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Prime Day 2026: Best Early Apple Device and Accessory Deals Now Live
Amazon is soon to be back with its annual summertime Prime Day event, lasting for four days from June 23-26, one of the longest Prime Day events yet. As it does every year, Prime Day offers shoppers a huge selection of deals across Amazon's storefront, and there are already many deals you can get on sale ahead of the event. Note: MacRumors is an affiliate partner with Amazon. When you click a link and make a purchase, we may receive a small payment, which helps us keep the site running.
iPhone 18 Pro: Six new features are coming this fall
Here are six new features rumored for the iPhone 18 Pro and Pro Max, which are expected to launch this fall.
Jelly Roll breaks silence on Bunnie Xo divorce mid-concert: 'I wasn't going to talk about it tonight'
Jelly Roll broke his silence on his divorce from Bunnie Xo mid-concert. His comments come days after news broke that the country artist filed for divorce from the podcaster.
JFK. Jr liked when Carolyn Bessette 'got all the attention,' author says
John F. Kennedy Jr. liked when Carolyn Bessette 'got all the attention,' author Pamela Keogh says. But when Bessette was advised on how to win over paparazzi, the former Calvin Klein publicist replied, 'I hate those bastards.'
Carmen Electra reveals why she loves the Prince diss track that 'everyone knows is written about me'
Carmen Electra is looking back on her relationship with Prince, from their brief love affair, to the album they made together in 1993, to the diss track she swears 'everyone knows' was written about her.
Harvard Business Review Brings Back The World’s Dumbest Idea
HBR revives “maximizing shareholder value”—the dumbest idea in the world—treating customers as mere constraints. True value creation for customers, not metrics, wins long-term.
iPhone 18 Pro and Pro Max: smaller Dynamic Island, new camera, and 4 more upgrades could come at a higher price
A next-gen 2nm A20 Pro chip, brand-new Siri AI features, and fresh colorways could headline this September’s release.
Bunnie Xo says she and Jelly Roll are 'still having a baby together,' despite divorce
Jelly Roll filed for divorce from Bunnie Xo in May, but she says they're still having a baby together
WCC publishes “HIV and Mental Health: What Can the Church Do?”
The World Council of Churches (WCC) has published “HIV and Mental Health: What Can the Church Do?” by Dr Sue Parry, a practical and theologically grounded resource for congregations ready to respond to one of the most complex pastoral challenges of our time.
Comedian Carlos Mencia arrested on 12 tax-related felony charges in Los Angeles
'Mind of Mencia' star Carlos Mencia is accused of being 'one of California's biggest tax scofflaws,' after allegedly failing to report over $8 million in income.
NYPD mistakes Knicks player for a fan, tries to kick him out of championship parade
Awkward. Police didn't recognize point guard Tyler Kolek at the event celebrating the New York Knicks' big win.
Stephen Colbert wears tan suit to Obama Presidential Center opening, winking at 2014 White House fashion controversy
Stephen Colbert wore a tan suit to the Obama Presidential Center opening, calling back to the controversy surrounding Barack Obama wearing a tan suit to a press conference in 2014.
JD Vance says 'The View' host Joy Behar is 'way tougher than the Iranians'
JD Vance says he's confident about ongoing negotiations with Iran after his recent visit to 'The View,' adding, 'Joy Behar is way tougher than the Iranians.'
PAHO Executive Committee concludes 178th session with key decisions to strengthen health across the Americas
Washington, D.C., 18 June 2026 (PAHO) – The 178th Session of the Executive Committee of the Pan American Health Organization (PAHO) concluded today after four days of discussions on the Region's most pressing public health priorities, with Member States approving a series of strategies, plans of action and resolutions that will help strengthen health systems, improve preparedness for health emergencies, and expand access to essential health services across the Americas.
Planned 'Police Academy' reboot starring Key and Peele was canceled after Michael Brown killing in Ferguson
Ike Barinholtz says he was writing a new 'Police Academy' film for Keegan-Michael Key and Jordan Peele, until Michael Brown was killed in Ferguson, Mo.
NFL Trade Rumors: Eagles “nuclear hot” for Maxx Crosby?
Never say never but this doesn’t seem realistic.
Seth Meyers reminds Donald Trump that the Reflecting Pool is not, in fact, a swimming pool: 'This isn't your chintzy golf club'
The 'Late Night With Seth Meyers' host reminded Donald Trump on Wednesday night that the Reflecting Pool is not a swimming pool. Meyers' quip comes amid costly renovations made to the water feature and comments the president made likening it to a pool at one of his clubs.
Clarinda Business Park Earns Iowa Certified Site Designation
The Hugh and Maxine Loudon Business Park in Clarinda has earned an Iowa Certified Site designation through IEDA's Certified Sites program.
iPhone 18 Pro is getting larger camera bump per leaks, here’s why
iPhone 18 Pro and Pro Max’s camera bump is expected to get even larger this year, with thicker lenses and aluminum plateau. Here’s why.
Jimmy Kimmel has proof world leaders ‘hate’ Trump: ‘Saddest photo I’ve ever seen’
Jimmy Kimmel is presenting photographic evidence that world leaders 'hate' Trump after his 'increasingly childish behavior' at the G7 Summit.
Arsenal Capital Partners Adds Max Schechter as Head of Industrial Growth Business Development
/PRNewswire/ -- Arsenal Capital Partners ("Arsenal"), a middle-market private equity firm specializing in building industrial growth and healthcare companies,...
Ethan Zohn reveals he tried to get cannabis use approved for 'Survivor'
'Survivor' star Ethan Zohn reveals he tried to get cannabis use approved for the 'Winners at War' season, but was denied for one very specific reason.
Analyst Perspectives on Oracle’s Strategy to Help Customers Secure Business Data against AI Threats
Oracle today announced its AI security strategy based on three principles: secure at source, secure at speed, and secure through resilience. To help customers accelerate and strengthen their security posture Oracle is making several of its most widely deployed and battle-tested database security, patching, testing, and lifecycle management tools available at no cost for a limited time, or at a 90% discount on one-year term licenses. This move has been positively received by leading industry analysts and reaffirms Oracle’s leadership in equipping enterprises to maximize their resilience in the face of increasing AI-era security threats.
Stephen King shares his thoughts on 'Widow's Bay' and 'Maximum Pleasure Guaranteed'
Two reviews for the price of one.
12 Reasons to Wait for the iPhone 18 Pro
We're only three months out from the launch of Apple's premium next-generation smartphone lineup, and while we're not expecting a sea change in terms of functionality, there are still several enhancements rumored to be coming to the iPhone 18 Pro and iPhone 18 Pro Max. One thing worth noting is that Apple is reportedly planning a major change to its iPhone release cycle this year, adopting a two-phase rollout starting with the iPhone 18 series.
The Sperm-Maxxing Bros Are Actually Onto Something
Wellness influencers have stumbled onto a huge issue when it comes male fertility, though not every solution they're pitching is good advice.
'Survivor' animated movie is in the works
'Survivor' animated movie in the works, host Jeff Probst announces: "But this time, the players aren't humans."
'Dancing With the Stars' announces beloved late-night personality as newest competitor
'Dancing With the Stars' is dipping into the late-night pool for season 35, as the show announced this talk-show mainstay as the newest competitor to join Maura Higgins, Ciara Miller, and more.
Netflix cancels the Duffer Brothers-produced 'The Boroughs' after 1 season
Less than a month after premiering, the sci-fi series 'The Boroughs' has been canceled.
Anya Taylor-Joy says it's 'difficult' to talk honestly about working with George Miller on 'Furiosa'
Anya Taylor-Joy said that it's "difficult" to speak about working with George Miller on 'Furiosa: A Mad Max Saga.'
'24' star Elisha Cuthbert explains why she took years-long break from acting
'24' and 'Girl Next Door' actress Elisha Cuthbert opens up about her Hollywood return after a years-long break from acting.
Report: Redundancies at Microsoft owned Zenimax have begun
It is reported that redundancies have begun at Zenimax, the umbrella company that includes Bethesda, ID, Arkane and others.
904th Contracting Battalion demystifies federal acquisition for Savannah area small businesses
FORT STEWART, GA-The 904th Contracting Battalion recently executed a federal contracting workshop in partnership with the Savannah Chamber of Commerce....
Spider-Man faces off against the Hulk in 'Brand New Day' trailer: 'Didn't know you could get that big'
Is your Peter tingle activated? Spider-Man finds himself going up against the Hulk in the newest 'Brand New Day' trailer.
Mikayla Matthews Shares How She Snacks to Satisfy ‘Cravings’ Amid Her ‘Long Health Journey’ With Chronic Illness (Exclusive)
Mikayla Matthews shares how chronic health issues have shaped her snacking habits, work and family life while discussing her Snackish partnership.
Michigan Lawmakers Take Up Bill To Cap Marijuana Business Licenses As Industry Reels From Tax Increase
“We are doing our best to create the right regulatory scheme to be able to adequately enforce the market.” By Ben Solis, Michigan Advance The Michigan Senate is refocusing its marijuana industry license cap legislation to include new barriers to obtaining a license for growers, processors or dispensary operators with outstanding industry-related tax debt—a move […]
Earliest outbreak of the plague killed hunter-gatherer kids 5,500 years ago
Scientists have solved a mystery that puzzled them for decades: Why were so many dead children buried by hunter-gatherers in Russia 5,500 years ago? It turns out they were killed by the earliest known outbreak of the plague, revealing new insights about the disease.
Olivia Wilde knew her relationship with Jason Sudeikis was over when he asked her this
Filmmaker and actress Olivia Wilde said that she knew her relationship with ex-fiancé Jason Sudeikis was over when he asked her this cutting question.
Depression screening using video games
Game-like tasks to measure the unconscious way the brain assesses rewarding experiences could help doctors screen patients more quickly for depression.
'Lilo & Stitch' and 'The Ring' star Daveigh Chase dies at 35: report
Daveigh Chase, the former child actress who voiced Lilo in 'Lilo & Stitch' and portrayed the central young ghost in 'The Ring,' has reportedly died at 35.
SanDisk’s new PlayStation 5 SSD will cost you more than three PS5 Pros
You can max out your PS5 Pro’s storage for the price of three consoles.
Jelly Roll’s daughter speaks out on his divorce from Bunnie Xo
Jelly Roll's daughter, Bailee Ann, broke her silence on his split from Bunnie Xo, sharing she is 'disgusted by how invested' people are in the personal matter.
Can Your Scalp Health Predict How Well You're Aging?
The scalp undergoes age-related changes just like any other part of the body. However, scalp health can't reveal much about how well you'll age.
Ann Dowd reveals what 'Handmaid's Tale' costar Elisabeth Moss texted her after Donald Trump's election
Ann Dowd was in a panic the morning she woke up to find that Donald Trump had been elected. But then she got a text from her 'Handmaid's Tale' costar Elisabeth Moss with a message of resilience.
Psst! Grab these early Amazon Prime Day Lego deals on collectible sets before the crowds discover them
We found record-low Lego deals at Amazon ahead of Prime Day, including collectible sets from “Harry Potter,” “Star Wars,” Disney, Marvel, Pixar, and “The Lord of the Rings.” Shop favorites like Diagon Alley, a Balrog book nook, and a “101 Dalmatians” puppy while they're at their lowest prices ever
Corey Feldman diagnosed with 'really bad case of food poisoning,' released from hospital after mid-flight medical emergency
'Stand by Me' actor Corey Feldman has been released from the hospital following a mid-flight medical emergency on a flight to Los Angeles.
'Rich Kids of Beverly Hills' star Brendan Fitzpatrick sued over alleged $80M Ponzi-style scheme
Brendan Fitzpatrick, former star of E!'s 'Rich Kids of Beverly Hills,' is being sued over an alleged $80M Ponzi scheme involving his Sri Lanka-based global mining and commodities company.
An EPA Researcher Details the Agency's Assault on Science
In late January, the Trump administration began shutting down projects within the EPA’s independent science division that touched on climate change and environmental justice. Air quality researcher Thomas Luben, who had worked at the agency for 18 years, was fired for objecting.
Bob Odenkirk revives Saul Goodman for surprise and slightly confusing PSA
For some unexplained reason, Bob Odenkirk and Jonathan Banks have reprised their 'Better Call Saul' characters in a new mock ad.
Sean Penn will write and direct a movie tied to the Jan. 6 U.S. Capitol riot, with Bradley Cooper eyeing lead role
Sean Penn is writing and directing a new movie tied to the Jan. 6, 2021, riot at the U.S. Capitol. Bradley Cooper is in talks to play the lead role in the film.
“The Pitt” cast officially clocks back in for start of season 3 production
The HBO Max drama's next batch episodes will be set in November.
CBS will pay for Stephen Colbert's 'Peanuts' music licensing gag from 'Late Show' finale
CBS will pay the licensing fee for the use of Vince Guaraldi's 'Linus and Lucy' after Stephen Colbert's house band played the tune on 'The Late Show' finale — but there's a twist.
ESPN unveils star-studded summer lineup for Women's Sports Sundays presented by TJ Maxx
ESPN today announced the full schedule for Women's Sports Sundays presented by TJ Maxx, a first-of-its-kind weekly primetime franchise that will place women's sports at the center of the summer sports calendar. Debuting Sunday, June 21, the new franchise will deliver nine consecutive weeks of marquee women's sports programming across ESPN, ESPN2, the ESPN App, Disney+ and ESPN Deportes, featuring the WNBA and NWSL's biggest stars in premium national windows.
Billy Bush blasts Al Roker as 'vindictive,' 'rageful' during their 'Today' run: 'He's a mean person'
Billy Bush claims 'Today' cohosts Matt Lauer and Al Roker, whom he says were 'territorial' during their time together on the morning show, 'definitely did not want me there.'
'House of the Dragon' season 3 reviews: What critics are saying
The first reviews are in for 'House of the Dragon' season 3, with many critics applauding the HBO series' epic battles and dramatic character developments.
JD Vance addresses controversial 'childless cat ladies' comment on 'The View'
JD Vance attempted to explain his controversial 'childless cat ladies' comment on 'The View,' after Joy Behar pressed him on the 'boneheaded' remark that even drew a response from Taylor Swift.
Shrek and Donkey are locked up in first 'Shrek 5' trailer
Shrek and Donkey are reunited in the new look at the long-awaited 'Shrek 5,' 16 years after the last film.
Sean Combs' prison sentence gets 2 months shorter as release date moves up for third time
Sean Combs' prison release date has been moved up for the third time in four months, shortening his prison sentence by seven weeks.
'Disclosure Day' anchor Courtney Grace breaks down that unforgettable ending
Her name is Courtney Grace and she carries Steven Spielberg's sci-fi thriller to its emotional climax. She discussed her experience working on the film.
Andrew Rannells reveals brief romance with Anderson Cooper inspired 'Girls' storyline
Andrew Rannells says he briefly dated Anderson Cooper when he was 25, and told 'Girls' showrunners Lena Dunham and Jenni Konner about the fling.
Whoopi Goldberg melts down, snaps on Ana Navarro during JD Vance's 'View' interview: 'Ana, God, please!'
Whoopi Goldberg snapped on 'The View' cohost Ana Navarro during a tense JD Vance interview. 'Ana, God, please!' Goldberg shouted, scolding Navarro in the process: 'Don't do that!'
'Smile' tackles sports, 'A Quiet Place' hits Florida Keys in new IDW Dark comics (exclusive)
'Smile' entity tackles sports and 'A Quiet Place' hits the Florida Keys in new IDW Dark comic expansions.
'View' studio audience members refused to clap for JD Vance as he walks out for interview
'The View' studio audience members refused to clap for Vice President JD Vance as the controversial politician made his way out to the set for an interview with Whoopi Goldberg, Sunny Hostin, more.
Armie Hammer explains how 'old Jamaican guy' helped quiet his anger over famous friends' lack of support
Armie Hammer explained how an 'old Jamaican guy' helped him get over the anger of his famous friends failing to publicly support him through his abuse scandal.
Tom Holland confirms he and Zendaya secretly got married
After months of speculation, Tom Holland has confirmed he and Zendaya are married: 'That's all you get on that.'
Jelly Roll reportedly files for divorce from podcast star Bunnie Xo after 10 years, 2023 vow renewal
Country singer Jelly Roll has reportedly filed for divorce from his wife, podcast star Bunnie Xo, after 10 years of marriage. The couple had renewed their vows in 2023.
Sunrise adds YouTube Premium and HBO Max to entertainment offering
Swiss telecommunications operator Sunrise has expanded its entertainment portfolio with the addition of YouTube Premium and HBO Max, strengthening its position as a one-stop destination for televis…
What is looksmaxxing?
A Q&A with Dr. Bravender discussing what looksmaxxing is. Along with the true dangers of it, what parents should know, and when to intervene.
Lance Bass on Having Type 1.5 Diabetes, Being Misdiagnosed, and Taking Control of His Health
In a new interview with Health, the former NSYNC singer opens up about the frustration of incorrectly treating type 2 diabetes for years and how he's currently managing his true diagnosis.
Opinion | What if Both Parties Redistricted to the Max?
How the scramble for partisan advantage could further distort America’s politics.
What's the average age of first-time homebuyers across Europe?
Fewer than seven in ten EU households live in owner-occupied homes. Euronews Business takes a closer look at the age at which Europeans buy their first home, which varies widely across the continent, based on exclusive data provided by RE/MAX.
Corey Feldman reportedly hospitalized after suffering medical emergency on flight to Los Angeles
'Stand by Me' actor Corey Feldman was reportedly hospitalized on Monday after suffering a medical emergency on a flight from Chicago to Los Angeles.
Global Fund gathering in Luxembourg underscores international solidarity in health
A high-level working lunch with Members of Parliament, organized in Luxembourg by Friends of The Global Fund Europe, acknowledged that the contribution of Luxembourg to the Global Fund is an example of international solidarity and commitment for Europe and for the world.
Apple iPhone 18 Pro Release Date: How WWDC 2026 Clues Signal September Launch Details
Apple's WWDC 2026 schedule mirrors last year's rollout, offering fresh clues about when the iPhone 18 Pro, iPhone 18 Pro Max and rumored foldable iPhone could launch.
'Love Island USA' executive producer James Barker dies at 40 while shooting season 8 in Fiji
'Love Island USA' executive producer James Barker died at 40 after 'suffering a medical emergency' while filming season 8 of the reality show in Fiji.
PAHO Executive Committee opens 178th session with focus on key health priorities and financing challenges in the Americas
Washington, D.C., 15 June 2026 (PAHO) — The Executive Committee of the Pan American Health Organization (PAHO) today opened its 178th session, where Member States will address the Region’s main health priorities in a context marked by financing challenges and the need to strengthen preparedness for health emergencies.
Bonnie Tyler wakes from coma 1 month after emergency intestinal surgery, but remains 'very unwell'
'Total Eclipse of the Heart' singer Bonnie Tyler is awake one month after being placed in an induced coma to aid her recovery from emergency surgery.
Whoopi Goldberg refuses to let Jalen Brunson answer Ana Navarro's question on 'The View'
Whoopi Goldberg stepped in, refusing to let Jalen Brunson answer Ana Navarro's question on 'The View' in an awkward on-air moment: 'Girl,' Goldberg said.
UFC fighter Josh Hokit shouts, 'Michelle Obama is a man,' at White House Freedom 250 event
Josh Hokit made a distasteful comment about Michelle Obama during the UFC Freedom 250 event at the White House.
Katie Thurston Delays Biopsy, New Treatment for Stage 4 Breast Cancer for 'Mental Health Reasons’: ‘I Need a Break’
Katie Thurston has been open about her fear of needles and the emotional toll of her stage 4 breast cancer journey. The ‘Bachelorette’ alum said she’s now pushing back a biopsy and new treatment to prioritize her mental health.
Sally Field couldn’t understand this classic Hollywood actor on set: 'I don’t know if he was stoned or what'
Sally Field is revealing the classic Hollywood actor who she just couldn't understand at all whenever they interacted on set.
Announcing the Winners of the NIH Replication Prize: Shaping the Future of Rigorous Science
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'Moana' star Auliʻi Cravalho is Jessica Cruz in 'My Adventures with Superman' universe (exclusive)
'My Adventures with Superman' will debut 'Moana' star Auliʻi Cravalho as Jessica Cruz before she headlines the Green Lantern spinoff. See an exclusive first look at the character.
Jay Shetty Says His 'Body Couldn't Keep Up with His Vision' Before Prioritizing This One Aspect in His Wellness Routine (Exclusive)
The global bestselling author and podcast host, 38, talks to PEOPLE about his health journey and latest partnership with BIOptimizers.
Robert De Niro's message for Donald Trump on his 80th birthday: 'Shut the f--- up'
As the president was hanging with UFC fighters at the White House on his 80th birthday, Robert De Niro delivered a fiery anti-Trump speech, declaring that he wants to "love my country again."
'Alf' star Anne Schedeen dies at 77, family highlights her 'burning hatred for Trump'
'Al'f actress Anne Schedeen has died at age 77, the star's family announced in an emotional Facebook post, saying she left behind 'burning hatred for Trump.'
Rainn Wilson thinks 'The Office' couldn't be made today because it was too 'politically incorrect'
Rainn Wilson is calling out a 'bias in the media' toward 'liberal policies' for his belief that 'The Office' could not be made today, saying it would be 'too hard to be as politically incorrect as the show was.'
Oliver Tree revealed his family won't 'get a penny' after his death, just weeks before his fatal crash
Just weeks before Oliver Tree's death at 32 in a helicopter crash, the 'When I'm Down' singer revealed details of his will, including that his family is not 'going get a penny.'
Jalen Brunson seeks a role on 'SVU' after New York Knicks win historic NBA championship
Jalen Brunson is ready for his close-up: The Knicks' star point guard and captain wants to appear on 'Law & Order: SVU' after leading his team to a historic victory in the NBA championships.
Stars react to Knicks NBA Finals win: Timothée disses Oscars, Cardi B screams, Ben Stiller sprints, and more
Timothée Chalamet shades the Oscars, Ben Stiller jumps into director more, Jennifer Lopez screams at the top of her lungs, and more in EW's roundup of the starriest reactions to the Knicks becoming NBA champions for the first time in 53 years.
'ANTM' stars shade Tyra Banks for suing Netflix over docuseries editing: 'Now she knows how we feel'
'America's Next Top Model' stars Angelea Preston and Adrianne Curry shaded Tyra Banks' Netflix lawsuit over editing and an alleged false narrative: 'Now she knows how we feel,' Preston tells EW.
'Disclosure Day' lands out-of-this-world opening weekend with $93 million at global box office
Steven Spielberg's alien oddity 'Disclosure Day' conquered the world this weekend with a $93 million gross, while the ultra low-budget horror 'Obsession' continues to surge in its fifth weekend in theaters.
Oliver Tree, 'Life Goes On' and 'Miss You' singer, dies at 32 in tragic helicopter crash
Oliver Tree is among the six people killed in a Sunday helicopter collision in Brazil that killed 6.
Is SMIC N+3’s Metal Pitch Smaller than Intel 18A’s?
Almost four years ago, we published that SMIC had started shipping 7 nm (N+1) chips. Now, SMIC is shipping its third-generation 7 nm (N+3) process in Huawei’s Kirin 9030, with a minimum metal pitch of 32.5 nm, about 10% tighter than the 36 nm minimum metal pitch shipping in Intel’s latest Panther Lake CPUs on 18A. The headline is true, but incomplete cherry picked metric. N+3 reaches the density of TSMC N6 through aggressive DUV multi-patterning and design-technology co-optimization (DTCO), but it pays for that in complexity, efficiency and process control. We found this and more in our reverse engineering and teardown where we cover SMIC’s N3 process technology, Huawei’s packaging, memory, architecture, and more. SemiAnalysis has been building a state-of-the-art teardown lab in Oregon capable of analyzing the world’s most advanced and important chips over the last year and half. We have already generated revenue on advanced datacenter chip teardowns including our recent reverse engineering of a major TSMC customer’s COUPE CPO optical engine + EIC 3D stack. This is the first public report from the SemiAnalysis Teardown Engineering & Evaluation Lab, or STEEL for short. The lab is aggressively scaling up and out and we’re excited to announce it publicly. This is a bit of inconvenient timing for TechInsights as they are private equity owned and currently being sold while having enjoyed virtually no credible competition for decades. This has led to TechInsights underinvesting in CAPEX. SemiAnalysis exceeds TechInsights in revenue despite no venture or private equity ownership and being founded only 6 years ago. Because we have no external investors and are founder led, we move faster, build faster, and we can release client chip teardowns for free regularly, while focusing on datacenter for our major clients. Here’s the first public image from our lab, the HiSilicon Kirin 9030 Pro SoC: This report will detail our teardown of the Kirin 9030 and our findings on SMIC’s N+3 process, the most advanced in China. For comparison, we’ll show our teardown of the MediaTek Helio G99, made on TSMC N6. Through this comparison, we can look at the effect of export controls – SMIC N+3 and TSMC N6 are comparable nodes, but one is heavily export-controlled, the other free to use the West’s most advanced equipment. Here we see both China’s progress and constraints. SMIC N+3 reaches TSMC N6-class logic density, but it requires far more aggressive DUV multi-patterning, so it does not match N6 on process maturity or cost. The Kirin 9030 Pro performs similarly to three-year-old Android flagships, and trails far behind the current flagship SoCs from Apple, Qualcomm, MediaTek, and Samsung. The efficiency gap is even wider. Export controls have not stopped Huawei and SMIC from shipping advanced silicon, but they have forced a different path. Without EUV, SMIC is leaning harder on DUV multi-patterning, DTCO, and increasingly complex integration. The roadmap continues forward through tighter design rules and backside power, but each step adds cost and process risk. Huawei’s τ scaling and LogicFolding show another path: stacking active logic and recovering density through advanced packaging and system-technology co-optimization (STCO). To understand the Kirin 9030, we must first understand Huawei’s SoC history. HiSilicon is Huawei’s chip design arm, responsible for the Kirin smartphone SoCs, Kunpeng server CPUs, Ascend AI accelerators, and switch/router networking silicon. Before export controls, Huawei was TSMC’s largest customer – the only customer on TSMC’s first EUV node, N7+, and among the first on N5, alongside Apple. That ended in late 2020. Huawei switched to Qualcomm SoCs in its flagship smartphones, though export controls limited them to 4G-only variants. In late 2023, Huawei returned to in-house silicon with the Kirin 9000s, a successor to the Kirin 9000, fabricated on SMIC N+2 instead of TSMC N5. In the following years, they released the Kirin 9010 and 9020 on the same N+2 process. These chips used Huawei’s in-house TaiShan CPU cores and Maleoon GPU. We have not torn down a Kirin 9020 ourselves, so the predecessor die shot is from Kurnal. The die shots show how Huawei spent its silicon budget: which functional blocks are where, and how their areas compare to the predecessor. First, a quick guide to the major blocks on the die. The total die area is nearly identical, but the 9030 uses that area more aggressively. A denser process lets Huawei fit an extra middle CPU core, more GPU and NPU cores, and larger caches into the same footprint. In contrast, the Helio G99 is a much smaller, low-cost SoC, built for budget smartphones rather than a flagship device. While the Kirin 9030 is ~140 mm², the G99 is only ~29 mm², roughly one-fifth the area. The underlying TSMC process technology, however, is directly comparable as a baseline for analyzing SMIC’s. The Kirin 9030 is an evolutionary refresh, not a clean-sheet design. Its CPU, GPU and NPU cores carry over the 9020’s families, and the gains come from three levers: the SMIC N+2-to-N+3 process step, DTCO and floorplan work, and incremental microarchitecture. Area is where the first two show up, and the 9030 scales well here. Performance and efficiency are the harder test. Huawei’s design holds up better than its node would suggest, but the chip still trails, both because N+3 sits behind the leading-edge nodes and because its cores, while competent, remain a few generations behind the newest designs. The new prime core is an incremental update. The main changes are a 10% frequency increase from 2.5 GHz to 2.75 GHz and a doubling in the L2 cache from 1 MiB to 2 MiB. Despite the increased cache, the core size decreased by 7.6%. Excluding the private L2 cache, the core size decreased by 21%. This is a large reduction for an incremental node. Compared with the TaiShan New V120 core in the Kirin 9020, the Kirin 9030’s middle core is almost unchanged architecturally, yet each core shrinks by ~22%. Most of that comes from the move from N+2 to N+3, with layout likely accounting for the rest. Visually, the most noticeable change is the increase from 3 middle cores to 4. There is also a 20% increase in the shared L3 cache of the big cluster. This helps to improve multi-core performance without sacrificing much in terms of area. Even with each core shrinking, the big CPU cluster’s total area is essentially unchanged. The per-core savings went back into an additional middle core and larger caches. The tiny cores shrank less than the prime core (excluding its L2 cache) and less than the middle cores. This is likely because fixed overhead is a larger share on a small core. We cannot resolve any architectural changes from the die shot alone, but the per-clock and efficiency gains shown below point to more than pure process and layout scaling. The area reduction was offset by a doubling of the shared L2 cache from 2 MiB to 4 MiB, leaving the total tiny CPU cluster area slightly larger. Area is the easiest improvement to see from a die shot, but it is only one part of PPA (power, performance, area). For modern logic, power and performance matter just as much, and often more. Since Dennard scaling broke down in the mid-2000s, voltage and frequency have not scaled in step with transistor dimensions, so each node has had to fight harder for gains in performance and efficiency. The starkest comparison is not Kirin 9020 versus Kirin 9030 Pro. Apple’s efficiency cores run circles around Huawei’s prime core. Apple’s low-power core delivers 20% higher integer performance while drawing only 1 W, compared with 4.5 W for Huawei’s prime core. N+3 matches TSMC N6, but N6 is several generations old. Apple and Qualcomm build on N4 and N3P, which are denser and sit on a better voltage-frequency curve, giving them a larger transistor budget and more performance per watt. The 9030’s own cores did improve. The middle and tiny cores gained 17% and 14% in per-clock integer performance over the 9020, with floating-point flat on the middle core and up 11% on the tiny. The tiny core improves cleanly, with performance rising while power falls and efficiency increases by 45% in integer and 24% in floating point. The middle core is mixed: integer performance rises but power rises faster, cutting integer efficiency by 7%, while lower power lifts floating-point efficiency 16%. Per-clock gains at the same or lower frequency are microarchitectural, so the cores are tuned, not just shrunk. Both also failed to hold their rated maximum frequencies, pointing to thermal, power, or stability limits. Per clock, the middle core sits around Arm Cortex-A720 and the tiny core near the Cortex-A520; absolute performance trails because Huawei clocks them much lower. The prime core is roughly Cortex-X2 class per clock, a 2021 design. Apple’s 2020 M1 Firestorm core is still 35% higher per clock and 57% faster in absolute integer performance at a similar 4.5 W. The current leading edge is further ahead again: the Apple M5 P-core is 60% higher per clock and 2.7× faster, the Arm C1 Ultra 45% higher and 2× faster. Matching older high-end cores per clock is a genuine design achievement. What Huawei cannot match is the voltage-frequency curve and transistor budget of leading-edge nodes, which let Apple, Qualcomm and others spend more transistors in the same area on wider cores, larger caches and deeper buffers while running at lower voltage. Huawei’s LogicFolding roadmap is one answer, stacking active logic to recover density and shorten signal paths. We return to it later. The GPU compute units (CUs) changed more visibly than the CPU cores, moving to a more rectangular layout for both the arithmetic logic unit (ALU) clusters and the CU overall. Even with ray-tracing support added, a CU shrank ~28%. However, that shrink is offset by the increase from 4 to 6 CUs and the area outside the CUs grew 33%. Overall, the GPU cluster is larger by ~10%. The GPU is where Huawei makes its biggest gains. The Maleoon 935 is not competitive with current flagships, but it is a large step up from the 920 and reaches older-flagship territory. In 3DMark it is 70% faster in Wild Life Extreme (WLE) and 79% faster in Steel Nomad Light (SNL) than the 920; with 11% higher clocks and 50% more CUs, the ~67% theoretical uplift roughly matches WLE and is beaten by SNL. It edges ahead of the Snapdragon 8+ Gen 1 in WLE and SNL, and the Dimensity 9200 and Apple A16 in WLE, but stays far behind newer parts: the Snapdragon 8 Elite Gen 5 and Dimensity 9500 are ~2.4–2.6× faster in WLE and ~3.2× faster in SNL. The Maleoon 935 is Huawei’s first GPU with hardware-accelerated ray tracing; there it lands slightly ahead of the Exynos 2200, and on par with the Apple A16, with current flagships up to 3.7× faster. The Neural Processing Unit (NPU) saw the largest structural changes of any block, moving from a Lite and a Tiny core in the Kirin 9020 to a Lite and two Tiny cores in the Kirin 9030. Both core types also show significant layout changes. This is a reversal in Huawei’s NPU design. The Kirin 9000 5G, its last flagship chip on TSMC N5, used two Lite and one Tiny core. The series of SoCs on SMIC N+2 moved to one Lite and one Tiny core, likely for area savings. With the Kirin 9030, Huawei has shifted back toward a larger multi-core NPU cluster, but with the additional area going to a Tiny core rather than a Lite core. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Before diving into the process stack, the package and memory are worth separating from the SoC itself. The Pro variant of the Kirin 9030 carries 12 GB of Samsung DRAM, with two stacks of four dies each. The dies were identified as the K4L2E165YD, a 12 Gb LPDDR5X-9600 device fabricated on Samsung’s 1a node, the fourth generation of its 10 nm-class DRAM after 1x, 1y and 1z. 1a has shipped in volume since 2022, so this is current memory rather than older-node inventory. The 16 GB Pro Max variants we obtained were found with both CXMT and Samsung packages. The CXMT package is marked CXDD7JEDM, with two stacks of four dies, packaged in week 45 of 2025. The inferred die dimensions from X-ray computed tomography (CT) are consistent with a known density of ~0.3 Gib/mm² for the CXMT G4 process, roughly equivalent to other manufacturers’ 1z processes. The Kirin 9030 uses a typical integrated package-on-package (iPoP) stack: multiple DRAM dies in a memory package sit above an organic redistribution layer (RDL) interposer, which sits above the SoC and package substrate. The full package is then mounted to the printed circuit board (PCB) through ball-grid array (BGA) solder bumps. The memory package substrate is a thin bismaleimide-triazine (BT) laminate carrying the LPDDR5X stack. The organic RDL interposer over the SoC routes the PoP signals around the die and carries possible dummy thermal copper pillars. The package substrate, a thicker Ajinomoto Build-up Film (ABF) build-up over a BT core, fans the flip-chip bumps out to BGA pitch and embeds the power planes. The whole stack is organic. The only silicon is the SoC and the LPDDR5X dies; there is no silicon interposer. Keeping it all-organic brings the package’s coefficient of thermal expansion (CTE) close to the PCB’s, reducing board-level warpage, and avoids the cost of a silicon interposer the SoC’s bandwidth does not need. In an iPoP stack, the memory package connects to the organic RDL interposer through an array of solder bumps. Underfill fills the gap around those bumps, adding stiffness and protecting the joints from mechanical stress. The Pro and Pro Max variants differ here, which we cover behind the paywall. The die shot and architecture tell us how Huawei allocated its silicon budget. The process tells us what SMIC can manufacture. We use the Helio G99 as the process reference for TSMC N6. Both SMIC N+3 and TSMC N6 are evolutions of previous 7 nm-class nodes. We used targeted TEM cross-sections through logic and memory regions, imaged in both fin-cut and gate-cut directions. Each cross-section caption gives its horizontal field width (HFW), the real width of the imaged area. We start at the transistor fins, then move up through standard cells, local interconnect, and SRAM. SMIC has not overtaken Intel or TSMC. It uses aggressive DUV scaling and DTCO to reach N6-class density, but that density doesn’t translate into comparable performance and efficiency, for two reasons: the node gap to leading-edge nodes, and Huawei’s core designs. Fin Profile One of the most important knobs in a FinFET process is the fin profile: the shape of an individual fin and the channel where current passes from source to drain. The ideal fin is tall, narrow, and nearly vertical. A taller fin increases effective channel width, while a narrower fin improves electrostatic control by thinning the body the gate must control. Push either too far, and the process pays for it: weaker drive current, fragile fins, taper, footing and line-edge variation that hit yield and device variability. The Intel 22 nm, 14 nm, and 10 nm fin cross-sections show how FinFET nodes have improved over time. 22 nm fins were a first-generation structure, relatively short, wide and strongly tapered. The shape limits current density and reduces gate control uniformity across the height of the fin. At 14 nm and 10 nm, Intel pushed the fins taller and narrower while also making the sidewalls more vertical. Rather than shrinking the device, these changes increase the effective channel width per fin and improve electrostatic control. The trade-off is that taller fins at tighter pitches are much more difficult to manufacture. Now, let’s compare the Helio G99 on TSMC N6 with the Kirin 9030 on SMIC N+3. Both processes are in the same class, with fin pitch of 30-32 nm on N+3 and 34 nm in our N6 cross-section. The pitch for N6 is especially interesting as N7’s HD library is generally listed with a 33 nm fin pitch, and N6 did not shrink pitches directly. Its density gains came from DTCO instead of tighter pitches. The 34 nm pitch was stable across our sampled region and serves more as a comparison against the SMIC N+3 we have not investigated further. Pinning down N+3’s fin patterning scheme takes more than one core unit. The CPU cores show a dense ~32 nm pitch, with the pitch between N-P fin pairs alternating between 78 and 88 nm. Logic alone may be consistent with dual-pitch mandrels of 120 and 110 nm, but this is a complex and unusual approach. Combining the pitch from the the 8T SRAM, which has more complex repeat unit, with the CPU core sequence allows us to reverse engineer the patterning steps with more confidence. As both the logic and SRAM should share the same base grid, a single CD mandrel lithography pattern with 128 nm pitch undergoing SAQP produces a die-wide ~32 nm grid (128 nm/4), which supports the pitch sequencing seen in both logic and SRAM cells. In the sampled cross-sections, N+3 shows a taller, narrower, higher-aspect-ratio fin than N6. The measured fin aspect ratio is ~9.5:1 on N+3 versus 7.8:1 on N6. N+3 also shows less top rounding, with an estimated radius of ~2 nm, compared with 2.8 nm on N6. Even though the fin widths differ, the ratio of top rounding to fin width tells the same story, with N+3 at 0.37 and N6 at 0.44. In a geometric sense, lower is better; a perfectly rectangular fin would have no top-rounding penalty. These are single-digit-nanometer features measured from a handful of cuts, so treat the absolute numbers as approximate. The important result is the relative gap: N+3’s fins are consistently taller, narrower and less rounded than N6’s. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. Standard Cell A standard cell is the basic building block of chip layout: a fixed-height row pairing one NMOS and one PMOS transistor that share a gate, tiled in a grid to build logic blocks. The key dimensions are contacted gate pitch (CGP), cell height (CH), fin count, and the lower-metal routing grid. To measure density, we use the Bohr metric: a weighted average of NAND2 gate area (60%) and scan flip-flop area (40%). This represents a realistic mix of combinational and sequential logic. This metric has its limitations, especially for complex cell layouts like TSMC’s FinFLEX, which alternates cells with different fin counts. Even so, it is the best metric for a pure process-level comparison. Another important measurement is the fin pitch; it refers to the distance between two fins of the same transistor. In a FinFET process, multiple fins are used in each transistor to increase the drive current and thus performance. TSMC N6 ships both a high-density (HD) library with 2 PMOS and 2 NMOS fins per cell, and a high-performance (HP) library with 3 of each. More fins under the shared gate mean more effective channel width. HP cells switch harder at the cost of area. Designers mix the two on a die, primarily spending HP cells on timing-critical paths, and matching their PPA targets. In the Cortex-A55 core of the Helio G99, we found a cell height of 240 nm for the HD cell. MediaTek has used HD cells in the G99 to minimize die size and thus cost. As an SoC for budget smartphones at ~$100, this is essential. By contrast, we found only one library in the Kirin 9030, with 2 NMOS and 2 PMOS fins. This suggests a narrower library strategy than TSMC N6, where both HD and HP libraries are widely used. This likely reflects the smaller customer base and the more constrained domestic design and electronic design automation (EDA) ecosystem. In all three CPU cores of the Kirin 9030, we found cell heights of 228 nm, 5% smaller than on N6. This is also a reduction of 9.5% over SMIC N+2’s cell height of 252 nm. SMIC N+3 and TSMC N6’s HD library both feature a CGP of 57 nm. For SMIC, this is a 9.5% shrink over N+2. In the past, CGP and cell height alone may have been enough to compare transistor density. Now, however, we must consider scaling boosters and DTCO as well. SMIC’s density gain does not come from EUV. It comes from using every available DTCO booster aggressively. First is fin depopulation: reducing the number of NMOS and PMOS fins in each cell. The first FinFET nodes started with 3 or 4 fins for each transistor. SMIC N+3 and TSMC N6 HD both use only 2 fins per transistor, trading drive strength for density. Next is contact over active gate (COAG). By landing the gate contact directly over the active gate, instead of out over the isolation region, the cell height drops. N+3 integrates COAG while N6 does not. Our N+3 gate-cut cross-sections indicate COAG, with the gate contact sitting over the active region, while N6 shows an off-gate contact. Last is single diffusion break (SDB). Diffusion breaks are inserted between cells in the same row to provide electrical isolation, but they also introduce local layout effects (LLE), layout-dependent shifts in electrical characteristics. In the past, a double diffusion break was used, consuming the space of two CGPs. SMIC N+3 and TSMC N6 instead use SDB, saving area but increasing LLE sensitivity. This must be controlled at the process level and accurately modeled in the process design kit (PDK) so that EDA tools can account for it. Overall, SMIC N+3 has a transistor density of 113.4 MTr/mm², slightly above TSMC N6 at 107.7 MTr/mm². Even without EUV, SMIC has achieved density beyond TSMC’s mature N6 node which utilizes EUV. Metal Stack The smallest critical dimension in the teardown is M0; SMIC N+3 uses a 32.5 nm local metal pitch. That is smaller than the 36 nm M0 pitch on Intel 18A in Panther Lake. However, this does not mean that SMIC has a better process than Intel 18A or TSMC N3P. M0 is a local intra-cell routing layer. Its usefulness depends on the full interconnect stack: M1 and M2 pitch, track count, via and line resistance, design rules, mask count, overlay control, and routing flexibility. The 32.5 nm M0 is consistent with self-aligned quadruple patterning (SAQP), whose four-population line-width loading we read coarsely as alternating widths of 21.5 to 24 nm; M1 and M2, at 38 and 40 nm, are consistent with self-aligned double patterning (SADP), a single A/B split. On TSMC N6, M0, M2, and M3 sit at a relaxed ~40 nm and are consistent with SADP-class double patterning, with no need for quadruple patterning. That said, we measure M2 for example at ~43 nm, likely inflated by sparse routing. We do not assign any specific layer to EUV from our cross-sections; the distinction we can draw is double versus quadruple patterning, not lithography wavelength. Transistor-level density in the front-end-of-line (FEOL) sets an upper bound, but the design is ultimately limited by what the interconnect stack can route. The lowest metals are the most important for standard-cell density, but the semi-global and global layers determine how usable that density is at the block and chip level. Two axes are commonly used for chip cross-sections: the fin-cut and the gate-cut. The micrograph above is a fin-cut and shows metals 0 through 3. This axis lets us see the even-numbered metals, with M0 right above the fins. There are two kinds of M0 lines. The first are the power rails; these are wide wires for the VDD and VSS running horizontally at the top and bottom edges of each standard cell. The wide wires measure 55 nm across, more than double the other M0 lines. Their width minimizes resistance and reduces IR drop. The second kind are intra-cell wires, short segments within the cell that connect terminals to M1. These have alternating widths between 21.5 and 24 nm. The M0 pitch is 32.5 nm, a 19% reduction versus N+2 and N6. At this pitch, DUV patterning requires more aggressive multi-patterning, increasing mask count, overlay sensitivity, process complexity and cost. M0 is below what a single DUV-defined spacer (SADP) can resolve, so SMIC cascades a second spacer step (SAQP). The cross-section reflects the cost: the M0 trenches are visibly more re-entrant (narrower at the bottom than the top) than M1 or M2 on the same chip and carry a bright barrier-rich foot where the trench meets the etch-stop layer. That shape is partly the intended damascene profile, as a slightly narrow bottom helps void-free copper fill, but its magnitude at M0 is driven by the tight pitch and the higher trench aspect ratio. Intel 18A supports an M0 pitch of 32 nm, although Panther Lake has only shipped with a looser 36 nm pitch. This is due to Intel’s heavy usage of HP libraries. Among leading-edge nodes, 18A has the loosest M0 pitches due to PowerVia. With power routing moving to the backside, congestion is reduced, and the entire front-side metal stack can be used for signal routing. M2 is the first true inter-cell routing layer. It runs horizontally like M0 but spans across multiple cells to carry block-level signals. The M2 pitch sets the cell’s track height – the number of M2 tracks that fit between the VDD and VSS rails, defining what the library calls a 6-track or 7.5-track cell. This layer is the most important, limiting the routing of entire blocks. SMIC N+3 features a 5.7-track cell. The M2 pitch is 40 nm, a 5% decrease over N+2 and the same as N6. This shrink keeps the pitch at the edge of what is possible with double patterning. Future nodes will need to increase the number of masks for M2 as reducing the number of tracks is much harder due to the limitations in routing. The micrograph above is in the perpendicular direction, the gate-cut, and shows metals 0 through 4. This allows us to see and measure the odd-numbered vertical metal layers. The M1 pitch is 38 nm, 9.5% less than N+2 and 33% less than N6. The M1-to-gate ratio matters because it sets local routing flexibility. N+2 and N+3 use a 3:2 ratio, while N6 uses a 1:1 ratio, explaining the huge differences in M1 pitch. The more M1 lines there are compared with the gates, the more flexibility there is for power and signal crossing within the cell. Routing flexibility enables more complex and better cells. Clean fractional ratios are also preferred as a grid is periodic and improves layouts. The 3:2 ratio gives SMIC more local routing flexibility than a strict 1:1 grid, but it also complicates layout and patterning. This is a DTCO choice, with SMIC increasing process complexity to recover density and routability without EUV. This 3:2 ratio is not very popular in the leading-edge nodes. TSMC has only used it on N7+, the N5 family, and the short-lived N3(B). They have switched back to a 1:1 ratio for N3E. Intel has only used it on the 10 nm/Intel 7 family, with Intel 4, 3 and 18A all using a 1:1 ratio. Samsung is the only one still using a 3:2 ratio at the leading edge, using it in the SF4 and SF3 families. It remains to be seen if SMIC will remain at a 3:2 ratio or move to a 1:1 ratio with its future nodes. The industry is still actively exploring these local-routing ratios. At VLSI 2026, imec will be presenting work on even higher ratios, including a 2:1 scheme that can reduce area by up to 14%. We will be covering the conference in a future newsletter article. Subscribe We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Interested in joining us on this ride and think you can be a difference maker? Check out our Careers page. The final local interconnect layer for N+3 is M3, with a pitch of 44 nm. The M3 pitch is the same as on N+2 and 10% larger than on N6. The semi-global layers carry the majority of block-level signal routing. They have a coarser pitch than the lower local layers. On leading-edge nodes, they are designed to sit at the limit of DUV single patterning. M4 through M11 pitches were found divided between 80–82 nm (M4–M6), 128 nm (M7–M10), and 148 nm (M11). Given limited sampling, it is possible these are divided further in dense routing areas. At the top are two giant metal layers, M12 and M13. These have kept the same pitches as N+2 at 1920 nm and 4600 nm respectively. While the lower layers’ pitches are generally fixed by the process and library, the upper layers vary much more in pitch and count, depending on the design. Even two smartphone SoCs on the same process can have wildly different metal stacks. The Helio G99 carries fewer routing layers, reaching coarse metal pitches of 850 nm by M9, while the larger and higher-performance Kirin 9030 keeps fine pitches until M11. SRAM At the leading edge, SRAM is much more difficult to scale than logic. TSMC’s latest nodes have seen little to no bitcell scaling, while logic still has more DTCO levers to pull. While looking for other logic libraries in the GPU compute units, we stumbled upon the SRAM. The most common type of SRAM has 6 transistors (6T), but this cell had 8 transistors (8T) instead. 8T SRAM adds two transistors to form a dedicated read port. Unlike a 6T cell, where reading disturbs the storage, the decoupled read port removes read-disturb, improving read stability and letting the cell be pushed harder for performance. At first glance, the cut looked like an unusual logic library, with each cell row having 3 fins of one polarity and 5 fins of another. The rows also alternated in orientation. Energy-dispersive X-ray spectroscopy (EDS) resolved our confusion. The cut had not landed on the GPU logic, but on the SRAM macro beside it. The unusual fin pattern was due to the SRAM library. We return to EDS in the process flow analysis behind the paywall. SRAM libraries are not like traditional logic libraries. Due to the unequal number of PMOS and NMOS transistors, they require specialized rules and layout libraries. They do not need the flexibility of logic libraries, so they are hyper-optimized for one purpose: dense, reliable memory. The SRAM cell we found is a 1:2:2-2:2 cell. This means there is 1 fin per pull-up (PU) PMOS transistor, and 2 fins per pull-down (PD) and pass-gate (PG) NMOS transistor. These 2 PU, 2 PD and 2 PG transistors would usually form a single 6T high-current cell (HCC). An 8T HCC adds a read-pull-down (RPD) and a read-pass-gate (RPG) NMOS transistor, each with two fins. We measured a cell height of 406 nm, which brings the bitcell size to 0.0463 µm². That is a theoretical peak density of 21.6 Mib/mm². We estimate that a 6T HCC would have a cell height of 292 nm and a size of 0.0337 µm². This is ~12% larger than a 6T HCC on Intel 3 and 4. We also estimate the 6T high-density cell (HDC) to have a cell height of 228 nm and a size of 0.0260 µm². This is coincidentally the same as the logic standard-cell height measured earlier. The estimate puts the cell near Samsung 7LPP/5LPP and slightly below TSMC N7/N6. That is a theoretical peak density of 38.5 Mib/mm². 6T HDC is arguably the most important cell as it is used for the largest caches in a chip, the L3 caches and system-level cache (SLC). Both the Kirin 9020 and 9030 have split the SLC into 4 banks to raise total SLC bandwidth. In the Kirin 9030, the SLC increased from 2 MiB to 3 MiB per bank. Correspondingly, the number of arrays within the bank also increased by 50%, from 16 to 24. Each array can store 128 KiB and forms an orderly pattern on the die shot. From the Kirin 9020 to the Kirin 9030, the area of a 128 KiB SLC array decreased from 0.0477 mm² to 0.0392 mm², an 18% shrink. The achieved density is 25.5 Mib/mm², 66% of the theoretical maximum. While the SLC was quite similar across both chips, the L3 has seen some major changes, particularly in terms of its layout. The total capacity also went up from 10 MiB to 12 MiB. Much like the SLC, the L3 is also split into 4 banks. In the Kirin 9020, an L3 bank consisted of 16× 128 KiB arrays and 16× 32 KiB arrays. However, an L3 bank in the Kirin 9030 instead consists of 48× 64 KiB arrays. In the Kirin 9020 L3, a 128 KiB array was 0.0513 mm² and a 32 KiB array was 0.0154 mm². The size of the 128 KiB array is different on the L3 and SLC as the assist circuitry for the two arrays differs depending on their purpose. In the Kirin 9030 L3, a 64 KiB array is 0.0210 mm². Although not a like-for-like comparison, normalized for capacity, it is 18% smaller than the 9020’s 128 KiB L3 array and 31% smaller than its 32 KiB L3 array. The achieved density is slightly lower than the SLC, at 23.8 Mib/mm², 62% of the theoretical maximum. Unlike the L3 and SLC, the prime cores’ private L2 cache uses a 2-bank design. As the prime cores’ L2 is latency-critical, it likely uses 6T HCC instead of 6T HDC. The 9020 has 16 arrays in each bank while the 9030 has 32. Each array has a capacity of 32 KiB. A 32 KiB array in the L2 shrank from 0.0171 mm² to 0.0142 mm², ~17% smaller. The density is 17.6 Mib/mm², ~59% of the theoretical maximum for 6T HCC. SRAM scaled well from N+2 to N+3, shrinking by ~19%, close to the theoretical logic shrink. The caveat is that N+2’s bitcells were unusually large, bigger than comparable 7 nm-class nodes, so part of the gain is catch-up rather than true scaling. With the insights from STEEL’s teardowns, we will be doing a deep dive into SRAM in a future newsletter article. Subscribe Everything above came out of a single STEEL teardown: die annotation, block-level area analysis and TEM cross-sections through logic and SRAM. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline or to commission a custom teardown, contact sales@semianalysis.com. Future Roadmap The same cross-sections that pin down N+3 also show where SMIC can go next. Although N+3 is already close to the practical limits of DUV multi-patterning in several layers, SMIC still has a few scaling levers left. A theoretical N+4 would likely start with cell height. N+3 uses 5 M0 tracks between its power rails. Moving to 4 M0 tracks, as on SMIC N+2 and TSMC N6, could reduce cell height by roughly 15%. The routing grid is only one side of the shrink; the front end also must fit into the smaller cell. One possible FEOL lever is reducing the p-to-n isolation spacing from two diffusion grid units to one. Intel used this scaling booster on Intel 4, and TSMC did so on its N3 family. This path trades layout flexibility for density. Fewer M0 tracks reduce local routing resources, while tighter p-to-n spacing raises integration and design-rule difficulty. M2 is also constrained by the cell height shrink. For SMIC to maintain a ~5.7-track cell, M2 would need to move toward ~35 nm. That would move another layer into SAQP territory. SMIC could also reduce the CGP from 57 nm to 54 nm. Intel reached a similar CGP on Intel 10 nm/Intel 7 without EUV. The local interconnect is also tougher. If SMIC keeps the 3:2 M1-to-gate ratio, M1 would need to shrink to 36 nm and would likely require SAQP as well. If SMIC moves to a 1:1 ratio, M1 could relax to 54 nm, but it would give up routing flexibility. Under this theoretical path, we estimate that SMIC N+4 could reach a cell height of 198 nm and a CGP of 54 nm, implying a Bohr density of 137.8 MTr/mm², on par with TSMC N5 or Samsung SF4. However, the difficulty is cumulative. Each step is individually plausible, but together they make N+4 harder than the transition from N+2 to N+3. It will likely take longer, cost more, and carry less process margin. A theoretical N+5 would require a larger integration shift. One possible path is backside contacts (BSCon), moving power routing and source/drain contacts to the backside, which would reduce front-side routing pressure and enable another reduction in cell height. The front-side metal pitches could relax to reduce the process complexity. M0 would likely relax slightly to ~34 nm, and M2 and M4 pitches could relax further. CGP is unlikely to shrink much further. Even with EUV, 48 nm has been the practical limit for yield and process control. This approach would allow N+5’s cell height to fall to 170 nm and its CGP to 53 nm. This implies a Bohr density of 163.6 MTr/mm², on par with Intel 18A’s HP library. However, this would not make N+5 cost-competitive with the leading edge. It would reach a similar density through a much more expensive route. The integration difficulty rises sharply, with new process flows for backside alignment, wafer thinning, contact reveal, and backside metallization. Past this point, standard density and interconnect scaling become increasingly unattractive. That is where Huawei’s roadmap stops looking like a normal foundry roadmap and starts looking like a packaging roadmap. At ISCAS 2026, Huawei unveiled its tau (τ) scaling law, reframing process scaling in the time domain. τ is the time cost of data movement and processing: switching delays in transistors, RC signal propagation delays in circuits, compute, memory, and networking latency. Outside Huawei’s terminology, this is called system-technology co-optimization. This is Huawei’s answer to its lack of EUV lithography. Without EUV, planar density cannot keep pace with TSMC, Intel, or Samsung. If transistor density cannot shrink further, Huawei’s alternative is to shorten wires, reduce buffering, and stack logic vertically. “LogicFolding”, Huawei’s implementation of this new scaling idea, is, in practice, an aggressive 3D stacking approach. AMD V-Cache places SRAM above or below a CPU die. AMD’s MI350X places active interposer dies (AIDs) underneath accelerator and compute dies (XCDs), with the AIDs handling cache, IO interfaces, the network-on-chip (NoC) and embedded metal-insulator-metal (MIM) capacitors. With LogicFolding, parts of the same logic block are split across multiple active dies bonded face-to-face at ultra-fine pitch. This allows Huawei to shorten some critical paths and reduce buffer overhead, not merely add cache capacity or offload the IO and interconnect. Shortening wires is where the higher clocks come from. A large share of a modern core’s delay and energy budget goes into driving long interconnects and the repeater buffers along them. LogicFolding distributes a block’s critical-path gates across multiple stacked tiers bonded at a very fine pitch, so the bond interface behaves like an additional metal layer and the longest paths get shorter. That is how Huawei expects to recover frequency and efficiency it cannot get from the process alone. Huawei’s roadmap shows its intent. Prime core frequency is targeted to rise from 2.75 GHz in the Kirin 9030 to roughly 5 GHz by 2031, far beyond what planar scaling alone could deliver. Prime cores with 3.1 and 3.39 GHz clocks are being tested in its labs, although their power consumption is unknown. Beyond that, chips are in the design, simulation or pathfinding phase, meaning the frequencies are targets. However, the direction matters more: LogicFolding also helps with performance, not just density. The catch is that Huawei’s density claim is not directly comparable to foundry densities. A stacked design can report more transistors per package footprint by adding active layers, even if each patterned die remains well behind TSMC or Intel in front-end density. This is how Huawei can claim to reach foundry 14A-equivalent density by 2031. This is not a like-for-like foundry comparison, with Huawei using stacked logic and measuring density per package footprint. On a normalized Bohr-density basis, SMIC N+3 is ~114 MTr/mm², 38% less than Intel 18A’s HD library. Huawei’s 3D roadmap closes the gap by stacking active logic, reaching 215 MTr/mm² by 2030. In 2031, the roadmap density jumps to 295 MTr/mm², implying either a third active layer, partial EUV insertion or aggressive planar DUV scaling. Huawei’s methodology makes other foundries look much denser as well. Applying it to AMD’s MI450X with an N2 top die on an N3P base die yields a theoretical density of 460.2 MTr/mm² in 2026, compared with Huawei’s 295 MTr/mm² in 2031. This Kirin 9030 does not use LogicFolding, remaining in a conventional mobile SoC package. Instead, it forms the baseline for how far Huawei and SMIC can push planar scaling. Future teardowns of Kirin and Ascend chips will show both planar logic density and Huawei’s hybrid bonding solutions. Export controls changed China’s optimization problem rather than ending it. EUV restrictions raised the cost and complexity of leading-edge manufacturing without freezing it. SMIC reaches N6-class logic density through DUV immersion, SAQP and DTCO, while Huawei shifts more of the burden onto architecture, packaging and system-level integration. Future nodes will be tougher. N+3 still had room to tighten local metals and reduce cell height and CGP. Further scaling without EUV leaves fewer levers. More aggressive multi-patterning adds masks and overlay error. SMIC can keep pushing DUV, but each step will get more expensive and less forgiving. The design side is just as critical. Huawei had domestic EDA tools and flows before the Kirin 9030, with the Kirin 9000s, 9010 and 9020 making that clear. Huawei was able to ship multiple consumer SoCs on SMIC N+2 and N+3 while cut off from the Western EDA stack. US export controls restricted EDA tools for advanced chips in 2022 but did not target tools for more mature chips. In 2025, the US government briefly placed much broader restrictions on EDA software from Synopsys, Cadence, and others, before lifting them less than two months later as part of a trade deal tied to rare earths. Huawei has been unable to access those tools because it remains on a US trade blacklist. That forced Huawei, SMIC and Chinese academic institutions to build their own tools and flows. Researchers at Peking University recently announced a prototype EDA tool for Huawei’s LogicFolding architecture, which requires a new flow to handle the multilayer layout and floorplan. This is not the same as replacing the full Synopsys or Cadence stack, but it shows where domestic EDA is headed: toward tighter co-optimization between architecture, process and packaging. These advances are also diffusing into the Chinese ecosystem. SMIC is licensing its N+2 and N+3 processes to HLMC/Hua Hong at the government’s direction rather than by choice. If the same process learning feeds into Ascend accelerators for AI training and inference, the choke point shifts from one named fab to an ecosystem. Alibaba’s T-Head silicon arm and Cambricon, a Chinese AI chip designer that is expected to supply ByteDance, could also be major beneficiaries. Sanctions aimed at SMIC alone become less effective once the manufacturing knowledge has spread to other fabs and design houses. China is not closing the gap with Intel, Samsung and TSMC. The teardown shows the opposite in several places: no EUV, no backside power, higher process complexity, and visible trade-offs. But China is still advancing. If domestic chips become good enough for phones, inference, networking and security-sensitive workloads, they can matter strategically without matching TSMC at the leading edge. Behind the paywall, we show what else STEEL can do, with material and process flow analysis of SMIC N+3, and analysis of the Kirin 9030 package. We’re diving deep into the most advanced datacenter and AI hardware hitting the market. To learn more about what’s in the pipeline, access the full Kirin 9030 and SMIC N+3 analysis or to commission a custom teardown, contact sales@semianalysis.com.
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