SCROLL NEWS / DISCOVERY

Search headlines

Find the stories shaping the conversation.

Search mode
Refine results
Active filters Keyword All time

Results for " vote " 5,493 found 🔀 AI-powered Shuffle

Bridge DePaul is making room for political disagreement on campus

The group is entering its second year with plans to focus on dialogue, voter information and student engagement with different political ideas.

depauliaonline.com logo
Sep 28 • 7:00 AM EDT • Politics • depauliaonline.com
They led protests against Netanyahu. Can they turn outrage into political power?

As Israel heads toward elections, protest leaders are running for parliament — and finding that bringing people into the streets is different from winning their votes

forward.com logo
Sep 28 • 6:33 AM EDT • Politics • forward.com
The last day to register to vote for the November election in Texas is Oct. 5

Local election officials say you shouldn't wait until the last minute.

kut.org logo
Sep 28 • 6:00 AM EDT • Politics • kut.org
Vote now for the Thibodaux Regional Health Systems Athlete of the Week (Sept. 21- 27)

The poll is back open voting for the Houma Today/ Daily Comet Athlete of the Week, sponsored by Thibodaux Regional Health Systems. Vote now!

houmatoday.com logo
Sep 28 • 5:05 AM EDT • Health • houmatoday.com
Vote now for the Thibodaux Regional Health Systems Athlete of the Week (Sept. 21- 27)

The poll is back open voting for the Houma Today/ Daily Comet Athlete of the Week, sponsored by Thibodaux Regional Health Systems. Vote now!

houmatoday.com logo
Sep 28 • 5:05 AM EDT • Sports • houmatoday.com
Jude Bellingham’s World Cup haul earns second England award

Jude Bellingham has been voted England’s Player of the Year for the 2025-26 season, according to Mundo Deportivo, with the Real Madrid midfielder recognised by fans for a second consecutive campaign...

sports.yahoo.com logo
Sep 28 • 5:05 AM EDT • Sports • sports.yahoo.com
How voting rights restorations could impact the midterms

Geography, voting patterns and time all may mitigate the political parties’ ability to capitalize on a new well of potential voters to draw from.

vpm.org logo
Sep 28 • 5:00 AM EDT • Politics • vpm.org
Food Safety Finds a Place Among ‘Kitchen-Table’ Political Issues

Recent outbreaks of foodborne illness and high-profile recalls have made this issue a concern of voters.

kffhealthnews.org logo
Sep 28 • 5:00 AM EDT • Health • kffhealthnews.org
Food Safety Finds a Place Among ‘Kitchen-Table’ Political Issues

Recent outbreaks of foodborne illness and high-profile recalls have made this issue a concern of voters.

kffhealthnews.org logo
Sep 28 • 5:00 AM EDT • Politics • kffhealthnews.org
‘Voters aren’t naive’ claims former Ballon d’Or chief

Grigoriy Rtveladze: “Hold my beer.”

sports.yahoo.com logo
Sep 28 • 3:00 AM EDT • Sports • sports.yahoo.com
Locals, students give testimonies for Suicide Prevention Month

The Syracuse Common Council voted to recognize September 2026 as Suicide Prevention Awareness Month on Sept. 21.

dailyorange.com logo
Sep 27 • 8:52 PM EDT • Health • dailyorange.com
Locals, students give testimonies for Suicide Prevention Month

The Syracuse Common Council voted to recognize September 2026 as Suicide Prevention Awareness Month on Sept. 21

dailyorange.com logo
Sep 27 • 8:52 PM EDT • Health • dailyorange.com
Across the South, Black voters weigh a new political reality

New voting maps in the South have sparked a wave of grassroots activism following a major Supreme Court ruling.

yahoo.com logo
Sep 27 • 6:50 PM EDT • Politics • yahoo.com
Report: Conference executives crafting ‘Plan B’ ahead of Protect College Sports Act vote

Monday evening, the U.S. Senate is expected to hold a full vote on the Protect College Sports Act. In the meantime, executives at the conference level are crafting “Plan B,” Yahoo! Sports’ Ross Dellenger reported. The plan would include parts of the bipartisan Senate bill, including a $48.8 million revenue-share cap, which would be a […]

sports.yahoo.com logo
Sep 27 • 6:20 PM EDT • Sports • sports.yahoo.com
😐 Neutral (0%)
love
100%
Manchin says ‘if character means anything, you can’t vote for Ken Paxton’

“I don’t know that young man and things he’s said I’m discouraged about, but I can tell you, if character means anything, you can’t vote for Ken Paxton, if character means a…

newsnationnow.com logo
Sep 27 • 4:46 PM EDT • Politics • newsnationnow.com
Following the Dollars in American Politics

Money plays a powerful—and sometimes difficult to understand—role in American elections. Voters regularly hear terms such as campaign committees, PACs, Super PACs, independent expenditures, and issue advocacy. However, it is

shorelinemedia.net logo
Sep 27 • 2:46 PM EDT • Politics • shorelinemedia.net
AP Top 25: How Channel 2 sports director Zach Klein voted in this week’s poll

The Southeastern Conference has 10 teams in this week’s poll, including both of the top 2.

sports.yahoo.com logo
Sep 27 • 2:11 PM EDT • Sports • sports.yahoo.com
🙂 Positive (33%)
ahah
100%
Supreme Court vote shadows Maine Sen. Susan Collins in her first bid after abortion rights decision

The Nov. 3 election will be the first time Collins is on the ballot since the Supreme Court’s 2022 ruling that overturned Roe v. Wade, resulting in abortion being banned in much of the United States.

pbs.org logo
Sep 27 • 1:38 PM EDT • Politics • pbs.org
Supreme Court vote shadows Maine Sen. Susan Collins in her first race after abortion rights decision

The Nov. 3 election will be the first time Collins is on the ballot since the Supreme Court’s 2022 ruling that overturned Roe v. Wade, resulting in abortion being banned in much of the United States.

pbs.org logo
Sep 27 • 1:38 PM EDT • Politics • pbs.org
Local businesses see more customers from ArtPrize

GRAND RAPIDS, Mich. (WOOD) — ArtPrize is at its halfway point with one more week for people to explore art across Grand Rapids and cast their votes. While the event puts artists in the spotli…

woodtv.com logo
Sep 27 • 1:37 PM EDT • Business • woodtv.com
Bucs fans aren’t confident in the team’s direction

NFL fans also voted on which 0-2 team will make the playoffs.

sports.yahoo.com logo
Sep 27 • 1:33 PM EDT • Sports • sports.yahoo.com
🙂 Positive (50%)
love
100%
Politics has become a personality contest. Voters need to look at the record instead

In the age of celebrity politics, judge leaders by actual results. Politics has become a personality contest. That is exactly why voters need to look past the sound bites, and at the record

jpost.com logo
Sep 27 • 1:00 PM EDT • Politics • jpost.com
😐 Neutral (8%)
wow
100%
Recent Utah, Texas incidents fuel rumors and political narratives undermining trust in election integrity

Real voting issues become misleading narratives through false allegations of “voter fraud” intentions and other well-worn tactics.

cip.uw.edu logo
Sep 27 • 12:22 PM EDT • Politics • cip.uw.edu
In Knoxville, cheers for Trump

The president, booed at other big sporting events this year, drew mostly cheers at Neyland Stadium. In the parking lots, some of his own voters had misgivings.

washingtonpost.com logo
Sep 27 • 12:18 PM EDT • Politics • washingtonpost.com
Cook Political Report founder: House is a ‘done deal’ for Democrats, reclaiming Senate ‘very realistic’

Cook Political Report founder Charlie Cook on Sunday said that it has been a “done deal” conclusion that Democrats are likely to retake the House after the November midterm elections, w…

thehill.com logo
Sep 27 • 11:57 AM EDT • Politics • thehill.com
California voters to decide on Props 41 and 42, challenging the billionaire tax

California voters will face two ballot measures this November—Propositions 41 and 42—that aim to challenge the proposed billionaire tax and other future taxes like it.

kcra.com logo
Sep 27 • 11:25 AM EDT • Politics • kcra.com
Swiss voters reject bid to lock neutrality into Constitution

The country is known for neutrality, but Russia's war in Ukraine reopened questions over its non-engagement in foreign conflicts

euractiv.com logo
Sep 27 • 8:25 AM EDT • Politics • euractiv.com
Rogers Tries to Make El-Sayed’s Health Care Plan Scary

_Taylor, Michigan_HERE’S HOW YOU CAN TELL Mike Rogers is anxious to make up ground in the Michigan Senate race: He held a press conference on health care last weekend. Health care is usually a rough issue for Republicans, because voters associate the GOP with attacking cherished programs like Medicare and Medicaid that Democrats have historically supported. It’s a particularly difficult issue in this campaign, because a few months ago Donald Trump and the Republicans refused to extend temporary financial assistance in the Affordable Care Act. As a result of that decision, more than 20 million Americans faced higher insurance prices this year. That’s not a policy choice you want to be defending at a time when voters frequently cite the cost of health care as a top concern. Throw in the fact that Democratic nominee Abdul El-Sayed can draw on his credibility as a doctor and former public health director in Detroit, and it might seem like Rogers’s best bet would be to avoid health care altogether. But Rogers had his reasons to spotlight health care last Saturday. And they became apparent a few minutes before he spoke, when members of his campaign staff There’s a lot happening. Too much, some days. We can’t promise to have all the answers. But we can promise to keep asking the questions, following the facts, and figuring things out alongside people who care about where this country is headed. Read with us. Learn with us. And when it matters, stand with us. Join the side you’re already on. Join Bulwark+

thebulwark.com logo
Sep 27 • 8:01 AM EDT • Health • thebulwark.com
Harrison: Will Mississippi politicians avoid blame for rising healthcare costs?

Nearly all of Mississippi’s congressional delegation voted against extending the enhanced tax credits or subsidies for the Affordable Care Act Marketplace insurance policies.

sunherald.com logo
Sep 27 • 8:00 AM EDT • Politics • sunherald.com
Supreme Court vote shadows Maine Sen. Susan Collins in her first bid after abortion rights decision

As Maine Republican Susan Collins seeks a sixth Senate term, some voters are bringing up her 2018 vote to confirm Brett Kavanaugh as a Supreme Court justice.

ksat.com logo
Sep 27 • 7:54 AM EDT • Politics • ksat.com
Supreme Court vote shadows Maine Sen. Susan Collins in her first bid after abortion rights decision

As Maine Republican Susan Collins seeks a sixth Senate term, some voters are bringing up her 2018 vote to confirm Brett Kavanaugh as a Supreme Court justice.

clickorlando.com logo
Sep 27 • 7:54 AM EDT • Politics • clickorlando.com
Supreme Court vote shadows Maine Sen. Susan Collins in her first bid after abortion rights decision

As Maine Republican Susan Collins seeks a sixth Senate term, some voters are bringing up her 2018 vote to confirm Brett Kavanaugh as a Supreme Court justice.

clickondetroit.com logo
Sep 27 • 7:54 AM EDT • Politics • clickondetroit.com
Supreme Court vote shadows Maine Sen. Susan Collins in her first bid after abortion rights decision

As Maine Republican Susan Collins seeks a sixth Senate term, some voters are bringing up her 2018 vote to confirm Brett Kavanaugh as a Supreme Court justice.

click2houston.com logo
Sep 27 • 7:54 AM EDT • Politics • click2houston.com
Supreme Court vote shadows Maine Sen. Susan Collins in her first bid after abortion rights decision

As Maine Republican Susan Collins seeks a sixth Senate term, some voters are bringing up her 2018 vote to confirm Brett Kavanaugh as a Supreme Court justice.

news4jax.com logo
Sep 27 • 7:54 AM EDT • Politics • news4jax.com
Democrats for office, Republicans for policy?

My prediction for this election: Voters will vote against … themselves. Voters will elect Democrats to run virtually everything — and then approve ballot measures telling those Democrats to stop doing virtually everything. Democrats for office. Limited government for policy. Colorado has reinvented ticket splitting without the inconvenience of electing Republicans. We used to split […]

coloradopolitics.com logo
Sep 27 • 7:00 AM EDT • Politics • coloradopolitics.com
The most pressing midterm issues for rural voters

Affordability matters most for rural voters heading into the midterms.

axios.com logo
Sep 27 • 6:55 AM EDT • Health • axios.com
High-Signal Publisher
Can friends lobbying friends on politics really work? Editorial Board Roundtable

So, what does our Editorial Board Roundtable think of these approaches, paid and otherwise, of friends lobbying friends on how to vote?

cleveland.com logo
Sep 27 • 5:42 AM EDT • Politics • cleveland.com
Pennsylvania voters are split on whether they want Gov. Josh Shapiro to run for president in 2028

While poll respondents praised Shapiro's work as Pennsylvania governor, his stance on Israel — which has evolved over time— gives some voters pause on a White House run.

inquirer.com logo
Sep 27 • 5:01 AM EDT • Politics • inquirer.com
Washington Taxed Its Millionaires. Now the Rich Want It Repealed.

Washington State voters will get a chance to accept or reject the 9.9 percent income tax on millionaires approved by the Legislature, which broke the state’s taboo against levying income taxes.

nytimes.com logo
Sep 27 • 5:00 AM EDT • Politics • nytimes.com
Hackney voters show Labour's London challenge

In Hackney, locals talk of their financial worries and disillusionment with politics.

bbc.com logo
Sep 27 • 2:45 AM EDT • Politics • bbc.com
Deep dive
😐 Neutral (3%)
love
39%
sad
33%
wow
28%
Vote for Athlon’s College Football Awards: Standouts and Upsets Galore
sports.yahoo.com logo
Sep 27 • 12:10 AM EDT • Sports • sports.yahoo.com
Israel say football and politics must stay separate, after Ireland vote to fulfil fixture

The Israel Football Association has said football and politics need to remain separate in the wake of Ireland players voting ​on Saturday to fulfil Sunday's Nations League fixture between the sides ‌in Hungary.

reuters.com logo
Sep 26 • 1:00 PM EDT • Politics • reuters.com
Byron Donalds: 'Americans just want to be Americans again.'

Are voters finally over the partisan divide?

floridapolitics.com logo
Sep 26 • 12:46 PM EDT • Politics • floridapolitics.com
Byron Donalds says he would have debated David Jolly at Sunshine Economy Summit

'He just wants to hide from the voters.'

floridapolitics.com logo
Sep 26 • 10:55 AM EDT • Politics • floridapolitics.com
Intel Panther Lake Teardown, 18A, BSPD, GAAFET, SemiAnalysis STEEL

Panther Lake debuts the first commercial implementation of backside power delivery (BSPDN), introduces Intel’s first iteration of gate-all-around (GAA) transistors, and showcases their advanced packaging capabilities with its Foveros-S assembly. With Panther Lake, Intel’s manufacturing arc has shifted from nebulous roadmaps to shipped silicon, a significant milestone on their long road back to competitive semiconductor manufacturing. To evaluate the extent of Intel’s comeback, we tore down Panther Lake. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Our teardown traces 18A from its four-sheet RibbonFETs (Intel’s marketing name for GAAFETs) and gate stacks through contacts, frontside and backside wiring, and the bonded carrier. We explain how these material and integration choices improve gate control and reduce resistance, while adding capacitance, thermal resistance, and process complexity. Our measurements put Panther Lake’s 18A compute logic and TSMC N3E GPU logic at similar logic density. However, 18A does not lead TSMC N3P, N2 or Samsung SF2 in peak density. Panther Lake’s CPU cores are incremental updates, and the high-end GPU still uses TSMC N3E. Panther Lake assembles one compute tile, one GPU tile, and one I/O tile atop a passive base tile using Intel’s Foveros-S advanced packaging. Both compute tile variants use Intel 18A. The Xe3 GPU options are a 4-core GT1 tile on Intel 3 and a larger 12-core GT2 tile on TSMC N3E. Both I/O tile variants use TSMC N6. [1], [2] Our analysis centers on the PTL-U compute tile, both the 4-core and 12-core GPU tiles, as well as the 12-lane I/O tile. In conventional chips, power and signal are routed through the same frontside metal stack towards the device frontend. Power rails consume scarce routing resources near the transistors, while tall via stacks carry VDD and VSS from the coarse upper wires to local rails. Backside power delivery (BSPD) moves the main power network behind the transistor layer, to the backside, separating it from frontside signal routing. We covered BSPD and its impacts in 2024. [3], [4], [5] Intel’s BSPD implementation, branded as “PowerVia”, routes power through dedicated backside metals to nano-TSVs, which connect those rails to local source/drain (S/D) contacts. Implementing that separation requires Intel to build the interconnect stacks from both sides of the wafer. The frontside comprises the M0-M14 signal stack, while the backside comprises the BM0-BM5 power stack. M0 and BM0 are closest to the transistors. The nano-TSVs connect the two sides, but Intel patterns and etches each via from the front after forming the contacts. A narrow via runs from the side of the contact deep into the silicon substrate. Intel then completes the frontside signal metal stack, bonds the wafer to a carrier, flips it and removes the original substrate until the buried via tips are exposed. The backside metal stack is then deposited directly on the revealed vias. The nano-TSV and backside-via profiles taper in opposite directions because Intel forms them from opposite sides of the wafer. The transistor structures form the FEOL. Local contacts and nano-TSVs connect them to the wiring. M0 begins the frontside interconnect stack. The silicon carrier remains attached above the frontside interconnects. It supports the device wafer during substrate removal and backside processing and remains part of the finished chip’s thermal path. PowerVia removes the main power distribution from the congested frontside metals, routing supply through shorter and wider backside wires. Its lateral landing still occupies area in the standard cell, so it recovers less cell area than a direct backside contact. [3] Nano-TSVs beside the logic devices carry VDD or VSS from the backside power network, while signal connections continue upward through the frontside metals. Backside Interconnects Samsung SF2 data is included for comparison to Panther Lake’s within this article. SF2 is the incumbent GAA foundry node but lacks BSPD, serving as a useful reference to evaluate 18A. A full teardown of Samsung’s S26 products, processed on SF2, will be shared soon.Nanosheet-cut EDS comparison. The PowerVia supply path runs from the backside Cu rails through Mo-lined W nano-TSVs to the local transistor contacts. In this cross section, the tapered connection spans roughly 150 nm from the contact level to BM0. The Ta liner confines Cu and promotes adhesion to the surrounding stack; the AlOₓ etch stop controls the next dielectric etch above the rail. Dielectric beneath the ribbons electrically separates the devices from the backside wiring and removes the conducting silicon body below the channel. [6] AlOₓ serves as an etchstop (ES), enabling endpointing and protecting the underlying layers. Low-volatility aluminum fluoride reaction products resist the fluorinated plasma, allowing a thin AlOₓ film to protect the metal while the surrounding low-k dielectric is removed. [6], [7]. While the BM0 and layers above the M1 lines show double AlOx layers, Our SMIC N+3 teardown showed single AlOₓ layers. SMIC uses a simpler local AlOₓ substack, while the remaining cap and etch sequence provide the required landing protection. So why double layers? The closely spaced AlOₓ doublets provide two protected endpoints in the etch sequence. Intel documents an AlOₓ/SiN/AlOₓ stack that explains the benefit. The main dielectric plasma etch stops on the first AlOₓ film; a selective wet clear opens that film; a second plasma etch removes the intermediate SiN and stops on the second AlOₓ film. The final wet clear exposes the metal landing surface. SiN is the intermediate dielectric in Intel’s published example. [8] The second stop protects the metal through a cap breakthrough. Wide openings can etch faster than narrow ones, and etch depth varies across the wafer. Metal under an early-clearing opening would otherwise be exposed while other openings still need more etching. Staged protection widens the process window and reduces metal erosion, corrosion and void formation. [8] TSMC documents AlN/AlOₓ/SiOC/AlOₓ above Cu, with AlN blocking Cu diffusion, and a simpler AlN/SiOC/AlOₓ variant that omits one AlOx film. [9] Levels with different opening sizes, aspect ratios, pattern densities and cap materials need different etch margins. A double AlOx stop is useful where another protected endpoint justifies the added processing. The extra film adds formation, selective opening and cleaning steps, plus another set of interfaces to control adhesion, moisture, and stress. These blanket films are opened through the existing via pattern, so each film does not require another lithography mask. AlOₓ adds parasitic capacitance when it replaces lower-k dielectric; two thin AlOₓ films can nevertheless contain less AlOₓ than one thick film. Total thickness, placement, and theintermediate dielectric determine the electrical cost. Deposition chemistry also changes AlOx permittivity and residual hydroxyl content, which can oxidize the underlying metal. [7], [8], [10], [11] The backside stack separates into relatively fine BM0-BM2 wiring near the devices and coarser BM3-BM5 power distribution. The largest pitch increase occurs between BM2 and BM3. BM0’s pitch closely matches the logic-row height, fitting local power delivery to the cell rows. Higher levels aggregate current through larger conductors: routing density becomes less important than low resistance and current capacity as the network approaches the package. This hierarchy provides wide power wiring for the power delivery network without consuming scarce frontside signal-routing resources. [3] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Frontside Interconnects Intel 18A combines Mo-lined W contacts and nano-TSVs with a separate backside Cu power network. Samsung SF2 keeps power on the frontside, using Ti-based contact interfaces and Ta-based barriers and Co liners around Cu wiring. In 18A standard-cell rows, backside power rails supply the devices through nano-TSVs within the cells, freeing frontside routing resources. Samsung’s M0 accommodates both power and signal connections. From the device toward M0, the connection runs through a Ti-based S/D interface, W contact fill, a Mo-lined W via, and the Cu M0 wire. Mo supplies a conductive nucleation and adhesion layer for W, replacing the resistive TiN liner used in conventional W integration. This increases the effective conduction volume within the feature while retaining W fill and its established polishing, cleaning and etching processes. Intel’s Mo/W patent describes this integration tradeoff. The nano-TSV uses the same Mo-lined W construction in the backside supply path. [12] The move from TiN to Mo is an incremental change. While a full Co or Mo fill can also reduce the volume lost to liners in very small features, it requires new integration schemes that increase complexity and risk. Cu remains attractive for wider wires due to its low resistance. As wires and vias shrink, the diffusion barrier consumes an increasing fraction of their cross-section. [12], [12], [14] Intel uses Co/Ru liners at M0-M1, Co at M2-M4, and Nb at M5-M9. The lower-level liners help Cu adhere and reduce void formation during trench fills. Applied Materials’ Endura has new thermal control that facilitate wetting process, so the thin film continuity is good enough that good capillary pressure will drive Cu atoms to the via bottom without voiding. Intel’s choice to use Nb is particularly interesting. Intel’s Nb patent describes a conductive diffusion barrier intended to reduce the barrier’s contribution to resistance relative to conventional Ta-based barriers, particularly at via bottoms where all current crosses the barrier. The patent pairs Nb in coarser levels with the option of lower-cost PVD processing. [15], [16] The upper metal layers support thicker barriers formed through physical vapor deposition (PVD) despite its worse coverage and uniformity. Meanwhile, the lower metal layers require thinner barriers deposited through conformal atomic layer deposition (ALD). Co/Ru adds another material interface and requires controlled deposition and Cu fill. Changing liners and barriers by metal layer allows Intel to optimize interconnect resistance, process complexity, and reliability. [15, 16] RibbonFET, Intel’s name for its gate-all-around FETs (GAAFETs), replaces the FinFET’s vertical fins with four stacked horizontal silicon nanosheets, allowing the gate to surround the channel on every side. The path to GAAFET begins with the planar transistor. A planar MOSFET places the gate above the channel between its source and drain. Pairing an NMOS with a PMOS transistor creates a CMOS inverter, in which the NMOS pulls the output low for a high input, and the PMOS pulls it high for a low input. The gate must retain electrostatic control of the channel to ensure clean switching. As gate lengths shrank, the drain began to compete with the gate for that control, increasing off-state leakage. Electrostatic control was restored through an architectural evolution that raised the channel into a vertical fin and wrapping the gate around three sides. Called “FinFET”, this new architecture packed more effective channel width into a smaller footprint. Further scaling made it harder to maintain both drive current and leakage within smaller cells, and reintroduced the same problems planar MOSFETs faced. Nanosheet GAAFETs close the fourth side by replacing the vertical fin with a stack of horizontal nanosheets, each surrounded by the gate. The tighter electrostatic control suppresses leakage at shorter gate lengths while stacking adds effective channel width within the cell footprint. In a FinFET process, channel width changes in discrete steps as designers must add or remove whole fins. Nanosheet width can instead be adjusted continuously within the process’s design rules. Wider sheets increase drive current, while narrower sheets reduce capacitance at the cost of drive current. Intel 18A uses stacks of four nanosheets each and varies their widths across logic and SRAM. At the process level, adding more sheets to each stack increases effective channel width and drive current, but complicates fabrication. RibbonFET vs MBCFET Samsung began GAAFET production in 2022 with SF3E, following with SF3 and now SF2. Its ‘MBCFET’ provides a useful structural comparison with Intel’s first RibbonFET implementation. [17] STEEL is digging deeper into SF2, used in the Exynos 2600, and TSMC’s GAAFET N2, used in Apple’s A20 Pro, in upcoming newsletter articles. We’re throwing some teasers on X. Let’s compare Samsung SF2’s MBCFET with Intel 18A’s RibbonFET. Subscribe Even to the untrained eye, Intel’s extra nanosheet is obvious. Intel stacks four ribbons to Samsung’s three. Samsung’s sheets are much wider in these fields, so both sheet count and width matter to the available channel perimeter. Sheet width also changes which silicon surfaces carry current. On conventional (001) silicon, wide nanosheets emphasize the broad top and bottom surfaces, favoring electron transport; the larger sidewall contribution in a narrow sheet favors hole transport. Thinner sheets improve gate control but increase confinement and scattering. This makes width and thickness part of the NMOS/PMOS balance, alongside strain and threshold voltage. [18], [19] GAAFET designs like 18A use different work-function-metal (WFM) stacks for NMOS and PMOS. Around each ribbon, a thin SiOx interfacial layer separates the silicon channel from the HfOx high-k dielectric, with La providing dipole tuning and the WFM wrapping the dielectric. NMOS uses a TiAl-based stack, while PMOS uses TiN WFM. W fills the remaining gate trench, providing a lower-resistivity path where the work-function layers are no longer needed. In this field, the PMOS stacks leave room for W between ribbons, while the NMOS stacks occupy more of those gaps. A silicon-based dielectric marks the P/N boundary, allowing the PMOS and NMOS gates, sharing the same gate trench, to be processed sequentially. Fast logic paths, retention circuits, and SRAM need a family of threshold options. Changing threshold without substantially changing device dimensions, capacitance or fabrication complexity is valuable. FinFET processes typically use different work-function-metal stacks. In a four-ribbon GAA stack, the narrow sheet-to-sheet gap limits how much WFM can fit around each channel. La in the gate dielectric creates interfacial dipoles at the SiOx/HfOx boundary, shifting effective work function and tuning threshold voltage. This gives Intel another control alongside its NMOS and PMOS WFM stacks. Low-threshold devices improve critical-path drive; higher thresholds reduce leakage elsewhere. Dipole tuning is especially useful in GAA because it changes threshold without consuming the narrow intersheet gap with thicker WFM. Precise control of La incorporation, diffusion and interface quality has long been a challenge, limiting viability in high volume production but is now seen from every leading-edge foundry. Intel’s patent describes depositing a dipole-forming oxide above HfOx and annealing it toward the interfacial oxide before completing the work-function and fill metals. This separates threshold tuning from the space available for metal. Newer research addresses the thermal cost: imec’s 2026 dipole-middle research inserts the shifter between two HfOx depositions, shortening the diffusion path while protecting SiOx during patterning. [20], [21]Matched-cut EDS, Intel 18A (left) vs. Samsung SF2 (right). Intel retains raised source/drain epi beneath its contacts, while Samsung recesses W deep into the epi to form a V-shaped Ti-lined interface. The deeper contact increases metal-to-semiconductor area and shortens the current path from the lower sheets, reducing contact and spreading resistance. It also removes epi volume and brings the contact etch closer to the channel ends. Retaining more epi preserves the material available for strain transfer, especially from SiGe into PMOS. These geometries balance contact access against stress engineering and etch margin. [22], [23] Samsung stacks three sheets to Intel’s four ribbons, and both processes use sheet width to tune drive strength. In our Samsung cross-sections, widths range roughly from 19 to 30 nm in the NPU rows and 37 to 50 nm in the CU cell. The Samsung nanosheets taper, with the widest sheet at the bottom and the narrowest at the top. Both processes use HfOx gate dielectric and Ti-based work-function stacks, with Al in the NMOS stack. In the Samsung devices shown here, the dielectric and WFM occupy the intersheet gaps, leaving W above the top sheet. Intel’s PMOS stack leaves more room between ribbons, and W fills those gaps while the thicker NMOS stack leaves W mainly in the upper trench. Gate-stack EDS maps. The W between Intel’s PMOS ribbons provides a conductive path close to the lower gates. Where WFM fills the entire gap, the gate still surrounds the channel, but voltage reaches it through the more resistive work-function films. Thinner WFM and dipole tuning preserve room for low-resistivity fill; Mo and Ru are alternative fill metals being developed for further scaling. [24] A masked, sequential WFM flow explains the different gate heights and inter-nanosheet fill. The proposed sequence below shows how separate NMOS and PMOS work-function steps produce that geometry. Enabled by the BSPDN process, Intel replaces the dense-logic silicon subfin with dielectric, removing the parasitic conduction path below the ribbons and reducing substrate-related capacitance. A retained silicon body as in classical, non-SOI, planar and FinFET designs needs junction and punchthrough-stop engineering to suppress leakage. Dielectric isolation makes that leakage less sensitive to the subfin doping profile but adds removal and fill steps. It also weakens the direct thermal path through silicon, making the contacts, metal stacks and package more important for heat extraction. [24], [26] Fluorine is concentrated around selected Intel device structures in the maps. WF6 is a standard precursor for W nucleation and fill, while barrier films protect adjacent dielectrics from fluorine attack. Low-fluorine W processes reduce the residual-F burden. Chloride-based precursors avoid introducing F during W deposition, but require control of chlorine attack, nucleation and fill quality. The integration target is a continuous, low-resistance W path with a thin protective liner and minimal chemical damage to the surrounding stack. [20], [27], [28] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. We measured cell height, gate pitch, metal geometry, and ribbon dimensions at the XTEM sites shown below. The tables group these dimensions by site and device polarity. Our “sheet cuts” cross the silicon channel and show the ribbons end-on. “gate cuts” run along the channel through successive gates. The 18A logic cell dimensions point to a five-track logic library while the N3E and Intel 3 cell dimensions evidence a seven-track logic library. The DDR-PHY uses wider M0 wires and much larger spacing than core logic. That trades routing density for lower wire resistance and weaker coupling between neighboring nets. The geometry suits the current delivery and coupling requirements of analog, clock, and I/O circuitry. PowerVia lets 18A combine a compact cell height with wider M0 geometry by moving the main power rails off the signal-routing tracks. That relaxes local wire scaling while preserving a small cell footprint. Cell height and gate pitch set the geometric density; pin access and routability determine how much of it a real block can use. [29] The biggest takeaway from our gate-pitch measurements is that Intel 18A compute logic and TSMC N3E GPU logic have similar density in the Bohr representative-cell model. The 18A example is 18.6% denser than the Intel 3 GPU example. Gate pitches are nearly identical across the three sites, so cell height drives most of the difference. The Bohr model combines a four-transistor NAND2 spanning three gate pitches and a 32-transistor scan flip-flop (SFF) spanning nineteen pitches, weighting their densities 60:40. The sensitivity column shows how independently changing cell height and gate pitch by ±1 nm changes the result. This compares representative cell geometries; whole-die density also depends on cell mix and placement. The 18A P-core gives M0 substantially more metal cross section than the N3E vector engine. Treating each profile as a trapezoid gives 2.63 times the area per line and 1.84 times the area after normalization by routing pitch. The larger section reduces the geometric contribution to line resistance and lowers current density for a given current. Taller and wider wires also add capacitance, so circuit delay depends on the balance of resistance and capacitance. The DDR-PHY has less metal area per routing width than the 18A core fields, while remaining above N3E. [30] Area = height × (top CD + bottom CD) / 2, including liners. Area/pitch normalizes by routing width. Taper is the symmetric sidewall angle from vertical, with the largest angle belonging to the DDR-PHY. Compute tile The measurements show how ribbon dimensions and gate-stack geometry vary across the compute tile and between NMOS and PMOS to balance channel drive, gate load and the space needed for the dielectric/WFM stack across logic, SRAM and the DDR-PHY. Width mainly changes available channel perimeter; thickness also changes electrostatic control and carrier confinement. Gate-stack thickness then determines the space left for low-resistivity fill P-core and LP E-core logic Both the P-core and LP E-core use multiple nanosheet widths. Widths are measured on high-magnification XTEMs while wider-field images demonstrate additional width choices within the LP E-core. Multiple widths are expected even within an LP E-core. Timing-critical paths, buffers and cells with different fanout need different drive strengths. The lower-magnification fields show this width diversity beyond the sites quantified in the table. L2 and L3 SRAM GAA gives SRAM designers another way to balance the pull-up (PU), pass-gate (PG), and pull-down (PD) transistors. FinFET bitcells set device strength through fin count while GAA adds nanosheet width as a sizing knob. In a 6T SRAM cell, a strong pull-down relative to the pass-gate limits read disturbance, while a strong pass-gate relative to the pull-up improves writability. During a write, the pass-gate and write driver pull the node storing “1” below the inverter trip point. During a read, the pull-down holds the node storing “0” low. Bias, threshold voltage, mismatch and assist circuitry set the remaining margin. FinFET high-current cells commonly use a PU:PG:PD fin-count pattern of 1:2:2, a device-sizing ratio rather than a current ratio. Ribbon width lets Intel balance SRAM strengths without adding whole fins. The L2 cell uses its narrowest ribbons for PU and widest for PD, improving writability and read stability respectively. Intel’s disclosed HCC operates without assist; its denser HDC uses negative-bitline write assist. Pulling the selected bitline briefly below ground increases pass-gate overdrive so it can overpower the pull-up at lower supply voltage. That buys density and low voltage writability at the cost of boosting circuitry, switching energy, and additional voltage stress that must be controlled. [31], [32] Four rectangular ribbons give the perimeter = 8 × (width + thickness), before corner rounding. PG/PU is 1.49 and PD/PG is 1.16. The L3 structures closely resemble L2 in layout and cell height. Fewer L3 nanosheet widths are tabulated because fewer high-magnification images were available. DDR PHY The DDR-PHY trades density for controlled analog behavior and reliable off-chip signaling. It contains drivers, receivers, delay circuits, and calibration logic that set drive strength, sampling time, and voltage margin. Repeated four-sheet devices with similar widths fit the use of regular transistor units for matching and programmable drive. Its wider local wiring provides room for current delivery and separation of sensitive signals, while consuming more area than a dense core-logic grid. The layout serves the memory channel’s electrical requirements as well as digital logic density. [33] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Intel 3 GPU devices Vector engine logic Intel 3’s XVE logic uses two-fin PMOS and NMOS devices with power rails in M0. Its cell height and M0 pitch give a seven-track geometry, two tracks more than the 18A logic. One-fin groups also appear among the two-fin devices. Intel 3 L2 SRAM The Intel 3 L2 SRAM uses the familiar HCC sizing pattern: one PU fin, two PG fins, and two PD fins. N3E GPU devices Vector engine logic The N3E XVE field contains repeated two-fin devices with seven-track cell geometry. N3E remains a FinFET process, giving Panther Lake a direct FinFET-to-RibbonFET comparison. N3E L2 SRAM The N3E L2 SRAM uses the same PU:PG:PD fin-count pattern of 1:2:2. Panther Lake-U follows Lunar Lake’s floorplan quite closely. Both pair 4 P-cores with 4 LP E-cores and NPU, media and display engines in similar locations. Lunar Lake also uses Xe2, the direct predecessor to Panther Lake’s Xe3 GPU. This makes Lunar Lake the most direct basis for our comparisons. Arrow Lake differs in core count and uses the older Xe-LPG GPU architecture, so we only use it where it offers a more direct component-level comparison. Compute tile Panther Lake compute-tile floorplans remain sparse even months after launch. Intel 18A’s backside metal and dielectric stack must be removed without damaging the underlying structures before a clean transistor-level floorplan can be imaged. Most published die shots hide or heavily process the background, but we are quite proud of the die shot we achieved and are excited to show the work we have done. We measured the areas of the key components on the compute tile and compared them with their Lunar Lake predecessors on TSMC N3B. These help us to capture changes in block area and compare the two chips across process nodes and designs. Our total tile areas exclude the scribe-line area. The compute-plus-GPU subtotal below uses the PTL-U compute tile and GT1 GPU; it excludes the I/O tile and passive base. Individual block areas use the boundaries marked on the floorplans The compute-plus-GPU row is recomputed from the displayed PTL-U and GT1 areas. Component rows use their stated per-region counts and are not an additive partition of the whole tile. The P-core area remains almost unchanged between Lunar Lake and Panther Lake, despite L2 capacity increasing from 2.5 MiB to 3 MiB. Arrow Lake uses the same Lion Cove core as Lunar Lake but also has a 3 MiB L2. Cougar Cove fits 20% more L2 into the same P-core area. The larger private cache keeps more of each core’s working set close to its execution units, reducing access to shared L3 and DRAM. Extra capacity adds storage leakage and lookup energy, so designers balance it against avoided lower-level accesses. The shared P-core L3 cache also shrank by 14.8%. [2] Cougar Cove combines a similar footprint with Intel’s reported power-efficiency improvements. RibbonFET’s tighter channel control reduces leakage, while PowerVia reduces supply droop and allows tighter voltage guardbands. [1] Darkmont’s four-core LP E-core cluster is 5.0% smaller than Skymont’s on Lunar Lake, with most of the reduction in its L2 regions. The 1 MiB region shrank by 8.4% and the 1.5 MiB region by 14.9%. The tag arrays also use one fewer visible row. Tags identify which memory addresses the data array holds, so rearranging them changes the cache’s layout and wiring without requiring less data capacity. [2] The LP E-cores share one L2. This pools capacity and avoids duplicating all the cache machinery, but the four cores contend for its banks and bandwidth. Their separate cluster also keeps light work away from the performance cluster and its L3, allowing that larger domain to sleep. [1], [2] Cache area includes more than the storage cells. Tags identify each line, decoders select rows, sense amplifiers read the small bitline signal, and wires connect to the banks. Splitting an array into smaller sections shortens wordlines and bitlines, improving access speed, but duplicates peripheral circuits. Panther Lake’s smaller cache regions therefore reflect the complete memory implementation, including how much of each region is devoted to storage. [34] Unlike Meteor Lake and Arrow Lake, Panther Lake has no separate SoC tile. The NPU, LP E-cores, memory controllers, PHYs, media and display engines now share the compute tile. This removes an active die and keeps CPU memory traffic on one die. The cost is moving PHY and I/O-related circuitry onto 18A: drivers, receivers and analog circuits must still meet external voltage, loading and signal-integrity requirements, so their area does not shrink like dense digital logic. [1], [2] The biggest shrink comes from the NPU, which occupies 36.9% less area. NPU 5 consolidates the same total INT8 MAC count into half as many neural compute engines. Each of the three NCEs has a larger MAC array to make the complete NCE envelope 22.6% larger than an NPU 4 engine. Consolidation also halves the number of scratchpads and SHAVE DSPs, from 12 to 6. The MAC array handles matrix multiplication and convolution, while SHAVE executes vector and custom operations that fit the array poorly. [1], [2], [35] The paired floorplans identify each NCE envelope and its scratchpad, MAC, and SHAVE regions. Each measured MAC polygon is counted once per NCE in the area accounting below. The scratchpads store weights, activations, and intermediate results near the MAC arrays, allowing repeated use without fetching them again from DRAM. Halving their number delivers the largest measured area saving but leaves less local storage for the same total MAC count. Layers that no longer fit locally require smaller working tiles or more transfers of intermediate data. The benefit depends on keeping the enlarged arrays busy while managing that tighter storage budget. [36] NPU 5 also adds native FP8. Using half the operand width of FP16 reduces storage and transfer demand, helping workloads fit the smaller local memory budget. Lower precision and format-dependent range make scaling and model validation part of deployment. Hardware activation functions further reduce work that would otherwise occupy the programmable DSPs. [1], [2] Microsoft requires an NPU to deliver at least 40 TOPS for Copilot+ PCs. Both Lunar Lake and Panther Lake meet this threshold, but Panther Lake uses significantly less silicon. GPU tiles Panther Lake is Intel’s first product with Xe3, its latest GPU architecture. It offers two different GPU tiles: a smaller GT1 tile with 4 Xe3 cores on Intel 3 and a larger GT2 tile with 12 Xe3 cores on TSMC N3E. Panther Lake allows us to compare the same GPU architecture across both Intel 3 and TSMC N3E. Wildcat Lake adds a third Xe3 implementation on Intel 18A. A future newsletter will detail Xe3 and its implementation differences across all three process nodes. GT2 scales Xe3 to a different physical layout, with render slices arranged vertically instead of GT1’s horizontal arrangement. Slice placement sets the distances to shared cache banks and the D2D interface. Those wires consume area and add delay, so scaling the number of Xe cores also requires a new balance of cache placement, routing and timing. [1] What’s immediately obvious is that the GT2 tile on TSMC N3E has much smaller Xe cores than GT1. These block areas include logic, caches, and routing. An Xe core on the GT1 tile is ~69% larger than one on Lunar Lake, and ~55% larger than one on GT2. Intel 3 therefore uses substantially more area per Xe core. The block-area gap exceeds the measured logic and SRAM density gaps, bringing routing, timing targets, cell mix, and floorplan allocation into the comparison. The measured vector/matrix engine region is almost unchanged between Lunar Lake and Panther Lake’s GT2 tile. Xe3 retains eight 512-bit vector engines and eight 2048-bit XMX engines per core. Its gains also come from feeding those engines more effectively: more resident threads hide stalls, and variable register allocation lets shaders trade registers per thread against the number of threads kept active. [1] The shared L1/SLM capacity increased by 33% from 192 KiB to 256 KiB, while its area increased only 5%, raising effective density by 27%. L1 retains reused cache lines, while software-managed SLM lets a thread group share data locally. Both reduce traffic to more distant memory. Allocating more SLM per group can also limit how many groups reside on a core at once. [1], [37] The GT1 tile carries 4 MiB of L2 against 16 MiB on the GT2 tile. GT1 divides its L2 cache into four 1 MiB banks, while GT2 uses eight 2 MiB banks. Each bank contains 128 macros, but each N3E macro stores 16 KiB, twice the Intel 3 macro’s 8 KiB capacity. The N3E macro is only 54% larger while holding twice as many bits, giving it 30% higher density: ~23.7 Mbit/mm² versus 18.3 Mbit/mm². Including bank-level circuitry, the gap widens to ~16.9 Mbit/mm² on GT2 versus ~10.4 Mbit/mm² on GT1. GT2 gains density with its macros storing more bits per unit area, and those macros occupy more of each cache bank. Larger macros spread decoder and sense-amplifier overhead across more storage, while a more compact bank layout reduces the share spent on control and routing. The compromise is longer wordlines and bitlines that carry more capacitance. [34] I/O tile Panther Lake uses two I/O tile variants, both fabricated on TSMC N6. The smaller one provides 4 PCIe 5.0 and 8 PCIe 4.0 lanes and serves lower-tier systems as well as those without a discrete GPU, while the larger one adds 8 PCIe 5.0 lanes, bringing the total to 20 lanes, for discrete-GPU connectivity. Panther Lake SKUs with the larger 10- or 12-Xe GPUs use the smaller I/O tile. [38] The smaller I/O tile adds a PCIe 4.0 block and a Thunderbolt block to Lunar Lake’s I/O layout, providing four additional PCIe 4.0 lanes and another Thunderbolt 4 port. Its repeated N6 blocks retain nearly identical areas and layouts. Reusing these proven PHYs and controllers avoids porting and requalifying external interfaces on 18A, where faster digital logic offers less benefit to circuits constrained by the off-chip link. [38] SemiAnalysis’s teardown lab (STEEL) dives deep into the world’s advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. We’re hiring technical experts from system to transistor and everywhere in between. Check out our Careers page. Panther Lake offers scalability and modularity through its disaggregated packaging that partition compute, GPU, and I/O silicon into separate tiles allowing for a suite of tile configurations. This partitioning makes the package part of Intel’s node economics as it determines how much leading-edge wafer area each product consumes, which functions can remain on other processes, and how much configuration freedom Intel can offer from a shared set of tiles. Furthermore, fabricating the compute and GPU tiles separately confines the new 18A process to the compute tile and allows graphics and I/O to use other, more established, and more cost-effective processes. For Panther Lake, the GPU and I/O tiles are assembled alongside the compute tile on a passive silicon base using Foveros-S. Intel’s current technology brief lists a nominal 36 µm pitch for Foveros-S. Through-silicon vias (TSVs) in the base connect the fine wiring above to the larger package connections below. The functional tiles sit side by side on that passive base in a 2.5D configuration. [39] Our cross-section through the compute and GPU tiles shows the package’s wiring hierarchy. Microbumps connect each active tile to the passive silicon base; its fine redistribution layer (RDL) carries the short, dense tile-to-tile links. TSVs carry connections through the base to the package substrate, which fans them out to the much coarser motherboard solder joints. The base supplies interconnect, while computation remains in the active tiles above it. [39] At the compute-tile edge, the higher-magnification inset shows a local microbump spacing of approximately 25.24 µm and a feature width of 12.33 µm. These local spacings are finer than Intel’s nominal Foveros-S value. The X-ray fields further confirm tighter neighboring bumps, consistent across every die-to-die area found on each tile. Additional X-ray analysis is offered after the paywall. Putting the memory controller beside the CPU removes the D2D transfer that CPU memory requests required in Meteor Lake and Arrow Lake. This avoids the extra transmitter, receiver, and link traversal, saving interface energy and latency. Panther Lake’s separate GPU still crosses a D2D link to reach DRAM, so its larger local caches also help contain package traffic. [1], [40] Smaller dies are less likely to contain a random fatal defect, and screening them before assembly prevents one bad tile from consuming a complete package of good silicon. Reuse also spreads design and qualification work across more products. Against those gains, Intel pays for the passive base, D2D circuits, extra bonding and test steps, and losses during assembly. Cost per working product across the portfolio captures the combined effect of wafer yield, reuse, test, and assembly. [29] Wildcat Lake packaging Intel launched Core Series 3, formerly Wildcat Lake, on 16 April 2026 for value mobile and edge systems. Wildcat Lake keeps 18A but removes the passive base and combines more functions on one die to simplify the package. The two products therefore reveal two distinct ways to commercialize the same leading-edge process. [41] Wildcat Lake’s 18A die combines up to two Cougar Cove P-cores, four Darkmont LP E-cores, two Xe3 cores and a smaller NPU. A separate platform-controller die supplies I/O, connected through UCIe, Intel’s first processor implementation of the standard. Consolidating graphics remove a tile boundary and the passive base, reducing assembly complexity for a modest-bandwidth value product. It also ties CPU and graphics scaling to the same die, giving up Panther Lake’s ability to swap in a much larger GPU. [42], [43] In July 2021, Intel CEO Pat Gelsinger set out an ambitious process roadmap aimed at regaining performance leadership by 2025, later described as five nodes in four years. Five years and one CEO later, Intel’s comeback story is not as unambiguously positive as Pat may have hoped. [44], [45] Intel once set the pace for process technology, bringing high-k metal gate technology and FinFETs into volume production years ahead of the rest of the industry. Its 22 nm FinFET process reached consumers with Ivy Bridge in 2012. [46] Intel’s integrated device manufacturing (IDM) model allowed its architects and process engineers to co-optimize products and processes. Starting with Sandy Bridge, Intel dominated x86, while AMD struggled with Bulldozer. That lead faltered at 14 nm and broke at 10 nm. Intel targeted a massive 2.7× density increase, but the node arrived years late and required several revisions before it could support Intel’s full lineup. This delay forced Intel to stretch 14 nm across six generations, while TSMC moved ahead in process technology and AMD recovered in x86. By 2019, Intel was still shipping 14 nm across most of its product stack, with its 10 nm client ramp focused on Ice Lake mobile processors. Meanwhile, TSMC was shipping N7 and N7+, and AMD’s Zen 2 compute chiplets used N7 to raise core counts and improve efficiency. Intel’s process failures were central to its decline, but unsound business decisions furthered their downward slide. Product delays compounded product mistakes, pushing client, server, and FPGA roadmaps off schedule. Several attempts to enter AI (Nervana and Gaudi) and networking (Tofino) also failed to establish lasting businesses. Intel’s recovery has focused on consumer CPUs and advanced packaging. Tiger Lake, Alder Lake, Lunar Lake and now Panther Lake have restored Intel’s consumer roadmap. On the process side, Intel 4 shipped with Meteor Lake, Intel 3 with Granite Rapids and Sierra Forest, and Intel 18A with Panther Lake. Intel has also made advanced packaging part of its foundry offering. However, Intel is still playing catch-up in servers. Several Xeon generations arrived years late and trailed contemporary AMD and Arm server CPUs in performance, efficiency, and core count. The process roadmap is back, but Intel does not hold the same process-technology leadership position it held prior to 10 nm. The introduction of gate-all-around nanosheets and backside power delivery are two of the biggest changes to transistor integration in a decade. Intel took on both changes at once: 18A paired its first RibbonFET with PowerVia in Panther Lake. Panther Lake is a substantial manufacturing milestone. Our cross-sections show how RibbonFET and PowerVia reshape local contacts and wiring, while the floorplans show where architectural consolidation and process choices save area. A sustained competitive lead depends on product performance, cost, yield, and the next implementation. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page.. [1] Intel, “Intel Tech Tour 2025 Panther Lake recap,” Doc. 866361, 2025. Accessed: Sep. 14, 2026. [Online]. Available: https://cdrdv2-public.intel.com/866361/ITT_2025_Panther_Lake_Recap1.pdf [2] Intel, “Core Ultra processors Series 3 datasheet, volume 1,” Doc. 872188-001, Jan. 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://cdrdv2-public.intel.com/872188/872188-001.pdf [3] N. Horiguchi and E. Beyne, “Backside power delivery: How to power chips from the backside,” imec Reading Room, Nov. 25, 2022. Accessed: Sep. 14, 2026. [Online]. Available: https://www.imec-int.com/en/articles/how-power-chips-backside [4] W. Hafez et al., “Intel PowerVia technology: Backside power delivery for high density and high-performance computing,” in Proc. IEEE Symp. VLSI Technol. Circuits, Kyoto, Japan, Jun. 2023, pp. 1–2, doi: 10.23919/vlsitechnologyandcir57934.2023.10185208. [5] K. Fischer et al., “Intel 18A platform technology featuring RibbonFET (GAA) and PowerVia for advanced high-performance computing,” in Proc. Symp. VLSI Technol. Circuits, Kyoto, Japan, Jun. 2025, pp. 1–3, doi: 10.23919/vlsitechnologyandcir65189.2025.11075006. [6] K.-F. Cheng, C.-L. Teng, H.-Y. Huang, and H.-C. Chen, “Metal oxide composite as etch stop layer,” U.S. Patent 12 176 247 B2, Dec. 24, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US12176247B2/en [7] S. W. King, “Dielectric barrier, etch stop, and metal capping materials for state of the art and beyond metal interconnects,” ECS J. Solid State Sci. Technol., vol. 4, no. 1, pp. N3029–N3047, 2015, doi: 10.1149/2.0051501jss. [8] A. V. Mule’, D. J. Towner, D. Seghete, C. R. Ryder, and A. A. Gonzalez, “Multi-layer etch stop layers for advanced integrated circuit structure fabrication,” U.S. Patent Appl. 20220102343 A1, Mar. 31, 2022. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US20220102343A1/en [9] C.-C. Wang and J. H. Wang, “Interconnect structure with dielectric cap layer and etch stop layer stack,” U.S. Patent Appl. 20230253247 A1, Aug. 10, 2023. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US20230253247A1/en [10] Y. J. Wu, K.-F. Cheng, C.-C. Lee, H.-K. Chang, and H.-Y. Huang, “Etch stop layer for interconnect structures,” U.S. Patent Appl. 20240332070 A1, Oct. 3, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US20240332070A1/en [11] M. G. Rainville, N. Shankar, K. S. Reddy, and D. M. Hausmann, “Deposition of aluminum oxide etch stop layers,” U.S. Patent Appl. 20180197770 A1, Jul. 12, 2018. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.justia.com/patent/20180197770 [12] J. S. Leib et al., “Conductive lines having molybdenum liner and tungsten fill for advanced integrated circuit structure fabrication,” U.S. Patent Appl. 20240429126 A1, Dec. 26, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.justia.com/patent/20240429126 [13] M. Naik, “Cobalt enables power and performance scaling at single-digit logic nodes,” Applied Materials, Dec. 17, 2018. Accessed: Sep. 14, 2026. [Online]. Available: https://www.appliedmaterials.com/us/en/blog/blog-posts/cobalt-enables-power-and-performance-scaling-at-single-digit-logic-nodes.html [14] Lam Research, “Breaking through AI’s invisible barrier with molybdenum,” Lam Research Newsroom, May 6, 2025. Accessed: Sep. 14, 2026. [Online]. Available: https://newsroom.lamresearch.com/molybdenum-metallization-ai-revolution [15] P. Yashar, G. Malyavanatham, and H. Vijwani, “Integrated circuit interconnect structures with niobium barrier materials,” U.S. Patent Appl. 20240112951 A1, Apr. 4, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US20240112951A1/en [16] Applied Materials, “Applied Materials unveils chip wiring innovations for more energy-efficient computing,” Applied Materials Investor Relations, Jul. 8, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://ir.appliedmaterials.com/news-releases/news-release-details/applied-materials-unveils-chip-wiring-innovations-more-energy [17] Samsung, “Samsung showcases AI-era vision and latest foundry technologies at SFF 2024,” Samsung Semiconductor, Jun. 13, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://semiconductor.samsung.com/news-events/news/samsung-showcases-ai-era-vision-and-latest-foundry-technologies-at-sff-2024/ [18] C. W. Yeung et al., “Channel geometry impact and narrow sheet effect of stacked nanosheet,” in Proc. IEEE Int. Electron Devices Meeting (IEDM), Dec. 2018, pp. 28.6.1–28.6.4, doi: 10.1109/iedm.2018.8614608. [19] S. Mochizuki et al., “Evaluation of (110) versus (001) channel orientation for improved nFET/pFET device performance trade-off in gate-all-around nanosheet technology,” in Proc. Int. Electron Devices Meeting (IEDM), Dec. 2023, pp. 1–4, doi: 10.1109/iedm45741.2023.10413854. [20] D. G. Ouellette et al., “Fabrication of gate-all-around integrated circuit structures having molybdenum nitride metal gates and gate dielectrics with a dipole layer,” U.S. Patent 12 051 698 B2, Jul. 30, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US12051698B2/en [21] imec, “Advancing the CFET-based device roadmap with novel integration modules and standard-cell architectures,” imec, 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://www.imec-int.com/en/articles/advancing-cfet-based-device-roadmap-novel-integration-modules-and-standard-cell [22] A. Reznicek, X. Miao, C. Lee, and J. Zhang, “Wrap around contact for nanosheet source drain epitaxy,” U.S. Patent 11 302 813 B2, Apr. 12, 2022. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US11302813B2/en [23] J. A. Kittl, J. G. Hong, D. R. Palle, and M. S. Rodder, “Methods for varied strain on nano-scale field effect transistor devices,” U.S. Patent 9 978 833 B2, May 22, 2018. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US9978833B2/en [24] S. Gandikota et al., “Method of reducing metal gate resistance for next generation NMOS device application,” Int. Patent Appl. WO 2024/137272 A1, Jun. 27, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/WO2024137272A1/en [25] J. Zhang et al., “Full bottom dielectric isolation to enable stacked nanosheet transistor for low power and high performance applications,” in Proc. IEEE Int. Electron Devices Meeting (IEDM), Dec. 2019, pp. 11.6.1–11.6.4, doi: 10.1109/iedm19573.2019.8993490. [26] C. Yoo, J. Chang, Y. Seon, H. Kim, and J. Jeon, “Analysis of self-heating effects in multi-nanosheet FET considering bottom isolation and package options,” IEEE Trans. Electron Devices, vol. 69, no. 3, pp. 1524–1531, Mar. 2022, doi: 10.1109/ted.2022.3141327. [27] S. S. Pradhan, D. B. Bergstrom, J.-S. Chun, and J. Chiu, “Tungsten gates for non-planar transistors,” European Patent Appl. EP 3 506 367 A1, Jul. 3, 2019. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/EP3506367A1/en [28] L. Schloss and X. Ba, “Tungsten films having low fluorine content,” U.S. Patent 9 754 824 B2, Sep. 5, 2017. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US9754824B2/en [29] Intel Foundry, “Accelerating AI and HPC with advanced process and packaging technologies,” Doc. 367370-001US, Jun. 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intel.com/content/dam/www/central-libraries/us/en/documents/2025-11/intel-foundry-hpc-ai-brief.pdf [30] M. Lofrano, X. Chang, H. Oprins, and Z. Tokei, “Mitigating the thermal bottleneck in advanced interconnects,” imec, Sep. 28, 2023. Accessed: Sep. 14, 2026. [Online]. Available: https://www.imec-int.com/en/articles/mitigating-thermal-bottleneck-advanced-interconnects [31] S. Bair, “Intel at ISSCC 2025: Navid Shahriari invited talk, eight papers, forums, panelist & product details,” Intel Community, Feb. 19, 2025. Accessed: Sep. 14, 2026. [Online]. Available: https://community.intel.com/t5/Blogs/Tech-Innovation/Edge-5G/Intel-at-ISSCC-2025-Navid-Shahriari-Invited-Talk-Eight-Papers/post/1667592 [32] D. Chandra, E. Potladhurthi, D. R. S. Reddy, and K. S. Rengarajan, “Tunable negative bitline write assist and boost attenuation circuit,” U.S. Patent Appl. 20160203857 A1, Jul. 14, 2016. Accessed: Sep. 14, 2026. [Online]. Available: https://patents.google.com/patent/US20160203857A1/en [33] Synopsys, “Advantages of firmware-based training in high-speed DDR IP,” Synopsys IP Technical Bulletin. Accessed: Sep. 14, 2026. [Online]. Available: https://www.synopsys.com/articles/firmware-based-training-ddr-ip.html [34] N. Muralimanohar, R. Balasubramonian, and N. P. Jouppi, “CACTI 6.0: A tool to understand large caches,” Hewlett-Packard Laboratories, 2009. Accessed: Sep. 14, 2026. [Online]. Available: https://users.cs.utah.edu/~rajeev/cacti6/cacti6-tr.pdf [35] Intel, “Intel Tech Tour 2024 Lunar Lake AI hardware accelerators,” Doc. 824436, 2024. Accessed: Sep. 14, 2026. [Online]. Available: https://cdrdv2-public.intel.com/824436/2024_Intel_Tech%20Tour%20TW_Lunar%20Lake%20AI%20Hardware%20Accelerators.pdf [36] Y.-H. Chen, J. Emer, and V. Sze, “Eyeriss: A spatial architecture for energy-efficient dataflow for convolutional neural networks,” in Proc. 43rd ACM/IEEE Annu. Int. Symp. Comput. Archit. (ISCA), Jun. 2016, pp. 367–379, doi: 10.1109/isca.2016.40. [37] Intel, “Introduction to the Xe-HPG architecture,” Doc. 758306, Nov. 4, 2022. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intel.com/content/www/us/en/developer/articles/technical/introduction-to-the-xe-hpg-architecture.html [38] Intel, “Core Ultra processors Series 3 for the edge,” Doc. 855291. Accessed: Sep. 14, 2026. [Online]. Available: https://cdrdv2-public.intel.com/855291/Intel%C2%AE%20Core%E2%84%A2%20Ultra%20Processors%20Series%203%20for%20Edge%20Overview_2.pdf [39] Intel Foundry, “Foveros technology brief,” Doc. 366411-001US, Feb. 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intel.com/content/dam/www/central-libraries/us/en/documents/2025-07/foveros-25d-product-brief.pdf [40] D. Das Sharma, “UCIe: Building an open chiplet ecosystem,” UCIe Consortium, 2022. Accessed: Sep. 14, 2026. [Online]. Available: https://www.uciexpress.org/_files/ugd/0c1418_c5970a68ab214ffc97fab16d11581449.pdf [41] Intel, “Intel launches Intel Core Series 3 processors,” Intel Newsroom, Apr. 16, 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intel.com/content/www/us/en/newsroom/news/client-computing/intel-launches-intel-core-series-3-processors-changing-the-game-for-everyday-computing.html [42] Intel, “Core Series 3 launch press deck,” Apr. 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://download.intel.com/newsroom/2026/Intel-Core-Series-3/Intel-Core-Series-3-Launch-Press-Deck.pdf [43] Intel, “Intel outlines architectures for agentic AI at Hot Chips 2026,” Intel Newsroom, Aug. 24, 2026. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intel.com/content/www/us/en/newsroom/news/client-computing/intel-outlines-architectures-for-agentic-ai-at-hot-chips-2026.html [44] Intel, “Intel accelerates process and packaging innovations,” Intel Investor Relations, Jul. 26, 2021. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intc.com/filings-reports/all-sec-filings/content/0001193125-21-224438/d199788dex991.htm [45] Intel, “Intel reports third-quarter 2021 financial results,” Intel Investor Relations, Oct. 21, 2021. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intc.com/news-events/press-releases/detail/1505/intel-reports-third-quarter-2021-financial-results [46] Intel, “3rd generation Intel Core processors bring exciting new experiences and fun to the PC,” Intel Investor Relations, Apr. 23, 2012. Accessed: Sep. 14, 2026. [Online]. Available: https://www.intc.com/news-events/press-releases/detail/577/3rd-generation-intel-core-processors-bring-exciting

newsletter.semianalysis.com logo
Sep 26 • 9:36 AM EDT • Technology • newsletter.semianalysis.com
Faith leaders organize to boost voter turnout ahead of midterms

NEW ORLEANS – The Rev.

centraloregondaily.com logo
Sep 26 • 9:25 AM EDT • Politics • centraloregondaily.com
MWCConnection Reacts Results: Mountain West dark horse team.

Check out what the voters think.

sports.yahoo.com logo
Sep 26 • 9:00 AM EDT • Sports • sports.yahoo.com
The GOP wants to talk about crime, immigration and trans issues. Voters don’t

Republican former Florida congressman Matt Gaetz summed up a large portion of the GOP’s midterm message this week when he responded to a man who said he was voting Democratic for the first time ever.

cnn.com logo
Sep 26 • 6:30 AM EDT • Politics • cnn.com
VoteVets Spends Millions to Elect Democrats, Shaping Midterms

The organization, founded in 2006 to back Democratic veterans opposing the Iraq war, is pouring huge sums into this year’s elections amid intense voter antipathy for another conflict in the Middle East.

nytimes.com logo
Sep 26 • 5:01 AM EDT • Politics • nytimes.com
Lucas: What if politics actually worked?

There are some 3.2 million registered independent voters in Massachusetts compared to 1.3 million Democrats and 424,000 Republicans.

bostonherald.com logo
Sep 26 • 4:40 AM EDT • Politics • bostonherald.com
Deep dive
😐 Neutral (15%)
wow
65%
ahah
35%
SSM Health Dean Medical Group nurses at outpatient centers vote to unionize

MADISON (WKOW) -- SSM Health Dean Medical Group nurses at ten outpatient centers in the Madison area have voted to unionize with SEIU Wisconsin.

wkow.com logo
Sep 25 • 10:28 PM EDT • Health • wkow.com
Supreme Court Ruling Could Have Limited Impact on Voter Screening in Midterms

Federal law requires a 90-day “quiet period” before elections, likely restricting the immediate scope of a decision that allows the use of a citizenship database to examine voter rolls.

nytimes.com logo
Sep 25 • 7:35 PM EDT • Politics • nytimes.com
Could New York use expanded federal voter citizenship database?

New York election officials can now choose to use an expanded federal database to verify the citizenship of people on voter rolls.

spectrumlocalnews.com logo
Sep 25 • 7:03 PM EDT • Politics • spectrumlocalnews.com
White House claims pro-Trump ad it paid Fox to air was ‘public service announcement’

Some Democrats say taxpayer-funded ad could be illegal government propaganda aimed at influencing voters

theguardian.com logo
Sep 25 • 7:02 PM EDT • Politics • theguardian.com
Health care costs a major concern for voters ahead of midterms
pbs.org logo
Sep 25 • 6:35 PM EDT • Health • pbs.org
Supreme Court blocks Trump-backed Missouri congressional map

The ruling is a defeat for Republicans seeking to give their party an edge in the midterm elections for control of the House. It means voters will face a different map than the one used in the primary elections.

npr.org logo
Sep 25 • 6:06 PM EDT • Politics • npr.org
High-Signal Publisher
Supreme Court blocks Trump-backed Missouri congressional map

The ruling is a defeat for Republicans seeking to give their party an edge in the midterm elections for control of the House. It means voters will face a different map than the one used in the primary elections.

kgou.org logo
Sep 25 • 6:06 PM EDT • Politics • kgou.org
Supreme Court OKs Use of Social Security Data to Check Voter Rolls. What It Means for the Midterms

The Supreme Court on Friday allowed the Trump administration to move forward – for now – with a system that uses federal data to help states identify people on their voter rolls who may not be eligible to vote. The emergency ruling lifts restrictions imposed by a lower court on the administration's ...

usnews.com logo
Sep 25 • 5:48 PM EDT • Politics • usnews.com
Polls show a snapshot of Minnesota's political landscape

All Things Considered host Clay Masters and the MPR News politics team break down a week in Minnesota politics with a recap of the latest polling data.

mprnews.org logo
Sep 25 • 4:51 PM EDT • Politics • mprnews.org
Political debates were once considered essential. Has that changed?

For most of the television era, the political debate had a pretty straightforward purpose: Put candidates next to each other, take away the script, and let voters watch. But with no top-of-ticket debates scheduled to happen in Florida this year, where does the debate stand?

news.wfsu.org logo
Sep 25 • 3:20 PM EDT • Politics • news.wfsu.org
What Does Caesars Entertainment (CZR) Shareholder Approval Mean For Its Privatization?

Caesars Entertainment (NasdaqGS:CZR) shareholders have approved the acquisition of the company by Fertitta Gaming. The vote clears a key hurdle for Caesars to become a wholly owned subsidiary of Fertitta Gaming and to complete its move to private ownership. Regulatory and closing conditions now become the next focus as the transaction advances toward completion. The shareholder approval for Fertitta Gaming's takeover of Caesars Entertainment sits against broader shifts our research has...

simplywall.st logo
Sep 25 • 3:16 PM EDT • Entertainment • simplywall.st
Poll: Two out of three of North Carolinians get political news from local TV or social media

Local television and social media are where most North Carolina voters get their political and government news, according to a poll released Friday. No other source reached more than 17% of voters.

ncnewsline.com logo
Sep 25 • 3:10 PM EDT • Politics • ncnewsline.com
Voters are turning to AI on politics. Is it up to the task?

Artificial intelligence is playing a growing role in how voters get information about politics and elections, raising fresh questions about how the technology could influence the way voters stay in…

wkrn.com logo
Sep 25 • 2:51 PM EDT • Politics • wkrn.com
Winning Gen Z: Radical media, political access, and the youth vote

Xaviaer DuRousseau analyzes Hasan Piker's influence on young voters and the growing debate over radical media in youth politics.

foxnews.com logo
Sep 25 • 2:51 PM EDT • Politics • foxnews.com
How worried are Republicans about the midterms? GOP Senators demand Congress stay in town for a vote on affordability
cnn.com logo
Sep 25 • 2:46 PM EDT • Politics • cnn.com
Why the 2026 election could be the worst midterm for the GOP this century

The Republican Party’s two worst midterm elections in the 21st Century were in 2006 and 2018. In the former, an unpopular Middle Eastern war cost George W. Bush dearly. In 2018, voters balked at the upending of historic norms and chaotic style of a new president named Donald Trump.

cnn.com logo
Sep 25 • 1:49 PM EDT • Politics • cnn.com
Deep dive
😐 Neutral (5%)
wow
48%
ahah
28%
angry
24%
After state warning, NJ panel approves 34% health premium hike for teachers

The vote to hike teachers’ health benefit rates came after a state warning that benefits may be halted in the new year without an agreement.

newjerseymonitor.com logo
Sep 25 • 1:41 PM EDT • Health • newjerseymonitor.com
How higher education shapes politics

By Andrew Menendez | Contributing Writer In recent elections, mentions of the voter preferences of college-educated voters seem to permeate news surrounding young people—the way most people seem to discuss it is wrong. It has become a general rule in media such as Fox News or The New York Post to frame universities and most […]

panthernow.com logo
Sep 25 • 1:30 PM EDT • Politics • panthernow.com
Here’s How Trump Is Building a National Citizenship Database to Check Voters

The Supreme Court allowed the Trump administration to deploy a system that merges personal data from across the government. Questions remain about its reliability.

nytimes.com logo
Sep 25 • 1:27 PM EDT • Politics • nytimes.com
Justices uphold Trump's expanded data checks to spot non-citizens who registered to vote

The Trump administration says Social Security data may help spot non-citizens who are registered to vote.

latimes.com logo
Sep 25 • 12:11 PM EDT • Politics • latimes.com
Supreme Court lets Trump administration use revamped federal voter eligibility database for now

The Supreme Court on Friday lifted restrictions on a controversial federal voter database before November’s elections, granting President Donald Trump a temporary win in his aggressive campaign against noncitizen voting.

pbs.org logo
Sep 25 • 12:06 PM EDT • Politics • pbs.org
Show-Me-State Politics: Missouri voters deciding new ballot issues; judge hears case over book bans in schools

KY3’s Tyler Wayne and KY3 Missouri Capitol Bureau Chief Hannah Falcon discuss this week in Show-Me-State Politics.

ky3.com logo
Sep 25 • 12:04 PM EDT • Politics • ky3.com
Your Weekly Michigan Political Brief

The Michigan Chamber of Commerce has endorsed Republican nominee Mike Rogers in his campaign for the U.S. Senate. Michigan Attorney General Dana Nessel said this week she will vote for fellow Democrat Abdul El-Sayed in his run for U.S. Senate, ending speculation that she did not endorse his candidacy due to their differences over Israel. […]

michiganadvance.com logo
Sep 25 • 12:00 PM EDT • Politics • michiganadvance.com
Author Sarah Longwell says political character counts in ‘How to Eat an Elephant’

Is the idea of political virtue outdated? What do voters say when asked if character counts? That’s just one of the complicated topics Sarah Longwell, publisher of The Bulwark and host of The Focus Group Podcast, tackles in her new book, “How to Eat an Elephant: One Voter at a Time.”

mprnews.org logo
Sep 25 • 12:00 PM EDT • Politics • mprnews.org
Deep dive
😐 Neutral (10%)
wow
63%
love
37%
Supreme Court lets Trump administration use federal voter eligibility database

The emergency order allows states, for now, to use the Department of Homeland Security program, called Systematic Alien Verification for Entitlements.

spectrumlocalnews.com logo
Sep 25 • 11:57 AM EDT • Politics • spectrumlocalnews.com
Supreme Court lets Trump administration use federal voter eligibility database

The emergency order allows states, for now, to use the Department of Homeland Security program, called Systematic Alien Verification for Entitlements.

spectrumlocalnews.com logo
Sep 25 • 11:57 AM EDT • Politics • spectrumlocalnews.com
Supreme Court revives DHS citizenship data tool for voter audits in win for Trump

In a major win for President Donald Trump’s efforts to find non-citizen voters, the Supreme Court on Friday said states can use a controversial citizenship data collection tool for reviewing voter rolls.

cnn.com logo
Sep 25 • 11:53 AM EDT • Politics • cnn.com
Supreme Court allows Trump administration to use expanded database for potential voter purges

Critics have said the data could lead to U.S. citizens being kicked off the voter rolls, but the justices noted the law prohibits broad voter purges in the weeks leading up to an election.

nbcnews.com logo
Sep 25 • 11:52 AM EDT • Politics • nbcnews.com
High-Signal Publisher
Supreme Court Allows Expansive Federal Database for Voter Screening

Critics of a citizenship database built by the Trump administration have raised alarms about privacy and improper voter purges.

nytimes.com logo
Sep 25 • 11:49 AM EDT • Politics • nytimes.com
Supreme Court lets Trump administration use revamped federal voter eligibility database for now

The emergency order allows states, for now, to use the Department of Homeland Security program, called Systematic Alien Verification for Entitlements, or SAVE,

wtop.com logo
Sep 25 • 11:40 AM EDT • Politics • wtop.com
Reform small boat vote branded 'political stunt'

The leader of Portsmouth City Council denies his party does not oppose small boat crossings.

yahoo.com logo
Sep 25 • 11:37 AM EDT • Politics • yahoo.com
Bella Vista Business Association votes to become Bella Vista Chamber of Commerce

BELLA VISTA -- The Bella Vista Business Association has been operating as a chamber of commerce for a while, so it only makes sense to officially name itself as such, according to Association President Jean Galloway.

bvwv.nwaonline.com logo
Sep 25 • 11:06 AM EDT • Business • bvwv.nwaonline.com
Med Center Health celebrated Cal Turner Rehab & Specialty Care's 30th Anniversary in Scottsville

Email newsletter signup Polls What is the biggest challenge facing Bowling Green? Vote Now View Results

bgdailynews.com logo
Sep 25 • 9:11 AM EDT • Health • bgdailynews.com
CMMC nurses in Lewiston vote to form union

The situation prompted Gov. Janet Mills earlier this week to call on Prime Healthcare to reinstate the nurses fired or suspended.

spectrumlocalnews.com logo
Sep 25 • 9:08 AM EDT • Business • spectrumlocalnews.com
Ballots from WA voters of color, younger voters challenged most, report says

An analysis by UW researchers says younger voters and voters of color in Washington have their ballots challenged more often.

seattletimes.com logo
Sep 25 • 9:00 AM EDT • Politics • seattletimes.com
Dunlap calls for crackdown on price gougers

Dunlap said if he’s elected to Congress, he would support cracking down on companies that gouge consumers, push to add more food safety inspectors and vote to end the war in Iran to bring down oil prices.

spectrumlocalnews.com logo
Sep 25 • 8:05 AM EDT • Politics • spectrumlocalnews.com
Capitol agenda: Dems weigh doing Husted a solid - Live Updates

A data center measure easily passed the House last week with more than 200 Democratic votes, but campaign-season politics are making action trickier for the party in the Senate.

politico.com logo
Sep 25 • 8:00 AM EDT • Politics • politico.com
Can the Left Make America Fun Again?

Hi friends, I’ve got a piece in The New York Times today about how collective joy — participatory, youthful, anti-corporate — can defeat Trumpism and transform our lives. The basic argument is that politics used to be embedded in communal life: dances, sports leagues, union halls. As that infrastructure disappeared — and more of everyday life was atomized and privatized — politics became something broadcast at people rather than something they did together. NYC-DSA and Zohran provide another model, where socials and face-to-face organizing are tied to a fight vs the corporations that fenced off so much of the good life. Rebuilding that kind of collective fun, I argue, could help bring young people back into politics and, by redistributing America’s wealth, make everyday life more joyful. I would super appreciate it if you’d read the piece, share it, or post comments on it. Thank you! p.s. FYI, Opinion writers don’t get any say over their headlines! More Take action to support the fight of licensed deck officers at Alaska Tanker Company and Overseas Shipholding Group to win a first union contract. This is one of the most important, and underreported, unionization campaigns in America: these workers have a huge amount of power over domestic energy distribution and maritime supply chains, and they’re still without a contract two years after having voted overwhelmingly to unionize. Please sign the public petition here, and if you’re an academic you can sign this support letter.

laborpolitics.com logo
Sep 25 • 7:31 AM EDT • Politics • laborpolitics.com
Netanyahu turned the UN into campaign theater – but will Israelis buy the show?

NATIONAL AFFAIRS: The prime minister presents himself on the global stage as a leader uniquely equipped to defend Israel in a hostile world, seeking to bring that same message home to Israeli voters.

jpost.com logo
Sep 25 • 7:24 AM EDT • Politics • jpost.com
😐 Neutral (11%)
wow
60%
angry
40%
India’s ‘cockroach’ movement targets election chief in political pivot

The Gen Z group that forced out an education minister is demanding the election chief’s resignation over alleged voter roll irregularities.

scmp.com logo
Sep 25 • 6:30 AM EDT • Politics • scmp.com
Trump's trade war with Canada adds a challenge in Senate races

The dispute stands to heighten voters' economic worries and add to the GOP's political challenge in dead-heat races, analysts say.

latimes.com logo
Sep 25 • 6:00 AM EDT • Politics • latimes.com
Alaskans Dismayed, But Not Moved, by Peltola’s Treatment of Her Staff

Voters interviewed in Anchorage and Fairbanks on Thursday said news that Mary Peltola, the Democratic nominee for Senate, had used offensive slurs would not change their vote.

nytimes.com logo
Sep 25 • 5:50 AM EDT • Politics • nytimes.com
Americans are confused and worried about elections. Will that impact turnout?

New polling shows many voters are concerned about the midterms. But prior elections show no clear link between voter concerns and fewer voters actually casting ballots.

kosu.org logo
Sep 25 • 5:00 AM EDT • Politics • kosu.org
Americans are confused and worried about elections. Will that impact turnout?

New polling shows many voters are concerned about the midterms. But prior elections show no clear link between voter concerns and fewer voters actually casting ballots.

kgou.org logo
Sep 25 • 5:00 AM EDT • Politics • kgou.org
Democrats weigh how to handle data center vote that could benefit a GOP foe

“They say they’re for more affordability,” embattled GOP Sen. Jon Husted said. “This is a chance for everybody to prove it.”

politico.com logo
Sep 25 • 4:45 AM EDT • Politics • politico.com
Trump’s odd midterm strategy: Give voters the opposite of what they want

There’s a simple way to understand Republicans’ apparent plight ahead of the midterm elections.

cnn.com logo
Sep 25 • 12:01 AM EDT • Politics • cnn.com
League of Women Voters is nonpartisan — and unapologetically political

Every election season, someone asks the same question, usually with a raised eyebrow: "If the League of Women Voters doesn't take sides, why does ...

cascadiadaily.com logo
Sep 25 • 12:00 AM EDT • Politics • cascadiadaily.com
Campaign finance complaint against Let’s Go Washington dismissed

The conservative political committee is backing three initiatives that voters will consider in November’s general election.

seattletimes.com logo
Sep 24 • 9:10 PM EDT • Politics • seattletimes.com
2nd Congressional District: Republican Kelley Dennison

The political newcomer, 27, said she wants more people from her generation, Gen Z, to join the political conversation.

cpr.org logo
Sep 24 • 8:25 PM EDT • Politics • cpr.org
Look up what political districts you live in ahead of the midterm elections

This tool helps you find what races you'll be voting on this 2026 midterm election.

cpr.org logo
Sep 24 • 7:00 PM EDT • Politics • cpr.org