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Intel Panther Lake Teardown, 18A, BSPD, GAAFET, SemiAnalysis STEEL

Panther Lake debuts the first commercial implementation of backside power delivery (BSPDN), introduces Intel’s first iteration of gate-all-around (GAA) transistors, and showcases their advanced packaging capabilities with its Foveros-S assembly. With Panther Lake, Intel’s manufacturing arc has shifted from nebulous roadmaps to shipped silicon, a significant milestone on their long road back to competitive semiconductor manufacturing. To evaluate the extent of Intel’s comeback, we tore down Panther Lake. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Our teardown traces 18A from its four-sheet RibbonFETs (Intel’s marketing name for GAAFETs) and gate stacks through contacts, frontside and backside wiring, and the bonded carrier. We explain how these material and integration choices improve gate control and reduce resistance, while adding capacitance, thermal resistance, and process complexity. Our measurements put Panther Lake’s 18A compute logic and TSMC N3E GPU logic at similar logic density. However, 18A does not lead TSMC N3P, N2 or Samsung SF2 in peak density. Panther Lake’s CPU cores are incremental updates, and the high-end GPU still uses TSMC N3E. Panther Lake assembles one compute tile, one GPU tile, and one I/O tile atop a passive base tile using Intel’s Foveros-S advanced packaging. Both compute tile variants use Intel 18A. The Xe3 GPU options are a 4-core GT1 tile on Intel 3 and a larger 12-core GT2 tile on TSMC N3E. Both I/O tile variants use TSMC N6. [1], [2] Our analysis centers on the PTL-U compute tile, both the 4-core and 12-core GPU tiles, as well as the 12-lane I/O tile. In conventional chips, power and signal are routed through the same frontside metal stack towards the device frontend. Power rails consume scarce routing resources near the transistors, while tall via stacks carry VDD and VSS from the coarse upper wires to local rails. Backside power delivery (BSPD) moves the main power network behind the transistor layer, to the backside, separating it from frontside signal routing. We covered BSPD and its impacts in 2024. [3], [4], [5] Intel’s BSPD implementation, branded as “PowerVia”, routes power through dedicated backside metals to nano-TSVs, which connect those rails to local source/drain (S/D) contacts. Implementing that separation requires Intel to build the interconnect stacks from both sides of the wafer. The frontside comprises the M0-M14 signal stack, while the backside comprises the BM0-BM5 power stack. M0 and BM0 are closest to the transistors. The nano-TSVs connect the two sides, but Intel patterns and etches each via from the front after forming the contacts. A narrow via runs from the side of the contact deep into the silicon substrate. Intel then completes the frontside signal metal stack, bonds the wafer to a carrier, flips it and removes the original substrate until the buried via tips are exposed. The backside metal stack is then deposited directly on the revealed vias. The nano-TSV and backside-via profiles taper in opposite directions because Intel forms them from opposite sides of the wafer. The transistor structures form the FEOL. Local contacts and nano-TSVs connect them to the wiring. M0 begins the frontside interconnect stack. The silicon carrier remains attached above the frontside interconnects. It supports the device wafer during substrate removal and backside processing and remains part of the finished chip’s thermal path. PowerVia removes the main power distribution from the congested frontside metals, routing supply through shorter and wider backside wires. Its lateral landing still occupies area in the standard cell, so it recovers less cell area than a direct backside contact. [3] Nano-TSVs beside the logic devices carry VDD or VSS from the backside power network, while signal connections continue upward through the frontside metals. Backside Interconnects Samsung SF2 data is included for comparison to Panther Lake’s within this article. SF2 is the incumbent GAA foundry node but lacks BSPD, serving as a useful reference to evaluate 18A. A full teardown of Samsung’s S26 products, processed on SF2, will be shared soon.Nanosheet-cut EDS comparison. The PowerVia supply path runs from the backside Cu rails through Mo-lined W nano-TSVs to the local transistor contacts. In this cross section, the tapered connection spans roughly 150 nm from the contact level to BM0. The Ta liner confines Cu and promotes adhesion to the surrounding stack; the AlOₓ etch stop controls the next dielectric etch above the rail. Dielectric beneath the ribbons electrically separates the devices from the backside wiring and removes the conducting silicon body below the channel. [6] AlOₓ serves as an etchstop (ES), enabling endpointing and protecting the underlying layers. Low-volatility aluminum fluoride reaction products resist the fluorinated plasma, allowing a thin AlOₓ film to protect the metal while the surrounding low-k dielectric is removed. [6], [7]. While the BM0 and layers above the M1 lines show double AlOx layers, Our SMIC N+3 teardown showed single AlOₓ layers. SMIC uses a simpler local AlOₓ substack, while the remaining cap and etch sequence provide the required landing protection. So why double layers? The closely spaced AlOₓ doublets provide two protected endpoints in the etch sequence. Intel documents an AlOₓ/SiN/AlOₓ stack that explains the benefit. The main dielectric plasma etch stops on the first AlOₓ film; a selective wet clear opens that film; a second plasma etch removes the intermediate SiN and stops on the second AlOₓ film. The final wet clear exposes the metal landing surface. SiN is the intermediate dielectric in Intel’s published example. [8] The second stop protects the metal through a cap breakthrough. Wide openings can etch faster than narrow ones, and etch depth varies across the wafer. Metal under an early-clearing opening would otherwise be exposed while other openings still need more etching. Staged protection widens the process window and reduces metal erosion, corrosion and void formation. [8] TSMC documents AlN/AlOₓ/SiOC/AlOₓ above Cu, with AlN blocking Cu diffusion, and a simpler AlN/SiOC/AlOₓ variant that omits one AlOx film. [9] Levels with different opening sizes, aspect ratios, pattern densities and cap materials need different etch margins. A double AlOx stop is useful where another protected endpoint justifies the added processing. The extra film adds formation, selective opening and cleaning steps, plus another set of interfaces to control adhesion, moisture, and stress. These blanket films are opened through the existing via pattern, so each film does not require another lithography mask. AlOₓ adds parasitic capacitance when it replaces lower-k dielectric; two thin AlOₓ films can nevertheless contain less AlOₓ than one thick film. Total thickness, placement, and theintermediate dielectric determine the electrical cost. Deposition chemistry also changes AlOx permittivity and residual hydroxyl content, which can oxidize the underlying metal. [7], [8], [10], [11] The backside stack separates into relatively fine BM0-BM2 wiring near the devices and coarser BM3-BM5 power distribution. The largest pitch increase occurs between BM2 and BM3. BM0’s pitch closely matches the logic-row height, fitting local power delivery to the cell rows. Higher levels aggregate current through larger conductors: routing density becomes less important than low resistance and current capacity as the network approaches the package. This hierarchy provides wide power wiring for the power delivery network without consuming scarce frontside signal-routing resources. [3] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Frontside Interconnects Intel 18A combines Mo-lined W contacts and nano-TSVs with a separate backside Cu power network. Samsung SF2 keeps power on the frontside, using Ti-based contact interfaces and Ta-based barriers and Co liners around Cu wiring. In 18A standard-cell rows, backside power rails supply the devices through nano-TSVs within the cells, freeing frontside routing resources. Samsung’s M0 accommodates both power and signal connections. From the device toward M0, the connection runs through a Ti-based S/D interface, W contact fill, a Mo-lined W via, and the Cu M0 wire. Mo supplies a conductive nucleation and adhesion layer for W, replacing the resistive TiN liner used in conventional W integration. This increases the effective conduction volume within the feature while retaining W fill and its established polishing, cleaning and etching processes. Intel’s Mo/W patent describes this integration tradeoff. The nano-TSV uses the same Mo-lined W construction in the backside supply path. [12] The move from TiN to Mo is an incremental change. While a full Co or Mo fill can also reduce the volume lost to liners in very small features, it requires new integration schemes that increase complexity and risk. Cu remains attractive for wider wires due to its low resistance. As wires and vias shrink, the diffusion barrier consumes an increasing fraction of their cross-section. [12], [12], [14] Intel uses Co/Ru liners at M0-M1, Co at M2-M4, and Nb at M5-M9. The lower-level liners help Cu adhere and reduce void formation during trench fills. Applied Materials’ Endura has new thermal control that facilitate wetting process, so the thin film continuity is good enough that good capillary pressure will drive Cu atoms to the via bottom without voiding. Intel’s choice to use Nb is particularly interesting. Intel’s Nb patent describes a conductive diffusion barrier intended to reduce the barrier’s contribution to resistance relative to conventional Ta-based barriers, particularly at via bottoms where all current crosses the barrier. The patent pairs Nb in coarser levels with the option of lower-cost PVD processing. [15], [16] The upper metal layers support thicker barriers formed through physical vapor deposition (PVD) despite its worse coverage and uniformity. Meanwhile, the lower metal layers require thinner barriers deposited through conformal atomic layer deposition (ALD). Co/Ru adds another material interface and requires controlled deposition and Cu fill. Changing liners and barriers by metal layer allows Intel to optimize interconnect resistance, process complexity, and reliability. [15, 16] RibbonFET, Intel’s name for its gate-all-around FETs (GAAFETs), replaces the FinFET’s vertical fins with four stacked horizontal silicon nanosheets, allowing the gate to surround the channel on every side. The path to GAAFET begins with the planar transistor. A planar MOSFET places the gate above the channel between its source and drain. Pairing an NMOS with a PMOS transistor creates a CMOS inverter, in which the NMOS pulls the output low for a high input, and the PMOS pulls it high for a low input. The gate must retain electrostatic control of the channel to ensure clean switching. As gate lengths shrank, the drain began to compete with the gate for that control, increasing off-state leakage. Electrostatic control was restored through an architectural evolution that raised the channel into a vertical fin and wrapping the gate around three sides. Called “FinFET”, this new architecture packed more effective channel width into a smaller footprint. Further scaling made it harder to maintain both drive current and leakage within smaller cells, and reintroduced the same problems planar MOSFETs faced. Nanosheet GAAFETs close the fourth side by replacing the vertical fin with a stack of horizontal nanosheets, each surrounded by the gate. The tighter electrostatic control suppresses leakage at shorter gate lengths while stacking adds effective channel width within the cell footprint. In a FinFET process, channel width changes in discrete steps as designers must add or remove whole fins. Nanosheet width can instead be adjusted continuously within the process’s design rules. Wider sheets increase drive current, while narrower sheets reduce capacitance at the cost of drive current. Intel 18A uses stacks of four nanosheets each and varies their widths across logic and SRAM. At the process level, adding more sheets to each stack increases effective channel width and drive current, but complicates fabrication. RibbonFET vs MBCFET Samsung began GAAFET production in 2022 with SF3E, following with SF3 and now SF2. Its ‘MBCFET’ provides a useful structural comparison with Intel’s first RibbonFET implementation. [17] STEEL is digging deeper into SF2, used in the Exynos 2600, and TSMC’s GAAFET N2, used in Apple’s A20 Pro, in upcoming newsletter articles. We’re throwing some teasers on X. Let’s compare Samsung SF2’s MBCFET with Intel 18A’s RibbonFET. Subscribe Even to the untrained eye, Intel’s extra nanosheet is obvious. Intel stacks four ribbons to Samsung’s three. Samsung’s sheets are much wider in these fields, so both sheet count and width matter to the available channel perimeter. Sheet width also changes which silicon surfaces carry current. On conventional (001) silicon, wide nanosheets emphasize the broad top and bottom surfaces, favoring electron transport; the larger sidewall contribution in a narrow sheet favors hole transport. Thinner sheets improve gate control but increase confinement and scattering. This makes width and thickness part of the NMOS/PMOS balance, alongside strain and threshold voltage. [18], [19] GAAFET designs like 18A use different work-function-metal (WFM) stacks for NMOS and PMOS. Around each ribbon, a thin SiOx interfacial layer separates the silicon channel from the HfOx high-k dielectric, with La providing dipole tuning and the WFM wrapping the dielectric. NMOS uses a TiAl-based stack, while PMOS uses TiN WFM. W fills the remaining gate trench, providing a lower-resistivity path where the work-function layers are no longer needed. In this field, the PMOS stacks leave room for W between ribbons, while the NMOS stacks occupy more of those gaps. A silicon-based dielectric marks the P/N boundary, allowing the PMOS and NMOS gates, sharing the same gate trench, to be processed sequentially. Fast logic paths, retention circuits, and SRAM need a family of threshold options. Changing threshold without substantially changing device dimensions, capacitance or fabrication complexity is valuable. FinFET processes typically use different work-function-metal stacks. In a four-ribbon GAA stack, the narrow sheet-to-sheet gap limits how much WFM can fit around each channel. La in the gate dielectric creates interfacial dipoles at the SiOx/HfOx boundary, shifting effective work function and tuning threshold voltage. This gives Intel another control alongside its NMOS and PMOS WFM stacks. Low-threshold devices improve critical-path drive; higher thresholds reduce leakage elsewhere. Dipole tuning is especially useful in GAA because it changes threshold without consuming the narrow intersheet gap with thicker WFM. Precise control of La incorporation, diffusion and interface quality has long been a challenge, limiting viability in high volume production but is now seen from every leading-edge foundry. Intel’s patent describes depositing a dipole-forming oxide above HfOx and annealing it toward the interfacial oxide before completing the work-function and fill metals. This separates threshold tuning from the space available for metal. Newer research addresses the thermal cost: imec’s 2026 dipole-middle research inserts the shifter between two HfOx depositions, shortening the diffusion path while protecting SiOx during patterning. [20], [21]Matched-cut EDS, Intel 18A (left) vs. Samsung SF2 (right). Intel retains raised source/drain epi beneath its contacts, while Samsung recesses W deep into the epi to form a V-shaped Ti-lined interface. The deeper contact increases metal-to-semiconductor area and shortens the current path from the lower sheets, reducing contact and spreading resistance. It also removes epi volume and brings the contact etch closer to the channel ends. Retaining more epi preserves the material available for strain transfer, especially from SiGe into PMOS. These geometries balance contact access against stress engineering and etch margin. [22], [23] Samsung stacks three sheets to Intel’s four ribbons, and both processes use sheet width to tune drive strength. In our Samsung cross-sections, widths range roughly from 19 to 30 nm in the NPU rows and 37 to 50 nm in the CU cell. The Samsung nanosheets taper, with the widest sheet at the bottom and the narrowest at the top. Both processes use HfOx gate dielectric and Ti-based work-function stacks, with Al in the NMOS stack. In the Samsung devices shown here, the dielectric and WFM occupy the intersheet gaps, leaving W above the top sheet. Intel’s PMOS stack leaves more room between ribbons, and W fills those gaps while the thicker NMOS stack leaves W mainly in the upper trench. Gate-stack EDS maps. The W between Intel’s PMOS ribbons provides a conductive path close to the lower gates. Where WFM fills the entire gap, the gate still surrounds the channel, but voltage reaches it through the more resistive work-function films. Thinner WFM and dipole tuning preserve room for low-resistivity fill; Mo and Ru are alternative fill metals being developed for further scaling. [24] A masked, sequential WFM flow explains the different gate heights and inter-nanosheet fill. The proposed sequence below shows how separate NMOS and PMOS work-function steps produce that geometry. Enabled by the BSPDN process, Intel replaces the dense-logic silicon subfin with dielectric, removing the parasitic conduction path below the ribbons and reducing substrate-related capacitance. A retained silicon body as in classical, non-SOI, planar and FinFET designs needs junction and punchthrough-stop engineering to suppress leakage. Dielectric isolation makes that leakage less sensitive to the subfin doping profile but adds removal and fill steps. It also weakens the direct thermal path through silicon, making the contacts, metal stacks and package more important for heat extraction. [24], [26] Fluorine is concentrated around selected Intel device structures in the maps. WF6 is a standard precursor for W nucleation and fill, while barrier films protect adjacent dielectrics from fluorine attack. Low-fluorine W processes reduce the residual-F burden. Chloride-based precursors avoid introducing F during W deposition, but require control of chlorine attack, nucleation and fill quality. The integration target is a continuous, low-resistance W path with a thin protective liner and minimal chemical damage to the surrounding stack. [20], [27], [28] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. We measured cell height, gate pitch, metal geometry, and ribbon dimensions at the XTEM sites shown below. The tables group these dimensions by site and device polarity. Our “sheet cuts” cross the silicon channel and show the ribbons end-on. “gate cuts” run along the channel through successive gates. The 18A logic cell dimensions point to a five-track logic library while the N3E and Intel 3 cell dimensions evidence a seven-track logic library. The DDR-PHY uses wider M0 wires and much larger spacing than core logic. That trades routing density for lower wire resistance and weaker coupling between neighboring nets. The geometry suits the current delivery and coupling requirements of analog, clock, and I/O circuitry. PowerVia lets 18A combine a compact cell height with wider M0 geometry by moving the main power rails off the signal-routing tracks. That relaxes local wire scaling while preserving a small cell footprint. Cell height and gate pitch set the geometric density; pin access and routability determine how much of it a real block can use. [29] The biggest takeaway from our gate-pitch measurements is that Intel 18A compute logic and TSMC N3E GPU logic have similar density in the Bohr representative-cell model. The 18A example is 18.6% denser than the Intel 3 GPU example. Gate pitches are nearly identical across the three sites, so cell height drives most of the difference. The Bohr model combines a four-transistor NAND2 spanning three gate pitches and a 32-transistor scan flip-flop (SFF) spanning nineteen pitches, weighting their densities 60:40. The sensitivity column shows how independently changing cell height and gate pitch by ±1 nm changes the result. This compares representative cell geometries; whole-die density also depends on cell mix and placement. The 18A P-core gives M0 substantially more metal cross section than the N3E vector engine. Treating each profile as a trapezoid gives 2.63 times the area per line and 1.84 times the area after normalization by routing pitch. The larger section reduces the geometric contribution to line resistance and lowers current density for a given current. Taller and wider wires also add capacitance, so circuit delay depends on the balance of resistance and capacitance. The DDR-PHY has less metal area per routing width than the 18A core fields, while remaining above N3E. [30] Area = height × (top CD + bottom CD) / 2, including liners. Area/pitch normalizes by routing width. Taper is the symmetric sidewall angle from vertical, with the largest angle belonging to the DDR-PHY. Compute tile The measurements show how ribbon dimensions and gate-stack geometry vary across the compute tile and between NMOS and PMOS to balance channel drive, gate load and the space needed for the dielectric/WFM stack across logic, SRAM and the DDR-PHY. Width mainly changes available channel perimeter; thickness also changes electrostatic control and carrier confinement. Gate-stack thickness then determines the space left for low-resistivity fill P-core and LP E-core logic Both the P-core and LP E-core use multiple nanosheet widths. Widths are measured on high-magnification XTEMs while wider-field images demonstrate additional width choices within the LP E-core. Multiple widths are expected even within an LP E-core. Timing-critical paths, buffers and cells with different fanout need different drive strengths. The lower-magnification fields show this width diversity beyond the sites quantified in the table. L2 and L3 SRAM GAA gives SRAM designers another way to balance the pull-up (PU), pass-gate (PG), and pull-down (PD) transistors. FinFET bitcells set device strength through fin count while GAA adds nanosheet width as a sizing knob. In a 6T SRAM cell, a strong pull-down relative to the pass-gate limits read disturbance, while a strong pass-gate relative to the pull-up improves writability. During a write, the pass-gate and write driver pull the node storing “1” below the inverter trip point. During a read, the pull-down holds the node storing “0” low. Bias, threshold voltage, mismatch and assist circuitry set the remaining margin. FinFET high-current cells commonly use a PU:PG:PD fin-count pattern of 1:2:2, a device-sizing ratio rather than a current ratio. Ribbon width lets Intel balance SRAM strengths without adding whole fins. The L2 cell uses its narrowest ribbons for PU and widest for PD, improving writability and read stability respectively. Intel’s disclosed HCC operates without assist; its denser HDC uses negative-bitline write assist. Pulling the selected bitline briefly below ground increases pass-gate overdrive so it can overpower the pull-up at lower supply voltage. That buys density and low voltage writability at the cost of boosting circuitry, switching energy, and additional voltage stress that must be controlled. [31], [32] Four rectangular ribbons give the perimeter = 8 × (width + thickness), before corner rounding. PG/PU is 1.49 and PD/PG is 1.16. The L3 structures closely resemble L2 in layout and cell height. Fewer L3 nanosheet widths are tabulated because fewer high-magnification images were available. DDR PHY The DDR-PHY trades density for controlled analog behavior and reliable off-chip signaling. It contains drivers, receivers, delay circuits, and calibration logic that set drive strength, sampling time, and voltage margin. Repeated four-sheet devices with similar widths fit the use of regular transistor units for matching and programmable drive. Its wider local wiring provides room for current delivery and separation of sensitive signals, while consuming more area than a dense core-logic grid. The layout serves the memory channel’s electrical requirements as well as digital logic density. [33] The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page. Intel 3 GPU devices Vector engine logic Intel 3’s XVE logic uses two-fin PMOS and NMOS devices with power rails in M0. Its cell height and M0 pitch give a seven-track geometry, two tracks more than the 18A logic. One-fin groups also appear among the two-fin devices. Intel 3 L2 SRAM The Intel 3 L2 SRAM uses the familiar HCC sizing pattern: one PU fin, two PG fins, and two PD fins. N3E GPU devices Vector engine logic The N3E XVE field contains repeated two-fin devices with seven-track cell geometry. N3E remains a FinFET process, giving Panther Lake a direct FinFET-to-RibbonFET comparison. N3E L2 SRAM The N3E L2 SRAM uses the same PU:PG:PD fin-count pattern of 1:2:2. Panther Lake-U follows Lunar Lake’s floorplan quite closely. Both pair 4 P-cores with 4 LP E-cores and NPU, media and display engines in similar locations. Lunar Lake also uses Xe2, the direct predecessor to Panther Lake’s Xe3 GPU. This makes Lunar Lake the most direct basis for our comparisons. Arrow Lake differs in core count and uses the older Xe-LPG GPU architecture, so we only use it where it offers a more direct component-level comparison. Compute tile Panther Lake compute-tile floorplans remain sparse even months after launch. Intel 18A’s backside metal and dielectric stack must be removed without damaging the underlying structures before a clean transistor-level floorplan can be imaged. Most published die shots hide or heavily process the background, but we are quite proud of the die shot we achieved and are excited to show the work we have done. We measured the areas of the key components on the compute tile and compared them with their Lunar Lake predecessors on TSMC N3B. These help us to capture changes in block area and compare the two chips across process nodes and designs. Our total tile areas exclude the scribe-line area. The compute-plus-GPU subtotal below uses the PTL-U compute tile and GT1 GPU; it excludes the I/O tile and passive base. Individual block areas use the boundaries marked on the floorplans The compute-plus-GPU row is recomputed from the displayed PTL-U and GT1 areas. Component rows use their stated per-region counts and are not an additive partition of the whole tile. The P-core area remains almost unchanged between Lunar Lake and Panther Lake, despite L2 capacity increasing from 2.5 MiB to 3 MiB. Arrow Lake uses the same Lion Cove core as Lunar Lake but also has a 3 MiB L2. Cougar Cove fits 20% more L2 into the same P-core area. The larger private cache keeps more of each core’s working set close to its execution units, reducing access to shared L3 and DRAM. Extra capacity adds storage leakage and lookup energy, so designers balance it against avoided lower-level accesses. The shared P-core L3 cache also shrank by 14.8%. [2] Cougar Cove combines a similar footprint with Intel’s reported power-efficiency improvements. RibbonFET’s tighter channel control reduces leakage, while PowerVia reduces supply droop and allows tighter voltage guardbands. [1] Darkmont’s four-core LP E-core cluster is 5.0% smaller than Skymont’s on Lunar Lake, with most of the reduction in its L2 regions. The 1 MiB region shrank by 8.4% and the 1.5 MiB region by 14.9%. The tag arrays also use one fewer visible row. Tags identify which memory addresses the data array holds, so rearranging them changes the cache’s layout and wiring without requiring less data capacity. [2] The LP E-cores share one L2. This pools capacity and avoids duplicating all the cache machinery, but the four cores contend for its banks and bandwidth. Their separate cluster also keeps light work away from the performance cluster and its L3, allowing that larger domain to sleep. [1], [2] Cache area includes more than the storage cells. Tags identify each line, decoders select rows, sense amplifiers read the small bitline signal, and wires connect to the banks. Splitting an array into smaller sections shortens wordlines and bitlines, improving access speed, but duplicates peripheral circuits. Panther Lake’s smaller cache regions therefore reflect the complete memory implementation, including how much of each region is devoted to storage. [34] Unlike Meteor Lake and Arrow Lake, Panther Lake has no separate SoC tile. The NPU, LP E-cores, memory controllers, PHYs, media and display engines now share the compute tile. This removes an active die and keeps CPU memory traffic on one die. The cost is moving PHY and I/O-related circuitry onto 18A: drivers, receivers and analog circuits must still meet external voltage, loading and signal-integrity requirements, so their area does not shrink like dense digital logic. [1], [2] The biggest shrink comes from the NPU, which occupies 36.9% less area. NPU 5 consolidates the same total INT8 MAC count into half as many neural compute engines. Each of the three NCEs has a larger MAC array to make the complete NCE envelope 22.6% larger than an NPU 4 engine. Consolidation also halves the number of scratchpads and SHAVE DSPs, from 12 to 6. The MAC array handles matrix multiplication and convolution, while SHAVE executes vector and custom operations that fit the array poorly. [1], [2], [35] The paired floorplans identify each NCE envelope and its scratchpad, MAC, and SHAVE regions. Each measured MAC polygon is counted once per NCE in the area accounting below. The scratchpads store weights, activations, and intermediate results near the MAC arrays, allowing repeated use without fetching them again from DRAM. Halving their number delivers the largest measured area saving but leaves less local storage for the same total MAC count. Layers that no longer fit locally require smaller working tiles or more transfers of intermediate data. The benefit depends on keeping the enlarged arrays busy while managing that tighter storage budget. [36] NPU 5 also adds native FP8. Using half the operand width of FP16 reduces storage and transfer demand, helping workloads fit the smaller local memory budget. Lower precision and format-dependent range make scaling and model validation part of deployment. Hardware activation functions further reduce work that would otherwise occupy the programmable DSPs. [1], [2] Microsoft requires an NPU to deliver at least 40 TOPS for Copilot+ PCs. Both Lunar Lake and Panther Lake meet this threshold, but Panther Lake uses significantly less silicon. GPU tiles Panther Lake is Intel’s first product with Xe3, its latest GPU architecture. It offers two different GPU tiles: a smaller GT1 tile with 4 Xe3 cores on Intel 3 and a larger GT2 tile with 12 Xe3 cores on TSMC N3E. Panther Lake allows us to compare the same GPU architecture across both Intel 3 and TSMC N3E. Wildcat Lake adds a third Xe3 implementation on Intel 18A. A future newsletter will detail Xe3 and its implementation differences across all three process nodes. GT2 scales Xe3 to a different physical layout, with render slices arranged vertically instead of GT1’s horizontal arrangement. Slice placement sets the distances to shared cache banks and the D2D interface. Those wires consume area and add delay, so scaling the number of Xe cores also requires a new balance of cache placement, routing and timing. [1] What’s immediately obvious is that the GT2 tile on TSMC N3E has much smaller Xe cores than GT1. These block areas include logic, caches, and routing. An Xe core on the GT1 tile is ~69% larger than one on Lunar Lake, and ~55% larger than one on GT2. Intel 3 therefore uses substantially more area per Xe core. The block-area gap exceeds the measured logic and SRAM density gaps, bringing routing, timing targets, cell mix, and floorplan allocation into the comparison. The measured vector/matrix engine region is almost unchanged between Lunar Lake and Panther Lake’s GT2 tile. Xe3 retains eight 512-bit vector engines and eight 2048-bit XMX engines per core. Its gains also come from feeding those engines more effectively: more resident threads hide stalls, and variable register allocation lets shaders trade registers per thread against the number of threads kept active. [1] The shared L1/SLM capacity increased by 33% from 192 KiB to 256 KiB, while its area increased only 5%, raising effective density by 27%. L1 retains reused cache lines, while software-managed SLM lets a thread group share data locally. Both reduce traffic to more distant memory. Allocating more SLM per group can also limit how many groups reside on a core at once. [1], [37] The GT1 tile carries 4 MiB of L2 against 16 MiB on the GT2 tile. GT1 divides its L2 cache into four 1 MiB banks, while GT2 uses eight 2 MiB banks. Each bank contains 128 macros, but each N3E macro stores 16 KiB, twice the Intel 3 macro’s 8 KiB capacity. The N3E macro is only 54% larger while holding twice as many bits, giving it 30% higher density: ~23.7 Mbit/mm² versus 18.3 Mbit/mm². Including bank-level circuitry, the gap widens to ~16.9 Mbit/mm² on GT2 versus ~10.4 Mbit/mm² on GT1. GT2 gains density with its macros storing more bits per unit area, and those macros occupy more of each cache bank. Larger macros spread decoder and sense-amplifier overhead across more storage, while a more compact bank layout reduces the share spent on control and routing. The compromise is longer wordlines and bitlines that carry more capacitance. [34] I/O tile Panther Lake uses two I/O tile variants, both fabricated on TSMC N6. The smaller one provides 4 PCIe 5.0 and 8 PCIe 4.0 lanes and serves lower-tier systems as well as those without a discrete GPU, while the larger one adds 8 PCIe 5.0 lanes, bringing the total to 20 lanes, for discrete-GPU connectivity. Panther Lake SKUs with the larger 10- or 12-Xe GPUs use the smaller I/O tile. [38] The smaller I/O tile adds a PCIe 4.0 block and a Thunderbolt block to Lunar Lake’s I/O layout, providing four additional PCIe 4.0 lanes and another Thunderbolt 4 port. Its repeated N6 blocks retain nearly identical areas and layouts. Reusing these proven PHYs and controllers avoids porting and requalifying external interfaces on 18A, where faster digital logic offers less benefit to circuits constrained by the off-chip link. [38] SemiAnalysis’s teardown lab (STEEL) dives deep into the world’s advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. We’re hiring technical experts from system to transistor and everywhere in between. Check out our Careers page. Panther Lake offers scalability and modularity through its disaggregated packaging that partition compute, GPU, and I/O silicon into separate tiles allowing for a suite of tile configurations. This partitioning makes the package part of Intel’s node economics as it determines how much leading-edge wafer area each product consumes, which functions can remain on other processes, and how much configuration freedom Intel can offer from a shared set of tiles. Furthermore, fabricating the compute and GPU tiles separately confines the new 18A process to the compute tile and allows graphics and I/O to use other, more established, and more cost-effective processes. For Panther Lake, the GPU and I/O tiles are assembled alongside the compute tile on a passive silicon base using Foveros-S. Intel’s current technology brief lists a nominal 36 µm pitch for Foveros-S. Through-silicon vias (TSVs) in the base connect the fine wiring above to the larger package connections below. The functional tiles sit side by side on that passive base in a 2.5D configuration. [39] Our cross-section through the compute and GPU tiles shows the package’s wiring hierarchy. Microbumps connect each active tile to the passive silicon base; its fine redistribution layer (RDL) carries the short, dense tile-to-tile links. TSVs carry connections through the base to the package substrate, which fans them out to the much coarser motherboard solder joints. The base supplies interconnect, while computation remains in the active tiles above it. [39] At the compute-tile edge, the higher-magnification inset shows a local microbump spacing of approximately 25.24 µm and a feature width of 12.33 µm. These local spacings are finer than Intel’s nominal Foveros-S value. The X-ray fields further confirm tighter neighboring bumps, consistent across every die-to-die area found on each tile. Additional X-ray analysis is offered after the paywall. Putting the memory controller beside the CPU removes the D2D transfer that CPU memory requests required in Meteor Lake and Arrow Lake. This avoids the extra transmitter, receiver, and link traversal, saving interface energy and latency. Panther Lake’s separate GPU still crosses a D2D link to reach DRAM, so its larger local caches also help contain package traffic. [1], [40] Smaller dies are less likely to contain a random fatal defect, and screening them before assembly prevents one bad tile from consuming a complete package of good silicon. Reuse also spreads design and qualification work across more products. Against those gains, Intel pays for the passive base, D2D circuits, extra bonding and test steps, and losses during assembly. Cost per working product across the portfolio captures the combined effect of wafer yield, reuse, test, and assembly. [29] Wildcat Lake packaging Intel launched Core Series 3, formerly Wildcat Lake, on 16 April 2026 for value mobile and edge systems. Wildcat Lake keeps 18A but removes the passive base and combines more functions on one die to simplify the package. The two products therefore reveal two distinct ways to commercialize the same leading-edge process. [41] Wildcat Lake’s 18A die combines up to two Cougar Cove P-cores, four Darkmont LP E-cores, two Xe3 cores and a smaller NPU. A separate platform-controller die supplies I/O, connected through UCIe, Intel’s first processor implementation of the standard. Consolidating graphics remove a tile boundary and the passive base, reducing assembly complexity for a modest-bandwidth value product. It also ties CPU and graphics scaling to the same die, giving up Panther Lake’s ability to swap in a much larger GPU. [42], [43] In July 2021, Intel CEO Pat Gelsinger set out an ambitious process roadmap aimed at regaining performance leadership by 2025, later described as five nodes in four years. Five years and one CEO later, Intel’s comeback story is not as unambiguously positive as Pat may have hoped. [44], [45] Intel once set the pace for process technology, bringing high-k metal gate technology and FinFETs into volume production years ahead of the rest of the industry. Its 22 nm FinFET process reached consumers with Ivy Bridge in 2012. [46] Intel’s integrated device manufacturing (IDM) model allowed its architects and process engineers to co-optimize products and processes. Starting with Sandy Bridge, Intel dominated x86, while AMD struggled with Bulldozer. That lead faltered at 14 nm and broke at 10 nm. Intel targeted a massive 2.7× density increase, but the node arrived years late and required several revisions before it could support Intel’s full lineup. This delay forced Intel to stretch 14 nm across six generations, while TSMC moved ahead in process technology and AMD recovered in x86. By 2019, Intel was still shipping 14 nm across most of its product stack, with its 10 nm client ramp focused on Ice Lake mobile processors. Meanwhile, TSMC was shipping N7 and N7+, and AMD’s Zen 2 compute chiplets used N7 to raise core counts and improve efficiency. Intel’s process failures were central to its decline, but unsound business decisions furthered their downward slide. Product delays compounded product mistakes, pushing client, server, and FPGA roadmaps off schedule. Several attempts to enter AI (Nervana and Gaudi) and networking (Tofino) also failed to establish lasting businesses. Intel’s recovery has focused on consumer CPUs and advanced packaging. Tiger Lake, Alder Lake, Lunar Lake and now Panther Lake have restored Intel’s consumer roadmap. On the process side, Intel 4 shipped with Meteor Lake, Intel 3 with Granite Rapids and Sierra Forest, and Intel 18A with Panther Lake. Intel has also made advanced packaging part of its foundry offering. However, Intel is still playing catch-up in servers. Several Xeon generations arrived years late and trailed contemporary AMD and Arm server CPUs in performance, efficiency, and core count. The process roadmap is back, but Intel does not hold the same process-technology leadership position it held prior to 10 nm. The introduction of gate-all-around nanosheets and backside power delivery are two of the biggest changes to transistor integration in a decade. Intel took on both changes at once: 18A paired its first RibbonFET with PowerVia in Panther Lake. Panther Lake is a substantial manufacturing milestone. Our cross-sections show how RibbonFET and PowerVia reshape local contacts and wiring, while the floorplans show where architectural consolidation and process choices save area. A sustained competitive lead depends on product performance, cost, yield, and the next implementation. The SemiAnalysis STEEL teardown lab breaks down advanced datacenter and AI hardware. To learn more about our pipeline or to commission a teardown, contact sales@semianalysis.com. WE’RE HIRING: Architecture, floorplan, packaging, manufacturing, and labs experts. Opportunities from system to transistor and everywhere in between. Check out our Careers page.. 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Sep 25 • 12:05 AM EDT • Sports • sports.yahoo.com

Falcons Shock Packers In Primetime!

The Atlanta Falcons stunned the Green Bay Packers on Thursday night, rolling to a 35-14 victory at Lambeau Field and handing Green Bay its second straight loss. The Packers came out quickly, with Jordan Love connecting with Christian Watson for an early touchdown. Atlanta answered through Bijan Robinson, who broke loose for a huge 55-yard…

Sep 24 • 11:30 PM EDT • Sports • sports.yahoo.com

Instant analysis of Packers' home opener loss to the Falcons

Instant analysis of the Packers' primetime loss to the Falcons to open Week 3.

Sep 24 • 11:25 PM EDT • Sports • sports.yahoo.com

Norvell Blinded by QB Loyalty Ahead of Central Arkansas Game

Florida State coach continues to praise his starting quarterback, Ashton Daniels, even after throwing three interceptions in a 50-36 loss to Alabama last Saturday. Norvell praises his confidence and decision-making skills. Daniels has thrown three touchdown passes against ranked teams this season.

Sep 24 • 10:30 PM EDT • Sports • sports.yahoo.com

Mizzou soccer blanked 2-0 in loss to Auburn

Mizzou stretched its SEC winless streak to 12 in a 2-0 loss to Auburn on Thursday night in Columbia.

Sep 24 • 9:00 PM EDT • Sports • columbiamissourian.com

Rockies Finish Up at Home With Loss to Diamondbacks

Colorado Rockies starting pitcher Tanner Gordon was not sharp early on Thursday, helping the Arizona Diamondbacks get a victory at Coors Field.

Sep 24 • 7:01 PM EDT • Sports • sports.yahoo.com

Cubs’ Final Series Might Be Forced To New Location

The magic number for the Chicago Cubs to clinch their spot in the 2026 MLB postseason is one, as they need either just one more victory or a loss by the Arizona Diamondbacks. The Cubs, who are playing their series finale against the Miami Marlins, have one more series remaining on the road against the […] The post Cubs’ Final Series Might Be Forced To New Location appeared first on HEAVY.

Sep 24 • 7:01 PM EDT • Sports • sports.yahoo.com

Bellamy wants more from Wales after Portugal loss

Craig Bellamy believes there is "more to come" from his Wales side in the Nations League following their opening match loss in Lisbon.

Sep 24 • 6:28 PM EDT • Sports • sports.yahoo.com

White Sox clinch a playoff spot with a 9-1 rout of the Royals after back-to-back 100-loss seasons

Sep 24 • 4:58 PM EDT • Sports • sports.yahoo.com

White Sox Clinch Playoff Spot, Complete Historic Turnaround

After clinching on Thursday, the Chicago White Sox are headed back to the postseason for the first time since 2021, completing a historic turnaround just two years after an MLB-record 121-loss season.

Sep 24 • 4:54 PM EDT • Sports • sports.yahoo.com

Kansas’ Defense Deserves Credit Despite the Loss

Kansas’ Defense Deserves Credit Despite the Loss

Sep 24 • 4:15 PM EDT • Sports • sports.yahoo.com

Who Replaces Labaron Philon Jr for Alabama Basketball

Alabama basketball faces a major offensive problem with the loss of Labaron Philon Jr. Despite testing the NBA waters his freshman year, Philon Jr. decided to return to Alabama. In his sophomore year, Philon took a massive step in his game, becoming more than just a good defender and decent scorer. Last season, he averaged …

Sep 24 • 4:15 PM EDT • Sports • sports.yahoo.com

Tyler’s Take: What can be done with Mike Sainristil

Commanders CB Mike Sainristil has had a rough start to the 2026 season, playing a huge role in both Washington losses

Sep 24 • 2:00 PM EDT • Sports • sports.yahoo.com

Ohio football coach resigns following investigation into 'unprofessional conduct'

Rob Page had been placed on administrative leave following a loss to Pickerington Central (OH) on September 18.

Sep 24 • 1:43 PM EDT • Sports • sports.yahoo.com

Eagles Face Massive Defensive Question Before Bears Week 3 Showdown

The Philadelphia Eagles are looking for some payback as they take on the Chicago Bears in Week 3.Last season, the Bears torched the Eagles on the ground, rushing for 281 yards to win 24-15 on Black Friday. It was a rough loss for a Philly team that was trying to close out the NFC East […] The post Eagles Face Massive Defensive Question Before Bears Week 3 Showdown appeared first on HEAVY.

Sep 24 • 1:17 PM EDT • Sports • sports.yahoo.com

Semaglutide is improving the heart health of millions—but how? Experts are stumped

“Our analyses could not fully ascribe the effects of semaglutide on cardiovascular disease to known risk factors with any certainty,” one researcher said after exploring years of data. "These results suggest that semaglutide should be considered as a cardiovascular disease reduction drug and not just as a weight loss drug,"

Sep 24 • 12:36 PM EDT • Health • cardiovascularbusiness.com

Why Astros placed Cristian Javier on IL before MLB postseason

This could be a significant loss for the Astros.

Sep 24 • 10:57 AM EDT • Sports • sports.yahoo.com

VIDEO: How the Packers came back on the Jets

The Jets fell to 1-1 in Week 2 as the Green Bay Packers rallied from 10 points down in the fourth quarter to force overtime. The Packers were able to outplay the Jets in all three phases of the game in the final 10 minutes of regulation and overtime. Blame for the loss does not […]

Sep 24 • 10:46 AM EDT • Sports • sports.yahoo.com

Businesses shocked in Kiryat Shmona: State demands $68 million return

Blow to northern businesses: Out of nearly $1.7 billion transferred to the city, the Tax Authority is demanding hundreds of millions back.

Sep 24 • 10:30 AM EDT • Business • jpost.com

Bears power rankings roundup: Where Chicago lands in Week 3

The Chicago Bears took a tumble in the power rankings after their Week 2 loss to the Minnesota Vikings.

Sep 24 • 9:31 AM EDT • Sports • sports.yahoo.com

Looking Back at Framber Valdez’s First Season With Detroit

Beyond the win-loss record, Detroit’s high-priced southpaw overcame a stagnant offense and a disastrous early outing to prove he remains a dominant, durable force in the rotation.

Sep 24 • 9:06 AM EDT • Sports • sports.yahoo.com

Durbin: Obama election 'one of the real satisfactions of my career'

Sen. Dick Durbin talks early losses, major wins, Barack Obama and ahead of his retirement.

Sep 24 • 5:01 AM EDT • Politics • sj-r.com

Kim Kardashian’s Team Moms highlights the ridiculous excess of the US youth-sports industry

A new Paramount+ series premiering Thursday turns pushy sports parents into glossy entertainment – with the children largely ushered off stage

Sep 24 • 5:00 AM EDT • Sports • theguardian.com

England vs Spain: Anthony Gordon backs Thomas Tuchel's 'DNA' comments about possession and calls on Three Lions to focus on their strengths

Thomas Tuchel said control with possession is not in the DNA of England players after World Cup loss; Anthony Gordon agreed, explaining inbuilt ability for Spanish players; winger calls on England to focus on own strengths; Follow England vs Spain on Sky Sports website and App on Saturday

Sep 24 • 2:00 AM EDT • Sports • skysports.com

Manchester United announce seventh annual loss in latest financial record

Manchester United finished third in the 2025/26 Premier League season while recording their lowest wage bill in six years, The Athletic reports.United spent £302 million on wages during the year, dow...

Sep 24 • 1:55 AM EDT • Sports • sports.yahoo.com

Colts Consider Signing 3 Veteran Playmakers

The Indianapolis Colts are going to start showing off a serious sense of urgency. They’ve begun the season 0-2, with a bad loss to the Baltimore Ravens (41-23) followed by an overtime defeat at the hands of the Kansas City Chiefs. After an 8-2 start to last season, the Colts have now lost nine consecutive […] The post Colts Consider Signing 3 Veteran Playmakers appeared first on HEAVY.

Sep 24 • 1:24 AM EDT • Sports • sports.yahoo.com

Jared Goff Has Blunt Message for Lions ‘Vultures’

Jared Goff says the Detroit Lions welcome outside doubt after their loss to the Buffalo Bills and are ready to respond at Ford Field.

Sep 23 • 10:06 PM EDT • Sports • sports.yahoo.com

Vikings-Bucs First Injury Report

The Minnesota Vikings and Tampa Bay Buccaneers released their first injury reports in advance of their Sunday afternoon matchup in Tampa. Here they are. Minnesota Vikings Tampa Bay Buccaneers Injury Report Terms and Glossary Injury designation definitions: Probable = the league defines a Probable injury designation as a 75% or greater chance of playing. Historically, […]

Sep 23 • 9:27 PM EDT • Sports • sports.yahoo.com

Shorthanded Lions Suddenly Bring Back Familiar Face

The Detroit Lions are all kinds of banged up right now as they continue preparations to host the New York Jets in Week 3 of the 2026 NFL season, hoping to rebound from their frustrating 41-31 loss on the road to the Buffalo Bills last week.The Lions, who were already without the likes of Cade […] The post Shorthanded Lions Suddenly Bring Back Familiar Face appeared first on HEAVY.

Sep 23 • 8:56 PM EDT • Sports • sports.yahoo.com

South Korea’s weight-loss obsession and the health risks it brings

South Korean women face higher underweight rates than men, with experts warning that social pressure to be thin and weight-loss drugs may pose health risks.

Sep 23 • 7:45 PM EDT • Health • globalnation.inquirer.net

Palmetto Sports Daily: Clemson takes 1st trip out west, How SC looks to bounce back after loss

Clemson prepares for its first West Coast trip since the ACC expansion, and South Carolina looks for answers as it heads to Alabama.

Sep 23 • 7:20 PM EDT • Sports • wistv.com

Customers say unlicensed pool contractor left them with unfinished holes, thousands in losses

Multiple customers say a contractor named Rob Houston who does business by the name of "Splash Solutions" and "Splash Pools" took tens of thousands of dollars from them for inground pool projects and left the work unfinished or never started.

Sep 23 • 5:51 PM EDT • Business • wsmv.com

Giants injury update: the latest on LB Brian Burns

The New York Giants face another defensive setback as a key pass rusher is likely to miss time with an ankle injury following Monday’s loss.

Sep 23 • 5:23 PM EDT • Sports • sports.yahoo.com

Rockies Have Five More Games to Pick Up Victories

With the 100-loss mark reached yet again, the Colorado Rockies are looking to get a win or two before the 2026 MLB season ends.

Sep 23 • 5:19 PM EDT • Sports • sports.yahoo.com

San Francisco Giants Make Marcelo Mayer Move During Twins Series

The San Francisco Giants certainly have not had the season they’d hoped for by any stretch.They’re coming off a 3-2 loss against the Minnesota Twins on Tuesday night and sit at 65-93 overall with just five games remaining in the regular season.And while these games don’t count for anything and it’s likely most in San […] The post San Francisco Giants Make Marcelo Mayer Move During Twins Series appeared first on HEAVY.

Sep 23 • 4:35 PM EDT • Sports • sports.yahoo.com

Bears running back not spotted at Wednesday's practice

The Bears run game might've taken a hit after Sunday's loss to the Vikings as a key contributor missed Wednesday's practice.

Sep 23 • 4:15 PM EDT • Sports • sports.yahoo.com

Bears’ First Personnel Domino Falls After Embarrassing Week 2 Loss

The Chicago Bears did not wait long to make a change after their ugly Week 2 loss. Two days after […]

Sep 23 • 1:35 PM EDT • Sports • sports.yahoo.com

How Rockies avoided F grade from ESPN despite 100 losses

The Rockies should feel better about their future.

Sep 23 • 11:00 AM EDT • Sports • sports.yahoo.com

Two Observations From Giants' 3-2 Loss vs. Twins

An observation on the hitting and pitching side of things following the San Francisco Giants' latest loss.

Sep 23 • 9:35 AM EDT • Sports • sports.yahoo.com

Rome's Colosseum closes for the day after a worker plunges to his death

Rome's Colosseum has been closed to mourn a worker who fell to his death at Italy's most-visited monument | 830 WCCO

Sep 23 • 8:35 AM EDT • Entertainment • audacy.com

Rome's Colosseum closes for the day after a worker plunges to his death

Rome's Colosseum has been closed to mourn a worker who fell to his death at Italy's most-visited monument | WWJ Newsradio 950

Sep 23 • 8:35 AM EDT • Entertainment • audacy.com

Game MVP: LSU vs Ole Miss

In a loss one player shined and might be overlooked. Dilin Jones is the MVP for LSU after the los to Ole Miss

Sep 23 • 8:00 AM EDT • Sports • sports.yahoo.com

Seattle businesses say short notice for multi-day planned outages led to revenue losses

“I believe it was poor planning on their part.”

Sep 23 • 7:00 AM EDT • Business • kiro7.com

Tigers can seize series win on Wednesday afternoon against Nationals

The Detroit Tigers missed a chance to secure a series win over the visiting Washington Nationals on Tuesday night, dropping the second of the three-game series, 3-1. Despite tossing a quality start, Drew Anderson was saddled with the loss while the offense barely made a peep at Comerica Park. Making his final start of the […]

Sep 23 • 7:00 AM EDT • Sports • sports.yahoo.com

Reform and the UAE – a threat to British politics

By Alex Carlen The United Arab Emirates likes to present itself as part of the solution to the climate crisis. The oil-rich Gulf state has committed to Net Zero by 2050, hosted COP 28, and even declared “championing climate action” as one of three strategic objectives for this week’s session of the United Nations General Assembly. But behind the scenes the UAE has quietly built one of its closest political relationships in Europe with the party most hostile to climate action in Britain: Nigel Farage’s Reform UK. There is no evidence that the UAE is funding Reform. But a new FairSquare report, Petro-populism: the UAE–Reform threat, published today, documents a growing political relationship that should concern anyone interested in the integrity of British democracy. Reform’s leaders have embraced the UAE’s political model and promoted positions that align closely with the Emirati government’s priorities, while the UAE has given Farage and his party unusually warm access and public backing. What is emerging is not simply a relationship between British politicians and a wealthy Gulf state, but a channel through which an authoritarian government can cultivate political influence here, and abroad. Democracy for Sale relies on its readers. If you already support us, thanks so much. If you don’t, sign up to support fearless independent investigative journalism. Subscribe Back in January, Nigel Farage appeared at a GB News event in Dubai. On the 50th floor of a tower overlooking the luxury resorts and upscale residences of Palm Jumeirah, the Reform leader declared: “I want Clacton to look like this.” At the event – which Farage never declared on his official register of interests – senior Emirati officials mixed with British expats. Farage was keen to flatter. “We recognise you are our friends”, he said, assuring them that “a Brexit London, a Reform London, will remember you.” Controversy surrounding Reform’s finances and its susceptibility to foreign influence have centred around high-profile donations from billionaire crypto donors, and the jailing of Nathan Gill, Reform’s former leader in Wales, for accepting bribes to give pro-Russia speeches. Far less attention has been paid to Reform’s blossoming new alliance with the UAE, an oil-rich authoritarian state with a track record of ruinous anti-democratic interventions. Farage wasn’t always so fond of the UAE. Back in 2023 he called it an “absolute monarchy with an abysmal human rights record.” Now Reform’s hierarchy calls the UAE home. Deputy leader Richard Tice splits his time between his constituency and Dubai and has called on the UK to learn from the UAE. The party’s treasurer Nick Candy runs a firm which has been in partnership with a UAE-state linked firm since 2024. Nadhim Zahawi sits on the board of an Abu Dhabi think tank alongside an array of the most senior UAE officials and is reportedly close to three brothers of the country’s despotic ruler Mohammed Bin Zayed. Reform’s leading lights have effusively praised the UAE’s governance model, defended it from criticism, and advanced its political agenda in the UK. GB News, whose two major shareholders – the Legatum Foundation and Paul Marshall – have strong links to the UAE, has been more than happy to broadcast UAE propaganda and was forced to pay damages in 2025 after airing a false claim about a UK charity by the UAE “disinfluencer” Amjad Taha. The UAE has responded in kind. When the UAE Minister for Foreign Affairs conducted an official visit to the UK in May, Farage was the only non-government figure granted an audience. UAE state media publicised the meeting, and said that they discussed “the strategic relations between the two countries and ways to enhance them in a manner that serves mutual interests.” For the UAE these ‘mutual interests’ largely concern its paranoia over political Islam, and in this regard the UAE-Reform alliance is part of a broad and troubling pattern. Following a crackdown on dissent at home in the aftermath of the Arab Spring, the UAE has offered material and political support to a range of violent and authoritarian actors willing to oppose the Muslim Brotherhood with no regard for the consequences. Its meddling in Egypt, Tunisia, Yemen, and most notably Sudan, have been devastating. The UAE’s strategy of seeking out partners on the political fringes who it believes will advance its interests is not unique to Britain – it extends beyond the Middle East to Europe and the US. In France, it has offered clandestine support to Marine Le Pen through secret meetings, as well allegedly funding trips to the region after which Le Pen returned with a renewed focus on the UAE’s perceived enemies – Qatar and the Muslim Brotherhood. Left-wing opposition leader Jean-Luc Mélenchon has accused the UAE of smearing him and of “encouraging discrimination, hatred or violence”. In the US, the UAE actively supported the rise of Donald Trump, establishing itself as a key ally during both his first and second terms. Around these relationships sits a wider ecosystem of figures willing to amplify UAE narratives, that even extends to Andrew Tate and Tommy Robinson. Subscribe In Britain, the UAE has used a combination of aggressive diplomacy and illicit, disruptive tactics to achieve its policy goal of eliminating any perceived threat from political Islam. In 2012, for instance, it threatened to block billion-pound arms deals with the UK and stop inward investment if David Cameron did not act against the Muslim Brotherhood and rein in the BBC’s coverage of the group – going so far as to suggest, with no supporting evidence, that the group had infiltrated the BBC. It has financed smear campaigns against a high-profile UK charity and funded a mercenary to secretly surveil, and possibly assassinate, a British national on British soil. In Reform UK, the UAE has finally found an ally willing to not only ban the Muslim Brotherhood, but to publicly vilify the group and repeat the UAE’s claims that dangerous Muslims are a fifth column in British society, a narrative that aligns with the Islamophobia and anti-immigration sentiments that underpin Reform’s populist politics. The Rycroft review into foreign interference concluded that “hostile states and non-state actors have a clear incentive to attempt to undermine UK democracy.” The UAE’s network and alliance with Reform must be understood within that framework. It is a powerful, disruptive and deeply authoritarian actor with the resources and networks to intervene in our politics, and a track-record of doing so in a multitude of other countries. The evidence of the threat the UAE poses is overwhelming. The question is whether parliamentarians are willing to call the UAE out and demand action using the tools that the government has to respond. Placing the UAE on the “Enhanced Tier” of the Foreign Registration scheme alongside Russia and Iran would send a powerful signal to the UAE that its meddling will no longer be tolerated, and would place Farage’s next trips to the UAE under the scrutiny they deserve. Alex Carlen is research and advocacy manager at London based human rights organisation FairSquare and author of its new report Petro-populism: the UAE–Reform threat. Subscribe

Sep 23 • 6:50 AM EDT • Politics • democracyforsale.substack.com

‘The Red Goose’ explores life’s ‘quiet wonders'

Local author Allen Guy Wilcox explores family, loss, rural America and everyday life in his debut poetry collection, “The Red Goose.”

Sep 23 • 6:00 AM EDT • Entertainment • romesentinel.com

Pens Points: Penguins drop second preseason game

Here are your Pens Points for this Wednesday morning… The Pittsburgh Penguins fell 7-4 to the Detroit Red Wings in Pittsburgh’s second preseason game on Tuesday at PPG Paints Arena. Nick Robertson scored in his Penguins debut, while Kaeden Korczak and Rutger McGroarty also found the net in the loss. [Recap] Forward Nick Robertson is […]

Sep 23 • 6:00 AM EDT • Sports • sports.yahoo.com

Tigers and Cubs: Week 3 vs. Ole Miss

Despite a loss, who performed well? Who struggled the most?

Sep 23 • 6:00 AM EDT • Sports • sports.yahoo.com

Want To Remember More Of What You Read? Science Says Do This

Want information to stick? A few simple tweaks can make studying more effective.

Sep 23 • 5:21 AM EDT • Science • mindbodygreen.com

Flyers Squashed by Bruins in Preseason Loss After Losing Vladar

Sep 23 • 4:00 AM EDT • Sports • sports.yahoo.com

Mariners fade into fall in 7-0 loss to Astros

Summer is over

Sep 23 • 3:10 AM EDT • Sports • sports.yahoo.com

Gal Gadot's $3m. Genesis Prize initiative funds 24 Israeli mental health and trauma care NGOs

Recipients include Make-A-Wish Israel, United Hatzalah, and CareGivers Israel. The grants will support treatment, trauma counseling, caregiver training, and social work services.

Sep 23 • 1:56 AM EDT • Health • jpost.com

Lynx clinch No. 1 seed despite 'embarrassing' loss to Fever, Olivia Miles dealing with calf injury

Olivia Miles missed Tuesday night's game in Indianapolis with a calf injury.

Sep 23 • 12:36 AM EDT • Sports • sports.yahoo.com

Penguins Talk About Finally Standing up for Crosby

Not on his watch. First-year Pittsburgh Penguins defenseman Declan Carlile explained after Tuesday night’s 7-4 preseason loss to the Detroit […]

Sep 22 • 10:53 PM EDT • Sports • sports.yahoo.com

Brown Health axes multiple execs after $13M operating loss

Rhode Island’s largest health system has been trying to get its operations back in the black this year.

Sep 22 • 10:28 PM EDT • Health • wpri.com

Penix Must Fix The Falcons’ Historic Offensive Slump

After a 34-3 loss to Carolina, the Falcons turn to Michael Penix Jr. to end a period of offensive ineptitude that spans nearly five decades.

Sep 22 • 10:20 PM EDT • Sports • sports.yahoo.com

Chargers Have Made Roster Adjustments Following the Week 2 Loss

The Los Angeles Chargers have made some adjustments to the roster following the Week 2 loss to the Las Vegas Raiders.

Sep 22 • 10:11 PM EDT • Sports • sports.yahoo.com

Jaguar Land Rover recalls 23,000 SUVs over risk of sudden drive power loss

Jaguar Land Rover recalled more than 23,000 vehicles over an electronic system error that may lead to the loss of drive power and exterior lighting.

Sep 22 • 9:44 PM EDT • Business • foxbusiness.com

SMU's Kevin Jennings Praises 'Good Response' After Louisville Nightmare

The Mustangs have moved on from their loss to the Cardinals, with Missouri State up next.

Sep 22 • 8:28 PM EDT • Sports • sports.yahoo.com

Bear Up, Bear Down: Who helped, hurt stock vs. Vikings

Following their Week 2 loss to the Vikings, here are the Bears players whose stock is rising and falling.

Sep 22 • 7:15 PM EDT • Sports • sports.yahoo.com

Schaeffer Deserves Credit for Rockies' Improvement in 2026

Sure, the Colorado Rockies, more than likely, will finish with 100 losses again this season. Still, manager Warren Schaeffer has helped this ballclub show definite signs of growth.

Sep 22 • 5:50 PM EDT • Sports • sports.yahoo.com

Auburn Weekly Roundtable

Week 4 has arrived, and the Auburn Tigers are looking for a bounceback after their 42-39 loss to the Florida Gators. It’s Homecoming on the Plains, and the Vanderbilt Commodores are in town, who have had the Tigers’ number over the past few seasons.

Sep 22 • 4:38 PM EDT • Sports • sports.yahoo.com

DOJ loses 25th lawsuit seeking voter records as judge tosses WA case

It was the 25th court loss in a row for the Trump administration as it seeks private voter data from states.

Sep 22 • 3:50 PM EDT • Politics • seattletimes.com

Planetary crisis heightens global inequality of health opportunities

The worldwide inequality of health opportunities is being further heightened by the triple planetary crisis - climate change, loss of biodiversity and environmental pollution.

Sep 22 • 1:27 PM EDT • Health • news-medical.net

Steelers Week 2 grades in loss to Patriots

Pittsburgh Steelers Week 2 grades.

Sep 22 • 11:59 AM EDT • Sports • sports.yahoo.com

OU football not sure of offensive identity heading into Georgia

OU (2-1) fell out of the AP Top 25 following Saturday’s 14-6 win over New Mexico (2-1), a result that felt more like a loss to many Sooner fans. Now,

Sep 22 • 11:46 AM EDT • Sports • oudaily.com

Stars & Skulls Grades for Steelers-Patriots

Things did not go well for the Pittsburgh Steelers in a 20-3 loss to the New England Patriots on Sunday, […]

Sep 22 • 11:03 AM EDT • Sports • sports.yahoo.com

Planetary crises deepen global health inequality, paper warns

The global inequality in health opportunities is being further heightened by the triple planetary crisis—climate change, biodiversity loss and environmental pollution. Addressing it is more than a question ...

Sep 22 • 10:10 AM EDT • Health • phys.org

Razorback Report Card: Tulsa

Arkansas cannot erase the losses to Utah and Georgia in one afternoon, but the Razorbacks must show real progress against unbeaten Tulsa before the season becomes harder to salvage. Razorback Report Card: Tulsa Five Questions Arkansas Must Answer Against Tulsa The Razorbacks are 1-2. Their lone win came against North Alabama, but even that 31-14 …

Sep 22 • 10:00 AM EDT • Sports • sports.yahoo.com

UNC's Bill Belichick Has Perfect Response After Loss to Clemson

A loss is a loss, but things are changing.

Sep 22 • 8:00 AM EDT • Sports • sports.yahoo.com

Liam Coen: Jaguars Must ‘Move on and Respond'

Head coach Liam Coen and his players are using the Jaguars' loss at Denver as motivation to improve.

Sep 22 • 7:00 AM EDT • Sports • sports.yahoo.com

Tennessee Titans news: What’s next after Eagles loss?

The Tennessee Titans are turning the page after losing to the Philadelphia Eagles in Week 2.

Sep 22 • 7:00 AM EDT • Sports • sports.yahoo.com

Which young Buckeye are you buying the most stock in?

Now that we’ve all had a few days to let the collapse in Texas sink in, this week’s fan survey wants to know where your head is following the loss. Click the link and vote.

Sep 22 • 6:31 AM EDT • Sports • sports.yahoo.com