to the Office of the US Trade Representative on two trade policy dockets that could have significant implications for exercise equipment manufacturers, suppliers, and fitness facility operators.

healthandfitness.org logo
Sep 28 • 1:20 PM EDT • Health • healthandfitness.org
Kone overtakes Barella to become Serie A’s most expensive midfielder

The season has started off on the right foot for Roma, who are still undefeated in their first six league and Champions League matches. Among the key players is undoubtedly French midfielder Manu Kon�...

sports.yahoo.com logo
Sep 28 • 8:40 AM EDT • Sports • sports.yahoo.com
Diaper maker grows jobs, investment in Rockingham County

Belgium-based Drylock Technologies has exceeded its investment and job creation promises in Reidsville in Rockingham County. The hygiene products manufacturer promised in February 2024 to invest $26.9 million to create 113 jobs at its first U.S. factory for baby care products. Since then, Drylock has invested more than $31 million and has 212 workers who […]

businessnc.com logo
Sep 28 • 8:23 AM EDT • Business • businessnc.com
Vetter Expands Global Manufacturing Network to Support Future Customer Needs

RAVENSBURG, Germany--(BUSINESS WIRE)--Sep 28, 2026--

rutlandherald.com logo
Sep 28 • 8:17 AM EDT • Business • rutlandherald.com
Navigating the American Dream: How Integrated Financial Tools, Credit and Rewards Can Help Small Businesses Succeed

(Feature Impact) Owning a small business has been a cornerstone of the “American Dream” for generations. It represents the chance to transform a passion into a livelihood and legacy. However, turning dreams into reality is rarely a smooth or easy process and requires more than ambition alone. Today’s business owners need support and access to tools that enable them to overcome challenges and keep growing.#placement_678081_0_i{width:100%;margin:0 auto;}var rnd = window.rnd || Math.floor(Math.random()*10e6);var pid678081 = window.pid678081 || rnd;var plc678081 = window.plc678081 || 0;var abkw = window.abkw || '';var absrc = 'https://ads.empowerlocal.co/adserve/;ID=181918;size=0x0;setID=678081;type=js;sw='+screen.width+';sh='+screen.height+';spr='+window.devicePixelRatio+';kw='+abkw+';pid='+pid678081+';place='+(plc678081++)+';rnd='+rnd+';click=CLICK_MACRO_PLACEHOLDER';var _absrc = absrc.split("type=js"); absrc = _absrc[0] + 'type=js;referrer=' + encodeURIComponent(document.location.href) + _absrc[1];document.write('');Recent research conducted by the Capital One Insights Center shows 75% of more than 1,000 surveyed small business owners with more than one employee and annual revenues of up to $20 million are confident about the future, and 69% believe their business is actively primed for growth.While this optimism is promising, 47% of business owners still said their operations either stayed the same or became less efficient over the past year, citing issues like back-office friction and fragmented financial systems that make it difficult to get a clear picture of the health of their businesses.If you’re a small business owner eager to grow but not sure how to get there, start with this advice from real small business owners and experts at Capital One.Identify Sources of FrictionBefore you can pour effort into growth, you must understand what barriers are holding you back. Take time to look under the hood of your business to identify where time and energy is being lost.For example, you may be among the 78% of small business owners who feel stressed and uncertain about expense management – think hours spent hunting for receipts, manually entering numbers into software and reconciling accounts. Operational challenges aren’t just a hassle; they also pull attention away from important priorities like serving your customers and planning for growth. “We were focused on making as many candles as possible, especially during the busy season,” said Katie Roering, co-owner of Fontana Candle Co. “A lot of the back-office tasks like procurement, raw material purchasing, forecasting – all the really important things – were done at 3 a.m., 8 p.m. or on Saturday and Sunday, and there really just was not enough time in the day to get everything done that we needed to. We just knew as we continued to grow, we needed to streamline our processes, build out our team and keep moving forward.”Use Integrated Tools to Manage FinancesInstead of balancing 10 different tracking and analysis tools, you can turn to one-stop solutions to improve efficiency. Time gets lost when you’re forced to manually gather and interpret relevant data before you’re able to act. You need a platform that handles the busywork for you.Integrated, or “all-in-one,” financial tools – like accounting and bookkeeping platforms with automation capabilities or business credit cards featuring built-in analytical tools – allow you to easily stay on top of cash flow and day-to-day operations. For small businesses where every hour and dollar makes a difference, consolidating and automating systems can have an immediate impact. In fact, 51% of survey respondents said integrated tools have already fueled their growth.Leverage Credit Access and Rewards WiselyGrowth requires capital, so access to credit is a game-changer for many business owners, with 77% describing it as a key factor in achieving business resilience. Having funds accessible when you need them makes your business more capable of weathering storms such as equipment failures and seasonal slowdowns. It also puts the power in your hands to act when an exciting opportunity presents itself, like an inventory flash sale or the chance to advertise in a new market.Access to credit comes with another advantage: rewards. By using credit cards for your daily business expenses, you can earn cash back, points or travel rewards. Whether you redeem these to cover everyday expenses, book business trips or reinvest in the business, they can act as a bonus source of income. Learn to maximize rewards like the 84% of small business cardholders surveyed so you aren’t leaving money on the table.To learn more about how small business owners can identify obstacles, employ integrated financial tools and use credit as a tool for growth, read the full report at capitalone.com/about/insights-center.Photos courtesy of Shutterstock

times-herald.com logo
Sep 28 • 1:00 AM EDT • Business • times-herald.com
Studs and duds from Rams' 30-26 loss to Broncos

Kyren Williams and Davante Adams showed up in a big way, while Emmanuel Forbes Jr. had a rough night for the Rams.

sports.yahoo.com logo
Sep 28 • 12:47 AM EDT • Sports • sports.yahoo.com
Bob on Business: Notaries and funerals? It’s the Fort Worth Business Plan Competition

Also, Pilates, manufacturing, real estate, maroon Mouser and more Pilates!

fortworthreport.org logo
Sep 27 • 7:55 PM EDT • Business • fortworthreport.org
Panther Lake teardown reveals Intel 18A in detail — TSMC still leads in density

SemiAnalysis has taken Intel’s Panther Lake apart, showing how the company’s 18A process combines RibbonFET gate-all-around transistors with PowerVia backside power delivery. The analysis finds that 18A delivers logic density similar to TSMC’s N3E, but does not yet give Intel a clear manufacturing lead over TSMC’s newer nodes.

notebookcheck.net logo
Sep 27 • 5:23 PM EDT • Technology • notebookcheck.net
Dallas Fed gives updates on manufacturing, service and energy sectors

This week's business events include reports from the Federal Reserve Bank of Dallas on some of state's biggest industries.

dallasnews.com logo
Sep 27 • 9:20 AM EDT • Business • dallasnews.com
Roma star Manu Kone’s value now nearing €100m

Serie A side Roma saw Manu Kone get linked with a host of Premier League teams in the summer. They managed to keep hold of him right after Chelsea made concrete advances and this decision has paid off...

sports.yahoo.com logo
Sep 26 • 12:30 PM EDT • Sports • sports.yahoo.com
😐 Neutral (0%)
ahah
100%
Trump declines to say if Ukraine can manufacture Patriot missiles to fend off Russian attacks

President Donald Trump declined to say if he agreed to allow Ukraine manufacture Patriot missiles a day after Ukraine’s Volodymyr Zelensky reported he would.

cnn.com logo
Sep 26 • 12:09 PM EDT • Politics • cnn.com
Intel Panther Lake Teardown, 18A, BSPD, GAAFET, SemiAnalysis STEEL

Panther Lake debuts the first commercial implementation of backside power delivery (BSPDN), introduces Intel’s first iteration of gate-all-around (GAA) transistors, and showcases their advanced packaging capabilities with its Foveros-S assembly. With Panther Lake, Intel’s manufacturing arc has shifted from nebulous roadmaps to shipped silicon, a significant milestone on their long road back to competitive semiconductor manufacturing. To evaluate the extent of Intel’s comeback, we tore down Panther Lake. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Our teardown traces 18A from its four-sheet RibbonFETs (Intel’s marketing name for GAAFETs) and gate stacks through contacts, frontside and backside wiring, and the bonded carrier. We explain how these material and integration choices improve gate control and reduce resistance, while adding capacitance, thermal resistance, and process complexity. Our measurements put Panther Lake’s 18A compute logic and TSMC N3E GPU logic at similar logic density. However, 18A does not lead TSMC N3P, N2 or Samsung SF2 in peak density. Panther Lake’s CPU cores are incremental updates, and the high-end GPU still uses TSMC N3E. Panther Lake assembles one compute tile, one GPU tile, and one I/O tile atop a passive base tile using Intel’s Foveros-S advanced packaging. Both compute tile variants use Intel 18A. The Xe3 GPU options are a 4-core GT1 tile on Intel 3 and a larger 12-core GT2 tile on TSMC N3E. Both I/O tile variants use TSMC N6. [1], [2] Our analysis centers on the PTL-U compute tile, both the 4-core and 12-core GPU tiles, as well as the 12-lane I/O tile. In conventional chips, power and signal are routed through the same frontside metal stack towards the device frontend. Power rails consume scarce routing resources near the transistors, while tall via stacks carry VDD and VSS from the coarse upper wires to local rails. Backside power delivery (BSPD) moves the main power network behind the transistor layer, to the backside, separating it from frontside signal routing. We covered BSPD and its impacts in 2024. [3], [4], [5] Intel’s BSPD implementation, branded as “PowerVia”, routes power through dedicated backside metals to nano-TSVs, which connect those rails to local source/drain (S/D) contacts. Implementing that separation requires Intel to build the interconnect stacks from both sides of the wafer. The frontside comprises the M0-M14 signal stack, while the backside comprises the BM0-BM5 power stack. M0 and BM0 are closest to the transistors. The nano-TSVs connect the two sides, but Intel patterns and etches each via from the front after forming the contacts. A narrow via runs from the side of the contact deep into the silicon substrate. Intel then completes the frontside signal metal stack, bonds the wafer to a carrier, flips it and removes the original substrate until the buried via tips are exposed. The backside metal stack is then deposited directly on the revealed vias. The nano-TSV and backside-via profiles taper in opposite directions because Intel forms them from opposite sides of the wafer. The transistor structures form the FEOL. Local contacts and nano-TSVs connect them to the wiring. M0 begins the frontside interconnect stack. The silicon carrier remains attached above the frontside interconnects. It supports the device wafer during substrate removal and backside processing and remains part of the finished chip’s thermal path. PowerVia removes the main power distribution from the congested frontside metals, routing supply through shorter and wider backside wires. Its lateral landing still occupies area in the standard cell, so it recovers less cell area than a direct backside contact. [3] Nano-TSVs beside the logic devices carry VDD or VSS from the backside power network, while signal connections continue upward through the frontside metals. Backside Interconnects Samsung SF2 data is included for comparison to Panther Lake’s within this article. SF2 is the incumbent GAA foundry node but lacks BSPD, serving as a useful reference to evaluate 18A. A full teardown of Samsung’s S26 products, processed on SF2, will be shared soon.Nanosheet-cut EDS comparison. The PowerVia supply path runs from the backside Cu rails through Mo-lined W nano-TSVs to the local transistor contacts. In this cross section, the tapered connection spans roughly 150 nm from the contact level to BM0. The Ta liner confines Cu and promotes adhesion to the surrounding stack; the AlOₓ etch stop controls the next dielectric etch above the rail. Dielectric beneath the ribbons electrically separates the devices from the backside wiring and removes the conducting silicon body below the channel. [6] AlOₓ serves as an etchstop (ES), enabling endpointing and protecting the underlying layers. Low-volatility aluminum fluoride reaction products resist the fluorinated plasma, allowing a thin AlOₓ film to protect the metal while the surrounding low-k dielectric is removed. [6], [7]. While the BM0 and layers above the M1 lines show double AlOx layers, Our SMIC N+3 teardown showed single AlOₓ layers. SMIC uses a simpler local AlOₓ substack, while the remaining cap and etch sequence provide the required landing protection. So why double layers? The closely spaced AlOₓ doublets provide two protected endpoints in the etch sequence. Intel documents an AlOₓ/SiN/AlOₓ stack that explains the benefit. The main dielectric plasma etch stops on the first AlOₓ film; a selective wet clear opens that film; a second plasma etch removes the intermediate SiN and stops on the second AlOₓ film. The final wet clear exposes the metal landing surface. SiN is the intermediate dielectric in Intel’s published example. [8] The second stop protects the metal through a cap breakthrough. Wide openings can etch faster than narrow ones, and etch depth varies across the wafer. Metal under an early-clearing opening would otherwise be exposed while other openings still need more etching. Staged protection widens the process window and reduces metal erosion, corrosion and void formation. [8] TSMC documents AlN/AlOₓ/SiOC/AlOₓ above Cu, with AlN blocking Cu diffusion, and a simpler AlN/SiOC/AlOₓ variant that omits one AlOx film. [9] Levels with different opening sizes, aspect ratios, pattern densities and cap materials need different etch margins. A double AlOx stop is useful where another protected endpoint justifies the added processing. The extra film adds formation, selective opening and cleaning steps, plus another set of interfaces to control adhesion, moisture, and stress. These blanket films are opened through the existing via pattern, so each film does not require another lithography mask. AlOₓ adds parasitic capacitance when it replaces lower-k dielectric; two thin AlOₓ films can nevertheless contain less AlOₓ than one thick film. Total thickness, placement, and theintermediate dielectric determine the electrical cost. Deposition chemistry also changes AlOx permittivity and residual hydroxyl content, which can oxidize the underlying metal. [7], [8], [10], [11] The backside stack separates into relatively fine BM0-BM2 wiring near the devices and coarser BM3-BM5 power distribution. The largest pitch increase occurs between BM2 and BM3. BM0’s pitch closely matches the logic-row height, fitting local power delivery to the cell rows. Higher levels aggregate current through larger conductors: routing density becomes less important than low resistance and current capacity as the network approaches the package. This hierarchy provides wide power wiring for the power delivery network without consuming scarce frontside signal-routing resources. [3] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Frontside Interconnects Intel 18A combines Mo-lined W contacts and nano-TSVs with a separate backside Cu power network. Samsung SF2 keeps power on the frontside, using Ti-based contact interfaces and Ta-based barriers and Co liners around Cu wiring. In 18A standard-cell rows, backside power rails supply the devices through nano-TSVs within the cells, freeing frontside routing resources. Samsung’s M0 accommodates both power and signal connections. From the device toward M0, the connection runs through a Ti-based S/D interface, W contact fill, a Mo-lined W via, and the Cu M0 wire. Mo supplies a conductive nucleation and adhesion layer for W, replacing the resistive TiN liner used in conventional W integration. This increases the effective conduction volume within the feature while retaining W fill and its established polishing, cleaning and etching processes. Intel’s Mo/W patent describes this integration tradeoff. The nano-TSV uses the same Mo-lined W construction in the backside supply path. [12] The move from TiN to Mo is an incremental change. While a full Co or Mo fill can also reduce the volume lost to liners in very small features, it requires new integration schemes that increase complexity and risk. Cu remains attractive for wider wires due to its low resistance. As wires and vias shrink, the diffusion barrier consumes an increasing fraction of their cross-section. [12], [12], [14] Intel uses Co/Ru liners at M0-M1, Co at M2-M4, and Nb at M5-M9. The lower-level liners help Cu adhere and reduce void formation during trench fills. Applied Materials’ Endura has new thermal control that facilitate wetting process, so the thin film continuity is good enough that good capillary pressure will drive Cu atoms to the via bottom without voiding. Intel’s choice to use Nb is particularly interesting. Intel’s Nb patent describes a conductive diffusion barrier intended to reduce the barrier’s contribution to resistance relative to conventional Ta-based barriers, particularly at via bottoms where all current crosses the barrier. The patent pairs Nb in coarser levels with the option of lower-cost PVD processing. [15], [16] The upper metal layers support thicker barriers formed through physical vapor deposition (PVD) despite its worse coverage and uniformity. Meanwhile, the lower metal layers require thinner barriers deposited through conformal atomic layer deposition (ALD). Co/Ru adds another material interface and requires controlled deposition and Cu fill. Changing liners and barriers by metal layer allows Intel to optimize interconnect resistance, process complexity, and reliability. [15, 16] RibbonFET, Intel’s name for its gate-all-around FETs (GAAFETs), replaces the FinFET’s vertical fins with four stacked horizontal silicon nanosheets, allowing the gate to surround the channel on every side. The path to GAAFET begins with the planar transistor. A planar MOSFET places the gate above the channel between its source and drain. Pairing an NMOS with a PMOS transistor creates a CMOS inverter, in which the NMOS pulls the output low for a high input, and the PMOS pulls it high for a low input. The gate must retain electrostatic control of the channel to ensure clean switching. As gate lengths shrank, the drain began to compete with the gate for that control, increasing off-state leakage. Electrostatic control was restored through an architectural evolution that raised the channel into a vertical fin and wrapping the gate around three sides. Called “FinFET”, this new architecture packed more effective channel width into a smaller footprint. Further scaling made it harder to maintain both drive current and leakage within smaller cells, and reintroduced the same problems planar MOSFETs faced. Nanosheet GAAFETs close the fourth side by replacing the vertical fin with a stack of horizontal nanosheets, each surrounded by the gate. The tighter electrostatic control suppresses leakage at shorter gate lengths while stacking adds effective channel width within the cell footprint. In a FinFET process, channel width changes in discrete steps as designers must add or remove whole fins. Nanosheet width can instead be adjusted continuously within the process’s design rules. Wider sheets increase drive current, while narrower sheets reduce capacitance at the cost of drive current. Intel 18A uses stacks of four nanosheets each and varies their widths across logic and SRAM. At the process level, adding more sheets to each stack increases effective channel width and drive current, but complicates fabrication. RibbonFET vs MBCFET Samsung began GAAFET production in 2022 with SF3E, following with SF3 and now SF2. Its ‘MBCFET’ provides a useful structural comparison with Intel’s first RibbonFET implementation. [17] STEEL is digging deeper into SF2, used in the Exynos 2600, and TSMC’s GAAFET N2, used in Apple’s A20 Pro, in upcoming newsletter articles. We’re throwing some teasers on X. Let’s compare Samsung SF2’s MBCFET with Intel 18A’s RibbonFET. Subscribe Even to the untrained eye, Intel’s extra nanosheet is obvious. Intel stacks four ribbons to Samsung’s three. Samsung’s sheets are much wider in these fields, so both sheet count and width matter to the available channel perimeter. Sheet width also changes which silicon surfaces carry current. On conventional (001) silicon, wide nanosheets emphasize the broad top and bottom surfaces, favoring electron transport; the larger sidewall contribution in a narrow sheet favors hole transport. Thinner sheets improve gate control but increase confinement and scattering. This makes width and thickness part of the NMOS/PMOS balance, alongside strain and threshold voltage. [18], [19] GAAFET designs like 18A use different work-function-metal (WFM) stacks for NMOS and PMOS. Around each ribbon, a thin SiOx interfacial layer separates the silicon channel from the HfOx high-k dielectric, with La providing dipole tuning and the WFM wrapping the dielectric. NMOS uses a TiAl-based stack, while PMOS uses TiN WFM. W fills the remaining gate trench, providing a lower-resistivity path where the work-function layers are no longer needed. In this field, the PMOS stacks leave room for W between ribbons, while the NMOS stacks occupy more of those gaps. A silicon-based dielectric marks the P/N boundary, allowing the PMOS and NMOS gates, sharing the same gate trench, to be processed sequentially. Fast logic paths, retention circuits, and SRAM need a family of threshold options. Changing threshold without substantially changing device dimensions, capacitance or fabrication complexity is valuable. FinFET processes typically use different work-function-metal stacks. In a four-ribbon GAA stack, the narrow sheet-to-sheet gap limits how much WFM can fit around each channel. La in the gate dielectric creates interfacial dipoles at the SiOx/HfOx boundary, shifting effective work function and tuning threshold voltage. This gives Intel another control alongside its NMOS and PMOS WFM stacks. Low-threshold devices improve critical-path drive; higher thresholds reduce leakage elsewhere. Dipole tuning is especially useful in GAA because it changes threshold without consuming the narrow intersheet gap with thicker WFM. Precise control of La incorporation, diffusion and interface quality has long been a challenge, limiting viability in high volume production but is now seen from every leading-edge foundry. Intel’s patent describes depositing a dipole-forming oxide above HfOx and annealing it toward the interfacial oxide before completing the work-function and fill metals. This separates threshold tuning from the space available for metal. Newer research addresses the thermal cost: imec’s 2026 dipole-middle research inserts the shifter between two HfOx depositions, shortening the diffusion path while protecting SiOx during patterning. [20], [21]Matched-cut EDS, Intel 18A (left) vs. Samsung SF2 (right). Intel retains raised source/drain epi beneath its contacts, while Samsung recesses W deep into the epi to form a V-shaped Ti-lined interface. The deeper contact increases metal-to-semiconductor area and shortens the current path from the lower sheets, reducing contact and spreading resistance. It also removes epi volume and brings the contact etch closer to the channel ends. Retaining more epi preserves the material available for strain transfer, especially from SiGe into PMOS. These geometries balance contact access against stress engineering and etch margin. [22], [23] Samsung stacks three sheets to Intel’s four ribbons, and both processes use sheet width to tune drive strength. In our Samsung cross-sections, widths range roughly from 19 to 30 nm in the NPU rows and 37 to 50 nm in the CU cell. The Samsung nanosheets taper, with the widest sheet at the bottom and the narrowest at the top. Both processes use HfOx gate dielectric and Ti-based work-function stacks, with Al in the NMOS stack. In the Samsung devices shown here, the dielectric and WFM occupy the intersheet gaps, leaving W above the top sheet. Intel’s PMOS stack leaves more room between ribbons, and W fills those gaps while the thicker NMOS stack leaves W mainly in the upper trench. Gate-stack EDS maps. The W between Intel’s PMOS ribbons provides a conductive path close to the lower gates. Where WFM fills the entire gap, the gate still surrounds the channel, but voltage reaches it through the more resistive work-function films. Thinner WFM and dipole tuning preserve room for low-resistivity fill; Mo and Ru are alternative fill metals being developed for further scaling. [24] A masked, sequential WFM flow explains the different gate heights and inter-nanosheet fill. The proposed sequence below shows how separate NMOS and PMOS work-function steps produce that geometry. Enabled by the BSPDN process, Intel replaces the dense-logic silicon subfin with dielectric, removing the parasitic conduction path below the ribbons and reducing substrate-related capacitance. A retained silicon body as in classical, non-SOI, planar and FinFET designs needs junction and punchthrough-stop engineering to suppress leakage. Dielectric isolation makes that leakage less sensitive to the subfin doping profile but adds removal and fill steps. It also weakens the direct thermal path through silicon, making the contacts, metal stacks and package more important for heat extraction. [24], [26] Fluorine is concentrated around selected Intel device structures in the maps. WF6 is a standard precursor for W nucleation and fill, while barrier films protect adjacent dielectrics from fluorine attack. Low-fluorine W processes reduce the residual-F burden. Chloride-based precursors avoid introducing F during W deposition, but require control of chlorine attack, nucleation and fill quality. The integration target is a continuous, low-resistance W path with a thin protective liner and minimal chemical damage to the surrounding stack. [20], [27], [28] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. We measured cell height, gate pitch, metal geometry, and ribbon dimensions at the XTEM sites shown below. The tables group these dimensions by site and device polarity. Our “sheet cuts” cross the silicon channel and show the ribbons end-on. “gate cuts” run along the channel through successive gates. The 18A logic cell dimensions point to a five-track logic library while the N3E and Intel 3 cell dimensions evidence a seven-track logic library. The DDR-PHY uses wider M0 wires and much larger spacing than core logic. That trades routing density for lower wire resistance and weaker coupling between neighboring nets. The geometry suits the current delivery and coupling requirements of analog, clock, and I/O circuitry. PowerVia lets 18A combine a compact cell height with wider M0 geometry by moving the main power rails off the signal-routing tracks. That relaxes local wire scaling while preserving a small cell footprint. Cell height and gate pitch set the geometric density; pin access and routability determine how much of it a real block can use. [29] The biggest takeaway from our gate-pitch measurements is that Intel 18A compute logic and TSMC N3E GPU logic have similar density in the Bohr representative-cell model. The 18A example is 18.6% denser than the Intel 3 GPU example. Gate pitches are nearly identical across the three sites, so cell height drives most of the difference. The Bohr model combines a four-transistor NAND2 spanning three gate pitches and a 32-transistor scan flip-flop (SFF) spanning nineteen pitches, weighting their densities 60:40. The sensitivity column shows how independently changing cell height and gate pitch by ±1 nm changes the result. This compares representative cell geometries; whole-die density also depends on cell mix and placement. The 18A P-core gives M0 substantially more metal cross section than the N3E vector engine. Treating each profile as a trapezoid gives 2.63 times the area per line and 1.84 times the area after normalization by routing pitch. The larger section reduces the geometric contribution to line resistance and lowers current density for a given current. Taller and wider wires also add capacitance, so circuit delay depends on the balance of resistance and capacitance. The DDR-PHY has less metal area per routing width than the 18A core fields, while remaining above N3E. [30] Area = height × (top CD + bottom CD) / 2, including liners. Area/pitch normalizes by routing width. Taper is the symmetric sidewall angle from vertical, with the largest angle belonging to the DDR-PHY. Compute tile The measurements show how ribbon dimensions and gate-stack geometry vary across the compute tile and between NMOS and PMOS to balance channel drive, gate load and the space needed for the dielectric/WFM stack across logic, SRAM and the DDR-PHY. Width mainly changes available channel perimeter; thickness also changes electrostatic control and carrier confinement. Gate-stack thickness then determines the space left for low-resistivity fill P-core and LP E-core logic Both the P-core and LP E-core use multiple nanosheet widths. Widths are measured on high-magnification XTEMs while wider-field images demonstrate additional width choices within the LP E-core. Multiple widths are expected even within an LP E-core. Timing-critical paths, buffers and cells with different fanout need different drive strengths. The lower-magnification fields show this width diversity beyond the sites quantified in the table. L2 and L3 SRAM GAA gives SRAM designers another way to balance the pull-up (PU), pass-gate (PG), and pull-down (PD) transistors. FinFET bitcells set device strength through fin count while GAA adds nanosheet width as a sizing knob. In a 6T SRAM cell, a strong pull-down relative to the pass-gate limits read disturbance, while a strong pass-gate relative to the pull-up improves writability. During a write, the pass-gate and write driver pull the node storing “1” below the inverter trip point. During a read, the pull-down holds the node storing “0” low. Bias, threshold voltage, mismatch and assist circuitry set the remaining margin. FinFET high-current cells commonly use a PU:PG:PD fin-count pattern of 1:2:2, a device-sizing ratio rather than a current ratio. Ribbon width lets Intel balance SRAM strengths without adding whole fins. The L2 cell uses its narrowest ribbons for PU and widest for PD, improving writability and read stability respectively. Intel’s disclosed HCC operates without assist; its denser HDC uses negative-bitline write assist. Pulling the selected bitline briefly below ground increases pass-gate overdrive so it can overpower the pull-up at lower supply voltage. That buys density and low voltage writability at the cost of boosting circuitry, switching energy, and additional voltage stress that must be controlled. [31], [32] Four rectangular ribbons give the perimeter = 8 × (width + thickness), before corner rounding. PG/PU is 1.49 and PD/PG is 1.16. The L3 structures closely resemble L2 in layout and cell height. Fewer L3 nanosheet widths are tabulated because fewer high-magnification images were available. DDR PHY The DDR-PHY trades density for controlled analog behavior and reliable off-chip signaling. It contains drivers, receivers, delay circuits, and calibration logic that set drive strength, sampling time, and voltage margin. Repeated four-sheet devices with similar widths fit the use of regular transistor units for matching and programmable drive. Its wider local wiring provides room for current delivery and separation of sensitive signals, while consuming more area than a dense core-logic grid. The layout serves the memory channel’s electrical requirements as well as digital logic density. [33] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Intel 3 GPU devices Vector engine logic Intel 3’s XVE logic uses two-fin PMOS and NMOS devices with power rails in M0. Its cell height and M0 pitch give a seven-track geometry, two tracks more than the 18A logic. One-fin groups also appear among the two-fin devices. Intel 3 L2 SRAM The Intel 3 L2 SRAM uses the familiar HCC sizing pattern: one PU fin, two PG fins, and two PD fins. N3E GPU devices Vector engine logic The N3E XVE field contains repeated two-fin devices with seven-track cell geometry. N3E remains a FinFET process, giving Panther Lake a direct FinFET-to-RibbonFET comparison. N3E L2 SRAM The N3E L2 SRAM uses the same PU:PG:PD fin-count pattern of 1:2:2. Panther Lake-U follows Lunar Lake’s floorplan quite closely. Both pair 4 P-cores with 4 LP E-cores and NPU, media and display engines in similar locations. Lunar Lake also uses Xe2, the direct predecessor to Panther Lake’s Xe3 GPU. This makes Lunar Lake the most direct basis for our comparisons. Arrow Lake differs in core count and uses the older Xe-LPG GPU architecture, so we only use it where it offers a more direct component-level comparison. Compute tile Panther Lake compute-tile floorplans remain sparse even months after launch. Intel 18A’s backside metal and dielectric stack must be removed without damaging the underlying structures before a clean transistor-level floorplan can be imaged. Most published die shots hide or heavily process the background, but we are quite proud of the die shot we achieved and are excited to show the work we have done. We measured the areas of the key components on the compute tile and compared them with their Lunar Lake predecessors on TSMC N3B. These help us to capture changes in block area and compare the two chips across process nodes and designs. Our total tile areas exclude the scribe-line area. The compute-plus-GPU subtotal below uses the PTL-U compute tile and GT1 GPU; it excludes the I/O tile and passive base. Individual block areas use the boundaries marked on the floorplans The compute-plus-GPU row is recomputed from the displayed PTL-U and GT1 areas. Component rows use their stated per-region counts and are not an additive partition of the whole tile. The P-core area remains almost unchanged between Lunar Lake and Panther Lake, despite L2 capacity increasing from 2.5 MiB to 3 MiB. Arrow Lake uses the same Lion Cove core as Lunar Lake but also has a 3 MiB L2. Cougar Cove fits 20% more L2 into the same P-core area. The larger private cache keeps more of each core’s working set close to its execution units, reducing access to shared L3 and DRAM. Extra capacity adds storage leakage and lookup energy, so designers balance it against avoided lower-level accesses. The shared P-core L3 cache also shrank by 14.8%. [2] Cougar Cove combines a similar footprint with Intel’s reported power-efficiency improvements. RibbonFET’s tighter channel control reduces leakage, while PowerVia reduces supply droop and allows tighter voltage guardbands. [1] Darkmont’s four-core LP E-core cluster is 5.0% smaller than Skymont’s on Lunar Lake, with most of the reduction in its L2 regions. The 1 MiB region shrank by 8.4% and the 1.5 MiB region by 14.9%. The tag arrays also use one fewer visible row. Tags identify which memory addresses the data array holds, so rearranging them changes the cache’s layout and wiring without requiring less data capacity. [2] The LP E-cores share one L2. This pools capacity and avoids duplicating all the cache machinery, but the four cores contend for its banks and bandwidth. Their separate cluster also keeps light work away from the performance cluster and its L3, allowing that larger domain to sleep. [1], [2] Cache area includes more than the storage cells. Tags identify each line, decoders select rows, sense amplifiers read the small bitline signal, and wires connect to the banks. Splitting an array into smaller sections shortens wordlines and bitlines, improving access speed, but duplicates peripheral circuits. Panther Lake’s smaller cache regions therefore reflect the complete memory implementation, including how much of each region is devoted to storage. [34] Unlike Meteor Lake and Arrow Lake, Panther Lake has no separate SoC tile. The NPU, LP E-cores, memory controllers, PHYs, media and display engines now share the compute tile. This removes an active die and keeps CPU memory traffic on one die. The cost is moving PHY and I/O-related circuitry onto 18A: drivers, receivers and analog circuits must still meet external voltage, loading and signal-integrity requirements, so their area does not shrink like dense digital logic. [1], [2] The biggest shrink comes from the NPU, which occupies 36.9% less area. NPU 5 consolidates the same total INT8 MAC count into half as many neural compute engines. Each of the three NCEs has a larger MAC array to make the complete NCE envelope 22.6% larger than an NPU 4 engine. Consolidation also halves the number of scratchpads and SHAVE DSPs, from 12 to 6. The MAC array handles matrix multiplication and convolution, while SHAVE executes vector and custom operations that fit the array poorly. [1], [2], [35] The paired floorplans identify each NCE envelope and its scratchpad, MAC, and SHAVE regions. Each measured MAC polygon is counted once per NCE in the area accounting below. The scratchpads store weights, activations, and intermediate results near the MAC arrays, allowing repeated use without fetching them again from DRAM. Halving their number delivers the largest measured area saving but leaves less local storage for the same total MAC count. Layers that no longer fit locally require smaller working tiles or more transfers of intermediate data. The benefit depends on keeping the enlarged arrays busy while managing that tighter storage budget. [36] NPU 5 also adds native FP8. Using half the operand width of FP16 reduces storage and transfer demand, helping workloads fit the smaller local memory budget. Lower precision and format-dependent range make scaling and model validation part of deployment. Hardware activation functions further reduce work that would otherwise occupy the programmable DSPs. [1], [2] Microsoft requires an NPU to deliver at least 40 TOPS for Copilot+ PCs. Both Lunar Lake and Panther Lake meet this threshold, but Panther Lake uses significantly less silicon. GPU tiles Panther Lake is Intel’s first product with Xe3, its latest GPU architecture. It offers two different GPU tiles: a smaller GT1 tile with 4 Xe3 cores on Intel 3 and a larger GT2 tile with 12 Xe3 cores on TSMC N3E. Panther Lake allows us to compare the same GPU architecture across both Intel 3 and TSMC N3E. Wildcat Lake adds a third Xe3 implementation on Intel 18A. A future newsletter will detail Xe3 and its implementation differences across all three process nodes. GT2 scales Xe3 to a different physical layout, with render slices arranged vertically instead of GT1’s horizontal arrangement. Slice placement sets the distances to shared cache banks and the D2D interface. Those wires consume area and add delay, so scaling the number of Xe cores also requires a new balance of cache placement, routing and timing. [1] What’s immediately obvious is that the GT2 tile on TSMC N3E has much smaller Xe cores than GT1. These block areas include logic, caches, and routing. An Xe core on the GT1 tile is ~69% larger than one on Lunar Lake, and ~55% larger than one on GT2. Intel 3 therefore uses substantially more area per Xe core. The block-area gap exceeds the measured logic and SRAM density gaps, bringing routing, timing targets, cell mix, and floorplan allocation into the comparison. The measured vector/matrix engine region is almost unchanged between Lunar Lake and Panther Lake’s GT2 tile. Xe3 retains eight 512-bit vector engines and eight 2048-bit XMX engines per core. Its gains also come from feeding those engines more effectively: more resident threads hide stalls, and variable register allocation lets shaders trade registers per thread against the number of threads kept active. [1] The shared L1/SLM capacity increased by 33% from 192 KiB to 256 KiB, while its area increased only 5%, raising effective density by 27%. L1 retains reused cache lines, while software-managed SLM lets a thread group share data locally. Both reduce traffic to more distant memory. Allocating more SLM per group can also limit how many groups reside on a core at once. [1], [37] The GT1 tile carries 4 MiB of L2 against 16 MiB on the GT2 tile. GT1 divides its L2 cache into four 1 MiB banks, while GT2 uses eight 2 MiB banks. Each bank contains 128 macros, but each N3E macro stores 16 KiB, twice the Intel 3 macro’s 8 KiB capacity. The N3E macro is only 54% larger while holding twice as many bits, giving it 30% higher density: ~23.7 Mbit/mm² versus 18.3 Mbit/mm². Including bank-level circuitry, the gap widens to ~16.9 Mbit/mm² on GT2 versus ~10.4 Mbit/mm² on GT1. GT2 gains density with its macros storing more bits per unit area, and those macros occupy more of each cache bank. Larger macros spread decoder and sense-amplifier overhead across more storage, while a more compact bank layout reduces the share spent on control and routing. The compromise is longer wordlines and bitlines that carry more capacitance. [34] I/O tile Panther Lake uses two I/O tile variants, both fabricated on TSMC N6. The smaller one provides 4 PCIe 5.0 and 8 PCIe 4.0 lanes and serves lower-tier systems as well as those without a discrete GPU, while the larger one adds 8 PCIe 5.0 lanes, bringing the total to 20 lanes, for discrete-GPU connectivity. Panther Lake SKUs with the larger 10- or 12-Xe GPUs use the smaller I/O tile. [38] The smaller I/O tile adds a PCIe 4.0 block and a Thunderbolt block to Lunar Lake’s I/O layout, providing four additional PCIe 4.0 lanes and another Thunderbolt 4 port. Its repeated N6 blocks retain nearly identical areas and layouts. Reusing these proven PHYs and controllers avoids porting and requalifying external interfaces on 18A, where faster digital logic offers less benefit to circuits constrained by the off-chip link. [38] SemiAnalysis’s teardown lab (STEEL) dives deep into the world’s advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. We’re hiring technical experts from system to transistor and everywhere in between. Check out our Careers page. Panther Lake offers scalability and modularity through its disaggregated packaging that partition compute, GPU, and I/O silicon into separate tiles allowing for a suite of tile configurations. This partitioning makes the package part of Intel’s node economics as it determines how much leading-edge wafer area each product consumes, which functions can remain on other processes, and how much configuration freedom Intel can offer from a shared set of tiles. Furthermore, fabricating the compute and GPU tiles separately confines the new 18A process to the compute tile and allows graphics and I/O to use other, more established, and more cost-effective processes. For Panther Lake, the GPU and I/O tiles are assembled alongside the compute tile on a passive silicon base using Foveros-S. Intel’s current technology brief lists a nominal 36 µm pitch for Foveros-S. Through-silicon vias (TSVs) in the base connect the fine wiring above to the larger package connections below. The functional tiles sit side by side on that passive base in a 2.5D configuration. [39] Our cross-section through the compute and GPU tiles shows the package’s wiring hierarchy. Microbumps connect each active tile to the passive silicon base; its fine redistribution layer (RDL) carries the short, dense tile-to-tile links. TSVs carry connections through the base to the package substrate, which fans them out to the much coarser motherboard solder joints. The base supplies interconnect, while computation remains in the active tiles above it. [39] At the compute-tile edge, the higher-magnification inset shows a local microbump spacing of approximately 25.24 µm and a feature width of 12.33 µm. These local spacings are finer than Intel’s nominal Foveros-S value. The X-ray fields further confirm tighter neighboring bumps, consistent across every die-to-die area found on each tile. Additional X-ray analysis is offered after the paywall. Putting the memory controller beside the CPU removes the D2D transfer that CPU memory requests required in Meteor Lake and Arrow Lake. This avoids the extra transmitter, receiver, and link traversal, saving interface energy and latency. Panther Lake’s separate GPU still crosses a D2D link to reach DRAM, so its larger local caches also help contain package traffic. [1], [40] Smaller dies are less likely to contain a random fatal defect, and screening them before assembly prevents one bad tile from consuming a complete package of good silicon. Reuse also spreads design and qualification work across more products. Against those gains, Intel pays for the passive base, D2D circuits, extra bonding and test steps, and losses during assembly. Cost per working product across the portfolio captures the combined effect of wafer yield, reuse, test, and assembly. [29] Wildcat Lake packaging Intel launched Core Series 3, formerly Wildcat Lake, on 16 April 2026 for value mobile and edge systems. Wildcat Lake keeps 18A but removes the passive base and combines more functions on one die to simplify the package. The two products therefore reveal two distinct ways to commercialize the same leading-edge process. [41] Wildcat Lake’s 18A die combines up to two Cougar Cove P-cores, four Darkmont LP E-cores, two Xe3 cores and a smaller NPU. A separate platform-controller die supplies I/O, connected through UCIe, Intel’s first processor implementation of the standard. Consolidating graphics remove a tile boundary and the passive base, reducing assembly complexity for a modest-bandwidth value product. It also ties CPU and graphics scaling to the same die, giving up Panther Lake’s ability to swap in a much larger GPU. [42], [43] In July 2021, Intel CEO Pat Gelsinger set out an ambitious process roadmap aimed at regaining performance leadership by 2025, later described as five nodes in four years. Five years and one CEO later, Intel’s comeback story is not as unambiguously positive as Pat may have hoped. [44], [45] Intel once set the pace for process technology, bringing high-k metal gate technology and FinFETs into volume production years ahead of the rest of the industry. Its 22 nm FinFET process reached consumers with Ivy Bridge in 2012. [46] Intel’s integrated device manufacturing (IDM) model allowed its architects and process engineers to co-optimize products and processes. Starting with Sandy Bridge, Intel dominated x86, while AMD struggled with Bulldozer. That lead faltered at 14 nm and broke at 10 nm. Intel targeted a massive 2.7× density increase, but the node arrived years late and required several revisions before it could support Intel’s full lineup. This delay forced Intel to stretch 14 nm across six generations, while TSMC moved ahead in process technology and AMD recovered in x86. By 2019, Intel was still shipping 14 nm across most of its product stack, with its 10 nm client ramp focused on Ice Lake mobile processors. Meanwhile, TSMC was shipping N7 and N7+, and AMD’s Zen 2 compute chiplets used N7 to raise core counts and improve efficiency. Intel’s process failures were central to its decline, but unsound business decisions furthered their downward slide. Product delays compounded product mistakes, pushing client, server, and FPGA roadmaps off schedule. Several attempts to enter AI (Nervana and Gaudi) and networking (Tofino) also failed to establish lasting businesses. Intel’s recovery has focused on consumer CPUs and advanced packaging. Tiger Lake, Alder Lake, Lunar Lake and now Panther Lake have restored Intel’s consumer roadmap. On the process side, Intel 4 shipped with Meteor Lake, Intel 3 with Granite Rapids and Sierra Forest, and Intel 18A with Panther Lake. Intel has also made advanced packaging part of its foundry offering. However, Intel is still playing catch-up in servers. Several Xeon generations arrived years late and trailed contemporary AMD and Arm server CPUs in performance, efficiency, and core count. The process roadmap is back, but Intel does not hold the same process-technology leadership position it held prior to 10 nm. The introduction of gate-all-around nanosheets and backside power delivery are two of the biggest changes to transistor integration in a decade. Intel took on both changes at once: 18A paired its first RibbonFET with PowerVia in Panther Lake. Panther Lake is a substantial manufacturing milestone. Our cross-sections show how RibbonFET and PowerVia reshape local contacts and wiring, while the floorplans show where architectural consolidation and process choices save area. A sustained competitive lead depends on product performance, cost, yield, and the next implementation. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page.. [1] Intel, “Intel Tech Tour 2025 Panther Lake recap,” Doc. 866361, 2025. Accessed: Sep. 14, 2026. [Online]. Available: https://cdrdv2-public.intel.com/866361/ITT_2025_Panther_Lake_Recap1.pdf [2] Intel, “Core Ultra processors Series 3 datasheet, volume 1,” Doc. 872188-001, Jan. 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://cdrdv2-public.intel.com/872188/872188-001.pdf [3] N. Horiguchi and E. Beyne, “Backside power delivery: How to power chips from the backside,” imec Reading Room, Nov. 25, 2022. Accessed: Sep. 14, 2026. [Online]. Available: https://www.imec-int.com/en/articles/how-power-chips-backside [4] W. Hafez et al., “Intel PowerVia technology: Backside power delivery for high density and high-performance computing,” in Proc. IEEE Symp. VLSI Technol. Circuits, Kyoto, Japan, Jun. 2023, pp. 1–2, doi: 10.23919/vlsitechnologyandcir57934.2023.10185208. [5] K. Fischer et al., “Intel 18A platform technology featuring RibbonFET (GAA) and PowerVia for advanced high-performance computing,” in Proc. Symp. VLSI Technol. Circuits, Kyoto, Japan, Jun. 2025, pp. 1–3, doi: 10.23919/vlsitechnologyandcir65189.2025.11075006. [6] K.-F. Cheng, C.-L. Teng, H.-Y. Huang, and H.-C. Chen, “Metal oxide composite as etch stop layer,” U.S. Patent 12 176 247 B2, Dec. 24, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US12176247B2/en [7] S. W. King, “Dielectric barrier, etch stop, and metal capping materials for state of the art and beyond metal interconnects,” ECS J. Solid State Sci. Technol., vol. 4, no. 1, pp. N3029–N3047, 2015, doi: 10.1149/2.0051501jss. [8] A. V. Mule’, D. J. Towner, D. Seghete, C. R. Ryder, and A. A. Gonzalez, “Multi-layer etch stop layers for advanced integrated circuit structure fabrication,” U.S. Patent Appl. 20220102343 A1, Mar. 31, 2022. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US20220102343A1/en [9] C.-C. Wang and J. H. Wang, “Interconnect structure with dielectric cap layer and etch stop layer stack,” U.S. Patent Appl. 20230253247 A1, Aug. 10, 2023. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US20230253247A1/en [10] Y. J. Wu, K.-F. Cheng, C.-C. Lee, H.-K. Chang, and H.-Y. Huang, “Etch stop layer for interconnect structures,” U.S. Patent Appl. 20240332070 A1, Oct. 3, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US20240332070A1/en [11] M. G. Rainville, N. Shankar, K. S. Reddy, and D. M. Hausmann, “Deposition of aluminum oxide etch stop layers,” U.S. Patent Appl. 20180197770 A1, Jul. 12, 2018. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.justia.com/patent/20180197770 [12] J. S. Leib et al., “Conductive lines having molybdenum liner and tungsten fill for advanced integrated circuit structure fabrication,” U.S. Patent Appl. 20240429126 A1, Dec. 26, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.justia.com/patent/20240429126 [13] M. Naik, “Cobalt enables power and performance scaling at single-digit logic nodes,” Applied Materials, Dec. 17, 2018. Accessed: Sep. 14, 2026. [Online]. Available: https://www.appliedmaterials.com/us/en/blog/blog-posts/cobalt-enables-power-and-performance-scaling-at-single-digit-logic-nodes.html [14] Lam Research, “Breaking through AI’s invisible barrier with molybdenum,” Lam Research Newsroom, May 6, 2025. Accessed: Sep. 14, 2026. [Online]. Available: https://newsroom.lamresearch.com/molybdenum-metallization-ai-revolution [15] P. Yashar, G. Malyavanatham, and H. Vijwani, “Integrated circuit interconnect structures with niobium barrier materials,” U.S. Patent Appl. 20240112951 A1, Apr. 4, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US20240112951A1/en [16] Applied Materials, “Applied Materials unveils chip wiring innovations for more energy-efficient computing,” Applied Materials Investor Relations, Jul. 8, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://ir.appliedmaterials.com/news-releases/news-release-details/applied-materials-unveils-chip-wiring-innovations-more-energy [17] Samsung, “Samsung showcases AI-era vision and latest foundry technologies at SFF 2024,” Samsung Semiconductor, Jun. 13, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://semiconductor.samsung.com/news-events/news/samsung-showcases-ai-era-vision-and-latest-foundry-technologies-at-sff-2024/ [18] C. W. Yeung et al., “Channel geometry impact and narrow sheet effect of stacked nanosheet,” in Proc. IEEE Int. Electron Devices Meeting (IEDM), Dec. 2018, pp. 28.6.1–28.6.4, doi: 10.1109/iedm.2018.8614608. [19] S. Mochizuki et al., “Evaluation of (110) versus (001) channel orientation for improved nFET/pFET device performance trade-off in gate-all-around nanosheet technology,” in Proc. Int. Electron Devices Meeting (IEDM), Dec. 2023, pp. 1–4, doi: 10.1109/iedm45741.2023.10413854. [20] D. G. Ouellette et al., “Fabrication of gate-all-around integrated circuit structures having molybdenum nitride metal gates and gate dielectrics with a dipole layer,” U.S. Patent 12 051 698 B2, Jul. 30, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US12051698B2/en [21] imec, “Advancing the CFET-based device roadmap with novel integration modules and standard-cell architectures,” imec, 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://www.imec-int.com/en/articles/advancing-cfet-based-device-roadmap-novel-integration-modules-and-standard-cell [22] A. Reznicek, X. Miao, C. Lee, and J. Zhang, “Wrap around contact for nanosheet source drain epitaxy,” U.S. Patent 11 302 813 B2, Apr. 12, 2022. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US11302813B2/en [23] J. A. Kittl, J. G. Hong, D. R. Palle, and M. S. Rodder, “Methods for varied strain on nano-scale field effect transistor devices,” U.S. Patent 9 978 833 B2, May 22, 2018. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US9978833B2/en [24] S. Gandikota et al., “Method of reducing metal gate resistance for next generation NMOS device application,” Int. Patent Appl. WO 2024/137272 A1, Jun. 27, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/WO2024137272A1/en [25] J. Zhang et al., “Full bottom dielectric isolation to enable stacked nanosheet transistor for low power and high performance applications,” in Proc. IEEE Int. Electron Devices Meeting (IEDM), Dec. 2019, pp. 11.6.1–11.6.4, doi: 10.1109/iedm19573.2019.8993490. [26] C. Yoo, J. Chang, Y. Seon, H. Kim, and J. Jeon, “Analysis of self-heating effects in multi-nanosheet FET considering bottom isolation and package options,” IEEE Trans. Electron Devices, vol. 69, no. 3, pp. 1524–1531, Mar. 2022, doi: 10.1109/ted.2022.3141327. [27] S. S. Pradhan, D. B. Bergstrom, J.-S. Chun, and J. Chiu, “Tungsten gates for non-planar transistors,” European Patent Appl. EP 3 506 367 A1, Jul. 3, 2019. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/EP3506367A1/en [28] L. Schloss and X. Ba, “Tungsten films having low fluorine content,” U.S. Patent 9 754 824 B2, Sep. 5, 2017. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US9754824B2/en [29] Intel Foundry, “Accelerating AI and HPC with advanced process and packaging technologies,” Doc. 367370-001US, Jun. 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intel.com/content/dam/www/central-libraries/us/en/documents/2025-11/intel-foundry-hpc-ai-brief.pdf [30] M. Lofrano, X. Chang, H. Oprins, and Z. Tokei, “Mitigating the thermal bottleneck in advanced interconnects,” imec, Sep. 28, 2023. Accessed: Sep. 14, 2026. [Online]. Available: https://www.imec-int.com/en/articles/mitigating-thermal-bottleneck-advanced-interconnects [31] S. Bair, “Intel at ISSCC 2025: Navid Shahriari invited talk, eight papers, forums, panelist & product details,” Intel Community, Feb. 19, 2025. Accessed: Sep. 14, 2026. [Online]. Available: https://community.intel.com/t5/Blogs/Tech-Innovation/Edge-5G/Intel-at-ISSCC-2025-Navid-Shahriari-Invited-Talk-Eight-Papers/post/1667592 [32] D. Chandra, E. Potladhurthi, D. R. S. Reddy, and K. S. Rengarajan, “Tunable negative bitline write assist and boost attenuation circuit,” U.S. Patent Appl. 20160203857 A1, Jul. 14, 2016. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US20160203857A1/en [33] Synopsys, “Advantages of firmware-based training in high-speed DDR IP,” Synopsys IP Technical Bulletin. Accessed: Sep. 14, 2026. [Online]. Available: https://www.synopsys.com/articles/firmware-based-training-ddr-ip.html [34] N. Muralimanohar, R. Balasubramonian, and N. P. Jouppi, “CACTI 6.0: A tool to understand large caches,” Hewlett-Packard Laboratories, 2009. Accessed: Sep. 14, 2026. [Online]. Available: https://users.cs.utah.edu/~rajeev/cacti6/cacti6-tr.pdf [35] Intel, “Intel Tech Tour 2024 Lunar Lake AI hardware accelerators,” Doc. 824436, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://cdrdv2-public.intel.com/824436/2024_Intel_Tech%20Tour%20TW_Lunar%20Lake%20AI%20Hardware%20Accelerators.pdf [36] Y.-H. Chen, J. Emer, and V. Sze, “Eyeriss: A spatial architecture for energy-efficient dataflow for convolutional neural networks,” in Proc. 43rd ACM/IEEE Annu. Int. Symp. Comput. Archit. (ISCA), Jun. 2016, pp. 367–379, doi: 10.1109/isca.2016.40. [37] Intel, “Introduction to the Xe-HPG architecture,” Doc. 758306, Nov. 4, 2022. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intel.com/content/www/us/en/developer/articles/technical/introduction-to-the-xe-hpg-architecture.html [38] Intel, “Core Ultra processors Series 3 for the edge,” Doc. 855291. Accessed: Sep. 14, 2026. [Online]. Available: https://cdrdv2-public.intel.com/855291/Intel%C2%AE%20Core%E2%84%A2%20Ultra%20Processors%20Series%203%20for%20Edge%20Overview_2.pdf [39] Intel Foundry, “Foveros technology brief,” Doc. 366411-001US, Feb. 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intel.com/content/dam/www/central-libraries/us/en/documents/2025-07/foveros-25d-product-brief.pdf [40] D. Das Sharma, “UCIe: Building an open chiplet ecosystem,” UCIe Consortium, 2022. Accessed: Sep. 14, 2026. [Online]. Available: https://www.uciexpress.org/_files/ugd/0c1418_c5970a68ab214ffc97fab16d11581449.pdf [41] Intel, “Intel launches Intel Core Series 3 processors,” Intel Newsroom, Apr. 16, 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intel.com/content/www/us/en/newsroom/news/client-computing/intel-launches-intel-core-series-3-processors-changing-the-game-for-everyday-computing.html [42] Intel, “Core Series 3 launch press deck,” Apr. 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://download.intel.com/newsroom/2026/Intel-Core-Series-3/Intel-Core-Series-3-Launch-Press-Deck.pdf [43] Intel, “Intel outlines architectures for agentic AI at Hot Chips 2026,” Intel Newsroom, Aug. 24, 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intel.com/content/www/us/en/newsroom/news/client-computing/intel-outlines-architectures-for-agentic-ai-at-hot-chips-2026.html [44] Intel, “Intel accelerates process and packaging innovations,” Intel Investor Relations, Jul. 26, 2021. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intc.com/filings-reports/all-sec-filings/content/0001193125-21-224438/d199788dex991.htm [45] Intel, “Intel reports third-quarter 2021 financial results,” Intel Investor Relations, Oct. 21, 2021. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intc.com/news-events/press-releases/detail/1505/intel-reports-third-quarter-2021-financial-results [46] Intel, “3rd generation Intel Core processors bring exciting new experiences and fun to the PC,” Intel Investor Relations, Apr. 23, 2012. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intc.com/news-events/press-releases/detail/577/3rd-generation-intel-core-processors-bring-exciting

newsletter.semianalysis.com logo
Sep 26 • 9:36 AM EDT • Technology • newsletter.semianalysis.com
How a baby business survived China and Canada tariffs

Garett Senez's company Quark Baby is based in Canada and manufactured in China. The tariffs required him to switch up his supply chain to survive.

businessinsider.com logo
Sep 26 • 4:49 AM EDT • Business • businessinsider.com
Proposed business park south of Durango could noticeably increase county’s share of manufacturing jobs

Strategic plan calls for nearly 1.2 million square feet of commercial and industrial space over 21 years

durangoherald.com logo
Sep 25 • 5:47 PM EDT • Business • durangoherald.com
Wisconsin business to layoff 40+ employees days before Christmas

Sunlite Plastics in Germantown will lay off 41 employees on Dec. 7 due to a drastic reduction in manufacturing orders.

wearegreenbay.com logo
Sep 25 • 4:52 PM EDT • Business • wearegreenbay.com
WCES targets India’s semiconductor market with specialty gas business

Indian renewable energy firm Waaree Clean Energy Solutions (WCES) will enter the domestic specialty gases market to target semiconductor manufacturing amid the Indian government’s $13.2bn Semiconductor Mission 2.0 programme.

gasworld.com logo
Sep 25 • 11:40 AM EDT • Business • gasworld.com
US core capital goods orders surge in August

New orders for key U.S.-manufactured capital goods increased more than expected in ​August and data for the prior month ‌was revised sharply higher, pointing to another quarter of robust growth in business spending on equipment ​amid an artificial intelligence infrastructure buildout.

reuters.com logo
Sep 25 • 8:47 AM EDT • Business • reuters.com
Goss report: Tariffs, inflation put pressure on Iowa manufacturers

The Creighton University Mid-America Business Conditions Index, which measures economic activity across nine states, moved above growth neutral for the seventh consecutive month in August, pointing to solid economic growth in regional manufacturing. The Creighton Economic Forecasting Group conducts the survey of supply managers to produce leading economic indicators of the Mid-America economy. The Business…

businessrecord.com logo
Sep 25 • 7:00 AM EDT • Business • businessrecord.com
Arzana raises $4.3M to automate factory paperwork

Growing up around manufacturing in Okoboji, William Alexander wondered if there were ways to make administrative tasks more efficient to give manufacturers more time to focus on their specialties. After graduating from Stanford University, Alexander teamed up with classmate Marshall Kools to develop Arzana, which builds custom artificial intelligence models around client workflows and data,…

businessrecord.com logo
Sep 25 • 7:00 AM EDT • Business • businessrecord.com
Filippo Bernardini Scammed the Book Business for Years. Is He Back?

The man who admitted to stealing hundreds of manuscripts swore he’d never do it again. New online skulduggery resembles his old tricks, and then some.

nytimes.com logo
Sep 25 • 5:00 AM EDT • Business • nytimes.com
Gibraltar Business Capital Provides Credit Facility to Support RS2 Healthcare Partners’ Investment in KMM Group

Gibraltar Business Capital (GBC) closed an asset-based revolving credit facility for KMM Group, a vertically integrated precision contract manufacturer. The

abfjournal.com logo
Sep 25 • 2:05 AM EDT • Business • abfjournal.com
Intense Media Pressure an Emerging Challenge in CHO Business

Growing culture media requirements are becoming a major logistical and storage challenge for biopharmaceutical manufacturers.

genengnews.com logo
Sep 24 • 3:47 PM EDT • Business • genengnews.com
😐 Neutral (17%)
wow
75%
love
25%
Edinburg Woman Arrested in Connection with Fatal McAllen Overdose

The McAllen Police Department has Arrested Vanessa Denise Rico, 48 years old, of Edinburg, Texas, on two (2) counts of Manufacture or Delivery of a Controlled Substance following an investigation into the death of a 39-year old McAllen man.

texasborderbusiness.com logo
Sep 24 • 2:46 PM EDT • Business • texasborderbusiness.com
Dollar perched at two-month high as hot PMI fuels inflation fears, rate hike bets

The dollar clung to a two-month high on Thursday after a strong manufacturing reading reignited inflation fears and rate-hike bets, while a weak Treasury auction sent yields ​higher across the curve, providing fresh impetus to the US currency.

reuters.com logo
Sep 23 • 10:02 PM EDT • Business • reuters.com
Chamber of Commerce, oil groups urge Trump to reject diesel export ban

American business, energy and manufacturing groups on Wednesday urged President Trump to reject calls to impose a diesel export ban after the president said he was weighing this move in an effort t…

thehill.com logo
Sep 23 • 6:30 PM EDT • Business • thehill.com
Manufacturer GAF Earns Salute to Business Award

GAF , a Standard Industries company and North America’s largest roofing and waterproofing manufacturer, was recently honored by the Economic Development Corporation Michigan City (EDCMC) with a …

buildingindiana.com logo
Sep 23 • 7:00 AM EDT • Business • buildingindiana.com
Glendale says Salazar ‘manufactured a dispute’ to bail on entertainment district

“The city’s accusation is false, unsupported, and directly contradicted by the public record,” a lawyer for Central Street Capital said.

denverpost.com logo
Sep 23 • 6:00 AM EDT • Entertainment • denverpost.com
This makerspace allows other beauty and wellness businesses to thrive in DC

Yeleen Beauty Makerspace in Northeast D.C. is a shared commercial manufacturing facility and tech hub designed for early-stage beauty and wellness companies.

wtop.com logo
Sep 23 • 5:05 AM EDT • Business • wtop.com
Feyi-Waboso could be star at World Cup

Immanuel Feyi-Waboso could be one of England's stars at next summer's World Cup if he can keep fit this season, says Exeter boss Rob Baxter.

sports.yahoo.com logo
Sep 23 • 5:05 AM EDT • Sports • sports.yahoo.com
Donald Trump Wants a Vance-Rubio Ticket in 2028, Says Ari Emanuel

Emanuel also believes David Ellison’s doing right by an independent press.

hollywoodreporter.com logo
Sep 23 • 3:47 AM EDT • Politics • hollywoodreporter.com
India business activity rebounds in September to 3-month high, PMI shows

India's business growth accelerated in September on stronger demand in both manufacturing and services, a ​preliminary survey showed, though weaker export momentum and more ‌subdued hiring tempered the upbeat picture.

reuters.com logo
Sep 23 • 1:39 AM EDT • Business • reuters.com
India business activity rebounds in September to 3-month high, PMI shows

BENGALURU, Sept 23 (Reuters) - India's business growth accelerated in September on stronger demand in both manufacturing and services, a preliminary survey ​showed, though weaker export momentum and more ‌subdued hiring tempered the upbeat picture. • H...

wtvbam.com logo
Sep 23 • 1:39 AM EDT • Business • wtvbam.com
India business activity rebounds in September to 3-month high, PMI shows

BENGALURU, Sept 23 (Reuters) - India's business growth accelerated in September on stronger demand in both manufacturing and services, a preliminary survey showed, though weaker export momentum and

finance.yahoo.com logo
Sep 23 • 1:39 AM EDT • Business • finance.yahoo.com
Merck Life Science Expands Bengaluru Manufacturing with €13 Million Investment

Merck Life Science is expanding its manufacturing capabilities in Bengaluru with an investment of approximately €13 million, strengthening the company’s ability to supply critical materials to customers across India and the wider Asia-Pacific region. The expansion at Merck Life Science’s Jigani site in Bengaluru will introduce biological buffer manufacturing alongside the facility’s established chemistry capabilities. The investment is designed to enable faster and more reliable access to critical materials used by customers across research, diagnostics, biotechnology and biopharmaceutical manufacturing. The development further advances Merck Life Science’s “in-region, for-region” approach, under which the company is expanding manufacturing capabilities closer to the markets and customers it serves. By adding biological buffer production in India, the Jigani expansion will broaden the site’s manufacturing capabilities while strengthening Merck Life Science’s regional supply infrastructure for the rapidly developing life sciences sector across India and Asia-Pacific. The company said the expansion reflects both the contribution of its teams and its collaboration with government and industry stakeholders. Merck Life Science acknowledged the support of India’s Department for Promotion of Industry and Internal Trade (DPIIT), the German Embassy New Delhi, and Invest India in helping strengthen life science manufacturing capabilities in the region. The investment comes as India continues to expand its role across pharmaceutical, biotechnology, diagnostics and biomanufacturing value chains, increasing demand for dependable regional access to materials supporting research and manufacturing operations. The Bengaluru expansion reinforces Merck Life Science’s focus on building manufacturing capacity within Asia-Pacific and supporting customers through a more regionalised supply network.

biopharmaapac.com logo
Sep 22 • 8:00 PM EDT • Science • biopharmaapac.com
Alicia Keys, Gigi Hadid and Jennifer Lopez bring star power to Vogue World in Milan

Italy's fashion elite has gathered for Vogue's annual fashion event at the historic Galleria Vittorio Emanuele II | KCBS All News 106.9FM and 740AM

audacy.com logo
Sep 22 • 5:18 PM EDT • Entertainment • audacy.com
Third-generation CEO Andy Heily shifts Krusteaz’s focus as consumer tastes change

Andy Heily, third-generation CEO of Krusteaz Co., discusses leading the Tukwila food manufacturer and balancing family business with personal passions.

bizjournals.com logo
Sep 22 • 3:26 PM EDT • Business • bizjournals.com
Optimi Health Appoints Dr. Michael Blough as Chief Clinical Development Officer

Supports Optimi’s planned Phase 2 psilocybin trial in major depressive disorder and Phase 3 MDMA trial in PTSDVANCOUVER, British Columbia, Sept. 22, 2026 (GLOBE NEWSWIRE) -- Optimi Health Corp. (NASDAQ: OPTH) (CSE: OPTI) (FSE: 8BN) ("Optimi" or the "Company"), a commercial-stage pharmaceutical manufacturer of regulated psychedelic drug products, today announced the appointment of Michael Blough, Ph.D., as Chief Clinical Development Officer. Dr. Blough has significant experience leading Health Ca

finance.yahoo.com logo
Sep 22 • 9:00 AM EDT • Health • finance.yahoo.com
Barcelona ‘closely following’ Real Betis starlet

The scouting department at Barcelona are closely tracking an up-and-coming member of the defensive ranks at La Liga rivals Real Betis.This comes amid the understanding that Emmanuel N’Goran has made...

sports.yahoo.com logo
Sep 21 • 5:15 PM EDT • Sports • sports.yahoo.com
What Makes a Trailblazer: TSTC graduate always dreamed of business ownership

What do dyslexia, jewelry and an angry mother all have in common? Give up? They all put Mathew on the path to business ownership. Mathew Joseph is a graduate from Texas State Technical College’s Industrial Electrical Technician (now Advanced Manufacturing – Industrial Maintenance) program. He is also the owner and president of C3 Industrial Technologies…

gilmermirror.com logo
Sep 21 • 1:35 PM EDT • Business • gilmermirror.com
Deep dive
😐 Neutral (22%)
wow
46%
love
29%
ahah
25%
Titan International Signs Definitive Agreement to Sell ITM Business to USCO S.p.A.

/PRNewswire/ -- Titan International, Inc. (NYSE: TWI) ("Titan" or the "Company"), a leading global manufacturer of off-highway wheels, tires and undercarriage...

prnewswire.com logo
Sep 21 • 12:21 PM EDT • Business • prnewswire.com
Adidas to release final Germany kit on November 3

In a promotional video featuring prominent football figures, Germany's equipment supplier Adidas announced that they will release one more football kit on November 3 to mark the end of its partnership with the German Football Federation (DFB). In the video published on social media on Monday, Joachim Löw, Jürgen Klinsmann, Philipp Lahm, Manuel Neuer and Florian Wirtz, among others, debate on which Germany jersey is the most beautiful one in history.

sports.yahoo.com logo
Sep 21 • 10:18 AM EDT • Sports • sports.yahoo.com
Trump accused of ‘manufacturing a national security justification’ to push arch plan

President had said the triumphal arch he plans to build near Washington would double as a ‘military complex’

theguardian.com logo
Sep 21 • 6:52 AM EDT • Politics • theguardian.com
😐 Neutral (11%)
ahah
43%
wow
29%
angry
28%
The Political Earthquake From Germany’s China Shock

For decades, Germany’s stability rested on an implicit bargain: high-value manufacturing would provide good jobs, strong export revenues, and broad-based prosperity, which political institutions would translate into social cohesion. Competition from China shakes that bargain to its foundations. MUNICH—September 6, 2026, could mark a turning point in Germany’s postwar political history. In the Saxony-Anhalt state […]

pubaffairsbruxelles.eu logo
Sep 21 • 6:23 AM EDT • Politics • pubaffairsbruxelles.eu
Abdul El-Sayed takes on economy, affordability in Saginaw stop

At a town hall in Saginaw, Democratic U.S. Senate candidate Dr. Abdul El-Sayed said Mid-Michigan’s job security and economy require major public investment in manufacturing, education, health care and small

abc12.com logo
Sep 20 • 8:09 PM EDT • Politics • abc12.com
Brookfield Business (BBUC) Joins Reliance Deal. What Returns Can it Capture?

Brookfield Business Corporation (NYSE:BBUC) will participate in Brookfield’s proposed acquisition of Reliance Worldwide Corporation, announced September 15. The transaction values the plumbing-products manufacturer at approximately US$2.8 billion in enterprise value, excluding lease liabilities. The investment group plans to acquire 100% ownership. Funding will come through the Brookfield Capital Partners strategy and Brookfield Business Corporation (NYSE:BBUC). […]

finance.yahoo.com logo
Sep 20 • 3:40 PM EDT • Business • finance.yahoo.com
Why Is Elbit Systems (TASE:ESLT) Rebranding Its U.S. Business As Twenty Six Defense?

Elbit Systems (TASE:ESLT) has rebranded its U.S. operating segment as Twenty-Six Defense, targeting the domestic American defense market. The new Twenty-Six Defense banner is intended to highlight U.S. industrial capacity and onshore production for defense customers. Elbit Systems links the rebrand to closer alignment with U.S. national security priorities and government focus on localized manufacturing. The Twenty-Six Defense shift toward a U.S. centric identity is an important context for...

finance.yahoo.com logo
Sep 20 • 1:10 PM EDT • Business • finance.yahoo.com
The health risks of AI

Reports from a top artificial intelligence company that it stopped several attempted uses of its product that could assist in manufacturing a bioweapon caught the attention of lawmakers in Washington…

dailykos.com logo
Sep 20 • 1:00 PM EDT • Health • dailykos.com
Lennar snags 444 lots near TSMC for $60M

Lennar Corp. has secured 444 lots near the Taiwan Semiconductor Manufacturing Co.'s $265 billion development in north Phoenix.

ktar.com logo
Sep 20 • 9:31 AM EDT • Business • ktar.com
‘It's awful’: How tariffs, soaring fuel costs and higher interest rates are squeezing American companies

Tariffs, soaring fuel prices and higher interest rates are squeezing American companies, particularly manufacturers, auto suppliers, retailers and transportation businesses.

cnbc.com logo
Sep 20 • 8:00 AM EDT • Business • cnbc.com
Chris Sutton warns Emmanuel Fernandez after Rangers drama vs Celtic

Emmanuel Fernandez in action for Rangers

sports.yahoo.com logo
Sep 20 • 7:45 AM EDT • Sports • sports.yahoo.com
Manu Prakash, transforming science education with ‘Foldscope’
yahoo.com logo
Sep 19 • 2:25 PM EDT • Science • yahoo.com
Serie A: Roma and Inter Milan in a crazy draw!

A crazy top-of-the-table clash!On Saturday night, the showdown between AS Roma and Inter Milan gave us a completely wild 2-2 draw.Perfectly set on their way by a goal from Manu Koné in the sixth minu...

sports.yahoo.com logo
Sep 19 • 1:57 PM EDT • Sports • sports.yahoo.com
Kings’ Acuff Jr., Sharpe Earn Rookie Superlative Praise

Fellow 2026 draftees identify Darius Acuff Jr. as the class's premier scorer while branding Emanuel Sharp a defensive powerhouse.

sports.yahoo.com logo
Sep 19 • 8:00 AM EDT • Sports • sports.yahoo.com
Sidelines Scoreboard: High School Football Highlights (9/18/26)

(KSEE/KGPE) – Game of the Week: Clovis 41, Bullard 14 Clovis West 49, Turlock 8 Clovis East 34, Frontier 20 Kingsburg 54, Selma 0 Bakersfield 49, Tulare Union 27 Madera 56, Merced 33 Liberty (Madera) 41, Summerville 20 Orosi 42, Fowler 6 Immanuel 29, Edison 8 Porterville 45, Dinuba 42 Chowchilla 62, Fresno 8 Sunnyside […]

sports.yahoo.com logo
Sep 19 • 2:33 AM EDT • Sports • sports.yahoo.com
😐 Neutral (16%)
iPhone 18 Pro Max Requires 'Prepare to Ship' Battery Drain Before Shipping

The iPhone 18 Pro Max has a battery capacity over 20 watt-hours, which means there are additional shipping requirements. If an iPhone 18 Pro Max needs to be shipped somewhere, its maximum battery capacity has to be limited through firmware. According to Apple, the iPhone 18 Pro Max uses an "innovative battery-firmware solution" that limits battery capacity to below 20Wh between when the iPhone is manufactured and its delivery to a customer.

macrumors.com logo
Sep 18 • 7:27 PM EDT • Technology • macrumors.com
Long-standing Lac Du Flambeau business unveils new manufacturing facility

A long-standing business in the Lac Du Flambeau community has just opened a newly constructed facility.

wjfw.com logo
Sep 18 • 4:14 PM EDT • Business • wjfw.com
Amazon and Wiwynn Expand Texas Manufacturing to Socorro Texas

Amazon and Wiwynn are expanding advanced manufacturing operations in Socorro, near El Paso, with plans to create nearly 1,000 new jobs by the end of 2027 and increase domestic production of hardware used in Amazon’s data center infrastructure.

texasborderbusiness.com logo
Sep 18 • 3:43 PM EDT • Business • texasborderbusiness.com
Deep dive
😐 Neutral (10%)
wow
75%
love
25%
Canada brings its tariff worries to Chicago as U.S. trade ties fray

Canada’s minister of industry traveled to Chicago for a major manufacturing technology trade show at McCormick Place and to meet with Gov. JB Pritzker and various Chicago companies.

chicagobusiness.com logo
Sep 18 • 12:14 PM EDT • Business • chicagobusiness.com
ABI names 2026 Legends in Manufacturing honorees

The Iowa Association of Business and Industry and Elevate Iowa Manufacturing have announced four recipients of the 2026 Legends in Manufacturing Awards. The honorees are Steve Anderson of Merrill Manufacturing in Storm Lake in the under 100 employees category; Lori Schaefer-Weaton of Agri-Industrial Plastics Co. in Fairfield in the 100-300 employees category; Pat Weiler of…

businessrecord.com logo
Sep 18 • 11:55 AM EDT • Business • businessrecord.com
Sedlacek: How digital wallets are modernizing business payments

UMB Bank’s Lanie Sedlacek explains how digital wallets can help businesses streamline payments, improve controls and reduce manual work.

journalrecord.com logo
Sep 18 • 9:45 AM EDT • Business • journalrecord.com
Talking Business with Don Cunningham: Making things is in the Lehigh Valley’s DNA

After a couple decades of manufacturing decline starting in the 1990s, manufacturing is once again the largest part of the Lehigh Valley economy with more than 700 manufacturers generating about $9 billion in annual GDP from 37,000 workers.

mcall.com logo
Sep 18 • 8:00 AM EDT • Business • mcall.com
The best workplace culture in America is being built by companies you’ve never heard of

As public companies cut jobs to fund AI, small and mid-sized businesses are proving more resilient—and redefining workplace culture.

cio.com logo
Sep 18 • 7:00 AM EDT • Business • cio.com
Far-right politician Éric Zemmour joins 2027 French presidential race

French far-right politician Éric Zemmour said on Friday that he would run in next year's presidential election, joining far-right candidate Marine Le Pen, who was runner-up to President Emmanuel Macron…

france24.com logo
Sep 18 • 5:06 AM EDT • Politics • france24.com
How Data And AI Are Transforming The Life Insurance Business At Manulife

How Data and AI are Transforming the Life Insurance Business at Manulife

forbes.com logo
Sep 17 • 8:04 PM EDT • Business • forbes.com
NSF invests in translating low-dimensional semiconductor technologies to establish U.S. leadership in microelectronics

The U.S. National Science Foundation today announced an initiative to translate low-dimensional semiconductor technologies from laboratory demonstrations into platforms for U.S. manufacturers to…

nsf.gov logo
Sep 17 • 4:21 PM EDT • Science • nsf.gov
Henrico Business Watch: Business license filings Sept. 10-16, 2026

Henrico County reported the following business-license filings with start dates during the week. The filings are listed alphabetically by business or trade name, followed by a registered address and business industry classification. Amanda Parker, 8300 Buckeye Drive – No business license required – manufacturing, nonprofit and other. Asser’s Medical Trans,

henricocitizen.com logo
Sep 17 • 3:32 PM EDT • Business • henricocitizen.com
Input costs, transportation expenses drive uncertainty for manufacturers

Manufacturers are growing more optimistic about sales and production over the coming year, but rising input costs, transportation expenses and continued global uncertainty are keeping pressure on the sector, according to a new survey from the National Association of Manufacturers. NAM’s Q3 2026 Manufacturers’ Outlook Survey found that manufacturers expect raw material and other input […]

chamberbusinessnews.com logo
Sep 17 • 3:03 PM EDT • Business • chamberbusinessnews.com
Florida releases first SEC availability report ahead of Auburn

Florida listed Eric Singleton Jr. and Emmanuel Oyebadejo as questionable on its first SEC-mandated availability report.

sports.yahoo.com logo
Sep 17 • 2:33 PM EDT • Sports • sports.yahoo.com
Workforce is both an opportunity and challenge for NH manufacturers

Annual summit scheduled as NH welcomes company from Massachusetts

nhbr.com logo
Sep 17 • 2:27 PM EDT • Business • nhbr.com