SCROLL NEWS / DISCOVERY
Search headlines
Find the stories shaping the conversation.
Results for " amas " 391 found 🔀 AI-powered Shuffle
What changing political tides mean for Gaza
More than 1,100 Palestinians have been killed since the ceasefire between Israel and Hamas nearly a year ago.
Syria to host 1st US business forum after sanctions eased
Event in Damascus to bring together officials and business leaders as economic ties begin to recover | Anadolu
Who will win race for Ohio governor? Key forecaster calls it a toss-up
The Ohio governor's race between Vivek Ramaswamy and Amy Acton is now a toss-up, according to one forecaster. See why.
Bonnie Tyler’s ‘Total Eclipse of the Heart’: The 5 greatest movie moments
Tyler’s iconic power ballad has elevated scenes in comedies, dramas, and even horror movies.
Fort Bend County Fair Announces 2026 Entertainment Lineup Featuring Sawyer Brown, Pat Green
ROSENBERG, Texas (Covering Katy News) — The Fort Bend County Fair has announced its entertainment lineup for its 90th annual celebration, featuring a mix of Texas country stars, Tejano favorites and nationally recognized performers during Championship BBQ Weekend and the fair's 10-day run. The 2026 Fort Bend County Fair begins with Championship BBQ Weekend on Sept. 18-19, followed by the fair Sept. 25 through Oct. 4. The entertainment schedule opens Friday, Sept. 18, with Tejano group Los Morales, followed by Texas country artist Cole Phillips on Saturday, Sept. 19. Phillips has gained attention for his traditional country sound influenced by classic honky-tonk music. The fair officially opens Friday, Sept. 25, with Tyce Delk, a New Mexico native whose touring schedule has expanded across the country. Country music veterans Sawyer Brown will headline Saturday, Sept. 26. The band, whose career spans more than four decades, remains known for hits including "Some Girls Do," "The Race Is On" and "Thank God for You." Go Tejano Day on Sunday, Sept. 27, will feature Prófugos de Nuevo León, along with performances by Los Rinches and Grupo Zenio. The second week of the fair begins Wednesday, Sept. 30, with Bellville singer-songwriter David Lewis, a recent Texas Country Music Association Male Artist of the Year nominee. Oklahoma Red Dirt artist Josh Meloy will perform Thursday, Oct. 1. Texas country star Pat Green returns to the Fort Bend County Fair stage Friday, Oct. 2. Green, whose career includes three Grammy Award nominations, has sold more than 2 million albums and amassed more than 200 million career streams. He is best known for songs including "Wave on Wave" and "Carry On." Country newcomer Vincent Mason will perform Saturday, Oct. 3. Mason has accumulated more than 500 million career streams and was recently nominated for Academy of Country Music New Male Artist of the Year. The fair concludes Sunday, Oct. 4, with Texas music legend Gary P. Nunn, whose "London Homesick Blues" remains one of the state's most recognizable songs. Weekend visitors also can enjoy performances on Music Row by J Paul Jr. & the Zydeco Nubreeds, Southern County Line, Los Rangerz and Horizon. The Fort Bend County Fair Association, a nonprofit organization, supports youth, agriculture and education. According to the association, it has awarded more than $2 million in scholarships during the past decade and generated $1.4 million through its 2025 youth auctions. Tickets go on sale at 10 a.m. Friday, July 10. Guests are encouraged to purchase tickets in advance and select the specific day they plan to attend, as tickets are valid only for the date purchased. Admission includes entry to the fairgrounds, access to the carnival, shopping, exhibits, food vendors and, when scheduled, admission to the rodeo and that day's concert. Season passes and single-day tickets will be available. For tickets and additional information, visit fortbendcountyfair.com or call the Fair Office at 281-342-6171. The address of the Fairgrounds is 4310 Texas 36 S in Rosenberg. 2026 Fort Bend County Fair Entertainment Schedule Championship BBQ Weekend Friday, Sept. 18: Los Morales Saturday, Sept. 19: Cole Phillips Fair Entertainment Friday, Sept. 25: Tyce Delk Saturday, Sept. 26: Sawyer Brown Sunday, Sept. 27 (Go Tejano Day): Prófugos de Nuevo León, Los Rinches and Grupo Zenio Wednesday, Sept. 30: David Lewis Thursday, Oct. 1: Josh Meloy Friday, Oct. 2: Pat Green Saturday, Oct. 3: Vincent Mason Sunday, Oct. 4: Gary P. Nunn × Expand FBCF Fort Bend County Fair 2026 Artist Lineup
Timeline: 20 years of Hamas rule in Gaza, from election to political exit
A chronological look at key milestones from Hamas's 2006 election victory to its 2026 exit from governing Gaza.
As Israel becomes Democratic litmus test, Jewish progressives warn about a tilt into antisemitism
For many liberals, longtime policy priorities like universal healthcare or stopping climate change are now intertwined with opposing Israel. An ascendant faction of the left argues there’s no such thing anymore as “progressive except for Palestine” — a phrase that took off in the years following Hamas’ October 7, 2023, attack and the ensuing war in Gaza — and sees opposition to Israel as a Democratic litmus test.
Trump posts a doctored photo of the Obamas and Air Force One with graffiti spray-painted on plane
President Donald Trump has posted a falsified image of former President Barack Obama and former first lady Michelle Obama boarding Air Force One covered with graffiti | News-Talk 1380 WAOK
Trump posts a doctored photo of the Obamas and Air Force One with graffiti spray-painted on plane
President Donald Trump has posted a falsified image of former President Barack Obama and former first lady Michelle Obama boarding Air Force One covered with graffiti | WWJ Newsradio 950
Arkansas basketball learns Bahamas opponents ahead of summer trip
The Razorbacks will face two Canadian universities, a Colombian professional team and the Bahamas national team while in Nassau.
Trump earned $1.2 billion from crypto business, filings show
A recent federal filing reveals that President Donald Trump generated about $1.2 billion from his cryptocurrency ventures in 2025, highlighting the substantial wealth amassed since his return to the White House.
Melat Kiros becomes 28th far-left candidate to win a Democratic primary this year as socialists amass power
Melat Kiros becomes the 28th far-left endorsed candidate to win a Democratic primary, ousting 15-term incumbent Diana DeGette in Colorado's 1st district.
India's Yash Raj Films Backs Rusk Media in Vertical Entertainment Push
Bollywood studio Yash Raj Films invests in Rusk Media to build original vertical microdramas and animation IP for Gen Z and Gen Alpha audiences.
OUTAGE RESOLVED: Tri-County mental health crisis lines back online
Update: As of Sunday, June 28 at 3:25 p.m., the Multnomah County Crisis Line, the Washington County Crisis Line and the Clackamas County Crisis and Support Line are currently back online.
TECHNICAL OUTAGE: Tri-County mental health crisis lines temporarily down
As of Sunday, June 28 at 10:30 a.m., the Multnomah County Crisis Line, Washington County Crisis Line and Clackamas County Crisis and Support Line are currently not working due to a network outage.
Multiple Portland-area mental health crisis lines down due to technical outage
Mental health crisis lines in Multnomah, Washington, and Clackamas counties are down due to technical issues, and officials are urging people to call or text 988 if they or someone they know is exp…
Hollywood gets into the microdrama race as mobile-first storytelling draws stars and major studios
While much of Hollywood was consumed by the streaming wars, Issa Rae was studying a different mode of entertainment thousands of miles away: microdramas. No stranger to creating a successful online s...
Sports and Dramas Drive April Viewing Patterns in Nielsen’s Latest Gauge Reports
Cable Gains Share for Second Consecutive Month in Six-Month-High Finish, Boosted by NCAA Tournament Final Four...
USPS tells Congress it needs cash rescue amid broken business model
Postmaster General David Steiner told a Senate committee the agency has amassed nearly $31 billion in cumulative defaults and could run out of cash by year's end
Casagrande: The summer dramas that divide, unite college sports
An offseason like no other is dripping in summer drama.
Computer science graduate Anthony Burrows set to begin pursuing second bachelor’s in engineering this fall
Burrows, a member of the UMSL’s men’s tennis team, first came to the university as part of a cohort of 20 students from The Bahamas.
Yamashita tops Woad in playoff to win Meijer LPGA Classic
Miyu Yamashita birdied the first playoff hole to beat Lottie Woad in a duel of rising stars at the Meijer LPGA Classic in Belmont, Michigan, on Sunday.They returned to par-five 18th for the playoff, Yamashita rolling in her four-foot birdie putt after Woad had missed her longer birdie attempt.
Israel Pennerman: From The Bahamas to Biomedical Science, A Journey of Discovery & Purpose
Fall 2025 Graduate | Public Health Science For Israel Pennerman, pursuing a degree in Public Health Science was never simply about earning a diploma. It was about gaining the knowledge and skills needed to address health challenges facing communities around the world. Originally from Nassau, The Bahamas, Pennerman arrived at Saint Augustine’s University with a […]
Obamas inaugurate presidential center, cementing their political legacy in Chicago
The new campus on Chicago’s South Side is more than a traditional presidential library. It harkens back to former President Barack Obama’s political origins as a community organizer.
Indonesia's MD Entertainment Bets on IP and Microdramas
MD Entertainment CEO Manoj Punjabi outlines plans for cross-border IP development, microdrama expansion and global partnerships at APOS.
Indonesia’s MD Entertainment Bets on IP and Microdramas for Global Push
As Indonesia’s entertainment industry gains greater international visibility, MD Entertainment, one of the country’s top studios, is increasingly looking beyond local success and toward global partner...
Bank Balances Rolled Back for Forza Horizon 6 Players Who Used Exploit to Amass a Billion Credits
In response to an arcane but incredibly lucrative exploit discovered by Forza Horizon 6 players, Playground Games has confirmed most of those credits gained will be removed.
Is SMIC N+3’s Metal Pitch Smaller than Intel 18A’s?
Almost four years ago, we published that SMIC had started shipping 7 nm (N+1) chips. Now, SMIC is shipping its third-generation 7 nm (N+3) process in Huawei’s Kirin 9030, with a minimum metal pitch of 32.5 nm, about 10% tighter than the 36 nm minimum metal pitch shipping in Intel’s latest Panther Lake CPUs on 18A. The headline is true, but incomplete cherry picked metric. N+3 reaches the density of TSMC N6 through aggressive DUV multi-patterning and design-technology co-optimization (DTCO), but it pays for that in complexity, efficiency and process control. We found this and more in our reverse engineering and teardown where we cover SMIC’s N3 process technology, Huawei’s packaging, memory, architecture, and more. SemiAnalysis has been building a state-of-the-art teardown lab in Oregon capable of analyzing the world’s most advanced and important chips over the last year and half. We have already generated revenue on advanced datacenter chip teardowns including our recent reverse engineering of a major TSMC customer’s COUPE CPO optical engine + EIC 3D stack. This is the first public report from the SemiAnalysis Teardown Engineering & Evaluation Lab, or STEEL for short. The lab is aggressively scaling up and out and we’re excited to announce it publicly. This is a bit of inconvenient timing for TechInsights as they are private equity owned and currently being sold while having enjoyed virtually no credible competition for decades. This has led to TechInsights underinvesting in CAPEX. SemiAnalysis exceeds TechInsights in revenue despite no venture or private equity ownership and being founded only 6 years ago. Because we have no external investors and are founder led, we move faster, build faster, and we can release client chip teardowns for free regularly, while focusing on datacenter for our major clients. Here’s the first public image from our lab, the HiSilicon Kirin 9030 Pro SoC: This report will detail our teardown of the Kirin 9030 and our findings on SMIC’s N+3 process, the most advanced in China. For comparison, we’ll show our teardown of the MediaTek Helio G99, made on TSMC N6. Through this comparison, we can look at the effect of export controls – SMIC N+3 and TSMC N6 are comparable nodes, but one is heavily export-controlled, the other free to use the West’s most advanced equipment. Here we see both China’s progress and constraints. SMIC N+3 reaches TSMC N6-class logic density, but it requires far more aggressive DUV multi-patterning, so it does not match N6 on process maturity or cost. The Kirin 9030 Pro performs similarly to three-year-old Android flagships, and trails far behind the current flagship SoCs from Apple, Qualcomm, MediaTek, and Samsung. The efficiency gap is even wider. Export controls have not stopped Huawei and SMIC from shipping advanced silicon, but they have forced a different path. Without EUV, SMIC is leaning harder on DUV multi-patterning, DTCO, and increasingly complex integration. The roadmap continues forward through tighter design rules and backside power, but each step adds cost and process risk. Huawei’s τ scaling and LogicFolding show another path: stacking active logic and recovering density through advanced packaging and system-technology co-optimization (STCO). To understand the Kirin 9030, we must first understand Huawei’s SoC history. HiSilicon is Huawei’s chip design arm, responsible for the Kirin smartphone SoCs, Kunpeng server CPUs, Ascend AI accelerators, and switch/router networking silicon. Before export controls, Huawei was TSMC’s largest customer – the only customer on TSMC’s first EUV node, N7+, and among the first on N5, alongside Apple. That ended in late 2020. Huawei switched to Qualcomm SoCs in its flagship smartphones, though export controls limited them to 4G-only variants. In late 2023, Huawei returned to in-house silicon with the Kirin 9000s, a successor to the Kirin 9000, fabricated on SMIC N+2 instead of TSMC N5. In the following years, they released the Kirin 9010 and 9020 on the same N+2 process. These chips used Huawei’s in-house TaiShan CPU cores and Maleoon GPU. We have not torn down a Kirin 9020 ourselves, so the predecessor die shot is from Kurnal. The die shots show how Huawei spent its silicon budget: which functional blocks are where, and how their areas compare to the predecessor. First, a quick guide to the major blocks on the die. The total die area is nearly identical, but the 9030 uses that area more aggressively. A denser process lets Huawei fit an extra middle CPU core, more GPU and NPU cores, and larger caches into the same footprint. In contrast, the Helio G99 is a much smaller, low-cost SoC, built for budget smartphones rather than a flagship device. While the Kirin 9030 is ~140 mm², the G99 is only ~29 mm², roughly one-fifth the area. The underlying TSMC process technology, however, is directly comparable as a baseline for analyzing SMIC’s. The Kirin 9030 is an evolutionary refresh, not a clean-sheet design. Its CPU, GPU and NPU cores carry over the 9020’s families, and the gains come from three levers: the SMIC N+2-to-N+3 process step, DTCO and floorplan work, and incremental microarchitecture. Area is where the first two show up, and the 9030 scales well here. Performance and efficiency are the harder test. Huawei’s design holds up better than its node would suggest, but the chip still trails, both because N+3 sits behind the leading-edge nodes and because its cores, while competent, remain a few generations behind the newest designs. The new prime core is an incremental update. The main changes are a 10% frequency increase from 2.5 GHz to 2.75 GHz and a doubling in the L2 cache from 1 MiB to 2 MiB. Despite the increased cache, the core size decreased by 7.6%. Excluding the private L2 cache, the core size decreased by 21%. This is a large reduction for an incremental node. Compared with the TaiShan New V120 core in the Kirin 9020, the Kirin 9030’s middle core is almost unchanged architecturally, yet each core shrinks by ~22%. Most of that comes from the move from N+2 to N+3, with layout likely accounting for the rest. Visually, the most noticeable change is the increase from 3 middle cores to 4. There is also a 20% increase in the shared L3 cache of the big cluster. This helps to improve multi-core performance without sacrificing much in terms of area. Even with each core shrinking, the big CPU cluster’s total area is essentially unchanged. The per-core savings went back into an additional middle core and larger caches. The tiny cores shrank less than the prime core (excluding its L2 cache) and less than the middle cores. This is likely because fixed overhead is a larger share on a small core. We cannot resolve any architectural changes from the die shot alone, but the per-clock and efficiency gains shown below point to more than pure process and layout scaling. The area reduction was offset by a doubling of the shared L2 cache from 2 MiB to 4 MiB, leaving the total tiny CPU cluster area slightly larger. Area is the easiest improvement to see from a die shot, but it is only one part of PPA (power, performance, area). For modern logic, power and performance matter just as much, and often more. Since Dennard scaling broke down in the mid-2000s, voltage and frequency have not scaled in step with transistor dimensions, so each node has had to fight harder for gains in performance and efficiency. The starkest comparison is not Kirin 9020 versus Kirin 9030 Pro. Apple’s efficiency cores run circles around Huawei’s prime core. Apple’s low-power core delivers 20% higher integer performance while drawing only 1 W, compared with 4.5 W for Huawei’s prime core. N+3 matches TSMC N6, but N6 is several generations old. Apple and Qualcomm build on N4 and N3P, which are denser and sit on a better voltage-frequency curve, giving them a larger transistor budget and more performance per watt. The 9030’s own cores did improve. The middle and tiny cores gained 17% and 14% in per-clock integer performance over the 9020, with floating-point flat on the middle core and up 11% on the tiny. The tiny core improves cleanly, with performance rising while power falls and efficiency increases by 45% in integer and 24% in floating point. The middle core is mixed: integer performance rises but power rises faster, cutting integer efficiency by 7%, while lower power lifts floating-point efficiency 16%. Per-clock gains at the same or lower frequency are microarchitectural, so the cores are tuned, not just shrunk. Both also failed to hold their rated maximum frequencies, pointing to thermal, power, or stability limits. Per clock, the middle core sits around Arm Cortex-A720 and the tiny core near the Cortex-A520; absolute performance trails because Huawei clocks them much lower. The prime core is roughly Cortex-X2 class per clock, a 2021 design. Apple’s 2020 M1 Firestorm core is still 35% higher per clock and 57% faster in absolute integer performance at a similar 4.5 W. The current leading edge is further ahead again: the Apple M5 P-core is 60% higher per clock and 2.7× faster, the Arm C1 Ultra 45% higher and 2× faster. Matching older high-end cores per clock is a genuine design achievement. What Huawei cannot match is the voltage-frequency curve and transistor budget of leading-edge nodes, which let Apple, Qualcomm and others spend more transistors in the same area on wider cores, larger caches and deeper buffers while running at lower voltage. Huawei’s LogicFolding roadmap is one answer, stacking active logic to recover density and shorten signal paths. We return to it later. The GPU compute units (CUs) changed more visibly than the CPU cores, moving to a more rectangular layout for both the arithmetic logic unit (ALU) clusters and the CU overall. Even with ray-tracing support added, a CU shrank ~28%. However, that shrink is offset by the increase from 4 to 6 CUs and the area outside the CUs grew 33%. Overall, the GPU cluster is larger by ~10%. The GPU is where Huawei makes its biggest gains. The Maleoon 935 is not competitive with current flagships, but it is a large step up from the 920 and reaches older-flagship territory. In 3DMark it is 70% faster in Wild Life Extreme (WLE) and 79% faster in Steel Nomad Light (SNL) than the 920; with 11% higher clocks and 50% more CUs, the ~67% theoretical uplift roughly matches WLE and is beaten by SNL. It edges ahead of the Snapdragon 8+ Gen 1 in WLE and SNL, and the Dimensity 9200 and Apple A16 in WLE, but stays far behind newer parts: the Snapdragon 8 Elite Gen 5 and Dimensity 9500 are ~2.4–2.6× faster in WLE and ~3.2× faster in SNL. The Maleoon 935 is Huawei’s first GPU with hardware-accelerated ray tracing; there it lands slightly ahead of the Exynos 2200, and on par with the Apple A16, with current flagships up to 3.7× faster. The Neural Processing Unit (NPU) saw the largest structural changes of any block, moving from a Lite and a Tiny core in the Kirin 9020 to a Lite and two Tiny cores in the Kirin 9030. Both core types also show significant layout changes. This is a reversal in Huawei’s NPU design. The Kirin 9000 5G, its last flagship chip on TSMC N5, used two Lite and one Tiny core. The series of SoCs on SMIC N+2 moved to one Lite and one Tiny core, likely for area savings. With the Kirin 9030, Huawei has shifted back toward a larger multi-core NPU cluster, but with the additional area going to a Tiny core rather than a Lite core. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Before diving into the process stack, the package and memory are worth separating from the SoC itself. The Pro variant of the Kirin 9030 carries 12 GB of Samsung DRAM, with two stacks of four dies each. The dies were identified as the K4L2E165YD, a 12 Gb LPDDR5X-9600 device fabricated on Samsung’s 1a node, the fourth generation of its 10 nm-class DRAM after 1x, 1y and 1z. 1a has shipped in volume since 2022, so this is current memory rather than older-node inventory. The 16 GB Pro Max variants we obtained were found with both CXMT and Samsung packages. The CXMT package is marked CXDD7JEDM, with two stacks of four dies, packaged in week 45 of 2025. The inferred die dimensions from X-ray computed tomography (CT) are consistent with a known density of ~0.3 Gib/mm² for the CXMT G4 process, roughly equivalent to other manufacturers’ 1z processes. The Kirin 9030 uses a typical integrated package-on-package (iPoP) stack: multiple DRAM dies in a memory package sit above an organic redistribution layer (RDL) interposer, which sits above the SoC and package substrate. The full package is then mounted to the printed circuit board (PCB) through ball-grid array (BGA) solder bumps. The memory package substrate is a thin bismaleimide-triazine (BT) laminate carrying the LPDDR5X stack. The organic RDL interposer over the SoC routes the PoP signals around the die and carries possible dummy thermal copper pillars. The package substrate, a thicker Ajinomoto Build-up Film (ABF) build-up over a BT core, fans the flip-chip bumps out to BGA pitch and embeds the power planes. The whole stack is organic. The only silicon is the SoC and the LPDDR5X dies; there is no silicon interposer. Keeping it all-organic brings the package’s coefficient of thermal expansion (CTE) close to the PCB’s, reducing board-level warpage, and avoids the cost of a silicon interposer the SoC’s bandwidth does not need. In an iPoP stack, the memory package connects to the organic RDL interposer through an array of solder bumps. Underfill fills the gap around those bumps, adding stiffness and protecting the joints from mechanical stress. The Pro and Pro Max variants differ here, which we cover behind the paywall. The die shot and architecture tell us how Huawei allocated its silicon budget. The process tells us what SMIC can manufacture. We use the Helio G99 as the process reference for TSMC N6. Both SMIC N+3 and TSMC N6 are evolutions of previous 7 nm-class nodes. We used targeted TEM cross-sections through logic and memory regions, imaged in both fin-cut and gate-cut directions. Each cross-section caption gives its horizontal field width (HFW), the real width of the imaged area. We start at the transistor fins, then move up through standard cells, local interconnect, and SRAM. SMIC has not overtaken Intel or TSMC. It uses aggressive DUV scaling and DTCO to reach N6-class density, but that density doesn’t translate into comparable performance and efficiency, for two reasons: the node gap to leading-edge nodes, and Huawei’s core designs. Fin Profile One of the most important knobs in a FinFET process is the fin profile: the shape of an individual fin and the channel where current passes from source to drain. The ideal fin is tall, narrow, and nearly vertical. A taller fin increases effective channel width, while a narrower fin improves electrostatic control by thinning the body the gate must control. Push either too far, and the process pays for it: weaker drive current, fragile fins, taper, footing and line-edge variation that hit yield and device variability. The Intel 22 nm, 14 nm, and 10 nm fin cross-sections show how FinFET nodes have improved over time. 22 nm fins were a first-generation structure, relatively short, wide and strongly tapered. The shape limits current density and reduces gate control uniformity across the height of the fin. At 14 nm and 10 nm, Intel pushed the fins taller and narrower while also making the sidewalls more vertical. Rather than shrinking the device, these changes increase the effective channel width per fin and improve electrostatic control. The trade-off is that taller fins at tighter pitches are much more difficult to manufacture. Now, let’s compare the Helio G99 on TSMC N6 with the Kirin 9030 on SMIC N+3. Both processes are in the same class, with fin pitch of 30-32 nm on N+3 and 34 nm in our N6 cross-section. The pitch for N6 is especially interesting as N7’s HD library is generally listed with a 33 nm fin pitch, and N6 did not shrink pitches directly. Its density gains came from DTCO instead of tighter pitches. The 34 nm pitch was stable across our sampled region and serves more as a comparison against the SMIC N+3 we have not investigated further. Pinning down N+3’s fin patterning scheme takes more than one core unit. The CPU cores show a dense ~32 nm pitch, with the pitch between N-P fin pairs alternating between 78 and 88 nm. Logic alone may be consistent with dual-pitch mandrels of 120 and 110 nm, but this is a complex and unusual approach. Combining the pitch from the the 8T SRAM, which has more complex repeat unit, with the CPU core sequence allows us to reverse engineer the patterning steps with more confidence. As both the logic and SRAM should share the same base grid, a single CD mandrel lithography pattern with 128 nm pitch undergoing SAQP produces a die-wide ~32 nm grid (128 nm/4), which supports the pitch sequencing seen in both logic and SRAM cells. In the sampled cross-sections, N+3 shows a taller, narrower, higher-aspect-ratio fin than N6. The measured fin aspect ratio is ~9.5:1 on N+3 versus 7.8:1 on N6. N+3 also shows less top rounding, with an estimated radius of ~2 nm, compared with 2.8 nm on N6. Even though the fin widths differ, the ratio of top rounding to fin width tells the same story, with N+3 at 0.37 and N6 at 0.44. In a geometric sense, lower is better; a perfectly rectangular fin would have no top-rounding penalty. These are single-digit-nanometer features measured from a handful of cuts, so treat the absolute numbers as approximate. The important result is the relative gap: N+3’s fins are consistently taller, narrower and less rounded than N6’s. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Standard Cell A standard cell is the basic building block of chip layout: a fixed-height row pairing one NMOS and one PMOS transistor that share a gate, tiled in a grid to build logic blocks. The key dimensions are contacted gate pitch (CGP), cell height (CH), fin count, and the lower-metal routing grid. To measure density, we use the Bohr metric: a weighted average of NAND2 gate area (60%) and scan flip-flop area (40%). This represents a realistic mix of combinational and sequential logic. This metric has its limitations, especially for complex cell layouts like TSMC’s FinFLEX, which alternates cells with different fin counts. Even so, it is the best metric for a pure process-level comparison. Another important measurement is the fin pitch; it refers to the distance between two fins of the same transistor. In a FinFET process, multiple fins are used in each transistor to increase the drive current and thus performance. TSMC N6 ships both a high-density (HD) library with 2 PMOS and 2 NMOS fins per cell, and a high-performance (HP) library with 3 of each. More fins under the shared gate mean more effective channel width. HP cells switch harder at the cost of area. Designers mix the two on a die, primarily spending HP cells on timing-critical paths, and matching their PPA targets. In the Cortex-A55 core of the Helio G99, we found a cell height of 240 nm for the HD cell. MediaTek has used HD cells in the G99 to minimize die size and thus cost. As an SoC for budget smartphones at ~$100, this is essential. By contrast, we found only one library in the Kirin 9030, with 2 NMOS and 2 PMOS fins. This suggests a narrower library strategy than TSMC N6, where both HD and HP libraries are widely used. This likely reflects the smaller customer base and the more constrained domestic design and electronic design automation (EDA) ecosystem. In all three CPU cores of the Kirin 9030, we found cell heights of 228 nm, 5% smaller than on N6. This is also a reduction of 9.5% over SMIC N+2’s cell height of 252 nm. SMIC N+3 and TSMC N6’s HD library both feature a CGP of 57 nm. For SMIC, this is a 9.5% shrink over N+2. In the past, CGP and cell height alone may have been enough to compare transistor density. Now, however, we must consider scaling boosters and DTCO as well. SMIC’s density gain does not come from EUV. It comes from using every available DTCO booster aggressively. First is fin depopulation: reducing the number of NMOS and PMOS fins in each cell. The first FinFET nodes started with 3 or 4 fins for each transistor. SMIC N+3 and TSMC N6 HD both use only 2 fins per transistor, trading drive strength for density. Next is contact over active gate (COAG). By landing the gate contact directly over the active gate, instead of out over the isolation region, the cell height drops. N+3 integrates COAG while N6 does not. Our N+3 gate-cut cross-sections indicate COAG, with the gate contact sitting over the active region, while N6 shows an off-gate contact. Last is single diffusion break (SDB). Diffusion breaks are inserted between cells in the same row to provide electrical isolation, but they also introduce local layout effects (LLE), layout-dependent shifts in electrical characteristics. In the past, a double diffusion break was used, consuming the space of two CGPs. SMIC N+3 and TSMC N6 instead use SDB, saving area but increasing LLE sensitivity. This must be controlled at the process level and accurately modeled in the process design kit (PDK) so that EDA tools can account for it. Overall, SMIC N+3 has a transistor density of 113.4 MTr/mm², slightly above TSMC N6 at 107.7 MTr/mm². Even without EUV, SMIC has achieved density beyond TSMC’s mature N6 node which utilizes EUV. Metal Stack The smallest critical dimension in the teardown is M0; SMIC N+3 uses a 32.5 nm local metal pitch. That is smaller than the 36 nm M0 pitch on Intel 18A in Panther Lake. However, this does not mean that SMIC has a better process than Intel 18A or TSMC N3P. M0 is a local intra-cell routing layer. Its usefulness depends on the full interconnect stack: M1 and M2 pitch, track count, via and line resistance, design rules, mask count, overlay control, and routing flexibility. The 32.5 nm M0 is consistent with self-aligned quadruple patterning (SAQP), whose four-population line-width loading we read coarsely as alternating widths of 21.5 to 24 nm; M1 and M2, at 38 and 40 nm, are consistent with self-aligned double patterning (SADP), a single A/B split. On TSMC N6, M0, M2, and M3 sit at a relaxed ~40 nm and are consistent with SADP-class double patterning, with no need for quadruple patterning. That said, we measure M2 for example at ~43 nm, likely inflated by sparse routing. We do not assign any specific layer to EUV from our cross-sections; the distinction we can draw is double versus quadruple patterning, not lithography wavelength. Transistor-level density in the front-end-of-line (FEOL) sets an upper bound, but the design is ultimately limited by what the interconnect stack can route. The lowest metals are the most important for standard-cell density, but the semi-global and global layers determine how usable that density is at the block and chip level. Two axes are commonly used for chip cross-sections: the fin-cut and the gate-cut. The micrograph above is a fin-cut and shows metals 0 through 3. This axis lets us see the even-numbered metals, with M0 right above the fins. There are two kinds of M0 lines. The first are the power rails; these are wide wires for the VDD and VSS running horizontally at the top and bottom edges of each standard cell. The wide wires measure 55 nm across, more than double the other M0 lines. Their width minimizes resistance and reduces IR drop. The second kind are intra-cell wires, short segments within the cell that connect terminals to M1. These have alternating widths between 21.5 and 24 nm. The M0 pitch is 32.5 nm, a 19% reduction versus N+2 and N6. At this pitch, DUV patterning requires more aggressive multi-patterning, increasing mask count, overlay sensitivity, process complexity and cost. M0 is below what a single DUV-defined spacer (SADP) can resolve, so SMIC cascades a second spacer step (SAQP). The cross-section reflects the cost: the M0 trenches are visibly more re-entrant (narrower at the bottom than the top) than M1 or M2 on the same chip and carry a bright barrier-rich foot where the trench meets the etch-stop layer. That shape is partly the intended damascene profile, as a slightly narrow bottom helps void-free copper fill, but its magnitude at M0 is driven by the tight pitch and the higher trench aspect ratio. Intel 18A supports an M0 pitch of 32 nm, although Panther Lake has only shipped with a looser 36 nm pitch. This is due to Intel’s heavy usage of HP libraries. Among leading-edge nodes, 18A has the loosest M0 pitches due to PowerVia. With power routing moving to the backside, congestion is reduced, and the entire front-side metal stack can be used for signal routing. M2 is the first true inter-cell routing layer. It runs horizontally like M0 but spans across multiple cells to carry block-level signals. The M2 pitch sets the cell’s track height – the number of M2 tracks that fit between the VDD and VSS rails, defining what the library calls a 6-track or 7.5-track cell. This layer is the most important, limiting the routing of entire blocks. SMIC N+3 features a 5.7-track cell. The M2 pitch is 40 nm, a 5% decrease over N+2 and the same as N6. This shrink keeps the pitch at the edge of what is possible with double patterning. Future nodes will need to increase the number of masks for M2 as reducing the number of tracks is much harder due to the limitations in routing. The micrograph above is in the perpendicular direction, the gate-cut, and shows metals 0 through 4. This allows us to see and measure the odd-numbered vertical metal layers. The M1 pitch is 38 nm, 9.5% less than N+2 and 33% less than N6. The M1-to-gate ratio matters because it sets local routing flexibility. N+2 and N+3 use a 3:2 ratio, while N6 uses a 1:1 ratio, explaining the huge differences in M1 pitch. The more M1 lines there are compared with the gates, the more flexibility there is for power and signal crossing within the cell. Routing flexibility enables more complex and better cells. Clean fractional ratios are also preferred as a grid is periodic and improves layouts. The 3:2 ratio gives SMIC more local routing flexibility than a strict 1:1 grid, but it also complicates layout and patterning. This is a DTCO choice, with SMIC increasing process complexity to recover density and routability without EUV. This 3:2 ratio is not very popular in the leading-edge nodes. TSMC has only used it on N7+, the N5 family, and the short-lived N3(B). They have switched back to a 1:1 ratio for N3E. Intel has only used it on the 10 nm/Intel 7 family, with Intel 4, 3 and 18A all using a 1:1 ratio. Samsung is the only one still using a 3:2 ratio at the leading edge, using it in the SF4 and SF3 families. It remains to be seen if SMIC will remain at a 3:2 ratio or move to a 1:1 ratio with its future nodes. The industry is still actively exploring these local-routing ratios. At VLSI 2026, imec will be presenting work on even higher ratios, including a 2:1 scheme that can reduce area by up to 14%. We will be covering the conference in a future newsletter article. Subscribe We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. The final local interconnect layer for N+3 is M3, with a pitch of 44 nm. The M3 pitch is the same as on N+2 and 10% larger than on N6. The semi-global layers carry the majority of block-level signal routing. They have a coarser pitch than the lower local layers. On leading-edge nodes, they are designed to sit at the limit of DUV single patterning. M4 through M11 pitches were found divided between 80–82 nm (M4–M6), 128 nm (M7–M10), and 148 nm (M11). Given limited sampling, it is possible these are divided further in dense routing areas. At the top are two giant metal layers, M12 and M13. These have kept the same pitches as N+2 at 1920 nm and 4600 nm respectively. While the lower layers’ pitches are generally fixed by the process and library, the upper layers vary much more in pitch and count, depending on the design. Even two smartphone SoCs on the same process can have wildly different metal stacks. The Helio G99 carries fewer routing layers, reaching coarse metal pitches of 850 nm by M9, while the larger and higher-performance Kirin 9030 keeps fine pitches until M11. SRAM At the leading edge, SRAM is much more difficult to scale than logic. TSMC’s latest nodes have seen little to no bitcell scaling, while logic still has more DTCO levers to pull. While looking for other logic libraries in the GPU compute units, we stumbled upon the SRAM. The most common type of SRAM has 6 transistors (6T), but this cell had 8 transistors (8T) instead. 8T SRAM adds two transistors to form a dedicated read port. Unlike a 6T cell, where reading disturbs the storage, the decoupled read port removes read-disturb, improving read stability and letting the cell be pushed harder for performance. At first glance, the cut looked like an unusual logic library, with each cell row having 3 fins of one polarity and 5 fins of another. The rows also alternated in orientation. Energy-dispersive X-ray spectroscopy (EDS) resolved our confusion. The cut had not landed on the GPU logic, but on the SRAM macro beside it. The unusual fin pattern was due to the SRAM library. We return to EDS in the process flow analysis behind the paywall. SRAM libraries are not like traditional logic libraries. Due to the unequal number of PMOS and NMOS transistors, they require specialized rules and layout libraries. They do not need the flexibility of logic libraries, so they are hyper-optimized for one purpose: dense, reliable memory. The SRAM cell we found is a 1:2:2-2:2 cell. This means there is 1 fin per pull-up (PU) PMOS transistor, and 2 fins per pull-down (PD) and pass-gate (PG) NMOS transistor. These 2 PU, 2 PD and 2 PG transistors would usually form a single 6T high-current cell (HCC). An 8T HCC adds a read-pull-down (RPD) and a read-pass-gate (RPG) NMOS transistor, each with two fins. We measured a cell height of 406 nm, which brings the bitcell size to 0.0463 µm². That is a theoretical peak density of 21.6 Mib/mm². We estimate that a 6T HCC would have a cell height of 292 nm and a size of 0.0337 µm². This is ~12% larger than a 6T HCC on Intel 3 and 4. We also estimate the 6T high-density cell (HDC) to have a cell height of 228 nm and a size of 0.0260 µm². This is coincidentally the same as the logic standard-cell height measured earlier. The estimate puts the cell near Samsung 7LPP/5LPP and slightly below TSMC N7/N6. That is a theoretical peak density of 38.5 Mib/mm². 6T HDC is arguably the most important cell as it is used for the largest caches in a chip, the L3 caches and system-level cache (SLC). Both the Kirin 9020 and 9030 have split the SLC into 4 banks to raise total SLC bandwidth. In the Kirin 9030, the SLC increased from 2 MiB to 3 MiB per bank. Correspondingly, the number of arrays within the bank also increased by 50%, from 16 to 24. Each array can store 128 KiB and forms an orderly pattern on the die shot. From the Kirin 9020 to the Kirin 9030, the area of a 128 KiB SLC array decreased from 0.0477 mm² to 0.0392 mm², an 18% shrink. The achieved density is 25.5 Mib/mm², 66% of the theoretical maximum. While the SLC was quite similar across both chips, the L3 has seen some major changes, particularly in terms of its layout. The total capacity also went up from 10 MiB to 12 MiB. Much like the SLC, the L3 is also split into 4 banks. In the Kirin 9020, an L3 bank consisted of 16× 128 KiB arrays and 16× 32 KiB arrays. However, an L3 bank in the Kirin 9030 instead consists of 48× 64 KiB arrays. In the Kirin 9020 L3, a 128 KiB array was 0.0513 mm² and a 32 KiB array was 0.0154 mm². The size of the 128 KiB array is different on the L3 and SLC as the assist circuitry for the two arrays differs depending on their purpose. In the Kirin 9030 L3, a 64 KiB array is 0.0210 mm². Although not a like-for-like comparison, normalized for capacity, it is 18% smaller than the 9020’s 128 KiB L3 array and 31% smaller than its 32 KiB L3 array. The achieved density is slightly lower than the SLC, at 23.8 Mib/mm², 62% of the theoretical maximum. Unlike the L3 and SLC, the prime cores’ private L2 cache uses a 2-bank design. As the prime cores’ L2 is latency-critical, it likely uses 6T HCC instead of 6T HDC. The 9020 has 16 arrays in each bank while the 9030 has 32. Each array has a capacity of 32 KiB. A 32 KiB array in the L2 shrank from 0.0171 mm² to 0.0142 mm², ~17% smaller. The density is 17.6 Mib/mm², ~59% of the theoretical maximum for 6T HCC. SRAM scaled well from N+2 to N+3, shrinking by ~19%, close to the theoretical logic shrink. The caveat is that N+2’s bitcells were unusually large, bigger than comparable 7 nm-class nodes, so part of the gain is catch-up rather than true scaling. With the insights from STEEL’s teardowns, we will be doing a deep dive into SRAM in a future newsletter article. Subscribe Everything above came out of a single STEEL teardown: die annotation, block-level area analysis and TEM cross-sections through logic and SRAM. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Future Roadmap The same cross-sections that pin down N+3 also show where SMIC can go next. Although N+3 is already close to the practical limits of DUV multi-patterning in several layers, SMIC still has a few scaling levers left. A theoretical N+4 would likely start with cell height. N+3 uses 5 M0 tracks between its power rails. Moving to 4 M0 tracks, as on SMIC N+2 and TSMC N6, could reduce cell height by roughly 15%. The routing grid is only one side of the shrink; the front end also must fit into the smaller cell. One possible FEOL lever is reducing the p-to-n isolation spacing from two diffusion grid units to one. Intel used this scaling booster on Intel 4, and TSMC did so on its N3 family. This path trades layout flexibility for density. Fewer M0 tracks reduce local routing resources, while tighter p-to-n spacing raises integration and design-rule difficulty. M2 is also constrained by the cell height shrink. For SMIC to maintain a ~5.7-track cell, M2 would need to move toward ~35 nm. That would move another layer into SAQP territory. SMIC could also reduce the CGP from 57 nm to 54 nm. Intel reached a similar CGP on Intel 10 nm/Intel 7 without EUV. The local interconnect is also tougher. If SMIC keeps the 3:2 M1-to-gate ratio, M1 would need to shrink to 36 nm and would likely require SAQP as well. If SMIC moves to a 1:1 ratio, M1 could relax to 54 nm, but it would give up routing flexibility. Under this theoretical path, we estimate that SMIC N+4 could reach a cell height of 198 nm and a CGP of 54 nm, implying a Bohr density of 137.8 MTr/mm², on par with TSMC N5 or Samsung SF4. However, the difficulty is cumulative. Each step is individually plausible, but together they make N+4 harder than the transition from N+2 to N+3. It will likely take longer, cost more, and carry less process margin. A theoretical N+5 would require a larger integration shift. One possible path is backside contacts (BSCon), moving power routing and source/drain contacts to the backside, which would reduce front-side routing pressure and enable another reduction in cell height. The front-side metal pitches could relax to reduce the process complexity. M0 would likely relax slightly to ~34 nm, and M2 and M4 pitches could relax further. CGP is unlikely to shrink much further. Even with EUV, 48 nm has been the practical limit for yield and process control. This approach would allow N+5’s cell height to fall to 170 nm and its CGP to 53 nm. This implies a Bohr density of 163.6 MTr/mm², on par with Intel 18A’s HP library. However, this would not make N+5 cost-competitive with the leading edge. It would reach a similar density through a much more expensive route. The integration difficulty rises sharply, with new process flows for backside alignment, wafer thinning, contact reveal, and backside metallization. Past this point, standard density and interconnect scaling become increasingly unattractive. That is where Huawei’s roadmap stops looking like a normal foundry roadmap and starts looking like a packaging roadmap. At ISCAS 2026, Huawei unveiled its tau (τ) scaling law, reframing process scaling in the time domain. τ is the time cost of data movement and processing: switching delays in transistors, RC signal propagation delays in circuits, compute, memory, and networking latency. Outside Huawei’s terminology, this is called system-technology co-optimization. This is Huawei’s answer to its lack of EUV lithography. Without EUV, planar density cannot keep pace with TSMC, Intel, or Samsung. If transistor density cannot shrink further, Huawei’s alternative is to shorten wires, reduce buffering, and stack logic vertically. “LogicFolding”, Huawei’s implementation of this new scaling idea, is, in practice, an aggressive 3D stacking approach. AMD V-Cache places SRAM above or below a CPU die. AMD’s MI350X places active interposer dies (AIDs) underneath accelerator and compute dies (XCDs), with the AIDs handling cache, IO interfaces, the network-on-chip (NoC) and embedded metal-insulator-metal (MIM) capacitors. With LogicFolding, parts of the same logic block are split across multiple active dies bonded face-to-face at ultra-fine pitch. This allows Huawei to shorten some critical paths and reduce buffer overhead, not merely add cache capacity or offload the IO and interconnect. Shortening wires is where the higher clocks come from. A large share of a modern core’s delay and energy budget goes into driving long interconnects and the repeater buffers along them. LogicFolding distributes a block’s critical-path gates across multiple stacked tiers bonded at a very fine pitch, so the bond interface behaves like an additional metal layer and the longest paths get shorter. That is how Huawei expects to recover frequency and efficiency it cannot get from the process alone. Huawei’s roadmap shows its intent. Prime core frequency is targeted to rise from 2.75 GHz in the Kirin 9030 to roughly 5 GHz by 2031, far beyond what planar scaling alone could deliver. Prime cores with 3.1 and 3.39 GHz clocks are being tested in its labs, although their power consumption is unknown. Beyond that, chips are in the design, simulation or pathfinding phase, meaning the frequencies are targets. However, the direction matters more: LogicFolding also helps with performance, not just density. The catch is that Huawei’s density claim is not directly comparable to foundry densities. A stacked design can report more transistors per package footprint by adding active layers, even if each patterned die remains well behind TSMC or Intel in front-end density. This is how Huawei can claim to reach foundry 14A-equivalent density by 2031. This is not a like-for-like foundry comparison, with Huawei using stacked logic and measuring density per package footprint. On a normalized Bohr-density basis, SMIC N+3 is ~114 MTr/mm², 38% less than Intel 18A’s HD library. Huawei’s 3D roadmap closes the gap by stacking active logic, reaching 215 MTr/mm² by 2030. In 2031, the roadmap density jumps to 295 MTr/mm², implying either a third active layer, partial EUV insertion or aggressive planar DUV scaling. Huawei’s methodology makes other foundries look much denser as well. Applying it to AMD’s MI450X with an N2 top die on an N3P base die yields a theoretical density of 460.2 MTr/mm² in 2026, compared with Huawei’s 295 MTr/mm² in 2031. This Kirin 9030 does not use LogicFolding, remaining in a conventional mobile SoC package. Instead, it forms the baseline for how far Huawei and SMIC can push planar scaling. Future teardowns of Kirin and Ascend chips will show both planar logic density and Huawei’s hybrid bonding solutions. Export controls changed China’s optimization problem rather than ending it. EUV restrictions raised the cost and complexity of leading-edge manufacturing without freezing it. SMIC reaches N6-class logic density through DUV immersion, SAQP and DTCO, while Huawei shifts more of the burden onto architecture, packaging and system-level integration. Future nodes will be tougher. N+3 still had room to tighten local metals and reduce cell height and CGP. Further scaling without EUV leaves fewer levers. More aggressive multi-patterning adds masks and overlay error. SMIC can keep pushing DUV, but each step will get more expensive and less forgiving. The design side is just as critical. Huawei had domestic EDA tools and flows before the Kirin 9030, with the Kirin 9000s, 9010 and 9020 making that clear. Huawei was able to ship multiple consumer SoCs on SMIC N+2 and N+3 while cut off from the Western EDA stack. US export controls restricted EDA tools for advanced chips in 2022 but did not target tools for more mature chips. In 2025, the US government briefly placed much broader restrictions on EDA software from Synopsys, Cadence, and others, before lifting them less than two months later as part of a trade deal tied to rare earths. Huawei has been unable to access those tools because it remains on a US trade blacklist. That forced Huawei, SMIC and Chinese academic institutions to build their own tools and flows. Researchers at Peking University recently announced a prototype EDA tool for Huawei’s LogicFolding architecture, which requires a new flow to handle the multilayer layout and floorplan. This is not the same as replacing the full Synopsys or Cadence stack, but it shows where domestic EDA is headed: toward tighter co-optimization between architecture, process and packaging. These advances are also diffusing into the Chinese ecosystem. SMIC is licensing its N+2 and N+3 processes to HLMC/Hua Hong at the government’s direction rather than by choice. If the same process learning feeds into Ascend accelerators for AI training and inference, the choke point shifts from one named fab to an ecosystem. Alibaba’s T-Head silicon arm and Cambricon, a Chinese AI chip designer that is expected to supply ByteDance, could also be major beneficiaries. Sanctions aimed at SMIC alone become less effective once the manufacturing knowledge has spread to other fabs and design houses. China is not closing the gap with Intel, Samsung and TSMC. The teardown shows the opposite in several places: no EUV, no backside power, higher process complexity, and visible trade-offs. But China is still advancing. If domestic chips become good enough for phones, inference, networking and security-sensitive workloads, they can matter strategically without matching TSMC at the leading edge. Behind the paywall, we show what else STEEL can do, with material and process flow analysis of SMIC N+3, and analysis of the Kirin 9030 package. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline, access the full Kirin 9030 and SMIC N+3 analysis or to commission a custom teardown, contact sales@semianalysis.com.
6 said killed in Gaza strikes as Hamas health ministry says war toll surpasses 73,000
Terror group says it responded to 15-point Board of Peace blueprint aiming to push ceasefire to next stage, although sources say disagreements remain over disarmament issue
He Spent 15 Years Amassing SpaceX Shares. Now Comes the Windfall.
Justin Fishner-Wolfson, long a minor figure in Elon Musk’s orbit, is at the helm of a multibillion-dollar payout
AI-Generated Microdramas Are Real — and Thriving Under Our Noses
Vertical-first platforms are proving that human-assisted AI production is a commercially viable engine for mobile entertainment
AI-Generated Microdramas Are Real — and Thriving Under Our Noses
Vertical-first platforms are proving that human-assisted AI production is a commercially viable engine for mobile entertainment
Bleecker Street, Ld Entertainment acquire Anton Corbijn’s ‘A Talent For Murder’ with Helen Mirren
IMDb es la fuente de contenido de películas, programas de TV y celebridades más popular y confiable del mundo.
What Happened on June 7: Hollywood Moments That Made Entertainment History
IMDb es la fuente más popular y autorizada del mundo para informarte de películas, series y programas de televisión y celebridades.
NBC Cancels 9 TV Shows: Full List and Ratings
From crime dramas to daytime TV, NBC is clearing space for a revamped 2026-27 lineup.
Best British crime series old and new to watch
Here are 15 British crime dramas, new and old, to watch. The genre is varied, the casts inevitably fine and justice almost always prevails.
What Happened on June 7: Hollywood Moments That Made Entertainment History
IMDb es la fuente de contenido de películas, programas de TV y celebridades más popular y confiable del mundo.
Mock political party for India's young 'cockroaches' set to hold first protest in New Delhi
NEW DELHI (AP) — The Cockroach Janata Party, a social media movement that began as an online joke and amassed millions of followers across India, will face its biggest test yet Saturday with its founder expected to lead a demonstration in New Delhi.
Remote work is taking its toll on the mental health of American workers, researchers find
Working from home comes with some major pluses. It's more flexible, there's no more pesky commute, work-life balance improves, and you can even stay in your pajamas all day if you want. But according ...
Microdramas Are Exploding: Here Are 5 Ways People Are Talking About Them
TikTok unveiled a Sundance partnership, Fox's vertical shows are incoming and ReelShort's founder got candid about AI
How this Baton Rouge nursing director helps her staff cope with daily dramas of the ER
Learn about Susan Green's 32-year nursing career journey from a $100 training course to leading her team with compassion and dedication through challenges like COVID-19.
CORUS ENTERTAINMENT IS CANADA'S ENTERTAINMENT SPECIALTY PROGRAMMING LEADER¹ WITH AN UNRIVALED 2026/2027 SLATE OF CANADIAN ORIGINALS AND ACQUISTIONS ACROSS ITS NETWORKS AND STACKTV
With more top 20 networks than any other broadcaster and owning 100 per cent of the top 10 most watched entertainment specialty programs this past fall3, Corus Entertainment dominates Canada's entertainment specialty programming landscape1. With a powerhouse slate of star-studded dramas and comedies, premium lifestyle and factual storytelling, and family fun entertainment premiering across its networks and streaming on STACKTV, Corus' 2026/27 lineup solidifies its position as the leader in Canad
Astros Legends Series 20: Danny Darwin
He pitched for 20 seasons, 8 clubs, and was a member of the beloved 1986 Astros. The Legends Series 20th installment features Danny Darwin, who amassed 171 wins throughout his career. Q: What did you think of Nolan Ryan’s nickname of “Dr. Death” for you? Did you like it? A: (laughs) Oh My […]
Home Entertainment Guide May 2026: The Bride!, Wuthering Heights, Sentimental Value, More
The latest on Blu-ray and streaming includes controversial dramas from Maggie Gyllenhaal and Emerald Fennel, along with Criterion releases of Body Heat, Lenny, and Peter Hujar's Day.
Ebola outbreak: What travel restrictions have countries imposed?
Canada, the Bahamas and the US are banning arrivals from affected countries to prevent the spread of the rare strain.
Wheelhouse Acquires ‘Shark Week’ Powerhouse Anomaly Entertainment
IMDb es la fuente de contenido de películas, programas de TV y celebridades más popular y confiable del mundo.
Matthew Perry's assistant is last to be sentenced over his ketamine death
Kenneth Iwamasa, 60, is set to be sentenced Wednesday in a Los Angeles federal courtroom
The Highest Metacritic-Scored Game Of 2026 Has Just Arrived
Mina the Hollower is here and has amassed the single highest Metacritic score of 2026 so far but a decent margin.
Bari Weiss: Think For Yourself, Not By Yourself
When we launched The Free Press, the plan was simple: Tell the truth plainly, and let readers come to their own conclusions. I thought there would be a sizable enough group of people who would pay the cost of one coffee a month to read high-quality news and opinion journalism. But what happened next surprised even me. Yes, you came for the stories—for the investigations, essays, debates, interviews, podcasts, and arguments. But over the past few years, you also found one another. I’ve watched strangers become friends in the lobby before our debates. I’ve seen people trade numbers after live recordings of Honestly, launch businesses after Free Press dinners, fall in love after our meetups—even get married (!?), and say some version of the same sentence over and over again: I thought I was the only one. We live in the most connected age in history, and yet, millions of people feel isolated, alienated, politically homeless, and starved for real conversation. We have followers and no neighbors. Algorithms instead of interlocutors. Our social media feeds are like troughs, but what we really need is a table to gather around. The Free Press is a publication, yes, but it is also a gathering place for independent minds. So today, I’m thrilled to share our new investment in you. We are launching a new world of community experiences for our paid subscribers, designed to bring _Free Press_ers together online and in real life. Introducing Our Community Launch The Free Press Forum Our new digital home for paid subscribers, the Forum, is now live. This is where _Free Press_ers can meet, debate, recommend, organize, joke, argue, and converse like civilized people. Imagine that. This is not social media as you know it. No bots. No algorithmic rage bait. No performative nonsense. Just smart people talking to one another. Inside the Forum, you’ll find conversations on the things our readers already care about most: the issues of the day, recommendations (books, music, travel), work and networking, parenting, dating, and where to find your people—online and in real life. Jump in! Introduce yourself and join the first conversations in the Free Press Forum here. You’ll also find announcements from us (paid subscribers are first to hear!) and our writers, hosting regular Ask Me Anythings (AMAs)—live conversations where subscribers can ask questions, push back, and continue the discussion beyond the page. This Thursday, subscribers can chat with our brilliant reporter, culture vulture, and co-founder Suzy Weiss. Friday, I’ll be lending you Nellie Bowles, queen of TGIF, to answer subscriber questions live. Read more about The Forum directly from Nellie here. The Free Press Supper Club The best part of being a _Free Press_er is meeting other _Free Press_ers. So we’re inviting you all to dinner to do just that. It’s part salon, part blind date, part old-fashioned dinner party. Here’s how it works: You answer a short questionnaire. We match you with a small group of _Free Press_ers in your city. We send you to a great restaurant. You show up for supper. The rest is up to you. Your next best friend, co-founder, or future spouse may already be waiting at the table. Learn more and sign up here for our first Supper Club in 12 cities in three countries taking place on June 18. Don’t see your city? Raise your hand if you’d like a Free Press Supper Club near you. Yes, St. Louis—we hear you. The Free Press Retreats and Excursions We’re also building something new for 2027: immersive experiences for Free Press readers who want to continue the conversation trailside, poolside, or around a fire long after dessert. The Free Press Retreat will be an intimate long weekend built around big ideas, outdoor adventure, great meals, and the kinds of discussions that happen when curious people spend meaningful time together. Bring your spouse, your parents, your children—or come on your own. Free Press Excursions will take us farther afield: curated trips with Free Press writers and contributors exploring places that help explain the world we live in, from the battlefields of Gettysburg and Normandy to the Vatican in Rome. We’ll share more details this summer. If you’d like an early look when these experiences open for registration, show your interest here.**A Note to Our Subscribers** These new offerings exist because of our paying subscribers. If you’re already one: Thank you. You built this. And you keep us going. If you’ve been reading us for free and wondering whether to join, this is a very good time. For a short while only, we’re offering a rare 20 percent discount for you to join our community as a paid subscriber. You’ll unlock everything we publish, plus exclusive access to our members-only Forum, Supper Clubs, and more insider perks. Thinking for yourself shouldn’t mean thinking by yourself. See you there. —Bari
AMAs 2026 red carpet: Best and worst looks celebrities wore
Hilary Duff, Karol G, and Teyana Taylor were among the stars who attended the 2026 American Music Awards and walked the red carpet in bold fashion.
Hilary Duff, Nikki Glaser lead daring fashion on the American Music Awards red carpet
The 2026 American Music Awards red carpet featured disco glamour, Western style and sheer couture as stars arrived at the MGM Grand in Las Vegas.
2026 AMAs full coverage: BTS wins Artist of the Year as New Kids on the Block and Keith Urban bring the nostalgia
Queen Latifah's hosting run comes to a close, while Twenty One Pilots, Leon Thomas and Karol G collect AMA honors.
Ohio Gov. DeWine talks endorsing Ramaswamy, why legalizing sports betting is his 'biggest mistake'
Ohio Gov. Mike DeWine reflected on his time in office, shared plans for his post-politics life and touched briefly on the current governor’s race during a recent forum.
I Went to the 2026 AMAs—This Was the Night's Best Performance
I went to this year's 2026 American Music Awards in person, and it was basically one giant, star-studded concert (I'm talking BTS, Maluma and New Kids on the Block). But one performance stood out as my favorite. Here, my AMAs review.
Confession: I've Never Been a BTS Fan, But Seeing Them Live at the AMAs Changed Everything
I've never been a fan of BTS, but seeing them live at the 2026 American Music Awards in Las Vegas changed everything. Here, why their performance was so good.
2026 AMAs full coverage: New Kids on the Block and Keith Urban bring the nostalgia while BTS wins Artist of the Year
The 52nd American Music Awards is live on CBS and Paramount+. Yahoo is here all night with updates, winners, performances, backstage moments and everything you missed.
The best and worst moments from the 2026 American Music Awards
Check out the highs (and a few lows) from the 2026 American Music Awards, including a couple of Queen Latifah sing-alongs and a Black Eyed Peas reunion.
2026 AMAs nominations list: Taylor Swift, Sabrina Carpenter, Morgan Wallen in running for top awards, BTS set to perform
Swift's 2025 album 'The Life of a Showgirl' helped drive her eight AMA nominations.
Ex-assistant who injected Matthew Perry with ketamine faces prison term
Ex-assistant Kenneth Iwamasa, who injected Matthew Perry with fatal ketamine doses, will be sentenced; family calls him most to blame.
Sources: Donald Trump Jr.’s wedding celebration will be on a small island in the Bahamas without his father present
UN council urged to use ‘every means at its disposal’ to press Hamas to disarm
A report from the Board of Peace established by President Trump said Hamas' refusal to disarm is the main obstacle to implementing the ceasefire
2026 American Music Awards: How to watch, AMAs start time, TV channel, and more
Everything you need to know to tune in to the 2026 AMAs.
Lebanon and Syria reshape ties amid Israeli attacks and regional shifts
Damascus and Beirut focus on sovereignty and cooperation, moving away from decades of Syrian dominance over Lebanon.
Millennials Are Gonna Lose It Over the Latest 90s Boy Band Added to the Nostalgia-Filled AMAs Lineup
The group joins Hootie & the Blowfish, Katseye, Keith Urban and more with Queen Latifah hosting at the MGM Grand Garden Arena.
Bahamian public health leader Dr. Merceline Dahl-Regis receives WHO Global Health Leaders Award at 79th World Health Assembly
Geneva, Switzerland, 18 May 2026 (PAHO) — Dr. Merceline Dahl-Regis of The Bahamas was recognized today with the World Health Organization (WHO) Director-General’s Global Health Leaders Award during the High-Level Welcome of the Seventy-ninth World Health Assembly (WHA79), honoring her lifelong contribution to public health in the Americas and globally.
Hungarian President Sulyok Rejects Magyar’s Call to Resign
Hungarian President Tamas Sulyok rejected demands from new Prime Minister Peter Magyar to resign by the end of May, setting the stage for a legal battle in Budapest.
Iko Uwais, Joe Taslim Head K-Movie Entertainment’s Indonesian Action Slate at Cannes Market (Exclusive)
IMDb es la fuente de contenido de películas, programas de TV y celebridades más popular y confiable del mundo.
NBC Reveals New ‘Law & Order’ Time Slot for Fall 2026
NBC is betting big on reality TV, sports, and legacy franchises as it reshuffles ‘Law & Order,' cancels ‘Brilliant Minds,' and rolls out new dramas and comedies.
New Business: Campo Enoteca to expand to Nashua; Yamas Greek Eatery opens in Concord
Eric Maxwell bought Campo Enoteca, a farm-to-table Italian restaurant on Elm Street in Manchester, three years ago with the idea he would eventually expand.
War worsens Lebanon’s economic crisis with job losses, price gouging and slow business
The latest war between Israel and Hamas, and the closure of the Strait of Hormuz, have sent economic shock waves across the Mideast.
Billy Idol to Receive Lifetime Achievement Award at the AMAs
Plus, who else is receiving special honors.
Hamas could survive as political group if it disarms, Board of Peace's Gaza envoy says
Nickolay Mladenov also warns the current stalemate over Donald Trump's peace plan could lead to a permanent division of the territory.
Clackamas County Launches New Tourism Business Grant Program
Clackamas County is investing in its tourism economy by launching a new, one-time Tourism Business Grant Program. Applications are open May 14 through June 18.
Syria and Lebanon make ‘significant progress’ at talks on joint interests
In Damascus, Lebanese prime minister and Syrian president discuss issues including security, transport and energy.
Anti-woke Vivek Ramaswamy confronts racism in his run for Ohio governor
Vivek Ramaswamy built a political brand casting racism as an obsession of Democrats. As a Republican running for Ohio governor, he’s facing racism on the right.
Is the FDA Really Suppressing Science? Plus. . .
It’s Thursday, May 7. This is The Front Page, your daily window into the world of The Free Press—and our take on the world at large. Today: Aaron MacLean says Trump is poised to snatch defeat from the jaws of victory in the Iran war. Joe Klein on the life of CNN founder Ted Turner. Jillian Lederman on why cruise ships are here to stay. And much more. But first: Is the FDA suppressing science? On Tuesday, The New York Times published a story with an alarming takeaway. “FDA Blocked Publication of Research Finding Covid and Shingles Vaccines Were Safe,” read the headline. It is the latest in a string of stories that all have the same message: The Food and Drug Administration (FDA), and other agencies, are engaged in a cover-up—and silencing scientists trying to get the word out about the Covid vaccine. What all these stories suggest—some more subtly than others—is that the outsiders now running the public health establishment, officials such as Marty Makary at the FDA and Jay Bhattacharya at the National Institutes of Health, are on a revenge tour. That they are doing harm to the country to get back at the scientists and bureaucrats who ostracized them for deviating from the public-health consensus during the pandemic. It’s a seductive narrative. But is it true? That’s the question we address in our latest editorial. —The Editors Read [ Marty Makary's FDA Has All the Right Enemies ](https://www.thefp.com/p/marty-makary-vaccine-study-fda) [ Trump Blinks First ](https://www.thefp.com/p/iran-peace-deal-pakistan-trump-strait-of-hormuz) Aaron MacLean In return for no detectable concessions, President Trump this week gave up on forcing open the Strait of Hormuz. Now, the Trump administration looks desperate for a deal to end the war with Iran. It’s easy to understand the desire to end the war, but are they blowing the chance at victory? Aaron MacLean makes sense of the administration’s latest moves—and Iran’s response—in his column today. Read full story Aaron MacLean and Niall Ferguson: Live in New York City Join Aaron MacLean and Niall Ferguson on May 19 for a live recording of School of War at the iconic New York Historical. In a conversation as timely as it is wide-ranging, Aaron and Niall will explore the strategic stakes of the moment, including the Middle East, China, and the future of American leadership on the global stage. Get Tickets Now [ Ted Turner, the Optimist Who Built CNN ](https://www.thefp.com/p/ted-turner-cnn-tribute) Joe Klein The man who gave us CNN and the 24-hour news cycle, Ted Turner, died Wednesday at the age of 87. Today, political writer Joe Klein—who almost ghostwrote Turner’s autobiography—remembers his friend, the American media mogul who stood out for his idealism and lack of a filter—something that got Turner in trouble more than once. “His was not a traditional intelligence, but one of horizon: Ted saw things before other people did,” Joe writes. Read full story [ Nothing Can Sink the Cruise Ship ](https://www.thefp.com/p/cruise-ship-hantavirus) Jillian Lederman A viral outbreak on a cruise ship that left three passengers dead has left some people wondering: Are cruise ships on the way out? Not so fast, says Jillian Lederman, who has been on many a cruise herself. Read her piece on why 38 million people a year take a cruise—and aren’t about to stop. Read full story [ The Great Writers Who Were Terrible People ](https://www.thefp.com/p/the-great-writers-who-were-terrible) Shilo Brooks Throughout history, some of the greatest literary geniuses have also been immoral bigots. In the latest episode of Old School, Shilo Brooks is joined by Eli Lake for a conversation about those geniuses, from Voltaire to Norman Mailer and Roald Dahl—and why we should read their work despite their odious prejudices. Listen on MORE FROM THE FREE PRESS [ Inside the Digital Intifada ](https://www.thefp.com/p/digital-intifada-social-media-hamas-terror) Warren Kinsella Read full story [ This Week in American History: Trump’s Over-Arching Problem ](https://www.thefp.com/p/this-week-in-american-history-trumps-over-arching-problem) Jonathan Horn Read full story [ Humanity Is Still Evolving—and Fast ](https://www.thefp.com/p/humanity-is-still-evolvingand-fast) Razib Khan Read full story THE NEWS Thirteen D.C. Metropolitan Police officers have been placed on administrative leave and could face termination after an internal investigation found evidence that crime statistics were manipulated to make the city look safer. The Republican-led House Oversight Committee previously alleged that former D.C. police chief Pamela Smith pressured officers to skew data. Tennessee Republicans unveiled a redrawn U.S. House map yesterday that would split up Memphis’s black-majority Democratic district, the latest move in a nationwide push to redraw congressional boundaries ahead of the midterms. The effort follows a Supreme Court ruling last week on Louisiana’s districts, which Tennessee House Speaker Cameron Sexton said gave states the green light to redraw maps along partisan lines. Israel struck Beirut for the first time since a ceasefire with Hezbollah took effect last month, saying it targeted a commander of the militant group’s elite Radwan force in the city’s southern suburbs. The strikes risk destabilizing that truce at a delicate moment, as Iran and the U.S. report progress toward a deal to resolve their own standoff. The U.S. Air Force is aiming for a Fourth of July delivery of a Boeing 747 gifted by Qatar, hoping to add it to the Air Force One fleet in time for the U.S.’s 250th anniversary, Reuters reported. (For more on the controversy surrounding the aircraft, read Jed Rubenfeld’s piece “It’s a Terrible Idea, but Trump Probably Can Accept a Free Jet from Qatar.”) Commerce Secretary Howard Lutnick testified privately before Congress that he has no memory of why he and his family dined on Jeffrey Epstein’s private island in 2012, according to Reuters. The admission contradicts Lutnick’s earlier claim that he had cut ties with the convicted sex offender well before that visit. Weeks before a former JPMorgan investment banker filed a lawsuit packed with explosive allegations, the bank reportedly offered him $1 million to settle his sexual assault and harassment claims, according to The Wall Street Journal. The suit, filed by Chirayu Rana, alleges he was sexually assaulted by a female colleague, subjected to racial discrimination, and forced into a degrading dynamic at work. JPMorgan says the claims lack merit, and the female colleague’s lawyers call the accusations fabricated. A new report from the Hartford Institute for Religion Research shows that, for the first time in roughly 20 years, church attendance is trending upward, with more people volunteering and clergy expressing renewed optimism. The study’s authors described the findings, based on a survey of more than 7,400 congregations, as showing signs of widespread recovery from low attendance numbers.
Gaza health officials say 5 killed, including Hamas police officer, in Israeli strikes Wednesday
* * *
Ramaswamy advances in Ohio, and other takeaways from Tuesday’s primaries
Primaries in Indiana and Ohio reinforced President Donald Trump’s power in the GOP and set the stakes for several top-tier midterm races.
Trump-backed Ramaswamy wins Ohio governor primary, setting up a competitive Nov. race
In Ohio, where a Democrat hasn't won an election for governor in 20 years, Republican Vivek Ramaswamy and Democrat Amy Acton could be in for a tight race this fall.
Ohio heads to polls as Ramaswamy hopes to lock in as Republican candidate for governor
Trump-endorsed candidate facing a long-shot challenge from car designer and YouTube provocateur Casey Putsch
Ramaswamy’s personality, Trump’s revenge define Ohio, Indiana primaries
Ohio and Indiana primary voters hit the polls on May 5 and will test whether President Donald Trump's grip on the Republican Party is slipping.
Ramaswamy looks to put primary behind him and turn to expensive fall campaign for Ohio governor
Ohio Republican gubernatorial candidate Vivek Ramaswamy aims to put a long and sometimes unpleasant primary season behind him Tuesday
Birmingham to host 5th Annual Mental Health Day at Linn Park Friday
The City of Birmingham and Nurture of Alabama are teaming up to host the Fifth Annual Mental Health Day on Friday, May 8, at Linn Park.The event runs from 10 a.
How A.I. Is Transforming China’s Entertainment Industry
A.I.-generated microdramas have taken off. Celebrities have threatened legal action against the use of their likeness, while actors say jobs have dried up.
A List Of What We Know About Destiny 2’s Delayed June Major Update
Destiny 2's delayed Major Update is still a month away, but we are amassing a list of what we know is coming. It's not great.
These are the movies you’ll be able to catch at this year’s Film on the Rocks
Whether you’re into horror, dramas, comedies or action, Film on the Rocks will certainly deliver with its lineup for the 2026 season.
How governor candidates Ramaswamy, Acton want to fix Ohio's mental health crisis
Both frontrunners for governor want to improve Ohio's mental health care system, and each has a vision for a better state, but neither outlined detailed plans for how they would accomplish these goals.
Don’t upend Colorado’s ‘healthy balance’ on stream access
By Ashley House “The horizon is a perfect line between sky and water.” I heard this line of dialogue waft through my parents’ living room recently as they tuned into one of the newest Taylor Sheridan TV dramas, “The Madison.” As I lingered to admire the cinematographic qualities of the show (shot within the Madison River […]
Potential headwinds for Ramaswamy as he looks to fall campaign
Ohio's Republican primary for governor is a few weeks away, but there are few signs that the top candidate sees it as a competitive race.
How low can Ohio go? The gubernatorial race might show us
Ohio governor candidates on the right seem determined to answer one question: How low can you go and still get elected?
Acton's domestic dispute twisted into Ramaswamy campaign fodder
Opinion: Dr. Amy Acton's clash with her husband reflects strain of relentless work.
Entertainment: Obamas say aloha to Netflix
The Obamas are saying aloha to a business partner and splitting with a streaming giant.
Clackamas County commission race 2026: 2 ousted members challenge 15-year incumbent
Jim Bernard and Mark Shull, both defeated in past elections, are mounting separate bids to unseat Paul Savas.
2025 major champion puts 30-gram driver shaft into play
Miyu Yamashita opts for an extremely lightweight shaft profile to make some performance gains this week at the JM Eagle Championship.
Leeds 3-0 Wolves: What Farke and Justin said
Leeds United's victory this afternoon takes them to 39 points after 33 Premier League matches played. No team has ever gone on to be relegated from the Premier League after amassing 39+ points at this stage of a 38-game Premier League campaign.
Fox News Entertainment Newsletter: Heather Locklear dating Lorenzo Lamas, reality star suffered stroke
The Fox News Entertainment Newsletter brings you the latest Hollywood headlines, celebrity interviews and stories from Los Angeles and beyond.
Best of Bay Community’s Choice Awards business spotlight: Ardamas Fleet Services
Nominations for the Best of Bay Community's Choice Awards are rolling in! Don't miss your chance to recognize your favorite businesses.
Michael Phelps Reflects on Impact of His Mental Health Advocacy
Michael Phelps sits down with NBC Nightly News anchor Tom Llamas for a new series called Great Americans to mark 250 years of the United States. Phelps talks about his life after the Olympics and reflects on the impact that openly discussing his mental health struggles has had on others and why he says that's "better than winning an Olympic gold medal."
In Texas Senate Race, Talarico Is Out-Raising His G.O.P. Opponents
James Talarico, the Democratic nominee, has been amassing campaign cash as Senator John Cornyn and Attorney General Ken Paxton still battle each other.
Ohio governor race between Ramaswamy, Acton turns ugly
The fight over who'll be the next Ohio governor is getting ugly. And the election is still more than six months away.