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Decoding the gut microbiome's symphony in health and disease
The trillions of microorganisms living in our intestine influence our health, from digestion and metabolism to immunity. Yet scientists still struggle to understand how these microbes shape these important physiological functions because gut microbiomes are extraordinarily complex, redundant, and dynamic. New technologies are therefore essential for advancing microbiome research. Researchers at the University of Vienna have now reported effective strategies for simultaneously measuring thousands
How scientists are trying to repair the body from within: Regenerative medicine and anti-aging
At Scripps Research and its drug discovery arm, the Calibr-Skaggs Institute for Innovative Medicines, scientists are developing regenerative medicine therapies designed to help the body repair itself from within. Unlike traditional medicines that primarily manage symptoms or slow disease progression, regenerative medicine aims to restore damaged tissues and rebuild function lost to aging and disease. Researchers are advancing programs focused on the heart, lungs, digestive tract and eyes, including investigational therapies for heart failure, idiopathic pulmonary fibrosis, inflammatory bowel disease, age-related macular degeneration and other chronic conditions that become more common as we age. Learn how scientists are activating the body’s natural repair mechanisms to explore a future where medicine may not only treat disease, but help reverse its damage.
Kristen Beavers receives prestigious National Institutes of Health grant
With a passion for advancing healthy aging, Professor Kristen Beavers recently received a five-year National Institutes of Health (NIH) grant totaling more than $800,000 to enhance research and educational capacity in emerging areas related to aging, obesity, and body composition at Wake Forest University. This [...]
Sphere Entertainment Co (SPHR) (Q2 2026) Earnings Call Highlights: Strong Sphere Revenue Growth ...
Sphere Entertainment Co (SPHR) reports a 30% revenue surge in its Sphere segment driven by 'The Wizard of Oz,' while advancing construction on new venues in Abu Dhabi and National Harbor.
Senate Panel Advances Science of Reading, Dyslexia Bills with Bipartisan Support
Two bills passed out of the Senate HELP Committee Thursday, advancing the federal government’s oversight of literacy instruction and intervention.
The Lone Republican Who Voted Against Advancing Bill to Put Tougher Sanctions on Russia
The lawmaker referred to the legislation as the "latest counterproductive attempt to hold Russia accountable for its war against Ukraine."
National healthcare groups join HHS effort to improve behavioral health, addiction care
The Health and Human Services Secretary today announced that dozens of insurers, medical societies, healthcare providers and behavioral health experts have pledged to strengthen the nation’s behavioral health system by advancing best practices aimed at improving mental health and addiction treatment.
How I Got My Career in Foreign Policy: Andrea R. Flores
Andrea Flores has spent more than fifteen years working on immigration policy, including at DHS, the White House, and the ACLU. She spoke with CFR about how her 360-degree perspective has shaped her understanding of the issue and the challenges of advancing immigration reform.
Cleveland WNBA Names Cleveland Clinic as Third Founding Partner and Official Hospital and Sports Medicine Provider
World-renowned hospital system to focus on holistic player care, advancing youth development, health education and community engagement.
audioXpress Editor
audioXpress Magazine's editorial department. Advancing the Evolution of Audio Technology - Since 1970 - Connecticut, USA - audioxpress.com
NYC Health + Hospitals/Kings County Successfully Performs Its First Breast Tumor Cryoablation Procedure
NYC Health + Hospitals/Kings County has successfully performed its first breast tumor cryoablation procedure, marking a significant milestone in advancing
Health care bills are opaque. Congress is trying to change that, again.
Bipartisan lawmakers are advancing bills that would require hospitals and insurers to disclose their prices.
United quietly pursued a merger with Delta last year: report
The Wall Street Journal reports Chicago-based United Airlines approached Delta last year about a merger, but talks ended before advancing.
More Than a Website: Advancing Healthcare Across Michigan - MHA | Michigan Health & Hospital Association
John Karasinski, vice president, communications, MHA Healthcare is built on connections. Every day, hospitals across Michigan provide care to patients and families, and resources to communities that improve health and well-being. Behind those efforts are countless healthcare professionals, trustees, policymakers, educators and community leaders working together to strengthen healthcare for…
AMD EPYC Zen 7 "Florence" Confirmed With ACE, Next-Gen Memory
After announcing the AMD EPYC 9006 'Venice' processors today at AMD Advancing AI 2026, Lisa Su ended her keynote by confirming EPYC Zen 7 'Florence' details as well as EPYC Zen 8 'Ravenna' being in development.
Wilmington announces business and economic development chief
The city of Wilmington announced on Thursday the hiring of Louis Starks as its new business and economic development manager. According to a news release, the role focuses on strengthening Wilmington's business ecosystem, supporting entrepreneurship and advancing strategic economic growth. "In this role, Starks will collaborate with residents, local businesses, community groups, educational institutions and regional partners to promote investment, workforce development, and innovation for businesses of all sizes," the release stated. "He will also help connect small businesses with City procurement opportunities, cultivate public-private partnerships, and lead initiatives that promote long-term economic vitality." Starks has more than 20 years of experience in economic development, urban planning, housing finance, workforce development and public policy, according to the release. Most recently, he served as manager of business development for Oakland County, Michigan, "where he led teams focused on business retention and expansion and financial services for one of the nation's most economically diverse regions. During his tenure, his teams supported billions of dollars in business investment initiatives while helping create thousands of jobs," the release stated. He holds a law degree and master's degree in urban and regional planning from the University of Iowa, as well as a bachelor's degree from Duke University. He is also a Certified Economic Development Professional. Starks is expected to begin his Wilmington position on July 27. “Louis has built his career around helping individuals, organizations and communities reach their full potential,” stated city manager Becky Hawke in the release. “Whether supporting entrepreneurs, managing complex redevelopment projects, or bringing together public and private partners, he has consistently focused on creating opportunity and delivering results. He understands that a strong economy creates opportunities for everyone. By supporting local businesses and fostering innovation, his work will help ensure the benefits of Wilmington’s growth are felt throughout the community, creating jobs, strengthening neighborhoods, and improving quality of life for residents.”
2026 Health Policy Leadership Forum
The National Governors Association Center for Best Practicesconvened state and territory governors’ health policy advisors in Charlotte, North Carolina, July 8-10 for the 2026 Health Policy Leadership Forum. Through a discussion-based format, the forum provided governors’ advisors, NGA Partners and invited guests with an opportunity to exchange perspectives, share implementation strategies, and discuss emerging policy challenges shaping state and territorial health systems. Discussions focused on advancing governors’ health priorities in a rapidly evolving policy and fiscal environment while highlighting innovative approaches and peer-informed solutions from across the country.
Ranking Members Markey, Velázquez Push to Roll Back Trump Administration’s Discriminatory SBA Lending Policy that Blocks Immigrant Entrepreneurs from Pursuing the American Dream
Bicameral resolution would rescind Trump administration policy banning green card holders from accessing SBA loans Resolution Text (PDF) | One-Pager (PDF) (Washington, July 23) – Ranking Member Edward J. Markey (D-Mass.) and House Small Business Committee Ranking Member Nydia M. Velázquez (D-NY-7) today introduced a Congressional Review Act (CRA) resolution to rescind the Trump administration’s policy that bans green card holders from accessing essential Small Business Administration (SBA) loans to start and grow their businesses and invest in Main Streets nationwide. Trump’s SBA restrictions buck decades of precedent, attacking immigrant small business owners who are lawfully in the U.S. with no justification. The Trump administration’s green card holder ban is the most recent escalation of SBA’s draconian citizenship restrictions that are killing jobs and putting the American Dream further out of reach for entrepreneurs. In Fiscal Year 2025, the SBA made an estimated $5.7 billion in loans to green card holders, which supported more than 80,000 American jobs. Ranking Member Markey’s introduction of the CRA resolution follows his introduction of the Investing in the American Dream Act alongside Ranking Member Velázquez earlier this year. The Investing in the American Dream Act would roll back the SBA’s draconian lending restrictions and restore previous SBA lending policies for immigrant entrepreneurs lawfully in the U.S., including green card holders, refugees, and asylees. More than 100 organizations have called for the passage of the legislation and over 60 Massachusetts state legislators have raised concerns about the impact of the citizenship restrictions in their local communities. “Once again, Donald Trump is shutting hardworking immigrants out of the American Dream with his discriminatory and dangerous policies, fear tactics, and violent rhetoric. The anti-small business lending requirements implemented by Trump’s SBA won’t Make America Great Again—they are Making America Hate Again,” said Ranking Member Markey. “I am fighting every single day to roll back Trump’s brazen attempt to steal the American Dream from entrepreneurs in Massachusetts and across the country who enrich our communities, strengthen our Main Streets, and create jobs in the United States.” “Starting and owning your own business is one of the pillars of the American Dream. Under the Trump Administration, the SBA has sought to deny immigrant small business owners and entrepreneurs that dream by preventing them from accessing the capital they need to grow and scale their businesses. Not only is this policy cruel, but it is also self-defeating and holds our country back economically. As Ranking Member of the House Small Business Committee, I will do everything in my power to reverse this terrible policy,” said Ranking Member Velázquez. Massachusetts state legislators applauded Ranking Member Markey’s actions and emphasized the critical contributions of green card holders to Bay State communities and the Commonwealth’s economy. "Green card holders are our neighbors, workers, entrepreneurs, and taxpayers,” said Massachusetts State Senator Adam Gómez (D-Springfield), Senate Chair of the Joint Committee on Community Development and Small Businesses. “They open restaurants, launch small businesses, create jobs, and contribute every day to the economic strength of Massachusetts. Denying lawful permanent residents access to SBA loan programs doesn't make our economy stronger—it makes it harder for small businesses to succeed. I support this resolution because opportunity should never be limited by unnecessary barriers that prevent hardworking people from investing in their communities and pursuing the American dream." “Senator Markey’s CRA Resolution provides a valuable moment for our federal leaders to show their commitment to small businesses and the American Dream,” said Massachusetts State Representative Andy X. Vargas (D-Haverhill), House Chair of the Joint Committee on Community Development and Small Businesses. “The SBA’s recent policy restricting lawful residents from accessing the popular 7(a) and 504 programs has shut out some of the most entrepreneurial and hard-working members of our community from much-need capital. In Massachusetts, these programs have invested millions of dollars into small businesses owned by green card holders, supporting thousands of jobs. This should not be a partisan issue. People who worked hard, have legal status, and contribute so much to their communities via employment and economic impact don’t deserve to be in the crosshairs for political purposes. The Senator’s resolution is a step forward in restoring access to the American Dream that small business owners across the country deserve.” Several small business advocates and stakeholders voiced their support for Ranking Member Markey’s efforts to roll back Trump SBA’s discriminatory lending rules. “Immigrant-owned businesses are the foundation of the American economy. They power our neighborhoods, provide essential services, and employ our loved ones. Yet, systemic hurdles like the Small Business Administration’s citizenship restrictions unfairly block their path to prosperity," said Elizabeth Sweet, Executive Director of the Massachusetts Immigrant and Refugee Advocacy (MIRA) Coalition. "We applaud Senator Markey’s continued leadership and look forward to a future where immigrant entrepreneurs can share their ingenuity without arbitrary restrictions that hold us all back.” “Independent restaurants have always been built by people willing to work hard, take risks, and invest in their communities. When lawfully authorized entrepreneurs lose access to the financing they need to start or grow a business, we all lose. These are the businesses creating jobs, filling storefronts, and strengthening our neighborhoods. Access to capital should help good businesses succeed, and that’s exactly what restoring these SBA loan programs would do,” said Jen Ziskin, Executive Director of Massachusetts Restaurants United. “At the Latino Economic Development Corporation, we see firsthand that access to capital transforms lives, creates jobs, and strengthens neighborhoods. Many of the entrepreneurs we serve are lawful permanent residents who have invested their savings, opened businesses, and employ local residents. Restricting access to SBA financing doesn’t just impact business owners, it limits economic opportunity for entire communities. Main Street succeeds when every qualified entrepreneur has a fair chance to grow,” said Andrew Melendez, CEO and Founder of the Latino Economic Development Corporation. "Immigrants and immigrant-owned businesses are the heart and soul of small business communities in cities and towns throughout the Commonwealth, and across America. Limiting access to these SBA loans not only sends the wrong message about immigration, it will have significant negative economic impact on our small business ecosystem,” said Keith Mahoney, Vice President of Public Affairs at the Boston Foundation. “The SBA’s recent policy changes that prevent Legal Permanent Residents, and other non-citizens from participating in any of the SBA’s valuable programs are changes that are unwelcome, immoral, and antithetical to our purpose, our mission, and our vision for Massachusetts communities and businesses. Immigrant entrepreneurs and others have expressed concern that Common Capital will ‘report them to ICE,’ so loan demand has decreased. There is no valid reason for excluding Legal Permanent Residents and other noncitizens who are lawfully present in the U.S. from accessing the SBA’s programs. Immigrant entrepreneurs start businesses, they create jobs, they support their families and their communities. Our government should be in the business of encouraging their full participation in our economy,” said Raymond Lanza-Weil, President of Common Capital. "ECCHO-Latino now represents over 400 educators and 300 microbusinesses across Massachusetts, where immigrants make up 60% of the childcare workforce. When a green card holder is ready to grow her business—from expanding her home child care to opening a center—she shouldn't be turned away by local banks simply because of federal citizenship rules. Blocking access to SBA loans kills opportunity and deepens our state's childcare crisis. ECCHO-Latino strongly supports Senator Markey and Representative Velázquez in passing this resolution to put Main Street first," said Harold Antonio Blanco, Co-Founder & Executive Director of ECCHO-Latino Inc. "This is exactly how political ideology ruins an economy. Washington has taken lawful, tax-paying entrepreneurs who live in our communities, invest in America, and hire American workers, and declared their businesses ineligible for critical financing simply because a green card holder owns even a fraction of the company. Using policies ostensibly aimed at illegal immigration to punish lawful permanent residents is nothing short of ideological overreach and economic self-sabotage. The SBA exists to help viable small businesses grow, rather than imposing nativist tests that ignore an entrepreneur’s credit history, business plan, or ability to create jobs. When the federal government closes the door on qualified entrepreneurs, they’re also closing the door on American entrepreneurship and on American workers, while handing future companies, jobs, innovation, and investment to our competitors. America should be competing to attract people who want to invest and build here, not creating arbitrary barriers that drive their talent and capital elsewhere,” said Javier Palomarez, President and CEO of the United States Hispanic Business Council (USHBC). "The U.S. Small Business Administration's decision to prohibit legal permanent residents, including green card holders, from accessing SBA-backed loans has the potential for disastrous consequences that could reverberate throughout America's economy for years to come. After all, immigrants are twice as likely to start small businesses as U.S.-born individuals. Congress must overturn rules requiring the SBA to block legal permanent residents from accessing lending resources because so many of the entrepreneurs who drive job creation in this country were born outside the United States," said John Arensemeyer, Founder and CEO of Small Business Majority. “NCRC supports the Congressional Review Act resolution to overturn SBA’s citizenship restrictions that bar green-card holders from receiving the 7(a) and 504 loans. When qualified entrepreneurs are denied access to SBA loans, all of Main Street gets hurt. Communities lose jobs. Neighborhoods lose services. Local economies lose the opportunity to build wealth and shrink disparities,” said Jesse Van Tol, President & CEO of the National Community Reinvestment Coalition (NCRC). “We cannot afford to have the American Dream out of reach for hard-working, immigrant small business owners.” “Asian Americans and Asian immigrants have been integral in building local economies. They create businesses, jobs, and opportunities in communities across the country that benefit everyone. Lawful permanent residents pay taxes, invest in their communities, and strengthen Main Street, yet the SBA's discriminatory citizenship restrictions unfairly deny them access to the same tools that help small businesses grow and succeed. We applaud congressional leaders for advancing this resolution to overturn the latest restrictions on SBA lending for green card holders, and we urge lawmakers to also pass the Investing in the American Dream Act to fully restore access to SBA loan programs for all eligible people in the United States. Ensuring that immigrant-owned small businesses have a fair opportunity to access capital is essential to building a stronger, more inclusive economy that works for all,” said Joanna Derman, Director of Anti-Profiling, Civil Rights and National Security at Asian Americans Advancing Justice (AAJC). "Immigrant-owned businesses often turn to SBA 7(a) and 504 loans because they face higher denial rates from traditional lenders,” said Imani Augustus, Director of the Center for Entrepreneurial Opportunity. "These programs provide the capital they need to expand operations, hire workers, and invest in their businesses. Reversing the ban on lawful permanent residents is a critical first step toward ensuring these financing tools are accessible to everyone strengthening their communities through entrepreneurship. We applaud this action and urge Congress to fully restore access by passing the Investing in the American Dream Act.” "Last year, nearly 5,700 SBA loans worth $5.7 billion went to businesses owned by green card holders, supporting more than 80,000 jobs. These are entrepreneurs who have put down roots here, hired their neighbors, and invested in the communities they call home. Barring them from capital doesn't protect Main Street—it starves it. What should matter is the strength of a business and its potential to grow, not the immigration status of its owner. This resolution doesn’t eliminate all the citizenship restrictions in SBA’s policy change, but it’s a step toward restoring a commonsense principle that stood for more than 30 years," said Howard Wial, Director of Research at ICIC. "I'm encouraged to see Congress moving to reopen access to capital for green card holders, a key tool for small business survival. Green card holders accounted for an estimated 5,700 SBA loans in Fiscal Year 2025, worth $5.7 billion and supporting more than 80,000 jobs across the country. That capital is often what keeps a business operating through its toughest stretches when cash flow gets tight. When qualified entrepreneurs lose access to that capital over their immigration status rather than their ability to repay a loan, it's the local economy that pays the price,” said Small Business for America's Future Co-Chair Shaundell Newsome, Founder of Sumnu Marketing. “Small businesses are the backbone of the American economy, and entrepreneurs —including green card holders — take risks every day to build businesses, create jobs, and strengthen communities. SBA loan programs should be administered with clear, consistent standards that safeguard public resources while ensuring these programs remain focused on supporting eligible entrepreneurs and job creators. This resolution responds to the opportunity to support all entrepreneurs and preserve the integrity of federally supported lending programs. We applaud the introduction of this resolution and remain committed to policies that strengthen small businesses, promote economic growth, and maintain confidence in these vital lending programs,” said Carolina Martinez, CEO of CAMEO Network. “National CAPACD wholeheartedly supports the introduction of this resolution aimed at overturning the SBA's misguided policy prohibiting immigrants from accessing the 7(a) and 504 loan programs. As a coalition, we are committed to creating systems, organizations, and societies that are fair and just. We believe we and our economy are stronger when we uplift our rich and diverse communities. Access to capital helps small businesses create jobs, build wealth, and strengthen neighborhoods. Restoring this pathway is an important first step toward ensuring immigrant entrepreneurs can continue to grow their businesses and contribute positively to our economy as a whole. We urge Congress to build on this momentum by passing the Investing in the American Dream Act, which would fully restore fair access to safe and affordable credit and uphold our commitment to a fair economy that works for everyone,” said Seema Agnani, CEO of National CAPACD. Ranking Member Markey is fighting for small business owners and immigrants that rely on SBA loans to start and run their businesses, create jobs, and contribute to their communities. In May, Ranking Member Markey highlighted the significant contributions of immigrant entrepreneurs in Massachusetts and across the country and condemned the Trump administration’s repeated attacks on immigrant communities at a Small Business Committee hearing. MIRA’s Elizabeth Sweet, who participated in Ranking Member Markey’s listening session earlier in May, provided testimony at the hearing. Also in May, Ranking Member Markey hosted a listening session at the Urban College of Boston to hear directly from several Massachusetts immigrant small business owners, lenders, and chambers of commerce how President Trump’s cruel and callous anti-immigrant policies are hurting Main Streets in the Bay State. Earlier in May, Ranking Member Markey hosted a press conference alongside Ranking Member Velázquez, Democratic lawmakers, and stakeholders to condemn the Trump administration’s harmful anti-immigrant lending policies and to introduce the Investing in the American Dream Act. In March, Ranking Member Markey released a comprehensive report detailing the harms to small business owners, workers, and consumers caused by the Trump administration’s ICE raids in communities across the country. In February, Ranking Member Markey introduced the Small Business ICE Disruption Fund Act, which would provide grants to small businesses that have been impacted by the Trump administration’s violent immigration enforcement actions on Main Streets across the United States. Earlier in February, Ranking Member Markey, Ranking Member Velázquez, Congressional Black Caucus Chair Yvette Clarke (D-N.Y.), Congressional Hispanic Caucus Chair Adriano Espaillat (D-N.Y.), and Congressional Asian Pacific American Caucus Chair Grace Meng (D-N.Y.) sent a letter urging the SBA to rescind their lending rule change that bars legal permanent residents from receiving SBA loans. Previously, Ranking Members Markey and Velázquez released a statement condemning the actions of the SBA after it announced that small businesses with legal permanent residents will be barred from receiving SBA loans. In December 2025, Ranking Member Markey and all Democratic members of the Senate Small Business Committee sent a letter to the SBA reiterating concerns with the SBA’s citizenship requirements and highlighting a drop in SBA lending volume. In September 2025, Ranking Member Markey heard directly from SBA lenders about the issues with the citizenship verification requirements. In July 2025, Ranking Members Markey and Velázquez sent a letter to the SBA expressing serious concerns with the agency’s new, draconian citizenship verification requirements that require small businesses seeking SBA loans to be 100% owned by U.S. citizens, nationals, and legal permanent residents. SBA has not responded to the letter. ###
Framework launches world's first mini-ITX desktop PC with Ryzen AI Max+ Pro 495 and 192 GB RAM
Framework has previewed the latest iteration of the Framework Desktop PC at AMD's Advancing AI event. The Framework Desktop is a small 4.1-litre mini-ITX PC that is powered by the Ryzen AI Max "Halo" APUs. The newest iteration brings the Ryzen AI Max+ Pro 495.
IAM Texas State Council Charts Course for Organizing and Political Action
Nearly 100 participants, including delegates, guests, speakers, and IAM leaders from industries across the Lone Star State, gathered in Austin for the 2026 IAM Texas State Council Meeting to discuss the issues facing working families, strengthen the union’s legislative and organizing efforts, and hear from labor and political leaders committed to advancing workers’ rights. Texas
Patient Action Leaders Advancing Novel, Transformative, Equitable (PA’LANTE) Healthcare
UConn Health Disparities Institute and Hispanic Health Council amplifying Latina voices to improve healthcare in Connecticut.
AMD’s Zen 6 EPYC Venice Pictured as a 256-Core Monster, Massive Twin I/O Dies & First 2nm HPC Chip To Enter Volume Ramp
AMD has showcased its next-generation EPYC Venice CPU at the Advancing AI event, featuring a phenomenal core count of 256 based on Zen 6.
Advancing the next era of national science
OpenAI outlines its commitment to advancing American science working with the U.S. Department of Energy and national labs to use frontier AI to accelerate discovery.
Powering America's Genesis Mission: Microsoft's commitment to scientific discovery
Today, we’re excited to share a long-term commitment to the Department of Energy’s (DOE) Genesis Mission, backed by a $60 million investment designed to accelerate AI for science and the breakthroughs it can deliver for the country. This deepened commitment includes Microsoft’s new Scientific Partnership Advancing Research & Knowledge coordination hub and program office, otherwise...
TECfusions, a Rapidly Growing Developer and Operator of AI-Ready Data Centers and Power Infrastructure, Signs Business Combination Agreement with Apex Treasury Corp.
TECfusions is positioned where accelerating AI data center demand meets a scarcity of power-secured capacity. Company ethos centered on the fusion of ‘Technology, Environment, Community’ focuses on delivering AI-ready capacity while advancing environmental redevelopment and local community outcomes. Unique adaptive reuse strategy designed to convert legacy industrial sites into AI-ready, power-enabled data center infrastructure, accelerating deployment in power-constrained markets. The Transacti
Susumu Tonegawa Dies at 86; Nobel Laureate Showed How Antibodies Fight Infection
The first Japanese scientist to win the Nobel Prize in Physiology or Medicine, he went on to discover how memories are stored, advancing understanding of how the brain works.
A Historic Data-Sharing Agreement Affirms Tribal Authority and Aims to Improve Public Health
Diseases do not recognize borders, but the laws, regulations, and systems governing critical public health data often do. Improving how data is shared across different jurisdictions—including state and Tribal governments—better prepares public health departments to understand and respond to disease outbreaks and other public health issues while advancing the unique issue of Tribal data sovereignty, the right of a Tribal nation to collect and manage its own data.
Advancing next-gen AI with materials science innovation
As artificial intelligence pushes semiconductors and data centers to new physical limits, advances in materials science are becoming essential to sustaining the pace of innovation.
Amazon science meets rare disease innovation
A plant-derived therapy rooted in Amazonian medicine is advancing as a potential treatment for rare and life-threatening intestinal failure conditions
WHO marks 25 years of Research4Life, advancing access to scientific knowledge in more than 120 countries
The World Health Organization (WHO) today marks the 25th anniversary of Research4Life, a public-private partnership that provides researchers, educators, health professionals and policy-makers in low- and middle-income countries with affordable or free access to scientific knowledge.
Disability inclusion in health systems and emergency management remains uneven across Latin America and the Caribbean, new report finds
Washington, D.C., July 20, 2026 (PAHO) — Despite progress in laws, policies and programs aimed at advancing the rights of persons with disabilities across Latin America and the Caribbean, many continue to face barriers to accessing health services and emergency care on an equal basis with others, according to a new report released by the Pan American Health Organization (PAHO), the Economic Commission for Latin America and the Caribbean (ECLAC) and the Inter-American Network of Persons with Disabilities and Their Families (RIADIS).
Science can serve dark as well as light
I’m not sure how many of you are watching “Star City,” Apple TV’s spin-off of its “For All Mankind” program (2019-present), but it’s one of the better sci-fi series I’ve seen in a while, with an impressively dark political message. (Some light spoilers below.) For the uninitiated, “For All Mankind” presented a slightly tweaked history of the U.S. space program in which it was the USSR that landed on the Moon first in 1969, and shortly thereafter put a woman cosmonaut on the lunar surface. This sparks an ongoing space race that, in the original series, yields a lot of benefits for humanity. President Nixon’s insistence on a female astronaut corps to compete with the Soviets boosts the feminist movement of the 1970s and the ERA passes. New fuels generated for the space program create clean and cheap energy around Earth. There are also some darker changes — the USSR is thriving well into the 2000s, there are terrorist counter-technology movements around the globe, laborers on Mars work in nightmarish conditions and organize strikes and riots, etc. the @smotus report is a reader-supported publication. To support this work, please become a paid subscriber. Subscribe That show offers glimpses into the subtle ways this Earth is different. Teddy Kennedy never went to Chappaquidick because he was racing back to Washington to deal with the space program crisis; he gets elected President in 1972. John Lennon survives his early 1980s shooting but Pope John Paul II does not. The Apple Newton succeeded. Pretty much the whole of season 4 is a setup for an Al Gore joke. Again, mostly, the vision that “For All Mankind” presents is a positive one, with technology advancing many human interests. “Star City” goes in a very different direction. This spin-off show is about the same set of events but from the Soviet perspective. As we meet them, the team of scientists and cosmonauts responsible for the lunar landing are still basking in their hero status, but their program is embedded deep in the Soviet security state of the late 1960s. Everyone’s apartment is bugged. Whole teams of clerical staff spend their days transcribing recordings of people’s lives. People in the program, including respected cosmonauts, are regularly arrested. An incredibly menacing Colonel Lyudmilla Raskova (Anna Maxwell Martin) forces confessions and tortures and kills, expressing little more than annoyance in the process. Meanwhile, the space program’s highly respected Chief Designer (Rhys Ifans) has a vision for the program that he knows the government will not approve. He insists that they need to think past the Moon to focus on colonizing the solar system, starting with Venus. (This is a rough parallel to the Americans’ pivot to Mars in the original show.) He essentially builds a secret space program within the space program, calculating that the government will embrace the mission after it has succeeded. (As an aside, I’m not sure why the Venus obsession, as a successful mission can’t produce the biggest public relations payoff: a cosmonaut standing on the surface holding the Soviet flag. Anyone standing on Venus would be immediately crushed by the 92-bar atmosphere and then cremated in the 900°F temperatures. But in a country with no free press perhaps the visual payoff was less valued.) But the overall vision is that the technological advances have only amplified the most fearsome aspects of the Soviet system. The state is paranoid (but not incorrect) about American spies and does monstrous things to protect its secrets. People are terrified to trust each other. Classic banality-of-evil figures order people to harm those they care about; those people comply rather than get shot. Others are forced into criminal behavior to protect loved ones. We’re reminded all the time these days of what happens when a government despises science. It manifests in the defunding of schools, the elevation of fossil fuels as the rest of the world pivots to solar, outbreaks of measles and diarrhea, etc. But “Star City” offers a vision of a bad government that likes science. It’s not encouraging. It’s not yet clear if there will be a season two of this show. But I strongly recommend season one. It’s both thoughtful and gripping. Share
U.S. National Science Foundation, NSF National Radio Astronomy Observatory, and U.S. Naval Observatory Partner on Pathfinder for Next Generation Very Large Array
The U.S. National Science Foundation (NSF), the NSF National Radio Astronomy Observatory (NSF NRAO), and the U.S. Naval Observatory (USNO) are advancing a new collaboration to support the future of high-resolution radio astronomy and astrometry, with the development of a pathfinder instrument for the proposed Next Generation Very Large Array (ngVLA).
Blanche meets with Epstein accusers after demand from Republican senator crucial to confirmation
Acting Attorney General Todd Blanche met Thursday with accusers of convicted sex offender Jeffrey Epstein following the demand by a Republican senator whose support is crucial to advancing his nomination to lead the Justice Department.
Elevating citizen science: How IUCN Members are advancing a global conservation tool
This article shares reflections from an IUCN Member organisation about its efforts to elevate citizen and community science within the global conservation community. We demystify the IUCN motions process and show how it contributes to the IUCN Strategic Vision and Programme through the IUCN World Conservation Congress and its quadrennial cycle. Specifically, we outline the steps to organise support for Resolution 125 'Advancing citizen science to support and democratise conservation'.
National Academies Report Backs Climate Change Attribution Science
Attribution science is advancing quickly, researchers said. That could support lawsuits seeking damages for severe events worsened by global warming.
We Tracked Over $780 Million in Fundraising for Trump’s Presidency
The president and his allies have built a network of groups financed by wealthy donors and businesses that is advancing his priorities with little public disclosure.
The States Try to Topple WarnerMount…Thus Begins the Local Antitrust Era
(Welcome to the “Most Important Story of the Week”, my bi-weekly strategy column analyzing the most important (but often not buzziest) news story of the last two weeks. I’m the Entertainment Strategy Guy, a former streaming executive who now analyzes business strategy in the entertainment industry. Please subscribe.) Well, it looks like it’s time for another strategy column. Can I finally avoid writing about M&A? No, it seems I cannot. Admittedly, I’m a week early with this column, since I usually put it out every other week. But this news couldn’t wait. This will make three “Most Important Stories” in a row with a merger or acquisition as its centerpiece. First, Roku-Fox (an acquisition), then Comcast-NBCUniversal (a divestment!), and now the State AGs and the WGA’s lawsuits against Paramount’s pursuit of Warner Bros. Discovery (antitrust). M&A is usually the “most important” topic any given week, simply because a giant company merging or breaking up (or preventing those outcomes) can have the biggest impact on the streaming board. If you think about these companies as players in a game, changing the number of players is one of the biggest changes you can make. I shouldn’t really complain, either, since this lawsuit is very good news for customers and suppliers (econ speak for talent, workers and indie studios in Hollywood). So let me answer some questions about this potential trial, along with (shudder) making some heavily caveated predictions. I’ll also look at whether Hollywood must consolidate, whether or not the states can win, trouble at X-Box, Netflix’s YouTube binge, and more. Plus, I have five images that visualize this merger and the harm, including three brand new data looks you’ve never seen before. Subscribe Most Important Story of the Week - Can The States and the WGA Stop Hollywood’s Consolidation (Crisis)? If every other newsletter and news outlet is writing about the same story, I try to avoid writing about it as well, but I can’t ignore a story this consequential. The story of the last year was the fate of Warner Bros. Discovery, and this development potentially extends that saga into 2027. As I tried to figure out my angle, I realized, like my last column, I’m again faced with a series of questions. These questions, though, are much more forward-looking. Will the states win? Will the WGA win? If so, what happens to Warner Bros. Discovery? Either way, will this chill the market for future mergers? So you know what that means: predictions. About the future, no less, the hardest thing to predict.1 Just remember: nothing here comes with a guarantee. And the more confident someone is in their predictions, the less you should trust them. This situation is incredibly fluid, nuanced, uncertain and tenuous. So let’s try to explain what may happen. Question: Why File this Lawsuit? I’ll admit, a few months back, I was fairly pessimistic about the fate of this lawsuit. Rumors had started bubbling up that the state Attorneys General (in particular California) wanted to settle with either some minor divestments (usually CNN) or behavioral remedies. And that tracked for me: the states usually settle lawsuits, like the recent John Deere right-to-repair suit. Yet, they plan to fight this. (As they did the LiveNation-Ticketmaster monopolization trial and the Nexstar-Tegna merger.) Honestly, that also makes a ton of sense. Frankly, this move is just good politics for these State AGs. Most are still running for higher and higher office in blue states—some folks have emphasized that only Democratic AGs joined this suit, but given the Ellison/Trump ties, and fears of retribution, that tracks—and a high profile case like this will help them move up the electoral ladder, especially since Paramount and its leadership (the Ellisons, father and heir) have sided with the other side of the political aisle. That makes them unsympathetic to Democratic voters and Hollywood workers in particular. Why did this lawsuit happen? In addition to the very real concerns about industry consolidation, this is why. That said, I don’t think we would have seen this lawsuit for Netflix and Warner Bros., simply because they’re more sympathetic and aligned with Democrats. But those consolidation concerns are real. The “town”—meaning Hollywood and such—really is seeing the damage of mergers on this industry. That’s why the WGA also filed its own lawsuit in defense of workers as well. (Wildcard: What about Europe? Will they try to stop the deal, too? There have been some rumors out of the UK they may try to fight the deal, and UK enforcers just stopped a Getty Images-Shutterstock tie up, so there is precedence. This argument could go either way, though. On one hand, the EU doesn’t need to step in, cause they states are handling it. On the other hand, this could make the EU’s case easier. Just imagine if both sides coordinated. I’ll simply say, “We’ll see!”) Question: Will The State AGs or the WGA Win? Can the state AGs play David to Paramount-Skydance’s Goliath here? That’s really the whole thing, isn’t it? If you know this result, you could make a lot of money. When things are uncertain, it’s tempting to shrug and say, “Eh” meaning it’s a 50/50 proposition. I wouldn’t, though. When in doubt, you should expect that the merging parties succeed. AT&T did successfully buy Warner Bros., after all, and Disney bought Fox without any challenges. Many judges are extremely sympathetic to mergers, and I’d bet the state AGs get a judge who will allow the merger. (Even Obama-appointed judges often allow mergers.) As I understand it, we’ll see two main attacks. First, theatrical films. The AGs are arguing that, when it comes to share of box office and the number of both “wide releases” and blockbuster (or “tentpole”) films, the merging parties will have over 27% market share. Now, the Supreme Court once ruled from on high that any merger that exceeds 30% is presumptively illegal, but that’s guidance, not an ironclad bar. Still, the states will have to argue that this is close to having too much power, and with that power, this will likely further worsen the theater/studio splits in particular. Indeed, as Matthew Stoller pointed out, “just five studios are responsible for 95% of all blockbusters; if this merger goes through, then Paramount and Disney will control 60% of that.” So yes, movie studios will be very concentrated after this merger. Want me to visualize some of that? Well, here’s the share of films that grossed over $200 million at the domestic box office since 2022. (Note: this isn’t all films released in over 3,000 screens, but it is a good look at market power.) First, here are the 43 films by studio: Notice all the blue (Disney), orange (Universal), and purple (Warner Bros)? Yeah, those studios are powerful, and this combines Paramount with one of them. Here’s the look by studio and share of the films that grossed over $200 million: Now, if you look at that and also think, “Huh, should we break up Disney?” I’m with you. I’ve seen some folks poo-poo this idea that this is a real category, but it is! For an upcoming article, I’ve been pulling data on the share of top 100 films at the box office as a share of total box office, and it’s massive. Here’s the chart: (This analysis looks at The-Number’s top 100 films and total domestic box office each year.) To be clear, tentpoles make up 80.7% of the box office each year, so I do think it’s a genuine market. (To be clear, films grossing over $50 million make up 80% of the domestic box office, and films grossing over $100 million make up 64.1%.) I mean, the top 100 films at the box office make up 95% of each year’s grosses. Worse, the combined studios will likely cut output to flex that market power. Everyone can just look at what happened to Disney and Fox to see the precedent. (With fewer films, the remaining theaters have to give more for those few films that remain.) Here’s an image I’ve used a lot, the share of wide-release films from Disney and Fox over time: The AGs will also argue that this consolidation will also impact the cable industry. In this case, the consolidation is actually worse, but that environment is…complicated. Paramount will argue that the cable industry is shrinking. That said, predictions that cable will “go to zero” also don’t look very well supported by the data, as the declines are shrinking, meaning “cable” or “vMVPDs” will likely stabilize at some point. Can the state Attorneys General win on those two main arguments? I honestly don’t know. Again, I’d bet no, since history in general supports that, but it depends on the judge/jury and how they interpret the arguments. Notably, Paramount won’t face accusations about monopoly power in other areas, like streaming, news, sports rights, or vertical integration. I tend to disagree with leaving out sports rights, but I also see the appeal for a simpler case. The states also aren’t really pushing novel theories about labor harm either, which should help. (By the way, Sean McNulty at The Ankler wrote a great run through of potential options, and Capitol Forum also wrote a great paper on theatrical consolidation. Both these pieces predated the lawsuit. Matthew Stoller is also out with his analysis of the pros and cons of the case too.) In some ways, the WGA’s case is even stronger. Quoting Sean McNulty’s summary: “The WGA is citing WARNAMOUNT as crossing a 30% market share in multiple sectors, a number that the Supreme Court has precedent for deeming “presumptively anticompetitive” in a market. According to the WGA numbers, WARNAMOUNT would have represented: - 35% of film writing jobs between 2021 and 2024 - 36% of TV writing projects between 2022 and 2025 - 38% of overall deals between 2021 and 2024” Notably, antitrust enforcers did win recently in the Penguin-Simon & Schuster merger by focusing on labor impact, so don’t count this thinking out. (Wildcard: Will the states try to get a jury trial? Most likely no, they’ll let a judge handle it. If I’m them, though, I’d try to put this in front of a jury. Juries tend to understand monopoly power in a more realistic way than judges faced with legions of economists.) Question: What if They Win? What if They Lose?
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Is SMIC N+3’s Metal Pitch Smaller than Intel 18A’s?
Almost four years ago, we published that SMIC had started shipping 7 nm (N+1) chips. Now, SMIC is shipping its third-generation 7 nm (N+3) process in Huawei’s Kirin 9030, with a minimum metal pitch of 32.5 nm, about 10% tighter than the 36 nm minimum metal pitch shipping in Intel’s latest Panther Lake CPUs on 18A. The headline is true, but incomplete cherry picked metric. N+3 reaches the density of TSMC N6 through aggressive DUV multi-patterning and design-technology co-optimization (DTCO), but it pays for that in complexity, efficiency and process control. We found this and more in our reverse engineering and teardown where we cover SMIC’s N3 process technology, Huawei’s packaging, memory, architecture, and more. SemiAnalysis has been building a state-of-the-art teardown lab in Oregon capable of analyzing the world’s most advanced and important chips over the last year and half. We have already generated revenue on advanced datacenter chip teardowns including our recent reverse engineering of a major TSMC customer’s COUPE CPO optical engine + EIC 3D stack. This is the first public report from the SemiAnalysis Teardown Engineering & Evaluation Lab, or STEEL for short. The lab is aggressively scaling up and out and we’re excited to announce it publicly. This is a bit of inconvenient timing for TechInsights as they are private equity owned and currently being sold while having enjoyed virtually no credible competition for decades. This has led to TechInsights underinvesting in CAPEX. SemiAnalysis exceeds TechInsights in revenue despite no venture or private equity ownership and being founded only 6 years ago. Because we have no external investors and are founder led, we move faster, build faster, and we can release client chip teardowns for free regularly, while focusing on datacenter for our major clients. Here’s the first public image from our lab, the HiSilicon Kirin 9030 Pro SoC: This report will detail our teardown of the Kirin 9030 and our findings on SMIC’s N+3 process, the most advanced in China. For comparison, we’ll show our teardown of the MediaTek Helio G99, made on TSMC N6. Through this comparison, we can look at the effect of export controls – SMIC N+3 and TSMC N6 are comparable nodes, but one is heavily export-controlled, the other free to use the West’s most advanced equipment. Here we see both China’s progress and constraints. SMIC N+3 reaches TSMC N6-class logic density, but it requires far more aggressive DUV multi-patterning, so it does not match N6 on process maturity or cost. The Kirin 9030 Pro performs similarly to three-year-old Android flagships, and trails far behind the current flagship SoCs from Apple, Qualcomm, MediaTek, and Samsung. The efficiency gap is even wider. Export controls have not stopped Huawei and SMIC from shipping advanced silicon, but they have forced a different path. Without EUV, SMIC is leaning harder on DUV multi-patterning, DTCO, and increasingly complex integration. The roadmap continues forward through tighter design rules and backside power, but each step adds cost and process risk. Huawei’s τ scaling and LogicFolding show another path: stacking active logic and recovering density through advanced packaging and system-technology co-optimization (STCO). To understand the Kirin 9030, we must first understand Huawei’s SoC history. HiSilicon is Huawei’s chip design arm, responsible for the Kirin smartphone SoCs, Kunpeng server CPUs, Ascend AI accelerators, and switch/router networking silicon. Before export controls, Huawei was TSMC’s largest customer – the only customer on TSMC’s first EUV node, N7+, and among the first on N5, alongside Apple. That ended in late 2020. Huawei switched to Qualcomm SoCs in its flagship smartphones, though export controls limited them to 4G-only variants. In late 2023, Huawei returned to in-house silicon with the Kirin 9000s, a successor to the Kirin 9000, fabricated on SMIC N+2 instead of TSMC N5. In the following years, they released the Kirin 9010 and 9020 on the same N+2 process. These chips used Huawei’s in-house TaiShan CPU cores and Maleoon GPU. We have not torn down a Kirin 9020 ourselves, so the predecessor die shot is from Kurnal. The die shots show how Huawei spent its silicon budget: which functional blocks are where, and how their areas compare to the predecessor. First, a quick guide to the major blocks on the die. The total die area is nearly identical, but the 9030 uses that area more aggressively. A denser process lets Huawei fit an extra middle CPU core, more GPU and NPU cores, and larger caches into the same footprint. In contrast, the Helio G99 is a much smaller, low-cost SoC, built for budget smartphones rather than a flagship device. While the Kirin 9030 is ~140 mm², the G99 is only ~29 mm², roughly one-fifth the area. The underlying TSMC process technology, however, is directly comparable as a baseline for analyzing SMIC’s. The Kirin 9030 is an evolutionary refresh, not a clean-sheet design. Its CPU, GPU and NPU cores carry over the 9020’s families, and the gains come from three levers: the SMIC N+2-to-N+3 process step, DTCO and floorplan work, and incremental microarchitecture. Area is where the first two show up, and the 9030 scales well here. Performance and efficiency are the harder test. Huawei’s design holds up better than its node would suggest, but the chip still trails, both because N+3 sits behind the leading-edge nodes and because its cores, while competent, remain a few generations behind the newest designs. The new prime core is an incremental update. The main changes are a 10% frequency increase from 2.5 GHz to 2.75 GHz and a doubling in the L2 cache from 1 MiB to 2 MiB. Despite the increased cache, the core size decreased by 7.6%. Excluding the private L2 cache, the core size decreased by 21%. This is a large reduction for an incremental node. Compared with the TaiShan New V120 core in the Kirin 9020, the Kirin 9030’s middle core is almost unchanged architecturally, yet each core shrinks by ~22%. Most of that comes from the move from N+2 to N+3, with layout likely accounting for the rest. Visually, the most noticeable change is the increase from 3 middle cores to 4. There is also a 20% increase in the shared L3 cache of the big cluster. This helps to improve multi-core performance without sacrificing much in terms of area. Even with each core shrinking, the big CPU cluster’s total area is essentially unchanged. The per-core savings went back into an additional middle core and larger caches. The tiny cores shrank less than the prime core (excluding its L2 cache) and less than the middle cores. This is likely because fixed overhead is a larger share on a small core. We cannot resolve any architectural changes from the die shot alone, but the per-clock and efficiency gains shown below point to more than pure process and layout scaling. The area reduction was offset by a doubling of the shared L2 cache from 2 MiB to 4 MiB, leaving the total tiny CPU cluster area slightly larger. Area is the easiest improvement to see from a die shot, but it is only one part of PPA (power, performance, area). For modern logic, power and performance matter just as much, and often more. Since Dennard scaling broke down in the mid-2000s, voltage and frequency have not scaled in step with transistor dimensions, so each node has had to fight harder for gains in performance and efficiency. The starkest comparison is not Kirin 9020 versus Kirin 9030 Pro. Apple’s efficiency cores run circles around Huawei’s prime core. Apple’s low-power core delivers 20% higher integer performance while drawing only 1 W, compared with 4.5 W for Huawei’s prime core. N+3 matches TSMC N6, but N6 is several generations old. Apple and Qualcomm build on N4 and N3P, which are denser and sit on a better voltage-frequency curve, giving them a larger transistor budget and more performance per watt. The 9030’s own cores did improve. The middle and tiny cores gained 17% and 14% in per-clock integer performance over the 9020, with floating-point flat on the middle core and up 11% on the tiny. The tiny core improves cleanly, with performance rising while power falls and efficiency increases by 45% in integer and 24% in floating point. The middle core is mixed: integer performance rises but power rises faster, cutting integer efficiency by 7%, while lower power lifts floating-point efficiency 16%. Per-clock gains at the same or lower frequency are microarchitectural, so the cores are tuned, not just shrunk. Both also failed to hold their rated maximum frequencies, pointing to thermal, power, or stability limits. Per clock, the middle core sits around Arm Cortex-A720 and the tiny core near the Cortex-A520; absolute performance trails because Huawei clocks them much lower. The prime core is roughly Cortex-X2 class per clock, a 2021 design. Apple’s 2020 M1 Firestorm core is still 35% higher per clock and 57% faster in absolute integer performance at a similar 4.5 W. The current leading edge is further ahead again: the Apple M5 P-core is 60% higher per clock and 2.7× faster, the Arm C1 Ultra 45% higher and 2× faster. Matching older high-end cores per clock is a genuine design achievement. What Huawei cannot match is the voltage-frequency curve and transistor budget of leading-edge nodes, which let Apple, Qualcomm and others spend more transistors in the same area on wider cores, larger caches and deeper buffers while running at lower voltage. Huawei’s LogicFolding roadmap is one answer, stacking active logic to recover density and shorten signal paths. We return to it later. The GPU compute units (CUs) changed more visibly than the CPU cores, moving to a more rectangular layout for both the arithmetic logic unit (ALU) clusters and the CU overall. Even with ray-tracing support added, a CU shrank ~28%. However, that shrink is offset by the increase from 4 to 6 CUs and the area outside the CUs grew 33%. Overall, the GPU cluster is larger by ~10%. The GPU is where Huawei makes its biggest gains. The Maleoon 935 is not competitive with current flagships, but it is a large step up from the 920 and reaches older-flagship territory. In 3DMark it is 70% faster in Wild Life Extreme (WLE) and 79% faster in Steel Nomad Light (SNL) than the 920; with 11% higher clocks and 50% more CUs, the ~67% theoretical uplift roughly matches WLE and is beaten by SNL. It edges ahead of the Snapdragon 8+ Gen 1 in WLE and SNL, and the Dimensity 9200 and Apple A16 in WLE, but stays far behind newer parts: the Snapdragon 8 Elite Gen 5 and Dimensity 9500 are ~2.4–2.6× faster in WLE and ~3.2× faster in SNL. The Maleoon 935 is Huawei’s first GPU with hardware-accelerated ray tracing; there it lands slightly ahead of the Exynos 2200, and on par with the Apple A16, with current flagships up to 3.7× faster. The Neural Processing Unit (NPU) saw the largest structural changes of any block, moving from a Lite and a Tiny core in the Kirin 9020 to a Lite and two Tiny cores in the Kirin 9030. Both core types also show significant layout changes. This is a reversal in Huawei’s NPU design. The Kirin 9000 5G, its last flagship chip on TSMC N5, used two Lite and one Tiny core. The series of SoCs on SMIC N+2 moved to one Lite and one Tiny core, likely for area savings. With the Kirin 9030, Huawei has shifted back toward a larger multi-core NPU cluster, but with the additional area going to a Tiny core rather than a Lite core. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Before diving into the process stack, the package and memory are worth separating from the SoC itself. The Pro variant of the Kirin 9030 carries 12 GB of Samsung DRAM, with two stacks of four dies each. The dies were identified as the K4L2E165YD, a 12 Gb LPDDR5X-9600 device fabricated on Samsung’s 1a node, the fourth generation of its 10 nm-class DRAM after 1x, 1y and 1z. 1a has shipped in volume since 2022, so this is current memory rather than older-node inventory. The 16 GB Pro Max variants we obtained were found with both CXMT and Samsung packages. The CXMT package is marked CXDD7JEDM, with two stacks of four dies, packaged in week 45 of 2025. The inferred die dimensions from X-ray computed tomography (CT) are consistent with a known density of ~0.3 Gib/mm² for the CXMT G4 process, roughly equivalent to other manufacturers’ 1z processes. The Kirin 9030 uses a typical integrated package-on-package (iPoP) stack: multiple DRAM dies in a memory package sit above an organic redistribution layer (RDL) interposer, which sits above the SoC and package substrate. The full package is then mounted to the printed circuit board (PCB) through ball-grid array (BGA) solder bumps. The memory package substrate is a thin bismaleimide-triazine (BT) laminate carrying the LPDDR5X stack. The organic RDL interposer over the SoC routes the PoP signals around the die and carries possible dummy thermal copper pillars. The package substrate, a thicker Ajinomoto Build-up Film (ABF) build-up over a BT core, fans the flip-chip bumps out to BGA pitch and embeds the power planes. The whole stack is organic. The only silicon is the SoC and the LPDDR5X dies; there is no silicon interposer. Keeping it all-organic brings the package’s coefficient of thermal expansion (CTE) close to the PCB’s, reducing board-level warpage, and avoids the cost of a silicon interposer the SoC’s bandwidth does not need. In an iPoP stack, the memory package connects to the organic RDL interposer through an array of solder bumps. Underfill fills the gap around those bumps, adding stiffness and protecting the joints from mechanical stress. The Pro and Pro Max variants differ here, which we cover behind the paywall. The die shot and architecture tell us how Huawei allocated its silicon budget. The process tells us what SMIC can manufacture. We use the Helio G99 as the process reference for TSMC N6. Both SMIC N+3 and TSMC N6 are evolutions of previous 7 nm-class nodes. We used targeted TEM cross-sections through logic and memory regions, imaged in both fin-cut and gate-cut directions. Each cross-section caption gives its horizontal field width (HFW), the real width of the imaged area. We start at the transistor fins, then move up through standard cells, local interconnect, and SRAM. SMIC has not overtaken Intel or TSMC. It uses aggressive DUV scaling and DTCO to reach N6-class density, but that density doesn’t translate into comparable performance and efficiency, for two reasons: the node gap to leading-edge nodes, and Huawei’s core designs. Fin Profile One of the most important knobs in a FinFET process is the fin profile: the shape of an individual fin and the channel where current passes from source to drain. The ideal fin is tall, narrow, and nearly vertical. A taller fin increases effective channel width, while a narrower fin improves electrostatic control by thinning the body the gate must control. Push either too far, and the process pays for it: weaker drive current, fragile fins, taper, footing and line-edge variation that hit yield and device variability. The Intel 22 nm, 14 nm, and 10 nm fin cross-sections show how FinFET nodes have improved over time. 22 nm fins were a first-generation structure, relatively short, wide and strongly tapered. The shape limits current density and reduces gate control uniformity across the height of the fin. At 14 nm and 10 nm, Intel pushed the fins taller and narrower while also making the sidewalls more vertical. Rather than shrinking the device, these changes increase the effective channel width per fin and improve electrostatic control. The trade-off is that taller fins at tighter pitches are much more difficult to manufacture. Now, let’s compare the Helio G99 on TSMC N6 with the Kirin 9030 on SMIC N+3. Both processes are in the same class, with fin pitch of 30-32 nm on N+3 and 34 nm in our N6 cross-section. The pitch for N6 is especially interesting as N7’s HD library is generally listed with a 33 nm fin pitch, and N6 did not shrink pitches directly. Its density gains came from DTCO instead of tighter pitches. The 34 nm pitch was stable across our sampled region and serves more as a comparison against the SMIC N+3 we have not investigated further. Pinning down N+3’s fin patterning scheme takes more than one core unit. The CPU cores show a dense ~32 nm pitch, with the pitch between N-P fin pairs alternating between 78 and 88 nm. Logic alone may be consistent with dual-pitch mandrels of 120 and 110 nm, but this is a complex and unusual approach. Combining the pitch from the the 8T SRAM, which has more complex repeat unit, with the CPU core sequence allows us to reverse engineer the patterning steps with more confidence. As both the logic and SRAM should share the same base grid, a single CD mandrel lithography pattern with 128 nm pitch undergoing SAQP produces a die-wide ~32 nm grid (128 nm/4), which supports the pitch sequencing seen in both logic and SRAM cells. In the sampled cross-sections, N+3 shows a taller, narrower, higher-aspect-ratio fin than N6. The measured fin aspect ratio is ~9.5:1 on N+3 versus 7.8:1 on N6. N+3 also shows less top rounding, with an estimated radius of ~2 nm, compared with 2.8 nm on N6. Even though the fin widths differ, the ratio of top rounding to fin width tells the same story, with N+3 at 0.37 and N6 at 0.44. In a geometric sense, lower is better; a perfectly rectangular fin would have no top-rounding penalty. These are single-digit-nanometer features measured from a handful of cuts, so treat the absolute numbers as approximate. The important result is the relative gap: N+3’s fins are consistently taller, narrower and less rounded than N6’s. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Standard Cell A standard cell is the basic building block of chip layout: a fixed-height row pairing one NMOS and one PMOS transistor that share a gate, tiled in a grid to build logic blocks. The key dimensions are contacted gate pitch (CGP), cell height (CH), fin count, and the lower-metal routing grid. To measure density, we use the Bohr metric: a weighted average of NAND2 gate area (60%) and scan flip-flop area (40%). This represents a realistic mix of combinational and sequential logic. This metric has its limitations, especially for complex cell layouts like TSMC’s FinFLEX, which alternates cells with different fin counts. Even so, it is the best metric for a pure process-level comparison. Another important measurement is the fin pitch; it refers to the distance between two fins of the same transistor. In a FinFET process, multiple fins are used in each transistor to increase the drive current and thus performance. TSMC N6 ships both a high-density (HD) library with 2 PMOS and 2 NMOS fins per cell, and a high-performance (HP) library with 3 of each. More fins under the shared gate mean more effective channel width. HP cells switch harder at the cost of area. Designers mix the two on a die, primarily spending HP cells on timing-critical paths, and matching their PPA targets. In the Cortex-A55 core of the Helio G99, we found a cell height of 240 nm for the HD cell. MediaTek has used HD cells in the G99 to minimize die size and thus cost. As an SoC for budget smartphones at ~$100, this is essential. By contrast, we found only one library in the Kirin 9030, with 2 NMOS and 2 PMOS fins. This suggests a narrower library strategy than TSMC N6, where both HD and HP libraries are widely used. This likely reflects the smaller customer base and the more constrained domestic design and electronic design automation (EDA) ecosystem. In all three CPU cores of the Kirin 9030, we found cell heights of 228 nm, 5% smaller than on N6. This is also a reduction of 9.5% over SMIC N+2’s cell height of 252 nm. SMIC N+3 and TSMC N6’s HD library both feature a CGP of 57 nm. For SMIC, this is a 9.5% shrink over N+2. In the past, CGP and cell height alone may have been enough to compare transistor density. Now, however, we must consider scaling boosters and DTCO as well. SMIC’s density gain does not come from EUV. It comes from using every available DTCO booster aggressively. First is fin depopulation: reducing the number of NMOS and PMOS fins in each cell. The first FinFET nodes started with 3 or 4 fins for each transistor. SMIC N+3 and TSMC N6 HD both use only 2 fins per transistor, trading drive strength for density. Next is contact over active gate (COAG). By landing the gate contact directly over the active gate, instead of out over the isolation region, the cell height drops. N+3 integrates COAG while N6 does not. Our N+3 gate-cut cross-sections indicate COAG, with the gate contact sitting over the active region, while N6 shows an off-gate contact. Last is single diffusion break (SDB). Diffusion breaks are inserted between cells in the same row to provide electrical isolation, but they also introduce local layout effects (LLE), layout-dependent shifts in electrical characteristics. In the past, a double diffusion break was used, consuming the space of two CGPs. SMIC N+3 and TSMC N6 instead use SDB, saving area but increasing LLE sensitivity. This must be controlled at the process level and accurately modeled in the process design kit (PDK) so that EDA tools can account for it. Overall, SMIC N+3 has a transistor density of 113.4 MTr/mm², slightly above TSMC N6 at 107.7 MTr/mm². Even without EUV, SMIC has achieved density beyond TSMC’s mature N6 node which utilizes EUV. Metal Stack The smallest critical dimension in the teardown is M0; SMIC N+3 uses a 32.5 nm local metal pitch. That is smaller than the 36 nm M0 pitch on Intel 18A in Panther Lake. However, this does not mean that SMIC has a better process than Intel 18A or TSMC N3P. M0 is a local intra-cell routing layer. Its usefulness depends on the full interconnect stack: M1 and M2 pitch, track count, via and line resistance, design rules, mask count, overlay control, and routing flexibility. The 32.5 nm M0 is consistent with self-aligned quadruple patterning (SAQP), whose four-population line-width loading we read coarsely as alternating widths of 21.5 to 24 nm; M1 and M2, at 38 and 40 nm, are consistent with self-aligned double patterning (SADP), a single A/B split. On TSMC N6, M0, M2, and M3 sit at a relaxed ~40 nm and are consistent with SADP-class double patterning, with no need for quadruple patterning. That said, we measure M2 for example at ~43 nm, likely inflated by sparse routing. We do not assign any specific layer to EUV from our cross-sections; the distinction we can draw is double versus quadruple patterning, not lithography wavelength. Transistor-level density in the front-end-of-line (FEOL) sets an upper bound, but the design is ultimately limited by what the interconnect stack can route. The lowest metals are the most important for standard-cell density, but the semi-global and global layers determine how usable that density is at the block and chip level. Two axes are commonly used for chip cross-sections: the fin-cut and the gate-cut. The micrograph above is a fin-cut and shows metals 0 through 3. This axis lets us see the even-numbered metals, with M0 right above the fins. There are two kinds of M0 lines. The first are the power rails; these are wide wires for the VDD and VSS running horizontally at the top and bottom edges of each standard cell. The wide wires measure 55 nm across, more than double the other M0 lines. Their width minimizes resistance and reduces IR drop. The second kind are intra-cell wires, short segments within the cell that connect terminals to M1. These have alternating widths between 21.5 and 24 nm. The M0 pitch is 32.5 nm, a 19% reduction versus N+2 and N6. At this pitch, DUV patterning requires more aggressive multi-patterning, increasing mask count, overlay sensitivity, process complexity and cost. M0 is below what a single DUV-defined spacer (SADP) can resolve, so SMIC cascades a second spacer step (SAQP). The cross-section reflects the cost: the M0 trenches are visibly more re-entrant (narrower at the bottom than the top) than M1 or M2 on the same chip and carry a bright barrier-rich foot where the trench meets the etch-stop layer. That shape is partly the intended damascene profile, as a slightly narrow bottom helps void-free copper fill, but its magnitude at M0 is driven by the tight pitch and the higher trench aspect ratio. Intel 18A supports an M0 pitch of 32 nm, although Panther Lake has only shipped with a looser 36 nm pitch. This is due to Intel’s heavy usage of HP libraries. Among leading-edge nodes, 18A has the loosest M0 pitches due to PowerVia. With power routing moving to the backside, congestion is reduced, and the entire front-side metal stack can be used for signal routing. M2 is the first true inter-cell routing layer. It runs horizontally like M0 but spans across multiple cells to carry block-level signals. The M2 pitch sets the cell’s track height – the number of M2 tracks that fit between the VDD and VSS rails, defining what the library calls a 6-track or 7.5-track cell. This layer is the most important, limiting the routing of entire blocks. SMIC N+3 features a 5.7-track cell. The M2 pitch is 40 nm, a 5% decrease over N+2 and the same as N6. This shrink keeps the pitch at the edge of what is possible with double patterning. Future nodes will need to increase the number of masks for M2 as reducing the number of tracks is much harder due to the limitations in routing. The micrograph above is in the perpendicular direction, the gate-cut, and shows metals 0 through 4. This allows us to see and measure the odd-numbered vertical metal layers. The M1 pitch is 38 nm, 9.5% less than N+2 and 33% less than N6. The M1-to-gate ratio matters because it sets local routing flexibility. N+2 and N+3 use a 3:2 ratio, while N6 uses a 1:1 ratio, explaining the huge differences in M1 pitch. The more M1 lines there are compared with the gates, the more flexibility there is for power and signal crossing within the cell. Routing flexibility enables more complex and better cells. Clean fractional ratios are also preferred as a grid is periodic and improves layouts. The 3:2 ratio gives SMIC more local routing flexibility than a strict 1:1 grid, but it also complicates layout and patterning. This is a DTCO choice, with SMIC increasing process complexity to recover density and routability without EUV. This 3:2 ratio is not very popular in the leading-edge nodes. TSMC has only used it on N7+, the N5 family, and the short-lived N3(B). They have switched back to a 1:1 ratio for N3E. Intel has only used it on the 10 nm/Intel 7 family, with Intel 4, 3 and 18A all using a 1:1 ratio. Samsung is the only one still using a 3:2 ratio at the leading edge, using it in the SF4 and SF3 families. It remains to be seen if SMIC will remain at a 3:2 ratio or move to a 1:1 ratio with its future nodes. The industry is still actively exploring these local-routing ratios. At VLSI 2026, imec will be presenting work on even higher ratios, including a 2:1 scheme that can reduce area by up to 14%. We will be covering the conference in a future newsletter article. Subscribe We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. The final local interconnect layer for N+3 is M3, with a pitch of 44 nm. The M3 pitch is the same as on N+2 and 10% larger than on N6. The semi-global layers carry the majority of block-level signal routing. They have a coarser pitch than the lower local layers. On leading-edge nodes, they are designed to sit at the limit of DUV single patterning. M4 through M11 pitches were found divided between 80–82 nm (M4–M6), 128 nm (M7–M10), and 148 nm (M11). Given limited sampling, it is possible these are divided further in dense routing areas. At the top are two giant metal layers, M12 and M13. These have kept the same pitches as N+2 at 1920 nm and 4600 nm respectively. While the lower layers’ pitches are generally fixed by the process and library, the upper layers vary much more in pitch and count, depending on the design. Even two smartphone SoCs on the same process can have wildly different metal stacks. The Helio G99 carries fewer routing layers, reaching coarse metal pitches of 850 nm by M9, while the larger and higher-performance Kirin 9030 keeps fine pitches until M11. SRAM At the leading edge, SRAM is much more difficult to scale than logic. TSMC’s latest nodes have seen little to no bitcell scaling, while logic still has more DTCO levers to pull. While looking for other logic libraries in the GPU compute units, we stumbled upon the SRAM. The most common type of SRAM has 6 transistors (6T), but this cell had 8 transistors (8T) instead. 8T SRAM adds two transistors to form a dedicated read port. Unlike a 6T cell, where reading disturbs the storage, the decoupled read port removes read-disturb, improving read stability and letting the cell be pushed harder for performance. At first glance, the cut looked like an unusual logic library, with each cell row having 3 fins of one polarity and 5 fins of another. The rows also alternated in orientation. Energy-dispersive X-ray spectroscopy (EDS) resolved our confusion. The cut had not landed on the GPU logic, but on the SRAM macro beside it. The unusual fin pattern was due to the SRAM library. We return to EDS in the process flow analysis behind the paywall. SRAM libraries are not like traditional logic libraries. Due to the unequal number of PMOS and NMOS transistors, they require specialized rules and layout libraries. They do not need the flexibility of logic libraries, so they are hyper-optimized for one purpose: dense, reliable memory. The SRAM cell we found is a 1:2:2-2:2 cell. This means there is 1 fin per pull-up (PU) PMOS transistor, and 2 fins per pull-down (PD) and pass-gate (PG) NMOS transistor. These 2 PU, 2 PD and 2 PG transistors would usually form a single 6T high-current cell (HCC). An 8T HCC adds a read-pull-down (RPD) and a read-pass-gate (RPG) NMOS transistor, each with two fins. We measured a cell height of 406 nm, which brings the bitcell size to 0.0463 µm². That is a theoretical peak density of 21.6 Mib/mm². We estimate that a 6T HCC would have a cell height of 292 nm and a size of 0.0337 µm². This is ~12% larger than a 6T HCC on Intel 3 and 4. We also estimate the 6T high-density cell (HDC) to have a cell height of 228 nm and a size of 0.0260 µm². This is coincidentally the same as the logic standard-cell height measured earlier. The estimate puts the cell near Samsung 7LPP/5LPP and slightly below TSMC N7/N6. That is a theoretical peak density of 38.5 Mib/mm². 6T HDC is arguably the most important cell as it is used for the largest caches in a chip, the L3 caches and system-level cache (SLC). Both the Kirin 9020 and 9030 have split the SLC into 4 banks to raise total SLC bandwidth. In the Kirin 9030, the SLC increased from 2 MiB to 3 MiB per bank. Correspondingly, the number of arrays within the bank also increased by 50%, from 16 to 24. Each array can store 128 KiB and forms an orderly pattern on the die shot. From the Kirin 9020 to the Kirin 9030, the area of a 128 KiB SLC array decreased from 0.0477 mm² to 0.0392 mm², an 18% shrink. The achieved density is 25.5 Mib/mm², 66% of the theoretical maximum. While the SLC was quite similar across both chips, the L3 has seen some major changes, particularly in terms of its layout. The total capacity also went up from 10 MiB to 12 MiB. Much like the SLC, the L3 is also split into 4 banks. In the Kirin 9020, an L3 bank consisted of 16× 128 KiB arrays and 16× 32 KiB arrays. However, an L3 bank in the Kirin 9030 instead consists of 48× 64 KiB arrays. In the Kirin 9020 L3, a 128 KiB array was 0.0513 mm² and a 32 KiB array was 0.0154 mm². The size of the 128 KiB array is different on the L3 and SLC as the assist circuitry for the two arrays differs depending on their purpose. In the Kirin 9030 L3, a 64 KiB array is 0.0210 mm². Although not a like-for-like comparison, normalized for capacity, it is 18% smaller than the 9020’s 128 KiB L3 array and 31% smaller than its 32 KiB L3 array. The achieved density is slightly lower than the SLC, at 23.8 Mib/mm², 62% of the theoretical maximum. Unlike the L3 and SLC, the prime cores’ private L2 cache uses a 2-bank design. As the prime cores’ L2 is latency-critical, it likely uses 6T HCC instead of 6T HDC. The 9020 has 16 arrays in each bank while the 9030 has 32. Each array has a capacity of 32 KiB. A 32 KiB array in the L2 shrank from 0.0171 mm² to 0.0142 mm², ~17% smaller. The density is 17.6 Mib/mm², ~59% of the theoretical maximum for 6T HCC. SRAM scaled well from N+2 to N+3, shrinking by ~19%, close to the theoretical logic shrink. The caveat is that N+2’s bitcells were unusually large, bigger than comparable 7 nm-class nodes, so part of the gain is catch-up rather than true scaling. With the insights from STEEL’s teardowns, we will be doing a deep dive into SRAM in a future newsletter article. Subscribe Everything above came out of a single STEEL teardown: die annotation, block-level area analysis and TEM cross-sections through logic and SRAM. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Future Roadmap The same cross-sections that pin down N+3 also show where SMIC can go next. Although N+3 is already close to the practical limits of DUV multi-patterning in several layers, SMIC still has a few scaling levers left. A theoretical N+4 would likely start with cell height. N+3 uses 5 M0 tracks between its power rails. Moving to 4 M0 tracks, as on SMIC N+2 and TSMC N6, could reduce cell height by roughly 15%. The routing grid is only one side of the shrink; the front end also must fit into the smaller cell. One possible FEOL lever is reducing the p-to-n isolation spacing from two diffusion grid units to one. Intel used this scaling booster on Intel 4, and TSMC did so on its N3 family. This path trades layout flexibility for density. Fewer M0 tracks reduce local routing resources, while tighter p-to-n spacing raises integration and design-rule difficulty. M2 is also constrained by the cell height shrink. For SMIC to maintain a ~5.7-track cell, M2 would need to move toward ~35 nm. That would move another layer into SAQP territory. SMIC could also reduce the CGP from 57 nm to 54 nm. Intel reached a similar CGP on Intel 10 nm/Intel 7 without EUV. The local interconnect is also tougher. If SMIC keeps the 3:2 M1-to-gate ratio, M1 would need to shrink to 36 nm and would likely require SAQP as well. If SMIC moves to a 1:1 ratio, M1 could relax to 54 nm, but it would give up routing flexibility. Under this theoretical path, we estimate that SMIC N+4 could reach a cell height of 198 nm and a CGP of 54 nm, implying a Bohr density of 137.8 MTr/mm², on par with TSMC N5 or Samsung SF4. However, the difficulty is cumulative. Each step is individually plausible, but together they make N+4 harder than the transition from N+2 to N+3. It will likely take longer, cost more, and carry less process margin. A theoretical N+5 would require a larger integration shift. One possible path is backside contacts (BSCon), moving power routing and source/drain contacts to the backside, which would reduce front-side routing pressure and enable another reduction in cell height. The front-side metal pitches could relax to reduce the process complexity. M0 would likely relax slightly to ~34 nm, and M2 and M4 pitches could relax further. CGP is unlikely to shrink much further. Even with EUV, 48 nm has been the practical limit for yield and process control. This approach would allow N+5’s cell height to fall to 170 nm and its CGP to 53 nm. This implies a Bohr density of 163.6 MTr/mm², on par with Intel 18A’s HP library. However, this would not make N+5 cost-competitive with the leading edge. It would reach a similar density through a much more expensive route. The integration difficulty rises sharply, with new process flows for backside alignment, wafer thinning, contact reveal, and backside metallization. Past this point, standard density and interconnect scaling become increasingly unattractive. That is where Huawei’s roadmap stops looking like a normal foundry roadmap and starts looking like a packaging roadmap. At ISCAS 2026, Huawei unveiled its tau (τ) scaling law, reframing process scaling in the time domain. τ is the time cost of data movement and processing: switching delays in transistors, RC signal propagation delays in circuits, compute, memory, and networking latency. Outside Huawei’s terminology, this is called system-technology co-optimization. This is Huawei’s answer to its lack of EUV lithography. Without EUV, planar density cannot keep pace with TSMC, Intel, or Samsung. If transistor density cannot shrink further, Huawei’s alternative is to shorten wires, reduce buffering, and stack logic vertically. “LogicFolding”, Huawei’s implementation of this new scaling idea, is, in practice, an aggressive 3D stacking approach. AMD V-Cache places SRAM above or below a CPU die. AMD’s MI350X places active interposer dies (AIDs) underneath accelerator and compute dies (XCDs), with the AIDs handling cache, IO interfaces, the network-on-chip (NoC) and embedded metal-insulator-metal (MIM) capacitors. With LogicFolding, parts of the same logic block are split across multiple active dies bonded face-to-face at ultra-fine pitch. This allows Huawei to shorten some critical paths and reduce buffer overhead, not merely add cache capacity or offload the IO and interconnect. Shortening wires is where the higher clocks come from. A large share of a modern core’s delay and energy budget goes into driving long interconnects and the repeater buffers along them. LogicFolding distributes a block’s critical-path gates across multiple stacked tiers bonded at a very fine pitch, so the bond interface behaves like an additional metal layer and the longest paths get shorter. That is how Huawei expects to recover frequency and efficiency it cannot get from the process alone. Huawei’s roadmap shows its intent. Prime core frequency is targeted to rise from 2.75 GHz in the Kirin 9030 to roughly 5 GHz by 2031, far beyond what planar scaling alone could deliver. Prime cores with 3.1 and 3.39 GHz clocks are being tested in its labs, although their power consumption is unknown. Beyond that, chips are in the design, simulation or pathfinding phase, meaning the frequencies are targets. However, the direction matters more: LogicFolding also helps with performance, not just density. The catch is that Huawei’s density claim is not directly comparable to foundry densities. A stacked design can report more transistors per package footprint by adding active layers, even if each patterned die remains well behind TSMC or Intel in front-end density. This is how Huawei can claim to reach foundry 14A-equivalent density by 2031. This is not a like-for-like foundry comparison, with Huawei using stacked logic and measuring density per package footprint. On a normalized Bohr-density basis, SMIC N+3 is ~114 MTr/mm², 38% less than Intel 18A’s HD library. Huawei’s 3D roadmap closes the gap by stacking active logic, reaching 215 MTr/mm² by 2030. In 2031, the roadmap density jumps to 295 MTr/mm², implying either a third active layer, partial EUV insertion or aggressive planar DUV scaling. Huawei’s methodology makes other foundries look much denser as well. Applying it to AMD’s MI450X with an N2 top die on an N3P base die yields a theoretical density of 460.2 MTr/mm² in 2026, compared with Huawei’s 295 MTr/mm² in 2031. This Kirin 9030 does not use LogicFolding, remaining in a conventional mobile SoC package. Instead, it forms the baseline for how far Huawei and SMIC can push planar scaling. Future teardowns of Kirin and Ascend chips will show both planar logic density and Huawei’s hybrid bonding solutions. Export controls changed China’s optimization problem rather than ending it. EUV restrictions raised the cost and complexity of leading-edge manufacturing without freezing it. SMIC reaches N6-class logic density through DUV immersion, SAQP and DTCO, while Huawei shifts more of the burden onto architecture, packaging and system-level integration. Future nodes will be tougher. N+3 still had room to tighten local metals and reduce cell height and CGP. Further scaling without EUV leaves fewer levers. More aggressive multi-patterning adds masks and overlay error. SMIC can keep pushing DUV, but each step will get more expensive and less forgiving. The design side is just as critical. Huawei had domestic EDA tools and flows before the Kirin 9030, with the Kirin 9000s, 9010 and 9020 making that clear. Huawei was able to ship multiple consumer SoCs on SMIC N+2 and N+3 while cut off from the Western EDA stack. US export controls restricted EDA tools for advanced chips in 2022 but did not target tools for more mature chips. In 2025, the US government briefly placed much broader restrictions on EDA software from Synopsys, Cadence, and others, before lifting them less than two months later as part of a trade deal tied to rare earths. Huawei has been unable to access those tools because it remains on a US trade blacklist. That forced Huawei, SMIC and Chinese academic institutions to build their own tools and flows. Researchers at Peking University recently announced a prototype EDA tool for Huawei’s LogicFolding architecture, which requires a new flow to handle the multilayer layout and floorplan. This is not the same as replacing the full Synopsys or Cadence stack, but it shows where domestic EDA is headed: toward tighter co-optimization between architecture, process and packaging. These advances are also diffusing into the Chinese ecosystem. SMIC is licensing its N+2 and N+3 processes to HLMC/Hua Hong at the government’s direction rather than by choice. If the same process learning feeds into Ascend accelerators for AI training and inference, the choke point shifts from one named fab to an ecosystem. Alibaba’s T-Head silicon arm and Cambricon, a Chinese AI chip designer that is expected to supply ByteDance, could also be major beneficiaries. Sanctions aimed at SMIC alone become less effective once the manufacturing knowledge has spread to other fabs and design houses. China is not closing the gap with Intel, Samsung and TSMC. The teardown shows the opposite in several places: no EUV, no backside power, higher process complexity, and visible trade-offs. But China is still advancing. If domestic chips become good enough for phones, inference, networking and security-sensitive workloads, they can matter strategically without matching TSMC at the leading edge. Behind the paywall, we show what else STEEL can do, with material and process flow analysis of SMIC N+3, and analysis of the Kirin 9030 package. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline, access the full Kirin 9030 and SMIC N+3 analysis or to commission a custom teardown, contact sales@semianalysis.com.
WHO urges targeted action to strengthen emergency workforce capacities for shared health risks across the Asia-Pacific region
At a time when the world is more interconnected than ever, the World Health Organization (WHO) is disseminating a comprehensive regional analysis of shared health risks across Asia and the Pacific, urging Member States to invest in enhancing workforce capacities regionwide to mitigate these risks and ensure health systems are better prepared to anticipate, tackle and withstand a range of crises and shocks. Over 100 delegates from 49 countries and areas in the Asia-Pacific region reviewed results from the regional risk analysis during the WHO-led Asia Pacific Health Security Action Framework (APHSAF) Stakeholders Meeting in Malaysia. Synthesizing insights from 21 strategic risk assessments and more than 800 multisectoral experts, the regional analysis highlighted an urgent imperative: countries must proactively invest in emergency workforce preparedness to navigate a landscape where climate hazards, disease outbreaks and geophysical events increasingly overlap. These complex converging crises create devastating, compounding impacts on health systems and communities – reiterating the need for investing in a fit-for-purpose regional health workforce and multisectoral action.Key findings: an evolving risk landscape More than half of the participating countries ranked flooding, cyclones, dengue and pandemic-potential respiratory pathogens as being of high or very high risk, while antimicrobial resistance, landslides and gastroenteritis remain widespread concerns as well. “Given that 51% – over half – of these assessed hazards are deeply interconnected, isolated health interventions are no longer sufficient,” said Dr Saia Ma’u Piukala, WHO Regional Director for the Western Pacific. “Extreme weather events like cyclones and floods directly trigger subsequent disease outbreaks, while environmental degradation – driven by sea-level rise, coastal erosion and saltwater intrusion – fuels health risks across the Pacific. Mitigating these cascading risks requires unified, cross-sectoral action linking environmental, agricultural and public health policies to build true regional resilience.” Priority recommendations for action To address critical vulnerabilities, WHO calls on Member States in the Asia-Pacific region to urgently prioritize the following strategic actions: Bridge workforce capacity gaps. Embed and standardize emergency preparedness within academia to promote regional workforce interoperability. Foster multisectoral coordination. Address ad-hoc taskforce responses and fragmented surge support through formalized contingency plans and standard operating procedures that are frequently updated and tested. Secure sustainable financing for emergencies. Overcome systemic barriers to access dedicated funding for both immediate anticipatory actions and long-term emergency preparedness initiatives. Enable emergency-ready primary health care. Embed emergency management into public health workforce readiness planning. Ensure that emergency planning is inclusive. Establish clear pathways for inclusive emergency planning that actively involves communities most at risk and other vulnerable groups. Optimize communication. Update risk communication and community engagement strategies, aligning them with seasonal risk calendars. Elevating workforce readiness to meet regional health risks While the gaps identified are significant, the Asia-Pacific region possesses solid foundational pillars, including dedicated clinicians, laboratory staff, rapid response teams, emergency medical teams and extensive community networks. However, to adequately address the compounding nature of modern crises, the various components of the emergency workforce must collaborate cohesively. True resilience depends entirely on transforming this currently fragmented workforce into a highly trained, interconnected and rapidly deployable asset. To achieve this, WHO is actively advancing regional workforce capacities through the Global Health Emergency Corps initiative. This initiative – supported by the Gates Foundation and the Institute of Philanthropy – seeks to build a seamless network of emergency workforce across borders and sectors, ensuring that when a crisis strikes, a standardized, well-coordinated and trained workforce is immediately ready to respond. “Scaling up emergency workforce readiness is no longer optional,” said Dr Gina Samaan, Regional Emergency Director for WHO in the Western Pacific. “It is the definitive factor that will determine how effectively the Asia-Pacific region safeguards health and protects lives in an increasingly unpredictable future.” ____________________For more information, or to arrange media interviews, contact: Ara Johannes, WHO Western Pacific Health Emergencies Division: johannesa@who.int WHO Western Pacific Communications: wprocom@who.int
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Advancing Community Health Requires Whole-Person Care
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WHO urges targeted action to strengthen emergency workforce capacities for shared health risks across the Asia-Pacific region
Kuala Lumpur, Malaysia, 11 June 2026 – At a time when the world is more interconnected than ever, the World Health Organization (WHO) is disseminating a comprehensive regional analysis of shared health risks across Asia and the Pacific, urging Member States to invest in enhancing workforce capacities regionwide to mitigate these risks and ensure health systems are better prepared to anticipate, tackle and withstand a range of crises and shocks. Over 100 delegates from 49 countries and areas in the Asia-Pacific region reviewed results from the regional risk analysis during the WHO-led Asia Pacific Health Security Action Framework (APSHAF) Stakeholders Meeting in Malaysia. Synthesizing insights from 21 strategic risk assessments and more than 800 multisectoral experts, the regional analysis highlighted an urgent imperative: countries must proactively invest in emergency workforce preparedness to navigate a landscape where climate hazards, disease outbreaks and geophysical events increasingly overlap. These complex converging crises create devastating, compounding impacts on health systems and communities - reiterating the need for investing in a fit-for-purpose regional health workforce and multisectoral action. Key findings: an evolving risk landscape More than half of the participating countries ranked flooding, cyclones, dengue and pandemic-potential respiratory pathogens as being of high or very high risk, while antimicrobial resistance, landslides and gastroenteritis remain widespread concerns as well. “Given that 51% - over half - of these assessed hazards are deeply interconnected, isolated health interventions are no longer sufficient,” said Dr Saia Ma’u Piukala, WHO Regional Director for the Western Pacific. “Extreme weather events like cyclones and floods directly trigger subsequent disease outbreaks, while environmental degradation - driven by sea-level rise, coastal erosion and saltwater intrusion - fuels health risks across the Pacific. Mitigating these cascading risks requires unified, cross-sectoral action linking environmental, agricultural and public health policies to build true regional resilience.” Priority recommendations for action To address critical vulnerabilities, WHO calls on Member States in the Asia-Pacific region to urgently prioritize the following strategic actions: Bridge workforce capacity gaps. Embed and standardize emergency preparedness within academia to promote regional workforce interoperability. Foster multisectoral coordination. Address ad-hoc taskforce responses and fragmented surge support through formalized contingency plans and standard operating procedures that are frequently updated and tested. Secure sustainable financing for emergencies. Overcome systemic barriers to access dedicated funding for both immediate anticipatory actions and long-term emergency preparedness initiatives. Enable emergency-ready primary health care. Embed emergency management into public health workforce readiness planning. Ensure that emergency planning is inclusive. Establish clear pathways for inclusive emergency planning that actively involves communities most at risk and other vulnerable groups. Optimize communication. Update risk communication and community engagement strategies, aligning them with seasonal risk calendars. Elevating workforce readiness to meet regional health risks While the gaps identified are significant, the Asia-Pacific region possesses solid foundational pillars, including dedicated clinicians, laboratory staff, rapid response teams, emergency medical teams and extensive community networks. However, to adequately address the compounding nature of modern crises, the various components of the emergency workforce must collaborate cohesively. True resilience depends entirely on transforming this currently fragmented workforce into a highly trained, interconnected and rapidly deployable asset. To achieve this, WHO is actively advancing regional workforce capacities through the Global Health Emergency Corps initiative. This initiative - supported by the Gates Foundation and Institute of Philanthropy - seeks to build a seamless network of emergency workforce across borders and sectors, ensuring that when a crisis strikes, a standardized, well-coordinated and trained workforce is immediately ready to respond. “Scaling up emergency workforce readiness is no longer optional,” said Dr Gina Samaan, Regional Emergency Director for WHO in the Western Pacific. “It is the definitive factor that will determine how effectively the Asia-Pacific region safeguards health and protects lives in an increasingly unpredictable future.” For more information, or to arrange media interviews, contact: Ara Johannes, WHO Western Pacific Health Emergencies Division: johannesa@who.int WHO Western Pacific Communications: wprocom@who.int
World Food Safety Day 2026: EFSA advancing safer food through science
Every year, unsafe food causes illness, long-term health problems and economic harm for millions of people worldwide. World Health Organization estimates that contaminated food causes 866 million illnesses and 1.52 million deaths annually, affecting nearly one in nine people globally. For World Food Safety Day on 7 June 2026, EFSA is reaffirming its commitment to turning scientific evidence into safer food for everyone.
DPH Hosts Fourth Annual Advancing Healthy Lifestyles Conference
DOVER, DEL. (June 4, 2026) — The Physical Activity, Nutrition, and Obesity Prevention Program (PANO) of the Delaware Division of Public Health (DPH) brought together hundreds of leaders, advocates, and practitioners for its fourth annual Advancing Healthy Lifestyles Conference, on June 4, at the Bally’s Dover Casino Resort. It was a full day focused on […]
Intermountain Health and Larry H. Miller Utah Summer Games Announce New Partnership to Support Athlete Health and Community Wellness
CEDAR CITY – Intermountain Health and the Larry H. Miller Utah Summer Games, an outreach department of Southern Utah University, today announced a new partnership that will position Intermountain as the Official Health Partner and Medical Provider of the Games, strengthening support for athletes while advancing health, wellness, and community ...